Cooling device, transmission chamber and semiconductor equipment

Abstract

The invention provides a cooling device, a transmission chamber and a semiconductor device, the cooling device is used for cooling a wafer in the semiconductor device, and the cooling device comprises a gas transmission assembly, a support assembly and a gas supply assembly; the gas transmission assembly is communicated with the gas supply assembly and can be communicated with a gas source of cooling gas, and the gas transmission assembly is used for transmitting the cooling gas to the gas supply assembly; the air supply assembly is in a ring shape with an avoiding opening in one side, and the avoiding opening is used for avoiding a transmission device used for transmitting wafers in the semiconductor equipment. At least part of the supporting assembly is located on the ring inner side of the air supply assembly and used for supporting a wafer on the ring inner side of the air supply assembly; the gas supply assembly is used for conveying cooling gas to the wafer from the circumferential outer side of the wafer. According to the cooling device, the transmission chamber and the semiconductor equipment provided by the invention, the potential safety hazard of the semiconductor equipment can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a cooling device, a transmission chamber and a semiconductor device. Background Art

[0002] The reaction temperature of the Chemical Vapor Deposition (CVD) process is usually high (usually above 1000° C.). Therefore, the temperature of the wafer after the CVD process is usually high and needs to be cooled before subsequent processes can be performed.

[0003] An existing method of cooling wafers after a chemical vapor deposition process is to set a water cooling plate in the transfer chamber of the chemical vapor deposition equipment. After the chemical vapor deposition process is completed, the wafer is placed on the water cooling plate by a robot in the transfer chamber. Cooling water flows through the water cooling plate, and the cooling water takes away the heat of the wafer, thereby cooling the wafer after the chemical vapor deposition process.

[0004] However, since cooling water flows into the water cooling plate, there is an inevitable risk of leakage. Electronic components of the chemical vapor deposition equipment, such as sensors, are arranged under the water cooling plate. Once the water cooling plate leaks, the electronic components, such as sensors under the water cooling plate, may fail, and may even cause a short circuit in the circuit, which poses a great safety hazard to the chemical vapor deposition equipment. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a cooling device, a transfer chamber and a semiconductor device, which can reduce the safety hazards of the semiconductor device.

[0006] To achieve the purpose of the present invention, a cooling device is provided for cooling wafers in semiconductor equipment, the cooling device comprising a gas delivery component, a support component and a gas delivery component;

[0007] The gas delivery component is in communication with the gas supply component and can be in communication with a gas source of cooling gas, and the gas delivery component is used to deliver the cooling gas to the gas supply component;

[0008] The air delivery component is in a ring shape with a avoidance opening on one side, and the avoidance opening is used to avoid a transmission device for transmitting wafers in the semiconductor equipment;

[0009] At least a portion of the support assembly is located inside the ring of the gas delivery assembly, and is used to support the wafer inside the ring of the gas delivery assembly;

[0010] The gas delivery component is used to deliver the cooling gas to the wafer from the outer side of the wafer.

[0011] Optionally, the air supply component includes an assembly component and multiple air supply components, the assembly component is in a ring shape with the avoidance port on one side, the multiple air supply components are assembled on the assembly component at intervals along the circumference of the assembly component, and are all connected to the gas delivery component, and the multiple air supply components are used to deliver the cooling gas to the wafer from multiple positions outside the circumference of the wafer one by one.

[0012] Optionally, the air delivery component is provided with a plurality of air delivery holes, and the plurality of air delivery holes are arranged at intervals along the circumference of the assembly component, and the air delivery component delivers the cooling gas to the wafer through the air delivery holes.

[0013] Optionally, the interior of the assembly component has an assembly cavity, which is annular and extends along the circumference of the assembly component, and the side of the assembly cavity facing the inner side of the assembly component ring is open, and a plurality of the air supply components are installed in the assembly cavity at intervals, and the air supply holes face the opening of the assembly cavity.

[0014] Optionally, the assembly parts include a first assembly part, a second assembly part and a third assembly part, the first assembly part and the second assembly part are both in a ring shape with the avoidance opening on one side, the first assembly part and the second assembly part are arranged opposite to each other and at intervals, the assembly cavity is formed between the first assembly part and the second assembly part, the third assembly part covers the opening of the assembly cavity, and the third assembly part is provided with a plurality of matching holes, and the plurality of matching holes are arranged one-to-one correspondingly to all the air supply holes of all the air supply parts.

[0015] Optionally, the aperture of the matching hole is the same as the aperture of the air supply hole.

[0016] Optionally, the support assembly includes multiple support components, and the multiple support components are arranged at intervals along the circumference of the air supply assembly, and at least part of the support components are located on the inner side of the ring of the air supply assembly. The multiple support components are used to jointly support the wafer on the inner side of the ring of the air supply assembly.

[0017] Optionally, the supporting component is arranged at the bottom of the air supply assembly.

[0018] Optionally, the supporting component includes a connecting member and a supporting member, the connecting member is detachably connected to the air supply assembly, the supporting member is arranged on the connecting member and is at least partially located on the inner side of the ring of the air supply assembly for supporting the wafer.

[0019] Optionally, the support member is rod-shaped, and at least a portion of the support member in the axial direction is located inside the ring of the air supply assembly, so as to contact the wafer and support the wafer.

[0020] Optionally, the gas delivery assembly includes multiple gas delivery components, and the multiple gas delivery components are connected to the multiple gas supply components one-to-one and are all connected to the gas source. The multiple gas delivery components are used to deliver the cooling gas to the multiple gas supply components one-to-one.

[0021] Optionally, the gas delivery assembly further includes a plurality of flow control components, and the plurality of gas delivery components are connected to the gas source through the plurality of flow control components one by one, and the flow control components are used to control the flow of the cooling gas flowing from the gas source to the corresponding gas delivery components.

[0022] Optionally, the gas delivery component includes a flexible hose.

[0023] Optionally, the cooling device further includes a lifting component, which is connected to the air supply component and is used to drive the air supply component to rise and fall.

[0024] Optionally, the lifting assembly includes a driving source, a lifting shaft and a telescopic tube. The driving source is connected to the air supply assembly via the lifting shaft, and is used to drive the lifting shaft to lift and lower, thereby driving the air supply assembly to lift and lower. The telescopic tube is disposed outside the lifting shaft and is respectively connected to the driving source and the air supply assembly.

[0025] Optionally, the cooling device further includes a temperature measuring component for detecting the temperature of the wafer supported by the supporting component.

