Heat dissipation module and heat dissipation system

Abstract

The invention relates to the technical field of thermal control in a space environment, in particular to a heat dissipation module and a heat dissipation system, the heat dissipation module comprises a body and a flow channel adapter tube, the body comprises a transparent packaging layer and a first reflecting layer, a micro flow channel is formed in the body, the first reflecting layer covers the inner surface of the micro flow channel, and the first reflecting layer covers the inner surface of the micro flow channel. The heat dissipation module is further provided with a contact surface, the contact surface is used for making contact with heat production equipment, the micro-channel is arranged close to the contact surface, and the end of the micro-channel is connected with the channel adapter tube. The invention aims to provide a heat dissipation module and a heat dissipation system for at least one technical problem related in the prior art.

Description

Technical Field

[0001] The present application relates to the field of thermal control technology in a space environment, and more specifically, to a heat dissipation module and a heat dissipation system. Background Art

[0002] Due to the high vacuum environment of outer space, spacecraft can only rely on heat exchange through radiation to dissipate the heat generated inside themselves and the heat absorbed from outside space.

[0003] The amount of radiation heat dissipation of a spacecraft is positively correlated with the effective radiation heat dissipation area, while the amount of radiation heat dissipation per unit area is closely related to the thermal radiation properties of the thermal control coating on the radiation heat dissipation surface.

[0004] Therefore, in order to improve the heat dissipation capacity of spacecraft, on the one hand, it is necessary to increase the effective utilization area of ​​the spacecraft heat dissipation surface by the spacecraft thermal control system, and on the other hand, it is necessary to improve the radiation heat dissipation efficiency of the spacecraft heat dissipation surface. For the first requirement, traditional aerospace thermal control systems usually use methods such as pre-embedded heat pipes or fluid circuits inside the structural plate, installation of heat pipes or fluid circuits on the surface of the structural plate, and additional heat expansion plates on the installation surface of high power density equipment to achieve local heat transmission or diffusion; for the other requirement, traditional aerospace thermal control systems usually use low absorptivity and high emissivity thermal control coatings applied to the heat dissipation surface of the spacecraft to reduce the spacecraft's absorption of space heat flow and increase the radiation dissipation of the body's waste heat. The thermal control system under the above design form can be divided into two independent subsystems in terms of composition. In the design of spacecraft of different types, different functions, different application scenarios, and different space conditions, the heat conduction subsystem that plays a role in heat conduction or heat expansion and the heat radiation subsystem that plays a role in radiation heat dissipation need to be designed separately and achieve heat exchange coupling between the subsystems. This form of thermal control system has low adaptability to universal spacecraft platforms and it is difficult to shorten the development cycle. Summary of the invention

[0005] The purpose of the present application is to provide a heat dissipation module and a heat dissipation system in view of at least one technical problem involved in the background technology.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions: One aspect of the present application provides a heat dissipation module, including a main body and a flow channel adapter, the main body including a transparent packaging layer and a first reflective layer, a microchannel is formed in the main body, the first reflective layer covers the inner surface of the microchannel, the heat dissipation module also has a contact surface, the contact surface is used to contact with a heat generating device, the microchannel is arranged close to the contact surface, and the end of the microchannel is connected to the flow channel adapter.

[0007] Optionally, the body further includes a second reflective layer, the transparent encapsulation layer and the second reflective layer are stacked, and the second reflective layer is attached to a surface of the transparent encapsulation layer, and the contact surface is formed on a side of the second reflective layer away from the transparent encapsulation layer.

[0008] The beneficial effect of this technical solution is that the second reflective layer is a bright metal surface, which has a stronger reflective property for solar radiation, so that the heat dissipation module provided by the present application absorbs less solar radiation.

[0009] Optionally, in a cross section of the microchannel, a portion of the microchannel is formed on the transparent encapsulation layer, and another portion of the microchannel is formed on the second reflective layer.

[0010] The beneficial effect of this technical solution is that it allows the heat to be quickly transferred to the fluid in the microchannel after passing through the second reflective layer without passing through the transparent packaging layer, thereby improving the efficiency of heat transfer and further improving the heat dissipation capacity of the heat dissipation module.

[0011] Optionally, the first reflective layer and the second reflective layer are integrally formed.

[0012] The beneficial effects of this technical solution are: on the one hand, it avoids the possible gap between the first reflective layer and the second reflective layer, so that heat can be quickly transferred in the same uniform material, thereby improving the heat dissipation capacity; on the other hand, it improves the production efficiency of the heat dissipation module provided by the present application, thereby facilitating mass production.

