Radiator of controller power module

Abstract

The invention provides a radiator of a controller power module, and the radiator comprises a bottom plate which is in contact with the controller power module. A plurality of flow guide structures are distributed on the bottom plate at intervals, and an airflow generating device is arranged at one end of the bottom plate; the airflow generating device generates airflow, and the airflow flows along the plurality of flow guide structures, so that the controller power module is cooled. The bottom plate is in contact with the controller power module, and heat generated by the controller power module is transmitted to the bottom plate. Air flow is formed under the action of the air flow generating device, and heat is conducted to the flow guide structure when the air flow flows through the heat conduction structure. Gas can be reflected when colliding with the surfaces of the flow guide structures, so that vortexes are formed among the different flow guide structures, and the flowability of the gas is improved. The airflow generating device can increase the flowability of the gas, and the heat dissipation efficiency of the controller power module can be improved under the flow guide and reflection effects of the flow guide structure.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation equipment, and in particular to a heat sink of a controller power module. Background Art

[0002] As the market demand for variable frequency air conditioners continues to increase, the production models and quantities of variable frequency compressors continue to increase, and users' quality requirements for variable frequency compressors continue to increase, so the testing requirements for variable frequency compressors are also increasing. Since the test requires the use of a controller to drive the compressor to operate, for some test items with harsh test conditions, the heat generated by the controller power module will increase.

[0003] The heat sink commonly used on the market is a straight-fin heat sink, which has uneven heat dissipation. During the heat dissipation process using a straight-fin heat sink, the fluidity of the gas is poor, and the contact area between the airflow and the straight fins is small, which cannot promptly remove the heat generated by the controller power module.

[0004] Therefore, a gas with good fluidity and a large contact area between the fins and the airflow is required, so that the controller power module can be cooled in time to avoid damage to the controller due to excessive temperature. Summary of the invention

[0005] In order to overcome the problems existing in the related art, the purpose of the present invention is to provide a heat sink for a controller power module, which has good gas fluidity and a large contact area between the fins and the airflow, so that the controller power module can be cooled in time to avoid damage to the controller due to excessive temperature.

[0006] A heat sink for a controller power module comprises a base plate, the base plate is in contact with the controller power module; a plurality of flow guide structures are spaced apart on the base plate, an airflow generating device is provided at one end of the base plate; the airflow generating device generates airflow, and the airflow flows along the plurality of flow guide structures, thereby dissipating heat for the controller power module.

[0007] The bottom plate is in contact with the controller power module, and the heat generated by the controller power module is transferred to the bottom plate. An airflow is formed under the action of the airflow generating device, and the airflow transfers the heat to the flow-conducting structure when it flows through the heat-conducting structure. When the gas collides with the surface of the flow-conducting structure, it will be reflected, thereby forming eddies between different flow-conducting structures, which improves the fluidity of the gas. The airflow generating device increases the fluidity of the gas, and under the guidance and reflection of the flow-conducting structure, the efficiency of heat dissipation for the controller power module can be improved.

[0008] In a preferred technical solution of the present invention, the guide structure includes fins, and a plurality of the fins are distributed on the bottom plate at intervals.

[0009] When the gas collides with the guide structure, it will be reflected, and eddies can be formed between different fins, which can improve the fluidity of the gas, thereby improving the efficiency of heat dissipation for the controller power module. The gaps between the guide structures on the bottom plate form a guide channel, and the gas flows along the guide channel. During the flow, the gas exchanges heat with multiple guide structures, thereby transferring the heat of the controller power module to the guide structure and reducing the temperature of the controller power module.

[0010] In a preferred technical solution of the present invention, the fin includes a first guide portion and a second guide portion, the first guide portion is connected to or integrally formed with the second guide portion, and a guide angle is formed between the first guide portion and the second guide portion.

