Flexible circuit board, display device, electronic equipment and maintenance method thereof

Abstract

The invention relates to a flexible circuit board, a display device, electronic equipment and a maintenance method thereof. The flexible circuit board includes: a base material; the electronic component is arranged on one surface of the base material, and the electronic component comprises a plurality of pins; a plurality of bonding pad portions disposed on a surface of the substrate; one end of the signal line is connected to the welding pad part, and the other end of the signal line is connected to the pin; wherein the welding pad part comprises a first sub-welding pad, a connecting section and a second sub-welding pad, and the signal line, the second sub-welding pad, the connecting section and the first sub-welding pad are connected in sequence; in the extending direction perpendicular to the welding pad part, the width of the connecting section is smaller than the width of the first welding sub-pad and the width of the second welding sub-pad. The problem that the maintenance of the flexible circuit board on the electronic equipment is easy to cause damage to the electronic equipment can be solved.

Description

Technical Field

[0001] The present application relates to the field of fingerprint recognition technology, and in particular to a flexible circuit board and a display device, an electronic device and a maintenance method thereof. Background Art

[0002] Flexible printed circuit board (FPC) is widely used in various electronic products due to its excellent characteristics such as high wiring density, light weight, thin thickness, good bendability, etc. Electronic components such as IC chips are usually soldered on flexible circuit boards. Flexible circuit boards include multiple solder pads, and the solder pads of the flexible circuit board are electrically connected to the pad terminals on the electronic equipment.

[0003] However, in the related art, repairing the flexible circuit board on the electronic device easily causes damage to the electronic device. Summary of the invention

[0004] Based on this, it is necessary to provide a flexible circuit board and display device, electronic device and a maintenance method thereof to address the problem that the maintenance of the flexible circuit board on the sub-device easily causes damage to the electronic device.

[0005] According to a first aspect of the present application, a flexible circuit board is provided, comprising:

[0006] Base material;

[0007] An electronic component is disposed on a surface of the substrate, and the electronic component includes a plurality of pins;

[0008] A plurality of pads are disposed on a surface of the substrate;

[0009] A signal line, one end of which is connected to the pad portion, and the other end of which is connected to the pin;

[0010] The pad portion includes a first sub-pad, a connecting section, and a second sub-pad, and the signal line, the second sub-pad, the connecting section, and the first sub-pad are connected in sequence;

[0011] In an extension direction perpendicular to the pad portion, a width of the connecting section is smaller than a width of the first sub-pad and a width of the second sub-pad.

[0012] In some embodiments, in the extension direction of the pad portion, a ratio of the length of the second sub-pad to the length of the connecting section is greater than or equal to 3.

[0013] In some embodiments, in the extension direction of the pad portion, the length of the first sub-pad is greater than or equal to 10 mm, and the length of the second sub-pad is greater than or equal to 2 mm.

[0014] In some embodiments, in an extension direction perpendicular to the pad portion and the signal line, a ratio of a width of the first sub-pad to a width of the connecting segment is greater than or equal to 3, and a ratio of a width of the second sub-pad to a width of the connecting segment is greater than or equal to 3.

[0015] In some embodiments, the substrate includes a first substrate and a second substrate, the first substrate and the second substrate are non-integrated structures, the first sub-pad is disposed on the first substrate, and the second sub-pad and the signal line are disposed on the second substrate.

[0016] In some embodiments, the material of the connecting section is different from the material of the first sub-pad and the material of the second sub-pad;

[0017] One end of the connecting section overlaps with a surface of the first sub-pad facing away from the first substrate, and the other end of the connecting section overlaps with a surface of the second sub-pad facing away from the second substrate.

[0018] In some embodiments, the material of the connecting section includes solder.

[0019] According to a second aspect of the present application, a display device is provided, comprising any one of the above-mentioned flexible circuit boards.

[0020] According to a third aspect of the present application, an electronic device is provided, comprising any one of the above-described flexible circuit boards.

