Display panel, manufacturing method and display device

Abstract

The invention relates to a display panel, a manufacturing method and a display device, and relates to the technical field of display, the display panel comprises a substrate, metal gaskets, an insulating layer and a connecting wire, the connecting wire is at least partially located on the side face of the substrate and is connected with the first metal gasket and the second metal gasket, and the side, away from the substrate, of the insulating layer comprises a micro cavity; in the direction from the substrate to the insulating layer, the micro-cavity is of a structure with a narrow upper part and a wide lower part, so that the micro-cavity with the structure with the narrow upper part and the wide lower part is arranged on the surface of one side, deviating from the metal gasket, of the insulating layer, and when the side surface and at least part of the first surface and the second surface of the substrate are coated, due to the existence of the micro-cavity, the connecting wires on the two sides of the micro-cavity are naturally broken; the risk that the side connecting wires fall off due to the fact that the protective film is torn off is reduced, and the preparation yield is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Seamless splicing technology refers to the use of multiple display panels to be spliced ​​into a large display device. The driving circuit is set in the binding area of ​​the display panel, and a protective film is attached to the front and back of the display panel. The protective film is used to prevent contamination of the pixel area. The metal material is deposited on the side of the display panel using physical vapor deposition technology. After the coating is completed, the protective film is torn off, and the metal layer deposited on the side is patterned or laser-formed to form side metal traces. The side metal traces are used to connect the circuits on the front of the display panel to the circuits on the back, so as to achieve conduction between the display panel and the driving circuit.

[0003] However, the metal deposited on the protective film and the metal deposited on the side of the display panel are formed by integral coating. When the protective film is torn off, the metal deposited on the side has weak adhesion to the substrate and is easily torn off together, making it impossible to produce the side metal routing. Summary of the invention

[0004] In order to solve the above technical problems, the present disclosure provides a display panel and a manufacturing method, and a display device, which are used to increase the adhesion between the side coating and the substrate and reduce the risk of the side metal coating falling off due to tearing off the protective film.

[0005] In a first aspect, the present disclosure provides a display panel, comprising:

[0006] A substrate, comprising a first surface and a second surface arranged opposite to each other, and a side surface, wherein the first surface and the second surface are both provided with a metal pad;

[0007] The metal pad comprises a first metal pad and a second metal pad, the first metal pad is located on the first surface, and the second metal pad is located on the second surface;

[0008] a first insulating layer, wherein the first insulating layer is at least partially disposed on a side of the first metal pad away from the first surface, at least a portion of the first metal pad is exposed from the first insulating layer, and the first insulating layer comprises a micro cavity, wherein the micro cavity is located on a surface of the first insulating layer away from the first metal pad;

[0009] and / or,

[0010] a second insulating layer, wherein the second insulating layer is at least partially disposed on a side of the second metal pad away from the second surface, at least a portion of the second metal pad is exposed from the second insulating layer, and the second insulating layer comprises a micro cavity, and the micro cavity is located on a surface of the second insulating layer away from the second metal pad;

[0011] a connecting line, at least partially located on the side surface and connecting the first metal pad and the second metal pad;

[0012] The connecting wires on both sides of the micro cavity are at least partially disconnected.

[0013] In a second aspect, the present disclosure provides a display device, comprising the display panel as described in the first aspect.

[0014] In a third aspect, the present disclosure provides a method for manufacturing a display panel, for manufacturing the display panel as described in the first aspect, the method comprising:

[0015] providing a substrate;

[0016] forming metal pads on the first and second sides of the substrate;

[0017] An insulating layer is disposed on a side of the metal pad facing away from the substrate, and at least a portion of the metal pad is exposed from the insulating layer;

[0018] A protective layer is provided on a side of the insulating layer away from the metal pad, wherein at least a portion of the insulating layer is exposed from the protective layer;

[0019] Etching the insulating layer exposed from the protective layer to form a micro cavity;

[0020] Plating a metal layer on the side surface, the first surface and the second surface of the substrate, wherein the metal layer covers the metal pad exposed from the insulating layer, so that the metal pads on the first surface and the second surface are electrically connected;

[0021] The protective layer is peeled off.

[0022] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages: by setting a micro-cavity on the surface of the insulating layer away from the metal pad, the connecting wires on both sides of the micro-cavity are naturally disconnected, so that the break of the connecting wire is naturally formed during coating due to the existence of the micro-cavity, thereby increasing the adhesion between the connecting wire and the metal pad and the substrate, reducing the risk of side connecting wires falling off due to tearing off the protective film, and improving the preparation yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] Figure 1 Shown is a plan view of a display panel provided by an embodiment of the present disclosure;

[0026] Figure 2 Shown Figure 1 A cross-sectional view of the panel in the A-A' direction is shown;

[0027] Figure 3 Shown Figure 1 Another A-A' cross-sectional view of the display panel;

[0028] Figure 4 Shown Figure 1 Another AA' cross-sectional view of the display panel;

[0029] Figure 5 Shown Figure 1 A cross-sectional view of the panel in the A-A' direction is shown;

[0030] Figure 6 Shown Figure 1 A BB' cross-sectional view of the panel is shown in FIG.

[0031] Figure 7 Shown is a schematic diagram of a micro cavity structure provided by an embodiment of the present disclosure;

[0032] Figure 8 Shown Figure 1 A cross-sectional view of the panel in the A-A' direction is shown;

[0033] Fig. 9 The figure shows a schematic diagram of the relative widths of a metal line and a micro cavity provided by an embodiment of the present disclosure;

[0034] Fig.10 FIG. 1 is a schematic diagram showing a relative relationship between a micro cavity depth and a connection wiring thickness provided by an embodiment of the present disclosure;

[0035] Fig.11 A schematic diagram of a display device provided in an embodiment of the present disclosure;

[0036] Fig.12 Shown is a manufacturing flow chart of a display panel provided by an embodiment of the present disclosure;

[0037] Fig.13Shown is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure when a protective layer is present. DETAILED DESCRIPTION

