Wiring board laminate and method for manufacturing wiring board laminate

Abstract

The invention provides a wiring substrate laminated body which can easily laminate substrates and can prevent the substrates from becoming expensive. This wiring board laminate (10) is provided with: a wiring board (WB) having an opening (19a); an embedded member (14) embedded in the opening (19a) of the wiring board (WB); a curing material (17) that has a thermosetting resin, is arranged between the embedded member (14) and the inner peripheral surface of the opening (19a), and is bonded to the wiring board (WB); and a wiring layer 23 formed on the surfaces of the wiring substrate WB, the embedded member 14, and the cured material 17, in which the embedded member 14 has a ceramic main body 13 and metal films 15 formed on both surfaces of the ceramic main body 13.

Description

Technical Field The present invention relates to a wiring substrate laminate and a method for manufacturing the wiring substrate laminate. Background Art Conventionally, in order to appropriately cool heat-generating components such as LEDs and electronic components such as QFN (Quad For Non-Lead Package) mounted on a wiring board, there is known a wiring board laminate that dissipates heat from the back surface of the wiring board. In recent years, ceramic circuit boards using highly thermally conductive ceramics such as aluminum nitride (AlN) as substrate materials have become known as wiring substrates (see, for example, Patent Document 1). High heat dissipation and heat resistance can be achieved by using highly thermally conductive ceramics as substrate materials. [Prior art literature] [Patent Document 1] Japanese Patent No. 3690944 However, in the ceramic circuit board (wiring board laminate) described in Patent Document 1, since the entire board is made of ceramic, there is a problem that it is difficult to laminate the board. In addition, since the entire board is made of relatively expensive ceramic, there is a problem that the board becomes expensive. Therefore, the present invention is proposed to solve this problem, and its purpose is to provide a wiring substrate laminate that can easily stack substrates and prevent the substrates from becoming expensive. In addition, the present invention also aims to provide a manufacturing method for manufacturing such a wiring substrate laminate. Summary of the invention

[0001] The wiring substrate stack of the present invention includes: a wiring substrate having an opening; an embedded component embedded in the opening of the wiring substrate; a curing material including a thermosetting resin, arranged between the embedded component and the inner peripheral surface of the opening and bonded to the wiring substrate; and a wiring layer formed on the surfaces of the wiring substrate, the embedded component and the thermosetting resin, wherein the embedded component has a ceramic body and a metal film formed on both surfaces of the ceramic body. According to the wiring substrate laminate of the present invention, since it includes a wiring substrate having an opening and an embedded member embedded in the opening of the wiring substrate, and the embedded member has a ceramic body, high heat dissipation and heat resistance can be achieved by using ceramics with high thermal conductivity as a substrate material. In addition, since a wiring substrate is used, ceramics are used as a substrate material, and lamination can be performed in the area of ​​the wiring substrate while achieving high heat dissipation and heat resistance. In addition, compared with a case where the entire substrate is composed of ceramics to constitute a ceramic circuit substrate, the cost can be suppressed. In addition, according to the wiring substrate laminate of the present invention, since it includes a wiring substrate having an opening and an embedded component embedded in the opening of the wiring substrate, and the embedded component has a ceramic body, it is possible to use a monolithic ceramic body instead of a whole ceramic substrate and use other areas as a wiring substrate, thereby reducing the possibility of cracks compared to the case of using a whole ceramic substrate.

[0002] In the wiring substrate laminate of the present invention, it is preferred that at least one surface of the outer edge portion of the embedded member has a metal film non-formed area where the metal film is not formed, and the solidified material is further arranged between the ceramic body and the wiring layer in the metal film non-formed area. According to the wiring substrate stack of the present invention, since a metal film non-forming area where no metal film is formed is provided on at least one surface of the outer edge portion of the embedded component, and the solidified material is also arranged between the ceramic body and the wiring layer in the metal film non-forming area, the adhesion between the ceramic and the wiring layer, which are relatively difficult to adhere together, can be improved. In the case where a metal film is formed in a manner covering the entire ceramic body without forming a metal film non-forming area, there is a possibility of cracks being generated at the corners of the ceramic body due to the difference in thermal expansion coefficients between the metal film and the ceramic body. In contrast, according to the wiring substrate stack of the present invention, since the outer edge of the embedded component has a metal film non-forming area where the metal film is not formed, and the solidified material is also arranged between the ceramic body and the wiring layer in the metal film non-forming area, there is no metal film at the outer edge of the embedded component, thereby preventing the problem of cracks being generated at the corners of the ceramic body due to the difference in thermal expansion coefficients between the metal film and the ceramic body.

[0003] In the wiring substrate laminate of the present invention, the embedded member preferably has the metal film non-formed region on both surfaces of the outer edge portion, and the solidified material is further arranged between the ceramic body and the wiring layer in the two metal film non-formed regions of the ceramic body. According to the wiring substrate laminate of the present invention, since the metal film non-formed area is provided on both sides of the ceramic body, and the solidified material is also arranged between the ceramic body and the wiring layer in the metal film non-formed area, the adhesion between the ceramic and the wiring layer, which are relatively difficult to be adhered to on both sides of the ceramic body, can be improved.

[0004] In the wiring substrate laminate of the present invention, it is preferable that the metal film non-formation region is formed over the entire outer edge portion so as to surround the metal film when viewed in plan. According to the wiring substrate laminate of the present invention, since the metal film non-forming area is formed on the entire outer edge portion in a manner surrounding the metal film, a part of the outer edge portion of the ceramic body is less likely to crack locally, and cracks in the ceramic body are even less likely to occur.

[0005] In the wiring board laminate of the present invention, it is preferable that the metal film is formed on the surface of the ceramic body by direct plating. According to the wiring substrate laminate of the present invention, since the metal film is formed on the surface of the ceramic body by direct electroplating, the ceramic body and the metal film can be bonded with high adhesion. In addition, in order to improve the adhesion, it is also possible not to configure a bonding material between the ceramic body and the metal film, thereby preventing the heat dissipation from being reduced due to the bonding material.

[0006] In the wiring substrate laminate of the present invention, it is preferred that a metal layer is disposed on the surface of the wiring substrate, and the circuit wiring is constituted by the wiring layer, the metal layer, and the metal film. According to the wiring substrate laminate of the present invention, since the metal layer is disposed on the surface of the wiring substrate and the circuit wiring is constituted by the wiring layer, the metal layer and the metal film, various wiring structures can be constituted in the vertical direction.

[0007] In the wiring substrate laminate of the present invention, the metal layer is preferably a metal plating film formed on the surface of the wiring substrate by electroplating. According to the wiring substrate laminate of the present invention, since the metal layer is a metal plating film formed on the surface of the wiring substrate by plating, it has high adhesion with the wiring layer of the wiring substrate, and can easily form a laminated substrate with a complex structure.