[0021] According to a fourth aspect of the present application, a method for repairing an electronic device is provided, comprising:

[0022] An electronic device is provided, the electronic device comprising a device body and a flexible circuit board, the electronic device comprising a pad terminal; the flexible circuit board comprising a substrate, an electronic component, a plurality of pad portions and a signal line; the electronic component is arranged on a surface of the substrate, the electronic component comprises a plurality of pins; a plurality of pad portions are arranged on a surface of the substrate; one end of the signal line is connected to the pad portion, and the other end of the signal line is connected to the pin; wherein the pad portion comprises a first sub-pad, a connecting section and a second sub-pad, the signal line, the second sub-pad, the connecting section and the first sub-pad are connected in sequence; in a direction perpendicular to the extension of the pad portion, the width of the connecting section is smaller than the width of the first sub-pad and the width of the second sub-pad; the first sub-pad is electrically connected to the pad terminal;

[0023] Cutting the flexible circuit board at the plurality of connection sections of the plurality of pad portions, removing the portion of the flexible circuit board including the second sub-pad, and leaving the portion of the flexible circuit board including the first sub-pad on the device body;

[0024] Providing a repair flexible circuit board, the repair flexible circuit board comprising a plurality of solder pads;

[0025] The soldering pad of the repair flexible circuit board is electrically connected to the first sub-soldering pad retained on the device body.

[0026] In some embodiments of the present application, the pad portion includes a first sub-pad, a connecting section, and a second sub-pad. When a flexible circuit board on a display device or an electronic device is damaged, the flexible circuit board is cut off at multiple connecting sections of multiple pad portions, and the portion including the second sub-pad in the flexible circuit board is removed, and the portion including the first sub-pad in the flexible circuit board is retained on the device body. Another intact flexible circuit board (named as a repair flexible circuit board, and the repair flexible circuit board may include all structures in the flexible circuit board of the present application) is provided, and the repair flexible circuit board is cut off at multiple connecting sections of multiple pad portions of the repair flexible circuit board, and the portion including the first sub-pad in the repair flexible circuit board is removed. The second sub-pad included in the repair flexible circuit board is electrically connected to the first sub-pad retained on the device body by soldering or the like, thereby realizing the repair of the flexible circuit board of the display device and the electronic device. At the same time, there is no need to remove the protective layer, separate the pad of the flexible circuit board from the pad terminal of the electronic device, and tear off the damaged flexible circuit board, so that the display panel or the electronic device will not be damaged, thereby improving the repair yield and reducing the repair cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A first schematic diagram of a display device provided for some embodiments of the present application.

[0029] Figure 2 A first partial schematic diagram of a flexible circuit board provided in some embodiments of the present application.

[0030] Figure 3 An enlarged schematic diagram of a solder pad portion on a flexible circuit board provided in some embodiments of the present application.

[0031] Figure 4 A second schematic diagram of a display device provided in some embodiments of the present application.

[0032] Figure 5 A second partial schematic diagram of a flexible circuit board provided in some embodiments of the present application.

[0033] Figure 6 A schematic diagram of the process steps of a method for repairing an electronic device provided in some embodiments of the present application.

[0034] Figure 7 A schematic diagram of a damaged flexible circuit board in a method for repairing an electronic device provided in some embodiments of the present application.

[0035] Figure 8 A schematic diagram of a first intermediate process of a method for repairing an electronic device provided in some embodiments of the present application.

[0036] Fig. 9 Another schematic diagram of the first intermediate process of a method for repairing an electronic device provided in some embodiments of the present application. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0038] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0039] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0040] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0041] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0043] In the related art, the repair of flexible circuit boards on electronic devices can easily cause damage to the electronic devices. When electronic components or signal lines on a flexible circuit board are damaged, such as damage caused by electrostatic discharge (ESD), when replacing the flexible circuit board, the pad terminals of the electronic device and the protective layer (such as a protective adhesive layer, such as a protective film layer) on the flexible circuit board must first be torn off, and then the solder pads of the flexible circuit board are separated from the solder pad terminals of the electronic device (the damaged flexible circuit board is torn off). The inventors have found that when removing the protective layer, or separating the solder pads of the flexible circuit board from the solder pad terminals of the electronic device, or tearing off the damaged flexible circuit board, the electronic device will be damaged. For example, after the damaged flexible circuit board on the display device is removed, the display panel is also damaged (for example, the solder pad terminals of the display panel are damaged). In severe cases, the display panel or the electronic device can no longer be used.

[0044] Based on the above problems, the present application provides a flexible circuit board and a display device, an electronic device and a maintenance method thereof.

[0045] Figure 1 A first schematic diagram of a display device provided for some embodiments of the present application. Figure 2 A first partial schematic diagram of a flexible circuit board provided in some embodiments of the present application. Figure 3 An enlarged schematic diagram of a solder pad portion on a flexible circuit board provided in some embodiments of the present application.

[0046] Figure 4 A second schematic diagram of a display device provided in some embodiments of the present application. Figure 5 A second partial schematic diagram of a flexible circuit board provided in some embodiments of the present application.

