Lead frame of photoelectric coupler, photoelectric coupler and manufacturing method

Abstract

The invention discloses a lead frame of a photoelectric coupler, the photoelectric coupler and a manufacturing method, the lead frame comprises a first lead bracket and a second lead bracket, and a plurality of first connecting strips and second connecting strips which are arranged in parallel and alternately are arranged between the first lead bracket and the second lead bracket; a plurality of first frame units are arranged on the first connecting strip, and each first frame unit comprises a first frame subunit and a second frame subunit; the first lead support is provided with a plurality of first notches, the second lead support is provided with a plurality of second notches, the upper ends of the first connecting strips are connected with the bottom edges of the first notches, the lower ends of the first connecting strips are connected with the bottom edges of the second notches, and the upper ends and the lower ends of the first connecting strips are provided with first welding pins. And second welding pins are arranged at the bottom end of the first notch and the top end of the second notch. The single-chip lead frame is adopted, the welding pins capable of being welded are arranged, the lead frame is high in unit area utilization rate, high in density and high in strength, the cost is reduced, and meanwhile the reliability of a product is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of photoelectric couplers, and in particular to a lead frame of a photoelectric coupler, a photoelectric coupler and a manufacturing method thereof. Background Art

[0002] As a safety device for electric-optical-electrical conversion isolation, photocouplers have a wide range of market applications and environments. Usually, photocouplers contain a light-emitting chip and a photosensitive chip, which are encapsulated in the same package by packaging glue. When an input current signal is applied to the input end of the photocoupler, the light-emitting chip emits light, and the photosensitive chip generates an induced current after receiving the light, thereby realizing the conversion between photoelectric signals.

[0003] Common packaging structures for optocouplers include contrast type and reflective type. Contrast type optocouplers usually use a double-piece lead frame. After the light-emitting chip and the photosensitive chip are soldered, one of the lead frames is flipped over and overlapped, and then the ribs are cut and formed. This method easily causes the lead frame to shake due to the large amplitude of moving the entire lead frame, which in turn causes the chip soldering to fall off, causing reliability problems. At the same time, the frame unit used in the single-piece lead frame is generally single-row, resulting in low utilization rate per unit area of ​​the lead frame, sparse frame units, insufficient strength, and more material costs when making the same number of products. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides a lead frame of a photoelectric coupler, a photoelectric coupler and a manufacturing method. A single-piece lead frame is used and welding pins are provided for welding. The lead frame has high unit area utilization, high density and high strength, which reduces costs while improving product reliability.

[0005] The present invention provides a lead frame of a photoelectric coupler, the lead frame of the photoelectric coupler comprises a first lead support and a second lead support, a plurality of mutually parallel first connecting bars and second connecting bars are arranged between the first lead support and the second lead support, and the first connecting bars and the second connecting bars are arranged alternately;

[0006] A plurality of first frame units are arranged on the first connecting bar, wherein the first frame unit includes a first frame sub-unit and a second frame sub-unit, wherein the first frame sub-unit is arranged on one side of the first connecting bar, and the second frame sub-unit is arranged on the other side of the first connecting bar;

[0007] The first lead bracket is provided with a plurality of first notches, and the second lead bracket is provided with a plurality of second notches, the number of the first notches and the second notches is the same as the number of the first connecting strip, the upper end of the first connecting strip is connected to the bottom edge of the first notch, and the lower end of the first connecting strip is connected to the bottom edge of the second notch, the upper end and the lower end of the first connecting strip are provided with first welding pins, the bottom end of the first notch and the top end of the second notch are provided with second welding pins, the second welding pin located in the first notch is arranged directly above the first welding pin at the upper end of the first connecting strip, and the second welding pin located in the second notch is arranged directly above the first welding pin at the lower end of the first connecting strip.

[0008] Furthermore, the first connecting bar includes a first connecting rib, a second connecting rib, a third connecting rib, and a fourth connecting rib, and the first connecting rib, the second connecting rib, the third connecting rib, and the fourth connecting rib are parallel to each other.