[0013] Optionally, the microchannel and the contact surface are both formed in the transparent encapsulation layer.

[0014] The beneficial effect of this technical solution is that, when the heat dissipation surface of the heat generating device is a bright metal surface, there is no need to provide a second reflective layer, thereby reducing costs.

[0015] Optionally, at least two non-intersecting microchannels are formed in the body.

[0016] The beneficial effect of this technical solution is that the flow directions of the fluid working medium in two different microchannels can be different, which facilitates the formation of a flow channel for the fluid working medium to circulate in the microchannel or even in a heat dissipation system with multiple heat dissipation modules.

[0017] Optionally, the contact surface is a plane, the microchannels are parallel to each other, and the microchannels are parallel to the contact surface.

[0018] The beneficial effect of this technical solution is that the contact surface is a plane, which is suitable for the surfaces of most heat-generating devices, and the microchannels are parallel to each other and to the contact surface, which facilitates standardization, mass production and mass assembly of heat dissipation modules.

[0019] Optionally, the contact surface is used for detachable connection with a heat generating device.

[0020] The beneficial effect of this technical solution is that the heat dissipation module and the heat dissipation system using the heat dissipation module have independent heat dissipation channels and can be decoupled from the heat-generating equipment, thereby reducing the complexity of the heat dissipation system of the heat-generating equipment (especially spacecraft) and improving the reliability and stability of the spacecraft heat dissipation system.

[0021] Another aspect of the present application provides a heat dissipation system, including a micro piezoelectric pump and a heat dissipation module provided in the present application, wherein the micro piezoelectric pump is connected to the heat dissipation module, and the micro piezoelectric pump is used to drive a fluid working medium to flow in the microchannel.

[0022] Optionally, the heat dissipation system provided in the present application includes at least two heat dissipation modules, two non-intersecting microchannels are formed in the body, one of the two microchannels is a first microchannel, the other microchannel is a second microchannel, the channel transfer tube connected to the first microchannel is a first channel transfer tube, and the channel transfer tube connected to the second microchannel is a second channel transfer tube; The first microchannels are connected in sequence through the corresponding first channel transfer tubes so that the fluid can form a circulation between the first microchannels, and the second microchannels are connected in sequence through the corresponding second channel transfer tubes so that the fluid can form a circulation between the second microchannels, and a micro piezoelectric pump is installed on both the first channel transfer tube and the second channel transfer tube; or, The first microchannels are connected in sequence through the corresponding first channel transfer tubes, and the second microchannels are connected in sequence through the corresponding second channel transfer tubes. The first channel transfer tubes and the second channel transfer tubes are connected through a micro piezoelectric pump to form a circulation of the fluid between the first microchannels and the second microchannels.

[0023] The technical solution provided by this application can achieve at least one of the following beneficial effects: The heat dissipation module and heat dissipation system provided by the present application have a transparent packaging layer that is transparent to visible light and has strong absorption of infrared rays, so it has a strong infrared emissivity. The first reflection layer has good reflection characteristics for solar radiation and has a low solar absorption ratio, which makes the heat dissipation module provided by the present application have a strong radiation heat dissipation capability. Flow channel adapters are installed at both ends of the microchannel, so that multiple heat dissipation modules can be connected together through flow channel adapters according to the structural form of the heat generating equipment, thereby realizing the integration of heat conduction and heat radiation subsystems, and forming a corresponding heat dissipation system in a targeted manner, so that the heat dissipation module can be used for heat generating equipment of various structural forms (especially spacecraft structures that need heat dissipation), with high adaptability. Correspondingly, the heat dissipation system is developed for heat generating equipment of different structural forms, and the research and development cycle is relatively shortened. In addition, the heat dissipation module provided by the present application has a simple structure, which is convenient for being used as a standardized design to meet the application needs of mass production.

