Patterned graphene copper composite material with high electric conductivity and heat conductivity and preparation method of patterned graphene copper composite material

Abstract

The invention discloses a patterned graphene copper composite material with high electric conductivity and heat conductivity and a preparation method thereof, relates to the technical field of composite material preparation, and aims to solve the problem of how to improve the performance of the graphene copper composite material. The preparation method comprises the following steps: S1, coating graphene layers on the two sides of a graphene-coated copper foil with photoresist, after the photoresist is cured and molded, carrying out patterning treatment on the photoresist; s2, placing the graphene-coated copper foil in the step S1 into a photoetching machine, etching the graphene layer according to the patterned photoresist, and removing the photoresist layer to prepare a patterned graphene-coated copper foil; and S3, a plurality of patterned graphene-coated copper foils prepared in the step S2 are placed in a hot-pressing cavity, proper hot-pressing temperature and pressure are set, hot-pressing forming is conducted on the patterned graphene-coated copper foils through a lamination hot-pressing method, and the high-electric-conductivity and high-heat-conductivity graphene-copper composite material is obtained.

Description

Technical Field

[0001] The present invention relates to the technical field of composite material preparation, and in particular to a high-electrical and thermal-conductive patterned graphene copper composite material and a preparation method thereof. Background Art

[0002] Pure metals have long been considered to have the highest conductivity at room temperature. Since the first official record of the conductivity of copper about 100 years ago, a large number of studies on highly refined copper metal have only increased the conductivity by about 3%. The widely used International Annealed Copper Standard (IACS) records the conductivity of pure copper at room temperature as 5.8×10 7 S / m, among metals, only silver has a better conductivity than copper (about 108% IACS), but its cost is too high, so copper-based materials have always been used as the main conductive material.

[0003] In order to improve the conductivity of copper-based materials, the method of preparing high-purity copper by increasing purity, reducing grain boundaries and reducing defects has gradually approached the physical limit, the cost has increased significantly, and the technical requirements have become more and more stringent; and the addition of other alloy materials (such as tin, rare earth elements, etc.) also often has the phenomenon of decreased conductivity due to process instability or copper-based lattice distortion, which has certain limitations. The use of metallic copper and new materials to prepare ultra-high conductive copper-based composite materials has attracted extensive research.

[0004] Graphene is an allotrope of carbon atoms and a two-dimensional crystalline material. It is the basic single-layer SP of a two-dimensional lattice component. 2 Hybrid (two-dimensional honeycomb structure) carbon atoms. In 2004, British scientists successfully prepared graphene sheets for the first time. The carbon atoms inside the graphene sheets are bonded by σ bonds with extremely high bonding strength, and each carbon atom can provide an unbonded free electron. This unique structure awakens its high strength and good conductivity. Its strength is as high as 130GPa, and the carrier mobility is 15000cm 2 / (V·s), both of which are the highest among currently known materials. In addition, graphene also has a high surface area and thermal conductivity, as well as unique properties such as molecular, quantum, and tunneling effects. Patterned graphene has even better electrical and thermal conductivity. Due to its special two-dimensional structure and excellent performance, graphene still has good advantages in improving the mechanical properties of materials and maintaining the high electrical and thermal conductivity of copper, making it an excellent reinforcement material for copper-based composites. Graphene-enhanced copper-based materials have been widely used in the automotive and aerospace industries.

[0005] However, the wettability between graphene and copper is very poor, resulting in poor interface bonding, causing the material strength to decrease. In the preparation process of composite materials, the structure of graphene is often destroyed, and the excellent performance of graphene strongly depends on the complete structure. The performance of the graphene composite material thus obtained is often far from the theoretical value. Therefore, the interface structure of graphene copper is regulated to improve the problem of weak adhesion of graphene copper interface, ensure that graphene is not damaged or agglomerated during the preparation process of graphene copper composite materials, and improve the performance of graphene copper composite materials, which is of great significance to the research of composite materials. Summary of the invention

[0006] The present invention proposes a method for preparing a highly conductive and thermally conductive patterned graphene copper composite material, which is characterized by comprising the following steps: S1: coating a photoresist on the graphene layers on both sides of the graphene-coated copper foil, and curing the photoresist, and patterning the photoresist after curing; S2: placing the graphene-coated copper foil in step S1 into a photolithography machine, etching the graphene layer according to the patterned photoresist, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil; S3: placing multiple pieces of the patterned graphene-coated copper foil obtained in step S2 into a hot pressing chamber, setting appropriate hot pressing temperature and pressure, and hot pressing the patterned graphene-coated copper foil using a laminated hot pressing method to obtain a highly conductive and thermally conductive graphene-copper composite material.

