Heat dissipation device

Abstract

The heat dissipation device comprises a circuit board, a water cooling plate, a memory heat dissipation assembly and a plurality of water conveying pipes, and the circuit board is provided with a CPU installation position and a memory bank installation position; the water cooling plate is fixed to the circuit board and located at the top of the CPU installation position, and a first water flowing cavity is formed in the water cooling plate. The memory heat dissipation assembly comprises two heat dissipation frames and a heat conduction piece, the two heat dissipation frames are fixed to the circuit board and located on the two opposite sides of the memory bank installation position respectively, a second water flowing cavity is formed in each heat dissipation frame, one end of the heat conduction piece is detachably fixed to one heat dissipation frame, and the other end of the heat conduction piece is detachably fixed to the other heat dissipation frame; the heat-conducting fins are used for exchanging heat with the memory banks mounted on the memory bank mounting positions and the two heat dissipation racks; the multiple water conveying pipes are used for communicating the first water flowing cavity with the two second water flowing cavities so as to form a water flowing channel. According to the technical scheme, efficient water-cooling heat dissipation of the CPU and the memory bank can be achieved at the same time.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation device. Background Art

[0002] The circuit board is the core carrier board of the computer system that carries various electronic components. It is equipped with key structures such as the central processing unit (CPU) and memory. The CPU, as the computing core of the computer, generates a lot of heat during operation; the memory is used to temporarily store data and programs, and it also generates a lot of heat under high-frequency working conditions. With the continuous improvement of computer performance, the operating frequency and power consumption of the CPU and memory are constantly increasing, and the heat dissipation problem is becoming increasingly prominent.

[0003] At present, the heat dissipation methods of circuit boards mainly include air cooling and water cooling. The air cooling method usually installs a heat sink and a fan on the CPU to remove heat through air convection, but due to the low thermal conductivity of air, it is often difficult to meet the heat dissipation requirements under high-load working conditions. Although the water cooling method has a better heat dissipation effect, most of the water cooling devices in the prior art are only designed for the CPU, and the memory sticks still use air cooling. The overall heat dissipation efficiency is not high, and it is difficult to meet the temperature control requirements of high-performance computer systems. Especially in high-performance computing devices such as servers, the heat generated by memory sticks is getting higher and higher, and the existing heat dissipation solutions can no longer meet actual needs. Summary of the invention

[0004] The main purpose of the present invention is to solve the technical problem that the existing circuit board heat dissipation device cannot simultaneously achieve efficient water cooling of the CPU and the memory stick.

[0005] A first aspect of the present invention provides a heat dissipation device, the heat dissipation device comprising a circuit board, a water cooling plate, a memory heat dissipation component and a plurality of water pipes; Circuit board, with CPU mounting position and memory module mounting position; A water cooling plate is fixed to the circuit board and is located on the top of the CPU installation position, and a first water cavity is formed in the water cooling plate; A memory heat dissipation assembly, comprising two heat dissipation frames and a heat conductive sheet, wherein the two heat dissipation frames are fixed to the circuit board and are respectively located on opposite sides of the memory bar installation position, a second water discharge cavity is formed in each of the heat dissipation frames, two ends of the heat conductive sheet are respectively detachably fixed to the two heat dissipation frames, and the heat conductive sheet is used for heat exchange with the memory bar installed on the memory bar installation position and the two heat dissipation frames; and A plurality of water pipes are used to connect the first water flow cavity and the two second water flow cavities to form a water flow channel.

[0006] Optionally, the heat conductive sheet includes a first aluminum sheet, a second aluminum sheet and a heat pipe, the heat pipe is arranged in a flat shape, one side of the heat pipe is connected to the first aluminum sheet, and the other side of the heat pipe is connected to the second aluminum sheet; The two ends of the second aluminum sheet are detachably fixed to the two heat dissipation frames.

[0007] Optionally, a mounting groove is recessed on one side of the second aluminum sheet, the first aluminum sheet and the heat pipe are both installed in the mounting groove, and the side of the heat pipe close to the bottom of the mounting groove is connected to the bottom of the mounting groove.

[0008] Optionally, a side of the second aluminum sheet away from the heat pipe is connected to a memory bar installed in the memory bar installation position through a first thermal pad.