[0011] The length of the first guide portion is the same as that of the second guide portion. The first end of the first guide portion is connected to or integrally formed with the first end of the second guide portion, and the second end of the first guide portion is spaced apart from the second end of the second guide portion. The connection between the first guide portion and the second guide portion forms a vertex, and the second end of the first guide portion and the second end of the second guide portion form an opening.

[0012] In a preferred technical solution of the present invention, the diversion angle ranges from 15 to 35 degrees.

[0013] Within the above angle range, the larger the guide angle, the larger the angle at which the fin reflects the gas, making it easier to form vortices between different fins, thereby improving the fluidity of the gas. Within the above angle range, the smaller the guide angle, the smaller the contact area between the airflow and the fin, resulting in reduced heat dissipation efficiency.

[0014] In a preferred technical solution of the present invention, a plurality of bases are arranged near the airflow generating device, and the airflow generating device is screwed to the bases.

[0015] The base serves to fix the airflow generating device on the bottom plate. Providing multiple bases can enhance the stability of the airflow generating device and reduce the vibration of the airflow generating device.

[0016] In a preferred technical solution of the present invention, the airflow generating device is a cooling fan, the cooling fan is provided with a plurality of first mounting holes, the base is provided with a second mounting hole, and the first mounting hole and the second mounting hole are aligned.

[0017] Align the cooling fan with the base, place the cooling fan on the base from top to bottom, and insert the screws into the first mounting hole and the second mounting hole to fix the cooling fan on the base.

[0018] In a preferred technical solution of the present invention, the guide structure further includes a heat dissipation baffle, and the heat dissipation baffle is disposed on both sides of the bottom plate.

[0019] The height of the fins and heat dissipation baffles on the bottom plate is greater than or equal to the height of the airflow generating device to ensure that the PCB board faces upward, and the fins and heat dissipation baffles on the bottom plate for heat dissipation can be placed horizontally downward. Multiple heat dissipation baffles are arranged at intervals on both sides of the bottom plate facing the controller power module, and the heat dissipation baffles are parallel to the controller power module. The heat dissipation baffles are used to dissipate heat and change the flow direction of the airflow, so that the airflow passes through the fins in the middle of the bottom plate as much as possible, thereby taking away more heat.

[0020] In a preferred technical solution of the present invention, the first end of the first guide portion is connected to or integrally formed with the first end of the second guide portion, and the second end of the first guide portion is spaced apart from the second end of the second guide portion.

[0021] The first end of the first guide portion is connected to the second end of the second guide portion, and the connection forms a vertex. The second end of the first guide portion and the second end of the second guide portion are spaced apart from each other to form an opening.

[0022] In a preferred technical solution of the present invention, the fin is bent, and openings are formed at both ends of the fin; the fin includes a protrusion, and the protrusion faces the airflow generating device.

[0023] The curvature of each part of the C-shaped fin changes relatively little, so the airflow can flow through the C-shaped fin more smoothly, reducing the impact when different airflows converge in one place. In addition, the arc-shaped C-shaped fin has a streamlined structure, so that the airflow flows along the arc surface of the C-shaped fin, the heat exchange time is longer, and the C-shaped fin can absorb more heat.

[0024] In a preferred technical solution of the present invention, a PCB board is connected to a side of the controller power module away from the base plate.

[0025] The controller is soldered on the PCB board, and the controller power module is a component of the controller. The controller power module generates a lot of heat when running and transfers the heat to the base plate. The airflow is generated by the airflow generating device on the base plate, and the airflow is guided and heat is exchanged in combination with the fins and heat dissipation baffles on the base plate, so as to dissipate the heat of the controller power module in time.

