Semiconductor device cleaning equipment

Abstract

The invention discloses semiconductor device cleaning equipment which comprises a rack assembly, the rack assembly comprises a lower rack and an upper rack hinged to the lower rack, and the lower rack can be covered with the upper rack; the plasma cleaning machine comprises a lower machine frame and a workbench arranged on the lower machine frame, a feeding assembly, a plasma cleaning assembly and a discharging assembly are sequentially installed on the workbench, the feeding assembly is used for conveying materials to the plasma cleaning assembly, and the discharging assembly is used for receiving the materials from the plasma cleaning assembly; wherein the plasma cleaning assembly comprises an upper cavity, a lower cavity and a cleaning unit, the lower cavity is fixedly installed on the workbench, the upper cavity is arranged above the lower cavity, an upper cavity lifting assembly is fixedly installed on the upper cavity, and the upper cavity covers or is away from the lower cavity through the upper cavity lifting assembly; the cleaning unit is fixed to the workbench and used for cleaning materials located in the upper cavity and the lower cavity.

Description

Technical Field

[0001] The invention belongs to the technical field of plasma cleaning machines, and in particular relates to semiconductor device cleaning equipment. Background Art

[0002] In the chip packaging process, the cleanliness and surface properties of the lead frame are crucial to the packaging quality. Plasma cleaning can be used to treat the frame before wire bonding to remove surface contaminants such as particles, oxides, and organic matter, improve the bonding strength and tension uniformity of the bonding wire, and reduce the pressure and bonding temperature of the bonding head, thereby improving production efficiency and product quality and reducing packaging failures caused by poor bonding. Plasma cleaning of the lead frame before silver glue is applied to the LED can greatly improve the surface roughness and hydrophilicity of the frame, which is beneficial to the paving of the silver glue and the pasting of the chip, while saving the amount of silver glue.

[0003] Plasma cleaning machine is a device that uses plasma to effectively remove organic pollutants on the surface of materials, thereby achieving the purpose of cleaning and coating. As a new cleaning technology, plasma cleaning machine can achieve effects that conventional cleaning solutions cannot achieve, so it is often used in semiconductor packaging and LED packaging fields.

[0004] Plasma cleaning machines generally include microwave plasma cleaning machines and radio frequency plasma cleaning machines. The operating frequency of microwave plasma cleaning machines is generally 2.45GHz. The electron energy in its plasma is relatively concentrated and usually has a higher energy density, which makes microwave plasma perform well in some occasions that require high-energy reactions. The operating frequency of radio frequency plasma cleaning machines is generally 13.56MHz, and the electron energy distribution in its plasma is relatively wide, which means that during the cleaning or surface treatment process, there are both higher-energy electrons that can physically bombard the surface of the material to remove surface pollutants and oxide layers, and slightly lower-energy electrons that participate in chemical reactions to generate active groups that chemically modify the surface of the material.

[0005] When using microwave plasma cleaning, the active particles react chemically with the surface of the object being cleaned, which may cause the outer surface of the product to oxidize and produce oxides, which will adhere to the surface of the product and affect the appearance and performance of the product. The bombardment of various active particles on the surface of the cleaning material will cause a certain degree of damage and erosion to the surface of the material, and at the same time generate a large amount of reaction heat on the surface of the material, thereby affecting the surface quality and performance of the material.

[0006] Based on this, the present invention provides a semiconductor device cleaning equipment to solve the above problems existing in the prior art. Summary of the invention

[0007] In view of the above problems existing in the prior art, the present invention provides a semiconductor device cleaning device. The device structure of the semiconductor device cleaning device of the present invention is relatively simple, and the cost of its radio frequency power supply and matcher is lower than that of a microwave plasma cleaning machine, and can meet the cleaning needs at a lower cost.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions: A semiconductor device cleaning device, comprising: A frame assembly, the frame assembly comprising a lower frame and an upper frame hingedly mounted on the lower frame, the upper frame being coverable on the lower frame; and A workbench is arranged on the lower frame, on which a loading assembly, a plasma cleaning assembly and a unloading assembly are sequentially installed, wherein the loading assembly is used to transport materials to the plasma cleaning assembly, and the unloading assembly is used to receive materials from the plasma cleaning assembly; Among them, the plasma cleaning component includes an upper cavity, a lower cavity fixedly installed on a workbench, and a cleaning unit. The upper cavity is arranged above the lower cavity. The upper cavity is fixedly installed with an upper cavity lifting component. The upper cavity is covered or away from the lower cavity by the upper cavity lifting component. The cleaning unit is fixed to the workbench and is used to clean the materials located in the upper cavity and the lower cavity.

[0009] Furthermore, the cleaning unit includes a radio frequency power supply for generating high-frequency AC electromagnetic waves and a radio frequency matcher for matching the impedance between the radio frequency power supply and the load, the radio frequency matcher is fixedly installed at the bottom of the workbench, and the radio frequency power supply is installed in the lower frame and is electrically connected to the radio frequency matcher.