[0009] Furthermore, the first frame subunit includes a first base island, a second base island, a first pin, and a second pin, the first pin and the second pin are perpendicular to the first connecting strip, the first base island, the second base island, one end of the first pin, and one end of the second pin are connected to the first connecting rib, and the other end of the first pin and the other end of the second pin are connected to the third connecting rib.

[0010] Furthermore, the second frame sub-unit includes a third base island, a fourth base island, a third pin, and a fourth pin, the third pin and the fourth pin are perpendicular to the first connecting strip, the third base island, the fourth base island, one end of the third pin, and one end of the fourth pin are connected to the fourth connecting rib, and the other end of the third pin and the other end of the fourth pin are connected to the second connecting rib.

[0011] Furthermore, the thickness of the first welding pin is half of the thickness of the lead frame of the optocoupler, and the thickness of the second welding pin is half of the thickness of the lead frame of the optocoupler.

[0012] Furthermore, the first welding foot is an upward concave welding foot, and the second welding foot is a downward concave welding foot;

[0013] Or the first welding foot is a downward concave welding foot, and the second welding foot is an upward concave welding foot.

[0014] Furthermore, a plurality of second frame units or a plurality of third frame units are arranged on the second connecting strip, the second frame unit includes a third frame sub-unit and a fourth frame sub-unit, the third frame unit includes a fifth frame sub-unit, the third frame sub-unit is arranged on one side of the second connecting strip, the fourth frame sub-unit is arranged on the other side of the second connecting strip, and the fifth frame sub-unit is arranged on one side of the second connecting strip.

[0015] Further, the third frame unit is arranged on the second connecting bars of the first and last columns between the first lead support and the second lead support, and the second frame unit is arranged on the second connecting bars other than the first and last columns between the first lead support and the second lead support;

[0016] The fifth frame subunit is arranged on a side of the second connecting bar close to the adjacent first connecting bar.

[0017] Furthermore, the second connecting bar includes a fifth connecting rib, a sixth connecting rib, a seventh connecting rib, and an eighth connecting rib, and the fifth connecting rib, the sixth connecting rib, the seventh connecting rib, and the eighth connecting rib are parallel to each other.

[0018] Furthermore, the third frame sub-unit includes a fifth base island, a sixth base island, a fifth pin, and a sixth pin, the fifth pin and the sixth pin are perpendicular to the second connecting strip, the fifth base island, the sixth base island, one end of the fifth pin, and one end of the sixth pin are connected to the fifth connecting rib, and the other end of the fifth pin and the other end of the sixth pin are connected to the seventh connecting rib.

[0019] Furthermore, the fourth frame sub-unit includes a seventh base island, an eighth base island, a seventh pin, and an eighth pin, the seventh pin and the eighth pin are perpendicular to the second connecting strip, the seventh base island, the eighth base island, one end of the seventh pin, and one end of the eighth pin are connected to the eighth connecting rib, and the other end of the seventh pin and the other end of the eighth pin are connected to the sixth connecting rib.

[0020] Further, the fifth frame subunit includes a ninth base island, a tenth base island, a ninth pin, and a tenth pin, the ninth pin and the tenth pin are perpendicular to the second connecting bar, the ninth base island, the tenth base island, one end of the ninth pin, and one end of the tenth pin are connected to the fifth connecting rib, and the other end of the ninth pin and the other end of the tenth pin are connected to the seventh connecting rib;

[0021] Or the ninth base island, the tenth base island, one end of the ninth pin, and one end of the tenth pin are connected to the eighth connecting rib, and the other end of the ninth pin and the other end of the tenth pin are connected to the sixth connecting rib.