[0038] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0039] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0040] Figure 1 FIG. 1 is a schematic plan view of a display panel provided by an embodiment of the present disclosure. Figure 2 Shown Figure 1 A cross-sectional view of the display panel in the A-A' direction, Figure 3 Shown Figure 1 Another A-A' cross-sectional view of the display panel, Figure 4 Shown Figure 1 Another A-A' cross-sectional view of the display panel, please refer to Figures 1 to 4 The present disclosure provides a display panel 100, including a display area AA and a binding area BA, the binding area BA including a plurality of metal pads 20 arranged at intervals, the binding area BA also including a substrate 10, the substrate 10 including a first surface 11 and a second surface 12 arranged opposite to each other, and a side surface 13, the first surface 11 and the second surface 12 are both provided with metal pads 20; the metal pads 20 include a first metal pad 21 and a second metal pad 22, the first metal pad 21 is located on the first surface 11, and the second metal pad 22 is located on the second surface 12;

[0041] a first insulating layer 31, the first insulating layer 31 is at least partially disposed on a side of the first metal pad 21 away from the first surface 11, at least a portion of the first metal pad 21 is exposed from the first insulating layer 31, the first insulating layer 31 includes a micro cavity 00, and the micro cavity 00 is located on a surface of the first insulating layer 31 away from the first metal pad 21; and / or, a second insulating layer 32, the second insulating layer 32 is at least partially disposed on a side of the second metal pad 22 away from the second surface 12, at least a portion of the second metal pad 22 is exposed from the second insulating layer 32, the second insulating layer 32 includes a micro cavity 00, and the micro cavity 00 is located on a surface of the second insulating layer 32 away from the second metal pad 22;

[0042] The connection wiring 40 is at least partially located on the side surface 13 and connects the first metal pad 21 and the second metal pad 22 ; the connection wiring 40 on both sides of the micro cavity 00 is at least partially disconnected.

[0043] Specifically, the display panel 100 includes a substrate 10, and the substrate 10 includes a first surface 11, a second surface 12 and a side surface 13. The first surface 11 and the second surface 12 are arranged opposite to each other, and the side surface 13 is used to connect the first surface 11 and the second surface 12. It should be noted that the side surface 13 can be a completely vertical surface or a non-completely vertical surface. The figure only shows a case where the side surface 13 is a completely vertical surface. It can be understood that the side surface 13 can also be a beveled surface extending from one side of the first surface 11, or a beveled surface extending from one side of the second surface 12, or a side surface that connects the beveled surface extending from the first surface 11 and the beveled surface extending from the second surface 12 to each other.

[0044] A first metal pad 21 is disposed on the first surface 11 of the substrate 10 in the display panel 100, and a second metal pad 22 is disposed on the second surface 12 of the substrate 10 in the display panel 100. The projections of the first metal pad 21 and the second metal pad 22 on the plane where the substrate 10 is located may overlap or may not overlap, and the present disclosure does not make any specific restrictions on this.

[0045] Please refer to Figures 1 to 4 The display panel 100 also includes a first insulating layer 31, which is at least partially located on a side of the first metal pad 21 away from the first surface 11 of the substrate 10, and the first metal pad 21 is at least partially exposed from the first insulating layer 31; the display panel 100 may also include a second insulating layer 32, which is at least partially located on a side of the second metal pad 22 away from the first surface 11 of the substrate 10, and the second metal pad 22 is at least partially exposed from the second insulating layer 32.

[0046] Please refer to Figure 2 In an optional embodiment provided in the present disclosure, the display panel 100 includes a first insulating layer 31, the first insulating layer 31 includes a micro cavity 00, and the micro cavity 00 is located on a surface of the first insulating layer 31 facing away from the first metal pad 21. In this embodiment, the display panel 100 does not include a second insulating layer 32. Please refer to Figure 3 In another optional embodiment provided by the present disclosure, the display panel 100 includes a first insulating layer 31, the first insulating layer 31 includes a micro cavity 00, and the micro cavity 00 is located on a side surface of the first insulating layer 31 away from the first metal pad 21, and the display panel 100 also includes a second insulating layer 32, the second insulating layer 32 includes a micro cavity 00, and the micro cavity 00 is located on a side surface of the second insulating layer 32 away from the second metal pad 22. Please refer to Figure 4In another optional embodiment provided in the present disclosure, the display panel 100 does not include the first insulating layer 31, the display panel 100 includes a second insulating layer 32, the second insulating layer 32 includes a micro cavity 00, and the micro cavity 00 is located on a side surface of the second insulating layer 32 away from the second metal pad 22.

[0047] The display panel 100 also includes a connecting wire 40, which is at least partially located on the side 13, and the two ends of the connecting wire 40 are respectively connected to the first metal pad 21 and the second metal pad 22. Further, one end of the connecting wire 40 is connected to a portion of the first metal pad 21 exposed from the first insulating layer 31, and the other end of the connecting wire 40 is connected to a portion of the second metal pad 22 exposed from the second insulating layer 32; along a direction parallel to the plane where the substrate 10 is located, the connecting wires 40 on both sides of the micro cavity 00 are at least partially disconnected.

[0048] In this way, by setting a micro cavity 00 on the surface of the side of the insulating layer 30 away from the metal pad 20, the connecting wires 40 on both sides of the micro cavity 00 are at least partially disconnected. The connecting wires 40 can be connected to the metal pad 20 through coating, while the connecting wires 40 on both sides of the micro cavity 00 are naturally disconnected, thereby reducing the warping or falling off of the connecting wires 40 caused by tearing the film, thereby improving the manufacturing yield.

[0049] Figure 5 Shown Figure 1 A cross-sectional view of the display panel in the A-A' direction, Figure 6 Shown Figure 1 A BB' cross-section of the display panel is shown in FIG. Figure 7 FIG. 1 is a schematic diagram of a micro cavity structure provided by an embodiment of the present disclosure. Figure 8 Shown Figure 1 A cross-sectional view of the panel in the A-A' direction is shown in the figure. Figures 1 to 8 In an optional embodiment of the present disclosure, along the direction from the substrate 10 to the insulating layer 30 , the micro cavity 00 is a structure that is narrow at the top and wide at the bottom.