[0047] First, see Figures 1 to 5 The present application provides a flexible circuit board 10, which includes a substrate 11, an electronic component 12, a plurality of pads 15 and a signal line 13. The electronic component 12 is disposed on a surface of the substrate 11, and the electronic component 12 includes a plurality of pins; the plurality of pads 15 are disposed on a surface of the substrate 11; one end of the signal line 13 is connected to the pad 15, and the other end of the signal line 13 is connected to the pin; wherein the pad 15 includes a first sub-pad 151, a connecting section 152 and a second sub-pad 153, and the signal line 13, the second sub-pad 153, the connecting section 152 and the first sub-pad 151 are connected in sequence; in a direction perpendicular to the extension of the pad 15, the width of the connecting section 152 is smaller than the width of the first sub-pad 151 and the width of the second sub-pad 153.

[0048] For example, the substrate 11 may be a flexible film material, and the material of the substrate 11 may include polyimide (PI), epoxy resin or polyester (PET). The electronic component 12 may be an IC chip, and the IC chip may be fixed on the substrate 11 by a chip-on-film process to minimize the border width of the display device.

[0049] For example, the signal line 13 is specifically a copper line or an aluminum line. In some embodiments, the formation process of the signal line 13 is as follows: a copper film is formed on the surface of the substrate 11 by vacuum sputtering; a layer of positive photoresist is coated on the copper film to form a dry film; a photomask with a specific pattern is used for exposure, and part of the positive photoresist undergoes a chain breaking reaction after ultraviolet exposure and becomes a soluble substance; a developer is used to remove the soluble part of the dry film; a copper etching solution is used to etch the copper film, and the part of the copper film not covered by the dry film is etched away; the remaining dry film is removed, and the signal lines 13 arranged at intervals on the substrate 11 are obtained.

[0050] For example, Figure 1 and Figure 2 In the illustrated embodiment, the pad portion 15 is connected to the end of the signal line 13. The pad portion 15 and the signal line 13 may be made of the same material and obtained through the same process. Anisotropic conductive film (ACF) is coated on the pad portion 15 and the pad terminal on the display panel (device body of the electronic device) is bonded together through a hot pressing bonding process. For example, the first sub-pad 151 is bonded together with the pad terminal on the display panel through the anisotropic conductive film.

[0051] For example, in some embodiments, Figure 1 and Figure 2 For example, the connecting section 152 and the second sub-pad 153 and the first sub-pad 151 may be made of the same material. In this case, the substrate 11 may be an integral structure, and the substrate 11 may be an integrally formed structure.

[0052] For example, in some embodiments, Figure 4 and Figure 5 For example, the materials of the connecting section 152 , the second sub-pad 153 , and the first sub-pad 151 may be different (described in detail later).

[0053] For example, the plurality of pads 15 and the electronic components 12 may be disposed on the same surface of the substrate 11 , or may be disposed on different surfaces of the substrate 11 , which is not limited herein.

[0054] For example, the pad portion 15 includes a first sub-pad 151 , a connecting section 152 and a second sub-pad 153 , and the signal line 13 , the second sub-pad 153 , the connecting section 152 and the first sub-pad 151 are connected in sequence.

[0055] For example, the first sub-soldering pad 151 is used to electrically connect (bind) to the pad terminal 101 on the electronic device, and the connecting section 152 is used to connect the first sub-soldering pad 151 and the second sub-soldering pad 153. When the flexible circuit board 10 is damaged, the multiple connecting sections 152 of the multiple solder pad parts 15 are cutting parts. For example, the line where the multiple connecting sections 152 of the multiple solder pad parts 15 are located is the cutting line, so as to remove the part including the second sub-soldering pad 153 on the flexible circuit board 10.

[0056] For example, in some other embodiments, for example, before the flexible circuit board 10 is bound to the display panel, when the first sub-pad 151 is damaged, the flexible circuit board 10 is cut off at the multiple connecting sections 152 of the multiple pad portions 15, and the portion of the flexible circuit board 10 including the first sub-pad 151 is removed. At this time, the second sub-pad 153 can act as the first sub-pad 151, and the second sub-pad 153 can be electrically connected (bound) to the pad terminal on the electronic device.

[0057] For example, in the extension direction perpendicular to the pad portion 15, the width of the connecting section 152 is smaller than the width of the first sub-pad 151 and the width of the second sub-pad 153, that is, the width of the connecting section 152 is smaller, which is conducive to cutting and can avoid damaging the substrate 11 or other parts of the pad portion 15 during cutting.