[0022] Further, the first frame subunit is a first type of frame subunit, the second frame subunit is a first type of frame subunit, the third frame subunit is a second type of frame subunit, the fourth frame subunit is a second type of frame subunit, and the fifth frame subunit is a second type of frame subunit;

[0023] Or the first frame subunit is a first type of frame subunit, the second frame subunit is a second type of frame subunit, the third frame subunit is a first type of frame subunit, the fourth frame subunit is a second type of frame subunit, and the fifth frame subunit is a first type of frame subunit or a second type of frame subunit;

[0024] Furthermore, the first type of frame subunit is used to place a light-emitting chip, and the second type of frame subunit is used to place a photosensitive chip;

[0025] Or the first type of frame sub-unit is used for placing a photosensitive chip, and the second type of frame sub-unit is used for placing a light-emitting chip.

[0026] Further, a bend is formed at the connection between each frame subunit and the connection strip where the frame subunit is located;

[0027] The bending directions of the first frame subunit and the second frame subunit are opposite.

[0028] Furthermore, each frame subunit includes two base islands and two pins, and the base islands are provided with a chip bonding portion for placing an optocoupler chip and / or a wire bonding portion for wire bonding, and the chip bonding portion is a circular groove, a cross groove, or a rectangular groove.

[0029] Furthermore, a high-reflective metal layer is electroplated on the base island.

[0030] Further, the first connecting bar is provided with two groups of translation positioning holes, one group of which is located at the upper half of the first connecting bar, and the other group of which is located at the lower half of the first connecting bar, each group of translation positioning holes includes more than three translation positioning holes, and the translation positioning holes in the same group are not located in the same straight line;

[0031] Each translation positioning hole is located between the first connecting rib and the second connecting rib, or between the third connecting rib and the fourth connecting rib;

[0032] Each translation positioning hole is not located in the gap between two pins of any frame subunit;

[0033] The diameter of the translation positioning hole is smaller than the gap between the first connecting rib and the second connecting rib, and smaller than the gap between the third connecting rib and the fourth connecting rib.

[0034] The present invention also provides a photoelectric coupler, which includes two relatively arranged frame sub-units, a light-emitting chip, a photosensitive chip, bonding wires, and a packaging body. One of the two frame sub-units is the first frame sub-unit or the second frame sub-unit mentioned above, and the other is the third frame sub-unit or the fourth frame sub-unit or the fifth frame sub-unit mentioned above. The light-emitting chip is arranged on a base island of one of the frame sub-units, and the photosensitive chip is arranged on a base island of the other frame sub-unit. The two base islands with the light-emitting chip and the photosensitive chip are arranged relatively to each other, and the packaging body encapsulates and covers the two frame sub-units, the light-emitting chip, the photosensitive chip, and the bonding wires as a whole.

[0035] The present invention also provides a method for manufacturing a photoelectric coupler, the method being used to manufacture the above-mentioned photoelectric coupler, the method comprising:

[0036] Soldering the light-emitting chip and the photosensitive chip in the frame units of the lead frame of the photocoupler respectively;

[0037] Cutting off the first connecting strip section between the first welding pin at the upper end of the first connecting strip on the lead frame of the photocoupler and the second welding pin at the bottom end of the first notch, and cutting off the first connecting strip section between the first welding pin at the lower end of the first connecting strip on the lead frame of the photocoupler and the second welding pin at the top end of the second notch;

[0038] The first connecting strip is translated upward, so that the first welding foot at the upper end of the first connecting strip coincides with the second welding foot at the bottom end of the first notch, and the first welding foot at the lower end of the first connecting strip coincides with the second welding foot at the top end of the second notch;

[0039] Welding the first welding pin and the second welding pin to fix;

[0040] The ribs are cut, shaped, and packaged to form several optocouplers.

