Ultrasonic cleaning tank

Abstract

The invention discloses an ultrasonic cleaning tank, and aims to overcome the defects that the intensity in the ultrasonic cleaning tank is not uniformly dispersed, the ultrasonic intensity in the tank is greatly different at different positions, and the cleaning effect is poor. The ultrasonic cleaning device comprises a vibration outer tank and a cleaning inner tank, a plurality of energy converters distributed in a grid shape are installed at the bottom of the vibration outer tank, and the energy converters are all connected with an ultrasonic generator; a supporting net rack is installed in the vibration outer groove, and the cleaning inner groove is supported on the supporting net rack. According to the ultrasonic cleaning tank, the vibration intensity of each position in the cleaning inner tank is uniform and stable, the cleaning effect on particles on the surface of a wafer is good, and the detection accuracy of the particles on the surface of the wafer is guaranteed.

Description

Technical Field

[0001] The invention relates to a quartz product cleaning technology, and more specifically, to an ultrasonic cleaning tank. Background Art

[0002] As the integration of semiconductor devices and integrated circuits continues to increase, the characteristic size of the device is getting smaller, the requirements for the cleanliness of the wafer surface are getting higher and higher, and the detection frequency of particles on the wafer surface is getting higher and higher. Liquid particle testing (LPC testing) requires an ultrasonic tank with stable intensity, but the ultrasonic tanks currently on the market are difficult to meet this requirement. The intensity of the commonly used ultrasonic cleaning tanks is unevenly dispersed, and the ultrasonic intensity in the tank varies greatly at different positions. Interference will occur between different vibrators, resulting in high or low intensity at certain positions. Summary of the invention

[0003] In order to overcome the above-mentioned shortcomings, the present invention provides an ultrasonic cleaning tank, in which the vibration intensity inside the tank is uniform and stable, which has a good cleaning effect on the particles on the surface of the wafer and ensures the accuracy of the detection of particles on the surface of the wafer.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions: an ultrasonic cleaning tank, comprising a vibrating outer tank and a cleaning inner tank, a plurality of transducers arranged in a grid are installed at the bottom of the vibrating outer tank, and the transducers are all connected to an ultrasonic generator; a supporting grid is installed in the vibrating outer tank, and the cleaning inner tank is supported on the supporting grid.

[0005] When cleaning wafer products, place the wafer products in the cleaning inner tank, and then load the cleaning inner tank onto the supporting grid in the vibrating outer tank. Start the ultrasonic generator and transducer to generate ultrasonic vibration in the vibrating outer tank, and the ultrasonic vibration is transmitted to the cleaning inner tank to ultrasonically clean the wafer products in the cleaning inner tank. Since a number of transducers are arranged in a grid at the bottom of the vibrating outer tank, the ultrasonic vibration intensity at each position in the vibrating outer tank is more uniform. In addition, a supporting grid is installed in the vibrating outer tank, and the cleaning inner tank is supported on the supporting grid. The supporting grid can disperse the ultrasonic vibration to each position, making the vibration intensity at each position of the supporting grid more uniform, thereby making the ultrasonic vibration intensity at each position in the cleaning inner tank uniform and stable, ensuring the cleaning effect.

[0006] The ultrasonic cleaning tank of the patent application has uniform and stable vibration intensity at each position in the cleaning inner tank, has a good cleaning effect on the particles on the surface of the wafer, and ensures the accuracy of the detection of particles on the surface of the wafer.

[0007] Preferably, a mounting cavity is provided at the bottom of the vibration outer groove, a mounting frame is installed in the mounting cavity, and the transducers are all installed on the mounting frame.

[0008] The installation cavity is set at the bottom of the vibration outer tank, which is convenient for the installation of the transducer. The transducer is installed on the mounting frame, which is stable and reliable.

[0009] Preferably, a drainage hole is provided at the bottom of the vibration outer tank, the drainage hole is connected to a drainage pipe, and the drainage pipe extends to the outside of the vibration outer tank.

[0010] The drainage hole is arranged at the bottom of the vibration outer tank, and the drainage pipe extends to the outside of the vibration outer tank to facilitate the discharge of water.

[0011] Preferably, a protective grid is installed on the top of the inner cleaning tank.

[0012] The protective grid is larger than the wafer product in the cleaning tank, which plays a protective role. At the same time, the protective grid is placed on the top of the cleaning tank to achieve vibration transmission, which is conducive to making the vibration intensity of each position in the cleaning tank more uniform.