[0008] In the wiring substrate laminate of the present invention, the embedded member is preferably rectangular in plan view. According to the wiring substrate laminate of the present invention, since the embedded member is rectangular in plan view, it can be easily processed and easily aligned with the opening. In addition, when electronic components are arranged on the embedded member via the wiring layer, heat can be uniformly dissipated from the generally rectangular electronic components, thereby preventing the thermal stress from being locally increased and making it less likely to cause cracks.

[0009] The manufacturing method of a wiring substrate stack of the present invention is a manufacturing method of a wiring substrate stack for manufacturing the wiring substrate stack described in any one of [1] to [3] above, characterized in that it includes: a process of obtaining a stack, wherein the stack includes: a wiring substrate or a wiring substrate material having an opening; an embedded component located inside the opening; and a filling sheet or a cured coating layer that is integrated with the wiring substrate or the wiring substrate material and contains a thermosetting resin, wherein the inner surface of the opening of the wiring substrate or the wiring substrate material and the embedded component are filled with a thermosetting resin; and a process of grinding the filling sheet or the cured coating layer so that the thickness of the stack after grinding is constant and removing the cured coating layer. According to the manufacturing method of the wiring substrate laminate of the present invention, since an embedded component is arranged in the opening of the wiring substrate or wiring substrate material, and a laminate having a structure in which a thermosetting resin is filled into the opening (by heating and pressurizing), complicated processes are not required when arranging the embedded component, and embedded components of various shapes can be handled. In addition, since the cured material such as the filling sheet is ground and removed in a manner that the thickness of the laminate after grinding is constant, the thermosetting resin filled into the opening will not become a structure integrated with the cured material such as the filling sheet, and the filled thermosetting resin is not easy to break or fall off when the cured material is peeled off. Therefore, the reliability of the filling structure of the embedded component and the smoothness of the surface can be improved.

[0010] The manufacturing method of the wiring substrate stack of the present invention includes: a process of preparing a stacking material, wherein the stacking material includes: the wiring substrate or the wiring substrate material, the embedded component, and the filling sheet; a process of integrating the stacking materials by heating and pressurizing to obtain the stack; and a process of grinding the solidified material of the filling sheet in a manner that the thickness of the stack after grinding is constant and removing the solidified material of the filling sheet. According to the manufacturing method of the wiring substrate laminate of the present invention, since the embedded component can be arranged in the opening of the wiring substrate or the wiring substrate material, the thermosetting resin contained in the filling sheet is filled into the inside of the opening by heating and pressurizing, so the laminate can be obtained by a drying process. At this time, there is no need for complicated processes when arranging the embedded component, and embedded components of various shapes can also be handled. In addition, since the cured product of the filling sheet is ground until the thickness of the laminate after grinding is constant, the cured product of the filling sheet is removed, so the thermosetting resin filled in the opening will not become a structure integrated with the cured product of the filling sheet, so that it is not easy to cause the fracture or fall off of the filled thermosetting resin. Therefore, the reliability of the filling structure of the embedded component and the smoothness of the surface can be improved.

