Design method for improving overclocking problem of PCB

Abstract

The invention relates to the technical field of PCBs (Printed Circuit Board), in particular to a design method for improving an overclocking problem of a PCB, which comprises the following steps of: S1, designing PNL board edges, and keeping the PNL board edges unchanged according to a conventional parallel design, namely keeping four edges of the PNL parallel and equidistant; and S2, internal PCS rotation: in the PNL, each PCS is rotated. The PCB solves the problems that the PNL layout of the traditional PCB design is conventional parallel layout layout production, a substrate and a PP material used in the actual production process of a factory are made of resin and glass fiber cloth, the glass fiber cloth is made of a longitudinal and latitudinal matched skeleton and the middle is completely soaked with the resin, and when the PCB adopts the conventional parallel layout layout, the production efficiency is greatly improved, and the production cost is reduced. In the prior art, a part of circuits and hole sites are arranged on the warps or wefts of the glass fabric and are parallel and overlapped with the warps or wefts of the glass fabric, so that the circuit signal transmission is influenced and the signal loss is caused in the overclocking process, and the problems of poor overclocking effect and influence on the electrical reliability of a PCB (Printed Circuit Board) are solved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB boards, and in particular to a design method for improving overclocking problems of PCB boards. Background Art

[0002] PCB (Printed Circuit Board), Chinese name is printed circuit board, also known as printed circuit board, is an indispensable and important component in electronic equipment. PCB board is a substrate for assembling electronic components. It is usually made of one or more layers of insulating material with copper wire tracks printed on it. These tracks connect the various parts in the circuit. Its main functions include: Electrical connection: The wire tracks on the PCB board connect the various components in the circuit to form a complete circuit system, so that the electronic equipment can work normally. Protect the circuit: The insulating material on the PCB board can protect the components in the circuit from electromagnetic interference and other environmental factors, and improve the stability and reliability of the circuit. Heat dissipation: Some metal layers (such as copper foil) on the PCB board can play a role in heat dissipation, helping the components in the circuit to disperse heat and prevent overheating damage. Mechanical support: PCB board, as the substrate of circuit components, provides them with stable mechanical support, and can also protect the internal circuit components from external impact. PCB boards are mainly divided into the following categories: Single-sided board: The circuit pattern is printed on only one side of the substrate, and not on the other side. This board is usually used in simpler circuits. Double-sided board: The circuit pattern is printed on both sides of the substrate, and the components can be soldered on both sides. This type of board has a higher wiring density and a more complex circuit structure. Multilayer board: It is made up of multiple layers of insulating materials and copper foil, and each layer can have a circuit pattern. Multilayer boards are often used in highly integrated electronic devices to improve the wiring density and performance of the circuit. Design engineers use electronic design automation (EDA) tools to create circuit diagrams and PCB layouts. The design includes determining the function of the circuit, laying out components, drawing wire paths, etc., purchasing raw materials such as substrate materials (such as FR-4), copper foil, solder mask ink, and silk screen ink. These materials need to meet the requirements of PCB design, including printing inner layers, graphic etching, interlayer connections, outer layer graphic, solder mask and silk screen, surface treatment and other steps. Each step requires a high degree of precision and process control to ensure the performance and reliability of the final PCB. Assembling components onto the PCB includes steps such as welding, installing components, inspection and testing. After assembly, the PCB is tested and quality inspected to ensure that the circuit connection is correct, the components work properly, and meet the design requirements. PCB boards are widely used in various electronic devices such as computers, mobile phones, communication equipment, automotive electronic equipment, medical equipment, aerospace equipment, etc. With the continuous development of electronic technology, the application field of PCB boards is also expanding. With the miniaturization and improvement of integration of electronic equipment, HDI technology has become an important trend in the development of PCB boards. HDI technology can achieve finer lines and smaller spacing, thereby improving the wiring density and performance of circuits. As an important part of electronic equipment, PCB boards have broad development and application prospects. With the continuous advancement and innovation of electronic technology, PCB boards will continue to develop in the direction of higher density, higher performance and smaller size.