[0024] The additional technical features and advantages of the present application will be more clearly explained in the following description, or can be understood through the specific practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the specific implementation methods of the present application, the following is a brief introduction to the drawings required for the description of the specific implementation methods. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram of the main structure of an implementation of a standard unit of an integrated module provided in an embodiment of the present application; Figure 2 A left-side structural schematic diagram of an implementation manner of a heat dissipation module provided in an embodiment of the present application; Figure 3 A schematic diagram of the main structure of another implementation of a standard unit of an integrated module provided in an embodiment of the present application; Figure 4 A left-side structural schematic diagram of an implementation manner of a heat dissipation module provided in an embodiment of the present application applied to a heat generating device; FIG5 (a) is a schematic diagram of the reflection characteristics of solar radiation of the heat dissipation module provided in an embodiment of the present application; FIG5( b ) is a schematic diagram of the emission characteristics of infrared radiation of the heat dissipation module provided in an embodiment of the present application; Figure 6 A schematic diagram of the main structure of an implementation method of a heat dissipation system provided in an embodiment of the present application; Figure 7A schematic diagram of the main structure of another implementation of the heat dissipation system provided in an embodiment of the present application; Figure 8 A schematic diagram of a structure of an implementation method of a heat dissipation system provided in an embodiment of the present application applied to a heat generating device; The dotted arrows in Figure 5(a) represent the reflection of solar radiation, and the dotted arrows in Figure 5(b) represent the emission of infrared radiation.

[0027] Reference numerals: 01. Microchannel; 02. Second reflective layer; 03. Flow channel transfer tube; 04. Transparent encapsulation layer; 05. first reflective layer; 06. contact surface; 07. Micro piezoelectric pump; 08. Heat dissipation module; 100. Heat-generating equipment. DETAILED DESCRIPTION

[0028] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0029] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] like Figures 1 to 8As shown, one aspect of the present application provides a heat dissipation module 08, including a main body and a flow channel transfer tube 03, the main body includes a transparent encapsulation layer 04 and a first reflective layer 05, a microchannel 01 is formed in the main body, the first reflective layer 05 covers the inner surface of the microchannel 01, the heat dissipation module 08 also has a contact surface 06, the contact surface 06 is used to contact with the heat generating device 100, the microchannel 01 is arranged close to the contact surface 06, and the end of the microchannel 01 is connected to the flow channel transfer tube 03.

[0032] In the embodiment of the present application, the transparent encapsulation layer 04 is preferably made of transparent materials such as quartz glass or plastic, and the first reflective layer 05 is preferably made of metals with good reflective properties such as aluminum.

[0033] The heat dissipation module 08 provided in the present application, when in use, is in surface contact with the heat generating device 100 (such as a spacecraft structure that requires heat dissipation) through the contact surface 06, and is connected to the adjacent heat dissipation module 08, other heat dissipation devices or devices for driving the flow of fluid working medium through the flow channel transfer tube 03, so that the microchannel 01 can receive the fluid working medium and send the fluid working medium out of the microchannel 01, and the fluid working medium in the microchannel 01 absorbs the heat transferred from the heat generating device 100 and takes the heat away.

[0034] In the heat dissipation module 08 provided in the present application, the transparent encapsulation layer 04 is transparent to visible light and has strong absorption to infrared rays, so it has strong infrared emissivity. The first reflective layer 05 has good reflection characteristics for solar radiation and has a low solar absorption ratio. Flow channel adapter tubes 03 are installed at both ends of the microchannel 01, so that multiple heat dissipation modules 08 can be connected as a whole through the flow channel adapter tubes 03 according to the structural form of the heat generating equipment 100, thereby realizing the integration of heat conduction and heat radiation subsystems, and forming a corresponding heat dissipation system in a targeted manner, so that the heat dissipation module 08 can be used for heat generating equipment 100 of various structural forms (especially spacecraft structures that need heat dissipation), with high adaptability. Correspondingly, the heat dissipation system is developed for heat generating equipment 100 of different structural forms, and the research and development cycle is relatively shortened. In addition, the heat dissipation module 08 provided in the present application has a simple structure, which is convenient for being used as a standardized design to meet the application needs of mass production.

[0035] Optionally, the body further includes a second reflective layer 02, the transparent encapsulation layer 04 is superimposed on the second reflective layer 02, and the second reflective layer 02 is attached to the surface of the transparent encapsulation layer 04, and the contact surface 06 is formed on the side of the second reflective layer 02 away from the transparent encapsulation layer 04. In the embodiment of the present application, the second reflective layer 02 can be made of a metal with good reflective performance such as aluminum, and the material of the second reflective layer 02 is preferably the same as the material of the first reflective layer 05. The second reflective layer 02 is a bright metal surface, and has a strong reflective property for solar radiation, so that the heat dissipation module 08 provided in the present application absorbs less solar radiation. It can be understood that the transparent encapsulation layer 04 is fixedly connected to the second reflective layer 02. In the embodiment of the present application, the surface of the transparent encapsulation layer 04 used to connect to the second reflective layer 02 coincides with the surface of the second reflective layer 02 used to connect to the transparent encapsulation layer 04. Of course, when the thickness of the second reflective layer 02 is large enough, in some specific cases, in addition to the surface of the second reflective layer 02 facing away from the transparent encapsulation layer 04 , the contact surface 06 can also be formed on other side surfaces of the second reflective layer 02 .

