Wet tissue cover not prone to glue overflowing and bonding technology

Abstract

The invention provides a wet tissue cover not prone to glue overflowing and a bonding technology, and belongs to the technical field of wet tissue packaging, a circle of anti-overflow groove for preventing glue overflowing is formed in the outer edge of the bottom face of a cover body, a gluing part is formed on the inner side of the anti-overflow groove, and a blocking part is formed on the outer side of the anti-overflow groove; the bonding process comprises the steps of cover feeding and positioning, gluing, bonding, cooling and curing. According to the scheme, the anti-overflow grooves with the two side faces different in height are formed in the gluing part, appropriate pressure is applied when the bottom face of the cover and the wet tissue wrapping film are bonded through optimization of technological conditions and control over the gluing amount, redundant glue is effectively collected in the anti-overflow grooves, meanwhile, the bonding area of the glue is increased, and the gluing effect is improved. Therefore, the problem of glue overflow during bonding of the wet tissue sealing cover is effectively solved, the high quality of a product is guaranteed, and the use experience of a user is remarkably improved.

Description

Technical Field

[0001] The invention relates to the technical field of wet wipes packaging, and in particular to a wet wipes cover that is not prone to glue overflow and a bonding process. Background Art

[0002] The advent of wet wipes not only meets people's needs for hygiene, but also significantly improves the quality of life. Wet wipes come in a wide variety of types and specifications to suit different usage scenarios. For example, large-capacity packages for household use (such as 80 pieces) are designed for multiple uses over a long period of time. In order to ensure that the unused wet wipes remain moist, such large packages of wet wipes are usually equipped with a sealing cap to maintain the humidity inside the package.

[0003] However, in the production process of traditional wet wipes lids currently on the market, the application and bonding of the colloid often face the problem of improper glue control, and the existing sealing lids are also difficult to meet this production demand. In the process of bonding and extrusion, the problem of glue overflow is particularly prominent. This will not only affect the appearance of the products produced, but may even cause unnecessary adhesion between products, affecting product sales. The existing bonding technology for wet wipes lids still has obvious limitations in glue control and glue coating methods. It is urgent to develop a more precise and efficient bonding process to effectively solve the problem of glue overflow and further improve the overall quality of the product and user experience. Summary of the invention

[0004] The object of the present invention is to provide a wet wipes cover which is not prone to glue overflow and a bonding process, so as to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides a wet wipes cover which is not easy to overflow glue, adopting the following technical scheme:

[0006] The cover body is provided with a circle of anti-overflow groove at the outer edge of the bottom surface to prevent glue overflow. The inner side of the anti-overflow groove forms a glue coating part, and the outer side of the anti-overflow groove forms a barrier part, so that when the glue coating part is glued and attached to the wet wipes package, excess colloid is collected in the anti-overflow groove without overflowing.

[0007] As a further improvement, the thickness of the barrier portion is greater than the thickness of the adhesive coating portion, so that during lamination, the barrier portion contacts the wet wipes package first.

[0008] As a further improvement, the thickness of the glue coating portion is half of the thickness of the barrier portion.

[0009] The present invention also provides a bonding process that is not prone to glue overflow, using the wet wipes cover that is not prone to glue overflow, comprising the following steps:

[0010] Feeding and positioning the cap, conveying the cap body to the grabbing device, accurately controlling the alignment of the cap body and the wet wipes film through machinery or sensors, and the grabbing device grabs the cap body to the glue coating position;

[0011] Glue coating: use a hot melt glue machine to melt the hot melt glue, and evenly apply the melted glue on the bottom surface of the glue coating part;

[0012] After gluing, the grabbing device grabs the cover body to the fitting position, and applies pressure to tightly press the gluing part onto the wet wipes film, so that the barrier part completely fits the wet wipes film, and the excess colloid is collected in the anti-overflow groove under the action of the barrier part without overflowing;

[0013] Cooling and solidification. After the lamination is completed, the colloid cools and solidifies naturally at room temperature to form an adhesive layer, which firmly bonds the cover body to the wet wipes package.

[0014] As a further improvement, in the gluing step, the viscosity of the hot melt adhesive is 5500-8000 pcs.

[0015] As a further improvement, in the gluing step, the heating parameters of the hot melt glue machine are 175°C for the glue cylinder, 180°C for the throat, and 185°C for the gun head.