[0011] The manufacturing method of the wiring substrate laminate of the present invention is characterized in that: the laminate is a laminate in which a resin film having an opening at a position corresponding to the opening of the wiring substrate or the wiring substrate material is attached to the wiring substrate or the wiring substrate material, and the manufacturing method of the wiring substrate laminate includes: when removing the filling sheet or the cured product of the coating layer, the thickness of the laminate after grinding is ground to the thickness of a part of the resin film removed, and the remaining part of the resin film is further peeled off from the laminate; and the process of removing the cured product of the thermosetting resin of the embedded component covering the laminate. According to the manufacturing method of the wiring substrate laminate of the present invention, since the resin film is attached to the wiring substrate or the wiring substrate material, the thermosetting resin is not easily attached to the surface of the wiring substrate or the like during filling. In addition, since the resin film is present between the cured product such as the filling sheet and the wiring substrate or the like, and the cured product is ground to a thickness where a part of the resin film is removed, the cured product can be removed more reliably. Moreover, when the remaining part of the resin film is peeled off from the laminate, the height of the thermosetting resin located at the opening of the resin film becomes lower, and the convex thermosetting resin can be removed more easily. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 This is a cross-sectional view of the wiring board laminate 10 according to the first embodiment. Figure 2 This is a diagram for explaining the embedded member 14 in the first embodiment. Figure 3 This is a cross-sectional view for explaining the method for manufacturing the wiring substrate laminate according to the first embodiment. Figure 4 This is a cross-sectional view for explaining the method for manufacturing the wiring substrate laminate according to the first embodiment. Figure 5 This is a cross-sectional view for explaining the method for manufacturing the wiring substrate laminate according to the first embodiment. Figure 6 This is a cross-sectional view for explaining the method for manufacturing the wiring substrate laminate according to the second embodiment. Figure 7 This is a cross-sectional view for explaining the method for manufacturing the wiring substrate laminate according to the third embodiment. Figure 8 This is a cross-sectional view for explaining the method for manufacturing the wiring substrate laminate according to the third embodiment. Fig. 9 This is a cross-sectional view for explaining the method for manufacturing the wiring substrate laminate according to the third embodiment. Fig.10 This is a cross-sectional view for explaining the method for manufacturing the wiring substrate laminate according to Modification 1. Fig.11 This is a cross-sectional view for explaining a method for manufacturing a wiring substrate laminate according to Modification 2. DETAILED DESCRIPTION Hereinafter, a wiring substrate laminate and a method for manufacturing a wiring substrate laminate according to an embodiment of the present invention will be described with reference to the drawings. In addition, each of the drawings described below is a schematic diagram that does not strictly reflect the actual structure, size, vertical and horizontal scale, etc. [Implementation method 1] 1. Structure of Wiring Board Laminated Body 10 in Embodiment 1 Figure 11 is a cross-sectional view showing a wiring board laminate 10 according to the first embodiment. Figure 2 This is a diagram for explaining the embedded member 14 in the first embodiment. Figure 2 (a) is a cross-sectional view showing the embedded member 14, Figure 2 (b) is a perspective view showing the embedded member 14, Figure 2 (c) is a diagram showing the ceramic wafer 100 on which the embedded member 14 is formed. like Figure 1 As shown, the wiring substrate laminate 10 of the first embodiment includes a wiring substrate WB, an embedding member 14, a curing material 17, and a wiring layer 23. The wiring layer 23 is formed on both sides of the wiring substrate laminate 10. Pattern wiring is formed on the wiring layer 23 on the upper surface, and the wiring layer 23 on the lower surface is formed on the entire surface so as to be connected to a heat sink not shown. Therefore, in the wiring substrate stack 10, if electrical components (semiconductor chips, LEDs, inductors, etc.) are configured in the wiring layer 23 on the embedded component 14, the heat generated from the electrical components can be transferred to the heat sink (not shown) via the embedded component and the wiring layer 23 on the lower surface side and released to the outside. The wiring substrate WB is a double-sided metal laminated board with metal layers 20 arranged on both sides of the insulating layer 19. As the wiring substrate WB, for example, a glass epoxy substrate can be used, but a substrate made of an appropriate material described later can also be used. In the wiring substrate WB, on one side of the insulating layer 19 ( Figure 1 A patterned metal layer is formed on the top surface of the substrate, but a non-wired metal layer may be used. In addition, in Embodiment 1, a single-layer wiring substrate is used for ease of description, but a laminated wiring substrate may also be used. The material of the insulating layer 19 preferably contains a thermosetting resin, and preferably contains a prepreg containing a thermosetting resin and reinforcing fibers. The thermosetting resin can be any material as long as it is cured by heating or the like and has the heat resistance required for the wiring substrate. Specific examples of the thermosetting resin include various thermosetting resins such as epoxy resins, phenolic resins, and polyimide resins. The prepreg may contain a thermosetting resin, be cured by heating, etc., and have the heat resistance required for the wiring board. Specifically, composites of various thermosetting resins such as epoxy resin, phenolic resin, polyimide resin, and reinforcing fibers such as glass fiber, ceramic fiber, aramid fiber, and paper may be cited. The metal layer 20 may be any metal, for example, copper, copper alloy, aluminum, stainless steel, nickel, iron, other alloys, etc. Among them, copper and aluminum are preferred from the viewpoint of thermal conductivity and electrical conductivity. The wiring substrate WB has an opening 18 at a portion corresponding to the position where the embedded member 14 is arranged. The wiring substrate WB generally has a plurality of openings 18. The opening 18 can be formed by a drill, a punch, a milling cutter, etc. The size of the opening 18 is preferably slightly larger than the ceramic body 13 of the embedded member 14. The opening 18 is rectangular, but may be circular, elliptical, quadrilateral, or any other shape corresponding to the outer shape of the embedded member 14. Even in the case of a square or complex shape, a complex opening 18 can be formed using a milling cutter or the like. The embedded member 14 is embedded in the opening 18 of the wiring substrate WB. The ceramic body 13 is in a substantially rectangular parallelepiped shape, and the embedded member 14 is in a rectangular shape (substantially rectangular shape) when viewed from above (see Figure 2 (a) and Figure 2 (b)), but it can be an appropriate shape corresponding to the opening 18, such as a circle, an ellipse, a quadrangle, or other shapes. If the lateral size of the embedded member 14 is too large, it is easy to fall off after filling, and if it is too small, it is difficult to arrange, so it is preferably 0.1 to 20 mm in the largest width portion. The embedded member 14 includes a ceramic body 13 and a metal film 15 formed on both surfaces of the ceramic body 13 (see Figure 2 (a) and Figure 2 (b)) The thickness of the metal film 15 of the embedded member 14 is set to be the same as the thickness of the metal layer 20 of the wiring board WB. The embedded member 14 has metal film non-formed regions E where the metal film 15 is not formed on both surfaces of the outer edge. That is, the ceramic body 13 is exposed over the entire circumference of the outer edge on both surfaces of the embedded member 14. The embedded member 14 is formed by directly plating a metal film on both sides of a flat ceramic substrate, etching the metal film with a predetermined width along a singulation line to form a metal film non-formed region E, and then cutting along the singulation line to form the embedded member 14 (the ceramic substrate before cutting is referred to as Figure 2 (c)). Aluminum nitride (AlN) is used as the material of the ceramic body 13, but aluminum oxide (Al 2 O 3 ) or other ceramic materials. The metal film 15 is formed by direct plating on the surface of the ceramic body 13. The metal film 15 may be any metal, for example, copper, copper alloy, aluminum, stainless steel, nickel, iron, other alloys, etc. Among them, copper and aluminum are preferred from the viewpoint of thermal conductivity and electrical conductivity. The curing material 17 contains a thermosetting resin, is disposed between the embedding member 14 and the inner peripheral surface of the opening 18, and is bonded to the wiring substrate WB. The curing material 17 is also disposed between the ceramic body 13 and the wiring layer 23 in the metal film non-formed region E. As the resin constituting the curing material 17, it is preferred that the resin has excellent adhesion to the embedded component 14 and does not damage the withstand voltage characteristics. In addition, it is preferred that the resin deforms when heated and pressed, cures by heating, etc., and has the heat resistance required for the wiring substrate. As such a resin, various engineering plastics can be used alone or in combination of two or more in addition to epoxy resins, phenolic resins, and polyimide resins, but epoxy resins are preferred because they are excellent in the bonding strength between metals. In particular, among epoxy resins, it is further preferred to use bisphenol A type epoxy resins, bisphenol F type epoxy resins, hydrogenated bisphenol A type epoxy resins, hydrogenated bisphenol F type epoxy resins, triblock polymers having bisphenol A type epoxy resin structures at both ends, and triblock polymers having bisphenol F type epoxy resin