Anti-shake circuit board and preparation method thereof, camera module and electronic equipment

Abstract

The invention provides an anti-shake circuit board, a preparation method of the anti-shake circuit board, a camera module and electronic equipment. The anti-shake circuit board is divided into the connecting area and the movable area (used for bearing and connecting electronic elements such as an image sensor), the inner layer of the connecting area is arranged to be the suspension wire area containing the plurality of spaced suspension wires, and the circuit layer is arranged on the outer layer of the connecting area, so that the suspension wire area of the inner layer and the circuit layer of the circuit board of the outer layer are arranged separately; the vibration process is not affected by each other, the wiring width of the upper circuit layer is not limited, the lamination is not limited, the wiring density can be improved, and the circuit manufacturing difficulty is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to an anti-shake circuit board and a preparation method thereof, a camera module and an electronic device. Background Art

[0002] In recent years, with the rapid development of smartphones, photography as its core demand has been constantly upgraded and evolved. How to obtain stable and clear image quality under shaking is a higher demand of users for camera modules. In order to achieve high-quality, multi-scene application shooting functions, anti-shake has become a standard feature of camera modules.

[0003] There are many mainstream anti-shake technologies on the market. For example, electronic image stabilization, optical image stabilization, sensor-shift image stabilization (SIS) or micro stabilization are used to compensate or reduce image blur caused by vibration and overcome shaking, thereby improving the camera effect.

[0004] SIS and the image sensor are bonded together to form a whole. After obtaining the jitter parameters of the terminal containing the camera module, SIS controls the movement of the image sensor to compensate for the jitter error, thereby achieving the anti-shake effect. Currently, the suspended board design has been used in sensor anti-shake products. However, because each suspension wire needs to be hollowed out (generally it needs to be cut) and wiring needs to be done on the suspension wire, the spacing between the suspension wires is large, the line wiring width and density are limited by the width of the suspension wire, the wiring flexibility is limited, and the lines above the suspension wires also need to be separated, which wastes a lot of space and is difficult to process. Summary of the invention

[0005] In view of this, the present application proposes an anti-shake circuit board to solve at least one of the above problems.

[0006] In addition, it is also necessary to provide a camera module and an electronic device including the anti-shake circuit board.

[0007] An embodiment of the present application provides an anti-shake circuit board, which includes an inner substrate and an outer circuit board. The inner substrate includes a suspension wire area, the suspension wire area includes a plurality of suspension wires arranged at intervals, and there are through grooves between adjacent suspension wires. The outer circuit board includes a base material layer and a circuit layer formed on the surface of the base material layer.

[0008] The anti-shake circuit board has a groove, and the groove runs through the outer circuit board. The groove includes a first groove and a second groove. Along the arrangement direction of the first groove and the second groove, the anti-shake circuit board on the side of the first groove away from the second groove is a fixed area, the anti-shake circuit board between the first groove and the second groove is a connecting area, and the anti-shake circuit board on the side of the second groove away from the first groove is an active area. The hanging wire area is located in the connecting area, the active area is used to carry and connect electronic components, and the hanging wire area is used to move to control the movement of the electronic components to compensate for the jitter error.

[0009] In one embodiment, the inner substrate is made of an alloy, which includes a transition metal and its carbide or oxide and two or more metal elements of iron, cobalt, nickel or copper, and the transition metal includes titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, tungsten, molybdenum or beryllium.

[0010] In one embodiment, the inner substrate is made of titanium-copper alloy.

[0011] In one embodiment, the anti-shake circuit board further includes an adhesive layer, wherein the adhesive layer is located between the inner substrate and the base material layer, and the adhesive layer does not cover the hanging wire area.

[0012] In one implementation, the anti-shake circuit board further includes a conductive structure, and the circuit layer and the inner substrate are electrically connected via the conductive structure.

[0013] In one embodiment, the anti-shake circuit board further includes a protective layer. The protective layer is disposed on a side of the outer circuit board away from the inner substrate, and the groove penetrates the protective layer.

