Method for preparing silver-copper alloy target material through electron beam melting

Abstract

The invention provides a method for preparing a silver-copper alloy target material through electron beam melting. The method comprises the following steps that S1, alloy is prepared; s11, preparing the silver-copper alloy containing 0.1-70% or above of silver, and according to the component proportion of the silver-copper alloy needing to be prepared, firstly, placing the 5N silver-copper intermediate alloy in a crystallizer A of an electron beam furnace, and placing 4N cathode copper in a second crystallizer B; according to the method for preparing the silver-copper alloy target material through electron beam smelting, the step of preparing the target material is simplified till the smelting process is completed in one step in the electron beam furnace, the silver-copper alloy target material prepared through the steps of alloy preparation and grain control is small in grain size smaller than or equal to 100 micrometers, uniform and free of air holes and impurities, and the purity meets the 5N standard; meanwhile, a vibrator is mounted on a cooling bed (a crystallizer B) in the three-gun electron beam furnace, so that the growth of dendritic crystals is interfered in the cooling process, and the effect of refining crystal grains is achieved, so that the technological process of the copper-silver alloy target material is reduced, and the preparation cost of the target material is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of nonferrous metal purification, and in particular to a method for preparing a silver-copper alloy target material by electron beam melting. Background Art

[0002] In recent years, with the increasing development of sputtering target materials and technologies, the importance of sputtering target materials has become increasingly apparent in sputtering technology. The quality of the target material will directly affect the quality of the coating. During the sputtering process, the atoms on the surface of the target material are sputtered out in the form of ions and fall on the surface of the substrate to form a thin film. The material can be coated to improve the surface hardness, wear resistance, corrosion resistance, and heat resistance of the material to meet the different use requirements of the material. The key to vacuum magnetron sputtering coating lies in the target material used.

[0003] The main application areas of high-purity copper are the preparation of high-purity copper targets, high-end audio product conductors, fatigue-resistant cables and interconnect materials. High-purity copper is often used as interconnect material due to its high electromigration resistance and low resistance. As the characteristic size of metal interconnects develops towards the nanoscale, the width of metal interconnects continues to decrease, and the number of layers of metal interconnects continues to increase. The original pure copper target process has problems of electromigration and oxidation and cannot meet current needs. At the same time, in the application scenarios of products or parts such as high-strength wiring harnesses, high-pulse magnetic field conductors, electrical switch contact bridges, and high-power lifting motor rotors, higher requirements are also put forward for tensile strength and conductivity (generally speaking, the strength and conductivity of an alloy are inversely proportional, the higher the strength, the lower the conductivity, and the higher the conductivity, the lower the strength). Copper-silver alloy targets can avoid the problems of electromigration and oxidation, and can also have higher tensile strength and physical properties.

[0004] However, the existing preparation methods have high requirements on the purity of raw materials. Purification and alloy preparation cannot be completed in one step, and the grains cannot be refined while preparing silver-copper alloy ingots. This leads to a long process flow of copper-silver alloy targets and invisibly increases the preparation cost of the targets.

[0005] Therefore, it is necessary to provide a method for preparing silver-copper alloy target material by electron beam melting to solve the above technical problems. Summary of the invention

[0006] The invention provides a method for preparing a silver-copper alloy target material by electron beam melting, which solves the problem that the process flow of the copper-silver alloy target material is long and the preparation cost of the target material is increased.