structures at both ends, which have high fluidity and excellent miscibility with metal oxides and metal nitrides. The wiring layer 23 is formed on both sides of the wiring substrate laminate 10, and is formed on the surfaces of the wiring substrate WB, the embedded member 14, and the cured material 17. The wiring layer 23 is a metal-plated layer formed by metal plating on the surfaces of the wiring substrate WB, the embedded member 14, and the cured material 17. The wiring layer 23 forms a wiring pattern with the metal film 15 of the embedded member 14, and also forms a wiring pattern with the metal layer 20 of the wiring substrate WB. By configuring electronic components on the pattern wiring (especially on the pattern wiring on the embedded component 14), the heat generated by the electronic components can be dissipated to the back side via the wiring layer 23 on the upper side, the embedded component 14 and the wiring layer 23 on the lower side, and the heat can be released to the outside via a heat sink (not shown) connected to the surface of the wiring layer 23 on the back side. 2. Method for manufacturing wiring substrate laminate according to Embodiment 1 Next, a method for manufacturing the wiring substrate laminate 10 will be described. Figure 3 to Figure 5 2 is a cross-sectional view for explaining the method for manufacturing the wiring substrate laminate according to the first embodiment. Figure 3 (a)~ Figure 3 (e) Figure 4 (a)~ Figure 4 (d) Figure 5 (a)~ Figure 5 (e) is a diagram of each process. In this embodiment, first, Figure 3 (a) and Figure 3As shown in (b), a double-sided metal-clad laminate is used as the wiring board material WB', and a resin film 21 (filling sheet) is laminated on the wiring board material WB'. The double-sided metal laminate used as the wiring substrate material WB' is a laminate in which a cured insulating layer 19' is bonded to the metal layers 20' on both sides, but a laminate having a semi-cured insulating layer 19' can also be used and cured at any stage. In addition, a laminate formed by stacking two single-sided metal laminates having a semi-cured insulating layer 19' bonded to the metal layer 20' with the insulating layers 19' facing each other can also be used. Moreover, two metal plates (metal layers 20') can also be stacked on both sides of the semi-cured insulating layer 19'. In addition, a wiring substrate WB having a patterned metal layer 20 on the surface of the insulating layer 19 can also be used. As the material of the semi-cured insulating layer 19', it is preferred to contain a thermosetting resin, and preferably a prepreg blank containing a thermosetting resin and reinforcing fibers. like Figure 3 As shown in (b), the resin film 21 can be arranged only on the wiring substrate material WB′, but from the viewpoint of preventing position displacement and preventing the curing material 17 from adhering to the surface of the wiring substrate WB or the wiring substrate material WB′, it is preferably pre-attached to the wiring substrate WB or the wiring substrate material WB′. As the resin film 21, a film made of resin is preferred, and polyesters such as polyethylene terephthalate, polyolefins such as polyethylene and polypropylene, polyamides, etc. can be used. However, from the viewpoint of heat resistance, polyesters such as polyethylene terephthalate are preferred. In addition, when pasting the resin film 21, it is preferred to provide an adhesive layer on the resin film 21. As the adhesive, a rubber adhesive, an acrylic adhesive, a silicone adhesive, etc. can be used. Instead of providing an adhesive layer on the resin film 21, an adhesive layer can be applied to the wiring substrate WB or the wiring substrate material WB' to form it. Next, if Figure 3 As shown in (c), an opening 18 is formed in a portion of the wiring substrate material WB' corresponding to the embedded member 14. The wiring substrate material WB' generally includes a plurality of openings 18. The openings 18 can be formed by a drill, a punch, a milling cutter, etc. The size of the openings 18 is preferably slightly larger than the upper surface of the embedded member 14. Then, if Figure 3 As shown in (d), a support film 22 is attached to the lower surface of the wiring board material WB'. As the support film 22, the same material as the resin film 21 can be used, and preferably a material having the same adhesive layer can be used. Then, if Figure 3 As shown in (e), the wiring board material WB′ is placed on the support table 1. Next, if Figure 4As shown in (a), the embedded member 14 is arranged inside the opening 18 of the wiring substrate material WB'. In this embodiment, the embedded member 14 having the same thickness as the wiring substrate material WB' is used. As long as it can be arranged inside the opening 18 of the wiring substrate material WB'. In the case where the embedded member 14 has a thickness smaller than the thickness of the wiring substrate material WB', the upper surface of the embedded member 14 can be exposed by removing the hardening material 17 covering the upper surface of the embedded member 14 as needed. As a method for arranging the embedded member 14, a method such as a mounting device for mounting a fine component surface on a wiring substrate can be used, or as described later, a method of using an embedded member 14 formed at the position of the opening on a support body by etching or the like in advance and stacking the embedded member 14 relative to the wiring substrate WB or the wiring substrate material WB' is used, but a method of arranging the embedded member 14 inside the opening by applying vibration is preferred. As such a device, a commercially available feeding device for mounting a fine component surface on a wiring substrate can be used. As a method of applying vibration, there can be cited a method of applying vibration to the wiring board material WB' and conveying the embedded member 14 on its surface while continuously arranging it inside the opening, similarly to conveying a fine member by a vibration feeder. Alternatively, a plurality of embedded members 14 may be supplied to the upper surface of the wiring board material WB' in batches, and after vibrating the wiring board material WB' and / or the embedded member 14, the embedded member 14 present outside the opening may be removed. The frequency and amplitude of the vibration can be appropriately set according to the size of the embedded member 14. For example, the frequency is preferably 100 to 10,000 Hz, and the amplitude is preferably 10 μm to 1,000 μm. The generator of such micro-vibration can be composed of an oscillator of an electromagnet and an iron sheet, or an electroacoustic converter such as a piezoelectric transducer and a ferrite vibrator. In addition, if Figure 4 As shown in (a), it is preferred that the embedded component 14 is arranged inside the opening 18 without bias (preferably in the center), and a mounting device or the like is used. However, in terms of the vibration application method, a clamp with a smaller opening at the center position of the opening or near the center position of the opening can be arranged on the upper side of the wiring substrate WB or the wiring substrate material WB' to arrange the embedded component 14 inside the opening without deviation. Then, if Figure 4 As shown in (b), on the support 1, a filling sheet 16' containing a curing material 17 is stacked and arranged on the wiring board material WB' and the embedding member 14 to form a stacked material LM containing these. As the filling sheet 16', any sheet containing the curing material 17 may be a sheet made of a thermosetting resin, but preferably a prepreg containing the curing material 17 and reinforcing fibers. As the resin constituting the filling sheet 16', a resin having excellent adhesion to the embedded component 14 and not impairing the withstand voltage characteristics is preferred. As such a resin, various engineering plastics can be used alone or in combination of two or more, except for epoxy resin, phenolic resin, and polyimide resin, but epoxy resin is preferred because it is excellent in the bonding strength between metals. In addition, as the filling sheet 16', it is preferably composed of a material with high thermal conductivity, for example, a resin containing a thermally conductive filler is exemplified. The curing material 17 may be any material that is deformed when heated and pressed, cured by heating, etc., and has the heat resistance required for the wiring board. Specifically, the curing material 17 includes various thermosetting resins such as epoxy resin, phenol resin, and polyimide resin. The prepreg may be any material as long as it deforms when heated and pressed, cures by heating, etc., and has the heat resistance required for the wiring substrate. Specifically, composites of various thermosetting resins such as epoxy resin, phenolic resin, polyimide resin, and reinforcing fibers such as glass fiber, ceramic fiber, aramid fiber, and paper can be cited. Then, if Figure 4 (c) shows an example of a process including integrating the laminated material LM by heating and pressing to obtain a laminated body LB in which the inner surface of the opening of the wiring substrate material WB' and the embedded member 14 are filled with the curing material 17. In this way, in the example shown in the figure, it is possible to form a laminated body LB in which the height of the embedded member 14 is the same as the height of the surface of the wiring substrate WB or the wiring substrate material WB'. In addition, if Figure 4 (c) and Figure 4 As shown in (d), by heating and pressing, the filling sheet 16' becomes a thinner solidified material 16, and the solidified material 17 is filled between the inner surface of the opening 18 of the wiring substrate WB or the wiring substrate material WB' and the embedded member 14, and the solidified material 17 of the filling sheet 16' covers the upper surface of the embedded member 14. In addition, in the metal film non-formed area E where the metal film is not formed, it is also arranged between the ceramic body 13 and the wiring layer 23. Heating and pressurizing can be performed by arranging the stacked material LM on the support table 1, and performing heating and pressurizing by means of the pressing plate 2 or the like. As a method of hot pressing, a heating and pressurizing device (hot laminator, hot press) or the like can be used. At this time, in order to avoid the mixing of air, the atmosphere can also be made vacuum (vacuum