[0026] Optionally, the cooling device also includes: a wafer carrying part, which is located below the supporting assembly and is used to carry the wafer when the lifting assembly drives the air supply assembly to drive the wafer to descend until the lower surface of the wafer contacts the wafer carrying part.

[0027] Optionally, the wafer carrying part includes a carrying platform and a plurality of temperature measuring holes penetrating the carrying platform;

[0028] The temperature measuring component includes a plurality of temperature measuring components, each of which corresponds to one temperature measuring hole, and the temperature measuring component detects the temperature of the wafer through the temperature measuring hole.

[0029] Optionally, a plurality of protrusions are further provided on a side of the supporting platform facing the wafer, and the plurality of protrusions are used to jointly support the wafer.

[0030] Optionally, a plurality of first accommodating grooves are further provided on the side of the carrier platform facing the wafer, and the plurality of first accommodating grooves are arranged at intervals along the circumference of the carrier platform, and the first accommodating grooves are open on the side facing the outer periphery of the carrier platform, and the plurality of first accommodating grooves correspond one by one to accommodate the plurality of supporting components.

[0031] Optionally, a plurality of the temperature measuring components are arranged at intervals along a circumferential direction, and each of the temperature measuring components is arranged corresponding to at least one of the air supply components.

[0032] The present invention also provides a transfer chamber, comprising a chamber body, a transfer device and the cooling device provided by the present invention, wherein the transfer device is arranged in the chamber body for transferring wafers, and the cooling device is arranged in the transfer chamber for supporting and cooling the wafers.

[0033] The present invention also provides a semiconductor device, comprising a reaction chamber such as the transfer chamber provided by the present invention, wherein the reaction chamber is used to perform semiconductor process reactions, the transfer chamber is connected to the reaction chamber, the transfer device in the transfer chamber is used to transfer wafers to the reaction chamber, or to take out the wafers in the reaction chamber, and the cooling device in the transfer chamber is used to cool the wafers.

[0034] The present invention has the following beneficial effects:

[0035] The cooling device provided by the present invention comprises a gas transmission component, a support component and an air supply component. By connecting the gas transmission component with the air supply component and connecting the gas transmission component with a gas source of cooling gas, the cooling gas of the gas source can be transported to the gas supply component with the help of the gas transmission component. By making the gas supply component annular with a avoidance opening on one side and making at least a part of the support component located on the inner side of the ring of the gas supply component, the wafer can be transferred between the transmission device and the part of the support component located on the inner side of the ring of the gas supply component, and the cooling gas can be transported to the wafer from the outer side of the wafer with the help of the air supply component to cool the wafer. Therefore, with the help of the cooling device provided by the present invention, the wafer can be air-cooled (air-cooled), and then the problem of liquid (water) leakage caused by liquid cooling (water cooling) can be avoided. Further, with the help of the cooling device provided by the present invention, the wafer in the semiconductor device can be cooled, which can reduce the safety hazards of the semiconductor device.

[0036] The transfer chamber provided by the present invention, by arranging the cooling device provided by the present invention in the transfer chamber, can use the cooling device provided by the present invention to cool the wafers transferred to the transfer chamber through the transfer device in the transfer chamber, thereby reducing the safety hazards of the transfer chamber and further reducing the safety hazards of semiconductor equipment.

[0037] The semiconductor equipment provided by the present invention, with the aid of the transmission chamber provided by the present invention, can use the cooling device provided by the present invention to cool the wafers transmitted to the transmission chamber through the transmission device in the transmission chamber, thereby reducing the safety hazards of the transmission chamber and further reducing the safety hazards of the semiconductor equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A schematic diagram of the structure of a cooling device provided by an embodiment of the present invention;

[0039] Figure 2 A schematic diagram of the structure of an air supply assembly and a lifting assembly provided in an embodiment of the present invention;

[0040] Figure 3 A schematic diagram of the structure of an air delivery assembly and an air delivery component provided in an embodiment of the present invention;

[0041] Figure 4 A schematic diagram of the structure of the assembly components and the support assembly provided by the embodiment of the present invention;

[0042] Figure 5 A partial enlarged structural schematic diagram of an assembly component and a support assembly provided in an embodiment of the present invention;

[0043] Figure 6 A schematic diagram of the structure of the gas delivery component and the corresponding gas delivery assembly provided in an embodiment of the present invention;

[0044] Figure 7 A schematic diagram of the structure of a cooling device, a transmission chamber and a semiconductor device provided by an embodiment of the present invention;

[0045] Description of reference numerals:

[0046] 1-cooling device; 11-gas delivery assembly; 111-gas delivery component; 112-flow control component;

[0047] 113-first air intake component; 114-second air intake component; 121-support component; 122-connecting member;

[0048] 123-supporting member; 124-screw hole; 13-air supply assembly; 131-avoidance; 132-assembly component;

[0049] 133, 133A, 133B, 133C, 133D-air delivery component; 1331-air delivery hole; 134-assembly cavity; 135-first assembly part; 136-second assembly part; 137-third assembly part; 1371-matching hole; 14-lifting component; 141-driving source; 142-telescopic tube; 15-wafer bearing part;

[0050] 151-carrying platform; 152a, 152b, 152c, 152d, 152e-temperature measuring holes; 153-second containing tank; 154-first containing tank; 3-semiconductor equipment; 31-transfer chamber; 32-reaction chamber; 33-loading system; 34-front module; 35-vacuum transmission system; 36-alignment device; 37-transfer device. DETAILED DESCRIPTION

[0051] In order to enable those skilled in the art to better understand the technical solution of the present invention, the cooling device, the transmission chamber and the semiconductor equipment provided by the present invention are described in detail below with reference to the accompanying drawings.

[0052] like Figure 1 , Figure 2-Figure 4 and Figure 7 As shown, an embodiment of the present invention provides a cooling device 1 for cooling wafers in a semiconductor device 3, and the cooling device 1 includes a gas delivery component 11, a support component and a gas supply component 13; the gas delivery component 11 is connected to the gas supply component 13, and can be connected to a gas source of the cooling gas, and the gas delivery component 11 is used to deliver cooling gas to the gas supply component 13; the gas supply component 13 is annular with a avoidance port 131 on one side, and the avoidance port 131 is used to avoid a transmission device 37 for transmitting wafers in the semiconductor device 3; at least a part of the support component can be located on the inner side of the ring of the gas supply component 13, and is used to support the wafer on the inner side of the ring of the gas supply component 13; the gas supply component 13 is used to deliver cooling gas to the wafer from the outer side of the wafer.