[0009] Optionally, there are multiple heat-conducting plates, and the multiple heat-conducting plates are arranged in parallel and at intervals, and a memory bar is installed between any two adjacent heat-conducting plates.

[0010] Optionally, the water cooling plate includes a base plate, an upper cover and a plurality of first drainage plates, the base plate and the upper cover together enclose the first water flow cavity, the plurality of first drainage plates extend in parallel in the first water flow cavity, and a first water flow gap is formed between any two connected first drainage plates.

[0011] Optionally, the upper cover is provided with a first water inlet and a first water outlet, the first water inlet is connected to one of the plurality of water pipes, and the first water outlet is connected to another of the plurality of water pipes; wherein, The direction of a line connecting the first water inlet and the first water outlet is the same as the extending direction of the first guide plate.

[0012] Optionally, the heat sink comprises a strip portion fixed on the circuit board and two protrusions respectively arranged at both ends of the strip portion, the second water cavity passes through the strip portion, one end of the second water cavity is formed with a second water inlet on one of the protrusions, the other end of the second water cavity is formed with a second water outlet on the other of the protrusions, the second water inlet is connected to one of the water pipes, and the second water outlet is connected to the other of the water pipes; The height of the protrusion protruding from the surface of the circuit board is greater than the height of the strip portion protruding from the surface of the circuit board, and the heat conductive sheet is detachably fixed on the side wall of the strip portion facing away from the circuit board.

[0013] Optionally, the heat conducting sheet exchanges heat with the strip portion via a second heat conducting pad.

[0014] Optionally, the heat sink includes a plurality of second guide plates disposed in the strip portion, each of the second guide plates extending in the direction of a line connecting the two protrusions, the plurality of second guide plates being arranged in parallel, and a second water gap being formed between any two connected second guide plates.

[0015] The technical solution provided by the embodiments of the present application has at least the following advantages: The heat dissipation device provided by the present invention is provided with a water-cooling plate and a memory heat dissipation component on a circuit board, and the first water-flowing cavity in the water-cooling plate and the second water-flowing cavity in the two heat dissipation frames in the memory heat dissipation component are connected through a water pipe to form a water-flowing channel, thereby realizing the integrated water-cooling heat dissipation of the CPU and the memory module. The water-cooling plate is fixed on the top of the CPU installation position, and the heat generated by the CPU is taken away by the flowing coolant in the first water-flowing cavity; the two heat dissipation frames are respectively fixed on both sides of the memory module installation position, and the two ends of the heat conductive sheet are respectively fixed on the two heat dissipation frames, so that the heat conductive sheet contacts the memory module and exchanges heat with the heat dissipation frames, and the heat generated by the memory module is conducted to the heat dissipation frame through the heat conductive sheet, and then taken away by the flowing coolant in the second water-flowing cavity.

[0016] This design solves the problem in the prior art that the memory stick can only rely on air cooling for heat dissipation. By integrating the CPU water cooling and the memory stick water cooling into a water cooling system, the advantage of high water cooling heat dissipation efficiency is fully utilized. At the same time, since the heat conductive sheet can be detachably fixed on the heat dissipation rack, it is convenient to install and replace the memory stick, and the practicality of the device is improved. In addition, the heat dissipation rack is arranged on both sides of the memory stick installation position, which will not interfere with the normal installation of the memory stick, and the structure is compact and reasonable. Through the above design, the heat dissipation device of the present invention can meet the heat dissipation requirements of the CPU and the memory stick at the same time, and is particularly suitable for high-performance computing devices with large heat generation, which effectively solves the problem that the existing heat dissipation solution is difficult to meet actual needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 It is a structural schematic diagram of an embodiment of a heat dissipation device of the present invention; Figure 2 for Figure 1 Schematic diagram of the structure after omitting some structures; Figure 3 for Figure 1 A cross-sectional view after omitting some structures; Figure 4 for Figure 3 A partial enlarged view of the middle A; Figure 5 for Figure 1 Another cross-sectional view after omitting some structures; Figure 6 for Figure 5 A partial enlarged view of point B in the middle; Figure 7 for Figure 1 Schematic diagram of the decomposition after omitting some structures.