[0013] Preferably, a bracket is arranged above the inner cleaning tank, and a plurality of vibration intensity detection probes are detachably mounted on the bracket. The lower ends of the vibration intensity detection probes are inserted into the inner cleaning tank and distributed at various positions according to a grid.

[0014] Vibration intensity detection probes are installed at various positions of the cleaning inner tank to detect the ultrasonic vibration intensity to ensure uniform intensity and temperature at various positions. When the intensity deviation at various positions is large, the vibration intensity of the transducer at different positions can be adjusted by adjusting the position of the cleaning inner tank, adjusting the current intensity and frequency of the ultrasonic generator, and finally making the ultrasonic vibration intensity at various positions of the cleaning inner tank uniform and stable.

[0015] In the second solution, a plurality of vibration-averaging floats are installed in the vibration outer tank, and a pull rope is connected between the vibration-averaging floats and the bottom of the vibration outer tank.

[0016] The uniform vibration float is immersed in the liquid in the vibration outer tank. When the liquid in the vibration outer tank is subjected to ultrasonic vibration, the uniform vibration float vibrates, and the uniform vibration float breaks up and distributes the vibration, making the ultrasonic vibration intensity at each position of the vibration outer tank uniform and stable.

[0017] Preferably, a plurality of vibration-averaging buoys are provided above and below the supporting grid.

[0018] The vibration-averaging floats are distributed at various positions of the vibration outer tank, which is beneficial to the uniformity and stability of the vibration intensity at various positions in the vibration outer tank.

[0019] In the third solution, a vibration balancing frame is installed below the supporting grid in the vibration outer tank, and the vibration balancing frame is arranged to move back and forth horizontally.

[0020] By reciprocating the vibration-averaging frame in the vibration outer tank, the ultrasonic vibration in the vibration outer tank is dispersed and evenly distributed laterally, which is beneficial to the uniformity and stability of the vibration intensity at each position in the vibration outer tank.

[0021] Preferably, a sliding block and a driving motor are installed on the top of the vibrating outer groove, an extension rod is connected between the sliding block and the vibration-averaging frame, the output shaft of the driving motor is connected to a turntable, and a connecting rod is hinged between the turntable and the sliding block.

[0022] The driving motor drives the turntable to rotate, and the turntable realizes the push-pull movement of the sliding block through the connecting rod, thereby realizing the lateral reciprocating movement of the extension rod and the vibration-averaging frame.

[0023] The fourth solution is to install several rows of thin vibration-averaging rods at intervals at the bottom of the vibrating outer tank.

[0024] During the operation of the ultrasonic generator and transducer, the ultrasonic vibration is transmitted to the uniform vibration rod in the vibration outer groove, and is evenly distributed by the uniform vibration rod, which is beneficial to the uniformity and stability of the vibration intensity at each position in the vibration outer groove.

[0025] Compared with the prior art, the beneficial effects of the present invention are: (1) the vibration intensity at each position in the cleaning inner tank of the ultrasonic cleaning tank of the patent application is uniform and stable, which has a good cleaning effect on the particles on the wafer surface and ensures the accuracy of the detection of particles on the wafer surface; (2) before cleaning, the position of the cleaning inner tank is adjusted, the current intensity and frequency of the ultrasonic generator are adjusted, and the vibration intensity of the transducer at different positions is adjusted, so that the ultrasonic vibration intensity at each position of the cleaning inner tank is finally uniform and stable, ensuring that the vibration intensity at each position of the wafer product is uniform and stable during the cleaning process of the cleaning inner tank, thereby ensuring the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention.

[0027] Figure 2 It is a cross-sectional view of Example 1 of the present invention.

[0028] Figure 3 It is a cross-sectional view of Example 2 of the present invention.

[0029] Figure 4 It is a cross-sectional view of Example 3 of the present invention.

[0030] Figure 5 It is a cross-sectional view of Example 4 of the present invention.