[0026] The beneficial effects of the present invention are as follows: the present invention provides a heat sink for a controller power module, including a base plate, the base plate is in contact with the controller power module; a plurality of flow guide structures are spaced apart on the base plate, and an airflow generating device is provided at one end of the base plate; the airflow generating device generates an airflow, and the airflow flows along the plurality of flow guide structures, thereby dissipating heat for the controller power module. The base plate is in contact with the controller power module, and the heat generated by the controller power module is transferred to the base plate. An airflow is formed under the action of the airflow generating device, and the airflow conducts heat to the flow guide structure when flowing through the heat-conducting structure. When the gas collides with the surface of the flow guide structure, it will be reflected, thereby forming vortices between different flow guide structures, thereby improving the fluidity of the gas. The airflow generating device will increase the fluidity of the gas, and under the flow guidance and reflection action of the flow guide structure, the efficiency of heat dissipation for the controller power module can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a top view of a bottom plate of the present invention provided with V-shaped fins;

[0028] Figure 2 It is a schematic diagram of the base plate with V-shaped fins installed, the controller power module and the PCB board being connected to each other according to the present invention;

[0029] Figure 3 It is a schematic diagram of the assembly of the base plate with the cooling fan installed and the controller power module of the present invention;

[0030] Figure 4 It is a schematic structural diagram of the fin of the present invention;

[0031] Figure 5 It is a structural schematic diagram of the heat dissipation fan of the present invention;

[0032] Figure 6 is a schematic diagram of the airflow direction of the present invention;

[0033] Figure 7 yes Figure 6 Cross-sectional view along AA direction;

[0034] Figure 8 is a top view of a bottom plate of the present invention provided with C-shaped fins;

[0035] Fig. 9 It is a schematic diagram of the base plate with C-shaped fins installed, the controller power module and the PCB board being connected to each other according to the present invention;

[0036] Fig.10 yes Figure 1 Cross-sectional view along direction BB.

[0037] Figure numerals: 1. bottom plate; 2. controller power module; 3. fin; 4. first air guide portion; 5. second air guide portion; 6. base; 7. cooling fan; 8. first mounting hole; 9. second mounting hole; 10. heat dissipation baffle; 11. protrusion; 12. opening; 13. PCB board; 14. heat exchange protrusion. DETAILED DESCRIPTION

[0038] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0039] Example 1

[0040] like Figure 1-Figure 2 As shown, this embodiment provides a heat sink for a controller power module, including a base plate 1, which is in contact with a controller power module 2; a plurality of guide structures are spaced apart on the base plate 1, and an airflow generating device is provided at one end of the base plate 1; the airflow generating device generates an airflow, and the airflow flows along the plurality of guide structures, thereby dissipating the heat of the controller power module 2.

[0041] A plurality of third mounting holes are provided on the base plate 1 . The screw holes on the controller power module 2 are aligned with the third mounting holes, and screws are inserted into the screw holes on the controller power module 2 and the third mounting holes on the base plate 1 , thereby mounting the controller power module 2 on the base plate 1 .

[0042] An airflow generating device is provided on the bottom plate 1. When the airflow generating device is started, an airflow is formed under the action of the airflow generating device. A plurality of guide structures are provided on the flow path of the airflow, and there are gaps between adjacent guide structures. The heat generated by the controller power module 2 during operation will be transferred to the bottom plate 1. The airflow flows through the guide structure, and the airflow transfers the heat of the bottom plate 1 to the guide structure, thereby dissipating the heat of the controller power module 2 and preventing the heat of the controller from accumulating locally and causing local high temperature.

[0043] When the gas collides with the guide structure, reflection will occur, and eddy currents can be formed between different fins 3, thereby improving the fluidity of the gas and thus improving the efficiency of heat dissipation for the controller power module 2.

[0044] The gaps between the guide structures on the base plate 1 form a guide channel, and the gas flows along the guide channel. During the flow, the gas exchanges heat with multiple guide structures, thereby transferring the heat of the controller power module 2 to the guide structure and reducing the temperature of the controller power module 2.

[0045] The plurality of flow-guiding structures may be evenly distributed on the bottom plate 1 , or may be gathered in a part of the bottom plate 1 and dispersed in another part of the bottom plate 1 .