[0019] Description of Figure Numbers: 1. Circuit board; 11. CPU installation position; 12. Memory module installation position; 2. Water cooling plate; 21. First water cavity; 22. Bottom plate; 23. Upper cover; 231. First water inlet; 232. First water outlet; 24. First drainage plate; 25. First water gap; 3. Memory heat dissipation assembly; 31. Heat sink; 311. Strip; 312. Bump; 313. Second water inlet; 314. Second water outlet; 315. Second drainage plate; 316. Second water gap; 32. Heat conducting plate; 321. First aluminum sheet; 322. Second aluminum sheet; 322a. Installation slot; 323. Heat pipe; 33. First thermal pad; 34. Second thermal pad; 35. Second water cavity; 4. Water pipe.

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, "and / or" in the full text includes three solutions. Taking A and / or B as an example, it includes technical solution A, technical solution B, and technical solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, which must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0024] See also Figures 1 to 7 , an embodiment of the present application provides a heat dissipation device, the heat dissipation device includes a circuit board 1, a water cooling plate 2, a memory heat dissipation component 3 and a plurality of water pipes 4; The circuit board 1 has a CPU mounting position 11 and a memory module mounting position 12; A water cooling plate 2 is fixed to the circuit board 1 and is located on the top of the CPU installation position 11. A first water cavity 21 is formed in the water cooling plate 2. A memory heat dissipation assembly 3, comprising two heat dissipation frames 31 and a heat conductive sheet 32, wherein the two heat dissipation frames 31 are fixed to the circuit board 1 and are respectively located on opposite sides of the memory bar installation position 12, a second water discharge cavity 35 is formed in each of the heat dissipation frames 31, and both ends of the heat conductive sheet 32 ​​are respectively detachably fixed to the two heat dissipation frames 31, and the heat conductive sheet 32 ​​is used for heat exchange with the memory bar installed on the memory bar installation position 12 and the two heat dissipation frames 31; and A plurality of water pipes 4 are used to connect the first water flow cavity 21 and the two second water flow cavities 35 to form a water flow channel.

[0025] In this embodiment, the water-cooled plate 2 can be a hollow structure made of a metal material with good thermal conductivity, for example, it can be made of copper or aluminum; the water cavity refers to a hollow cavity formed inside the water-cooled plate 2 or the heat sink 31 for the circulation of coolant; the heat sink 31 can be a supporting structure made of a metal material with good thermal conductivity, for example, it can be made of copper or aluminum; the heat conductive sheet 32 ​​can be a sheet structure made of a metal material with good thermal conductivity, for example, it can be made of copper or aluminum; the water pipe 4 can be a hose or a hard pipe made of a high temperature resistant and corrosion resistant material, for example, it can be a rubber hose or a metal hard pipe.

[0026] In this embodiment, the water-cooling plate 2 can be fixed to the circuit board 1 by screws, or by buckles or other fasteners; the heat sink 31 can be fixed to the circuit board 1 by screws, or by buckles; both ends of the heat conductive sheet 32 ​​can be detachably fixed to the heat sink 31 by screws, or by detachable connection methods such as snap connection or bonding; the water pipe 4 can be connected to the water-cooling plate 2 and the heat sink 31 by a joint, and the joint can be threaded or quick-plug, or sealed by a sealing ring.

[0027] In this embodiment, the specific meaning of the water channel refers to the complete flow path formed by the coolant entering from a water inlet, flowing through the first water cavity 21 and the two second water cavities 35 in sequence, and then flowing out from a water outlet, so that the coolant can circulate in the entire heat dissipation system.

[0028] The heat dissipation device of this embodiment integrates the CPU water cooling and the memory module water cooling into an integrated water system, thereby achieving simultaneous water cooling of the CPU and the memory module, thereby improving the heat dissipation efficiency; the heat conductive sheet 32 ​​adopts a detachable fixing method to facilitate the installation and replacement of the memory module; the heat dissipation frame 31 is arranged on both sides of the memory module, with a compact structure and does not affect the installation of the memory module; the overall design improves the system heat dissipation efficiency, and is particularly suitable for the heat dissipation requirements of high-performance computing equipment.

[0029] Optionally, the heat conducting sheet 32 ​​includes a first aluminum sheet 321, a second aluminum sheet 322 and a heat pipe 323, the heat pipe 323 is arranged in a flat shape, one side of the heat pipe 323 is connected to the first aluminum sheet 321, and the other side of the heat pipe 323 is connected to the second aluminum sheet 322; Two ends of the second aluminum sheet 322 are detachably fixed to the two heat dissipation frames 31 .