[0010] Furthermore, the loading assembly and the unloading assembly both include a material lifting platform for placing materials, a first motor, a first ball screw and a mounting frame fixedly installed on the workbench, the mounting frame is fixedly installed with two guide rods arranged parallel to each other, the guide rods are arranged along the height direction, the guide rods pass through the material lifting platform, the material lifting platform is transmission-connected to the first ball screw, the first ball screw is arranged between the two guide rods, the end of the first ball screw away from the material lifting platform is connected to the first motor, and the first motor is used to drive the material lifting platform to move along the guide rods.

[0011] Furthermore, the workbench is also equipped with a loading assembly line located downstream of the loading assembly and a unloading assembly line located upstream of the unloading assembly, and the loading assembly line and the unloading assembly line both include: A bottom plate fixed on the workbench, wherein the bottom plate is provided with two mutually parallel first guide rails along the length direction, and the bottom plate is slidably connected to the movable plate via the first guide rails; at least one fixed side component, the fixed side component being fixed to the base plate; A movable side component is arranged corresponding to the fixed side component, the movable side component is mounted on the movable plate, and a space for materials to pass through is reserved between the movable side component and the fixed side component; and A width adjustment component is installed on the bottom plate, and the width adjustment component is used to adjust the distance between the fixed side component and the movable side component.

[0012] Further, the width adjustment assembly includes a motor fixing plate fixed to one side of the base plate, a second motor, a second ball screw, a second pulley, a slider connecting seat, a screw fixing seat and a screw supporting seat; Among them, the second motor is installed on the motor fixing plate, and the first pulley is installed at the output end of the second motor. The screw fixing seat and the screw supporting seat are fixed on the bottom plate and are rotatably connected with the two ends of the second ball screw respectively. The second pulley is installed at one end of the second ball screw, and the second pulley is connected to the first pulley through a synchronous belt. The second ball screw is rotatably connected to the slider connecting seat, and the sliding connecting seat is fixed to the lower part of the movable plate.

[0013] Further, the fixed side component includes a second material guide plate, the second material guide plate is fixed on the bottom plate, and a guide component for guiding the movement of materials is installed on a side of the second material guide plate opposite to the movable side component. The movable side component includes a third material guide plate, the third material guide plate is fixed on the movable plate, and a guide component for guiding the movement of materials is installed on a side of the second material guide plate opposite to the fixed side component.

[0014] Furthermore, the workbench is also equipped with a material pushing device for pushing materials, and the material pushing device is located above the loading assembly and the plasma cleaning assembly. The material pushing device includes a second guide rail, a linear module and a crossbeam fixed on the workbench, and the crossbeam is provided with at least one pushing member along its length direction. A sliding seat is fixed at one end of the crossbeam, and the sliding seat is slidably connected to the second guide rail. An overload detection assembly is installed at the other end of the beam, and the overload detection assembly is matched with the linear module for transmission. Under the action of the linear module, the beam can slide along the length direction of the second guide rail.

[0015] Furthermore, the overload detection component comprises: A mounting seat, the mounting seat being fixed with a first end plate and a second end plate, the first end plate and the second end plate being arranged opposite to and located on the same side of the mounting seat; a guide structure mounted on the mounting seat, the guide structure being located between the first end plate and the second end plate; and A connecting slider slidably connected to the guide structure, the connecting slider is fixed with a detection shaft, the second end plate is fixedly mounted with a photoelectric sensor, and the first end plate is fixedly mounted with a return spring; One side of the connecting slider is in contact with the return spring, and under the action of the return spring, the connecting slider can cooperate with the photoelectric sensor, and the photoelectric sensor can be triggered when the connecting slider slides away from the photoelectric sensor and reaches a set position.

[0016] Furthermore, the upper cavity lifting assembly includes an upper cavity fixing seat, a lifting seat and an upper cavity cylinder. The lifting seat is fixed on the workbench, and the lifting seat is arranged along the height direction. The upper cavity fixing seat is slidably connected with the lifting seat. The upper cavity fixing seat is fixed with the upper cavity fixing seat. The upper cavity fixing seat abuts against the output end of the upper cavity cylinder. The upper cavity cylinder is fixed on the lifting seat. After the upper cavity cylinder works, it can drive the upper cavity fixing seat to move along the height direction of the lifting seat.

[0017] Furthermore, material detection units are installed on both sides of the lower cavity respectively, and the material detection units are used to detect whether the material passes through.