[0050] Specifically, the micro cavity 00 is located on the side surface of the insulating layer 30 away from the substrate 10. In the direction from the substrate 10 to the insulating layer 30, the micro cavity 00 is a narrow upper and wide lower structure. The "upper" here refers to the part of the micro cavity 00 that is relatively far away from the substrate 10, and the "lower" here refers to the part of the micro cavity 00 that is relatively close to the substrate 10. Please refer to Figure 7 When the micro cavity 00 includes a first sub-portion 001 and a second sub-portion 002, the first sub-portion 001 of the micro cavity 00 is relatively far away from the substrate 10, and the second sub-portion 002 of the micro cavity 00 is relatively close to the substrate 10. The first sub-portion 001 of the micro cavity 00 which is relatively far away from the substrate 10 is narrower than the second sub-portion 002 of the micro cavity 00 which is relatively close to the substrate 10; please refer to Figure 8When the insulating layer 30 includes only one film layer 301, the micro cavity 00 is composed of only one part. In the direction perpendicular to the plane where the substrate 10 is located, the cross-section of the micro cavity 00 is a trapezoid. The short horizontal side of the trapezoid is relatively far away from the substrate 10, and the long horizontal side of the trapezoid is relatively close to the substrate 10. The trapezoidal micro cavity 00 is a narrow-upper-wide-lower structure. In this way, by setting the micro cavity 00 to a narrow-upper-wide-lower structure, when the connecting wire 40 is formed by coating, based on the special structure of the micro cavity 00, the connecting wires 40 on the left and right sides of the micro cavity 00 are naturally disconnected, thereby reducing the warping or falling off of the connecting part of the connecting wire 40 and the metal pad 20 caused by the subsequent film tearing process, resulting in poor connection.

[0051] Please combine Figures 1 to 8 In an optional embodiment of the present disclosure, the micro cavity 00 does not penetrate the insulating layer 30 .

[0052] Specifically, the micro cavity 00 is located on the surface of the insulating layer 30 away from the substrate 10. In the direction perpendicular to the plane where the substrate 10 is located, the micro cavity 00 does not penetrate the insulating layer 30, that is, the micro cavity 00 located on the side of the insulating layer 30 away from the substrate 10 has a minimum distance greater than 0 from the metal pad 20. When the coating forms the connecting wiring 40, there is a partial insulating layer 30 between the coating material that partially falls to the bottom of the micro cavity 00 and the metal pad 20, which can insulate the coating material located inside the micro cavity 00 from the metal pad 20. In this way, the micro cavity 00 does not penetrate the insulating layer 30, and when the coating forms the connecting wiring 40, the risk of short circuit caused by the coating material falling to the bottom of the micro cavity 00 and connecting with the metal pad 20 can be reduced, thereby improving the safety of the display panel 100.

[0053] Please combine Figures 1 to 6 In an optional embodiment of the present disclosure, a plurality of first metal pads 21 are provided on the first surface 11, and the plurality of first metal pads 21 are arranged at intervals; the first insulating layer 31 includes a first micro cavity 01 and a second micro cavity 02, and along a direction perpendicular to the plane where the substrate 10 is located, the projections of the first micro cavity 01 and the first metal pad 21 on the substrate 10 at least partially overlap, and the projections of the second micro cavity 02 and the first metal pad 21 on the substrate 10 do not overlap.

[0054] Specifically, in an optional embodiment provided by the present disclosure, the substrate 10 includes a first surface 11, and along a direction parallel to the plane where the substrate 10 is located, the first surface 11 is provided with a plurality of first metal pads 21 arranged at intervals, and along a direction perpendicular to the plane where the substrate 10 is located, the first insulating layer 31 is located on a side of the first metal pad 21 away from the substrate 10, please refer to Figure 5 , the first insulating layer 31 includes a first micro cavity 01, and the projection of the first micro cavity 01 on the substrate 10 at least partially overlaps with the projection of the first metal pad 21 on the substrate 10, please refer to Figure 6 The first insulating layer 31 includes a second micro cavity 02, and the projection of the second micro cavity 02 on the substrate 10 does not overlap with the projection of the first metal liner 21 on the substrate 10, that is, along the direction perpendicular to the plane where the substrate 10 is located, the surface of the first insulating layer 31 on one side away from the first metal liner 21 includes the first micro cavity 01 and the second micro cavity 02, wherein, along the direction from the substrate 10 to the first insulating layer 31, the first micro cavity 01 is located above the first metal liner 21, and the second micro cavity 02 is not located above the first metal liner 2 1; along the direction parallel to the plane where the substrate 10 is located, the second micro cavity 02 is located between two adjacent first metal pads 21. In this way, by arranging the second micro cavity 02 on the first insulating layer 31 located between two adjacent first metal pads 21 in the direction parallel to the plane where the substrate 10 is located, and in the direction along the first insulating layer 31 pointing to the plane where the substrate 10 is located, there is no first metal pad 21 below the second micro cavity 02, which can improve the water and oxygen isolation effect of the substrate 10 and reduce the short circuit probability of the display panel 100.

[0055] Please combine Figures 1 to 8 In an optional embodiment of the present disclosure, the size of the first micro cavity 01 is smaller than the size of the second micro cavity 02 .

[0056] Specifically, the side of the first insulating layer 31 facing away from the substrate 10 includes a first micro cavity 01 and a second micro cavity 02. In a direction perpendicular to the plane where the substrate 10 is located, the first micro cavity 01 at least partially overlaps with the first metal pad 21. In a direction parallel to the plane where the substrate 10 is located, the second micro cavity 02 is located between two adjacent first metal pads 21. In an optional embodiment provided in the present disclosure, in a direction perpendicular to the plane where the substrate 10 is located, one first metal pad 21 corresponds to a plurality of first micro cavities 01, and in a direction parallel to the plane where the substrate 10 is located, a plurality of second micro cavities correspond between two adjacent first metal pads 21. 02, the projection of the first micro cavity 01 on the plane where the substrate 10 is located is smaller than the projection of the second micro cavity 02 on the plane where the substrate 10 is located, and the number of the first micro cavity 01 is smaller than the number of the second micro cavity 02. In this way, by arranging the first micro cavity 01 and the second micro cavity 02 on the first insulating layer 31, the specific structure of the first micro cavity 01 and the second micro cavity 02 makes the connecting wires 40 on both sides of the micro cavity 00 naturally disconnected, and the size of the first micro cavity 01 is designed to be smaller than the size of the second micro cavity 02, so that the connecting wires 40 corresponding to the first metal liner 21 can be disconnected more thoroughly during coating, thereby reducing the probability of warping or falling off of the connecting wires 40 caused by tearing the film.

[0057] Please combine Figures 1 to 8 In an optional embodiment of the present disclosure, the first micro cavity 01 is connected to the second micro cavity 02.