[0053] The cooling device 1 provided in the embodiment of the present invention comprises a gas transmission component 11, a support component and an air supply component 13. By connecting the gas transmission component 11 with the air supply component 13, and connecting the gas transmission component 11 with the gas source of the cooling gas, the cooling gas of the gas source can be delivered to the air supply component 13 with the help of the gas transmission component 11. By making the air supply component 13 annular with a avoidance opening 131 on one side, and making at least a part of the support component located on the inner side of the ring of the air supply component 13, the wafer can be transferred between the transmission device 37 and the part of the support component located on the inner side of the ring of the air supply component 13, and the cooling gas can be delivered to the wafer from the outer side of the wafer with the help of the air supply component 13 to cool the wafer. Therefore, with the help of the cooling device 1 provided in the embodiment of the present invention, the wafer can be air-cooled (air-cooled), and then the liquid (water) leakage problem caused by the liquid cooling (water cooling) device can be avoided. Then, with the help of the cooling device 1 provided in the embodiment of the present invention, the wafer in the semiconductor device 3 can be cooled, and the safety hazard of the semiconductor device 3 can be reduced.

[0054] In actual applications, the semiconductor device 3 may include multiple chambers, and a transmission device 37 may be provided in the semiconductor device 3. The transmission device 37 can transmit wafers between the chambers. By raising and lowering the transmission device 37 and / or raising and lowering the gas delivery component 13, the wafers can be transferred between the transmission device 37 and the support component through the cooperation between the transmission device 37 and the support component. By making the gas delivery component 13 annular with a avoidance opening 131 on one side for avoiding the transmission device 37, interference between the gas delivery component 13 and the transmission device 37 can be avoided during the process of raising and lowering the transmission device 37 and / or raising and lowering the gas delivery component 13, so that the part of the transmission device 37 that carries the wafer can be on the inner side of the ring of the gas delivery component 13, so that the wafer can be transferred between the transmission device 37 and the part of the support component located on the inner side of the ring of the gas delivery component 13. When the part of the support assembly located inside the ring of the air supply assembly 13 supports the wafer, the wafer is located inside the ring of the air supply assembly 13, and the air supply assembly 13 is located outside the periphery of the wafer, so that cooling gas can be transported to the wafer from the periphery of the wafer with the help of the air supply assembly 13, thereby improving the uniformity of wafer cooling and avoiding partial sudden cooling of the wafer, thereby improving the cooling effect of the wafer and improving the effect of subsequent semiconductor processes of the wafer.

[0055] like Figure 1-Figure 5 As shown, in one embodiment of the present invention, the air delivery component 13 may include an assembly component 132 and a plurality of air delivery components 133. The assembly component 132 is in a ring shape (such as a C-shaped ring in the figure) with an avoidance opening 131 on one side. The plurality of air delivery components 133 are assembled on the assembly component 132 at intervals along the circumference of the assembly component 132, and are all connected to the gas delivery component 11. The plurality of air delivery components 133 are used to deliver cooling gas to the wafer from a plurality of positions on the outer side of the wafer circumference in a one-to-one manner.

[0056] By making the assembly component 132 an annular shape with an avoidance opening 131 on one side, the assembly component 132 can be prevented from interfering with the transmission device 37 during the lifting and lowering of the transmission device 37 and / or the lifting and lowering of the gas supply component 13, so that the part of the transmission device 37 that carries the wafer can be located inside the ring of the assembly component 132, so that the wafer can be transferred between the transmission device 37 and the part of the support component located inside the ring of the assembly component 132. By making the gas supply component 13 include a plurality of gas supply components 133, and making the plurality of gas supply components 133 be assembled on the assembly component 132 along the circumferential interval of the assembly component 132, cooling gas can be delivered to the wafer from multiple positions outside the wafer circumference in a one-to-one correspondence with the plurality of gas supply components 133, thereby improving the uniformity of wafer cooling. In addition, the uniformity of wafer cooling can be further improved by controlling the flow rate of cooling gas delivered to the wafer by each gas supply component 133.

[0057] like Figure 3As shown, optionally, the number of the air supply components 133 may be four. However, the number of the air supply components 133 is not limited thereto.

[0058] like Figure 6 As shown, in one embodiment of the present invention, the air delivery component 133 may be provided with a plurality of air delivery holes 1331 , and the plurality of air delivery holes 1331 are arranged at intervals along the circumference of the assembly component 132 , and the air delivery component 133 delivers cooling gas to the wafer through the air delivery holes 1331 .

[0059] That is to say, the cooling gas entering the air delivery component 133 can be discharged from the interior of the air delivery component 133 through the air delivery holes 1331, and thus delivered to the wafer. By arranging a plurality of air delivery holes 1331 on the air delivery component 133, and arranging the plurality of air delivery holes 1331 at circumferential intervals along the assembly component 132, the cooling gas can be delivered to the wafer at circumferential intervals along the assembly component 132 through the plurality of air delivery holes 1331, thereby improving the uniformity of wafer cooling.

[0060] like Figure 4 As shown, in one embodiment of the present invention, the interior of the assembly component 132 may have an assembly cavity 134, the assembly cavity 134 is annular and extends along the circumference of the assembly component 132, and the side of the assembly cavity 134 facing the inner side of the ring of the assembly component 132 is open, and a plurality of air supply components 133 are installed in the assembly cavity 134 at intervals, and the air supply holes 1331 face the opening of the assembly cavity 134.

[0061] By assembling a plurality of gas supply components 133 at intervals in the assembly cavity 134, the assembly stability of the plurality of gas supply components 133 can be improved. By making the gas supply hole 1331 face the opening of the assembly cavity 134, since the opening of the assembly cavity 134 is located on the side of the assembly cavity 134 facing the inner side of the ring of the assembly component 132, the cooling gas discharged through the gas supply hole 1331 can be delivered to the wafer from multiple positions outside the periphery of the wafer located inside the ring of the assembly component 132 through the opening of the assembly cavity 134.

[0062] like Figure 1 , Figure 2 and Figure 4As shown, in one embodiment of the present invention, the assembly component 132 may include a first assembly component 135, a second assembly component 136 and a third assembly component 137. The first assembly component 135 and the second assembly component 136 are both in a ring shape with an avoidance opening 131 on one side. The first assembly component 135 and the second assembly component 136 are opposite to each other and arranged at intervals. An assembly cavity 134 is formed between the first assembly component 135 and the second assembly component 136. The third assembly component 137 can cover the opening of the assembly cavity 134, and the third assembly component 137 is provided with a plurality of matching holes 1371, and the plurality of matching holes 1371 are arranged one-to-one correspondingly to all the air supply holes 1331 of all the air supply components 133.