[0046] The present embodiment provides a heat sink for a controller power module 2, including a base plate 1, which is in contact with the controller power module 2; a plurality of flow-guiding structures are spaced apart on the base plate 1, and an airflow generating device is provided at one end of the base plate 1; the airflow generating device generates an airflow, and the airflow flows along the plurality of flow-guiding structures, thereby dissipating heat for the controller power module 2. The base plate 1 is in contact with the controller power module 2, and the heat generated by the controller power module 2 is transferred to the base plate 1. An airflow is formed under the action of the airflow generating device, and the airflow conducts heat to the flow-guiding structure when flowing through the heat-conducting structure. When the gas collides with the surface of the flow-guiding structure, it will be reflected, thereby forming vortices between different flow-guiding structures, thereby improving the fluidity of the gas. The airflow generating device will increase the fluidity of the gas, and under the flow-guiding and reflection effects of the flow-guiding structure, the efficiency of heat dissipation for the controller power module 2 can be improved.

[0047] Example 2

[0048] like Figure 1-Figure 2 As shown, this embodiment provides a heat sink for a controller power module, including a base plate 1, which is in contact with a controller power module 2; a plurality of guide structures are spaced apart on the base plate 1, and an airflow generating device is provided at one end of the base plate 1; the airflow generating device generates an airflow, and the airflow flows along the plurality of guide structures, thereby dissipating the heat of the controller power module 2.

[0049] The flow guiding structure includes fins 3 , and a plurality of fins 3 are distributed on the bottom plate 1 at intervals.

[0050] like Figure 4 As shown, the fin 3 includes a first guide portion 4 and a second guide portion 5 , the first guide portion 4 and the second guide portion 5 are connected or integrally formed, and a guide angle is formed between the first guide portion 4 and the second guide portion 5 .

[0051] The gaps between adjacent fins 3 form a guide channel, and the airflow flows along the guide channel. The airflow transfers heat to the fins 3 during the flow, thereby reducing the temperature of the controller power module 2.

[0052] The fin 3 of this embodiment is V-shaped, and the length of the first guide portion 4 is the same as the length of the second guide portion 5. The first end of the first guide portion 4 is connected to or integrally formed with the first end of the second guide portion 5, and the second end of the first guide portion 4 is spaced apart from the second end of the second guide portion 5. The connection between the first guide portion 4 and the second guide portion 5 forms a vertex, and the second end of the first guide portion 4 and the second end of the second guide portion 5 form an opening 12.

[0053] The guide angle is in the range of 15-35 degrees. Within the above angle range, the larger the guide angle is, the larger the angle at which the fin 3 reflects the gas is, and it is easier to form vortices between different fins 3, thereby improving the fluidity of the gas. Within the above angle range, the smaller the guide angle is, the smaller the contact area between the airflow and the fin 3 is, resulting in reduced heat dissipation efficiency. After experiments, when the guide angle is in the range of 30-35 degrees, the efficiency of the airflow transferring heat to the fin 3 is higher, and the heat dissipation effect of the fin 3 is better.

[0054] like Fig.10 As shown, preferably, a plurality of heat exchange protrusions 14 are arranged on the heat exchange surface between the V-shaped fin 3 and the airflow, and the heat exchange protrusions 14 are semicircular, thereby increasing the heat exchange area between the V-shaped fin 3 and the airflow, so that the V-shaped fin 3 can absorb more heat carried by the airflow.

[0055] The airflow generating device is started, and the airflow generating device blows out airflow, and the airflow flows to the other side opposite to the airflow generating device. When the airflow flows to the vertex of the fin 3, it splits, and the airflows on the two opposite surfaces of the adjacent fins 3 flow in the same direction, thereby forming a vortex, increasing the flow speed of the airflow, and rapidly reducing the temperature of the controller power module 2.

[0056] The direction of air flow is Figure 6 As shown, the greater the power of the airflow generating device, the faster the flow rate of the airflow, and the higher the efficiency of heat dissipation for the controller power module 2.