[0030] In this embodiment, the heat conductive sheet 32 ​​is a composite structure, wherein the first aluminum sheet 321 and the second aluminum sheet 322 can be a sheet structure made of an aluminum material with good thermal conductivity; the heat pipe 323 can be a flat structure made of a metal material with high thermal conductivity, such as copper material with excellent thermal conductivity, or new thermal conductive materials such as graphene, the thermal conductivity of these materials is much higher than that of aluminum material; the flat setting means that the cross-sectional shape of the heat pipe 323 is flat, which is conducive to increasing the contact area with the aluminum sheet; the meaning of connected means that the two components are closely fitted to achieve heat conduction.

[0031] In a specific embodiment, one side of the heat pipe 323 can be connected to the first aluminum sheet 321 by welding, or by a thermally conductive material such as thermally conductive glue or thermally conductive silicone grease; the other side of the heat pipe 323 can be connected to the second aluminum sheet 322 in the same manner; the two ends of the second aluminum sheet 322 can be detachably fixed to the two heat dissipation frames 31 by screws, or by other detachable connection methods such as snaps.

[0032] This embodiment adopts a composite heat-conducting structure of "first aluminum sheet 321-heat pipe 323-second aluminum sheet 322", which has multiple advantages compared with a single aluminum sheet structure: first, the heat pipe 323 has a higher thermal conductivity than aluminum, and can quickly transfer the heat generated by the memory bar from the second aluminum sheet 322 to the first aluminum sheet 321, and quickly transfer it to the heat sink 31 on both sides through the second aluminum sheet 322, so that the heat can be taken away by the water cooling system more quickly, thereby improving the overall heat dissipation efficiency; second, the addition of the heat pipe 323 enhances the structural strength of the heat-conducting sheet 32, avoiding the problem that a single aluminum sheet is easily deformed during long-term use and affects the heat dissipation effect; third, the flat heat pipe 323 increases the contact area with the two aluminum sheets, making the heat transfer more uniform, reducing the thermal resistance during the heat transfer process, and making fuller use of the heat dissipation capacity of the water cooling system; finally, the second aluminum sheet 322 adopts a detachable fixing method, which not only ensures the heat conduction effect with the heat sink 31, but also facilitates the installation and maintenance of the heat-conducting sheet 32. The synergistic effect of this composite structure significantly improves the overall performance of the water cooling system.

[0033] Optionally, a mounting groove 322a is recessed on one side of the second aluminum sheet 322, the first aluminum sheet 321 and the heat pipe 323 are both installed in the mounting groove 322a, and the side of the heat pipe 323 close to the bottom of the mounting groove 322a is connected to the bottom of the mounting groove 322a.

[0034] In this embodiment, the mounting groove 322a can be a recessed structure formed by mechanical processing on one side of the second aluminum sheet 322, such as by milling, cutting and other processing methods; the groove bottom refers to the deepest plane part of the mounting groove 322a; the meaning of installation is to fix the component in a specific position, and in this embodiment, the first aluminum sheet 321 and the heat pipe 323 are fixed in the mounting groove 322a.

[0035] This embodiment has multiple technical effects by arranging a mounting groove 322a on the second aluminum sheet 322 to accommodate the first aluminum sheet 321 and the heat pipe 323: first, the setting of the mounting groove 322a forms a closed space, thereby increasing the contact area between the components; second, the setting of the mounting groove 322a enables the first aluminum sheet 321 and the heat pipe 323 to be partially covered by the second aluminum sheet 322, thereby enhancing the overall structural strength and improving the reliability of the thermal conductive sheet 32 ​​in long-term use.

[0036] Optionally, a side of the second aluminum sheet 322 away from the heat pipe 323 is connected to a memory bar installed in the memory bar installation position 12 through a first thermal pad 33 .

[0037] The first thermal pad 33 may be a sheet structure made of thermally conductive silica gel, phase change material or other flexible materials with good thermal conductivity. These materials have certain compressibility and elasticity and can adapt to different installation gaps.