[0063] By making the first assembly part 135 and the second assembly part 136 both in the shape of a ring with a avoidance opening 131 on one side, the assembly part 132 can be made in the shape of a ring with a avoidance opening 131 on one side, so as to avoid the first assembly part 135 and the second assembly part 136 from interfering with the transmission device 37 during the lifting and lowering of the transmission device 37 and / or the lifting and lowering of the air supply component 13. By making the first assembly part 135 and the second assembly part 136 opposite and spaced, an assembly cavity 134 can be formed between the first assembly part 135 and the second assembly part 136. By covering the opening of the assembly cavity 134 with the third assembly part 137, the assembly cavity 134 can be sealed with the help of the third assembly part 137, and the plurality of air supply parts 133 can be sealed in the assembly cavity 134. By arranging a plurality of mating holes 1371 on the third assembly part 137 and making the plurality of mating holes 1371 correspond one-to-one to all the air supply holes 1331 of all the air supply parts 133, the cooling gas discharged through the air supply holes 1331 can be delivered to the wafer from a plurality of positions on the outer side of the circumference of the wafer located on the inner side of the ring of the assembly part 132 through the corresponding mating holes 1371.

[0064] Optionally, the material of the third assembly part 137 may include metal.

[0065] Optionally, the third assembly part 137 may be in the shape of a long strip.

[0066] Optionally, the third assembly part 137 may be embedded in the opening of the assembly cavity 134 .

[0067] In one embodiment of the present invention, the diameter of the matching hole 1371 may be the same as the diameter of the air supply hole 1331 , so that the cooling gas discharged through the air supply hole 1331 can pass through the corresponding matching hole 1371 .

[0068] like Figure 1 , Figure 2 and Figure 4As shown, in one embodiment of the present invention, the support assembly may include a plurality of support components 121, and the plurality of support components 121 are arranged at intervals along the circumference of the air delivery assembly 13, and at least part of the support components 121 are located on the inner side of the ring of the air delivery assembly 13, and the plurality of support components 121 are used to jointly support the wafer on the inner side of the ring of the air delivery assembly 13.

[0069] Specifically, at least a portion of the support component 121 can be located on the inner side of the ring of the assembly component 132, that is, at least a portion of the support component 121 can protrude toward the inner side of the ring of the assembly component 132 relative to the inner ring of the assembly component 132, so that multiple support components 121 can support the wafer on the inner side of the ring of the assembly component 132. When multiple support components 121 support the wafer, the multiple support components 121 can respectively contact the bottom surface of the wafer, that is, the multiple support components 121 jointly support the wafer.

[0070] like Figure 1 , Figure 2 and Figure 4 As shown, optionally, the number of the supporting components 121 may be three. However, the number of the supporting components 121 is not limited thereto.

[0071] like Figure 1 , Figure 2 and Figure 4 As shown, optionally, one support component 121 among the multiple support components 121 can be located at one end of the air supply component 13 in the circumferential direction, another support component 121 can be located at the other end of the air supply component 13 in the circumferential direction, and the other support components 121 can be located in the middle of the air supply component 13 in the circumferential direction.

[0072] Since the support component 121 located in the middle of the circumference of the air supply component 13 may need to occupy part of the opening of the assembly space, optionally, the third assembly part 137 covering the opening of the assembly cavity 134 can be divided into multiple sections, and at least one section of the third assembly part 137 can be arranged between each two adjacent support components 121.

[0073] like Figure 1 , Figure 2 and Figure 4 As shown, in one embodiment of the present invention, the support component 121 can be arranged at the bottom of the air supply component 13.

[0074] Specifically, such a design can make the wafer be located below the multiple air delivery components 133 when multiple support components 121 jointly support the wafer. In this way, when the multiple air delivery components 133 transport cooling gas to the wafer, most of the cooling gas can flow through the upper surface of the wafer, pressing the wafer against the multiple support components 121, thereby avoiding the situation where the wafer is blown or even lifted up due to most of the cooling gas flowing through the lower surface of the wafer, thereby improving the stability of wafer cooling.

[0075] like Figure 5 As shown, in one embodiment of the present invention, the support component 121 may include a connecting member 122 and a supporting member 123, the connecting member 122 is detachably connected to the air supply component 13, the supporting member 123 is arranged on the connecting member 122, and is at least partially located on the inner side of the ring of the air supply component 13, for supporting the wafer.

[0076] Optionally, the connecting member 122 may be provided with a screw hole 124, and the bottom of the assembly component 132 may be provided with a threaded hole. By passing the screw through the screw hole 124 and threadably engaging with the threaded hole, the connecting member 122 can be connected to the bottom of the assembly component 132 with the help of the screw. In this way, by arranging the support member 123 on the connecting member 122, it is possible to arrange the support component 121 at the bottom of the air delivery component 13, and by making at least a portion of the support member 123 located on the inner side of the ring of the air delivery component 13, it is possible to make at least a portion of the support member 123 located on the inner side of the ring of the air delivery component 13 contact the wafer to support the wafer, so that at least a portion of the support component 121 can be located on the inner side of the ring of the air delivery component 13, and a plurality of support components 121 can jointly support the wafer on the inner side of the ring of the air delivery component 13.

[0077] like Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in one embodiment of the present invention, the support member 123 may be rod-shaped, and at least a portion of the support member 123 in the axial direction is located inside the ring of the gas delivery component 13, so as to contact the wafer and support the wafer.

[0078] Such a design can ensure that when the support member 123 contacts the wafer to support the wafer, the support member 123 and the wafer have a smaller contact area, thereby reducing contamination of the wafer by the support member 123 and improving the effect of subsequent semiconductor processes on the wafer.

[0079] Optionally, the material of the support member 123 may include quartz.

[0080] like Figure 3As shown, in one embodiment of the present invention, the gas delivery component 11 may include a plurality of gas delivery components 111, and the plurality of gas delivery components 111 are connected one-to-one with a plurality of gas delivery components 133, and are all connected to a gas source, and the plurality of gas delivery components 111 are used to deliver cooling gas to the plurality of gas delivery components 133 one-to-one.