[0058] Specifically, along the direction parallel to the plane where the substrate 10 is located, the multiple first micro cavities 01 corresponding to the same metal pad 20 are interconnected, the multiple second micro cavities 02 corresponding to two adjacent first metal pads 21 are interconnected, the first micro cavity 01 is connected to the second micro cavity 02, and the connecting wires 40 on both sides of the micro cavity 00 are at least partially disconnected. Please refer to Figure 1 The first micro cavity 01 is connected with the second micro cavity 02, and a continuous and neat micro cavity 00 channel can be formed on the insulating layer 30, so that the connecting wires 40 on both sides of the micro cavity 00 are naturally disconnected during film coating. In this way, the first micro cavity 01 is connected with the second micro cavity 02, so that the first micro cavity 01 and the second micro cavity 02 can form a natural transition, and the connecting wires 40 on both sides of the micro cavity 00 are neatly disconnected, which facilitates the smooth film tearing process.

[0059] Please refer to Figures 7 and 8 In an optional embodiment of the present disclosure, the insulating layer 30 includes a first film layer 301 and a second film layer 302, the first film layer 301 is located on the side of the second film layer 302 away from the substrate 10, and the etching rate of the first film layer 301 material is less than the etching rate of the second film layer 302 material.

[0060] Specifically, in an optional embodiment provided by the present disclosure, when there is a micro cavity 00 in the first insulating layer 31, the first insulating layer 31 includes a first film layer 301 and a second film layer 302, the first film layer 301 is located on the side of the second film layer 302 away from the substrate 10, and along the direction perpendicular to the plane where the substrate 10 is located, the micro cavity 00 is located in the first film layer 301 and part of the second film layer 302, and the etching rate of the first film layer 301 material is less than the etching rate of the second film layer 302 material; in another optional embodiment provided by the present disclosure, when there is a micro cavity 00 in the second insulating layer 32, the second insulating layer 32 includes a first film layer 301 and a second film layer 302, the first film layer 301 is located on the side of the second film layer 302 away from the substrate 10, and the micro cavity 00 is located in the first film layer 301 and part of the second film layer 302. On the side of the second film layer 302 facing away from the substrate 10, along the direction perpendicular to the plane where the substrate 10 is located, the micro cavity 00 is located in the first film layer 301 and part of the second film layer 302, and the etching rate of the first film layer 301 material is less than the etching rate of the second film layer 302 material; in this way, when the insulating layer 30 is etched to form the micro cavity 00, since the etching rate of the first film layer 301 material is less than the etching rate of the second film layer 302 material, the micro cavity 00 can be naturally formed in the direction perpendicular to the plane where the substrate 10 is located. The structure is narrow at the top and wide at the bottom, which is beneficial to the natural disconnection of the connecting wires 40 on both sides of the micro cavity 00 during coating, thereby reducing the occurrence of undesirable conditions such as warping of the connecting wires 40 caused by film tearing.

[0061] Please refer to Figure 7In an optional embodiment provided in the present disclosure, the micro cavity 00 includes a first sub-portion 001 and a second sub-portion 002, the first sub-portion 001 is located in the first film layer 301, the second sub-portion 002 is located in the second film layer 302, the first sub-portion 001 is connected to the second sub-portion 002, and the inner diameter R1 of the first sub-portion 001 is smaller than the inner diameter R2 of the second sub-portion 002.

[0062] Specifically, in an optional embodiment provided by the present disclosure, please refer to Figure 5 and Figure 7 The first insulating layer 31 includes a first micro cavity 01 and a second micro cavity 02. The projection of the first micro cavity 01 on the plane where the substrate 10 is located overlaps with the projection of the first metal liner 21 on the plane where the substrate 10 is located. The first micro cavity 01 includes a first sub-portion 001. In the direction perpendicular to the plane where the substrate 10 is located, the first sub-portion 001 is located in the first film layer 301 relatively far away from the first metal liner 21. The first micro cavity 01 includes a second sub-portion 002. The second sub-portion 002 is located in the second film layer 302 relatively close to the first metal liner 21. The first sub-portion 001 and the second sub-portion 002 are connected. The inner diameter R1 of the first sub-portion 001 is smaller than the inner diameter R2 of the second sub-portion 002. That is, in the direction from the substrate 10 to the first insulating layer 31, the first micro cavity 01 is a narrow upper and wide lower structure. Please combine Figure 6 to Figure 7 The projection of the second micro cavity 02 on the plane where the substrate 10 is located does not overlap with the projection of the first metal liner 21 on the plane where the substrate 10 is located. The second micro cavity 02 includes a first sub-portion 001. In a direction perpendicular to the plane where the substrate 10 is located, the first sub-portion 001 is located at a first film layer 301 relatively far away from the substrate 10. The second micro cavity 02 includes a second sub-portion 002. The second sub-portion 002 is located at a second film layer 302 relatively close to the substrate 10. The first sub-portion 001 and the second sub-portion 00 2, the inner diameter R1 of the first sub-portion 001 is smaller than the inner diameter R2 of the second sub-portion 002, that is, in the direction from the substrate 10 to the first insulating layer 31, the second micro cavity 02 is a structure that is narrow at the top and wide at the bottom; in this way, by arranging the micro cavity 00 into sub-portions that are mutually interpenetrating but located in different film layers, when etching the insulating layer 30, based on the material properties of the film layer and the difference in etching rate, the micro cavity 00 can naturally form a structure that is narrow at the top and wide at the bottom, which is beneficial to the natural disconnection of the connecting wires 40 on both sides of the micro cavity 00 during film coating.

[0063] It should be noted that the figure only shows the case where the first sub-portion 001 and the second sub-portion 002 of the micro cavity 00 are rectangular. It can be understood that the first sub-portion 001 and the second sub-portion 002 can also be isosceles trapezoids or unequal trapezoids, etc., which are narrow at the top and wide at the bottom. They are not listed here one by one and can be set according to actual process requirements.