[0014] An embodiment of the present application provides a method for preparing an anti-shake circuit board, the method comprising the following steps:

[0015] Forming a hanging wire area in a preset area of ​​the substrate to obtain an inner substrate, wherein the inner substrate includes the hanging wire area, the hanging wire area includes a plurality of hanging wires arranged at intervals, and through grooves are provided between adjacent hanging wires;

[0016] A bonding layer and an outer substrate are laminated on the outer side of the inner substrate, wherein the bonding layer is located between the inner substrate and the outer substrate; the outer substrate comprises a base material layer and a copper foil layer, and the bonding layer has an opening, and the opening corresponds to the hanging wire area;

[0017] The copper foil layer is manufactured into a circuit layer, and the circuit layer and the substrate layer form an outer circuit board;

[0018] A first groove and a second groove are arranged on the outer circuit board to obtain the anti-shake circuit board; along the arrangement direction of the first groove and the second groove, the anti-shake circuit board on the side of the first groove away from the second groove is a fixed area, the anti-shake circuit board between the first groove and the second groove is a connecting area, and the anti-shake circuit board on the side of the second groove away from the first groove is an active area; the hanging wire area is located in the connecting area, the active area is used to carry and connect electronic components, and the hanging wire area is used to move to control the movement of the electronic components to compensate for jitter errors.

[0019] In one embodiment, before the step of forming the copper foil layer into a circuit layer, the preparation method further includes: setting a conductive structure on the outer substrate, the conductive structure electrically connecting the copper foil layer and the inner substrate; after the step of forming the copper foil layer into a circuit layer, the preparation method further includes: setting a protective layer on the outer side of the outer circuit board.

[0020] An embodiment of the present application provides a camera module, which includes an image sensor and the anti-shake circuit board as described above. The active area of ​​the anti-shake circuit board is connected to the image sensor.

[0021] An embodiment of the present application provides an electronic device, which includes the camera module as described above.

[0022] The present application divides the anti-shake circuit board into a connection area and an active area (for carrying and connecting electronic components such as image sensors), sets the inner layer of the connection area as a suspension wire area containing a plurality of spaced suspension wires, and sets a circuit layer on the outer layer of the connection area, so that the inner layer suspension wire area and the circuit layer of the outer layer circuit board are set separately, the vibration process is not affected by each other, the wiring width of the upper circuit layer is not restricted, and the stacking is not limited, which can not only improve the wiring density but also reduce the difficulty of circuit production. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of an anti-shake circuit board provided in one embodiment of the present application.

[0024] Figure 2 for Figure 1 The cross-sectional schematic diagram of the anti-shake circuit board along II-II is shown.

[0025] Figures 3 to 12 For preparation Figure 2 The process cross-sectional diagram of the anti-shake circuit board is shown.

[0026] Fig.13 A schematic diagram of the module composition of a camera module provided in one embodiment of the present application.

[0027] Fig.14A schematic diagram of the module composition of an electronic device provided in one embodiment of the present application.

[0028] Main component symbols

[0029] Anti-shake circuit board 100

[0030] Inner substrate 10

[0031] Outer circuit board 20

[0032] Adhesive layer 30

[0033] Conductive structure 40

[0034] Protective layer 50

[0035] Suspended filament area 11

[0036] Suspended 12

[0037] Through slot 13

[0038] First groove 101

[0039] Second groove 102

[0040] Fixed area 110

[0041] Connection Zone 120

[0042] Activity Zone 130

[0043] Base material layer 21

[0044] Circuit layer 22

[0045] Connector 1

[0046] Substrate 10a

[0047] Outer substrate 20a

[0048] Copper foil layer 22a

[0049] Opening 31

[0050] Resist film 60

[0051] Part 161

[0052] Part 262

[0053] Camera module 200

[0054] Image Sensor 201

[0055] Electronic equipment 1000

[0056] The following specific implementation manner will further illustrate the embodiments of the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the technical field of the present application. The terms used herein are only for the purpose of describing specific implementation methods and are not intended to limit the present application embodiments.

[0058] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0059] It will be understood that when a layer is referred to as being “on” another layer, it can be directly on the other layer or intervening layers may be present therebetween. In contrast, when a layer is referred to as being “directly on” another layer, there are no intervening layers present.

[0060] Here, the embodiments of the present application are described with reference to the cross-sectional views, which are schematic diagrams of the idealized embodiments (and intermediate configurations) of the present application. Thus, it is foreseeable that the shapes of the diagrams are different due to manufacturing processes and / or tolerances. Therefore, the embodiments of the present application should not be interpreted as being limited to the specific shapes of the regions illustrated here, but should include deviations in shapes such as those produced due to manufacturing. The regions shown in the figures are themselves only schematic, and their shapes are not intended to illustrate the actual shapes of the devices, and are not intended to limit the scope of the present application.