[0081] like Figure 3 As shown, optionally, the number of the gas delivery components 133 may be four, the number of the gas delivery components 111 may be four, the four gas delivery components 111 are connected to the four gas delivery components 133 one by one, and the four gas delivery components 111 are all connected to the gas source, the cooling gas of the gas source can flow into the four gas delivery components 111 respectively, and then be delivered to the four gas delivery components 133 one by one through the four gas delivery components 111. In addition, the flow rate of each gas delivery component 111 can be controlled to achieve control of the flow rate of each gas delivery component 133, thereby further improving the uniformity of wafer cooling.

[0082] like Figure 6 As shown, in one embodiment of the present invention, the gas delivery component 11 may also include a plurality of flow control components 112, and the plurality of gas delivery components 111 are connected to the gas source through the plurality of flow control components 112 one by one, and the flow control components are used to control the flow of the cooling gas flowing from the gas source to the corresponding gas delivery components 111.

[0083] Optionally, the number of gas delivery components 111 may be four, the number of flow control components 112 may be four, the four gas delivery components 111 are connected to the gas source through the four flow control components 112 in a one-to-one correspondence, and the cooling gas of the gas source can flow into the four gas delivery components 111 in a one-to-one correspondence through the four flow control components 112, so that the flow rate of the cooling gas flowing into the four gas delivery components 111 can be controlled in a one-to-one correspondence through the four flow control components 112, so that the flow rate of the four gas supply components 133 connected in a one-to-one correspondence with the four gas delivery components 111 can be controlled in a one-to-one correspondence. That is to say, in one embodiment of the present invention, the flow rate of the cooling gas flowing into the multiple gas delivery components 111 is controlled in a one-to-one correspondence through the multiple flow control components 112, so as to control the flow rate of the cooling gas flowing into the multiple gas supply components 133 in a one-to-one correspondence, so as to control the flow rate of the cooling gas delivered to the wafer by each gas supply component 133, thereby further improving the uniformity of wafer cooling.

[0084] Optionally, the flow control component 112 may include a mass flow controller (Mass Flow Controller, abbreviated as MFC).

[0085] like Figure 6As shown, optionally, the gas delivery component 11 may also include a plurality of first air intake components 113 and a plurality of second air intake components 114, one ends of the plurality of first air intake components 113 are connected one-to-one with the air intake ends of the plurality of flow control components 112, and the other ends are connected to the gas source, one ends of the plurality of second air intake components 114 are connected one-to-one with the air outlet ends of the plurality of flow control components 112, and the other ends are connected one-to-one with the plurality of gas delivery components 111.

[0086] In actual applications, the cooling gas of the gas source can first enter the multiple flow control components 112 one by one through the multiple first air intake components 113, then enter the multiple second air intake components 114 one by one through the multiple flow control components 112, then enter the multiple gas delivery components 111 one by one through the multiple second air intake components 114, and then enter the multiple gas delivery components 133 one by one through the multiple gas delivery components 111.

[0087] Optionally, the gas source may be a gas source for semiconductor factory services.

[0088] In one embodiment of the present invention, the gas delivery component 111 may include a flexible hose, so that the gas delivery component 111 can be bent along with the rise and fall of the gas delivery assembly 13, so that the gas delivery assembly 13 can be freely raised and lowered.

[0089] like Figure 1 and Figure 2 As shown, in one embodiment of the present invention, the cooling device 1 may further include a lifting component 14, and the lifting component 14 is connected to the air supply component 13 and is used to drive the air supply component 13 to rise and fall.

[0090] In actual applications, after different semiconductor processes are completed, the temperature of the wafer will be different. Wafers with higher temperatures require longer cooling time, while wafers with lower temperatures require shorter cooling time. Figure 7As shown, for example, the semiconductor equipment 3 may include a transfer chamber 31 and a reaction chamber 32. The reaction chamber 32 is used to perform semiconductor processes. A transfer device 37 and a cooling device 1 may be provided in the transfer chamber 31. When the wafer completes the semiconductor process in the reaction chamber 32, the gas delivery component 13 may be located at a low position in the transfer chamber 31 to avoid interference with the movement of the transfer device 37. The transfer device 37 may be rotated and retracted to take the wafer in the reaction chamber 32 out to a cooling station in the transfer chamber 31. The cooling station corresponds to the support component. At this time, the wafer is located above the support component. Afterwards, the lifting component 14 may drive the gas delivery component 13 to rise, thereby driving the support component to rise. The support component provided on the gas delivery component 13 may support the wafer on the transfer device 37, lift the wafer on the transfer device 37, and separate the wafer from the transfer device 37. If the temperature of the wafer is low and the cooling time required is short, the gas supply component 13 can directly supply cooling gas to the wafer to cool the wafer. If the temperature of the wafer is high and the cooling time required is long, after the support component lifts the wafer on the transmission device 37 and separates the wafer from the transmission device 37, the transmission device 37 can be rotated away from the cooling device 1. Thereafter, the lifting component 14 can drive the gas supply component 13 to descend to leave enough space for the transmission device 37 to transmit other wafers, thereby avoiding interference of the cooling device 1 with the transmission device 37 in transmitting other wafers.

[0091] like Figure 1 and Figure 2 As shown, in one embodiment of the present invention, the lifting assembly 14 may include a driving source 141, a lifting shaft and a telescopic tube 142. The driving source 141 is connected to the air supply assembly 13 through the lifting shaft, and is used to drive the lifting shaft to lift and lower to drive the air supply assembly 13 to lift and lower. The telescopic tube 142 is sleeved outside the lifting shaft and is respectively connected to the driving source 141 and the air supply assembly 13.

[0092] In actual applications, the driving source 141 can provide a lifting driving force, and by driving the lifting shaft to lift and lower, it drives the air supply component 13 connected to the lifting shaft to lift and lower. Since the distance between the driving source 141 and the air supply component 13 will change during the process of the driving source 141 driving the air supply component 13 to lift and lower, therefore, by arranging a telescopic tube 142 outside the lifting shaft, and connecting the telescopic tube 142 to the driving source 141 and the air supply component 13 respectively, the telescopic tube 142 can be extended and retracted along with the lifting and lowering of the air supply component 13 during the process of the driving source 141 driving the air supply component 13 to lift and lower. Therefore, the lifting shaft can be always sealed with the help of the telescopic tube 142 during the process of the driving source 141 driving the air supply component 13 to lift and lower.

[0093] Optionally, the extension tube 142 may include a bellows.

[0094] Optionally, the gas delivery component 111 can be inserted into the telescopic tube 142 and pass through the assembly component 132 to the assembly space to communicate with the gas supply component 133, so that the gas delivery component 111 can be limited by the telescopic tube 142 and the assembly component 132 to improve the integrity of the cooling device 1.