[0031] In the figure: 1. vibration outer tank, 2. cleaning inner tank, 3. convex edge, 4. transducer, 5. ultrasonic generator, 6. mounting cavity, 7. mounting frame, 8. partition, 9. vibration cavity, 10. drainage hole, 11. drainage pipe, 12. support grid, 13. support block, 14. protection grid, 15. mounting plate, 16. pillar, 17. vibration intensity detection probe, 18. uniform vibration float, 19. pull rope, 20. uniform vibration frame, 21. sliding block, 22. extension rod, 23. turntable, 24. connecting rod, 25. support, 26. uniform vibration thin rod. DETAILED DESCRIPTION

[0032] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings: Example 1: An ultrasonic cleaning tank (see attached Figure 1 , Attachment Figure 2 ), including a vibrating outer tank 1 and a cleaning inner tank 2, the upper end of the vibrating outer tank 1 is provided with a convex edge 3, the inner edge and outer edge of the convex edge 3 protrude from the inner wall and outer wall of the vibrating outer tank 1 respectively. The vibrating outer tank 1 and the vibrating inner tank are both rectangular structures. A plurality of transducers 4 arranged in a grid are installed at the bottom of the vibrating outer tank 1, and the transducers 4 are all connected to the ultrasonic generator 5; a mounting cavity 6 is arranged at the bottom of the vibrating outer tank 1, and a mounting frame 7 is installed in the mounting cavity 6, and the transducers 4 are all installed on the mounting frame 7. A partition plate 8 is arranged at the bottom of the vibrating outer tank 1, and a vibrating cavity 9 is formed in the upper part of the inner partition plate 8 of the vibrating outer tank 1, and a mounting cavity 6 is formed in the lower part of the inner partition plate 8 of the vibrating outer tank 1, and the upper end of the transducer 4 is attached to the lower surface of the partition plate 8. The ultrasonic generator 5 is installed in the mounting cavity 6. A drainage hole 10 is arranged at the bottom of the vibrating outer tank 1, and the drainage hole 10 is connected to a drainage pipe 11, and the drainage pipe 11 extends to the outside of the vibrating outer tank 1. The drain hole 10 is arranged on the partition 8, and the drain hole 10 is close to the middle position of the partition 8. The installation cavity 6 is arranged at the bottom of the vibration outer tank 1, which facilitates the installation of the transducer 4 and the ultrasonic generator 5. The transducer 4 is installed on the mounting frame 7, which is stable and reliable. The drain hole 10 is arranged at the bottom of the vibration outer tank 1, and the drain pipe 11 extends to the outside of the vibration outer tank 1, which is convenient for the discharge of water flow.

[0033] A support grid 12 is installed in the vibration outer tank 1, and the cleaning inner tank 2 is supported on the support grid 12. A number of support blocks 13 are arranged at intervals on the inner wall of the vibration outer tank 1 in a circumferential direction, and the support grid 12 is supported on the support blocks 13, and the support grid 12 is fastened to the support blocks 13. A protective grid 14 is installed on the top of the cleaning inner tank 2, and the protective grid 14 is erected on the top of the cleaning inner tank 2. The protective grid 14 is larger than the wafer product of the cleaning inner tank 2 and plays a protective role. At the same time, the protective grid 14 is placed on the top of the cleaning inner tank 2 to realize the transmission of vibration, which is conducive to making the vibration intensity of each position of the cleaning inner tank 2 more uniform.

[0034] A bracket is arranged above the inner cleaning tank 2, and the bracket includes a mounting plate 15 and a plurality of pillars 16. The pillars 16 are arranged outside the outer vibration tank 1, and the upper ends of the pillars 16 are connected to the mounting plate 15 and support the mounting plate 15. A plurality of vibration intensity detection probes 17 are detachably mounted on the bracket, and the lower ends of the vibration intensity detection probes 17 are inserted into the inner cleaning tank 2 and distributed in a grid at various positions. The mounting plate 15 is provided with a plurality of mounting holes arranged in a rectangular array, and a detachable connection is achieved between the upper part of the vibration intensity detection probe 17 and the mounting hole, and the vibration intensity detection probe 17 is connected to the vibration intensity detector through a wire.

[0035] Before cleaning the wafer product, a vibration intensity detection probe 17 is installed at each position of the cleaning inner tank 2 to detect the ultrasonic vibration intensity to ensure uniform intensity and temperature at each position. When the intensity deviation at each position is large, the vibration intensity of the transducer 4 at different positions is adjusted by adjusting the position of the cleaning inner tank 2, adjusting the current intensity and frequency of the ultrasonic generator 5, and finally making the ultrasonic vibration intensity at each position of the cleaning inner tank 2 uniform and stable. The wafer product is loaded in the cleaning inner tank 2 with uniform and stable vibration intensity at each position for ultrasonic cleaning operation, and the cleaning effect is good. The cleaning liquid after cleaning in the cleaning inner tank 2 is sucked, and the particle detection equipment is used to detect the particle to ensure the accuracy of the particle detection on the wafer surface.