[0038] In this embodiment, the first thermal pad 33 can be fixed to the side of the second aluminum sheet 322 away from the heat pipe 323 by bonding, or it can be directly placed between the second aluminum sheet 322 and the memory stick; when the memory stick is installed in place, the first thermal pad 33 will be compressed, thereby forming a close contact with the memory stick and the second aluminum sheet 322; the thickness of the thermal pad can be selected according to the actual installation gap to ensure a good contact effect.

[0039] This embodiment has multiple technical effects by setting the first thermal pad 33 between the second aluminum sheet 322 and the memory stick: first, the compressible property of the thermal pad can effectively fill the small gap between the second aluminum sheet 322 and the memory stick, ensuring sufficient contact between the two and reducing the thermal resistance caused by the air gap; second, the elastic property of the thermal pad can buffer the stress during the installation process, avoid mechanical damage to the memory stick, and improve the safety of the device.

[0040] Optionally, there are multiple heat conducting sheets 32 , and the multiple heat conducting sheets 32 are arranged in parallel and at intervals, and a memory bar is installed between any two adjacent heat conducting sheets 32 .

[0041] It should be noted that, the number of heat conducting plates 32 being multiple means that two or more heat conducting plates 32 are provided; parallel means that the extension directions of the multiple heat conducting plates 32 are the same and parallel to each other; spaced apart means that a certain distance is maintained between adjacent heat conducting plates 32; adjacent means two heat conducting plates 32 that are close to each other in space.

[0042] In this embodiment, multiple heat conductive sheets 32 can be fixed on two heat dissipation frames 31 respectively by means of screws or clips, and the spacing distance between the heat conductive sheets 32 can be set according to the installation spacing of the memory sticks; the memory sticks can be installed in the space between adjacent heat conductive sheets 32, and each memory stick can achieve thermal contact with its corresponding heat conductive sheet 32.

[0043] The number and spacing of the heat conductive sheets 32 need to correspond to the number and spacing of the memory module mounting positions 12 on the circuit board 1 to ensure that each memory module can be effectively cooled; the space between two adjacent heat conductive sheets 32 needs to meet the installation requirements of the memory module.

[0044] By setting up multiple parallel and spaced heat conducting sheets 32, multiple technical effects are achieved: first, the arrangement of multiple heat conducting sheets 32 allows each memory stick to dissipate heat independently, avoiding mutual heat influence between multiple memory sticks and improving heat dissipation uniformity; second, the parallel setting of the heat conducting sheets 32 allows each memory stick to obtain the same heat dissipation conditions, ensuring the consistency of heat dissipation performance; third, the spacing setting of the heat conducting sheets 32 not only facilitates the installation and removal of the memory sticks, but also reserves sufficient heat dissipation space for the memory sticks to prevent heat accumulation; finally, this design enables the entire water cooling system to provide heat dissipation for multiple memory sticks at the same time, greatly improving the overall heat dissipation capacity of the system, and is particularly suitable for the heat dissipation requirements of multiple memory sticks working simultaneously in high-performance computing devices.

[0045] Optionally, the water cooling plate 2 includes a bottom plate 22, an upper cover 23 and a plurality of first guide plates 24, the bottom plate 22 and the upper cover 23 together enclose the first water flow cavity 21, the plurality of first guide plates 24 extend in parallel in the first water flow cavity 21, and a first water flow gap 25 is formed between any two connected first guide plates 24.

[0046] The bottom plate 22 can be a plate-like structure made of a metal material with good thermal conductivity, such as copper or aluminum; the upper cover 23 can be a cover plate structure made of the same material; the first guide plate 24 can be a sheet-like structure made of a metal material with good thermal conductivity, such as copper or aluminum; the water gap refers to a channel for the flow of coolant formed between two adjacent first guide plates 24.

[0047] The water-cooled plate 2 structure of this embodiment has multiple technical effects: first, the cooperation of the bottom plate 22 and the upper cover 23 forms a sealed first water cavity 21 to ensure that the coolant will not leak; second, multiple parallel first guide plates 24 increase the contact area with the coolant, while guiding the coolant to form a regular flow path, thereby improving the heat transfer efficiency; third, the setting of the first guide plates 24 also plays a supporting role, enhancing the structural strength of the water-cooled plate 2, and preventing deformation when the high-pressure coolant flows; finally, by reasonably setting the number and spacing of the first guide plates 24, the flow resistance and flow rate of the coolant can be optimized, while ensuring the heat dissipation effect, the water pump load is reduced, and the overall efficiency of the system is improved. This structural design not only improves the heat dissipation effect of the CPU, but also provides a stable and reliable coolant circulation foundation for the entire water cooling system.