[0061] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0062] See also Figure 1 and Figure 2 In a first aspect, the present application provides an anti-shake circuit board 100, which includes an inner substrate 10 and an outer circuit board 20. In this embodiment, the outer circuit board 20 is located at the upper and lower sides of the inner substrate 10 in the thickness direction. In other embodiments, the outer circuit board 20 may also be located only on the upper side or the lower side of the inner substrate 10.

[0063] The inner substrate 10 includes a suspension wire area 11, and the suspension wire area 11 includes a plurality of suspension wires 12 arranged at intervals, and a through groove 13 is provided between adjacent suspension wires 12, and the through groove 13 penetrates the inner substrate 10 along the thickness direction. The suspension wire 12 is the remaining portion after a preset area of ​​the inner substrate 10 (for example, the middle area of ​​the inner substrate 10) is etched and hollowed out. The outer circuit board 20 includes a substrate layer 21 and a circuit layer 22 formed on the surface of the substrate layer 21. In this embodiment, the substrate layer 21 is located between the inner substrate 10 and the circuit layer 22. In other embodiments, the circuit layer 22 may also be located between the substrate layer 21 and the inner substrate 10.

[0064] like Figure 1 and Figure 2 As shown, the anti-shake circuit board 100 has a groove, and the groove penetrates the outer circuit board 20 along the thickness direction. The groove includes a first groove 101 and a second groove 102. Along the arrangement direction of the first groove 101 and the second groove 102, the first groove 101 is away from the side of the second groove 102 (i.e. Figure 2 The anti-shake circuit board 100 on the left side of the first groove 101 is the fixing area 110, the anti-shake circuit board 100 between the first groove 101 and the second groove 102 is the connecting area 120, and the second groove 102 is away from the first groove 101 (i.e. Figure 2 The anti-shake circuit board 100 on the right side of the second groove 102 in the inner substrate 10 is the active area 130. The hanging wire area 11 is located in the connection area 120. The first groove 101 and the second groove 102 can also be regarded as the boundary between the hanging wire area 11 and the rest of the inner substrate 10 (the part other than the hanging wire area 11). The fixed area 110 can be used to connect the terminal interface, for example, Figure 2 As shown, the fixed area 110 can be used to connect the connector 1. The active area 130 is used to carry and connect electronic components (not shown), and the electronic components can be but are not limited to image sensors, etc. Since the suspension wire area 11 has a plurality of suspension wires 12 arranged at intervals (hollowed out), it can be used to move to control the movement of the electronic components to compensate for the jitter error.

[0065] like Figure 1As shown, in order to ensure the flatness of the electronic component (for example, image sensor) in the z direction (the direction perpendicular to the plane of the image sensor), the connection area 120 of the anti-shake circuit board 100 is required to have a larger bending section coefficient in the z direction. On the other hand, in order to compensate for the error of the image sensor moving in the x direction and the y direction (the x direction and the y direction are two mutually perpendicular directions on the surface where the image sensor is located) (to achieve the anti-shake function) and reduce the driving force, the suspension wire 12 is required to have a smaller bending section coefficient in the x direction and the y direction. Compared with the design of combining multiple suspension wires 12 into a whole suspension wire 12, the suspension wire area 11 is designed to include multiple single suspension wires 12 arranged at intervals, and the suspension wires 12 have a smaller width, a larger number, and a higher aspect ratio. The two designs have the same bending resistance in the z direction, but the design of multiple single suspension wires 12 arranged at intervals has a smaller bending section coefficient in the x direction and the y direction, which is more conducive to compensating for the error of the image sensor moving in the x direction and the y direction.

[0066] In the connection area 120 of the anti-shake circuit board 100, the inner layer suspension wire area 11 and the corresponding outer layer circuit board 20 are separately arranged, the vibration process does not affect each other, the wiring width of the upper layer circuit layer 22 is not restricted, and the stacking is not limited, which can improve the wiring density and reduce the difficulty of circuit production.

[0067] In some embodiments, the shape of the connection area 120 may be arc-shaped, rectangular (with right-angle corners), etc. The shape of the suspension wire 12 may be linear, arc-shaped, serpentine, etc. The serpentine or arc-shaped suspension wire 12 can reduce the deformation driving force and reduce the bending deformation.

[0068] In some embodiments, in the corner area of ​​the anti-shake circuit board 100 , an adhesive layer 30 may be provided in a partial area between the suspension wire 12 and the substrate layer 21 to ensure the stability of the suspension wire 12 during the movement process.