[0036] When cleaning the wafer product, place the wafer product in the cleaning inner tank 2, and then load the cleaning inner tank 2 onto the supporting grid 12 in the vibrating outer tank 1. Start the ultrasonic generator 5 and the transducer 4 to generate ultrasonic vibration in the vibrating outer tank 1, and the ultrasonic vibration is transmitted to the cleaning inner tank 2 to ultrasonically clean the wafer product in the cleaning inner tank 2. Since a number of transducers 4 are arranged in a grid shape at the bottom of the vibrating outer tank 1, the ultrasonic vibration intensity at each position in the vibrating outer tank 1 is more uniform. In addition, a supporting grid 12 is installed in the vibrating outer tank 1, and the cleaning inner tank 2 is supported on the supporting grid 12. The supporting grid 12 can disperse the ultrasonic vibration to each position, so that the vibration intensity at each position of the supporting grid 12 is more uniform, and then the ultrasonic vibration intensity at each position in the cleaning inner tank 2 is uniform and stable, thereby ensuring the cleaning effect.

[0037] Example 2: An ultrasonic cleaning tank (see attached Figure 3), including a vibrating outer tank 1 and a cleaning inner tank 2, the upper end of the vibrating outer tank 1 is provided with a convex edge 3, the inner edge and outer edge of the convex edge 3 protrude from the inner wall and outer wall of the vibrating outer tank 1 respectively. The vibrating outer tank 1 and the vibrating inner tank are both rectangular structures. A plurality of transducers 4 arranged in a grid are installed at the bottom of the vibrating outer tank 1, and the transducers 4 are all connected to the ultrasonic generator 5; a mounting cavity 6 is arranged at the bottom of the vibrating outer tank 1, and a mounting frame 7 is installed in the mounting cavity 6, and the transducers 4 are all installed on the mounting frame 7. A partition plate 8 is arranged at the bottom of the vibrating outer tank 1, and a vibrating cavity 9 is formed in the upper part of the inner partition plate 8 of the vibrating outer tank 1, and a mounting cavity 6 is formed in the lower part of the inner partition plate 8 of the vibrating outer tank 1, and the upper end of the transducer 4 is attached to the lower surface of the partition plate 8. The ultrasonic generator 5 is installed in the mounting cavity 6. A drainage hole 10 is arranged at the bottom of the vibrating outer tank 1, and the drainage hole 10 is connected to a drainage pipe 11, and the drainage pipe 11 extends to the outside of the vibrating outer tank 1. The drain hole 10 is arranged on the partition 8, and the drain hole 10 is close to the middle position of the partition 8. The installation cavity 6 is arranged at the bottom of the vibration outer tank 1, which facilitates the installation of the transducer 4 and the ultrasonic generator 5. The transducer 4 is installed on the mounting frame 7, which is stable and reliable. The drain hole 10 is arranged at the bottom of the vibration outer tank 1, and the drain pipe 11 extends to the outside of the vibration outer tank 1, which is convenient for the discharge of water flow.

[0038] A support grid 12 is installed in the vibration outer tank 1, and the cleaning inner tank 2 is supported on the support grid 12. A number of support blocks 13 are arranged at intervals on the inner wall of the vibration outer tank 1 in a circumferential direction, and the support grid 12 is supported on the support blocks 13, and the support grid 12 is fastened to the support blocks 13. A protective grid 14 is installed on the top of the cleaning inner tank 2, and the protective grid 14 is erected on the top of the cleaning inner tank 2. The protective grid 14 is larger than the wafer product of the cleaning inner tank 2 and plays a protective role. At the same time, the protective grid 14 is placed on the top of the cleaning inner tank 2 to realize the transmission of vibration, which is conducive to making the vibration intensity of each position of the cleaning inner tank 2 more uniform.

[0039] A plurality of vibration-averaging floats 18 are installed in the vibration outer tank 1, and a pull rope 19 is connected between the vibration-averaging floats 18 and the bottom of the vibration outer tank 1. A plurality of vibration-averaging floats 18 are arranged above and below the support grid 12. The buoyancy of the vibration-averaging floats 18 is greater than its own gravity, ensuring that the vibration-averaging floats 18 can be immersed and floated in the liquid of the vibration outer tank 1.

[0040] After the liquid in the vibration outer tank 1 is subjected to ultrasonic vibration, the vibration-distributing float 18 vibrates, and the vibration-distributing float 18 disperses and evenly distributes the vibration, so that the ultrasonic vibration intensity at each position of the vibration outer tank 1 is uniform and stable. The vibration-distributing float 18 is distributed at each position of the vibration outer tank 1, which is conducive to the uniformity and stability of the vibration intensity at each position in the vibration outer tank 1.