laminator, etc.). In particular, when the support film 22 is attached to the lower surface, since there is no place for the air inside the opening to escape, it is preferred to perform heating and pressurizing under a reduced pressure atmosphere. The heating temperature, pressure and other conditions can be appropriately set according to the material and thickness of the filling sheet 16', but the pressure for the pressurization treatment is preferably 0.5 to 30 MPa. Then, if Figure 5 As shown in (a), the cured product 16 of the coating layer is ground until the thickness of the laminated body LB after grinding is constant, and the cured product 16 is removed. In this embodiment, an example is shown in which the thickness of the laminated body LB after grinding is set to the thickness at which a part of the resin film 21 is removed when removing the cured product 16. In this way, the cured product 16 is removed as a whole, and a part of the resin film 21 is removed. Of course, only the entire cured product 16 may be removed, or the entire cured product 16 and the resin film 21 may be removed. As a device for grinding the thickness of the laminated body LB to a fixed thickness, a commercially available movable table grinder can be used. Figure 5 In (a), the grinding belt supported on the surface of the rotating roller is indicated by an imaginary line, but in reality, the grinding belt has a larger curvature radius than the grinding object, and the grinding belt moving with the roller has a certain interval with the moving table 3. The stacked body LB can be ground to a constant thickness during this interval. Then, if Figure 5 As shown in (b), there is a step of peeling off the remaining portion 21b of the resin film 21 from the laminated body LB. In this way, the solidified material 17 covering the embedded member 14 remains, and the convex portion A composed of the solidified material 17 is formed. Then, if Figure 5 As shown in (c), there is a step of removing the convex portion A of the solidified material 17 covering the embedded member 14 of the laminated body LB. In this way, the upper surface of the laminated body LB can be flattened. In addition, in the first embodiment, the resin film 21 is removed before the convex portion A is removed, but the resin film 21 can also be removed at the same time as the convex portion A is removed. As a method for removing the protrusion A, it is preferred to use a grinding or polishing method, and examples include a method using a grinding device having a hard rotating blade with multiple hard blades made of diamond or the like arranged in the radial direction of a rotating plate, a method using a grinder, a belt grinder, a grinder, a surface grinder, a hard abrasive formed product, etc. Next, a step of peeling at least the support film 22 (lower side) from the laminate LB is performed. When peeling the support film 22, it is preferable to set the adhesive force between the embedded member 14 and the support film 22 to be smaller than the adhesive force between the embedded member 14 and the curing material 17. With such an adhesive force, the support film 22 can be easily peeled off. Then, if Figure 5 As shown in (d), the exposed embedded member 14 and the metal layer 20' are subjected to metal plating to form a metal plating layer 23' (on both sides). The metal type of the metal plating layer is preferably copper, silver, Ni, etc. The method for forming the metal plating layer 23' includes, for example, a combination of electroless plating and electrolytic plating. Then, if Figure 5 As shown in (e), the metal plating layer 23' and the metal layer 20' are patterned to form the wiring layer 23. The patterning can be performed by, for example, etching the metal plating layer 23' and the metal layer 20' in a predetermined pattern using a resist to form the patterned wiring layer 23. The metal film 15 may also be etched. In this way, the wiring substrate laminate 10 can be manufactured. 3. Effects of the wiring substrate laminate 10 and the method for manufacturing the wiring substrate laminate according to the first embodiment According to the wiring substrate laminate 10 of the first embodiment, since the wiring substrate WB having the opening 18 and the embedded member 14 embedded in the opening 18 of the wiring substrate WB are provided, and the embedded member 14 has the ceramic body 13, the heat dissipation and heat resistance can be improved by using ceramics with high thermal conductivity as the substrate material. In addition, since the wiring substrate WB is used, ceramics can be used as the substrate material, and the lamination can be performed in the area of ​​the wiring substrate WB while achieving high heat dissipation and heat resistance. In addition, compared with the case where the entire substrate is composed of ceramics to constitute a ceramic circuit substrate, the cost can be suppressed. In addition, according to the wiring substrate stack 10 of embodiment 1, since it includes a wiring substrate WB with an opening 18 and an embedded component 14 embedded in the opening 18 of the wiring substrate WB, and the embedded component 14 has a ceramic body 13, it is possible to use a monolithic ceramic body instead of a whole ceramic substrate and use other areas as a wiring substrate, thereby reducing the possibility of cracks compared to the case of using a whole ceramic substrate. According to the wiring substrate stack 10 of embodiment 1, since there is a metal film non-forming area E where the metal film 15 is not formed at the outer edge of the embedded component 14, the solidified material 17 is also arranged between the ceramic body 13 and the wiring layer 23 in the metal film non-forming area E, thereby improving the adhesion between the ceramic body 13 composed of ceramic and the wiring layer 23 composed of metal, which are relatively difficult to adhere to each other. According to the wiring substrate stack 10 of embodiment 1, since there is a metal film non-forming area E on both sides of the ceramic body 13, the curing material 17 is also arranged between the ceramic body 13 and the wiring layer 23 in the metal film non-forming area E. Therefore, the closeness between the ceramic body 13 and the wiring layer 23, which are relatively difficult to close together on both sides of the ceramic body 13, can be improved, and cracks can be more reliably prevented from being generated at the corners of the ceramic body 13. According to the wiring substrate laminate 10 of the first embodiment, since the metal film non-formed area E is formed on the entire outer edge portion so as to surround the metal film 15 , cracks are less likely to occur locally in a portion of the outer edge portion of the ceramic body 13 , and cracks are even less likely to enter the ceramic body 13 . According to the wiring substrate laminate 10 of the first embodiment, since the metal film 15 is formed on the surface of the ceramic body 13 by direct electroplating, the ceramic body 13 and the metal film 15 can be bonded with high adhesion. In addition, since a bonding material for improving adhesion does not need to be arranged between the ceramic body 13 and the metal film 15, it is possible to prevent the heat dissipation from being reduced due to the bonding material. According to wiring board laminate 10 of the first embodiment, wiring layer 23 is disposed on the surface of wiring board WB, and circuit wiring is constituted by wiring layer 23 , metal layer 20 , and metal film 15 . Therefore, a wiring pattern with a complex structure can be constituted. According to wiring substrate laminate 10 of the first embodiment, wiring layer 23 is a metal plating film formed on the surface of wiring substrate WB by plating. Therefore, adhesion between wiring substrate WB and wiring layer 23 is high, and a laminate substrate with a complex structure can be easily configured. According to the wiring substrate laminate 10 of the first embodiment, since the embedded member 14 is rectangular in plan view, it can be easily processed and easily aligned with the opening. In addition, when electronic components are arranged on the embedded member 14 via the wiring layer 23, heat can be uniformly dissipated from the electronic components with many rectangular shapes, thereby preventing the thermal stress from being locally increased and making it more difficult to generate cracks. According to the manufacturing method of the wiring substrate laminate of the first embodiment, since the laminate having the structure of arranging the embedded component 14 in the opening of the wiring substrate WB or the wiring substrate material WB' and filling the thermosetting resin into the opening by heating and pressurizing is used, complicated processes are not required when arranging the embedded component 14, and embedded components of various shapes can be handled. In addition, since the solidified material such as the filling sheet 16' is ground until the thickness of the laminate after grinding is constant and the solidified material is removed, the thermosetting resin filled in the opening 18 will not become a structure integrated with the solidified material such as the filling sheet, and when the solidified material is peeled off, the filled thermosetting resin is not easy to break or fall off. Therefore, the reliability of the filling structure of the embedded component and the smoothness of the surface can be improved. According to the manufacturing method of the wiring substrate laminate of embodiment 1, since the embedded component 14 can be arranged in the opening 18 of the wiring substrate WB or the wiring substrate material WB', and the thermosetting resin contained in the filling sheet 16' is filled into the inside of the opening (by heating and pressurizing), the laminate can be obtained by a drying process. At this time, there is no need for complicated processes when configuring the embedded component, and embedded components of various shapes can also be handled. In addition, the cured product of the filling sheet is ground until the thickness of the laminate after grinding is constant, and the cured product of the filling sheet is removed. Therefore, the thermosetting resin filled in the opening will not become a structure integrated with the cured product of the filling sheet, so that it is not easy to cause the filled thermosetting resin to break or fall off. Therefore, the reliability of the filling structure of the embedded component and the smoothness of the surface can be improved. According to the