[0058] For example, in the extension direction perpendicular to the pad portion 15, the width of the first sub-pad 151 and the second sub-pad 153 is relatively large, which can facilitate binding or soldering connection of the first sub-pad 151 and the second sub-pad 153 on different flexible circuit boards during maintenance.

[0059] In some embodiments of the present application, by configuring the pad portion 15 to include a first sub-pad 151, a connecting section 152, and a second sub-pad 153, when a flexible circuit board 10 on a display device 100 or an electronic device is damaged, the flexible circuit board 10 is cut off at multiple connecting sections 152 of multiple pad portions 15, and the portion of the flexible circuit board 10 including the second sub-pad 153 is removed, while the portion of the flexible circuit board 10 including the first sub-pad 151 remains on the device body. Another intact flexible circuit board 10 (named as a repair flexible circuit board, and the repair flexible circuit board may include all the structures in the flexible circuit board 10 of the present application) is provided, the repair flexible circuit board is cut off at the multiple connecting sections 152 of the multiple pad parts 15 of the repair flexible circuit board, the part including the first sub-pad 151 in the repair flexible circuit board is removed, and the second sub-pad 153 included in the repair flexible circuit board is electrically connected to the first sub-pad 151 retained on the device body by soldering or the like, thereby realizing the repair of the flexible circuit board of the display device 100 and the electronic device. At the same time, there is no need to remove the protective layer, separate the pads of the flexible circuit board from the pad terminals of the electronic device, and tear off the damaged flexible circuit board, so as not to cause damage to the display panel or the electronic device, thereby improving the repair yield and reducing the repair cost.

[0060] In some embodiments, Figure 3 As shown, in the extension direction of the pad portion 15 , the ratio of the length of the second sub-pad 153 to the length of the connecting section 152 is greater than or equal to 3.

[0061] For example, in the extension direction of the pad portion 15, the length of the second sub-pad 153 is the third length L3, the length of the connecting section 152 is the second length L2, and the ratio of the third length L3 to the second length L2 is greater than or equal to 3. Increasing the length of the second sub-pad 153 can increase the contact area between the second sub-pad 153 and the solder during maintenance, and reducing the length of the connecting section 152 can reduce the resistance of the pad portion 15 on the electrical signal transmission path.

[0062] Illustratively, the length of the connecting section 152 is greater than or equal to 0.3 mm.

[0063] In some embodiments, Figure 3 As shown, in the extension direction of the pad portion 15 , the length of the first sub-pad 151 is greater than or equal to 10 mm, and the length of the second sub-pad 153 is greater than or equal to 2 mm.

[0064] For example, the length of the first sub-pad 151 is greater than or equal to 10 mm, the length of the first sub-pad 151 is a first length L1, and the first length L1 can be any value of 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, and 15 mm.

[0065] For example, the length of the second sub-soldering pad 153 is greater than or equal to 2 mm, the length of the second sub-soldering pad 153 is the third length L3, the third length L3 is greater than or equal to 2 mm, and the second length L2 can be any value among 2 mm, 3 mm, 4 mm, 5 mm, 6 mm and 8 mm.

[0066] In some embodiments, Figure 3 As shown, in the extending direction perpendicular to the pad portion 15 and the signal line 13 , the ratios of the width of the first sub-pad 151 and the width of the second sub-pad 153 to the width of the connecting section 152 are both greater than or equal to 3.

[0067] For example, in the extending direction perpendicular to the pad portion 15 and the signal line 13 , the width of the first sub-pad 151 is the first width d1 , the width of the second sub-pad 153 is the third width d3 , and the width of the connecting section 152 is the second width d2 .

[0068] For example, the ratio of the first width d1 and the third width d3 to the second width d2 is greater than or equal to 3, so that the first width d1 and the third width d3 are larger, so as to facilitate binding and solder coating. The second width d2 is smaller, which is convenient for cutting during maintenance and can avoid damaging other parts of the substrate 11 or the pad portion 15 during cutting.

[0069] It should be noted that, in some embodiments, the ratio of the width of the first sub-pad 151 and the width of the second sub-pad 153 to the width of the signal line 13 is greater than or equal to 3. For example, the width of the signal line 13 is greater than or equal to 0.35 mm.