[0041] A bracket is arranged above the inner cleaning tank 2, and the bracket includes a mounting plate 15 and a plurality of pillars 16. The pillars 16 are arranged outside the outer vibration tank 1, and the upper ends of the pillars 16 are connected to the mounting plate 15 and support the mounting plate 15. A plurality of vibration intensity detection probes 17 are detachably mounted on the bracket, and the lower ends of the vibration intensity detection probes 17 are inserted into the inner cleaning tank 2 and distributed in a grid at various positions. The mounting plate 15 is provided with a plurality of mounting holes arranged in a rectangular array, and a detachable connection is achieved between the upper part of the vibration intensity detection probe 17 and the mounting hole, and the vibration intensity detection probe 17 is connected to the vibration intensity detector through a wire.

[0042] Before cleaning the wafer product, a vibration intensity detection probe 17 is installed at each position of the cleaning inner tank 2 to detect the ultrasonic vibration intensity to ensure uniform intensity and temperature at each position. When the intensity deviation at each position is large, the vibration intensity of the transducer 4 at different positions is adjusted by adjusting the position of the cleaning inner tank 2, adjusting the current intensity and frequency of the ultrasonic generator 5, and finally making the ultrasonic vibration intensity at each position of the cleaning inner tank 2 uniform and stable. The wafer product is loaded in the cleaning inner tank 2 with uniform and stable vibration intensity at each position for ultrasonic cleaning operation, and the cleaning effect is good. The cleaning liquid after cleaning in the cleaning inner tank 2 is sucked, and the particle detection equipment is used to detect the particle to ensure the accuracy of the particle detection on the wafer surface.

[0043] When cleaning the wafer product, place the wafer product in the cleaning inner tank 2, and then load the cleaning inner tank 2 onto the supporting grid 12 in the vibrating outer tank 1. Start the ultrasonic generator 5 and the transducer 4 to generate ultrasonic vibration in the vibrating outer tank 1, and the ultrasonic vibration is transmitted to the cleaning inner tank 2 to ultrasonically clean the wafer product in the cleaning inner tank 2. Since a number of transducers 4 are arranged in a grid shape at the bottom of the vibrating outer tank 1, the ultrasonic vibration intensity at each position in the vibrating outer tank 1 is more uniform. In addition, a supporting grid 12 is installed in the vibrating outer tank 1, and the cleaning inner tank 2 is supported on the supporting grid 12. The supporting grid 12 can disperse the ultrasonic vibration to each position, so that the vibration intensity at each position of the supporting grid 12 is more uniform, and then the ultrasonic vibration intensity at each position in the cleaning inner tank 2 is uniform and stable, thereby ensuring the cleaning effect.

[0044] Example 3: An ultrasonic cleaning tank (see attached Figure 4), including a vibrating outer tank 1 and a cleaning inner tank 2, the upper end of the vibrating outer tank 1 is provided with a convex edge 3, the inner edge and outer edge of the convex edge 3 protrude from the inner wall and outer wall of the vibrating outer tank 1 respectively. The vibrating outer tank 1 and the vibrating inner tank are both rectangular structures. A plurality of transducers 4 arranged in a grid are installed at the bottom of the vibrating outer tank 1, and the transducers 4 are all connected to the ultrasonic generator 5; a mounting cavity 6 is arranged at the bottom of the vibrating outer tank 1, and a mounting frame 7 is installed in the mounting cavity 6, and the transducers 4 are all installed on the mounting frame 7. A partition plate 8 is arranged at the bottom of the vibrating outer tank 1, and a vibrating cavity 9 is formed in the upper part of the inner partition plate 8 of the vibrating outer tank 1, and a mounting cavity 6 is formed in the lower part of the inner partition plate 8 of the vibrating outer tank 1, and the upper end of the transducer 4 is attached to the lower surface of the partition plate 8. The ultrasonic generator 5 is installed in the mounting cavity 6. A drainage hole 10 is arranged at the bottom of the vibrating outer tank 1, and the drainage hole 10 is connected to a drainage pipe 11, and the drainage pipe 11 extends to the outside of the vibrating outer tank 1. The drain hole 10 is arranged on the partition 8, and the drain hole 10 is close to the middle position of the partition 8. The installation cavity 6 is arranged at the bottom of the vibration outer tank 1, which facilitates the installation of the transducer 4 and the ultrasonic generator 5. The transducer 4 is installed on the mounting frame 7, which is stable and reliable. The drain hole 10 is arranged at the bottom of the vibration outer tank 1, and the drain pipe 11 extends to the outside of the vibration outer tank 1, which is convenient for the discharge of water flow.