[0036] like Figure 2 As shown, optionally, in the cross section of the microchannel 01, a portion of the microchannel 01 is formed on the transparent encapsulation layer 04, and another portion of the microchannel 01 is formed on the second reflective layer 02. This allows the heat to be quickly transferred to the fluid in the microchannel 01 after passing through the second reflective layer 02 without passing through the transparent encapsulation layer 04, thereby improving the efficiency of heat transfer and further improving the heat dissipation capacity of the heat dissipation module 08.

[0037] Optionally, the first reflective layer 05 and the second reflective layer 02 are integrally formed. This avoids a possible gap between the first reflective layer 05 and the second reflective layer 02, allowing heat to be quickly transferred in the same uniform material to improve heat dissipation capacity, and on the other hand improves the production efficiency of the heat dissipation module 08 provided in the present application, facilitating mass production.

[0038] like Figure 3 and Figure 4 As shown, optionally, the microchannel 01 and the contact surface 06 are both formed on the transparent encapsulation layer 04. In this way, when the heat dissipation surface of the heat generating device 100 is a bright metal surface, there is no need to provide the second reflective layer 02, thereby reducing the cost.

[0039] Optionally, at least two non-intersecting microchannels 01 are formed in the body. In the embodiment of the present application, 2 to 4 microchannels 01 may be formed in the body, for example, 2, 3 or 4 microchannels 01. Preferably, two microchannels 01 are formed in the body. In this way, the flow direction of the fluid working medium in two different microchannels 01 may be different (of course, the flow direction may also be the same), which facilitates the formation of a flow channel for the circulation of the fluid working medium in the microchannel 01 or even in a heat dissipation system having multiple heat dissipation modules 08. Of course, in the embodiment of the present application, only one microchannel 01 may be formed in the transparent encapsulation layer 04.

[0040] Optionally, the contact surface 06 is a plane, and each microchannel 01 is parallel to each other, and each microchannel 01 is parallel to the contact surface 06. If the contact surface 06 is a plane, it is suitable for the surface of most heat-generating devices 100. If each microchannel 01 is parallel to each other, and each microchannel 01 is parallel to the contact surface 06, it is convenient for the standardization, mass production and mass assembly of the heat dissipation module 08. Of course, the microchannels 01 may not intersect or be parallel to each other; the microchannel 01 may also pass through the contact surface 06, but the microchannel preferably does not intersect with the contact surface 06; the specific shape of the contact surface 06 can be specifically designed according to the shape of the heat dissipation surface on the heat-generating device 100. For example, if the shape of the heat dissipation surface is a plane, the contact surface 06 can be designed as a plane. If the heat dissipation surface is an arc surface, the contact surface 06 can also be designed as an arc surface that is easy to fit with the heat dissipation surface. If the heat dissipation surface is a wavy surface, the contact surface 06 can also be designed as a wavy surface that is easy to fit with the heat dissipation surface, and so on.

[0041] Optionally, the contact surface 06 is used for detachable connection with the heat generating device 100. The detachable connection is preferably adhesive, for example, but not limited to, using silicone rubber adhesive. In this way, the heat dissipation module 08 and the heat dissipation system using the heat dissipation module 08 have independent heat dissipation channels and can be decoupled from the heat generating device 100, thereby reducing the complexity of the heat dissipation system of the heat generating device 100 (especially the spacecraft structure that needs to dissipate heat) and improving the reliability and stability of the spacecraft heat dissipation system.

[0042] like Figures 6 to 8 As shown, another aspect of the present application provides a heat dissipation system, including a micro piezoelectric pump 07 and a heat dissipation module 08 provided in an embodiment of the present application, the micro piezoelectric pump 07 is connected to the heat dissipation module 08, and the micro piezoelectric pump 07 is used to drive the fluid working medium to flow in the microchannel 01.