[0064] It should be noted that the figure only shows the first microcavity 01 and the second microcavity 02 of the first insulating layer 31. It can be understood that when the display panel 100 includes the second insulating layer 32, and the second insulating layer 32 includes the microcavity 00, the second insulating layer 32 has the first microcavity 01 and the second microcavity 02, and the first microcavity 01 in the second insulating layer 32 includes the first sub-portion 001 and the second sub-portion 002, the first sub-portion 001 and the second sub-portion 002 are connected, and the inner diameter of the first sub-portion 001 is smaller than the second sub-portion 002, that is, in the direction from the substrate 10 to the second insulating layer 32, the first microcavity 01 is a narrow upper and wide lower structure; the first sub-portion 001 of the first microcavity 01 is located relatively far The first micro cavity 01 is located in the first film layer 301 relatively away from the substrate 10, and the second sub-portion 002 of the first micro cavity 01 is located in the second film layer 302 relatively close to the substrate 10; the second micro cavity 02 in the second insulating layer 32 includes the first sub-portion 001 and the second sub-portion 002, the first sub-portion 001 of the second micro cavity 02 is located in the first film layer 301 relatively away from the substrate 10, and the second sub-portion 002 of the second micro cavity 02 is located in the second film layer 302 relatively close to the substrate 10, the first sub-portion 001 and the second sub-portion 002 are connected, and the inner diameter R1 of the first sub-portion 001 is smaller than the inner diameter R2 of the second sub-portion 002, that is, in the direction from the substrate 10 to the second insulating layer 32, the second micro cavity 02 is a structure that is narrow at the top and wide at the bottom.

[0065] Please refer to Figure 8 In an optional embodiment of the present disclosure, the cross-section of the micro cavity 00 in a direction perpendicular to the plane where the substrate 10 is located is a trapezoid.

[0066] Specifically, in an optional embodiment provided by the present disclosure, the insulating layer 30 only includes the first film layer 301, and the microcavity 00 is located on the surface of the first film layer 301 away from the substrate 10, and does not penetrate the first film layer 301. In the direction perpendicular to the plane where the substrate 10 is located, the cross-section of the microcavity 00 is trapezoidal. When the coating forms the connecting wiring 40, the microcavity 00 with the trapezoidal structure can make the coating material that falls into the bottom of the microcavity 00 and the connecting wiring 40 on both sides of the microcavity 00 naturally disconnected, so as to facilitate the subsequent film tearing process. In this way, when the insulating layer 30 only includes the first film layer 301, by setting the microcavity 00 into a trapezoidal structure with a narrow upper and a wide lower part, during the coating process, the connecting wiring 40 on both sides of the microcavity 00 can be naturally disconnected without adding any process, and will not form adhesion with the coating material that falls to the bottom of the microcavity 00, thereby reducing the occurrence of undesirable conditions such as warping or falling off of the connecting wiring 40 during film tearing.

[0067] Fig. 9 The figure shows a schematic diagram of the relative width of a metal line and a micro cavity provided by an embodiment of the present disclosure. Figures 1 to 9In an optional embodiment of the present disclosure, in the display panel 100 provided by the present disclosure, a metal line 41 exists in the micro cavity 00, and the maximum width H1 of the metal line 41 is less than the maximum width R2 of the micro cavity 00; the metal line 41 and the connecting line 40 are formed in the same process. It should be noted that the maximum width R2 of the micro cavity 00 is the maximum inner diameter R2 of the micro cavity 00.

[0068] Specifically, in an optional embodiment provided by the present disclosure, after the surface of the insulating layer 30 facing away from the substrate 10 is etched to form the micro cavity 00, the first surface 11, the second surface 12, and the side surface 13 of the substrate 10 are plated. After the coating is completed, the coating material deposited on the side surface 13, at least a portion of the first surface 11, and at least a portion of the second surface 12 forms a connecting line 40, and the connecting line 40 is used to connect the metal pads 20 on the first surface 11 and the second surface 12. The coating material deposited inside the micro cavity 00 forms a metal wire 41. The micro cavity 00 has a narrow upper and wide lower structure, so that the micro cavity 00 is The maximum width H1 of the metal wire 41 deposited inside the microcavity 00 is smaller than the maximum inner diameter R2 of the microcavity 00. Thus, during the coating process, the connecting wiring 40 is formed on the surface of the substrate 10 and the metal wire 41 is formed inside the microcavity 00. Due to the narrow upper and wide lower structure of the microcavity 00, the maximum width H1 of the metal wire 41 is smaller than the maximum width R2 of the microcavity 00, and the metal wire 41 will not be lifted up during subsequent film tearing, which is conducive to the deposition of the metal wire 41 inside the microcavity 00 to form a continuous metal wiring, which is convenient for connecting with the anti-static circuit of the display panel 100, thereby improving the safety of the display panel 100.

[0069] Please combine Figures 1 to 9 In an optional embodiment of the present disclosure, the display panel 100 includes an anti-static circuit, and the metal wire 41 is connected to the anti-static circuit.

[0070] Specifically, in an optional embodiment provided by the present disclosure, the display panel 100 includes an anti-static circuit, which is located at the periphery of the display area. In a direction perpendicular to the plane where the substrate 10 is located, in the same insulating layer 30, a plurality of first micro-cavities 01 corresponding to the same metal pad 20 are interconnected, a plurality of second micro-cavities 02 corresponding to two adjacent metal pads 20 are interconnected, and the first micro-cavity 01 is connected to the second micro-cavity 02. Please refer to Figure 1The interconnected micro cavities 00 form a continuous channel. When the connecting wiring 40 is formed by coating, at least part of the coating material is deposited on the bottom of the micro cavity 00 to form a continuous metal wire 41. The continuous metal wire 41 inside the multiple micro cavities 00 is connected to the anti-static circuit in the display panel 100 to prevent the connecting wiring 40 from being damaged by electrostatics in subsequent processes, thereby improving the anti-static effect of the display panel 100 and ensuring product reliability. In this way, by connecting the metal wire 41 in the multiple interconnected micro cavities 00 with the anti-static circuit of the display panel 100, the anti-static effect of the display panel 100 can be improved, thereby improving the safety and stability of the display panel 100.

[0071] Please refer to Figure 5 and Figure 6 In another optional embodiment provided by the present disclosure, along a direction parallel to the plane where the substrate 10 is located, the same insulating layer 30 includes a plurality of micro cavities 00, and the plurality of micro cavities 00 are interconnected. The coating process forms connecting traces 40 on the surface of the first insulating layer 31 of the first surface 11, the side surface 13, and the surface of the second insulating layer 32 of the second surface 12. After the metal wire 41 is formed inside the micro cavity 00, in combination with the subsequent packaging process, a light shielding layer 50 is filled above the metal wire 41 of the micro cavity 00. The light shielding layer 50 can reduce the reflectivity of the display panel 100 and prevent glue overflow to the display area due to the printing or pad printing process.