[0003] The traditional PCB board design PNL layout is produced by the conventional parallel layout layout, and the substrate and PP material used by the factory in the actual production process are made of resin and glass fiber cloth. The glass fiber cloth is a skeleton matched in the warp and weft directions, and the middle is completely impregnated with resin. When the PCB adopts the conventional parallel layout layout, some of its circuits and holes will be arranged on the warp or weft of the glass fiber cloth and keep parallel and overlapping with it. This design will affect the line signal transmission during the overclocking process, causing signal loss, thereby causing a poor overclocking effect and affecting the electrical reliability of the PCB board. In view of the above problems, a design method for improving the overclocking problem of a PCB board is provided. Summary of the invention

[0004] The purpose of the present invention is to provide a design method for improving overclocking of a PCB board, so as to solve the problems raised in the above background technology. To achieve the above purpose, the present invention provides the following technical solution: A design method for improving overclocking of a PCB board, comprising the following steps: S1. PNL board edge design: keep the PNL board edge in the conventional parallel design, that is, the four sides of the PNL remain parallel and equidistant; S2, internal PCS rotation, each PCS is rotated inside the PNL; S3, single PCS design, a single PCS is adjusted according to the rotated layout, and the positions of all circuits, holes and other components are adjusted according to the rotated angle; S4, SET piecewise rotation, all PCSs in the SET are rotated as a whole, and the rotation angle is consistent with the rotation angle of a single PCS; S5. Signal integrity design, by optimizing parameters such as line width, spacing and dielectric thickness, to reduce loss and interference during signal transmission; S6. Optimize production process, strictly control the quality of substrate and PP materials, and optimize cutting and drilling processes.

[0005] Preferably, the rotation angle of each PCS in S2 is 2-3.5 degrees.

[0006] Preferably, the process of PNL board edge design also includes: S1. Determine the needs and clarify the design requirements of the PNL board; S2, layout design, plan the layout plan according to the size and quantity of the PNL board, combine multiple PCS into a SET, and combine multiple SETs into a PNL board; S3, detailed design, design process holes on the edge of the PNL board, design the border of the PNL board, and mark the necessary information on the edge of the PNL board, including version number, production date, and manufacturer logo; S4, Review and Optimization, review the design documents of the PNL board, and optimize the design according to the review results, including adjusting the layout, modifying the position and size of the process holes; S5. Production preparation: According to the final design documents, make production drawings including layout drawings and process hole drawings. According to the production drawings, prepare the required materials and equipment, such as substrates, copper foils, drilling machines, etc. Set the process parameters such as drilling, cutting, and electroplating according to production requirements and material characteristics; S6. Production and processing: Drill holes on the substrate according to the hole position and hole diameter required by the design, use a cutting machine to cut the substrate into the required PNL board size, and electroplate the cut PNL board to improve its conductivity and corrosion resistance.

[0007] Preferably, the design requirements of the PNL plate include size, shape, material and process.

[0008] Preferably, the planning layout scheme includes determining the area and quantity of each PCS (single circuit board).

[0009] Preferably, the process holes include positioning holes and rivet holes.

[0010] Preferably, the process of internal PCS rotation includes: S1, determine the position of the PCS that needs to be rotated on the PCB board, and clarify the angle and direction of rotation; S2. Before making any changes, back up the original PCB design file to prevent unexpected situations that make it impossible to restore the original design; S3. In the PCB design software, use the selection tool to select the PCS to be rotated; S4, in the rotation function of the software, set the rotation angle and direction parameters to ensure that the selection of the rotation center point meets the design requirements. Usually, the center of mass of the PCS or a specific point can be selected as the rotation center; S5, after the rotation, the PCB needs to be re-layouted and the components need to be adjusted according to the new layout requirements; S6, conduct a comprehensive inspection on the rotated PCB to ensure there are no defects or problems caused by the rotation.

[0011] Preferably, the process of single PCS design includes: S1. Determine the function, size, and basic requirements of the working environment of the PCB board, and collect and organize relevant circuit schematics, component lists, and layout requirements; S2. Draw a circuit diagram in the design software based on the collected circuit schematics; S3. Check and update the component library to ensure that all components have correct packages and properties; S4, generating a network table from the circuit schematic diagram, the network table containing connection information between components; S5. Import the generated network table into the PCB layout design environment, layout the components according to the circuit functions and layout requirements, and follow the layout principles, such as partitioning by function, maintaining appropriate spacing between components, and avoiding signal interference; S6. Set the wiring rules according to the circuit requirements and PCB production process, and use the automatic wiring function of the design software to perform preliminary wiring; S7. Use the DRC function of the design software to check the PCB design to ensure that all components are connected correctly, the wiring complies with the rules, and there are no electrical errors.