[0007] In order to solve the above technical problems, the present invention provides a method for preparing a silver-copper alloy target by electron beam melting, comprising the following steps: S1. Alloy preparation; S11, preparation of a silver-copper alloy containing more than 0.1-70% silver, according to the proportion of the silver-copper alloy components to be prepared, first place the 5N silver-copper master alloy in the crystallizer A of the electron beam furnace, and place the 4N cathode copper in the No. 2 crystallizer B, and then evacuate each part of the electron beam furnace; turn on the high-voltage power supply and electron gun preheating of the electron beam melting furnace, first aim the No. 1 electron gun at the 4N cathode copper in the crystallizer B for melting, and then use the No. 2 electron gun to melt the silver-copper master alloy in the crystallizer A, and the melted silver-copper master alloy flows into the crystallizer B to obtain a mixed melt, and close the No. 1 and No. 2 electric guns; S12. Preparation of a silver-copper alloy containing more than 70% silver: according to the proportion of the silver-copper alloy to be prepared, 4N silver is placed in a crystallizer A of an electron beam furnace and 4N cathode copper is placed in a crystallizer B of an electron beam melting furnace, and then each part of the electron beam furnace is evacuated; the high-voltage power supply and electron gun of the electron beam melting furnace are turned on for preheating, and the No. 1 electron gun is first aimed at the 4N cathode copper in the crystallizer B for melting, and the No. 2 electron gun is used to melt the 4N silver in the crystallizer A, and the melted silver liquid flows into the crystallizer B to obtain a mixed melt, and the No. 1 and No. 2 electric guns are turned off; S2, grain control: turn off No. 1 and No. 2 electron guns while turning on No. 3 electron gun, adjust the power to 10-40KW, rotate and disturb along the inner edge of the crystallizer toward the center for 5-30S, immediately turn off No. 3 electron gun, turn on the vibrator, adjust the vibration frequency to 2-10 times / 30S, vibrate for 3-10min, turn off the vibrator, and obtain the silver-copper alloy ingot after cooling; the disturbance of the electron beam can play the role of stirring the mixed melt and refining the grains, and the role of the vibrator is to break the grains and reduce the porosity of the matrix; S3. Post-treatment: The silver-copper alloy ingot is subjected to homogenization annealing treatment at a temperature of 400-680°C for 4-5 hours to obtain a silver-copper alloy target.

[0008] Preferably, the 5N silver-copper intermediate alloy in step S11 is a silver-copper alloy containing 60-80% silver, and the content of the two main metal elements of silver and copper is ≥99.999%. The power of electron gun No. 1 in step S11 is set to 15-40KW, and the smelting time is 10-30min.

[0009] Preferably, the power of electron gun No. 2 in step S11 is set to 80-200KW, and the melting time is controlled to be within 30S according to the quality of the silver-copper intermediate alloy to be melted. In step S11, electron gun No. 1 is first turned on until the melting time is within 40S, and then electron gun No. 2 is turned on.

[0010] Preferably, in step S12, the power of electron gun No. 1 and electron gun No. 2 is set to 15-40KW, the smelting time is 10-30min, and electron gun No. 1 and electron gun No. 2 are turned on at the same time in step S12. After the silver liquid in crystallizer A is smelted, it flows into crystallizer B and mixes with the smelted copper liquid.

[0011] Preferably, the number and sequence of the grain control step S02 in step S12 can be adjusted according to the grain size to be achieved and the porosity requirements of the target material. Each time after the second opening of electron gun No. 3, the power of the electron gun needs to be adjusted to 50-100KW, and the disturbance is controlled within 10S.

[0012] Preferably, both step S11 and step S12 require the use of an electron beam furnace, which includes a main body, a first sealing port being provided at one end of the main body, a second sealing port being provided inside the first sealing port, a loading port being provided inside the second sealing port, and a card interface being provided on the side wall of the first sealing port.

[0013] Preferably, one end of the main body is rotatably connected to a first sealing door, a first sealing gasket is fixedly installed on one side of the first sealing door, a sliding groove is provided on the other side of the first sealing door, a pushing block is slidably connected to the inner side surface of the sliding groove, and an abutment block is fixedly installed on one side of the pushing block.

[0014] Preferably, the internal thread of the first sealing door is connected to an adjusting rod, a turning handle is fixedly installed on one end of the adjusting rod, a second sealing door is fixedly installed on the other end of the adjusting rod, a second sealing gasket is fixedly installed on one side of the second sealing door, and a limiting telescopic rod is fixedly installed on the top and bottom of one side of the first sealing door, and one end of the limiting telescopic rod is fixedly installed on the side of the second sealing door.

[0015] Preferably, a fixing plate is fixedly mounted on the other side of the first sealing door, and a threaded rod is connected to the internal thread of the fixing plate.