[0048] Optionally, the upper cover 23 is provided with a first water inlet 231 and a first water outlet 232, wherein the first water inlet 231 is connected to one of the plurality of water pipes 4, and the first water outlet 232 is connected to another of the plurality of water pipes 4; wherein, The direction of the line connecting the first water inlet 231 and the first water outlet 232 is the same as the extending direction of the first guide plate 24 .

[0049] In a specific implementation, the first water inlet 231 and the first water outlet 232 can be a connecting hole structure set on the upper cover 23 for the entry and exit of the coolant; one of the water pipes 4 refers to a pipe selected from multiple water pipes 4 for water inlet, and the other refers to another pipe selected for water outlet; the connection direction refers to the direction of the imaginary straight line connecting the first water inlet 231 and the first water outlet 232.

[0050] In this embodiment, the first water inlet 231 and the first water outlet 232 can be connected to the water pipe 4 through threaded joints, or other sealing connection methods such as quick joints can be used.

[0051] The design of this embodiment has multiple technical effects: first, the arrangement direction of the first water inlet 231 and the first water outlet 232 is parallel to the first guide plate 24, so that the coolant can flow smoothly along the channel formed by the guide plate, reducing the flow resistance and improving the flow efficiency; second, this arrangement enables the coolant to fully contact each first guide plate 24, enhancing the heat transfer effect and avoiding the generation of local hot spots; third, because the flow direction of the coolant is parallel to the guide plate, a regular flow state can be formed during the flow process, reducing the generation of turbulence and dead zones and improving the uniformity of heat dissipation; finally, this design optimizes the flow path of the coolant, while providing sufficient heat exchange, it also reduces the load of the water pump and improves the overall efficiency of the water cooling system.

[0052] Optionally, the heat dissipation frame 31 includes a strip portion 311 fixed on the circuit board 1 and two protrusions 312 respectively provided at both ends of the strip portion 311, the second water cavity 35 passes through the strip portion 311, one end of the second water cavity 35 is formed with a second water inlet 313 on one of the protrusions 312, the other end of the second water cavity 35 is formed with a second water outlet 314 on another of the protrusions 312, the second water inlet 313 is connected to one of the water pipes 4, and the second water outlet 314 is connected to another of the water pipes 4; The height of the protrusion 312 protruding from the surface of the circuit board 1 is greater than the height of the strip portion 311 protruding from the surface of the circuit board 1 , and the heat conductive sheet 32 ​​is detachably fixed to the side wall of the strip portion 311 facing away from the circuit board 1 .

[0053] The strip portion 311 can be a long strip structure made of a metal material with good thermal conductivity, such as copper or aluminum; the bump 312 can be a protrusion structure made of the same material and higher than the strip portion 311; the second water cavity 35 can be a hollow channel passing through the strip portion 311; the second water inlet 313 and the second water outlet 314 can be a connecting hole structure arranged on the bump 312.

[0054] In this embodiment, the strip portion 311 can be fixed to the circuit board 1 by screws, or by other fasteners; the protrusion 312 can be integrally formed with the strip portion 311, or fixedly connected by welding or the like; the second water inlet 313 and the second water outlet 314 can be connected to the water pipe 4 by threaded joints or quick joints; the heat conductive sheet 32 ​​can be detachably fixed to the side wall of the strip portion 311 by screws, or by other detachable connection methods such as snaps.

[0055] It should be noted that the height of the protrusion 312 protruding from the surface of the circuit board 1 is greater than the height of the strip portion 311 protruding from the surface of the circuit board 1. This height difference is designed to facilitate the connection of the water pipe 4 and avoid interference between the water pipe 4 and other components; the side wall of the strip portion 311 facing away from the circuit board 1 refers to the plane on the strip portion 311 away from the circuit board 1, which is used to install the heat conductive sheet 32.