[0070] In some embodiments, Figure 4 and Figure 5 As shown, the substrate 11 includes a first substrate 111 and a second substrate 112 . The first substrate 111 and the second substrate 112 are non-integrated structures. The first sub-pad 151 is disposed on the first substrate 111 , and the second sub-pad 153 and the signal line 13 are disposed on the second substrate 112 .

[0071] For example, Figure 4 A display device 100 or an electronic device after repair is illustrated. Figure 5 Illustration of a flexible circuit board after repair.

[0072] For example, in the repair process of the flexible circuit board 10, or the display device 100, or the electronic device, the following specifically includes: 1) a flexible circuit board 10 is bound to the device body of the electronic device, the flexible circuit board 10 is cut at the multiple connection sections 152 of the multiple pads 15 of the flexible circuit board 10, and the part including the second sub-pad 153 in the flexible circuit board 10 is removed, and the part including the first sub-pad 151 in the flexible circuit board 10 is retained on the device body; 2) the pad of the repaired flexible circuit board is electrically connected to the first sub-pad 151 retained on the device body. Through this repair method, the first substrate 111 and the second substrate 112 are formed, and the first substrate 111 and the second substrate 112 are non-integrated structures, and the first sub-pad 151 is arranged on the first substrate 111, and the second sub-pad 153 and the signal line 13 are arranged on the second substrate 112.

[0073] For example, in some embodiments, Figure 5 As shown, the edge of the first substrate 111 and the edge of the second substrate 112 are spaced apart.

[0074] For example, in some other embodiments, the edge of the first substrate 111 and the edge of the second substrate 112 may be disposed in contact with each other.

[0075] For example, in some other embodiments, the edge portion of the first substrate 111 and the edge portion of the second substrate 112 may be stacked or overlapped.

[0076] By way of example, the first substrate 111 is a portion of the substrate 11 on the flexible circuit board 10 to be repaired, and the second substrate 112 is a portion of the substrate on the flexible circuit board to be repaired.

[0077] For example, in some embodiments, the repair flexible circuit board has the same structure as the flexible circuit board 10 combined with any one or several of the above-mentioned features, that is, during the repair process of the flexible circuit board 10, the display device 100, or the electronic device, another flexible circuit board 10 can be used as a repair circuit board, and the multiple connecting sections 152 of the multiple pad portions 15 of the repair circuit board are cut off, and the portion of the repair circuit board including the first sub-pad 151 is removed, and the portion of the repair circuit board including the second sub-pad 153 and the electronic component 12 is retained, and the second sub-pad 153 in the repair circuit board is electrically connected to the first sub-pad 151 retained on the device body. At this time, in the repaired flexible circuit board, the display device, or the electronic device, the first substrate 111 in the flexible circuit board in the display device or the electronic device is derived from the flexible circuit board 10 before repair, and the second substrate 112 is derived from the repair circuit board.

[0078] For example, in some other embodiments, the structure of the flexible circuit board that repairs the flexible circuit board combined with any one or several of the above-mentioned features may be different. For example, the flexible circuit board that repairs the flexible circuit board does not include the second sub-pad 153 and the connecting section 152. For example, a pad portion of the flexible circuit board that repairs the flexible circuit board includes only one pad. In this case, there is no need to cut the flexible circuit board that repairs the flexible circuit board, and the pad on the repair circuit board can be electrically connected to the first sub-pad 151 retained on the device body.

[0079] It should be noted that Figure 1 The display device 100 or the electronic device before repair is shown as an example. Figure 2 The flexible circuit board before repair is shown. Before repair, the plurality of connecting sections 152 have not been cut, the substrate 11 is an integral structure, or the first substrate 111 and the second substrate 112 are connected as an integral structure (eg, an integral structure, for example, the first substrate 111 is connected to the second substrate 112).

[0080] In some embodiments, Figure 4 and Figure 5 As shown, the material of the connecting section 152 is different from the material of the first sub-pad 151 and the material of the second sub-pad 153; one end of the connecting section 152 overlaps with the side surface of the first sub-pad 151 facing away from the first substrate 111, and the other end of the connecting section 152 overlaps with the side surface of the second sub-pad 153 facing away from the second substrate 112.

[0081] For example, during the repair process of a flexible circuit board, a display device, or an electronic device, when electrically connecting the pad of the repaired flexible circuit board to the first sub-pad 151 retained on the device body, a material different from the first sub-pad 151 can be used, for example, the material of the connecting section 152 can include solder.

[0082] For example, when solder is used as the connecting section 152 , one end of the solder covers the first sub-pad 151 , and the other end of the solder covers the second sub-pad 153 .