[0016] Preferably, a rotating plate is fixedly mounted on one end of the threaded rod, and the other end of the threaded rod is rotatably connected to the other side of the pushing block.

[0017] Compared with the related art, the method for preparing silver-copper alloy target by electron beam melting provided by the present invention has the following beneficial effects: The present invention provides a method for preparing a silver-copper alloy target material by electron beam melting, which simplifies the steps of preparing the target material to complete the melting process in one step in an electron beam furnace, and the silver-copper alloy target material prepared by the alloy preparation and grain control steps has fine grains of ≤100μm, uniform, free of pores and inclusions, and purity that meets the 5N standard. At the same time, a vibrator is installed on the cooling bed (crystallizer B) in the three-gun electron beam furnace to interfere with the growth of dendrites during the cooling process, thereby playing a role in refining the grains, thereby reducing the copper-silver alloy target material process flow and reducing the preparation cost of the target material. The melting methods of silver-copper alloys of different compositions are different. The purpose of the present invention is to reduce the base loss rate, avoid segregation, fully cover silver-copper alloys of various compositions, and prepare the target material in one step. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the distribution of a crystallizer and a mechanical vibrator in an electron beam furnace of a method for preparing a silver-copper alloy target material by electron beam melting provided by the present invention; Figure 2 The metallographic structure diagram of the silver-copper alloy target provided by the present invention; Figure 3 A schematic structural diagram of a first embodiment of an electron beam furnace used in a method for preparing a silver-copper alloy target material by electron beam melting provided by the present invention; Figure 4 for Figure 1 Another perspective structural schematic diagram shown; Figure 5 for Figure 4 An enlarged schematic diagram of part A is shown; Figure 6 A schematic structural diagram of a second embodiment of an electron beam furnace used in a method for preparing a silver-copper alloy target material by electron beam melting provided by the present invention.

[0019] Numbers in the figure: 1. crystallizer A, 2. crystallizer B, 3. vibrator, 10. main body, 11. first sealing port, 12. second sealing port, 13. loading port, 14. card interface, 20. first sealing door, 21. first sealing gasket, 22. slide groove, 23. push block, 24. abutment block, 30. adjusting rod, 31. turning handle, 32. second sealing door, 33. second sealing gasket, 34. limiting telescopic rod, 40. fixed plate, 41. threaded rod, 42. rotating plate. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0021] Please refer to Figure 1 , Figure 2 ,in, Figure 1A schematic diagram of the distribution of a crystallizer and a mechanical vibrator in an electron beam furnace of a method for preparing a silver-copper alloy target material by electron beam melting provided by the present invention; Figure 2 A method for preparing a silver-copper alloy target by electron beam melting comprises the following steps: S1. Alloy preparation; S11, preparation of a silver-copper alloy containing more than 0.1-70% silver, according to the proportion of the silver-copper alloy components to be prepared, first place the 5N silver-copper master alloy in the crystallizer A1 of the electron beam furnace, place the 4N cathode copper in the No. 2 crystallizer B2, and then evacuate each part of the electron beam furnace; turn on the high-voltage power supply and electron gun preheating of the electron beam melting furnace, first aim the No. 1 electron gun at the 4N cathode copper in the crystallizer B2 for melting, then use the No. 2 electron gun to melt the silver-copper master alloy in the crystallizer A1, the melted silver-copper master alloy flows into the crystallizer B2 to obtain a mixed melt, and close the No. 1 and No. 2 electric guns; S12. Preparation of a silver-copper alloy containing more than 70% silver: according to the proportion of the silver-copper alloy to be prepared, 4N silver is placed in the crystallizer A1 of the electron beam furnace and 4N cathode copper is placed in the crystallizer B2 of the electron beam melting furnace, and then the various parts of the electron beam furnace are evacuated respectively; the high-voltage power supply and electron gun of the electron beam melting furnace are turned on for preheating, and the No. 1 electron gun is first aimed at the 4N cathode copper in the crystallizer B2 for melting, and the No. 2 electron gun is used to melt the 4N silver in the crystallizer A1, and the melted silver liquid flows into the crystallizer B2 to obtain a mixed melt, and the No. 1 and No. 2 electric guns are turned off; S2, grain control: turn off No. 1 and No. 2 electron guns while turning on No. 3 electron gun, adjust the power to 10-40KW, rotate and disturb along the inner edge of the crystallizer toward the center for 5-30S, immediately turn off No. 3 electron gun, turn on vibrator 3, adjust the vibration frequency to 2-10 times / 30S, vibrate for 3-10min, turn off vibrator 3, and obtain a silver-copper alloy ingot after cooling; the disturbance of the electron beam can play the role of stirring the mixed melt and refining the grains, and the role of vibrator 3 is to break the grains and reduce the porosity of the matrix; S3. Post-treatment: The silver-copper alloy ingot is subjected to homogenization annealing treatment at a temperature of 400-680°C for 4-5 hours to obtain a silver-copper alloy target.