[0018] Compared with the prior art, the beneficial effects of this solution are: The present invention provides a semiconductor device cleaning device, comprising a frame and an upper frame hingedly mounted on a lower frame, a loading assembly, a plasma cleaning assembly and a unloading assembly are sequentially mounted on a workbench of the frame, the loading assembly is used to transport materials to the plasma cleaning assembly, the unloading assembly is used to receive materials from the plasma cleaning assembly, the plasma cleaning assembly comprises a radio frequency power supply for generating high-frequency alternating electromagnetic waves and a radio frequency matcher for matching impedance between the radio frequency power supply and a load, the radio frequency matcher is fixedly mounted at the bottom of the workbench, the radio frequency power supply is mounted in the lower frame and is electrically connected to the radio frequency matcher, The RF matcher is electrically connected to the lower cavity and cooperates with the lower cavity. When the upper cavity is buckled on the lower cavity, plasma matter is generated between the upper cavity and the lower cavity through the RF matcher. The semiconductor device cleaning equipment of the present invention has a relatively simple structure, and the cost of its RF power supply and matcher is lower than that of a microwave plasma cleaning machine. In some application scenarios that do not require extremely high cleaning accuracy, it can meet basic cleaning needs at a lower cost and has a high cost-effectiveness ratio. It can flexibly adjust parameters such as RF power, gas flow, and cleaning time according to different cleaning materials and cleaning requirements to achieve the best cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure of the semiconductor device cleaning equipment; Figure 2 This is a top view of the workbench; Figure 3This is the main view of the semiconductor device cleaning equipment (without the upper frame); Figure 4 It is a schematic diagram of the structure of the feeding component; Figure 5 It is a schematic diagram of the structure of the blanking component; Figure 6 This is the general assembly drawing of the loading line; Figure 7 It is a schematic diagram of the fixed side component structure; Figure 8 This is a schematic diagram of the width adjustment component structure; Fig. 9 It is a schematic diagram of the structure of the mobile side components; Fig.10 It is a structural schematic diagram of a material propulsion device; Fig.11 This is a schematic diagram of the overload detection component structure; Fig.12 It is a cross-sectional view of the overload detection component; Fig.13 A schematic diagram of a motion state of an overload detection component.

[0020] The reference numerals are as follows: base plate 1, first guide rail 11, movable plate 2, guide block 21, fixed side assembly 3, second guide plate 31, guide assembly 32, movable side assembly 4, third guide plate 41, width adjustment assembly 5, motor fixing plate 51, second motor 52, first pulley 53, ball screw 54, second pulley 55, slider connecting seat 56, screw fixing seat 57, screw support seat 58, synchronous belt 59, second guide rail 6, linear module 61, drive motor 611, movable seat 62, crossbeam 63, pusher 631, sliding seat 632, overload detection assembly 64, mounting seat 64 1. First end plate 642, second end plate 643, guide structure 644, connecting slider 645, photoelectric sensor 646, spring guide shaft 647, return spring 648, detection shaft 649, lower frame 7, upper frame 71, workbench 72, host computer 73, vacuum pump 74, loading assembly 8, material lifting platform 81, first motor 82, first ball screw 83, mounting frame 84, guide rod 85, first material guide plate 86, upper cavity 91, lower cavity 92, upper cavity fixing seat 93, lifting seat 94, RF matcher 95, RF power supply 96, unloading assembly 10, material box 101. DETAILED DESCRIPTION

[0021] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] A semiconductor device cleaning device, such as Figure 1 , Figure 2 and Figure 3 As shown, including: A frame assembly, the frame assembly comprising a lower frame 7 and an upper frame 71 hingedly mounted on the lower frame 7, the upper frame 71 being coverably mounted on the lower frame 7; and A workbench 72 is arranged on the lower frame 7, and the workbench 72 is arranged horizontally. A loading assembly 8, a plasma cleaning assembly, and a unloading assembly 10 are sequentially installed on the workbench 72. The loading assembly 8 is used to transport materials to the plasma cleaning assembly, and the unloading assembly 10 is used to receive materials from the plasma cleaning assembly; Among them, the plasma cleaning component includes an upper cavity 91, a lower cavity 92 fixedly installed on the workbench 72, and a cleaning unit. The upper cavity 91 is arranged above the lower cavity 92. The upper cavity 91 is fixedly installed with an upper cavity 91 lifting component. The upper cavity 91 is covered or away from the lower cavity 92 by the upper cavity 91 lifting component. The cleaning unit is fixed to the workbench 72 and is used to clean the materials located in the upper cavity 91 and the lower cavity 92.

[0023] According to a specific embodiment provided by the present invention, Figure 2 As shown, the workbench 72 is respectively composed of a loading assembly 8, a loading assembly line, a plasma cleaning assembly, a unloading assembly line and an unloading assembly 10 from left to right. The upper frame 71 is installed with a host computer 73 for controlling the hardware of the semiconductor device cleaning equipment. When the present embodiment is in use, the material box 101 equipped with the lead frame is placed and aligned at the loading assembly 8, and the lead frame (material) is transported to the plasma cleaning assembly. After the plasma cleaning assembly is cleaned, the material can be transported to the unloading assembly 10. In order to facilitate cleaning, the plasma cleaning assembly is arranged in the middle of the workbench 72, and the upper frame 71 is hinged with the lower frame 7, so that it is covered on the lower frame 7, and the lower frame 7 is installed with a cabinet door.