[0016] As a further improvement, in the laminating step, pressure is applied to make the cover body fit the wet wipes package, and the pressure under this pressure is 134.093 kPa-167.616 kPa.

[0017] As a further improvement, the open time of the hot melt adhesive after melting is greater than the sum of the time of the gluing step and the time of the laminating step.

[0018] The beneficial effects of the above technical solution of the present invention are as follows:

[0019] This solution sets a circle of anti-overflow groove at the outer edge of the bottom surface of the lid, and combines it with a new bonding process. By optimizing the process conditions and controlling the amount of glue applied, appropriate pressure is applied when bonding the bottom surface of the lid and the wet wipes package, so that excess colloid is effectively collected in the anti-overflow groove, while increasing the bonding area of ​​the colloid, thereby effectively solving the problem of glue overflow when bonding the wet wipes sealing cover, which not only ensures the high quality of the product, but also significantly improves the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By reading the following detailed description with reference to the accompanying drawings, the above and other objects, features and advantages of the exemplary embodiments of the present invention will become readily understood. In the accompanying drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0021] Figure 1 A top view of the cover body of the present invention;

[0022] Figure 2 for Figure 1 AA section view in;

[0023] Figure 3 for Figure 2 Enlarged view of middle B;

[0024] Figure 4 A schematic diagram of the bonding process provided by the present invention;

[0025] Figure 5 for Figure 4 A is a schematic diagram of the situation (1) in which the figure is enlarged;

[0026] Figure 6 for Figure 4 A is a schematic diagram of the situation (2) in the enlarged view of FIG.

[0027] Figure 7 for Figure 4 Schematic diagram of the situation (3) in which A is enlarged.

[0028] Description of reference numerals:

[0029] 1. Lid body; 2. Anti-overflow groove; 3. Gluing part; 4. Barrier part; 5. Grabbing device; 6. Hot melt glue machine; 7. Wet wipes packaging. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Those skilled in the art should know that the embodiments described below are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0032] This solution optimizes the bonding process and combines it with a new wet wipes cover to design an anti-overflow groove 2 at the outer edge of the bottom surface of the wet wipes cover. When bonding the sealing cover, pressure is applied, and the barrier part 4 and the glue coating part 3 are pressed on the wet wipes package 7 in sequence, so that excess colloid enters the anti-overflow groove 2, increasing the bonding area between the cover body 1 and the wet wipes package 7 and increasing the bonding strength; in addition, the barrier part 4 forms a greater blocking pressure on the wet wipes package 7 than the glue coating part 3, effectively avoiding the problem of glue overflow when bonding the wet wipes sealing cover.

[0033] After introducing the basic principle of the present invention, various non-limiting embodiments of the present invention are described in detail below. The number of any element in the drawings is for illustration and not for limitation, and any naming is only for distinction and does not have any limiting meaning.

[0034] The principle and spirit of the present invention are explained in detail below with reference to several representative embodiments of the present invention.

[0035] An embodiment of a wet wipes cover that is not prone to glue overflow provided by the present invention:

[0036] like Figure 1-3 As shown, a wet wipes cover that is not easy to overflow glue comprises a cover body 1, and a circle of anti-overflow groove 2 is provided at the outer edge of the bottom surface thereof to prevent glue overflow, and a glue coating part 3 is formed inside the anti-overflow groove 2, and a barrier part 4 is formed outside the anti-overflow groove 2. Among them, the thickness L2 of the barrier part 4 is greater than the thickness L1 of the glue coating part 3. The key to this design is that when the wet wipes cover is glued, the barrier part 4 and the glue coating part 3 are pressed on the wet wipes film 7 in sequence, and the barrier part 4 forms a greater pressure on the wet wipes film 7 than the glue coating part 3, which effectively prevents the colloid flowing into the anti-overflow groove 2 from overflowing, and avoids adhesion between products.

[0037] In this embodiment, the thickness relationship between the glue coating part 3 and the barrier part 4 is 2L1=L2, the glue capacity of the anti-overflow groove 2 is less than or equal to 70% of the total glue capacity of the bottom surface of the cover body 1, and the total glue capacity of the bottom surface of the cover body 1 (that is, the sum of the glue capacity of the bottom surface S1 of the glue coating part 3 and the glue capacity of the anti-overflow groove 2) is 100%.