[0069] like Figure 2 As shown, in some embodiments, the anti-shake circuit board 100 further includes an adhesive layer 30, and the adhesive layer 30 is used to bond the inner substrate 10 and the outer circuit board 20. The adhesive layer 30 is located between the inner substrate 10 and the outer circuit board 20, and the adhesive layer 30 does not cover the hanging wire area 11. The adhesive layer 30 is not disposed between the first groove 101 and the second groove 102, and the adhesive layer 30 is located on the side of the first groove 101 away from the second groove 102 (i.e. Figure 2 The left side of the first groove 101 in the middle) and the side of the second groove 102 away from the first groove 101 (i.e. Figure 2The left side of the second groove 102 in the inner substrate 10). In this embodiment, the groove also penetrates the entire adhesive layer 30 in the thickness direction, and part of the surface of the inner substrate 10 is exposed from the groove. That is, the side walls of the first groove 101 (the second groove 102) are the outer circuit board 20 and the adhesive layer 30, and the bottom wall is the inner substrate 10. In other embodiments, the groove may only penetrate the outer circuit board 20 without penetrating the adhesive layer 30 in the thickness direction, and the side walls of the first groove 101 (the second groove 102) are the outer circuit board 20, and the bottom wall is the adhesive layer 30. In other embodiments, the groove may penetrate the outer circuit board 20 and part of the adhesive layer 30 in the thickness direction, and the side walls of the first groove 101 (the second groove 102) are the outer circuit board 20 and the adhesive layer 30, and the bottom wall is the adhesive layer 30.

[0070] Furthermore, the material of the adhesive layer 30 may be, but is not limited to, epoxy resin glue or acrylic.

[0071] like Figure 2 As shown, in some embodiments, the anti-shake circuit board 100 further includes a conductive structure 40. The circuit layer 22 of the outer circuit board 20 and the inner substrate 10 (part of the non-hanging wire area 11) are electrically connected through the conductive structure 40, and the conductive structure 40 can be but is not limited to a conductive hole.

[0072] like Figure 2 As shown, in some embodiments, the anti-shake circuit board 100 further includes a protective layer 50. The protective layer 50 is disposed on the side of the outer circuit board 20 away from the inner substrate 10, and the protective layer 50 covers the circuit layer 22 and the surface of the substrate layer 21 exposed from the circuit layer 22. The protective layer 50 can be a cover film layer (cover-lay, CVL) or a solder mask. The protective layer 50 is used to protect the outer circuit board 20 from being invaded by external water vapor or scratched by foreign objects. The grooves (the first groove 101 and the second groove 102) also penetrate the protective layer 50 in the thickness direction.

[0073] In some embodiments, the material of the inner substrate 10 is an alloy. The alloy includes a transition metal and its carbide or oxide and two or more metal elements of iron, cobalt, nickel or copper. The transition metal may be, but is not limited to, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, tungsten, molybdenum or beryllium. For example, the material of the inner substrate 10 may be an alloy of a transition metal (titanium) and iron, an alloy of a transition metal carbide and cobalt, an alloy of a transition metal oxide and nickel, an alloy of a transition metal (zirconium and hafnium) and copper, and so on.

[0074] In some embodiments, the inner substrate 10 is made of a titanium-copper alloy, which has high hardness and strength, and has good electrical conductivity and elongation, which is beneficial for reducing the overall thickness of the anti-shake circuit board 100 and making it thinner.

[0075] In some embodiments, the substrate layer 21 may be made of, but is not limited to, flexible materials such as polyimide (PI), polyester (PET), polyethylene terephthalate (PEN), and polydimethylsiloxane (PDMS).

[0076] See also Figures 3 to 12 A second aspect of the present application provides a method for preparing an anti-shake circuit board 100, and the preparation method includes steps S10 to S20.

[0077] like Figure 3 As shown, step S10, providing a substrate 10a. The material of the substrate 10a is an alloy, and the alloy includes a transition metal and its carbide or oxide and two or more metal elements of iron, cobalt, nickel or copper. The transition metal may be but not limited to titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, tungsten, molybdenum or beryllium. In this embodiment, the material of the substrate 10a is a titanium-copper alloy.

[0078] like Figure 4 As shown, step S11, laminating: laminating the anti-etching film 60 on the upper and lower sides of the substrate 10a respectively, and the anti-etching film 60 can be but is not limited to a dry film.