[0072] Fig.10 FIG. 1 is a schematic diagram showing the relative relationship between the depth of a micro cavity and the thickness of a connecting line provided in an embodiment of the present disclosure. Figures 1 to 10 The present disclosure provides a display panel 100 , wherein a depth h1 of the micro cavity 00 is greater than a thickness L1 of the connecting wire 40 , and a minimum inner diameter R1 of the micro cavity 00 is greater than or equal to 1.2 times the thickness L1 of the connecting wire 40 .

[0073] Specifically, along the direction perpendicular to the plane where the substrate 10 is located, the maximum depth h1 of the micro cavity 00 is greater than the thickness L1 of the connecting wire 40. The width H1 of the metal wire 41 deposited inside the micro cavity 00 by the coating process is less than the minimum inner diameter R1 of the micro cavity 00. When the coating is a thin film, the minimum inner diameter R1 of the micro cavity 00 is more than 1.2 times the thickness of the coating. In an optional embodiment provided in the present disclosure, the minimum inner diameter R1 of the micro cavity 00 is 1.2 times the thickness L1 of the connecting wire 40. In another optional embodiment provided in the present disclosure, the minimum inner diameter R1 of the micro cavity 00 is 1.2 times the thickness L1 of the connecting wire 40. 1 is 1.5 times the thickness L1 of the connecting wiring 40...They are not listed here one by one, and can be set specifically according to the process requirements, and it is only necessary to satisfy that the minimum inner diameter R1 of the micro cavity 00 is more than 1.2 times the thickness L1 of the connecting wiring 40; in this way, the height difference between the metal wire 41 inside the micro cavity 00 and the connecting wiring 40 on both sides of the micro cavity 00 is greater than the thickness L1 of the connecting wiring 40 itself, which can achieve the natural disconnection of the connecting wiring 40 on both sides of the micro cavity 00 and the metal wire 41 inside the micro cavity 00 during the coating process, thereby reducing the subsequent process defects caused by the back-adhesion of metal debris during the film tearing process.

[0074] Fig.11 A schematic diagram of a display device provided in an embodiment of the present disclosure is provided in conjunction with Figures 1 to 11 The present disclosure provides a display device 200, comprising a display panel 100 provided by any of the above-mentioned embodiments.

[0075] The display device 200 provided in the embodiment of the present disclosure may be any electronic device with a display function, such as a touch display screen, a mobile phone, a tablet computer, a laptop computer, an e-book, or a television, and may also be a spliced ​​display device, etc. The display device 200 provided in the embodiment of the present disclosure has the beneficial effects of the display panel 100 provided in the embodiment of the present disclosure, and the specific description of the display panel 100 in the above embodiments may be referred to, and will not be repeated in this embodiment.

[0076] Understandably, Fig.11 Only a rounded rectangular structure is used as an example to illustrate one shape of the display device 200. In some other embodiments of the present disclosure, the display device 200 may also be circular, elliptical or any other feasible shape, and the present disclosure does not specifically limit this.

[0077] Fig.12 FIG. 1 is a flowchart of manufacturing a display panel provided by an embodiment of the present disclosure. Fig.13 FIG. 1 is a schematic diagram of a structure of a display panel provided by an embodiment of the present disclosure when a protective layer is present. Figures 1 to 13 The present disclosure provides a method for manufacturing a display panel 100, which is used to manufacture the display panel 100 as described above, and the method includes:

[0078] S1: providing a substrate 10;

[0079] S2: forming a metal pad 20 on the first surface 11 and the second surface 12 of the substrate 10;

[0080] S3: Disposing an insulating layer 30 on a side of the metal pad 20 facing away from the substrate 10 , with at least a portion of the metal pad 20 exposed from the insulating layer 30 ;

[0081] S4: Disposing a protective layer 60 on a side of the insulating layer 30 away from the metal pad 20 , with at least a portion of the insulating layer 30 exposed from the protective layer 60 ;

[0082] S5: etching the insulating layer 30 exposed from the protective layer 60 to form a micro cavity 00;

[0083] S6: plating a metal layer on the side surface 13, the first surface 11 and the second surface 12 of the substrate 10, the metal layer covers the metal pad 20 exposed from the insulating layer 30, so that the metal pad 20 on the first surface 11 and the second surface 12 is electrically connected;

[0084] S7: tear off the protective layer 60.

[0085] Specifically, step S1: providing a substrate 10; step S2: making a plurality of first metal pads 21 arranged at intervals on the first surface 11 of the substrate 10 in a direction parallel to the plane where the substrate 10 is located, and making a plurality of second metal pads 22 arranged at intervals on the second surface 12 of the substrate 10; step S3: setting a first insulating layer 31 on a side of the plurality of first metal pads 21 arranged at intervals away from the substrate 10, at least a portion of the first metal pads 21 are exposed from the first insulating layer 31, and / or, setting a second insulating layer 32 on a side of the plurality of second metal pads 22 arranged at intervals away from the substrate 10, at least a portion of the second metal pads 22 are exposed from the second insulating layer 32; step S4: setting a protective layer 60 on a side of the first insulating layer 31 away from the first metal pad 21, at least a portion of the first insulating layer 31 is exposed from the protective layer 60, and / or, setting the protective layer 60 on a side of the second insulating layer 32 away from the second metal pad 22. , at least part of the second insulating layer 32 is exposed from the protective layer 60, and the material of the protective layer 60 may be an organic film such as a polyimide film; step S5: etching the first insulating layer 31 exposed from the protective layer 60 to form a micro cavity 00, and etching the second insulating layer 32 exposed from the protective layer 60 to form a micro cavity 00 (if any); step S6: coating the side surface 13 of the substrate 10, the first insulating layer 31 on the first surface 11, and the second insulating layer 32 on the second surface 12 to form a metal layer, the metal layer covers the first metal pad 21 at least partially exposed from the first insulating layer 31, and the metal layer covers the second metal pad 22 at least partially exposed from the second insulating layer 32, and the first metal pad 21 on the first surface 11 and the second metal pad 22 on the second surface 12 are electrically connected through the metal layer formed by the coating; step S7: after the coating is completed, tear off the protective layer 60 to obtain the display panel 100 provided in the embodiment of the present disclosure.