[0038] like Figure 5-7 As shown, when the wet wipes cover is glued, the adhesive coating part 3 and the barrier part 4 are pressed on the wet wipes film 7, which may produce several different situations: (1) Figure 5 As shown, the wet wipes package 7 corresponding to the overflow prevention groove 2 forms a slope; (2) as Figure 6 As shown, the wet tissue package 7 corresponding to the overflow prevention groove 2 is pressed against the top S2 in the overflow prevention groove 2 due to the extrusion protrusion; (3) Figure 7 As shown, the wet tissue packaging film 7 corresponding to the overflow prevention groove 2 occupies part of the space in the overflow prevention groove 2 due to the extrusion protrusion.

[0039] In summary, no matter which situation is used, it is ensured that the barrier portion 4 forms a barrier force on the wet wipes package 7 to prevent the colloid from overflowing, while taking into account the bonding area of ​​the colloid between the anti-overflow groove 2 and its corresponding wet wipes package 7, thereby increasing the bonding strength of the cover body 1.

[0040] like Figure 4 As shown, the present invention also provides a bonding process that is not easy to overflow glue, using the above-mentioned wet wipes cover that is not easy to overflow glue, comprising the following steps:

[0041] Cap delivery and positioning: the cap body 1 is delivered to the positioning position, and the cap body 1 is precisely aligned with the wet wipes film 7 by mechanical or sensor control;

[0042] Gluing: the grabbing device 5 grabs the cover to the gluing location, uses the hot melt glue machine 6 to melt the hot melt glue, and evenly spreads the melted glue on the bottom surface of the gluing portion 3;

[0043] After the gluing is completed, the gripping device 5 grabs the cover body 1 to the fitting position, and applies pressure to tightly press the gluing part 3 onto the wet wipes film 7, so that the barrier part 4 is completely fitted to the wet wipes film 7, and the pressure forces the excess semi-solidified colloid to flow into the anti-overflow groove 2, and does not overflow under the action of the barrier part 4;

[0044] Cooling and solidifying: After the lamination is completed, the colloid is naturally cooled and solidified at room temperature to form an adhesive layer, which firmly bonds the cover body 1 to the wet wipes packaging film 7.

[0045] During the cap feeding and positioning steps, ensure that it is aligned with the wet wipes film 7, which can avoid errors and ensure the accurate installation position of the cap body 1 on the wet wipes film 7;

[0046] In the gluing step, the gripping device 5 is a suction cup, and the heating parameters of the hot melt glue machine 6 are set to 175°C for the glue cylinder, 180°C for the throat, and 185°C for the gun head, respectively, to ensure that the hot melt glue can reach an ideal flow state without decomposition; the hot melt glue used is a hot melt glue with a viscosity of 5500-8000pcs. This type of hot melt glue can maintain good fluidity and bonding performance under the above temperature conditions due to its specific viscosity characteristics, while avoiding blockage caused by too high viscosity or waste caused by too low viscosity;

[0047] In this embodiment, the amount of glue applied on the bottom surface S1 of the glue-coating portion 3 is controlled to account for about 30% of the total glue capacity of the bottom surface of the cover body 1. In order to ensure the bonding quality of the product, a margin is often designed during glue application in actual production. Due to errors, when the amount of glue applied is greater than 30%, the glue will flow from the bottom surface S1 of the glue-coating portion 3 to the anti-overflow groove 2 during bonding, ensuring that the glue-coating portion 3 is evenly and appropriately covered with a glue layer to prevent overflow pollution caused by excessive glue.

[0048] like Figure 4As shown, in the laminating step, pressure is applied to make the cover body 1 fit the wet wipes package 7, and the pressure P1 under this pressure is 134.093kPa-167.616kPa. This pressure range can not only match the design of the anti-overflow groove 2, driving the colloid to flow into the anti-overflow groove 2, but also provide an effective blocking force for the flowing colloid to prevent the colloid from overflowing, ensuring that the cover has sufficient bonding strength; at the same time, it can also avoid deformation of the cover due to excessive pressure and reduce the production of defective products.