[0043] The heat dissipation system provided in the present application adopts the heat dissipation module 08 provided in the present application. The transparent encapsulation layer 04 is transparent to visible light and has strong absorption to infrared rays, so it has strong infrared emissivity. The first reflection layer 05 has good reflection characteristics of solar radiation and has a low solar absorption ratio, which makes the heat dissipation module 08 provided in the present application have strong radiation heat dissipation ability. The flow channel adapter tube 03 is installed at both ends of the microchannel 01, so that multiple heat dissipation modules 08 can be connected as a whole through the flow channel adapter tube 03 according to the structural form of the heat generating equipment 100, thereby realizing the integration of heat conduction and heat radiation subsystems, and forming a corresponding heat dissipation system in a targeted manner, so that the heat dissipation module 08 can be used for heat generating equipment 100 of various structural forms (especially spacecraft structures that need heat dissipation), with high adaptability. Correspondingly, the heat dissipation system is developed for heat generating equipment 100 of different structural forms, and the research and development cycle is relatively shortened; in addition, the heat dissipation module 08 provided in the present application has a simple structure, which is convenient for being used as a standardized design to meet the application needs of mass production.

[0044] Optionally, the heat dissipation system provided in the embodiment of the present application includes at least two heat dissipation modules 08, two non-intersecting microchannels 01 are formed in the body, one of the two microchannels 01 is a first microchannel 01, the other microchannel 01 is a second microchannel 01, the channel transfer tube 03 connected to the first microchannel 01 is a first channel transfer tube 03, and the channel transfer tube 03 connected to the second microchannel 01 is a second channel transfer tube 03; like Figure 6 As shown, in one embodiment of the present application, each of the first microchannels 01 is connected in sequence through each corresponding first channel transfer tube 03 so that the fluid working medium can form a circulation between each of the first microchannels 01, and each of the second microchannels 01 is connected in sequence through each corresponding second channel transfer tube 03 so that the fluid working medium can form a circulation between each of the second microchannels 01, and a micro piezoelectric pump 07 is installed on both the first channel transfer tube 03 and the second channel transfer tube 03. That is to say, in the heat dissipation system provided by the embodiment of the present application, under the action of the micro piezoelectric pump 07 installed on the first channel transfer tube 03, the fluid working medium flows through the first microchannel 01 of each heat dissipation module 08 in sequence to form a closed circulation, and, under the action of the micro piezoelectric pump 07 installed on the second channel transfer tube 03, the fluid working medium flows through the second microchannel 01 of each heat dissipation module 08 in sequence to form a closed circulation.

[0045] Figure 7As shown, in another embodiment of the present application, each of the first microchannels 01 is connected in sequence through each corresponding first channel transfer tube 03, and each of the second microchannels 01 is connected in sequence through each corresponding second channel transfer tube 03, and the first channel transfer tube 03 and the second channel transfer tube 03 are connected by a micro piezoelectric pump 07 to form a circulation of the fluid working medium between each of the first microchannels 01 and each of the second microchannels 01. That is to say, in the heat dissipation system provided in the embodiment of the present application, under the action of the micro piezoelectric pump 07, the fluid working medium flows through each of the first microchannels 01 in sequence and enters and flows through each of the second microchannels 01 in sequence, thereby forming a circulation of the fluid working medium.

[0046] In the heat dissipation system provided in the embodiment of the present application, the number of micro piezoelectric pumps 07 can be specifically selected according to needs, for example, the number of micro piezoelectric pumps 07 can be 1 to 10, specifically, it can be 2, 4, 6 or 8, etc. In the embodiment of the present application, the number of micro piezoelectric pumps 07 is preferably 2 or 8; similarly, in the heat dissipation system provided in the embodiment of the present application, the number of heat dissipation modules 08 can also be specifically selected according to needs, for example, the number of heat dissipation modules 08 can be 2 to 20, specifically, it can be 4, 8, 12 or 16, etc. In the embodiment of the present application, the number of heat dissipation modules 08 is preferably 4 or 16; each heat dissipation module 08 can be arranged according to the specific structure of the heat generating device 100, preferably, each heat dissipation module 08 is arranged in an array; Figure 1 and Figure 3 As shown, it is a standard unit of an integrated module formed by connecting two heat dissipation modules 08; in the embodiment of the present application, the flow channel transfer tube 03 can be designed as an elastic tube, so that the heat dissipation system can change the arrangement according to different heat generating devices 100, and further enhance the applicability. When the heat dissipation pressure of one or more heat dissipation modules 08 in the local area of ​​the array composed of each heat dissipation module 08 is relatively small, the heat can be transferred to the adjacent heat dissipation modules 08 through the heat dissipation module 08 corresponding to the heat source position or through the fluid working medium in the microchannel 01, and the heat can be radiated and dissipated in time; when the heat dissipation pressure of the local area of ​​the array composed of each heat dissipation module 08 is relatively large, the heat can be transferred to the adjacent heat dissipation modules 08 or each heat dissipation module 08 in the entire array through the flow of the fluid working medium in the microchannel 01, and the heat can be dissipated in a parallel manner of heat conduction and heat radiation.