[0079] like Figure 5 As shown, step S12, exposure: exposing the resist film 60 to form an exposed first portion 61 and an unexposed second portion 62. The first portion 61 and the second portion 62 are arranged alternately.

[0080] like Figure 6 As shown, step S13, development: the unexposed second portion 62 can be removed by a developing solution, and the first portion 61 is retained. The developing solution can be a conventional or unconventional developing solution in the art, and the present application is not limited thereto, as long as the unexposed second portion 62 can be removed. The developing solution can be a sodium carbonate solution.

[0081] like Figure 7 As shown, step S14, etching: etching the substrate 10a not blocked by the first portion 61 with an etching liquid. The etched substrate 10a forms a through groove 13, and the substrate 10a between adjacent through grooves 13 forms a plurality of suspended wires 12 arranged at intervals, and the suspended wires 12 and the through grooves 13 constitute a suspended wire area 11. The etching liquid can be a conventional or unconventional etching liquid in the art, and the present application does not limit it.

[0082] like Figure 8As shown, step S15, film stripping: the first portion 61 can be removed by using a sodium hydroxide solution to obtain the inner substrate 10.

[0083] like Fig. 9 As shown, in step S16, the adhesive layer 30 and the outer substrate 20a are pressed together on the outer side of the inner substrate 10, and the adhesive layer 30 is located between the inner substrate 10 and the outer substrate 20a. The outer substrate 20a includes a base material layer 21 and a copper foil layer 22a. In this embodiment, the base material layer 21 is located between the adhesive layer 30 and the copper foil layer 22a. In other embodiments, the copper foil layer 22a may be located between the adhesive layer 30 and the base material layer 21. The adhesive layer 30 has an opening 31, and the opening 31 can penetrate the adhesive layer 30 along the thickness direction. The opening 31 corresponds to the hanging wire area 11, and the orthographic projection of the opening 31 can completely cover the hanging wire area 11.

[0084] like Fig.10 As shown, in step S17, holes (not shown) may be formed on the outer substrate 20a and the bonding layer 30 by, but not limited to, laser drilling, mechanical drilling, etc., and then copper is plated in the holes by electroplating, etc., to form a conductive structure 40. The conductive structure 40 electrically connects the copper foil layer 22a and the inner substrate 10.

[0085] like Fig.11 As shown, in step S18, the copper foil layer 22a can be made into a circuit layer 22 by laminating, exposing, developing, etching, stripping and other steps. The laminating, exposing, developing, etching, stripping and other steps are common technical means in the art and are not repeated here. The circuit layer 22 and the substrate layer 21 form the outer circuit board 20.

[0086] like Fig.12 As shown, in step S19, a protective layer 50 is provided on the outer side of the outer circuit board 20. The protective layer 50 covers the circuit layer 22 and the surface of the substrate layer 21 exposed from the circuit layer 22. The protective layer 50 can be a covering film layer or a solder mask layer.

[0087] like Figure 2 As shown, in step S20, a first groove 101 and a second groove 102 are provided on the outer circuit board 20 to obtain an anti-shake circuit board 100. The first groove 101 and the second groove 102 penetrate the outer circuit board 20 along the thickness direction. In this embodiment, part of the surface of the inner substrate 10 is exposed from the first groove 101 and the second groove 102, and the first groove 101 and the second groove 102 are respectively connected to the opening 31 of the adhesive layer 30.

[0088] See also Fig.13In a third aspect, the present application provides a camera module 200, which includes an image sensor 201 and the anti-shake circuit board 100 as described above. The active area 130 of the anti-shake circuit board 100 carries and connects the image sensor 201. For example, the image sensor 201 and the active area 130 can be glued together, and the image sensor 201 can be electrically connected to the anti-shake circuit board 100 through a wire.

[0089] The image sensor 201 may be a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), which is not limited in the present application.

[0090] Of course, the camera module 200 also includes components such as a lens, a filter, and a lens holder, which will not be described in detail here.

[0091] See also Fig.14 In a fourth aspect, the present application provides an electronic device 1000, which includes the camera module 200 as described above. The electronic device 1000 may be, but is not limited to, electronic products such as mobile phones, AR, VR, etc.