method for manufacturing a wiring substrate laminated body of the first embodiment, since the resin film is attached to the wiring substrate WB or the wiring substrate material WB', it is difficult for the thermosetting resin to adhere to the surface of the wiring substrate etc. during filling. In addition, since the resin film exists between the cured product such as the filling sheet and the wiring substrate etc., and the cured product is ground to a thickness where a part of the resin film is removed, the cured product can be removed more reliably. Moreover, when the remaining part of the resin film is peeled off from the laminated body, the height of the thermosetting resin located at the opening of the resin film becomes lower, and the convex thermosetting resin can be removed more easily. [Implementation method 2] Figure 6 This is a cross-sectional view for explaining the method for manufacturing a wiring substrate laminate according to the second embodiment. Figure 6 (a)~ Figure 6 (c) is a process diagram. The manufacturing method of the wiring substrate laminate of the second embodiment has basically the same steps as the manufacturing method of the wiring substrate laminate of the first embodiment, but is different from the manufacturing method of the wiring substrate laminate of the first embodiment in that the support film 22 is not used. In implementation mode 2, if Figure 6 As shown in (a), in a state where the wiring board material WB' is placed on a support 1 such as a mirror plate, an embedded member 14 is arranged inside the opening of the wiring board material WB' (see Figure 6 (b)). Then, a filling sheet containing the solidifying material 17 is placed and heated and pressurized (see Figure 6 (c)). In this way, integration is achieved, and a process is implemented to obtain a laminated body LB in which the inner surface of the opening 18 of the wiring substrate WB or the wiring substrate material WB' and the embedded member 14 are filled with the curing material 17. At this time, although there is a case where the curing material 17 adheres to the periphery of the opening on the lower surface of the wiring substrate WB or the wiring substrate material WB', the adhered curing material 17 can be removed by grinding or chemical treatment. Except for the step of removing the support film, the subsequent steps are the same as those of the method for manufacturing the wiring board laminate according to the first embodiment, and thus the description thereof will be omitted. As described above, the manufacturing method of the wiring substrate laminate of the second embodiment is different from the manufacturing method of the wiring substrate laminate of the first embodiment in that the support film 22 is not used. However, as in the manufacturing method of the wiring substrate laminate of the first embodiment, since the embedded component is arranged in the opening of the wiring substrate or the wiring substrate material, and the laminate is used to fill the thermosetting resin into the internal structure of the opening by heating and pressurizing, it is not necessary to have complicated processes when arranging the embedded component, and it is also possible to deal with embedded components of various shapes. In addition, since the cured material such as the filling sheet is ground in a manner that the thickness of the laminate after grinding is constant and the cured material is removed, the thermosetting resin filled in the opening does not become a structure integrated with the cured material such as the filling sheet, and the filled thermosetting resin is unlikely to break or fall off when the cured material is peeled off. Therefore, the reliability of the filling structure of the embedded component and the smoothness of the surface can be improved. In addition, since the manufacturing method of the wiring substrate stack of embodiment 2 has the same steps as the manufacturing method of the wiring substrate stack of embodiment 1 except that the supporting film 22 is not used, it has corresponding effects among the effects possessed by the manufacturing method of the wiring substrate stack of embodiment 1. [Implementation method 3] Figure 7 This is a cross-sectional view for explaining the method for manufacturing a wiring substrate laminate according to the third embodiment. Figure 7 (a)~ Figure 7 (e) is a process diagram. The method for manufacturing a wiring substrate laminate according to the third embodiment basically has the same processes as the method for manufacturing a wiring substrate laminate according to the first embodiment, but differs from the method for manufacturing a wiring substrate laminate according to the first embodiment in that the resin film 21 is not used. In the third embodiment, a wiring board material WB′ (see FIG. 1 ) having an opening 18 and not having a resin film 21 attached thereto is prepared. Figure 7 (a)), a laminated material LM including an embedded member 14 located inside the opening and a filling sheet 16' laminated on the wiring board material WB' and including a curing material 17 (see Figure 7 (a)) In this embodiment, a support film 22 is attached to the lower surface of the wiring board material WB'. Next, as in the previous embodiment, the laminated material LM is integrated by heating and pressing to obtain a laminated body LB in which the inner surface of the opening 18 of the wiring substrate material WB' and the embedded member 14 are filled with the solidified material 17. In this way, a laminated body LB can be formed in which the height of the embedded member 14 is the same as the height of the surface of the wiring substrate material WB'. Then, if Figure 7 As shown in (d), the solidified material 16 of the filling sheet 16' is ground until the thickness of the laminated body LB after the grinding is constant, and the solidified material 16 of the filling sheet 16' is removed. In this embodiment, when the solidified material 16 of the filling sheet 16' is removed, the thickness of the laminated body LB after the grinding is set to a thickness at which all or almost all of the solidified material 16 is removed. In this way, all or almost all of the solidified material 16 is removed. Next, the support film 22 is removed. Since the subsequent steps are the same as those of the method for manufacturing the wiring substrate laminate of the first embodiment, the description thereof will be omitted. In this way, the wiring substrate laminate 10 of the third embodiment can be manufactured (see Figure 7 (e)). As described above, the manufacturing method of the wiring substrate laminate of the third embodiment is different from the manufacturing method of the wiring substrate laminate of the first embodiment in that the resin film 21 is not used. However, as in the manufacturing method of the wiring substrate laminate of the first embodiment, since an embedded component is arranged in the opening of the wiring substrate or the wiring substrate material, and a laminate is used in which a thermosetting resin is filled into the internal structure of the opening by heating and pressurizing, it is not necessary to have a complicated process when arranging the embedded component, and it is also possible to deal with embedded components of various shapes. In addition, since the cured material such as the filling sheet is ground in such a way that the thickness of the laminate after grinding is constant, and the cured material is removed, the thermosetting resin filled in the opening does not become a structure integrated with the cured material such as the filling sheet, and the filled thermosetting resin is unlikely to break or fall off when the cured material is peeled off. Therefore, the reliability of the filling structure of the embedded component and the smoothness of the surface can be improved. In addition, the manufacturing method of the wiring substrate stack of embodiment 3 has the same steps as the manufacturing method of the wiring substrate stack of embodiment 1 except that the resin film 21 is not used, and therefore has corresponding effects among the effects possessed by the manufacturing method of the wiring substrate stack of embodiment 1. [Implementation method 4] Figure 8 This is a cross-sectional view for explaining the method for manufacturing a wiring substrate laminate according to the fourth embodiment. Figure 8 (a) and Figure 8(b) is a diagram of each process. The manufacturing method of the wiring substrate laminate of the fourth embodiment basically has the same processes as the manufacturing method of the wiring substrate laminate of the first embodiment, but is different from the manufacturing method of the wiring substrate laminate of the first embodiment in that the embedded member 14 is arranged on the supporting film 22 in the front stage of the process of arranging the wiring substrate material WB. In implementation mode 4, Figure 8 As shown in (a), the embedded component 14 is arranged on the supporting film 22 at the front stage of the process of arranging the wiring substrate material WB', and then, while aligning with the embedded component 14, the wiring substrate material WB is arranged on the supporting film 22, and the filling sheet 16' is arranged on the wiring substrate material WB and the embedded component 14. Since the subsequent steps are the same as those in the method for manufacturing the wiring substrate laminate according to the first embodiment, the description thereof will be omitted. As described above, the manufacturing method of the wiring substrate laminated body in the fourth embodiment is different from the manufacturing method of the wiring substrate laminated body in the first embodiment in that the embedded component 14 is arranged on the supporting film 22 before the wiring substrate material WB is arranged. However, as in the case of the manufacturing method of the wiring substrate laminated body in the first embodiment, since the embedded component is arranged in the opening of the wiring substrate or the wiring substrate material, and the thermosetting resin is filled into the opening by heating and pressurizing, the laminated body does not require complicated processes when arranging the embedded component, and can also cope with embedded components of various shapes. In addition, since the cured material such as the filling sheet is ground in a manner that the thickness of the laminated body after grinding is constant and the cured material is removed, the thermosetting resin filled into the opening does not