[0007] The present invention is further configured as follows: the photoresist in step S1 is coated by spin coating, and the thickness of the spin coating is 0.5-5 μm; the photoresist is cured by heating, and the heating temperature is 80-120°C.

[0008] The present invention is further configured as follows: in step S2, acetone or ethanol solution is used to remove the photoresist layer.

[0009] The present invention is further configured as follows: during the photoresist patterning process, the pattern is pre-formed with a mask plate in conjunction with a photolithography machine to obtain a desired graphene pattern.

[0010] The present invention is further configured as follows: in step S1, the thickness of the graphene-coated copper foil is 10-250 μm, and the number of graphene layers on the surface is 1-300 layers.

[0011] The present invention is further configured as follows: in step S3, the patterned graphene-coated copper foil before hot pressing is heated to 600-1100° C. for 20-100 min, then kept at a constant temperature for 20-100 min, and cooled to room temperature after the insulation is completed for 20-100 min.

[0012] The present invention is further configured as follows: the hot pressing pressure in step S3 is 20-120 MPa, the pressing time is 20-100 min, then the constant pressure is maintained for 20-100 min, and after the constant pressure is completed, the pressure is reduced to 0 Pa, and the decompression time is 20-100 min.

[0013] The present invention is further configured as follows: the hot pressing chamber is maintained in vacuum or filled with argon gas for protection.

[0014] The present invention also provides a method for preparing a high-conductivity and thermal-conductivity pattern-replaced graphene copper composite material, which comprises the following steps: S1: placing the graphene-coated copper foil into the electron beam exposure instrument; S2: performing electron beam exposure patterning treatment on the graphene layer on the surface of the graphene-coated copper foil using an electron beam to obtain a patterned graphene-coated copper foil; S3: placing multiple pieces of the patterned graphene-coated copper foil obtained in step S2 into a hot pressing chamber, setting appropriate hot pressing temperature and pressure, and hot pressing the patterned graphene-coated copper foil using a lamination hot pressing method to obtain a highly conductive and thermally conductive graphene-copper composite material.

[0015] The present invention is further configured as follows: the acceleration voltage range of the electron beam exposure in step S2 is 10-200KV, the current range is 5-100nA, and the vacuum chamber pressure is 10 -6 -10 -4 Pa.

[0016] The present invention is further configured as follows: the patterned graphene-coated copper foil obtained in step S2 is taken out and then vacuum-sealed for storage.

[0017] The present invention is further configured as follows: during the electron beam exposure patterning process in step S2, the pattern is preliminarily used for computer programming control of the electron beam exposure equipment to obtain the desired graphene pattern.

[0018] The present invention is further configured as follows: in step S1, the thickness of the graphene-coated copper foil is 10-250 μm, and the number of graphene layers on the surface is 1-300 layers.

[0019] The present invention is further configured as follows: in step S3, the patterned graphene-coated copper foil before hot pressing is heated to 600-1100° C. for 20-100 min, then kept at a constant temperature for 20-100 min, and cooled to room temperature after the insulation is completed for 20-100 min.

[0020] The present invention is further configured as follows: the hot pressing pressure in step S3 is 20-120 MPa, the pressing time is 20-100 min, then the constant pressure is maintained for 20-100 min, and after the constant pressure is completed, the pressure is reduced to 0 Pa, and the decompression time is 20-100 min.

[0021] The present invention is further configured as follows: the hot pressing chamber is maintained in vacuum or filled with argon gas for protection.

[0022] The present invention also provides a high electrical and thermal conductive patterned graphene copper composite material, which is prepared by the preparation method as described above.

[0023] The beneficial effects of the present invention are: 1. Through the steps of photolithography, heat treatment, lamination and hot pressing, a graphene-copper composite material with a customizable graphene-copper interface pattern, good graphene-copper interface bonding, and ultra-high electrical and thermal conductivity can be prepared. The method has good controllability and is easy to mass produce.