[0022] The 5N silver-copper master alloy in step S11 is a silver-copper alloy containing 60-80% silver, and the content of the two main metal elements of silver and copper is ≥99.999%. The power of electron gun No. 1 in step S11 is set to 15-40KW, and the smelting time is 10-30min.

[0023] 5N silver-copper master alloy is smelted in a vacuum medium-frequency furnace; The use of low power and long time smelting is beneficial to the volatilization of various impurity elements.

[0024] The power of the No. 2 electron gun in the step S11 is set to 80-200KW. According to the quality of the silver-copper master alloy to be melted, the melting time is controlled to be within 30S. In the step S11, the No. 1 electron gun is first turned on until the melting time is within 40S, and then the No. 2 electron gun is turned on.

[0025] The purpose of rapid melting of the silver-copper master alloy is to avoid excessive silver loss and silver-copper stratification in the silver-copper alloy due to long melting time (the melting point of silver is 960℃, which is lower than the melting point of copper is 1083℃, and the density of silver is 10.49g / cm3, which is higher than the density of copper is 9.92g / cm3).

[0026] In the step S12, the power of the No. 1 electron gun and the No. 2 electron gun is set to 15-40KW, the smelting time is 10-30min, and the No. 1 electron gun and the No. 2 electron gun are turned on at the same time in the step S12. After the silver liquid in the crystallizer A is smelted, it flows into the crystallizer B and mixes with the smelted copper liquid.

[0027] The number and sequence of the grain control step S02 in step S12 can be adjusted according to the grain size to be achieved and the porosity of the target material. Each time after the second opening of the No. 3 electron gun, the power of the electron gun needs to be adjusted to 50-100KW, and the disturbance is controlled within 10S.

[0028] The purpose of adjusting high power is to melt quickly and control the matrix loss rate.

[0029] The overall loss rate of the silver-copper alloy target prepared by the present invention is controlled at 8.6% (including 7.5% silver loss and 9.3% copper loss). The prepared silver-copper alloy contains 2.56% silver and the impurity content is less than 10ppm. Figure 2 As shown, the alloy composition is uniform and non-segregated, the grain size is 50-100μm, and there are no inclusions or pores inside the target material; the silver-copper alloy target material prepared by the present invention has a wide alloy range, covering almost any proportion of silver-copper alloys, and the process can be adjusted according to the alloy range to be prepared; in the process of electron beam melting and purification and grain control, the loss rate in the melting and grain control process is controlled within 10% by controlling the electron beam power and melting time.