[0083] It should be noted that when solder is used as the connecting section 152, one end of the solder covers the surface of the first sub-pad 151 close to the second sub-pad 153, and the surface of the first sub-pad 151 away from the second sub-pad 153 needs to be bound to the display device or the device body. Figures 1 to 5 In the example, in the extension direction of the pad portion 15, the length of the first sub-pad 151 is greater than the length of the second sub-pad, that is, the first length L1 is greater than the third length L3, for example, the ratio of the length of the first sub-pad 151 to the length of the second sub-pad is greater than or equal to 2.

[0084] In some embodiments, Figure 4 and Figure 5As shown, the material of the connecting section 152 includes solder.

[0085] The present application also provides a display device, such as Figure 1 and Figure 4 As shown, the display device 100 includes any one of the above-mentioned flexible circuit boards 10, or the display device 100 includes a flexible circuit board 10 having any combination of the above-mentioned features.

[0086] For example, Figure 1 and Figure 4 As shown, the display device 100 includes a display panel 20 and a flexible circuit board 10 , the display panel 20 includes a pad terminal 101 , and the pad terminal 101 is bound to the first sub-pad 151 .

[0087] For example, in some embodiments, the display device 100 includes a display panel 20, a flexible circuit board 10, and a driving circuit substrate, one end of the flexible circuit board 10 is connected to the display panel 20, and the other end is connected to the driving circuit substrate. The display panel 20 includes a plurality of pixels that can display an image, and the display panel 20 can be an organic light-emitting display panel, a liquid crystal display panel, a plasma display panel, a field effect display panel, etc. Through the driving signal and power input by the flexible circuit board 10, the pixels on the display panel 20 can display an image. The flexible circuit board 10 can be specifically a chip on flex (Chip On Flex or Chip On Film, referred to as COF) with an IC (Integrated Circuit) chip, and the IC chip can receive a control signal and generate a scan signal or a data signal, and then transmit the scan signal or the data signal to the display panel 20. The driving circuit substrate is generally a rigid circuit board, which includes a driving circuit for driving the display panel 20. The display panel 20, the flexible circuit board 10, and the driving circuit substrate can be sequentially combined in the display device 100, and the flexible circuit board 10 can be bent so that the display panel 20 and the driving circuit substrate are opposite to each other. That is, when the flexible circuit board 10 is bent, the driving circuit substrate may be located on the back side of the display panel 20 .

[0088] The present application also provides an electronic device, such as Figure 1 and Figure 4 As shown, the electronic device includes the flexible circuit board 10 of any one of the above items, or the electronic device includes the flexible circuit board 10 combining any several of the above features.

[0089] Illustratively, the electronic device includes any one of the display devices 100 described above.

[0090] For example, Figure 1 and Figure 4 The electronic device is exemplified as a display device, but is not limited thereto. The electronic device may be a mobile phone, a tablet, a computer, a television, a wearable device, and the like.

[0091] See also Figures 6 to 9 , and combined Figure 4 and Figure 5 , Figure 6 A schematic diagram of the process steps of a method for repairing an electronic device provided in some embodiments of the present application. Figure 7 A schematic diagram of a damaged flexible circuit board in a method for repairing an electronic device provided in some embodiments of the present application. Figure 8 A schematic diagram of a first intermediate process of a method for repairing an electronic device provided in some embodiments of the present application. Fig. 9 Another schematic diagram of the first intermediate process of a method for repairing an electronic device provided in some embodiments of the present application. Figure 4 and Figure 5 A schematic diagram of a second intermediate process of a method for repairing an electronic device provided in some embodiments of the present application.

[0092] The present application also provides a method for repairing an electronic device, which can be used to repair any of the above-mentioned flexible circuit boards 10, display devices, or electronic devices. The method for repairing an electronic device includes: step S100, step S200, step S300, and step S400.

[0093] Step S100, providing an electronic device, the electronic device comprising a device body and a flexible circuit board 10, the electronic device comprising a pad terminal 101; the flexible circuit board 10 comprising a substrate 11, an electronic component 12, a plurality of pad portions 15 and a signal line 13; the electronic component 12 is arranged on a surface of the substrate 11, and the electronic component 12 comprises a plurality of pins; the plurality of pad portions 15 are arranged on a surface of the substrate 11; one end of the signal line 13 is connected to the pad portion 15, and the other end of the signal line 13 is connected to the pin; wherein the pad portion 15 comprises a first sub-pad 151, a connecting section 152 and a second sub-pad 153, and the signal line 13, the second sub-pad 153, the connecting section 152 and the first sub-pad 151 are connected in sequence; in a direction perpendicular to the extension of the pad portion 15, the width of the connecting section 152 is smaller than the width of the first sub-pad 151 and the width of the second sub-pad 153; the first sub-pad 151 is electrically connected to the pad terminal 101.