[0024] 2. Through electron beam, heat treatment and lamination hot pressing steps, a graphene-copper composite material with a customizable graphene-copper interface pattern, good graphene-copper interface bonding, and ultra-high electrical and thermal conductivity can be prepared. This method has good controllability and is easy to scale up for production. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A flow chart of Embodiment 1 is shown.

[0026] Figure 2 A flow chart of Example 12 is shown. DETAILED DESCRIPTION

[0027] Those skilled in the art can refer to the content of this article and appropriately improve the process parameters. It is particularly important to point out that all similar replacements and modifications are obvious to those skilled in the art, and they are all considered to be included in the present invention. The methods and applications of the present invention have been described through preferred embodiments, and relevant personnel can modify or appropriately change and combine the methods and applications described herein without departing from the content, spirit and scope of the present invention to implement and apply the technology of the present invention.

[0028] Example 1

[0029] The present invention proposes a method for preparing a high-conductivity and thermal-conductivity pattern-converted graphene copper composite material, comprising the following steps:

[0030] S1: coating a photoresist on the graphene layers on both sides of the graphene-coated copper foil and curing the photoresist, and patterning the photoresist after curing.

[0031] S2: placing the graphene-coated copper foil in step S1 into a photolithography machine, etching the graphene layer according to the patterned photoresist, removing the photoresist layer, and obtaining the patterned graphene-coated copper foil.

[0032] S3: placing multiple pieces of the patterned graphene-coated copper foil obtained in step S2 into a hot pressing chamber, setting appropriate hot pressing temperature and pressure, and hot pressing the patterned graphene-coated copper foil using a laminated hot pressing method to obtain a highly conductive and thermally conductive graphene-copper composite material.

[0033] The photoresist in step S1 is coated by spin coating with a thickness of 0.5-5 μm; the photoresist is cured by heating with a heating temperature of 80-120°C.

[0034] In step S2, acetone or ethanol solution is used to remove the photoresist layer.

[0035] During the photoresist patterning process, the pattern is pre-formed using a mask plate in conjunction with a photolithography machine to obtain the desired graphene pattern.

[0036] The thickness of the graphene-coated copper foil in step S1 is 10-250 μm, and the number of graphene layers on the surface is 1-300.

[0037] In step S3, the hot pressing chamber is heated to 600-1100° C. for 20-100 min, then kept at a constant temperature for 20-100 min, and then cooled to room temperature for 20-100 min.

[0038] The hot pressing pressure in step S3 is 20-120 MPa, the pressing time is 20-100 min, and then the constant pressure is maintained for 20-100 min. After the constant pressure is completed, the pressure is reduced to 0 Pa, and the decompression time is 20-100 min.

[0039] The hot pressing chamber is maintained in vacuum or filled with argon gas for protection.

[0040] Example 2

[0041] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0042] S1: Spin-coat the photoresist onto the graphene layers on both sides of the graphene-coated copper foil with a thickness of 50 μm, with a spin-coating thickness of 0.5 μm, heat to 95° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0043] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0044] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 950°C for 40 minutes and kept at a constant temperature for 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0045] During the hot pressing process, the pressing intensity is 50 MPa, the pressing time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0046] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0047] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0048] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 110.2% IACS, and the thermal conductivity was 394.0 W / (m·k).

[0049] Example 3

[0050] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0051] S1: Spin-coat the photoresist onto the graphene layer on both sides of the graphene-coated copper foil with a thickness of 50 μm, with the spin-coating thickness of 5 μm, heat to 100° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0052] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0053] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 950°C for 40 minutes and kept at a constant temperature for 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0054] During the hot pressing process, the pressing intensity is 50 MPa, the pressing time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0055] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0056] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0057] The electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested according to the Van der Pauw method, and the electrical conductivity was 106.8% IACS and the thermal conductivity was 312.4 W / (m·k).