[0041] The present invention provides a lead frame of a photoelectric coupler, a photoelectric coupler and a manufacturing method thereof. A single-piece lead frame is adopted, a first connecting strip and a second connecting strip are alternately arranged, and a double-row frame sub-unit is arranged on the connecting strip, so that the lead frame unit density is effectively improved, the unit area utilization rate is improved, the lead frame strength is improved, and the material cost is reduced; two frame sub-units are arranged to respectively fix a light-emitting chip and a photosensitive chip, and the two ends of the first connecting strip are cut off, and the superposition is achieved by plane unidirectional translation. Compared with a double-piece lead frame that needs to be flipped before superposition, the movement range is small, the process implementation difficulty is small, and the reliability is higher; welding pins are respectively arranged on the first connecting strip and the lead support, and can be welded and fixed after translation superposition, which is more stable and reliable than the clamping superposition of the double-piece lead frame; a translation positioning hole is arranged to improve the efficiency and precision of translation superposition, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 is a schematic diagram of the lead frame structure of the optocoupler in the first embodiment of the present invention;

[0044] Figure 2 is a schematic diagram of the structure of the first frame unit in the first embodiment of the present invention;

[0045] Figure 3 is a schematic diagram of the upper end structure of the first connecting bar in Embodiment 1 of the present invention;

[0046] Figure 4 is a schematic diagram of the structure of the lower end of the first connecting bar in the first embodiment of the present invention;

[0047] Figure 5 is a schematic diagram of the structure of the second frame unit in the first embodiment of the present invention;

[0048] Figure 6 is a schematic diagram of the first structure of the third frame unit in the first embodiment of the present invention;

[0049] Figure 7 is a schematic diagram of the second structure of the third frame unit in the first embodiment of the present invention;

[0050] Figure 8 is a schematic diagram of the structure of the first connecting bar in the first embodiment of the present invention;

[0051] Fig. 9is a schematic diagram of the lead frame structure of the optocoupler in the second embodiment of the present invention;

[0052] Fig.10 is a schematic diagram of the structure of the first frame unit in the second embodiment of the present invention;

[0053] Fig.11 is a schematic diagram of the upper end structure of the first connecting bar in the second embodiment of the present invention;

[0054] Fig.12 is a schematic diagram of the lower end structure of the first connecting bar in the second embodiment of the present invention;

[0055] Fig.13 is a schematic diagram of the structure of the second frame unit in the second embodiment of the present invention;

[0056] Fig.14 is a schematic diagram of the first structure of the third frame unit in the second embodiment of the present invention;

[0057] Fig.15 is a second structural schematic diagram of the third frame unit in the second embodiment of the present invention;

[0058] Fig.16 is a schematic diagram of the structure of the first connecting bar in the second embodiment of the present invention;

[0059] Fig.17 is a schematic diagram of the structure of the photoelectric coupler in the third embodiment of the present invention;

[0060] Fig.18 is a flow chart of a method for manufacturing a photoelectric coupler in a fourth embodiment of the present invention;

[0061] Fig.19 is a schematic structural diagram of a first connecting strip of a lead frame after both ends are cut off in a fourth embodiment of the present invention;

[0062] Fig. 20 It is a schematic diagram of the structure after the first connecting bar of the lead frame in the fourth embodiment of the present invention is translated. DETAILED DESCRIPTION

[0063] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0064] In the present invention, it should be understood that terms such as "include" or "have" are intended to indicate the existence of features, numbers, steps, behaviors, components, parts or a combination thereof disclosed in the specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, behaviors, components, parts or a combination thereof exist or are added.

[0065] It should also be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0066] Embodiment 1

[0067] Embodiment 1 of the present invention provides a lead frame of an optocoupler, wherein the lead frame of the optocoupler comprises a first lead support and a second lead support, wherein a plurality of mutually parallel first connecting bars and second connecting bars are arranged between the first lead support and the second lead support, and the first connecting bars and the second connecting bars are arranged alternately.

[0068] In an optional implementation of this embodiment, Figure 1 As shown, Figure 1 A schematic diagram of the lead frame structure of the optocoupler in Embodiment 1 of the present invention is shown, wherein the lead frame of the optocoupler includes a first lead support 11 and a second lead support 12, wherein a plurality of mutually parallel first connecting bars 2 and second connecting bars 3 are arranged between the first lead support 11 and the second lead support 12, and the first connecting bars 2 and the second connecting bars 3 are arranged alternately.