[0030] The working principle of the method for preparing silver-copper alloy target material by electron beam melting provided by the present invention is as follows: According to the proportion of silver-copper alloy components to be prepared, a 5N silver-copper intermediate (containing 75% silver) alloy is placed in the crystallizer A of the electron beam furnace, and a 4N cathode copper is placed in the No. 2 crystallizer B. Then, each part of the electron beam furnace is evacuated, and the vacuum degree of the electron beam furnace chamber is 1.5×10-1Pa. The high-voltage power supply and electron gun preheating of the electron beam melting furnace are turned on, and the No. 1 electron gun is first aimed at the 4N cathode copper in the crystallizer B for melting, with a power of 20KW and a time of 25min. Then, the No. 2 electron gun is used to melt the silver-copper intermediate alloy in the crystallizer A, with a power of 160kw and a time of 10S. The melted silver-copper intermediate alloy flows into the crystallizer B to obtain a mixed Combine the melt, turn off the No. 1 and No. 2 electron guns; turn off the No. 1 and No. 2 electron guns while turning off the No. 3 electron gun, adjust the power to 10-40KW, rotate and disturb along the inner edge of the crystallizer toward the center for 5-30S, immediately turn off the No. 3 electron gun, turn on the vibrator, adjust the vibration frequency to 2-10 times / 30S, vibrate for 3-10min, turn off the vibrator, and get the silver-copper alloy ingot after cooling; the disturbance of the electron beam can stir the mixed melt and refine the grains, and the function of the vibrator is to break the grains and reduce the matrix porosity; the silver-copper alloy ingot is homogenized annealed at a temperature of 680℃ and kept warm for 4h to get the silver-copper alloy target. The homogenization annealing process is used to homogenize the composition of the alloy ingot and eliminate component segregation and structural inhomogeneity.

[0031] Compared with the related art, the method for preparing silver-copper alloy target by electron beam melting provided by the present invention has the following beneficial effects: By simplifying the steps of preparing the target material to the melting process in an electron beam furnace in one step, the silver-copper alloy target material prepared through the alloy preparation and grain control steps has a small grain size of ≤100μm, uniform, free of pores and inclusions, and the purity meets the 5N standard. At the same time, a vibrator is installed on the cooling bed (crystallizer B2) in the three-gun electron beam furnace to interfere with the growth of dendrites during the cooling process and play a role in refining the grains, thereby reducing the process flow of the copper-silver alloy target material and reducing the preparation cost of the target material.

[0032] First embodiment Please refer to Figure 3 , Figure 4 and Figure 5 A method for preparing a silver-copper alloy target by electron beam melting, wherein an electron beam furnace is required in both step S11 and step S12, and the electron beam furnace comprises a main body 10, a first sealing opening 11 is provided at one end of the main body 10, a second sealing opening 12 is provided inside the first sealing opening 11, a loading opening 13 is provided inside the second sealing opening 12, and a card interface 14 is provided on the side wall of the first sealing opening 11.

[0033] One end of the body 10 is rotatably connected to a first sealing door 20, a first sealing gasket 21 is fixedly installed on one side of the first sealing door 20, a sliding groove 22 is opened on the other side of the first sealing door 20, a pushing block 23 is slidably connected to the inner side surface of the sliding groove 22, and an abutment block 24 is fixedly installed on one side of the pushing block 23.

[0034] The internal thread of the first sealing door 20 is connected to an adjusting rod 30, one end of the adjusting rod 30 is fixedly installed with a turning handle 31, the other end of the adjusting rod 30 is fixedly installed with a second sealing door 32, one side of the second sealing door 32 is fixedly installed with a second sealing gasket 33, and the top and bottom of one side of the first sealing door 20 are fixedly installed with a limiting telescopic rod 34, one end of the limiting telescopic rod 34 is fixedly installed on the side of the second sealing door 32.

[0035] When the second sealing door 32 moves, the limiting telescopic rod 34 will be extended, so that the limiting telescopic rod 34 plays a role in limiting the second sealing door 32; When in use, the pushing block 23 can slide on the inner side of the slide groove 22 , thereby pushing the abutting block 24 .

[0036] The working principle of the method for preparing silver-copper alloy target material by electron beam melting provided by the present invention is as follows: When in use, the alloy material to be prepared is placed into the interior of the main body 10 through the loading port 3, and then the first sealing door 20 is rotated to rotate the first sealing door 20 to the inner side of the first sealing port 11, and the first sealing gasket 21 is abutted against the inner side of the first sealing port 11, and then the pushing block 23 is pushed to drive the abutting block 24 to slide on the inner side of the slide groove 22, so that one end of the abutting block 24 abuts against the inner side of the card interface 14, thereby limiting the first sealing door 20, and then the turning handle 31 is rotated to drive the adjusting rod 30 to be threadedly connected inside the first sealing door 20, thereby driving the second sealing door 32 to move, so that the second sealing door 32 drives the second sealing gasket 33 to abut against the inner side of the second sealing port 12, thereby playing a sealing role.