[0058] Example 4

[0059] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0060] S1: Spin-coat the photoresist onto the graphene layers on both sides of the graphene-coated copper foil with a thickness of 50 μm, with a spin-coating thickness of 0.5 μm, heat to 95° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0061] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0062] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 950°C for 40 minutes and kept at a constant temperature for 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0063] During the hot pressing process, the pressing intensity is 50 MPa, the pressing time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0064] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0065] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0066] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 109.6% IACS, and the thermal conductivity was 384.3 W / (m·k).

[0067] Example 5

[0068] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0069] S1: Spin-coat the photoresist onto the graphene layers on both sides of the graphene-coated copper foil with a thickness of 50 μm, with a spin-coating thickness of 1 μm, heat to 95° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0070] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0071] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 850°C for 40 minutes and kept at a constant temperature for 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0072] During the hot pressing process, the pressing intensity is 50 MPa, the pressing time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0073] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0074] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0075] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 109.2% IACS, and the thermal conductivity was 368.4 W / (m·k).

[0076] Example 6

[0077] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0078] S1: Spin-coat the photoresist onto the graphene layers on both sides of the graphene-coated copper foil with a thickness of 50 μm, with a spin-coating thickness of 1 μm, heat to 95° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0079] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0080] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 950°C for 40 minutes and kept at a constant temperature for 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0081] During the hot pressing process, the pressing intensity is 120 MPa, the pressing time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0082] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0083] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0084] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 104.6% IACS, and the thermal conductivity was 345.6 W / (m·k).

[0085] Example 7

[0086] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0087] S1: Spin-coat the photoresist onto the graphene layers on both sides of the graphene-coated copper foil with a thickness of 50 μm, with a spin-coating thickness of 1 μm, heat to 95° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0088] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0089] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 1100°C for 40 minutes and kept at a constant temperature for 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0090] During the hot pressing process, the pressing intensity is 50 MPa, the pressing time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0091] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0092] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0093] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 106.8% IACS, and the thermal conductivity was 281.3 W / (m·k).

[0094] Example 8

[0095] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0096] S1: Spin-coat the photoresist onto the graphene layers on both sides of the graphene-coated copper foil with a thickness of 50 μm, with a spin-coating thickness of 0.5 μm, heat to 95° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0097] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0098] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 950°C for 40 minutes and kept at a constant temperature for 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0099] During the hot pressing process, the pressing intensity is 20 MPa, the pressing time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0100] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0101] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0102] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 103.8% IACS, and the thermal conductivity was 301.5 W / (m·k).

[0103] Example 9

[0104] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0105] S1: Spin-coat the photoresist onto the graphene layers on both sides of the graphene-coated copper foil with a thickness of 50 μm, with a spin-coating thickness of 0.5 μm, heat to 95° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0106] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0107] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 600°C for 40 minutes and kept at a constant temperature for 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0108] During the hot pressing process, the pressing intensity is 50 MPa, the pressing time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0109] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0110] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0111] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 101.2% IACS, and the thermal conductivity was 267.4 W / (m·k).

[0112] Example 10

[0113] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0114] S1: Spin-coat the photoresist onto the graphene layers on both sides of the graphene-coated copper foil with a thickness of 50 μm, with a spin-coating thickness of 0.5 μm, heat to 95° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0115] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0116] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 950°C for 40 minutes and kept at a constant temperature for 20 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0117] During the hot pressing process, the pressing intensity is 50 MPa, the pressing time is 40 minutes, the constant pressure time is 20 minutes, and finally the pressure is reduced for 40 minutes to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0118] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0119] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0120] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 102.3% IACS, and the thermal conductivity was 289.6 W / (m·k).

[0121] Embodiment 11

[0122] This example uses the method described in Example 1 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0123] S1: Spin-coat the photoresist onto the graphene layers on both sides of the graphene-coated copper foil with a thickness of 50 μm, with a spin-coating thickness of 0.5 μm, heat to 95° C. for curing, and complete the patterning of the photoresist after curing and forming.

[0124] S2: placing the graphene-coated copper foil cured in step S1 into a photolithography machine, etching the graphene layer of the graphene-coated copper foil by photolithography technology, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil;

[0125] S3: 16 pieces of patterned graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. Before hot pressing, the patterned graphene-coated copper foils are heated to 950°C for 40 minutes and kept at a constant temperature for 100 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0126] During the hot pressing process, the pressing intensity is 50 MPa, the pressing time is 40 min, the constant pressure time is 100 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material.