[0086] It should be noted that the material of the insulating layer 30 includes one or more of an organic material and an inorganic material. The first insulating layer 31 and the second insulating layer 32 may include only the first film layer 301, and the first film layer 301 includes one or more of an organic material and an inorganic material. The insulating layer 30 may also include a first film layer 301 and a second film layer 302, the first film layer 301 is an organic material and the second film layer 302 is an inorganic material, or the first film layer 301 is an inorganic material and the second film layer 302 is an organic material, or the first film layer 301 and the second film layer 302 are organic materials. The two film layers 302 are respectively organic materials of different compositions, or the first film layer 301 and the second film layer 302 are respectively inorganic materials of different compositions; for example, the material of the first film layer 301 is resin and the material of the second film layer 302 is silicon nitride; or, the material of the first film layer 301 is silicon nitride and the material of the second film layer 302 is resin; or, the material of the first film layer 301 is silicon oxide and the material of the second film layer 302 is silicon nitride...are not listed here one by one, it is only necessary to satisfy that when the insulating layer 30 includes multiple film layers, the material compositions of the multiple film layers are different.

[0087] Please combine Figures 1 to 13 The present disclosure provides a method for manufacturing a display panel 100. The specific method of removing the protective layer 60 in step S7 is: after patterning the metal layer to form the connection wiring 40, the protective layer 60 is removed, and a stripping liquid is used to remove the photoresist dry film; or, the protective layer 60 is removed first, and then the metal layer is laser engraved to form the connection wiring 40. For the display panel structure after the protective film is removed, please refer to Figures 1 to 10 .

[0088] Specifically, in an optional embodiment provided by the present disclosure, after the side surface 13 of the substrate 10, the first insulating layer 31 of the first surface 11, and the second insulating layer 32 of the second surface 12 are plated to form a metal layer, the metal layer can be patterned to form a connecting wire 40, and then the protective layer 60 can be torn off. The torn protective layer 60 can be torn off together with the metal layer plated above the protective layer 60, and only the connecting wire 40 extending along the side to the first metal pad 21 and the second metal pad 22 is retained, and then a stripping liquid is used to remove the photoresist dry film in the patterning process to obtain the display panel 100 provided by the embodiment of the present disclosure; another optional embodiment provided by the present disclosure In the selected embodiment, after the side 13 of the substrate 10, the first insulating layer 31 of the first surface 11, and the second insulating layer 32 of the second surface 12 are coated to form a metal layer, the protective layer 60 is first torn off, and the torn protective layer 60 is torn off together with the metal layer coated on the protective layer 60, and then the retained metal layer is laser engraved to form a connecting line 40, and the connecting line 40 connects the first metal pad 21 and the second metal pad 22 to obtain the display panel 100 provided in the embodiment of the present disclosure. In this way, a corresponding process for tearing off the protective layer 60 can be provided according to actual process requirements, providing a variety of feasible solutions for patterning the metal layer and tearing off the protective layer 60.

[0089] Please continue to refer to Figures 1 to 13 The present disclosure provides a method for manufacturing a display panel 100. In step S5, when the insulating layer 30 includes a first film layer 301 and a second film layer 302, different etching rates are used for the first film layer 301 and the second film layer 302 of the insulating layer 30 to form a micro cavity 00 that is narrow at the top and wide at the bottom; or, when the insulating layer 30 includes only one film layer, a negative photoresist process is used to etch the micro cavity 00 into a structure with a trapezoidal cross-section.

[0090] Specifically, in an optional embodiment provided by the present disclosure, when the insulating layer 30 includes a first film layer 301 and a second film layer 302, the material of the first film layer 301 and the material of the second film layer 302 include one or more of an organic material and an inorganic material, and the material of the first film layer 301 and the material of the second film layer 302 have different compositions, and there is no need to add a mask. A self-alignment process is adopted, and different etching rates are adopted for the first film layer 301 and the second film layer 302 of the insulating layer 30 to form a micro cavity 00 that is narrow at the top and wide at the bottom. The inner diameter R1 of the first sub-portion 001 of the same micro cavity 00 is smaller than the inner diameter R2 of the second sub-portion 002, and there is no misalignment in the openings of the first sub-portion 001 and the second sub-portion 002 of the micro cavity 00; in the present disclosure, In another optional embodiment provided, when the insulating layer 30 includes only the first film layer 301, the material of the first film layer 301 includes one or more of organic materials and inorganic materials. For example, when the material of the first film layer 301 is resin, a micro-cavity 00 with a trapezoidal structure can be formed in the resin film layer with the aid of a half-tone mask process, and the left hypotenuse and the right hypotenuse of the trapezoidal structure of the micro-cavity 00 are not strictly symmetrical (related to the evaporation angle); in this way, when the insulating layer 30 includes multiple film layers, the micro-cavity 00 with a narrow top and a wide bottom structure can be achieved by controlling the etching rates of different film layers. When the insulating layer 30 includes only one film layer, the micro-cavity 00 with a narrow top and a wide bottom structure can be achieved by process control, with low process risk and reduced production costs.

[0091] It should be noted that when etching the insulating layer 30 , the etching depth of the film layer close to the substrate 10 should be controlled to prevent the metal wire 41 and the metal pad 20 from being short-circuited due to etching.