[0049] In the above-mentioned adhesive bonding process that is not prone to glue overflow, the open time of the hot melt adhesive after heating and melting is greater than the sum of the glue coating step time and the bonding step time, so as to ensure that the adhesive can maintain good bonding performance during the glue coating and bonding process.

[0050] In this embodiment, a production device with a machine speed of 50-100 packs / min is used, and the production time of each pack of products is 0.6-1.2s. The time for the suction cup to absorb the cover to the gluing place accounts for 10%-25%, the gluing time to the bottom surface S1 of the gluing part 3 accounts for 20%-40%, the movement time of the suction cup from the gluing place to the wet wipes package 7 accounts for 10%-25%, and the time for the cover body 1 to bond the wet wipes package 7 accounts for 20%-40%. The colloid opening time needs to be greater than the sum of the gluing time, the movement time and the bonding time, that is, the colloid opening time accounts for more than 75%-90% of the production time of each pack of products.

[0051] In the above-mentioned adhesive bonding process that is not prone to glue overflow, any mechanical device or mechanical structure used, including the gripping device 5, the hot melt adhesive machine 6 and the glue coating device, etc., are all existing technologies and will not be described in detail here.

[0052] The above-mentioned ideal embodiments of the present invention are used as inspiration, but it is obvious to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art will think of many changes, modifications and alternatives without departing from the thought and spirit of the present invention. It should be understood that in the process of practicing the present invention, various alternatives to the embodiments of the present invention described herein may be adopted. The attached claims are intended to define the scope of protection of the present invention, and therefore cover the modular composition, equivalent or alternatives within the scope of protection of these claims.

Claims

1. A wet wipes cover that is not easy to overflow glue, characterized in that: include: The lid body (1) is provided with a circle of anti-overflow groove (2) at the outer edge of the bottom surface thereof for preventing glue from overflowing, the inner side of the anti-overflow groove (2) forms a glue coating part (3), and the outer side of the anti-overflow groove (2) forms a barrier part (4), so that when the glue coating part is glued and attached to the wet tissue packaging film (7), excess glue is collected in the anti-overflow groove (2) and does not overflow.

2. The wet wipes cover that is not easy to overflow glue according to claim 1, characterized in that: The thickness of the barrier portion (4) is greater than the thickness of the adhesive coating portion (3), so that during lamination, the barrier portion contacts the wet wipes packaging film first.

3. The wet wipes cover that is not easy to overflow glue according to claim 2, characterized in that: The thickness of the glue coating part (3) is half the thickness of the barrier part (4).

4. A non-overflow adhesive bonding process, using the non-overflow adhesive wet wipes cover according to any one of claims 1 to 3, characterized in that: The following steps are involved: Feeding and positioning the cover, conveying the cover body (1) to the gripping device (5), accurately controlling the alignment of the cover body (1) and the wet wipes film (7) through machinery or sensors, and the gripping device (5) grips the cover body (1) to the glue coating position; Gluing: using a hot melt glue machine (6) to melt the hot melt glue, and evenly smearing the melted glue on the bottom surface of the glue coating part (3); After the gluing is completed, the gripping device (5) grips the cover body (1) to the fitting position and applies pressure to tightly press the gluing portion (3) onto the wet tissue film (7), so that the barrier portion (4) is completely fitted onto the wet tissue film (7), and the excess colloid is collected in the anti-overflow groove (2) under the action of the barrier portion (4) without overflowing; After cooling and solidification, the colloid is naturally cooled and solidified at room temperature to form an adhesive layer, which firmly bonds the cover body (1) to the wet wipes packaging film (7).

5. The adhesive bonding process with no glue overflow according to claim 4, characterized in that: In the gluing step, the viscosity of the hot melt adhesive is 5500-8000 pcs.

6. The adhesive bonding process with no glue overflow according to claim 4, characterized in that: In the gluing step, the heating parameters of the hot melt glue machine (6) are respectively 175°C for the glue cylinder, 180°C for the throat, and 185°C for the gun head.

7. The adhesive bonding process with no glue overflow according to claim 4, characterized in that: In the laminating step, pressure is applied to make the cover body fit the wet wipes package, and the pressure under this pressure is 134.093 kPa-167.616 kPa.

8. The adhesive bonding process with no glue overflow according to claim 4, characterized in that: The colloid open time after the hot melt adhesive is melted is greater than the sum of the gluing step time and the laminating step time.

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