[0127] The patterned graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0128] The vacuum degree of the hot pressing chamber in this embodiment is 3.0×10 -3 Pa.

[0129] The electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested according to the Van der Pauw method, and the electrical conductivity was 105.8% IACS and the thermal conductivity was 301.2 W / (m·k).

[0130] The specific parameters of Examples 2-11 are described in Table 1: Table 1. Experimental parameters of the method of Example 1

[0131] Example 12

[0132] The present invention also provides a method for preparing a high-conductivity and thermal-conductivity pattern-replaced graphene copper composite material, which comprises the following steps:

[0133] S1: Place the graphene-coated copper foil into the electron beam lithography instrument.

[0134] S2: performing electron beam exposure patterning treatment on the graphene layer on the surface of the graphene-coated copper foil using an electron beam to obtain a patterned graphene-coated copper foil.

[0135] S3: placing multiple pieces of the patterned graphene-coated copper foil obtained in step S2 into a hot pressing chamber, setting appropriate hot pressing temperature and pressure, and hot pressing the patterned graphene-coated copper foil using a lamination hot pressing method to obtain a highly conductive and thermally conductive graphene-copper composite material.

[0136] The acceleration voltage of the electron beam exposure in step S2 is in the range of 10-200 KV, the current is in the range of 5-100 nA, and the vacuum chamber pressure is 10 -6 -10 -4 Pa.

[0137] The patterned graphene-coated copper foil obtained in step S2 is taken out and then vacuum-sealed for storage.

[0138] During the electron beam exposure patterning process in step S2, the pattern is preliminarily used for computer programming control of the electron beam exposure equipment to obtain the desired graphene pattern.

[0139] The thickness of the graphene-coated copper foil in step S1 is 10-250 μm, and the number of graphene layers on the surface is 1-300.

[0140] In step S3, the patterned graphene-coated copper foil before hot pressing is heated to 600-1100° C. for 20-100 min, then kept at a constant temperature for 20-100 min, and then cooled to room temperature after the insulation, with a cooling time of 20-100 min.

[0141] The hot pressing pressure in step S3 is 20-120 MPa, the pressing time is 20-100 min, and then the constant pressure is maintained for 20-100 min. After the constant pressure is completed, the pressure is reduced to 0 Pa, and the decompression time is 20-100 min.

[0142] The hot pressing chamber is maintained in vacuum or filled with argon gas for protection.

[0143] Embodiment 13

[0144] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0145] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0146] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 20 KV and the current is set to 10 nA to obtain a patterned graphene-coated copper foil.

[0147] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 950°C by hot pressing for 40 minutes and a constant temperature time of 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0148] During the hot pressing process, the pressure intensity is 50 MPa, the heating time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0149] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0150] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductivity graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 112.4% IACS, and the thermal conductivity was 392.4 W / (m·k).

[0151] Embodiment 14

[0152] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0153] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0154] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 10 KV and the current is set to 5 nA to obtain a patterned graphene-coated copper foil.

[0155] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 950°C by hot pressing for 40 minutes and a constant temperature time of 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0156] During the hot pressing process, the pressure intensity is 50 MPa, the heating time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0157] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0158] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductive graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 108.9% IACS, and the thermal conductivity was 377.6 W / (m·k).

[0159] Embodiment 15

[0160] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0161] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0162] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 100 KV and the current is set to 50 nA to obtain a patterned graphene-coated copper foil.

[0163] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 950°C by hot pressing for 40 minutes and a constant temperature time of 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0164] During the hot pressing process, the pressure intensity is 50 MPa, the heating time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0165] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0166] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductive graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 109.2% IACS, and the thermal conductivity was 384.6 W / (m·k).

[0167] Example 16

[0168] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0169] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0170] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 20 KV and the current is set to 10 nA to obtain a patterned graphene-coated copper foil.

[0171] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 950°C by hot pressing for 40 minutes and a constant temperature time of 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0172] During the hot pressing process, the pressure intensity is 20 MPa, the heating time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0173] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0174] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductive graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 104.1% IACS, and the thermal conductivity was 311.2 W / (m·k).