[0012] Preferably, the process of the SET continuous rotation includes: S1. Determine the angle and direction in which the SET connection piece needs to be rotated; S2. Fix the SET piece on the rotating device to ensure that it does not move or deform during the rotation process, and mark the reference points at the appropriate positions of the SET piece so that it can be accurately aligned and verified after rotation; S3, setting the corresponding rotation angle and speed parameters on the rotating device, starting the rotating device, performing the rotation operation, and monitoring any abnormal conditions during the rotation process; S4. Use the measuring tool to verify whether the angle of the SET joint after rotation is accurate, and check whether the SET joint remains flat after rotation; S5. After rotation, the layout needs to be rearranged, and the SET pieces need to be adjusted according to the new layout requirements. A comprehensive inspection of the rotated SET pieces is performed to ensure that there are no defects or problems caused by the rotation. Necessary electrical tests and functional tests are performed to ensure the quality of the SET pieces.

[0013] Preferably, the measuring tool is a vernier caliper.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The problem of parallel overlap between the lines and holes and the warp and weft directions of the glass fiber cloth has been solved, reducing the loss and interference during signal transmission. The transmission speed and bandwidth of the PCB board have been improved, and the overclocking performance has been enhanced. The anti-interference ability and stability of the PCB board have been enhanced, and the electrical reliability has been improved. The production process has been optimized, and the overall performance and reliability of the PCB board have been improved, which can effectively improve the electrical reliability of the PCB board, make the transmission of lines or holes.PAD and other signals smoother, improve the overclocking effect, improve the overclocking quality, reduce customer complaints, enhance the market competitiveness of corporate products, and increase the company's order share. Without affecting the electrical performance of the PCB, the PNL board edges of the boards at all levels are designed to be parallel according to the conventional design during the engineering layout design, which will not affect the production and handling of the board. The board PCS / SET is rotated at a certain angle to reduce the impact of materials on the transmission of electrical signals on the board and improve the overclocking effect; It solves the problem that the traditional PCB board design PNL layout is produced by a conventional parallel layout, while the substrate and PP materials used by the factory in the actual production process are made of resin and glass fiber cloth. The glass fiber cloth is a skeleton matched in the warp and weft directions, and the middle is completely impregnated with resin. When the PCB adopts a conventional parallel layout, some of its circuits and holes will be arranged on the warp or weft of the glass fiber cloth and remain parallel and overlapping with it. This design will affect the line signal transmission during the overclocking process, causing signal loss, thereby resulting in a poor overclocking effect and affecting the electrical reliability of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a PCB structure designed for a method of improving overclocking of a PCB board according to the present invention; Figure 2 A schematic diagram of a PCB structure designed for a method of improving overclocking of a PCB board according to the present invention; Figure 3 A schematic diagram of a PCB structure designed for a method of improving overclocking of a PCB board according to the present invention; Figure 4 A schematic diagram of a PCB structure designed for a method of improving overclocking of a PCB board according to the present invention; Figure 5 A schematic diagram of a PCB structure designed for a method of improving overclocking of a PCB board according to the present invention; Figure 6 A schematic diagram of a PCB structure designed for a method of improving overclocking of a PCB board according to the present invention; Figure 7 A schematic diagram of a PCB structure designed for a method of improving overclocking of a PCB board according to the present invention; Figure 8A schematic diagram of a PCB structure designed for a method of improving overclocking of a PCB board according to the present invention; Fig. 9 The present invention is a flowchart of a design method for improving overclocking problem of a PCB board. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the present invention.