[0057] The bottom plate 1 is in contact with the controller power module 2, and the heat generated during the operation of the controller power module 2 is transferred to the bottom plate 1. Preferably, the bottom plate 1 is made of aluminum material, which can increase the thermal conductivity of the bottom plate 1. The airflow is formed under the action of the airflow generating device, and the airflow conducts the heat to the fins 3 during the flow process, thereby dissipating the heat of the controller power module 2.

[0058] The guide structure of this embodiment includes fins 3, and a plurality of the fins 3 are distributed at intervals on the base plate 1. The fins 3 include a first guide portion 4 and a second guide portion 5, the first guide portion 4 is connected to or integrally formed with the second guide portion 5, and a guide angle is formed between the first guide portion 4 and the second guide portion 5. Within the above-mentioned angle range, the larger the guide angle, the larger the angle at which the fin 3 reflects the gas, and it is easier to form vortices between different fins 3, thereby improving the fluidity of the gas. Within the above-mentioned angle range, the smaller the guide angle, the smaller the contact area between the airflow and the fin 3, resulting in reduced heat dissipation efficiency. After experiments, when the guide angle is in the range of 30-35 degrees, the efficiency of the airflow transferring heat to the fin 3 is higher, and the heat dissipation effect of the fin 3 is better.

[0059] Example 3

[0060] like Figure 1-Figure 2 As shown, this embodiment provides a heat sink for a controller power module, including a base plate 1, which is in contact with a controller power module 2; a plurality of guide structures are spaced apart on the base plate 1, and an airflow generating device is provided at one end of the base plate 1; the airflow generating device generates an airflow, and the airflow flows along the plurality of guide structures, thereby dissipating the heat of the controller power module 2.

[0061] A plurality of bases 6 are arranged near the airflow generating device, and the airflow generating device is connected to the bases 6 by screws.

[0062] like Figure 2 , Figure 3 and Figure 5 As shown, the airflow generating device is a cooling fan 7, a plurality of first mounting holes 8 are provided on the cooling fan 7, a second mounting hole 9 is provided on the base 6, and the first mounting holes 8 and the second mounting holes 9 are aligned.

[0063] Align the cooling fan 7 with the base 6, place the cooling fan 7 on the base 6 from top to bottom, and then insert the screws into the first mounting hole 8 and the second mounting hole 9 to fix the cooling fan 7 on the base 6. This embodiment takes the arrangement of four bases 6 on the base plate 1 as an example.

[0064] The cooling fan 7 is started, and the cooling fan 7 blows out airflow, and the airflow flows toward the other side opposite to the cooling fan 7. The airflow transfers heat to the fins 3 in the process of flowing through the fins 3, thereby dissipating the heat of the controller power module 2.

[0065] In this embodiment, a plurality of bases 6 are provided near the airflow generating device, and the airflow generating device is screwed to the base 6. The airflow generating device is a cooling fan 7, and a plurality of first mounting holes 8 are provided on the cooling fan 7. A second mounting hole 9 is provided on the base 6, and the first mounting hole 8 and the second mounting hole 9 are aligned. The cooling fan 7 is aligned with the base 6, and the cooling fan 7 is placed on the base 6 from top to bottom, and then screws are inserted into the first mounting holes 8 and the second mounting holes 9, so as to fix the cooling fan 7 on the base 6.

[0066] Example 4

[0067] like Figure 1-Figure 2 As shown, this embodiment provides a heat sink for a controller power module, including a base plate 1, which is in contact with a controller power module 2; a plurality of guide structures are spaced apart on the base plate 1, and an airflow generating device is provided at one end of the base plate 1; the airflow generating device generates an airflow, and the airflow flows along the plurality of guide structures, thereby dissipating the heat of the controller power module 2.

[0068] The flow guiding structure includes fins 3 , and a plurality of fins 3 are distributed on the bottom plate 1 at intervals.