become a structure integrated with the cured material such as the filling sheet, and the filled thermosetting resin is unlikely to break or fall off when the cured material is peeled off. Therefore, the reliability of the filling structure of the embedded component and the smoothness of the surface can be improved. In addition, the manufacturing method of the wiring substrate stack of embodiment 4 has the same steps as the manufacturing method of the wiring substrate stack of embodiment 1, except that the embedded component 14 is arranged on the supporting film 22 before the wiring substrate material WB is arranged, and therefore has effects corresponding to the effects of the manufacturing method of the wiring substrate stack of embodiment 1. [Implementation method 5] Fig. 9 This is a cross-sectional view for explaining the method for manufacturing a wiring substrate laminate according to the fifth embodiment. Fig. 9 (a)~ Fig. 9(e) is a process diagram. The manufacturing method of the wiring substrate laminate of the fifth embodiment basically has the same processes as the manufacturing method of the wiring substrate laminate of the first embodiment, but is different from the manufacturing method of the wiring substrate laminate of the first embodiment in that a wiring substrate WB having a wiring pattern 20 as a metal layer and an insulating layer 19 is used instead of the wiring substrate material WB. like Fig. 9 As shown in (a), a laminated material LM including a wiring substrate WB having a plurality of openings 18 in a portion corresponding to the embedded component 14 and a filling sheet 16' including a curing material 17 is laminated in such a manner that the embedded component 14 is located inside each opening 18. At this time, the upper surface of the wiring substrate WB is preferably covered with a resin film 21, and more preferably, the resin film 21 has a plurality of openings 21a in a portion corresponding to the embedded component 14. Then, if Fig. 9 As shown in (b), a step of integrating the laminated material LM by heating and pressing is performed to obtain a laminated body LB in which the inner surface of the opening 18 of the wiring substrate WB and the embedded member 14 are filled with the curing material 17. In this way, a laminated body LB in which the height of the embedded member 14 is the same as or slightly lower than the upper surface of the wiring substrate WB can be formed. Such a step can be performed in the same manner as the previous embodiment. Then, if Fig. 9 As shown in (c), similarly to the previous embodiment, the step of removing the solidified material 16 of the filling sheet 16' is performed by grinding the solidified material 16 until the thickness of the laminated body LB after grinding becomes constant. In this embodiment, an example is shown in which the thickness of the laminated body LB after grinding is set to the thickness at which a part of the resin film 21 is removed when removing the solidified material 16 of the filling sheet 16'. In this way, the whole solidified material 16 is removed, and a part of the resin film 21 is removed. Of course, only the whole solidified material 16 may be removed. Then, if Fig. 9 (d) and Fig. 9 As shown in (e), the upper resin film 21 is peeled off to remove the thermosetting resin (convex portion A) covering the upper surface of the embedded member 14. When the upper surface of the embedded member 14 is higher than the upper surface of the wiring substrate WB, the embedded member 14 can be removed as needed. In this way, a wiring substrate can be obtained which has an insulating layer 19, an embedded component 14 embedded in the insulating layer 19, and a wiring layer (wiring pattern 20), wherein the insulating layer 19 includes a cured product 16 of a filling sheet 16', and the surrounding of the embedded component 14 is bonded to the insulating layer 19 using a cured material 17 having a different resin component from that of the insulating layer 19. As shown in the example of the figure, when a double-sided wiring board is used, it is preferable to have an interlayer connection structure such as a plated through hole, a metal bump, a filled via, or a plated via. As described above, the manufacturing method of the wiring substrate laminate of the fifth embodiment is different from the manufacturing method of the wiring substrate laminate of the first embodiment in that the wiring substrate WB having the wiring pattern 20 and the insulating layer 19 is used instead of the wiring substrate material WB. However, as in the manufacturing method of the wiring substrate laminate of the first embodiment, since a laminate having a structure in which an embedded component is arranged in an opening of the wiring substrate or the wiring substrate material and a thermosetting resin is filled into the opening by heating and pressurizing is used, complicated processes are not required when arranging the embedded component, and embedded components of various shapes can be handled. In addition, since the cured material such as the filling sheet is ground and removed in such a manner that the thickness of the laminate after grinding is constant, the thermosetting resin filled into the opening does not become a structure integrated with the cured material such as the filling sheet, and the filled thermosetting resin is less likely to break or fall off when the cured material is peeled off. Therefore, the reliability of the filling structure of the embedded component and the smoothness of the surface can be improved. In addition, the manufacturing method of the wiring substrate stack of embodiment 5 has the same steps as the manufacturing method of the wiring substrate stack of embodiment 1, except that a wiring substrate WB having a wiring pattern 20 and an insulating layer 19 is used instead of the wiring substrate material WB, and therefore has effects corresponding to the effects of the manufacturing method of the wiring substrate stack of embodiment 1. As mentioned above, although the present invention has been described based on the above-mentioned embodiment, the present invention is not limited to the above-mentioned embodiment. It can be implemented in various forms within the scope of the concept, and for example, the following modifications are also possible. (1) The number, material, shape, position, size, etc. of the components described in the above embodiments are merely examples and may be modified within a range that does not impair the effects of the present invention. (2) In each of the above-mentioned embodiments (including the above-mentioned or below-mentioned variations (the same below), a wiring substrate laminate having an insulated surface and a back surface is provided, but the present invention is not limited thereto. It may also be a wiring substrate laminate having a surface and a back surface that are electrically conductive. In this case, a through hole is formed in an opening of a wiring substrate material WB, and a plated through hole is formed on the inner surface of the through hole, so that a wiring substrate laminate having a surface and a back surface that are electrically conductive can be made (the wiring substrate laminate of variation 1 as a whole). Refer to Fig.10 (a)~ Fig.10 (c)). (3) In the above-mentioned embodiments, the metal layer 20 is a single-layer structure, but the present invention is not limited to this. The metal layer may be a multilayer wiring board with two or more layers. (4) In the above-mentioned embodiments, the stacked body LB is formed using the filling sheet 16' containing the curing material 17, but the present invention is not limited to this. Fig.11 As shown in FIG. 1 , a coating material including a curing material 17 may be used to form a laminate LB in which a cured product 16 of a coating layer having a recess 17a above an embedded member 14 is integrated into a wiring board material WB′ (see FIG. 1 ). Fig.11 (a)), the cured product 16 of the coating layer is ground to a constant thickness of the laminated body LB after grinding, and when the step of removing the cured product 16 is performed, the peripheral portion 17b of the cured product 16 of the coating layer and a portion of the thickness of the resin film 21 are removed (refer to Fig.11 (b)), the remaining portion 21b of the resin film 21 is peeled off from the laminate LB (see Fig.11 (c)) by polishing, sandblasting or the like to remove the cured product 16 of the coating layer on the upper surface of the embedded member 14 (see Fig.11 (d)) method. (5) In the above-mentioned embodiments, the wiring substrate laminate is manufactured using the wiring substrate material WB' having metal layers formed on both surfaces of the ceramic body 13, but the present invention is not limited thereto. The wiring substrate laminate may also be manufactured using a wiring substrate material having a metal layer formed on one surface of the ceramic body 13. (6) In the above-mentioned embodiments, the metal film non-formed region is provided on both sides of the outer edge of the ceramic body, but the present invention is not limited thereto. The metal film non-formed region may be provided on only one side of the outer edge of the ceramic body, and the metal film non-formed region may be filled with a curing agent, or the metal film non-formed region may be provided on only a portion of the outer edge of the ceramic body, and the metal film non-formed region may be filled with a curing agent. (7) In each of the above-mentioned embodiments, the thickness of the metal film 15 of the embedded component 14 is set to the same thickness as the thickness of the metal layer 20 of the wiring substrate WB, but the present invention is not limited to this. The thickness of the metal film 15 of the embedded component 14 may be set to a thickness different from the thickness of the metal layer 20 of the wiring substrate WB. When the thickness of the metal film 15 of the embedded component 14 is made thinner than the thickness of the metal layer 20 of the wiring substrate WB, the heat resistance when the heat generated by the electronic component is transferred to the back side via the embedded component 14 is reduced, and the heat generated by the electronic component is more easily transferred to the outside. In addition, when the thickness of the metal film 15 of the embedded component 14 is made thicker than the thickness of the metal layer 20 of the wiring substrate WB, the stress of the ceramic body 13 and the stress of the metal film 15 can be adjusted.