[0017] See also Figures 1 to 9 The present invention provides a technical solution: a design method for improving overclocking problem of a PCB board, comprising the following steps: S1. PNL board edge design: keep the PNL board edge in the conventional parallel design, that is, the four sides of the PNL remain parallel and equidistant; S2, internal PCS rotation, each PCS is rotated inside the PNL; S3, single PCS design, a single PCS is adjusted according to the rotated layout, and the positions of all circuits, holes and other components are adjusted according to the rotated angle; S4, SET piecewise rotation, all PCSs in the SET are rotated as a whole, and the rotation angle is consistent with the rotation angle of a single PCS; S5. Signal integrity design, by optimizing parameters such as line width, spacing and dielectric thickness, to reduce loss and interference during signal transmission; S6. Optimize production process, strictly control the quality of substrate and PP materials, and optimize cutting and drilling processes; The problem of parallel overlap between lines and holes and the warp and weft directions of the glass fiber cloth has been solved, reducing the loss and interference during signal transmission. The transmission speed and bandwidth of the PCB board have been improved, and the overclocking performance has been enhanced. The anti-interference ability and stability of the PCB board have been enhanced, and the electrical reliability has been improved. The production process has been optimized, and the overall performance and reliability of the PCB board have been improved, which can effectively improve the electrical reliability of the PCB board, make the transmission of lines or holes.PAD and other signals smoother, improve the overclocking effect, improve the overclocking quality, reduce customer complaints, enhance the market competitiveness of corporate products, and increase the company's order share. Without affecting the electrical performance of the PCB, the PNL board edges of the boards at all levels are designed to be parallel according to the conventional design during the engineering layout design, which will not affect the production and handling of the board. The board is rotated a certain angle within the PCS / SET to reduce the impact of materials on the transmission of electrical signals on the board. , improve the overclocking effect; solve the problem that the traditional PCB board design PNL layout is produced by the conventional parallel layout layout, and the substrate and PP material used by the factory in the actual production process are made of resin and glass fiber cloth. The glass fiber cloth is a skeleton matched in the warp and weft directions, and the middle is completely soaked in resin. When the PCB adopts the conventional parallel layout layout, some of its lines and holes will be arranged on the warp or weft of the glass fiber cloth and keep parallel and overlapping with it. This design will affect the line signal transmission during the overclocking process, causing signal loss, thereby resulting in poor overclocking effect and affecting the electrical reliability of the PCB board.

[0018] In this embodiment, the rotation angle of each PCS in S2 is 2-3.5 degrees.

[0019] In this embodiment, the process of PNL board edge design also includes: S1. Determine the needs and clarify the design requirements of the PNL board; S2, layout design, plan the layout plan according to the size and quantity of the PNL board, combine multiple PCS into a SET, and combine multiple SETs into a PNL board; S3, detailed design, design process holes on the edge of the PNL board, design the border of the PNL board, and mark the necessary information on the edge of the PNL board, including version number, production date, and manufacturer logo; S4, Review and Optimization, review the design documents of the PNL board, and optimize the design according to the review results, including adjusting the layout, modifying the position and size of the process holes; S5. Production preparation: According to the final design documents, make production drawings including layout drawings and process hole drawings. According to the production drawings, prepare the required materials and equipment, such as substrates, copper foils, drilling machines, etc. Set the process parameters such as drilling, cutting, and electroplating according to production requirements and material characteristics; S6. Production and processing: Drill holes on the substrate according to the hole position and hole diameter required by the design, use a cutting machine to cut the substrate into the required PNL board size, and electroplate the cut PNL board to improve its conductivity and corrosion resistance; The specific process steps of PNL board edge design involve multiple links, which need to comprehensively consider factors such as design requirements, production technology and material characteristics. According to production requirements, other necessary process treatments are carried out, such as cleaning and drying, etc., and the appearance quality of the PNL board is checked, such as surface flatness, color uniformity, etc., and the performance of the PNL board is tested, such as conductivity, insulation, etc.

[0020] In this embodiment, the design requirements of the PNL plate include size, shape, material, and process.

[0021] In this embodiment, planning the layout plan includes determining the area and quantity of each PCS (single circuit board).

[0022] In this embodiment, the process holes include positioning holes and rivet holes.