[0024] In this embodiment, the lower cavity 92 is fixedly mounted on the workbench 72, and a fixed guide plate is arranged in the lower cavity 92. The upper cavity 91 and the lower cavity 92 are pentahedral structures with one side open. The shape of the lower cavity 92 matches the upper cavity 91. A sealing ring is arranged on the upper cavity 91 or on the opposite side of the upper cavity 91. When the upper cavity 91 is buckled on the lower cavity 92, the vacuum pumping device can vacuum the area formed by the upper cavity 91 and the lower cavity 92. After the vacuum is exhausted, the process gas is introduced. The vacuum pumping device is installed in the lower frame 7. The vacuum pumping device can adopt the existing vacuum pump 74. The vacuum pumping device is connected to the upper cavity 91 through a pipeline. The fixed guide plate is used to place the material to be processed (chip lead frame). The height of the fixed guide plate is the same as the height of the loading and unloading assembly lines, so that the material can pass smoothly. The cleaning unit is used to clean the materials on the fixed guide plate. The upper cavity 91 is installed on the workbench 72 through the upper cavity 91 lifting assembly, and the upper cavity 91 lifting assembly is used to cover or keep away from the lower cavity 92.

[0025] Furthermore, the cleaning unit includes a radio frequency power supply 96 for generating high-frequency AC electromagnetic waves and a radio frequency matcher 95 for matching the impedance between the radio frequency power supply 96 and the load. The radio frequency matcher 95 is fixedly installed at the lower part of the workbench 72. The radio frequency power supply 96 is installed in the lower frame 7 and is electrically connected to the radio frequency matcher 95. The radio frequency matcher 95 is electrically connected to the lower cavity 92 and cooperates with the lower cavity 92. When the upper cavity 91 is snapped onto the lower cavity 92, plasma matter is generated between the upper cavity 91 and the lower cavity 92 through the radio frequency matcher 95. The radio frequency matcher 95 is an existing product and can be used using existing products on the market.

[0026] Compared with microwave plasma cleaning technology, the semiconductor device cleaning equipment of the present invention has a relatively simple structure, and the cost of its RF power supply and RF matching device is lower than that of microwave plasma cleaning machines. In some application scenarios where the cleaning precision requirements are not extremely high, it can meet the basic cleaning needs at a lower cost and has a high cost performance. The process parameter adjustment range of the semiconductor device cleaning equipment is relatively wide, and the RF power, gas flow, cleaning time and other parameters can be flexibly adjusted according to different cleaning materials and cleaning requirements, so as to achieve the best cleaning effect.

[0027] Furthermore, if Figure 4 and Figure 5 As shown, in order to save design costs, the loading component 8 and the unloading component 10 have the same structure and are installed on both sides in a mirror-symmetrical manner with the cleaning unit as the center line. The loading component 8 and the unloading component 10 both include a material lifting platform 81 for placing materials, a first motor 82, a first ball screw 8354 and a mounting frame 84 fixedly installed on the workbench 72, the mounting frame 84 is fixedly installed with two guide rods 85 arranged parallel to each other, the guide rods 85 are arranged along the height direction, the guide rods 85 pass through the material lifting platform 81, the material lifting platform 81 is transmission-connected with the first ball screw 8354, the first ball screw 8354 is arranged between the two guide rods 85, and the end of the first ball screw 8354 away from the material lifting platform 81 is connected to the first motor 82, and the first motor 82 is used to drive the material lifting platform 81 to move along the guide rods 85.

[0028] In order to improve production efficiency, the material box 101 of the present invention is a multi-layer structure designed in the height direction. The material lifting platform 81 can be driven to rise or fall by the first motor 82 and the first ball screw 8354, so that each layer of material can be transported to the plasma cleaning component. A plurality of first guide plates 86 are installed on the material lifting platform 81. The first guide plates 86 are used to locate the position of the material box 101. The first guide plates 86 can be arranged on both sides of the material box 101. The first ball screw 8354 and the guide rod 85 are arranged parallel to each other in the height direction. The first motor 82 is installed at the lower end of the first ball screw 8354, and the mounting frame 84 is fixed to the lower part of the workbench 72. The mounting frame 84 is based on the standard of being able to install the guide rod 85. The specific structure of the mounting frame 84 is not limited here. The guide rod 85 passes through the lifting seat 94 fixed at the bottom of the material lifting platform 81, and the lifting seat 94 is transmission-connected to the first ball screw 8354.

[0029] Furthermore, if Figure 6-Figure 9 As shown, the workbench 72 is also equipped with a loading assembly line located downstream of the loading assembly 8 and a unloading assembly line located upstream of the unloading assembly 10, and the loading assembly line and the unloading assembly line both include: A bottom plate 1 fixed on the workbench 72, wherein the bottom plate 1 is provided with two mutually parallel first guide rails 11 along the length direction, and the bottom plate 1 is slidably connected to the movable plate 2 via the first guide rails 11, and the length direction of the bottom plate 1 is provided in the width direction of the workbench 72, that is, perpendicular to the direction in which the materials advance; At least one fixed side component 3, the fixed side component 3 is arranged corresponding to the first material guide plate 86 of the loading component 8, and the fixed side component 3 is fixed on the bottom plate 1; A movable side component 4 is arranged corresponding to the fixed side component 3, and the movable side component 4 is installed on the movable plate 2, and a space for materials to pass is reserved between the movable side component 4 and the fixed side component 3; and The width adjustment component 5 is installed on the bottom plate 1 , and the width adjustment component 5 is used to adjust the distance between the fixed side component 3 and the movable side component 4 .