[0095] In an embodiment of the present invention, the cooling device 1 may further include a temperature measuring component for detecting the temperature of the wafer supported by the supporting component.

[0096] By detecting the temperature of the wafer supported by the support component with the aid of the temperature measuring component, the temperature of the wafer can be monitored in real time, and the accurate temperature of the wafer can be obtained, thereby improving the accuracy of wafer cooling. In addition, when the temperature of the wafer is cooled to a preset temperature, the cooling of the current wafer can be stopped in time, and the subsequent wafer to be cooled can be cooled in time, or the wafer can be transferred in time for subsequent semiconductor processes or transferred to the outside of the semiconductor device 3, thereby improving the cooling efficiency of the wafer.

[0097] When the temperature of the wafer is cooled to a preset temperature, the temperature measuring component can send a signal to the processing unit of the semiconductor device 3, and the processing unit can control the flow control component 112 to close according to the signal, so that the cooling gas stops entering the gas delivery component 111. Afterwards, the lifting component 14 can drive the gas supply component 13 to rise, so as to drive the support component to support the wafer to rise. When the gas supply component 13 rises to a high position, the transmission device 37 can rotate to the cooling station. At this time, the wafer is located below the support component. Afterwards, the lifting component can drive the gas supply component 13 to descend, so as to drive the support component to support the wafer to descend, and place the wafer on the transmission device 37 to separate the wafer from the support component. Afterwards, the lifting component 14 can continue to drive the gas supply component 13 to descend to a low position, so as to drive the support component to continue to descend to a lower position. Afterwards, the transmission device 37 can transfer the wafer to the outside of the semiconductor device 3 by rotating and retracting, or transfer the wafer to a subsequent semiconductor process position.

[0098] like Figure 1 As shown, in one embodiment of the present invention, the cooling device 1 may also include: a wafer carrying portion 15, which is located below the supporting assembly and is used to carry the wafer when the lifting assembly 14 drives the air supply assembly 13 to drive the wafer to descend to the lower surface of the wafer and contact the wafer carrying portion 15.

[0099] like Figure 1 As shown, in one embodiment of the present invention, the wafer carrying part 15 may include a carrying platform 151 and a plurality of temperature measuring holes passing through the carrying platform 151; the temperature measuring component includes a plurality of temperature measuring parts, each temperature measuring part corresponds to a temperature measuring hole, and the temperature measuring part detects the temperature of the wafer through the temperature measuring hole.

[0100] For example, Figure 1As shown, the number of temperature measuring holes is five, the number of temperature measuring parts is five, and the five temperature measuring parts detect the temperature of the wafer through the five temperature measuring holes one by one. However, the number of temperature measuring holes and temperature measuring parts is not limited to this. Multiple temperature measuring parts can measure the temperature of multiple positions of the wafer through multiple temperature measuring holes, so that the temperature uniformity of the wafer can be monitored in real time, and then the cooling uniformity of the wafer can be understood. Then, according to the temperature uniformity of the wafer, by controlling the flow of multiple flow control components 112, the flow of the cooling gas flowing into the multiple gas delivery components 111 can be controlled one by one, and the flow of the cooling gas flowing into the multiple gas delivery components 133 can be controlled one by one, and then the flow of the cooling gas delivered to the wafer by each gas delivery component 133 can be controlled, thereby improving the uniformity of wafer cooling.

[0101] Optionally, the temperature measuring element may include an infrared thermometer.

[0102] In an embodiment of the present invention, a plurality of protrusions may be further provided on the side of the carrier 151 facing the wafer, and the plurality of protrusions are used to jointly support the wafer.

[0103] Specifically, a plurality of protrusions can be arranged at intervals on the carrier 151, and at least part of the protrusions protrude relative to the first surface of the carrier 151 toward the support assembly. When the temperature of the wafer is high and the cooling time required is long, the lifting assembly 14 can be used to drive the gas supply assembly 13 to descend, so as to drive the support assembly to support the wafer to descend, and place the wafer on the plurality of protrusions to separate the wafer from the support assembly. At this time, the wafer is supported by the plurality of protrusions. In actual applications, when the gas supply assembly 13 delivers cooling gas to the wafer supported on the plurality of protrusions, the cooling gas can flow from the upper surface of the wafer, or flow from the lower surface of the wafer and the first surface of the support body, so that the wafer can be cooled.

[0104] like Figure 1 As shown, in one embodiment of the present invention, a plurality of first accommodating grooves 154 may be further provided on the side of the carrier platform 151 facing the wafer, and the plurality of first accommodating grooves 154 are arranged at intervals along the circumference of the carrier platform 151, and the first accommodating grooves 154 are open on one side facing the outer periphery of the carrier platform 151, and the plurality of first accommodating grooves 154 are provided for accommodating a plurality of supporting components 121 in a one-to-one correspondence.

[0105] For example, Figure 1 As shown, there are three first receiving grooves 154, and three supporting components 121. One side of the first receiving groove 154 facing the outer periphery of the carrier 151 is open, so that the supporting member 123 can enter the first receiving groove 154, so that the three supporting components 121 can be accommodated in the three first receiving grooves 154 one by one. However, the number of the first receiving grooves 154 and the supporting components 121 is not limited to this.

[0106] like Figure 1 As shown, in one embodiment of the present invention, a plurality of second accommodating grooves 153 may be further provided on the side of the carrier 151 facing the wafer, and the plurality of second accommodating grooves 153 are arranged at intervals on the carrier 151 to accommodate a plurality of protrusions one by one, and at least part of the protrusions protrude from the corresponding second accommodating grooves 153.

[0107] For example, Figure 1 As shown, the number of the second receiving grooves 153 is three, the number of the protrusions is three, and the three protrusions are accommodated in the three second receiving grooves 153 in a one-to-one correspondence. The protrusions can be limited by the second receiving grooves 153. However, the number of the second receiving grooves 153 and the protrusions is not limited to this.

[0108] Optionally, the protrusion may be spherical, a portion of the protrusion may be accommodated in the second accommodating groove 153 , and another portion of the protrusion may protrude from the second accommodating groove 153 , so as to support the wafer.

[0109] Optionally, the material of the protrusions may include quartz.

[0110] In one embodiment of the present invention, a plurality of temperature measuring components may be arranged at intervals along a circumferential direction, and each temperature measuring component is arranged corresponding to at least one air supply component 133 .