[0023] In this embodiment, the process of internal PCS rotation includes: S1, determine the position of the PCS that needs to be rotated on the PCB board, and clarify the angle and direction of rotation; S2. Before making any changes, back up the original PCB design file to prevent unexpected situations that make it impossible to restore the original design; S3. In the PCB design software, use the selection tool to select the PCS to be rotated; S4, in the rotation function of the software, set the rotation angle and direction parameters to ensure that the selection of the rotation center point meets the design requirements. Usually, the center of mass of the PCS or a specific point can be selected as the rotation center; S5, after the rotation, the PCB needs to be re-layouted and the components need to be adjusted according to the new layout requirements; S6, conduct a comprehensive inspection on the rotated PCB to ensure there are no defects or problems caused by the rotation.

[0024] In this embodiment, the process of single PCS design includes: S1. Determine the function, size, and basic requirements of the working environment of the PCB board, and collect and organize relevant circuit schematics, component lists, and layout requirements; S2. Draw a circuit diagram in the design software based on the collected circuit schematics; S3. Check and update the component library to ensure that all components have correct packages and properties; S4, generating a network table from the circuit schematic diagram, the network table containing connection information between components; S5. Import the generated network table into the PCB layout design environment, layout the components according to the circuit functions and layout requirements, and follow the layout principles, such as partitioning by function, maintaining appropriate spacing between components, and avoiding signal interference; S6. Set the wiring rules according to the circuit requirements and PCB production process, and use the automatic wiring function of the design software to perform preliminary wiring; S7. Use the DRC function of the design software to check the PCB design to ensure that all components are connected correctly, the wiring complies with the rules, and there are no electrical errors.

[0025] In this embodiment, the process of SET continuous rotation includes: S1. Determine the angle and direction in which the SET piece needs to be rotated, and understand whether the piece needs to be rearranged or adjusted after rotation; S2. Fix the SET piece on the rotating device to ensure that it does not move or deform during the rotation process, and mark the reference points at the appropriate positions of the SET piece so that it can be accurately aligned and verified after rotation; S3, setting the corresponding rotation angle and speed parameters on the rotating device, starting the rotating device, performing the rotation operation, and monitoring any abnormal conditions during the rotation process; S4. Use the measuring tool to verify whether the angle of the SET joint after rotation is accurate, and check whether the SET joint remains flat after rotation; S5. After rotation, it is necessary to rearrange the layout, adjust the SET pieces according to the new layout requirements, conduct a comprehensive inspection of the rotated SET pieces to ensure that there are no defects or problems caused by the rotation, and conduct necessary electrical tests and functional tests to ensure the quality of the SET pieces. During the production process, the quality of the SET pieces is continuously monitored, and problems are discovered and solved in a timely manner. Feedback from customers or production departments is collected to understand the performance and stability of the SET pieces after rotation. Based on the feedback and monitoring results, the rotation process is continuously optimized to improve the quality and production efficiency of the SET pieces. The specific process steps of the SET piece rotation may vary depending on different application scenarios, equipment types, and process requirements. Therefore, in actual operations, adjustments and optimizations should be made according to specific circumstances. At the same time, ensure that all operations comply with safety specifications and standards to avoid any potential safety risks.

[0026] In this embodiment, the measuring tool is a vernier caliper.

[0027] The above shows and describes the basic principles, main features and advantages of the present invention. Technical personnel in this industry should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A design method for improving overclocking problem of PCB board, characterized in that: The steps include: S1. PNL board edge design: keep the PNL board edge in the conventional parallel design, that is, the four sides of the PNL remain parallel and equidistant; S2, internal PCS rotation, each PCS is rotated inside the PNL; S3, single PCS design, a single PCS is adjusted according to the rotated layout, and the positions of all circuits, holes and other components are adjusted according to the rotated angle; S4, SET joint rotation, all PCS in the SET are rotated as a whole, and the rotation angle is consistent with the rotation angle of a single PCS; S5. Signal integrity design, by optimizing parameters such as line width, spacing and dielectric thickness, to reduce loss and interference during signal transmission; S6. Optimize production process, strictly control the quality of substrate and PP materials, and optimize cutting and drilling processes.

2. A PCB board overclocking design method according to claim 1, characterized in that: The rotation angle of each PCS in S2 is 2-3.5 degrees.