[0030] According to a specific embodiment provided by the present invention, the loading assembly line and the unloading assembly line have the same structure, the difference is that the loading assembly line is used for waiting for materials, and materials are placed on the loading assembly line during processing to save processing time. This implementation does not limit the length of the loading assembly line and the unloading assembly line, which is subject to actual production needs.

[0031] The bottom plate 1 can be set according to actual production needs. In this embodiment, a rectangular structure plate body is used. The upper surface of the plate body has two parallel guide rails fixed by bolts. Four guide blocks 21 are fixed at the lower part of the movable plate 2. The guide blocks 21 slide with the guide rails in pairs. During processing, the material passes under the guide of the relatively arranged fixed side component 3 and the movable side component 4. By adjusting the spacing between the fixed side component 3 and the movable side component 4, the assembly line mechanism of this embodiment can be compatible with materials of multiple sizes.

[0032] The width adjustment component 5 of this embodiment is not limited to being installed at the loading and unloading assembly lines, that is, it can also be installed at the loading component 8 and the unloading component 10. The principle and structure are basically the same, so that it can be better adjusted according to the width of different material boxes 101, so that the lead frame can move smoothly along the set route.

[0033] Further, the width adjustment assembly 5 includes a motor fixing plate 51 fixed to one side of the base plate 1, a second motor 52, a second ball screw 54, a second pulley 55, a slider connecting seat 56, a screw fixing seat 57 and a screw supporting seat 58; Among them, the second motor 52 is installed on the motor fixing plate 51, and the first pulley 53 is installed at the output end of the second motor 52. The screw fixing seat 57 and the screw supporting seat 58 are fixed on the bottom plate 1 and are rotatably connected with the two ends of the second ball screw 54 respectively. The second pulley 55 is installed at one end of the second ball screw 54, and the second pulley 55 is connected to the first pulley 53 through a synchronous belt 59. The second ball screw 54 is rotatably connected to the slider connecting seat 56, and the sliding connecting seat is fixed to the lower part of the movable plate 2.

[0034] According to a specific embodiment provided by the present invention, the distance between the fixed side component 3 and the movable side component 4 can be automatically adjusted by setting the width adjustment component 5, and there is no need for manual intervention to adjust the width of the assembly line. The degree of automation is high, and the accuracy and production efficiency of material transportation are improved.

[0035] Specifically, the bottom plate 1 is arranged horizontally, the motor fixing plate 51 is fixed vertically on the side of the end of the bottom plate 1, the second motor 52 is located below the bottom plate 1, the first pulley 53 and the second motor 52 are respectively located on both sides of the motor fixing plate 51, and the second motor 52 can be a stepper motor, a servo motor or a speed regulating motor. The second ball screw 54 is located in the middle of the bottom plate 1, between the two guide rails, and the second ball screw 54 is arranged along the length direction of the bottom plate 1. The rotational motion of the second motor 52 is converted into linear motion by the second ball screw 54. In actual operation, the width spacing to be adjusted is written through the upper computer 73, and the upper computer 73 controls the rotation of the second motor 52 and then drives the ball screw 54 to rotate, so as to achieve the 4-micron width spacing adjustment of the assembly line moving side component. In this embodiment, the second pulley 55 is fixed at the end of the second ball screw 54, the screw fixing seat 57 and the screw support seat 58 are both fixed on the base plate 1, the screw fixing seat 57 and the screw support seat 58 are used to install the second ball screw 54, the slider connecting seat 56 is fixed at the lower part of the movable plate 2, and the linear movement of the slider connecting seat 56 drives the movable plate 2 to move.

[0036] Furthermore, the fixed side component 3 includes a second material guide plate 31, which is fixed on the bottom plate 1, and a guide component 32 for guiding the movement of materials is installed on a side of the second material guide plate 31 opposite to the movable side component 4. The movable side component 4 includes a third material guide plate 41, which is fixed on the movable plate 2, and a guide component 32 for guiding the movement of materials is installed on a side of the second material guide plate 31 opposite to the fixed side component 3.

[0037] According to a specific embodiment provided by the present invention, a notch is provided on one side of the second guide plate 31 fixed to the bottom plate 1 to make way for the movable plate 2, and the movable plate 2 passes through the notch of each second guide plate 31, so that the movable plate 2 can move with the ball screw 54. The guide assembly 32 can adopt the existing technology, for example, guide wheels are installed on the upper parts of both ends of the second guide plate 31 and the third guide plate 41, and the two guide wheels are in a horizontal plane. The conveyor belt is driven between the two guide wheels, and the upper guide wheel is driven by the guide wheel arranged below. The guide wheel is coaxially fixed with a gear, and the gear is driven by the motor on the side of the assembly line mechanism. The conveyor belt moves under the drive of the guide wheel, and a clamping wheel is arranged on the upper part of the conveyor belt, which drives the material to move along the length direction of the second guide plate 31 and the third guide plate 41 at the same time.