[0047] Of course, in the heat dissipation system provided in the embodiment of the present application, only one heat dissipation module 08 may be provided, the first microchannel 01 of the heat dissipation module 08 is connected with the second microchannel 01 through the channel transfer tube 03, and a micro piezoelectric pump 07 is installed to form a circulation.

[0048] When only one microchannel 01 is provided in the heat dissipation module 08 provided in the embodiment of the present application, if the heat dissipation system includes at least two heat dissipation modules 08, the microchannels 01 are connected through the channel transfer tube 03 and a micro piezoelectric pump 07 is installed to form a circulation; if the heat dissipation system includes only one heat dissipation module 08, the two ends of the microchannel 01 are connected through the channel transfer tube 03, and a micro piezoelectric pump 07 is installed to form a circulation.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation module, characterized in that: It includes a main body and a flow channel adapter, the main body includes a transparent packaging layer and a first reflective layer, a microchannel is formed in the main body, the first reflective layer covers the inner surface of the microchannel, the heat dissipation module also has a contact surface, the contact surface is used to contact with the heat generating device, the microchannel is arranged close to the contact surface, and the end of the microchannel is connected to the flow channel adapter.

2. The heat dissipation module according to claim 1, characterized in that: The body further includes a second reflective layer, the transparent encapsulation layer and the second reflective layer are stacked, and the second reflective layer is attached to the surface of the transparent encapsulation layer, and the contact surface is formed on a side of the second reflective layer away from the transparent encapsulation layer.

3. The heat dissipation module according to claim 2, characterized in that: In a cross section of the microchannel, a portion of the microchannel is formed on the transparent encapsulation layer, and another portion of the microchannel is formed on the second reflective layer.

4. The heat dissipation module according to claim 3, characterized in that: The first reflective layer and the second reflective layer are integrally formed.

5. The heat dissipation module according to claim 1, characterized in that: The microchannel and the contact surface are both formed in the transparent encapsulation layer.

6. The heat dissipation module according to any one of claims 1 to 5, characterized in that: At least two non-intersecting micro-channels are formed in the body.

7. The heat dissipation module according to claim 6, characterized in that: The contact surface is a plane, the microchannels are parallel to each other, and the microchannels are parallel to the contact surface.

8. The heat dissipation module according to any one of claims 1 to 5, characterized in that: The contact surface is used for detachable connection with the heat generating device.

9. A heat dissipation system, characterized in that: It comprises a micro piezoelectric pump and a heat dissipation module as claimed in any one of claims 1 to 8, wherein the micro piezoelectric pump is connected to the heat dissipation module and is used to drive a fluid working medium to flow in the microchannel.

10. The heat dissipation system according to claim 9, characterized in that: The heat dissipation module comprises at least two heat dissipation modules, wherein two non-intersecting micro-channels are formed in the body, one of the two micro-channels is a first micro-channel, the other micro-channel is a second micro-channel, the channel transfer tube connected to the first micro-channel is a first channel transfer tube, and the channel transfer tube connected to the second micro-channel is a second channel transfer tube; The first microchannels are connected in sequence through the corresponding first channel transfer tubes so that the fluid can form a circulation between the first microchannels, and the second microchannels are connected in sequence through the corresponding second channel transfer tubes so that the fluid can form a circulation between the second microchannels, and a micro piezoelectric pump is installed on both the first channel transfer tube and the second channel transfer tube; or, The first microchannels are connected in sequence through the corresponding first channel transfer tubes, and the second microchannels are connected in sequence through the corresponding second channel transfer tubes. The first channel transfer tubes and the second channel transfer tubes are connected through a micro piezoelectric pump to form a circulation of the fluid between the first microchannels and the second microchannels.

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