[0045] A support grid 12 is installed in the vibration outer tank 1, and the cleaning inner tank 2 is supported on the support grid 12. A number of support blocks 13 are arranged at intervals on the inner wall of the vibration outer tank 1 in a circumferential direction, and the support grid 12 is supported on the support blocks 13, and the support grid 12 is fastened to the support blocks 13. A protective grid 14 is installed on the top of the cleaning inner tank 2, and the protective grid 14 is erected on the top of the cleaning inner tank 2. The protective grid 14 is larger than the wafer product of the cleaning inner tank 2 and plays a protective role. At the same time, the protective grid 14 is placed on the top of the cleaning inner tank 2 to realize the transmission of vibration, which is conducive to making the vibration intensity of each position of the cleaning inner tank 2 more uniform.

[0046] A vibration balancing frame 20 is installed below the supporting grid 12 in the vibration outer tank 1. The vibration balancing frame 20 has a grid structure and is arranged to move back and forth laterally. A sliding block 21 and a driving motor are installed on the top of the vibration outer tank 1. An extension rod 22 is connected between the sliding block 21 and the vibration balancing frame 20. The output shaft of the driving motor is connected to a turntable 23. A connecting rod 24 is hinged between the turntable 23 and the sliding block 21. A plurality of supports 25 are arranged on the supporting grid 12. A mounting groove is arranged on the supports 25. The vibration balancing frame 20 and the mounting groove are slidably connected. A slide groove is arranged at the upper end of the vibration outer tank 1. The sliding block 21 is slidably adapted to the slide groove.

[0047] The reciprocating movement of the vibration balancing frame 20 in the vibration outer tank 1 can disperse and evenly distribute the ultrasonic vibration in the vibration outer tank 1 horizontally, which is beneficial to the uniformity and stability of the vibration intensity at each position in the vibration outer tank 1. The driving motor drives the turntable 23 to rotate, and the turntable 23 pushes and pulls the sliding block 21 through the connecting rod 24, thereby realizing the horizontal reciprocating movement of the extension rod 22 and the vibration balancing frame 20.

[0048] A bracket is arranged above the inner cleaning tank 2, and the bracket includes a mounting plate 15 and a plurality of pillars 16. The pillars 16 are arranged outside the outer vibration tank 1, and the upper ends of the pillars 16 are connected to the mounting plate 15 and support the mounting plate 15. A plurality of vibration intensity detection probes 17 are detachably mounted on the bracket, and the lower ends of the vibration intensity detection probes 17 are inserted into the inner cleaning tank 2 and distributed in a grid at various positions. The mounting plate 15 is provided with a plurality of mounting holes arranged in a rectangular array, and a detachable connection is achieved between the upper part of the vibration intensity detection probe 17 and the mounting hole, and the vibration intensity detection probe 17 is connected to the vibration intensity detector through a wire.

[0049] Before cleaning the wafer product, a vibration intensity detection probe 17 is installed at each position of the cleaning inner tank 2 to detect the ultrasonic vibration intensity to ensure uniform intensity and temperature at each position. When the intensity deviation at each position is large, the vibration intensity of the transducer 4 at different positions is adjusted by adjusting the position of the cleaning inner tank 2, adjusting the current intensity and frequency of the ultrasonic generator 5, and finally making the ultrasonic vibration intensity at each position of the cleaning inner tank 2 uniform and stable. The wafer product is loaded in the cleaning inner tank 2 with uniform and stable vibration intensity at each position for ultrasonic cleaning operation, and the cleaning effect is good. The cleaning liquid after cleaning in the cleaning inner tank 2 is sucked, and the particle detection equipment is used to detect the particle to ensure the accuracy of the particle detection on the wafer surface.

[0050] When cleaning the wafer product, place the wafer product in the cleaning inner tank 2, and then load the cleaning inner tank 2 onto the supporting grid 12 in the vibrating outer tank 1. Start the ultrasonic generator 5 and the transducer 4 to generate ultrasonic vibration in the vibrating outer tank 1, and the ultrasonic vibration is transmitted to the cleaning inner tank 2 to ultrasonically clean the wafer product in the cleaning inner tank 2. Since a number of transducers 4 are arranged in a grid shape at the bottom of the vibrating outer tank 1, the ultrasonic vibration intensity at each position in the vibrating outer tank 1 is more uniform. In addition, a supporting grid 12 is installed in the vibrating outer tank 1, and the cleaning inner tank 2 is supported on the supporting grid 12. The supporting grid 12 can disperse the ultrasonic vibration to each position, so that the vibration intensity at each position of the supporting grid 12 is more uniform, and then the ultrasonic vibration intensity at each position in the cleaning inner tank 2 is uniform and stable, thereby ensuring the cleaning effect.