[0038] The second material guide plate 31 and the third material guide plate 41 are parallel to each other and are arranged along the material transportation direction. In order to improve production efficiency, the number of the second material guide plate 31 and the third material guide plate 41 can be set to multiple. In this embodiment, it is specifically set to four. The second material guide plate 31 and the third material guide plate 41 can be fixedly installed on the corresponding bottom plate 1 or the movable plate 2 at equal distances, so that when the movable plate 2 slides along the bottom plate 1, it will drive all the third material guide plates 41 to move.

[0039] Furthermore, the material can be manually pushed into the loading and unloading lines. In order to realize the automatic advancement of the material, the workbench 72 is also equipped with a material pushing device for pushing the material, such as Figure 10-13 As shown, the material pushing device is located above the feeding component 8 and the plasma cleaning component, the material pushing device spans the feeding component 8 and the plasma cleaning component, and both ends of the material pushing device are connected to the workbench 72. The material pushing device includes a second guide rail 6, a linear module 61 and a beam 63 fixed on the workbench 72. The beam 63 is provided with at least one pushing member 631 along its length direction. A sliding seat 632 is fixed at one end of the beam 63, and the sliding seat 632 is slidably connected to the second guide rail 6. An overload detection component 64 is installed at the other end of the beam 63. The overload detection component 64 is in transmission cooperation with the linear module 61. Under the action of the linear module 61, the beam 63 can slide along the length direction of the second guide rail 6.

[0040] According to a specific embodiment provided by the present invention, the second guide rail 6 can adopt the structure of an existing linear slide rail, the length of the second guide rail 6 is greater than the length of the guide structure 644, the beam 63 is arranged perpendicular to the second guide rail 6, and is driven by the linear module 61 to move along the second guide rail 6, and at least one pushing member 631 is arranged along the moving side of the beam 63 along its length direction, and the number of the pushing members 631 corresponds to the number of material boxes 101. Specifically, the beam 63 has corresponding threaded holes, and the pushing member 631 is fixed by threaded fixing. The pushing member 631 is used to push the material to move. The pushing member 631 can be a push rod or a push plate or other structures, which shall be subject to the actual production product structure.

[0041] One end of the second guide rail 6 is slidably connected to the sliding seat 632. The specific structure of the sliding seat 632 is not limited. The sliding seat 632 is installed in the height direction so that the beam 63 is located above the second guide rail 6 and the linear module 61. In this embodiment, the overload detection component 64 is fixedly installed on the sliding seat 632. The linear module 61 includes a drive motor 611. The drive motor 611 drives the beam 63 to move along the second guide rail 6. When the product encounters resistance and the pusher 631 is subjected to external force, the return spring 648 is compressed, so that the beam 63 drives the connecting slider 645 to move along the guide structure 644 until the detection shaft 649 is disengaged from the hole of the photoelectric sensor 646. At this time, the photoelectric sensor 646 sends a signal.

[0042] The driving motor 611 can be a servo motor or a stepper motor. The linear module 61 has a moving seat 62. The overload detection component base plate is connected to the moving seat 62 through bolts. After the driving motor 611 works, the moving seat 62 can move and drive the beam 63 to move along the second guide rail 6.

[0043] Furthermore, the overload detection component 64 includes: A mounting seat 641, to which a first end plate 642 and a second end plate 643 are fixed, wherein the first end plate 642 and the second end plate 643 are arranged opposite to and located on the same side of the mounting seat 641; A guide structure 644 mounted on the mounting seat 641 , wherein the guide structure 644 is located between the first end plate 642 and the second end plate 643 ; and A connecting slider 645 slidably connected to the guide structure 644, the connecting slider 645 is fixed with a detection shaft 649, the second end plate 643 is fixedly mounted with a photoelectric sensor 646, and the first end plate 642 is fixedly mounted with a return spring 648; Among them, one side of the connecting slider 645 abuts against the return spring 648, and under the action of the return spring 648, the connecting slider 645 can cooperate with the photoelectric sensor 646, and when the connecting slider 645 slides away from the photoelectric sensor 646 and reaches the set position, the photoelectric sensor 646 can be triggered.

[0044] According to a specific embodiment provided by the present invention, the first end plate 642 and the second end plate 643 are fixedly installed on the upper part of the mounting seat 641. The first end plate 642 and the second end plate 643 can be respectively arranged at the two end positions of the mounting seat 641. The connecting slider 645 is slidably matched with the guide structure 644, so that the connecting slider 645 can move closer to the first end plate 642 (away from the second end plate 643) or away from the first end plate 642 (moving closer to the second end plate 643). Under the push of the return spring 648, the connecting slider 645 can be matched with the photoelectric sensor 646, and the photoelectric sensor 646 is installed on the second end plate 643. When the connecting slider 645 is pushed toward the first end plate 642 by an external force, the return spring 648 is compressed to contract. When the connecting slider 645 moves away from the photoelectric sensor 646 and reaches a preset position, the photoelectric sensor 646 can be triggered to generate a signal.