Explanation of symbols

Claims

1. A wiring substrate laminate, characterized in that: include: a wiring substrate having an opening; an embedding member embedded in the opening of the wiring substrate; a curing material, comprising a thermosetting resin, disposed between the embedding member and the inner peripheral surface of the opening and bonded to the wiring substrate; as well as a wiring layer formed on the surface of the wiring substrate, the embedded member and the thermosetting resin, The embedded member includes a ceramic body and metal films formed on both surfaces of the ceramic body.

2. The wiring substrate laminate according to claim 1, wherein: A metal film non-formed region where the metal film is not formed is provided on at least one surface of the outer edge portion of the embedded member, The cured material is also disposed between the ceramic body and the wiring layer in the metal film non-formation region.

3. The wiring substrate laminate according to claim 2, wherein: The metal film non-formed region is provided on both surfaces of the outer edge portion of the embedded member. The cured material is also disposed between the ceramic body and the wiring layer in the two metal film non-formation regions of the ceramic body.

4. The wiring substrate laminate according to any one of claims 1 to 3, wherein: The metal film non-formation region is formed on the entire outer edge portion so as to surround the metal film in a plan view.

5. The wiring substrate laminate according to any one of claims 1 to 3, characterized in that: The metal film is formed on the surface of the ceramic body by direct plating.

6. The wiring substrate laminate according to any one of claims 1 to 3, wherein: A metal layer is arranged on the surface of the wiring substrate. The wiring layer, the metal layer, and the metal film constitute circuit wiring.

7. The wiring substrate laminate according to claim 6, wherein: The metal layer is a metal plated film formed on the surface of the wiring substrate by plating.

8. The wiring substrate laminate according to any one of claims 1 to 3, wherein: The opening is rectangular. The embedded component is rectangular when viewed from a plane.

9. A method for manufacturing a wiring substrate laminate, for manufacturing the wiring substrate laminate according to any one of claims 1 to 3, characterized in that: include: A process for obtaining a laminated body, the laminated body comprising: a wiring substrate or wiring substrate material having an opening; an embedded component located inside the opening; and a cured product of a filling sheet or coating layer which is integrated with the wiring substrate or the wiring substrate material and contains a thermosetting resin, wherein the thermosetting resin is filled between the inner surface of the opening of the wiring substrate or the wiring substrate material and the embedded component; and A step of grinding the filling sheet or the cured product of the coating layer so that the thickness of the laminate after grinding is constant and removing the cured product.

10. The method for manufacturing a wiring substrate laminate according to claim 9, wherein: include: A step of preparing a laminated material, the laminated material comprising: the wiring substrate or the wiring substrate material, the embedding member, and the filling sheet; A step of integrating the laminated materials by heating and pressurizing to obtain the laminated body; as well as A step of grinding and removing the cured product of the filling sheet so that the thickness of the laminated body after grinding becomes constant.

11. The method for manufacturing a wiring substrate laminate according to claim 9 or 10, characterized in that: The laminate is a laminate in which a resin film having an opening at a position corresponding to the opening of the wiring substrate or the wiring substrate material is attached to the wiring substrate or the wiring substrate material. The method for manufacturing the wiring substrate laminate comprises: The step of grinding the laminated body after grinding to a thickness corresponding to the thickness of removing a portion of the resin film when removing the filling sheet or the cured product of the coating layer, and further peeling the remaining portion of the resin film from the laminated body; and A step of removing a cured product of the thermosetting resin of the embedded member covering the stacked body.

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