[0051] Example 4: An ultrasonic cleaning tank (see attached Figure 5), including a vibrating outer tank 1 and a cleaning inner tank 2, the upper end of the vibrating outer tank 1 is provided with a convex edge 3, the inner edge and outer edge of the convex edge 3 protrude from the inner wall and outer wall of the vibrating outer tank 1 respectively. The vibrating outer tank 1 and the vibrating inner tank are both rectangular structures. A plurality of transducers 4 arranged in a grid are installed at the bottom of the vibrating outer tank 1, and the transducers 4 are all connected to the ultrasonic generator 5; a mounting cavity 6 is arranged at the bottom of the vibrating outer tank 1, and a mounting frame 7 is installed in the mounting cavity 6, and the transducers 4 are all installed on the mounting frame 7. A partition plate 8 is arranged at the bottom of the vibrating outer tank 1, and a vibrating cavity 9 is formed in the upper part of the inner partition plate 8 of the vibrating outer tank 1, and a mounting cavity 6 is formed in the lower part of the inner partition plate 8 of the vibrating outer tank 1, and the upper end of the transducer 4 is attached to the lower surface of the partition plate 8. The ultrasonic generator 5 is installed in the mounting cavity 6. A drainage hole 10 is arranged at the bottom of the vibrating outer tank 1, and the drainage hole 10 is connected to a drainage pipe 11, and the drainage pipe 11 extends to the outside of the vibrating outer tank 1. The drain hole 10 is arranged on the partition 8, and the drain hole 10 is close to the middle position of the partition 8. The installation cavity 6 is arranged at the bottom of the vibration outer tank 1, which facilitates the installation of the transducer 4 and the ultrasonic generator 5. The transducer 4 is installed on the mounting frame 7, which is stable and reliable. The drain hole 10 is arranged at the bottom of the vibration outer tank 1, and the drain pipe 11 extends to the outside of the vibration outer tank 1, which is convenient for the discharge of water flow.

[0052] A support grid 12 is installed in the vibration outer tank 1, and the cleaning inner tank 2 is supported on the support grid 12. A number of support blocks 13 are arranged at intervals on the inner wall of the vibration outer tank 1 in a circumferential direction, and the support grid 12 is supported on the support blocks 13, and the support grid 12 is fastened to the support blocks 13. A protective grid 14 is installed on the top of the cleaning inner tank 2, and the protective grid 14 is erected on the top of the cleaning inner tank 2. The protective grid 14 is larger than the wafer product of the cleaning inner tank 2 and plays a protective role. At the same time, the protective grid 14 is placed on the top of the cleaning inner tank 2 to realize the transmission of vibration, which is conducive to making the vibration intensity of each position of the cleaning inner tank 2 more uniform.

[0053] Several rows of spaced-apart thin vibration rods 26 are installed at the bottom of the vibration outer tank 1. The thin vibration rods 26 are installed on the partition 8. During the operation of the ultrasonic generator 5 and the transducer 4, the ultrasonic vibration is transmitted to the thin vibration rods 26 in the vibration outer tank 1. The thin vibration rods 26 disperse and evenly distribute the vibration, which is beneficial to the uniformity and stability of the vibration intensity at each position in the vibration outer tank 1.

[0054] A bracket is arranged above the inner cleaning tank 2, and the bracket includes a mounting plate 15 and a plurality of pillars 16. The pillars 16 are arranged outside the outer vibration tank 1, and the upper ends of the pillars 16 are connected to the mounting plate 15 and support the mounting plate 15. A plurality of vibration intensity detection probes 17 are detachably mounted on the bracket, and the lower ends of the vibration intensity detection probes 17 are inserted into the inner cleaning tank 2 and distributed in a grid at various positions. The mounting plate 15 is provided with a plurality of mounting holes arranged in a rectangular array, and a detachable connection is achieved between the upper part of the vibration intensity detection probe 17 and the mounting hole, and the vibration intensity detection probe 17 is connected to the vibration intensity detector through a wire.