[0037] Compared with the related art, the method for preparing silver-copper alloy target by electron beam melting provided by the present invention has the following beneficial effects: By cooperating with each other through structures such as the first sealing port 11, the second sealing port 12, the first sealing door 20, the second sealing door 32, the first sealing gasket 21 and the second sealing gasket 33, when in use, the first sealing door 20 can be stuck on the inner side of the first sealing port 11, and the second sealing door 32 can be stuck on the inner side of the second sealing port 12. In this way, the main body 10 can be double-sealed to prevent external air from entering the interior of the main body 10 during subsequent vacuuming.

[0038] Second embodiment Please refer to Figure 6 Based on the method for preparing a silver-copper alloy target by electron beam melting provided in the first embodiment of the present application, the second embodiment of the present application proposes another method for preparing a silver-copper alloy target by electron beam melting. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0039] Specifically, the difference of the method for preparing silver-copper alloy target material by electron beam melting provided in the second embodiment of the present application is that, in a method for preparing silver-copper alloy target material by electron beam melting, a fixing plate 40 is fixedly installed on the other side of the first sealing door 20, and the internal thread of the fixing plate 40 is connected to a threaded rod 41.

[0040] A rotating plate 42 is fixedly mounted on one end of the threaded rod 41 , and the other end of the threaded rod 41 is rotatably connected to the other side of the pushing block 23 .

[0041] The working principle of the method for preparing silver-copper alloy target material by electron beam melting provided by the present invention is as follows: When moving the pushing block 23, the user can rotate the rotating plate 42 so that the rotating plate 42 drives the threaded rod 41 to be threadedly connected inside the fixed plate 40, and then make one end of the threaded rod 41 abut against the pushing block 23 and move, so that the pushing block 23 drives the abutting block 24 to be inserted into the inner side of the card interface 14.

[0042] Compared with the related art, the method for preparing silver-copper alloy target by electron beam melting provided by the present invention has the following beneficial effects: By cooperating with each other, the fixed plate 40, the threaded rod 41 and the rotating plate 42, one end of the threaded rod 41 can push and limit the push block 23 during use, thereby preventing the push block 23 from moving.

[0043] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for preparing a silver-copper alloy target by electron beam melting, characterized in that: The following steps are involved: S1. Alloy preparation; S11, preparation of a silver-copper alloy containing more than 0.1-70% silver, according to the proportion of the silver-copper alloy components to be prepared, first place the 5N silver-copper master alloy in the crystallizer A of the electron beam furnace, and place the 4N cathode copper in the No. 2 crystallizer B, and then evacuate each part of the electron beam furnace; turn on the high-voltage power supply and electron gun preheating of the electron beam melting furnace, first aim the No. 1 electron gun at the 4N cathode copper in the crystallizer B for melting, and then use the No. 2 electron gun to melt the silver-copper master alloy in the crystallizer A, and the melted silver-copper master alloy flows into the crystallizer B to obtain a mixed melt, and close the No. 1 and No. 2 electric guns; S12. Preparation of a silver-copper alloy containing more than 70% silver: according to the proportion of the silver-copper alloy to be prepared, 4N silver is placed in a crystallizer A of an electron beam furnace and 4N cathode copper is placed in a crystallizer B of an electron beam melting furnace, and then each part of the electron beam furnace is evacuated; the high-voltage power supply and electron gun of the electron beam melting furnace are turned on for preheating, and the No. 1 electron gun is first aimed at the 4N cathode copper in the crystallizer B for melting, and the No. 2 electron gun is used to melt the 4N silver in the crystallizer A, and the melted silver liquid flows into the crystallizer B to obtain a mixed melt, and the No. 1 and No. 2 electric guns are turned off; S2, grain control: turn off No. 1 and No. 2 electron guns while turning on No. 3 electron gun, adjust the power to 10-40KW, rotate and disturb along the inner edge of the crystallizer toward the center for 5-30S, immediately turn off No. 3 electron gun, turn on the vibrator, adjust the vibration frequency to 2-10 times / 30S, vibrate for 3-10min, turn off the vibrator, and obtain the silver-copper alloy ingot after cooling; the disturbance of the electron beam can play the role of stirring the mixed melt and refining the grains, and the role of the vibrator is to break the grains and reduce the porosity of the matrix; S3. Post-treatment: The silver-copper alloy ingot is subjected to homogenization annealing treatment at a temperature of 400-680°C for 4-5 hours to obtain a silver-copper alloy target.