[0111] That is to say, the position of the temperature of the wafer detected by each temperature measuring component corresponds to the position where at least one air delivery component 133 delivers cooling gas to the wafer. Such a design can control the flow rate of cooling gas delivered to the wafer by at least one air delivery component 133 corresponding to the temperature measuring component according to the temperature of the position on the wafer corresponding to the temperature measuring component measured by the temperature measuring component, thereby accurately controlling the cooling temperature of multiple positions on the wafer, and further improving the uniformity of wafer cooling.

[0112] For example, the number of air delivery components 133 can be four, namely, air delivery component 133A, air delivery component 133B, air delivery component 133C and air delivery component 133D, and the number of temperature measuring components can be five, namely, a temperature measuring component corresponding to temperature measuring hole 152a, a temperature measuring component corresponding to temperature measuring hole 152b, a temperature measuring component corresponding to temperature measuring hole 152c, a temperature measuring component corresponding to temperature measuring hole 152d and a temperature measuring component corresponding to temperature measuring hole 152e. The four air delivery components 133 are arranged on the assembly component 132 at circumferential intervals along the assembly component 132, and the five temperature measuring components are arranged at circumferential intervals. Among them, the temperature measuring component corresponding to the temperature measuring hole 152a is arranged corresponding to the air supply component 133A, the temperature measuring component corresponding to the temperature measuring hole 152b is arranged corresponding to the air supply component 133B, the temperature measuring component corresponding to the temperature measuring hole 152c is arranged corresponding to the air supply component 133C, the temperature measuring component corresponding to the temperature measuring hole 152d is arranged corresponding to the air supply component 133D, the temperature measuring component corresponding to the temperature measuring hole 152e is located between the temperature measuring component corresponding to the temperature measuring hole 152b and the temperature measuring component corresponding to the temperature measuring hole 152c, and the temperature measuring component corresponding to the temperature measuring hole 152e is arranged corresponding to the air supply component 133B and the air supply component 133C.

[0113] In practical applications, for example, when the temperature of the wafer detected by the temperature measuring component corresponding to the temperature measuring hole 152a is lower than the temperature of the wafer detected by the temperature measuring component corresponding to the temperature measuring hole 152d, the flow rate of the cooling gas in the gas delivery component 111 connected to the gas delivery component 133A can be increased by controlling the flow rate of the airflow control component corresponding to the gas delivery component 133A to increase, thereby increasing the flow rate of the cooling gas in the gas delivery component 133A, and / or, the flow rate of the cooling gas in the gas delivery component 111 connected to the gas delivery component 133D can be reduced by controlling the flow rate of the airflow control component corresponding to the gas delivery component 133D to reduce the flow rate of the cooling gas in the gas delivery component 133D, thereby reducing the flow rate of the cooling gas in the gas delivery component 133D, thereby enabling different positions of the wafer corresponding to the temperature measuring components corresponding to the temperature measuring holes 152a and the temperature measuring components corresponding to the temperature measuring holes 152d to be evenly cooled.

[0114] That is to say, in the process of cooling the wafer, the temperatures of multiple positions of the wafer can be detected one by one through a plurality of temperature measuring components arranged at intervals. According to the temperatures of multiple positions of the wafer detected one by one by the plurality of temperature measuring components, the positions with higher temperatures and the positions with lower temperatures of the wafer during the cooling process can be understood. By increasing the flow rate of the cooling gas delivered by the air delivery component 133 corresponding to the position with higher temperature of the wafer, and / or reducing the flow rate of the cooling gas delivered by the air delivery component corresponding to the position with lower temperature of the wafer, the overall temperature of the wafer can be uniformly reduced, thereby enabling the wafer to be evenly cooled.

[0115] However, the number of temperature measuring components, the number of air supply components 133, and the corresponding relationship between the temperature measuring components and the air supply components 133 are not limited thereto.

[0116] Optionally, a plurality of temperature measuring elements may be arranged at even intervals along a circumference.

[0117] like Figure 7 As shown, an embodiment of the present invention further provides a transfer chamber 31, including a chamber body, a transfer device 37 and a cooling device 1 as provided in an embodiment of the present invention, the transfer device 37 is arranged in the chamber body for transferring wafers, and the cooling device 1 is arranged in the transfer chamber 31 for supporting and cooling the wafers.

[0118] The transfer chamber 31 (TC) provided in the embodiment of the present invention, by setting the cooling device 1 provided in the embodiment of the present invention in the transfer chamber 31, can use the cooling device 1 provided in the present invention to cool the wafer transferred to the transfer chamber 31 through the transfer device 37 in the transfer chamber 31, thereby reducing the safety hazard of the transfer chamber 31 and further reducing the safety hazard of the semiconductor equipment 3.

[0119] Optionally, the transmission device 37 may include a robot.

[0120] Optionally, the transmission chamber 31 may include a plurality of cooling devices 1, and the plurality of cooling devices 1 may be arranged at intervals in the chamber body.

[0121] like Figure 7 As shown, an embodiment of the present invention further provides a semiconductor device 3, including a reaction chamber 32 (Process Module, abbreviated as PM) such as a transmission chamber 31 provided in an embodiment of the present invention, the reaction chamber 32 is used to perform semiconductor process reactions, the transmission chamber 31 is connected to the reaction chamber 32, the transmission device 37 in the transmission chamber 31 is used to transfer wafers to the reaction chamber 32, or to take out wafers in the reaction chamber 32, and the cooling device 1 in the transmission chamber 31 is used to cool the wafers.

[0122] The semiconductor equipment 3 provided in the embodiment of the present invention, with the aid of the transmission chamber 31 provided in the embodiment of the present invention, can cool the wafer transferred to the transmission chamber 31 through the transmission device 37 in the transmission chamber 31 with the aid of the cooling device 1 provided in the embodiment of the present invention, thereby reducing the safety hazard of the transmission chamber 31 and further reducing the safety hazard of the semiconductor equipment 3.

[0123] like Figure 7As shown, the semiconductor equipment 3 may also include a loading system 33 (Loadport), a front end module 34 (Equipment Front End Module, abbreviated as EFEM) and a vacuum transfer system 35 (Loadlock). The wafer may enter the reaction chamber 32 from the loading system 33 through the front end module 34, the vacuum transfer system 35 and the transfer chamber 31 in sequence. A wafer alignment device 36 (Aligner) may be provided in the front end module 34. The wafer alignment device 36 may align the direction of the wafer in the front end module 34.

[0124] In summary, the cooling device 1 , the transfer chamber 31 and the semiconductor device 3 provided by the embodiment of the present invention can reduce the potential safety hazards of the semiconductor device 3 .