[0092] The present application divides the anti-shake circuit board 100 into a connection area 120 and an active area 130 (for carrying and connecting electronic components such as an image sensor 201), sets the inner layer of the connection area 120 as a suspension wire area including a plurality of spaced suspension wires 12, and sets a circuit layer 22 on the outer layer of the connection area 120, so that the inner layer suspension wire area 11 and the circuit layer 22 of the outer layer circuit board 20 are set separately, the vibration process is not affected by each other, the wiring width of the upper layer circuit layer 22 is not restricted, and the stacking is not limited, which can not only improve the wiring density but also reduce the difficulty of circuit production.

[0093] The above descriptions are some specific implementations of the present application, but they are not limited to these implementations in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. An anti-shake circuit board, characterized in that: include: An inner substrate, the inner substrate comprising a suspension wire area, the suspension wire area comprising a plurality of suspension wires arranged at intervals, and through grooves between adjacent suspension wires; and An outer layer circuit board, the outer layer circuit board comprising a substrate layer and a circuit layer formed on a surface of the substrate layer; Among them, the anti-shake circuit board has a groove, and the groove runs through the outer circuit board; the groove includes a first groove and a second groove, and along the arrangement direction of the first groove and the second groove, the anti-shake circuit board on the side of the first groove away from the second groove is a fixed area, the anti-shake circuit board between the first groove and the second groove is a connecting area, and the anti-shake circuit board on the side of the second groove away from the first groove is an active area; the hanging wire area is located in the connecting area, the active area is used to carry and connect electronic components, and the hanging wire area is used to move to control the movement of the electronic components to compensate for jitter errors.

2. The anti-shake circuit board according to claim 1, characterized in that: The inner substrate is made of an alloy, which includes transition metals and their carbides or oxides and two or more metal elements such as iron, cobalt, nickel or copper. The transition metal includes titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, tungsten, molybdenum or beryllium.

3. The anti-shake circuit board according to claim 2, characterized in that: The inner substrate is made of titanium-copper alloy.

4. The anti-shake circuit board according to claim 1, characterized in that: The anti-shake circuit board further includes a bonding layer, wherein the bonding layer is located between the inner substrate and the base material layer, and the bonding layer does not cover the hanging wire area.

5. The anti-shake circuit board according to claim 1, wherein: The anti-shake circuit board also includes a conductive structure, and the circuit layer and the inner substrate are electrically connected via the conductive structure.

6. The anti-shake circuit board according to claim 1, wherein: The anti-shake circuit board further includes a protective layer, which is arranged on a side of the outer circuit board away from the inner substrate, and the groove runs through the protective layer.

7. A method for preparing an anti-shake circuit board, characterized in that: The preparation method comprises the following steps: Forming a hanging wire area in a preset area of ​​the substrate to obtain an inner substrate, wherein the inner substrate includes the hanging wire area, the hanging wire area includes a plurality of hanging wires arranged at intervals, and through grooves are provided between adjacent hanging wires; A bonding layer and an outer substrate are laminated on the outer side of the inner substrate, wherein the bonding layer is located between the inner substrate and the outer substrate; the outer substrate comprises a base material layer and a copper foil layer, and the bonding layer has an opening, and the opening corresponds to the hanging wire area; The copper foil layer is manufactured into a circuit layer, and the circuit layer and the substrate layer form an outer circuit board; A first groove and a second groove are arranged on the outer circuit board to obtain the anti-shake circuit board; along the arrangement direction of the first groove and the second groove, the anti-shake circuit board on the side of the first groove away from the second groove is a fixed area, the anti-shake circuit board between the first groove and the second groove is a connecting area, and the anti-shake circuit board on the side of the second groove away from the first groove is an active area; the hanging wire area is located in the connecting area, the active area is used to carry and connect electronic components, and the hanging wire area is used to move to control the movement of the electronic components to compensate for jitter errors.

8. The preparation method according to claim 7, characterized in that: Before the step of forming the circuit layer from the copper foil layer, the preparation method further includes: setting a conductive structure on the outer substrate, the conductive structure electrically connecting the copper foil layer and the inner substrate; after the step of forming the circuit layer from the copper foil layer, the preparation method further includes: setting a protective layer on the outer side of the outer circuit board.

9. A camera module, characterized in that: The camera module comprises an image sensor and an anti-shake circuit board as claimed in any one of claims 1 to 6, and the active area of ​​the anti-shake circuit board is connected to the image sensor.

10. An electronic device, characterized in that: The electronic device comprises the camera module as claimed in claim 9.

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