[0056] The structural design of this embodiment has multiple technical effects: first, the strip portion 311 adopts a through-type second water cavity 35 design to ensure that the coolant can flow smoothly and improve the heat exchange efficiency; second, bumps 312 higher than the strip portion 311 are provided at both ends of the strip portion 311. This structure is convenient for the connection and installation of the water pipe 4, and can ensure that the water pipe 4 and the memory bar, the heat conductive plate 32 and other components will not interfere with each other, thereby improving the integration of the device; finally, the side wall of the strip portion 311 is used to detachably fix the heat conductive plate 32. This design not only ensures effective heat transfer between the heat conductive plate 32 and the heat sink 31, but also facilitates the installation and removal of the heat conductive plate 32, thereby improving the maintainability of the device. At the same time, the overall structure is compact, and the limited installation space is fully utilized.

[0057] Optionally, the heat conducting sheet 32 ​​exchanges heat with the strip portion 311 via a second heat conducting pad 34 .

[0058] The second thermal pad 34 can be a sheet structure made of thermally conductive silicone, phase change material or other flexible materials with good thermal conductivity. These materials have certain compressibility and elasticity and can adapt to different installation gaps. Heat exchange means the process of heat transfer between two components.

[0059] This embodiment has multiple technical effects by disposing a second thermal pad 34 between the thermally conductive sheet 32 ​​and the strip portion 311: first, the compressible property of the second thermally conductive pad 34 can effectively fill the small gap between the thermally conductive sheet 32 ​​and the strip portion 311, ensuring sufficient contact between the two, reducing the thermal resistance caused by the air gap, and improving the heat conduction efficiency; second, the elastic property of the thermal pad can adapt to the small deformation of the thermally conductive sheet 32 ​​during use, maintain a stable contact pressure, and ensure long-term heat dissipation effect; third, the presence of the thermal pad can also buffer the stress during the installation of the thermally conductive sheet 32, avoid damage to the strip portion 311, and extend the service life of the device; finally, this design ensures the detachable nature of the thermally conductive sheet 32 ​​while achieving efficient heat transfer through the thermal pad, so that the heat of the memory module can be transferred to the water cooling system more quickly, further improving the overall heat dissipation performance.

[0060] Optionally, the heat dissipation rack 31 includes a plurality of second guide plates 315 disposed in the strip portion 311 , each of the second guide plates 315 extending in the direction of the line connecting the two protrusions 312 , the plurality of second guide plates 315 are arranged in parallel, and a second water discharge gap 316 is formed between any two connected second guide plates 315 .

[0061] The second guide plate 315 can be a sheet structure made of a metal material with good thermal conductivity, such as a copper sheet or an aluminum sheet; the parallel arrangement means that the extension directions of multiple second guide plates 315 are the same and parallel to each other; the second water gap 316 refers to a channel for the flow of coolant formed between two adjacent second guide plates 315.

[0062] In this embodiment, the second guide plate 315 can be fixed in the strip portion 311 by welding, or by setting a slot inside the strip portion 311 to fix the second guide plate 315; the second guide plate 315 extends in the direction of the line connecting the two protrusions 312, which means that the length direction of the guide plate is consistent with the flow direction of the coolant; the spacing between adjacent guide plates can be set according to the heat dissipation requirements and fluid resistance requirements.

[0063] By arranging a plurality of second guide plates 315 in the strip portion 311, multiple technical effects are achieved: first, the plurality of parallel second guide plates 315 significantly increase the contact area with the coolant, thereby improving the heat exchange efficiency of the heat sink 31; second, the extension direction of the guide plates is consistent with the connection direction of the protrusions 312, so that the coolant can flow smoothly along the channels formed by the guide plates, thereby reducing the flow resistance; third, the arrangement of the plurality of guide plates also plays a supporting role, thereby enhancing the structural strength of the strip portion 311 and preventing deformation when the high-pressure coolant flows; finally, by reasonably setting the number and spacing of the guide plates, sufficient heat exchange area can be ensured and fluid resistance can be optimized, thereby reducing the water pump load while providing a good heat dissipation effect and improving the overall efficiency of the water cooling system.

[0064] In some embodiments, a circuit board 1 may have a plurality of memory module installation positions 12 , and each memory module installation position 12 is provided with a memory heat dissipation component 3 .