[0094] For example, an electronic device may be provided. Figure 1 The display device 100 shown includes a device body (display panel 20) and a flexible circuit board 10. The device body (display panel 20) includes a pad terminal 101. The first sub-pad 151 is electrically connected to the pad terminal 101. The pad terminal 101 and the first sub-pad 151 can be connected by anisotropic conductive film (ACF).

[0095] For example, Figure 7 As shown by the dotted circle CC1, the flexible circuit board 10 on the electronic device is damaged, for example, the signal line 13 is broken or the electronic component 12 is damaged by static electricity, and the electronic device needs to be repaired.

[0096] Step S200 , cutting the flexible circuit board 10 at the multiple connecting sections 152 of the multiple pad portions 15 , removing the portion of the flexible circuit board 10 including the second sub-pad 153 , and retaining the portion of the flexible circuit board 10 including the first sub-pad 151 on the device body.

[0097] For example, Figure 8 As shown, the flexible circuit board 10 is cut at the multiple connecting sections 152 of the multiple pad portions 15, as shown in FIG. Fig. 9 As shown, the portion of the flexible circuit board 10 including the second sub-pad 153 is removed, and the portion of the flexible circuit board 10 including the first sub-pad 151 remains on the device body.

[0098] Step S300, providing a repair flexible circuit board, wherein the repair flexible circuit board includes a plurality of solder pads.

[0099] Step S400, as Figure 4 and Figure 5 As shown, the pad for repairing the flexible circuit board is electrically connected to the first sub-pad 151 retained on the device body.

[0100] For example, in step S300, the repaired flexible circuit board has the same structure as the flexible circuit board combined with any one or any combination of the above-mentioned features, that is, in the repair process of the flexible circuit board, the display device, or the electronic device, another flexible circuit board 10 can be used as the repair circuit board, and the multiple connecting sections 152 of the multiple pad portions 15 of the repair circuit board are cut off, and the portion of the repair circuit board including the first sub-pad 151 is removed, and the portion of the repair circuit board including the second sub-pad 153 and the electronic component 12 is retained, and the second sub-pad 153 in the repair circuit board is electrically connected to the first sub-pad 151 retained on the device body (for example, soldering). At this time, in the repaired flexible circuit board, the display device, or the electronic device, the first substrate 111 in the flexible circuit board in the display device or the electronic device is derived from the flexible circuit board 10 before repair, and the second substrate 112 is derived from the repair circuit board.

[0101] For example, in step S300, in some other embodiments, the structure of the flexible circuit board for repairing the flexible circuit board combined with any one or any several of the above-mentioned features may be different. For example, the flexible circuit board for repairing does not include the second sub-pad 153 and the connecting section 152. For example, a pad portion of the flexible circuit board for repairing only includes one pad. At this time, there is no need to cut the flexible circuit board for repairing, and the pad on the repair circuit board can be electrically connected to the first sub-pad 151 retained on the device body.

[0102] For example, in step S300, in some other embodiments, the flexible circuit board 10, the display device 100, or the electronic device is a repaired flexible circuit board 10, the display device 100, or the electronic device, for example, Figure 4 and Figure 5 For example, the flexible circuit board 10 , the display device 100 , or the electronic device is further repaired.

[0103] It should be noted that, in some embodiments, Figure 1 and Figure 2 The flexible circuit board 10, the display device 100, or the electronic device before repair is illustrated; Figure 4 and Figure 5 The repaired flexible circuit board 10 , the display device 100 , or the electronic device is illustrated.

[0104] It should be noted that, in some embodiments, Figure 1 and Figure 2 The flexible circuit board 10, or the display device 100, or the electronic device provided in some embodiments of the present application can be easily repaired, and during the repair process, there is no need to remove the protective layer, separate the solder pads of the flexible circuit board from the solder pad terminals of the electronic device, or tear off the damaged flexible circuit board, which will not cause damage to the display panel or the electronic device, thereby improving the repair yield and reducing the repair cost.