[0175] Embodiment 17

[0176] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0177] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0178] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 20 KV and the current is set to 10 nA to obtain a patterned graphene-coated copper foil.

[0179] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 950°C by hot pressing for 40 minutes and a constant temperature time of 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0180] During the hot pressing process, the pressure intensity is 120 MPa, the heating time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0181] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0182] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductive graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 108.4% IACS, and the thermal conductivity was 380.2 W / (m·k).

[0183] Embodiment 18

[0184] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0185] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0186] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 20 KV and the current is set to 10 nA to obtain a patterned graphene-coated copper foil.

[0187] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 1100° C. for 40 min and kept at a constant temperature for 40 min. During this period, hot pressing is performed. After cooling for 40 min, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0188] During the hot pressing process, the pressure intensity is 50 MPa, the heating time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0189] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0190] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductive graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 108.4% IACS, and the thermal conductivity was 294.2 W / (m·k).

[0191] Embodiment 19

[0192] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0193] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0194] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 30 KV and the current is set to 15 nA to obtain a patterned graphene-coated copper foil.

[0195] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 950°C by hot pressing for 40 minutes and a constant temperature time of 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0196] During the hot pressing process, the pressure intensity is 50 MPa, the heating time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0197] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0198] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductive graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 111.6% IACS, and the thermal conductivity was 401.6 W / (m·k).

[0199] Embodiment 20

[0200] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0201] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0202] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 30 KV and the current is set to 15 nA to obtain a patterned graphene-coated copper foil.

[0203] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 600°C by hot pressing for 40 minutes and a constant temperature time of 40 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0204] During the hot pressing process, the pressure intensity is 50 MPa, the heating time is 40 min, the constant pressure time is 40 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0205] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0206] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductive graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 103.2% IACS, and the thermal conductivity was 287.7 W / (m·k).

[0207] Embodiment 21

[0208] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0209] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0210] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 30 KV and the current is set to 15 nA to obtain a patterned graphene-coated copper foil.

[0211] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 950°C by hot pressing for 40 minutes and a constant temperature time of 20 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0212] During the hot pressing process, the pressure intensity is 50 MPa, the heating time is 40 min, the constant pressure time is 20 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0213] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0214] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductive graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 105.5% IACS, and the thermal conductivity was 308.2 W / (m·k).

[0215] Embodiment 22

[0216] This example uses the method described in Example 12 to prepare a highly conductive and thermally conductive patterned graphene copper composite material, wherein the graphene-coated copper foil is a purchased part. The preparation process is as follows:

[0217] S1: Place a graphene-coated copper foil with a thickness of 50 μm into an electron beam exposure instrument.

[0218] S2: The graphene layer on the surface of the graphene-coated copper foil is subjected to electron beam exposure patterning treatment using an electron beam, and the acceleration voltage range is set to 30 KV and the current is set to 15 nA to obtain a patterned graphene-coated copper foil.

[0219] S3: 16 graphene-coated copper foils prepared in step S2 are placed in a vacuum hot pressing chamber for lamination and hot pressing. The patterned graphene-coated copper foils are heated to 950°C by hot pressing for 40 minutes and a constant temperature time of 100 minutes. During this period, hot pressing is performed. After cooling for 40 minutes, the formed high-conductivity and thermal-conductivity graphene-copper composite material is cooled to room temperature.

[0220] During the hot pressing process, the pressure intensity is 50 MPa, the heating time is 40 min, the constant pressure time is 100 min, and finally the pressure is reduced for 40 min to reduce the pressure to 0 Pa, thereby obtaining a highly conductive and thermally conductive graphene copper composite material, wherein the graphene-coated copper foil selected in this embodiment has a length of 20 mm and a width of 20 mm.

[0221] The vacuum degree in the hot pressing chamber of this embodiment is 5.0×10 -4 Pa.

[0222] According to the Van der Pauw method, the electrical properties of the high electrical and thermal conductive graphene copper composite material prepared in this embodiment were tested, and the electrical conductivity was 106.8% IACS, and the thermal conductivity was 364.3 W / (m·k).

[0223] The specific parameters of Examples 13-22 are described in Table 2: Table 2. Experimental parameters of the method of Example 10

[0224] Embodiment 23

[0225] The present invention also provides a high electrical and thermal conductive patterned graphene copper composite material, which is prepared by the preparation method as described above.