[0125] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A cooling device for cooling a wafer in a semiconductor device, characterized in that: The cooling device comprises a gas transmission component, a support component and a gas delivery component; The gas delivery component is in communication with the gas supply component and can be in communication with a gas source of cooling gas, and the gas delivery component is used to deliver the cooling gas to the gas supply component; The air delivery component is in a ring shape with a avoidance opening on one side, and the avoidance opening is used to avoid a transmission device for transmitting wafers in the semiconductor equipment; At least a portion of the support assembly is located inside the ring of the gas delivery assembly, and is used to support the wafer inside the ring of the gas delivery assembly; The gas delivery component is used to deliver the cooling gas to the wafer from the outer side of the wafer.

2. The cooling device according to claim 1, characterized in that: The air supply component includes an assembly component and multiple air supply components. The assembly component is in a ring shape with the avoidance port on one side. The multiple air supply components are assembled on the assembly component at intervals along the circumference of the assembly component and are all connected to the air supply component. The multiple air supply components are used to deliver the cooling gas to the wafer from multiple positions outside the wafer circumference in a one-to-one manner.

3. The cooling device according to claim 2, characterized in that: The air supply component is provided with a plurality of air supply holes, and the plurality of air supply holes are arranged at intervals along the circumference of the assembly component. The air supply component supplies the cooling gas to the wafer through the air supply holes.

4. The cooling device according to claim 3, characterized in that: The interior of the assembly component has an assembly cavity, which is annular and extends along the circumference of the assembly component, and the side of the assembly cavity facing the inner side of the assembly component ring is open, and a plurality of air supply components are installed in the assembly cavity at intervals, and the air supply holes face the opening of the assembly cavity.

5. The cooling device according to claim 4, characterized in that: The assembly parts include a first assembly part, a second assembly part and a third assembly part. The first assembly part and the second assembly part are both in a ring shape with the avoidance opening on one side. The first assembly part and the second assembly part are arranged opposite to each other and at intervals. The assembly cavity is formed between the first assembly part and the second assembly part. The third assembly part covers the opening of the assembly cavity, and the third assembly part is provided with a plurality of matching holes. The plurality of matching holes are arranged in one-to-one correspondence with all the air supply holes of all the air supply parts.

6. The cooling device according to claim 5, characterized in that: The diameter of the matching hole is the same as the diameter of the air supply hole.

7. The cooling device according to claim 2, characterized in that: The support assembly includes a plurality of support components, which are arranged at intervals along the circumference of the air supply assembly, and at least part of the support components are located on the inner side of the ring of the air supply assembly. The plurality of support components are used to jointly support the wafer on the inner side of the ring of the air supply assembly.

8. The cooling device according to claim 7, characterized in that: The supporting component is arranged at the bottom of the air supply assembly.

9. The cooling device according to claim 7, characterized in that: The supporting component includes a connecting member and a supporting member. The connecting member is detachably connected to the air supply assembly. The supporting member is arranged on the connecting member and is at least partially located on the inner side of the ring of the air supply assembly for supporting the wafer.

10. The cooling device according to claim 9, characterized in that: The support member is rod-shaped, and at least a portion of the support member in the axial direction is located inside the ring of the air supply component, so as to contact with the wafer to support the wafer.

11. The cooling device according to claim 2, characterized in that: The gas delivery assembly includes a plurality of gas delivery components, which are connected to the plurality of gas supply components one by one and are all connected to the gas source, and are used to deliver the cooling gas to the plurality of gas supply components one by one.

12. The cooling device according to claim 11, characterized in that The gas delivery assembly also includes a plurality of flow control components, and the plurality of gas delivery components are connected to the gas source through the plurality of flow control components one by one, and the flow control components are used to control the flow of the cooling gas flowing from the gas source to the corresponding gas delivery components.

13. The cooling device according to claim 11, characterized in that: The gas delivery component includes a flexible hose.

14. The cooling device according to claim 8, characterized in that The cooling device further comprises a lifting component, which is connected to the air supply component and is used to drive the air supply component to rise and fall.

15. The cooling device according to claim 14, characterized in that The lifting assembly includes a driving source, a lifting shaft and a telescopic tube. The driving source is connected to the air supply assembly via the lifting shaft and is used to drive the lifting shaft to lift and lower, thereby driving the air supply assembly to lift and lower. The telescopic tube is sleeved outside the lifting shaft and is respectively connected to the driving source and the air supply assembly.

16. The cooling device according to claim 14, characterized in that The cooling device also includes a temperature measuring component for detecting the temperature of the wafer supported by the supporting component.

17. The cooling device according to claim 16, characterized in that The cooling device also includes: a wafer carrying part, which is located below the supporting assembly and is used to carry the wafer when the lifting assembly drives the air supply assembly to drive the wafer to descend until the lower surface of the wafer contacts the wafer carrying part.

18. The cooling device according to claim 17, characterized in that The wafer carrying part includes a carrying platform and a plurality of temperature measuring holes penetrating the carrying platform; The temperature measuring component includes a plurality of temperature measuring components, each of which corresponds to one temperature measuring hole, and the temperature measuring component detects the temperature of the wafer through the temperature measuring hole.

19. The cooling device according to claim 18, characterized in that A plurality of protrusions are also provided on the side of the carrier platform facing the wafer, and the plurality of protrusions are used to jointly support the wafer.

20. The cooling device according to claim 18, characterized in that A plurality of first accommodating grooves are also provided on the side of the carrier platform facing the wafer. The plurality of first accommodating grooves are arranged at intervals along the circumference of the carrier platform, and the first accommodating grooves are open on one side facing the outer periphery of the carrier platform. The plurality of first accommodating grooves are arranged one by one for accommodating the plurality of supporting components.

21. The cooling device according to claim 18, characterized in that The plurality of temperature measuring components are arranged at intervals along a circumferential direction, and each of the temperature measuring components is arranged corresponding to at least one of the air supply components.

22. A transmission chamber, characterized in that: It comprises a chamber body, a transmission device and a cooling device as described in any one of claims 1 to 21, wherein the transmission device is arranged in the chamber body for transmitting wafers, and the cooling device is arranged in the transmission chamber for supporting and cooling the wafers.

23. A semiconductor device, characterized in that: It includes a reaction chamber and a transfer chamber as described in claim 22, wherein the reaction chamber is used to perform semiconductor process reactions, the transfer chamber is connected to the reaction chamber, the transfer device in the transfer chamber is used to transfer wafers to the reaction chamber, or to take out the wafers in the reaction chamber, and the cooling device in the transfer chamber is used to cool the wafers.

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