[0045] The end of the detection shaft 649 away from the connecting slider 645 is inserted into the photoelectric sensor 646. When the connecting slider 645 drives the detection shaft 649 to move, the end of the detection shaft 649 is disengaged from the hole of the photoelectric sensor 646. The spring guide shaft 647 is fixed on the first end plate 642. The end of the spring guide shaft 647 away from the first end plate 642 extends into the limiting hole opened by the connecting slider 645. The return spring 648 is sleeved on the spring guide shaft 647. Under the action of the return spring 648, the connecting slider 645 has a tendency to move away from the first end plate 642. The elastic coefficient of the return spring 648 can be selected according to the weight (friction force) of the product, and no specific restrictions are made here. The spring guide shaft 647 is parallel to the detection shaft 649. The guide structure 644 is a linear slide rail, which is arranged in parallel with the spring guide shaft 647. The linear slide rail is located below the connecting slider 645 and is fixed to the mounting seat 641 by bolts. The linear slide rail can adopt the existing structure. The length of the linear slide rail is not limited here and is subject to actual production needs.

[0046] Working principle of the material pushing device: the driving motor 611 drives the crossbeam 63 to move, and the push rod pushes the material forward. When the material is not stuck or runs smoothly, that is, when there is no overload, the detection shaft 649 and the photoelectric sensor 646 will not be separated from the induction detection, and the photoelectric sensor 646 will upload the non-overload switch value to the upper computer 73; When the material is stuck or does not run smoothly, that is, when an overload occurs, the connecting slider 645 moves back to press the return spring 648 to protect the product from damage, and the detection shaft 649 is separated from the photoelectric sensor 646 to generate a sensing signal, and the photoelectric sensor 646 uploads the overload switch value to the host computer 73.

[0047] Furthermore, the upper cavity 91 lifting assembly includes an upper cavity 91 fixing seat, a lifting seat 94 and an upper cavity 91 cylinder. The lifting seat 94 is fixed on the workbench 72, and the lifting seat 94 is arranged along the height direction. The upper cavity 91 fixing seat is slidably connected with the lifting seat 94. The upper cavity 91 fixing seat is fixed with the upper cavity 91. The upper cavity 91 cylinder is located below the upper cavity 91 fixing seat (the upper cavity 91 cylinder is not visible in the figure). When the upper cavity 91 cylinder is working, the upper cavity 91 is lifted away from the lower cavity 92, thereby making way for the material propulsion device to operate. The upper cavity 91 fixing seat and the upper cavity 91 will fall back to the upper part of the lower cavity 92 under gravity, and at the same time, the upper cavity 91 fixing seat is abutted against the output end of the upper cavity 91 cylinder. The upper cavity 91 cylinder is fixed on the lifting seat 94. After the upper cavity 91 cylinder is working, it can drive the upper cavity 91 fixing seat to move along the height direction of the lifting seat 94. This embodiment does not limit the specific structure of the fixing seat of the upper cavity 91 and the lifting seat 94. The actual production shall be based on the ability to install and fix the upper cavity 91 and the cylinder of the upper cavity 91.

[0048] Furthermore, material detection units (not visible in the figure) are respectively installed on both sides of the lower cavity 92. The material detection unit can be a photoelectric sensor 646. When the photoelectric sensor 646 is blocked, it generates an electrical signal and transmits the electrical signal to the upper computer 73 for recording. The photoelectric sensor 646 is set corresponding to the route through which each material passes. The photoelectric sensor 646 is installed on a long strip plate, and the long strip plate is fixed to the side of the lower cavity 92.

[0049] The processing steps of the present invention are as follows: S1, placing a material box 101 containing a sheet-shaped lead frame or substrate at a loading station, and starting a semiconductor device cleaning device; S2, after the loading assembly 8 rises to the set position, the material pushing device above the loading assembly 8 starts to move to push the lead frame or substrate onto the loading assembly line; S3, if there is no lead frame or substrate to be cleaned at the plasma cleaning component, the material pushing device pushes the lead frame or substrate to the plasma cleaning component for cleaning; if there is a lead frame or substrate being cleaned at the plasma cleaning component, the lead frame or substrate is pushed out to the unloading assembly line after cleaning is completed, and the material pushing device pushes the lead frame or substrate to the plasma cleaning component for cleaning; S4, after the lead frame or substrate is plasma cleaned, the material pushing device pushes the lead frame or substrate to the unloading assembly line, and then pushes it into the material box 101 of the unloading assembly 10 through the unloading assembly line operation.

[0050] Finally, it should be noted that in the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0051] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor device cleaning device, characterized in that: include: A frame assembly, the frame assembly comprising a lower frame and an upper frame hingedly mounted on the lower frame, the upper frame being coverable on the lower frame; and A workbench is arranged on the lower frame, on which a loading assembly, a plasma cleaning assembly and a unloading assembly are sequentially installed, wherein the loading assembly is used to transport materials to the plasma cleaning assembly, and the unloading assembly is used to receive materials from the plasma cleaning assembly; Among them, the plasma cleaning component includes an upper cavity, a lower cavity fixedly installed on a workbench, and a cleaning unit. The upper cavity is arranged above the lower cavity. The upper cavity is fixedly installed with an upper cavity lifting component. The upper cavity is covered or away from the lower cavity by the upper cavity lifting component. The cleaning unit is fixed to the workbench and is used to clean the materials located in the upper cavity and the lower cavity.