[0055] Before cleaning the wafer product, a vibration intensity detection probe 17 is installed at each position of the cleaning inner tank 2 to detect the ultrasonic vibration intensity to ensure uniform intensity and temperature at each position. When the intensity deviation at each position is large, the vibration intensity of the transducer 4 at different positions is adjusted by adjusting the position of the cleaning inner tank 2, adjusting the current intensity and frequency of the ultrasonic generator 5, and finally making the ultrasonic vibration intensity at each position of the cleaning inner tank 2 uniform and stable. The wafer product is loaded in the cleaning inner tank 2 with uniform and stable vibration intensity at each position for ultrasonic cleaning operation, and the cleaning effect is good. The cleaning liquid after cleaning in the cleaning inner tank 2 is sucked, and the particle detection equipment is used to detect the particle to ensure the accuracy of the particle detection on the wafer surface.

[0056] When cleaning the wafer product, place the wafer product in the cleaning inner tank 2, and then load the cleaning inner tank 2 onto the supporting grid 12 in the vibrating outer tank 1. Start the ultrasonic generator 5 and the transducer 4 to generate ultrasonic vibration in the vibrating outer tank 1, and the ultrasonic vibration is transmitted to the cleaning inner tank 2 to ultrasonically clean the wafer product in the cleaning inner tank 2. Since a number of transducers 4 are arranged in a grid shape at the bottom of the vibrating outer tank 1, the ultrasonic vibration intensity at each position in the vibrating outer tank 1 is more uniform. In addition, a supporting grid 12 is installed in the vibrating outer tank 1, and the cleaning inner tank 2 is supported on the supporting grid 12. The supporting grid 12 can disperse the ultrasonic vibration to each position, so that the vibration intensity at each position of the supporting grid 12 is more uniform, and then the ultrasonic vibration intensity at each position in the cleaning inner tank 2 is uniform and stable, thereby ensuring the cleaning effect.

[0057] The above-described embodiments are only preferred solutions of the present invention and are not intended to limit the present invention in any form. Other variations and modifications are possible without exceeding the technical solutions described in the claims.

Claims

1. An ultrasonic cleaning tank, characterized in that: It includes a vibrating outer tank and a cleaning inner tank. A plurality of transducers arranged in a grid are installed at the bottom of the vibrating outer tank, and the transducers are all connected to the ultrasonic generator. A supporting grid is installed in the vibrating outer tank, and the cleaning inner tank is supported on the supporting grid.

2. An ultrasonic cleaning tank according to claim 1, characterized in that: A mounting cavity is arranged at the bottom of the vibration outer tank, a mounting frame is installed in the mounting cavity, and the transducers are all installed on the mounting frame.

3. An ultrasonic cleaning tank according to claim 1, characterized in that: A drainage hole is arranged at the bottom of the vibration outer tank, the drainage hole is connected to a drainage pipe, and the drainage pipe extends to the outside of the vibration outer tank.

4. An ultrasonic cleaning tank according to claim 1, characterized in that: Clean the top of the inner tank and install a protective grid.

5. The ultrasonic cleaning tank according to claim 1, characterized in that: A bracket is arranged above the inner cleaning tank, and a plurality of vibration intensity detection probes are detachably mounted on the bracket. The lower ends of the vibration intensity detection probes are inserted into the inner cleaning tank and distributed at various positions according to a grid.

6. An ultrasonic cleaning tank according to any one of claims 1 to 5, characterized in that: A plurality of vibration-averaging floats are installed in the vibration outer tank, and a pull rope is connected between the vibration-averaging float and the bottom of the vibration outer tank.

7. An ultrasonic cleaning tank according to claim 6, characterized in that: A number of vibration-averaging floating balls are arranged above and below the supporting grid.

8. An ultrasonic cleaning tank according to any one of claims 1 to 5, characterized in that: A vibration balancing frame is installed below the supporting grid frame in the vibration outer tank, and the vibration balancing frame is arranged to move back and forth horizontally.

9. An ultrasonic cleaning tank according to claim 8, characterized in that: A sliding block and a driving motor are installed on the top of the vibration outer tank, an extension rod is connected between the sliding block and the vibration equalizing frame, an output shaft of the driving motor is connected to a turntable, and a connecting rod is hinged between the turntable and the sliding block.

10. An ultrasonic cleaning tank according to any one of claims 1 to 5, characterized in that: A plurality of rows of thin vibration-averaging rods arranged at intervals are installed at the bottom of the vibrating outer tank.

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