[0069] like Figure 6 As shown, the guide structure further includes a heat dissipation baffle 10, and the heat dissipation baffle 10 is disposed on both sides of the bottom plate 1. Figure 7 for Figure 6 Cross-sectional view along the AA direction.

[0070] like Figure 1 and Figure 3 As shown, a PCB board 13 is connected to a side of the controller power module 2 away from the base plate 1 .

[0071] The height of the fins 3 and the heat dissipation baffle 10 on the bottom plate 1 is greater than or equal to the height of the airflow generating device to ensure that the PCB board 13 faces upward, and the fins 3 and the heat dissipation baffle 10 on the bottom plate 1 for heat dissipation can be placed horizontally downward.

[0072] A plurality of heat dissipation baffles 10 are arranged at intervals on both sides of the bottom plate 1 facing the controller power module 2, and the heat dissipation baffles 10 are parallel to the controller power module 2. The heat dissipation baffles 10 are used to dissipate heat and change the flow direction of airflow, so that the airflow passes through the fins 3 in the middle of the bottom plate 1 as much as possible, thereby taking away more heat.

[0073] like Figure 4 As shown, when the shape of the fin 3 is V-shaped, the fin 3 includes a first guide portion 4 and a second guide portion 5, the first guide portion 4 and the second guide portion 5 are connected or integrally formed, and a guide angle is formed between the first guide portion 4 and the second guide portion 5. The first end of the first guide portion 4 is connected to the second end of the second guide portion 5, and the connection forms a vertex. The second end of the first guide portion 4 and the second end of the second guide portion 5 are spaced apart to form an opening 12.

[0074] The length of the heat dissipation baffle 10 is equal to the distance between two adjacent fins 3 on the same horizontal line. The heat dissipation baffle 10 extends from the opening 12 of one fin 3 to the vertex of another fin 3 . The distance between two adjacent heat dissipation baffles 10 is equal to the length of one heat dissipation baffle 10 .

[0075] Heat dissipation baffles 10 are provided on both sides of the base plate 1, so that when the airflow collides with the heat dissipation baffles 10, the heat dissipation baffles 10 rebound the airflow back, so that the airflow flows through more fins 3, and then is discharged from the exhaust port on the other side of the base plate 1 opposite to the airflow generating device, thereby improving the heat dissipation efficiency.

[0076] The controller is soldered on the PCB board 13, and the controller power module 2 is a component of the controller. The controller power module 2 generates a lot of heat when running, and transfers the heat to the base plate 1. The airflow generating device on the base plate 1 is used to generate airflow, and the fins 3 and the heat dissipation baffle 10 on the base plate 1 are combined to guide the airflow and exchange heat, so as to dissipate the heat of the controller power module 2 in time.

[0077] The air guide structure of this embodiment further includes a heat dissipation baffle 10, and the heat dissipation baffle 10 is disposed on both sides of the bottom plate 1. The heat dissipation baffle 10 is disposed on both sides of the bottom plate 1, so that when the airflow collides with the heat dissipation baffle 10, the heat dissipation baffle 10 rebounds the airflow back, so that the airflow flows through more fins 3, and then is discharged from the exhaust port on the other side of the bottom plate 1 opposite to the airflow generating device, thereby improving the heat dissipation efficiency.

[0078] Example 5

[0079] like Figure 8-Figure 9 As shown, this embodiment provides a heat sink for a controller power module, including a base plate 1, which is in contact with a controller power module 2; a plurality of guide structures are spaced apart on the base plate 1, and an airflow generating device is provided at one end of the base plate 1; the airflow generating device generates an airflow, and the airflow flows along the plurality of guide structures, thereby dissipating the heat of the controller power module 2.

[0080] The flow guiding structure includes fins 3 , and a plurality of fins 3 are distributed on the bottom plate 1 at intervals.