2. The method for preparing a silver-copper alloy target by electron beam melting according to claim 1, characterized in that: The 5N silver-copper master alloy in step S11 is a silver-copper alloy containing 60-80% silver, and the content of the two main metal elements of silver and copper is ≥99.999%. The power of electron gun No. 1 in step S11 is set to 15-40KW, and the smelting time is 10-30min.

3. The method for preparing a silver-copper alloy target by electron beam melting according to claim 1, characterized in that: The power of the No. 2 electron gun in the step S11 is set to 80-200KW. According to the quality of the silver-copper master alloy to be melted, the melting time is controlled to be within 30S. In the step S11, the No. 1 electron gun is first turned on until the melting time is within 40S, and then the No. 2 electron gun is turned on.

4. The method for preparing a silver-copper alloy target by electron beam melting according to claim 1, characterized in that: In the step S12, the power of the No. 1 electron gun and the No. 2 electron gun is set to 15-40KW, the smelting time is 10-30min, and the No. 1 electron gun and the No. 2 electron gun are turned on at the same time in the step S12. After the silver liquid in the crystallizer A is smelted, it flows into the crystallizer B and mixes with the smelted copper liquid.

5. The method for preparing a silver-copper alloy target by electron beam melting according to claim 1, characterized in that: The number and sequence of the grain control step S02 in step S12 can be adjusted according to the grain size to be achieved and the porosity of the target material. Each time after the second opening of the No. 3 electron gun, the power of the electron gun needs to be adjusted to 50-100KW, and the disturbance is controlled within 10S.

6. The method for preparing a silver-copper alloy target by electron beam melting according to claim 1, characterized in that: Both step S11 and step S12 require the use of an electron beam furnace, which includes a main body, a first sealing opening is opened at one end of the main body, a second sealing opening is opened inside the first sealing opening, a loading port is opened inside the second sealing opening, and a card interface is opened on the side wall of the first sealing opening.

7. The method for preparing a silver-copper alloy target by electron beam melting according to claim 6, characterized in that: One end of the body is rotatably connected to a first sealing door, a first sealing gasket is fixedly installed on one side of the first sealing door, a sliding groove is opened on the other side of the first sealing door, a pushing block is slidably connected to the inner side surface of the sliding groove, and an abutment block is fixedly installed on one side of the pushing block.

8. The method for preparing a silver-copper alloy target by electron beam melting according to claim 7, characterized in that: The internal thread of the first sealing door is connected to an adjusting rod, a turning handle is fixedly installed on one end of the adjusting rod, a second sealing door is fixedly installed on the other end of the adjusting rod, a second sealing gasket is fixedly installed on one side of the second sealing door, and a limiting telescopic rod is fixedly installed on the top and bottom of one side of the first sealing door, and one end of the limiting telescopic rod is fixedly installed on the side of the second sealing door.

9. The method for preparing a silver-copper alloy target by electron beam melting according to claim 8, characterized in that: A fixing plate is fixedly installed on the other side of the first sealing door, and a threaded rod is connected to the inner thread of the fixing plate.

10. The method for preparing a silver-copper alloy target by electron beam melting according to claim 9, characterized in that: A rotating plate is fixedly mounted on one end of the threaded rod, and the other end of the threaded rod is rotatably connected to the other side of the pushing block.

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