2. A semiconductor device cleaning device according to claim 1, characterized in that: The cleaning unit includes a radio frequency power supply for generating high-frequency AC electromagnetic waves and a radio frequency matcher for matching the impedance between the radio frequency power supply and the load. The radio frequency matcher is fixedly installed at the bottom of the workbench, and the radio frequency power supply is installed in the lower frame and is electrically connected to the radio frequency matcher.

3. A semiconductor device cleaning device according to claim 2, characterized in that: The loading assembly and the unloading assembly both include a material lifting platform for placing materials, a first motor, a first ball screw and a mounting frame fixedly installed on the workbench, the mounting frame is fixedly installed with two guide rods arranged parallel to each other, the guide rods are arranged along the height direction, the guide rods pass through the material lifting platform, the material lifting platform is transmission-connected to the first ball screw, the first ball screw is arranged between the two guide rods, the end of the first ball screw away from the material lifting platform is connected to the first motor, and the first motor is used to drive the material lifting platform to move along the guide rods.

4. A semiconductor device cleaning equipment according to any one of claims 1 to 3, characterized in that: The workbench is also equipped with a loading assembly line located downstream of the loading assembly and a unloading assembly line located upstream of the unloading assembly, and the loading assembly line and the unloading assembly line both include: A bottom plate fixed on the workbench, wherein the bottom plate is provided with two mutually parallel first guide rails along the length direction, and the bottom plate is slidably connected to the movable plate via the first guide rails; at least one fixed side component, the fixed side component being fixed to the base plate; A movable side component is arranged corresponding to the fixed side component, the movable side component is mounted on the movable plate, and a space for materials to pass through is reserved between the movable side component and the fixed side component; and A width adjustment component is installed on the bottom plate, and the width adjustment component is used to adjust the distance between the fixed side component and the movable side component.

5. A semiconductor device cleaning device according to claim 4, characterized in that: The width adjustment assembly includes a motor fixing plate fixed to one side of the bottom plate, a second motor, a second ball screw, a second pulley, a slider connecting seat, a screw fixing seat and a screw supporting seat; Among them, the second motor is installed on the motor fixing plate, and the first pulley is installed at the output end of the second motor. The screw fixing seat and the screw supporting seat are fixed on the bottom plate and are rotatably connected with the two ends of the second ball screw respectively. The second pulley is installed at one end of the second ball screw, and the second pulley is connected to the first pulley through a synchronous belt. The second ball screw is rotatably connected to the slider connecting seat, and the sliding connecting seat is fixed to the lower part of the movable plate.

6. A semiconductor device cleaning device according to claim 5, characterized in that: The fixed side component includes a second material guide plate, which is fixed to the bottom plate, and a guide component for guiding the movement of materials is installed on a side of the second material guide plate opposite to the movable side component. The movable side component includes a third material guide plate, which is fixed to the movable plate, and a guide component for guiding the movement of materials is installed on a side of the second material guide plate opposite to the fixed side component.

7. A semiconductor device cleaning device according to claim 6, characterized in that: The workbench is also equipped with a material pushing device for pushing materials, and the material pushing device is located above the loading component and the plasma cleaning component. The material pushing device includes a second guide rail, a linear module and a beam fixed on the workbench, and the beam is provided with at least one pushing member along its length direction. A sliding seat is fixed at one end of the beam, and the sliding seat is slidably connected to the second guide rail. An overload detection component is installed at the other end of the beam, and the overload detection component is matched with the linear module in transmission. Under the action of the linear module, the beam can slide along the length direction of the second guide rail.

8. A semiconductor device cleaning device according to claim 7, characterized in that: The overload detection component comprises: A mounting seat, the mounting seat being fixed with a first end plate and a second end plate, the first end plate and the second end plate being arranged opposite to and located on the same side of the mounting seat; a guide structure mounted on the mounting seat, the guide structure being located between the first end plate and the second end plate; and A connecting slider slidably connected to the guide structure, the connecting slider is fixed with a detection shaft, the second end plate is fixedly mounted with a photoelectric sensor, and the first end plate is fixedly mounted with a return spring; One side of the connecting slider is in contact with the return spring, and under the action of the return spring, the connecting slider can cooperate with the photoelectric sensor, and the photoelectric sensor can be triggered when the connecting slider slides away from the photoelectric sensor and reaches a set position.

9. A semiconductor device cleaning device according to claim 8, characterized in that: The upper cavity lifting assembly includes an upper cavity fixing seat for fixing the upper cavity, a lifting seat and an upper cavity cylinder fixed on the lifting seat. The lifting seat is fixed to the workbench, and the lifting seat is arranged along the height direction. The upper cavity fixing seat is slidably connected with the lifting seat. The upper cavity fixing seat abuts against the output end of the upper cavity cylinder. The upper cavity cylinder is used to drive the upper cavity fixing seat to move along the height direction of the lifting seat.

10. The semiconductor device cleaning equipment according to claim 9, characterized in that: Material detection units are respectively installed on both sides of the lower cavity, and the material detection units are used to detect whether the material passes through.

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