[0065] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A circuit board (1) having a CPU mounting position (11) and a memory module mounting position (12); A water cooling plate (2) is fixed to the circuit board (1) and is located on the top of the CPU installation position (11), and a first water flow cavity (21) is formed in the water cooling plate (2); A memory heat dissipation assembly (3), comprising two heat dissipation frames (31) and a heat conductive sheet (32), wherein the two heat dissipation frames (31) are both fixed to the circuit board (1) and are respectively located on two opposite sides of the memory bar installation position (12), a second water discharge cavity (35) is formed in each of the heat dissipation frames (31), and both ends of the heat conductive sheet (32) are respectively detachably fixed to the two heat dissipation frames (31), and the heat conductive sheet (32) is used for heat exchange with the memory bar installed on the memory bar installation position (12) and the two heat dissipation frames (31); as well as A plurality of water delivery pipes (4), wherein the plurality of water delivery pipes (4) are used to connect the first water flow cavity (21) and the two second water flow cavities (35) to form a water flow channel.

2. The heat dissipation device according to claim 1, characterized in that: The heat conducting sheet (32) comprises a first aluminum sheet (321), a second aluminum sheet (322) and a heat pipe (323); the heat pipe (323) is arranged in a flat shape; one side of the heat pipe (323) is connected to the first aluminum sheet (321), and the other side of the heat pipe (323) is connected to the second aluminum sheet (322); The two ends of the second aluminum sheet (322) are respectively detachably fixed to the two heat dissipation frames (31).

3. The heat dissipation device according to claim 2, characterized in that: A mounting groove (322a) is recessed on one side of the second aluminum sheet (322), the first aluminum sheet (321) and the heat pipe (323) are both mounted in the mounting groove (322a), and the side of the heat pipe (323) close to the bottom of the mounting groove (322a) is connected to the bottom of the mounting groove (322a).

4. The heat dissipation device according to claim 2, characterized in that: The side of the second aluminum sheet (322) away from the heat pipe (323) is connected to the memory bar installed in the memory bar installation position (12) through the first thermal pad (33).

5. The heat dissipation device according to claim 1, characterized in that: There are a plurality of heat conducting sheets (32), and the plurality of heat conducting sheets (32) are arranged in parallel and at intervals, and a memory bar is installed between any two adjacent heat conducting sheets (32).

6. The heat dissipation device according to claim 1, characterized in that: The water-cooling plate (2) comprises a bottom plate (22), an upper cover (23) and a plurality of first drainage plates (24); the bottom plate (22) and the upper cover (23) together enclose a first water flow cavity (21); the plurality of first drainage plates (24) extend in parallel in the first water flow cavity (21); and a first water flow gap (25) is formed between any two connected first drainage plates (24).

7. The heat dissipation device according to claim 6, characterized in that: The upper cover (23) is provided with a first water inlet (231) and a first water outlet (232), wherein the first water inlet (231) is connected to one of the plurality of water pipes (4), and the first water outlet (232) is connected to another of the plurality of water pipes (4); wherein: The direction of a line connecting the first water inlet (231) and the first water outlet (232) is the same as the extension direction of the first guide plate (24).

8. The heat dissipation device according to claim 1, characterized in that: The heat dissipation frame (31) comprises a strip portion (311) fixed on the circuit board (1) and two protrusions (312) respectively arranged at two ends of the strip portion (311); the second water cavity (35) passes through the strip portion (311); one end of the second water cavity (35) is formed with a second water inlet (313) on one of the protrusions (312); the other end of the second water cavity (35) is formed with a second water outlet (314) on the other of the protrusions (312); the second water inlet (313) is connected to one of the water pipes (4); and the second water outlet (314) is connected to another of the water pipes (4); The height of the protrusion (312) protruding from the surface of the circuit board (1) is greater than the height of the strip-shaped portion (311) protruding from the surface of the circuit board (1), and the heat conducting sheet (32) is detachably fixed to the side wall of the strip-shaped portion (311) facing away from the circuit board (1).

9. The heat dissipation device according to claim 8, characterized in that: The heat conducting sheet (32) exchanges heat with the strip portion (311) via a second heat conducting pad (34).

10. The heat dissipation device according to claim 8, characterized in that: The heat sink (31) comprises a plurality of second guide plates (315) arranged in the strip portion (311), each of the second guide plates (315) extending in the direction of the line connecting the two protrusions (312), the plurality of second guide plates (315) being arranged in parallel, and a second water discharge gap (316) being formed between any two connected second guide plates (315).

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