[0105] It should be noted that, in some embodiments, Figure 4 and Figure 5 The flexible circuit board 10, or the display device 100, or the electronic device provided in some embodiments of the present application is a flexible circuit board 10, or the display device 100, or the electronic device that has been repaired simply and is not likely to damage the display device or the electronic device.

[0106] It should be noted that, in some embodiments, Figure 4 and Figure 5The flexible circuit board 10, or the display device 100, or the electronic device provided in some embodiments of the present application can also continue to carry out the electronic device repair method of the present application, and can be repaired very simply. During the repair process, there is no need to remove the protective layer, separate the solder pads of the flexible circuit board from the solder pad terminals of the electronic device, or tear off the damaged flexible circuit board, which will not cause damage to the display panel or the electronic device, thereby improving the repair yield and reducing the repair cost.

[0107] It should be noted that the pad portion 15 , the first sub-pad 151 , the second sub-pad 153 , the pins, the pad terminal 101 and the pads are all PIN pins or pins that can be connected by solder or bonded with anisotropic conductive adhesive.

[0108] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0109] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A flexible circuit board, characterized in that: include: Base material; An electronic component is disposed on a surface of the substrate, and the electronic component includes a plurality of pins; A plurality of pads are disposed on a surface of the substrate; A signal line, one end of which is connected to the pad portion, and the other end of which is connected to the pin; The pad portion includes a first sub-pad, a connecting section, and a second sub-pad, and the signal line, the second sub-pad, the connecting section, and the first sub-pad are connected in sequence; In an extension direction perpendicular to the pad portion, a width of the connecting section is smaller than a width of the first sub-pad and a width of the second sub-pad.

2. The flexible circuit board according to claim 1, characterized in that: In the extension direction of the pad portion, a ratio of the length of the second sub-pad to the length of the connecting section is greater than or equal to 3.

3. The flexible circuit board according to claim 1, characterized in that: In the extending direction of the pad portion, the length of the first sub-pad is greater than or equal to 10 mm, and the length of the second sub-pad is greater than or equal to 2 mm.

4. The flexible circuit board according to claim 1, characterized in that: In an extension direction perpendicular to the pad portion and the signal line, a ratio of a width of the first sub-pad to a width of the connecting segment is greater than or equal to 3, and a ratio of a width of the second sub-pad to a width of the connecting segment is greater than or equal to 3.

5. The flexible circuit board according to any one of claims 1 to 4, characterized in that: The substrate includes a first substrate and a second substrate, the first substrate and the second substrate are non-integrated structures, the first sub-pad is arranged on the first substrate, and the second sub-pad and the signal line are arranged on the second substrate.

6. The flexible circuit board according to claim 5, characterized in that: The material of the connecting section is different from the material of the first sub-welding pad and the material of the second sub-welding pad; One end of the connecting section overlaps with a surface of the first sub-pad facing away from the first substrate, and the other end of the connecting section overlaps with a surface of the second sub-pad facing away from the second substrate.

7. The flexible circuit board according to claim 6, characterized in that: The material of the connecting section includes solder.

8. A display device, characterized in that: It comprises the flexible circuit board as claimed in any one of claims 1 to 7.

9. An electronic device, characterized in that: It comprises the flexible circuit board as claimed in any one of claims 1 to 7.

10. A method for repairing an electronic device, characterized in that: include: An electronic device is provided, the electronic device comprising a device body and a flexible circuit board, the electronic device comprising a pad terminal; the flexible circuit board comprising a substrate, an electronic component, a plurality of pad portions and a signal line; the electronic component is arranged on a surface of the substrate, the electronic component comprises a plurality of pins; a plurality of pad portions are arranged on a surface of the substrate; one end of the signal line is connected to the pad portion, and the other end of the signal line is connected to the pin; wherein the pad portion comprises a first sub-pad, a connecting section and a second sub-pad, the signal line, the second sub-pad, the connecting section and the first sub-pad are connected in sequence; in a direction perpendicular to the extension of the pad portion, the width of the connecting section is smaller than the width of the first sub-pad and the width of the second sub-pad; the first sub-pad is electrically connected to the pad terminal; Cutting the flexible circuit board at the plurality of connection sections of the plurality of pad portions, removing the portion of the flexible circuit board including the second sub-pad, and leaving the portion of the flexible circuit board including the first sub-pad on the device body; Providing a repair flexible circuit board, the repair flexible circuit board comprising a plurality of solder pads; The soldering pad of the repair flexible circuit board is electrically connected to the first sub-soldering pad retained on the device body.

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