3. A PCB board overclocking design method according to claim 1, characterized in that: The PNL board edge design process also includes: S1. Determine the needs and clarify the design requirements of PNL boards; S2, layout design, plan the layout plan according to the size and quantity of the PNL board, combine multiple PCS into a SET, and combine multiple SETs into a PNL board; S3, detailed design, design process holes on the edge of the PNL board, design the border of the PNL board, and mark the necessary information on the edge of the PNL board, including version number, production date, and manufacturer logo; S4, Review and Optimization, review the design documents of the PNL board, and optimize the design according to the review results, including adjusting the layout, modifying the position and size of the process holes; S5. Production preparation: According to the final design documents, make production drawings including layout drawings and process hole drawings. According to the production drawings, prepare the required materials and equipment, such as substrates, copper foils, drilling machines, etc. Set the process parameters such as drilling, cutting, and electroplating according to production requirements and material characteristics; S6. Production and processing: Drill holes on the substrate according to the hole position and hole diameter required by the design, use a cutting machine to cut the substrate into the required PNL board size, and electroplate the cut PNL board to improve its conductivity and corrosion resistance.

4. A PCB board overclocking design method according to claim 3, characterized in that: The design requirements of the PNL board include size, shape, material and process.

5. A PCB board overclocking design method according to claim 3, characterized in that: The layout planning includes determining the area and quantity of each PCS (single circuit board).

6. A PCB board overclocking design method according to claim 3, characterized in that: The process holes include positioning holes and rivet holes.

7. A PCB board overclocking design method according to claim 1, characterized in that: The process of internal PCS rotation includes: S1, determine the position of the PCS that needs to be rotated on the PCB board, and clarify the angle and direction of rotation; S2. Before making any changes, back up the original PCB design file to prevent unexpected situations that make it impossible to restore the original design; S3. In the PCB design software, use the selection tool to select the PCS to be rotated; S4, in the rotation function of the software, set the rotation angle and direction parameters to ensure that the selection of the rotation center point meets the design requirements. Usually, the center of mass of the PCS or a specific point can be selected as the rotation center; S5, after the rotation, the PCB needs to be re-layouted and the components need to be adjusted according to the new layout requirements; S6, conduct a comprehensive inspection on the rotated PCB to ensure there are no defects or problems caused by the rotation.

8. A PCB board overclocking design method according to claim 1, characterized in that: The single PCS design process includes: S1. Determine the function, size, and basic requirements of the working environment of the PCB board, and collect and organize relevant circuit schematics, component lists, and layout requirements; S2. Draw a circuit diagram in the design software based on the collected circuit schematics; S3. Check and update the component library to ensure that all components have correct packages and properties; S4, generating a network table from the circuit schematic diagram, the network table containing connection information between components; S5. Import the generated network table into the PCB layout design environment, layout the components according to the circuit functions and layout requirements, and follow the layout principles, such as partitioning by function, maintaining appropriate spacing between components, and avoiding signal interference; S6. Set the wiring rules according to the circuit requirements and PCB production process, and use the automatic wiring function of the design software to perform preliminary wiring; S7. Use the DRC function of the design software to check the PCB design to ensure that all components are connected correctly, the wiring complies with the rules, and there are no electrical errors.

9. A PCB board overclocking design method according to claim 1, characterized in that: The process of SET continuous rotation includes: S1. Determine the angle and direction in which the SET connection piece needs to be rotated; S2. Fix the SET piece on the rotating device to ensure that it does not move or deform during the rotation process, and mark the reference points at the appropriate positions of the SET piece so that it can be accurately aligned and verified after rotation; S3, setting the corresponding rotation angle and speed parameters on the rotating device, starting the rotating device, performing the rotation operation, and monitoring any abnormal conditions during the rotation process; S4. Use the measuring tool to verify whether the angle of the SET joint after rotation is accurate, and check whether the SET joint remains flat after rotation; S5. After rotation, the layout needs to be rearranged, and the SET pieces need to be adjusted according to the new layout requirements. A comprehensive inspection of the rotated SET pieces is performed to ensure that there are no defects or problems caused by the rotation. Necessary electrical tests and functional tests are performed to ensure the quality of the SET pieces.

10. A PCB board overclocking design method according to claim 9, characterized in that: The measuring tool is a vernier caliper.

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