[0226] In summary, the present invention can prepare a graphene copper composite material with a customizable graphene copper interface pattern, good graphene copper interface bonding, and ultra-high electrical and thermal conductivity through the steps of photolithography, heat treatment, and lamination hot pressing, and the method has good controllability and is easy to scale production. Through the steps of electron beam, heat treatment, and lamination hot pressing, a graphene copper composite material with a customizable graphene copper interface pattern, good graphene copper interface bonding, and ultra-high electrical and thermal conductivity can be prepared, and the method has good controllability and is easy to scale production.

[0227] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be within the scope of protection of the present invention.

Claims

1. A method for preparing a highly conductive and thermally conductive patterned graphene copper composite material, characterized in that: The following steps are included: S1: coating a photoresist on the graphene layers on both sides of the graphene-coated copper foil, and curing the photoresist, and patterning the photoresist after curing; S2: placing the graphene-coated copper foil in step S1 into a photolithography machine, etching the graphene layer according to the patterned photoresist, removing the photoresist layer, and obtaining a patterned graphene-coated copper foil; S3: placing multiple pieces of the patterned graphene-coated copper foil obtained in step S2 into a hot pressing chamber, setting appropriate hot pressing temperature and pressure, and hot pressing the patterned graphene-coated copper foil using a lamination hot pressing method to obtain a highly conductive and thermally conductive graphene-copper composite material.

2. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 1, characterized in that: In step S1, the photoresist is coated by spin coating with a thickness of 0.5-5 μm; the photoresist is cured by heating with a heating temperature of 80-120°C.

3. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 1, characterized in that: In step S2, the photoresist layer is removed using acetone or ethanol solution.

4. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 1, characterized in that: During the photoresist patterning process, the pattern is preliminarily formed using a mask plate in conjunction with a photolithography machine to obtain a desired graphene pattern.

5. A method for preparing a highly conductive and thermally conductive patterned graphene copper composite material, characterized in that: The following steps are included: S1: placing the graphene-coated copper foil into the electron beam exposure instrument; S2: performing electron beam exposure patterning treatment on the graphene layer on the surface of the graphene-coated copper foil using an electron beam to obtain a patterned graphene-coated copper foil; S3: placing multiple pieces of the patterned graphene-coated copper foil obtained in step S2 into a hot pressing chamber, setting appropriate hot pressing temperature and pressure, and hot pressing the patterned graphene-coated copper foil using a lamination hot pressing method to obtain a highly conductive and thermally conductive graphene-copper composite material.

6. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 5, characterized in that: The acceleration voltage range of the electron beam exposure in step S2 is 10-200KV, the current range is 5-100nA, and the vacuum chamber pressure is 10 -6 -10 -4 Pa.

7. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 5, characterized in that: The patterned graphene-coated copper foil obtained in step S2 is taken out and then vacuum-sealed for storage.

8. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 5, characterized in that: During the electron beam exposure patterning process in step S2, the pattern is preliminarily used for computer programming control of the electron beam exposure equipment to obtain the desired graphene pattern.

9. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 1 or 5, characterized in that: In step S1, the thickness of the graphene-coated copper foil is 10-250 μm, and the number of graphene layers on the surface is 1-300.

10. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 1 or 5, characterized in that: In step S3, the patterned graphene-coated copper foil before hot pressing is heated to 600-1100° C. for 20-100 min, then kept at a constant temperature for 20-100 min, and then cooled to room temperature after the insulation is completed for 20-100 min.

11. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 1 or 5, characterized in that: The hot pressing pressure in step S3 is 20-120 MPa, the pressing time is 20-100 min, and then the constant pressure is maintained for 20-100 min. After the constant pressure is completed, the pressure is reduced to 0 Pa, and the decompression time is 20-100 min.

12. The method for preparing the highly conductive and thermally conductive patterned graphene copper composite material according to claim 1 or 5, characterized in that: The hot pressing chamber is maintained in vacuum or filled with argon gas for protection.

13. A highly conductive and thermally conductive patterned graphene copper composite material, characterized in that: The method is prepared according to any one of claims 1 to 8.

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