[0092] In summary, the present disclosure provides a display panel and a manufacturing method, and a display device. By setting a micro cavity on the surface of the side of the insulating layer away from the metal liner, based on the upper narrow and lower wide structure of the micro cavity, the connection line is naturally disconnected on both sides of the micro cavity, thereby reducing the warping of the connection line caused by film tearing; the micro cavity does not penetrate the insulating layer, thereby reducing the risk of short circuit caused by the coating material falling to the bottom of the micro cavity and connecting with the metal liner, thereby improving the safety of the display panel; the size of the first micro cavity is designed to be smaller than the size of the second micro cavity, so that the first metal liner can be perpendicular to the plane where the substrate is located. The corresponding connecting wires are disconnected more thoroughly, and the probability of warping of the connecting wires caused by film tearing is smaller; the first micro cavity is connected to the second micro cavity, so that the first micro cavity and the second micro cavity form a natural transition, and the connecting wires on both sides of the micro cavity are neatly disconnected, which is convenient for the film tearing process to proceed smoothly; the etching rate of the first film layer material is lower than the etching rate of the second film layer material, so that the micro cavity naturally forms a narrow upper and wide lower structure in the direction perpendicular to the plane where the substrate is located, which is conducive to the natural disconnection of the connecting wires on both sides of the micro cavity during film coating; when the insulating layer includes multiple film layers, by setting the micro cavity to For the sub-parts that are interconnected but located in different film layers, when etching the insulating layer, the micro-cavity can naturally form a narrow-upper-wide-lower structure due to the material properties of the film layers and the difference in etching rates; when the insulating layer only includes the first film layer, the micro-cavity is set to a trapezoidal narrow-upper-wide-lower structure, so that when the coating forms the connecting wiring, the connecting wiring on both sides of the micro-cavity is naturally disconnected, and does not form adhesion with the coating material that falls to the bottom of the micro-cavity, thereby reducing the subsequent process defects caused by the back-adhesion of metal debris during the film tearing process; the maximum width of the metal wire is smaller than the maximum width of the micro-cavity, and it will not be carried up during the subsequent film tearing, which is beneficial to Metal wires are deposited inside the micro-cavity; by connecting the metal wires in multiple interconnected micro-cavities with the anti-static circuit of the display panel, the anti-static effect of the display panel can be improved; according to actual process requirements, a corresponding protective layer tearing process is provided to provide a variety of feasible solutions for patterning of the metal layer and tearing of the protective layer; when the insulating layer includes multiple film layers, the narrow-upper-wide-lower structure of the micro-cavity is achieved by controlling the etching rates of different film layers; when the insulating layer includes only one film layer, the narrow-upper-wide-lower structure of the micro-cavity is achieved through process control, with low process risk and reduced production costs.

[0093] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0094] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that: include: A substrate, comprising a first surface and a second surface arranged opposite to each other, and a side surface, wherein the first surface and the second surface are both provided with a metal pad; The metal pad comprises a first metal pad and a second metal pad, the first metal pad is located on the first surface, and the second metal pad is located on the second surface; a first insulating layer, wherein the first insulating layer is at least partially disposed on a side of the first metal pad away from the first surface, at least a portion of the first metal pad is exposed from the first insulating layer, and the first insulating layer comprises a micro cavity, wherein the micro cavity is located on a surface of the first insulating layer away from the first metal pad; and / or, a second insulating layer, wherein the second insulating layer is at least partially disposed on a side of the second metal pad away from the second surface, at least a portion of the second metal pad is exposed from the second insulating layer, and the second insulating layer comprises a micro cavity, and the micro cavity is located on a surface of the second insulating layer away from the second metal pad; a connecting line, at least partially located on the side surface and connecting the first metal pad and the second metal pad; The connecting wires on both sides of the micro cavity are at least partially disconnected.

2. The display panel according to claim 1, characterized in that: In a direction from the substrate to the insulating layer, the micro cavity is a structure that is narrow at the top and wide at the bottom.

3. The display panel according to claim 1, characterized in that: The micro cavity does not penetrate the insulating layer.

4. The display panel according to claim 1, characterized in that: The first surface is provided with a plurality of first metal pads, and the plurality of first metal pads are arranged at intervals; The first insulating layer includes a first micro cavity and a second micro cavity. Along a direction perpendicular to a plane where the substrate is located, the first micro cavity at least partially overlaps with a projection of the first metal pad on the substrate, and the second micro cavity does not overlap with a projection of the first metal pad on the substrate.

5. The display panel according to claim 4, characterized in that: The size of the first micro cavity is smaller than that of the second micro cavity.

6. The display panel according to claim 4, characterized in that: The first micro cavity is communicated with the second micro cavity.

7. The display panel according to claim 1, characterized in that: The insulating layer includes a first film layer and a second film layer, the first film layer is located on a side of the second film layer away from the metal pad, and an etching rate of the first film layer material is lower than an etching rate of the second film layer material.

8. The display panel according to claim 7, characterized in that: The micro cavity includes a first sub-portion and a second sub-portion, the first sub-portion is located in the first film layer, the second sub-portion is located in the second film layer, the first sub-portion is connected with the second sub-portion, and the inner diameter of the first sub-portion is smaller than the inner diameter of the second sub-portion.

9. The display panel according to claim 1, characterized in that: The cross section of the micro cavity in a direction perpendicular to the plane where the substrate is located is a trapezoid.

10. The display panel according to claim 1, characterized in that: There is a metal wire in the micro cavity, and the maximum width of the metal wire is smaller than the maximum width of the micro cavity; The metal wires and the connecting wirings are formed in the same process.

11. The display panel according to claim 10, characterized in that: The display panel includes an anti-static circuit, and the metal wire is connected to the anti-static circuit.

12. The display panel according to claim 1, characterized in that: The depth of the micro cavity is greater than the thickness of the connecting wire; The minimum inner diameter of the micro cavity is greater than or equal to 1.2 times the thickness of the connecting wiring.

13. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-12.

14. A method for manufacturing a display panel, characterized in that: For manufacturing a display panel according to any one of claims 1 to 12, the method comprises: providing a substrate; forming metal pads on the first and second sides of the substrate; An insulating layer is disposed on a side of the metal pad facing away from the substrate, and at least a portion of the metal pad is exposed from the insulating layer; A protective layer is provided on a side of the insulating layer away from the metal pad, wherein at least a portion of the insulating layer is exposed from the protective layer; Etching the insulating layer exposed from the protective layer to form a micro cavity; Plating a metal layer on the side surface, the first surface and the second surface of the substrate, wherein the metal layer covers the metal pad exposed from the insulating layer, so that the metal pads on the first surface and the second surface are electrically connected; Tear off the protective layer.

15. The method for manufacturing a display panel according to claim 14, characterized in that: The tearing off of the protective layer specifically includes: After the metal layer is patterned to form the connection wiring, the protective layer is torn off, and the photoresist dry film is removed by using a stripping solution; or, the protective layer is torn off first, and then the metal layer is laser engraved to form the connection wiring.

16. The method for manufacturing a display panel according to claim 14, characterized in that: When the insulating layer includes a first film layer and a second film layer, different etching rates are used for the first film layer and the second film layer of the insulating layer to form a micro cavity that is narrow at the top and wide at the bottom; Alternatively, when the insulating layer includes only one film layer, a negative photoresist process is used to etch the micro cavity into a structure with a trapezoidal cross section.

Images