[0081] The fin 3 is bent, and openings 12 are formed at two ends of the fin 3; the fin 3 includes a protrusion 11, and the protrusion 11 faces the airflow generating device.

[0082] like Figure X As shown, the shape of the fin 3 of this embodiment is C-shaped, the protrusion of the fin 3 faces the airflow generating device, and the opening 12 of the fin 3 is arranged on the other side opposite to the protrusion of the fin 3. The curvature change of each part of the C-shaped fin 3 is relatively small, so that the airflow can flow through the C-shaped fin 3 more smoothly, reducing the impact when different airflows converge in one place. In addition, the arc-shaped C-shaped fin 3 has a streamlined structure, so that the airflow flows along the arc surface of the C-shaped fin 3, the heat exchange time is longer, and the C-shaped fin 3 can absorb more heat.

[0083] like Fig.10 As shown, preferably, a plurality of heat exchange protrusions 14 are provided on the heat exchange surface between the fin 3 and the airflow, and the heat exchange protrusions 14 are semicircular, thereby increasing the contact area between the fin 3 and the airflow and improving the efficiency of the fin 3 in absorbing the heat carried by the airflow.

[0084] The fin 3 of this embodiment is bent, and openings 12 are formed at both ends of the fin 3; the fin 3 includes a protrusion 11, and the protrusion 11 faces the airflow generating device. The curvature variation of each part of the C-shaped fin 3 is relatively small, so that the airflow can flow through the C-shaped fin 3 more smoothly, reducing the impact when different airflows converge in one place. In addition, the arc-shaped C-shaped fin 3 has a streamlined structure, so that the airflow flows along the arc surface of the C-shaped fin 3, the heat exchange time is longer, and the C-shaped fin 3 can absorb more heat.

[0085] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a restriction. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in the subsequent accompanying drawings.

[0086] It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "above" other devices or structures would then be positioned "below" or "below" the other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0087] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0088] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat sink for a controller power module, characterized in that: It includes a base plate, which is in contact with the controller power module; a plurality of guide structures are spaced apart on the base plate, and an airflow generating device is provided at one end of the base plate; the airflow generating device generates airflow, and the airflow flows along the plurality of guide structures, thereby dissipating heat for the controller power module.

2. The heat sink of the controller power module according to claim 1, characterized in that: The flow guiding structure comprises fins, and a plurality of the fins are distributed on the bottom plate at intervals.

3. The heat sink of the controller power module according to claim 2, characterized in that: The fin comprises a first flow guide portion and a second flow guide portion, the first flow guide portion is connected to or integrally formed with the second flow guide portion, and a flow guide angle is formed between the first flow guide portion and the second flow guide portion.

4. The heat sink of the controller power module according to claim 3, characterized in that: The range of the diversion angle is 15-35 degrees.

5. The heat sink of the controller power module according to claim 1, characterized in that: A plurality of bases are arranged near the airflow generating device, and the airflow generating device is screw-connected to the bases.

6. The heat sink of the controller power module according to claim 5, characterized in that: The airflow generating device is a heat dissipation fan, a plurality of first mounting holes are arranged on the heat dissipation fan, a second mounting hole is arranged on the base, and the first mounting hole is aligned with the second mounting hole.

7. The heat sink of the controller power module according to claim 1, characterized in that: The guide structure further includes a heat dissipation baffle, and the heat dissipation baffle is disposed on both sides of the bottom plate.

8. The heat sink of the controller power module according to claim 3, characterized in that: The first end of the first guide portion is connected to or integrally formed with the first end of the second guide portion, and the second end of the first guide portion is spaced apart from the second end of the second guide portion.

9. The heat sink of the controller power module according to claim 2, characterized in that: The fin is bent, and openings are formed at both ends of the fin; the fin includes a protrusion, and the protrusion faces the airflow generating device.

10. The heat sink of the controller power module according to claim 1, characterized in that: A PCB board is connected to a side of the controller power module away from the bottom plate.

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