[0069] Specifically, the first connecting bars 2 and the second connecting bars 3 are arranged alternately, and the connecting bars located on the leftmost side and the rightmost side are both the second connecting bars 3 .

[0070] In an optional implementation of this embodiment, a plurality of first frame units are arranged on the first connecting strip, and the first frame unit includes a first frame sub-unit and a second frame sub-unit, the first frame sub-unit is arranged on one side of the first connecting strip, and the second frame sub-unit is arranged on the other side of the first connecting strip.

[0071] Specifically, Figure 1 As shown, a plurality of first frame units 4 are disposed on the first connecting bar 2 , and the first frame units 4 are arranged along the first connecting bar 2 .

[0072] In an optional implementation of this embodiment, Figure 2 As shown, Figure 2 FIG. 1 shows a schematic diagram of the structure of the first frame unit in the first embodiment of the present invention. Figure 2 for Figure 1In the enlarged schematic diagram at a, the first frame unit 4 includes a first frame sub-unit 41 and a second frame sub-unit 42, wherein the first frame sub-unit 41 is arranged on the left side of the first connecting bar 2, and the second frame sub-unit 42 is arranged on the right side of the first connecting bar 2.

[0073] In an optional implementation of this embodiment, the first connecting strip includes a first connecting rib, a second connecting rib, a third connecting rib, and a fourth connecting rib, and the first connecting rib, the second connecting rib, the third connecting rib, and the fourth connecting rib are parallel to each other.

[0074] Specifically, Figure 2 As shown, the first connecting strip 2 includes a first connecting rib 21, a second connecting rib 22, a third connecting rib 23, and a fourth connecting rib 24. The first connecting rib 1, the second connecting rib 22, the third connecting rib 23, and the fourth connecting rib 24 are parallel to each other, and the intervals between adjacent connecting ribs are equal.

[0075] In an optional implementation of this embodiment, each frame sub-unit includes two base islands and two pins.

[0076] In an optional implementation of this embodiment, Figure 2 As shown, the first frame subunit 41 includes a first base island 411, a second base island 412, a first pin 413, and a second pin 414. The first pin 413 and the second pin 414 are perpendicular to the first connecting strip 2. The first base island 411, the second base island 412, one end of the first pin 413, and one end of the second pin 414 are connected to the first connecting rib 21, and the other end of the first pin 413 and the other end of the second pin 414 are connected to the third connecting rib 23.

[0077] Specifically, the first base island 411 and the second base island 412 are vertically symmetrically arranged.

[0078] In an optional implementation of this embodiment, Figure 2 As shown, the second frame subunit 42 includes a third base island 421, a fourth base island 422, a third pin 423, and a fourth pin 424, and the third pin 423 and the fourth pin 424 are perpendicular to the first connecting strip 2, and the third base island 421, the fourth base island 422, one end of the third pin 423, and one end of the fourth pin 424 are connected to the fourth connecting rib 24, and the other end of the third pin 423 and the other end of the fourth pin 424 are connected to the second connecting rib 22.

[0079] Specifically, the third base island 421 and the fourth base island 422 are vertically symmetrically arranged.

[0080] In an optional implementation of this embodiment, a chip bonding portion for placing an optocoupler chip and / or a wire bonding portion for wire bonding is provided on the base island, and the chip bonding portion is a circular groove, a cross-shaped groove, or a rectangular groove.

[0081] Specifically, the first base island 411 is provided with a chip bonding portion with a rectangular groove and a wire bonding portion, the second base island 412 is provided with a chip bonding portion with a rectangular groove and a wire bonding portion, the third base island 421 is provided with a chip bonding portion with a rectangular groove and a wire bonding portion, and the fourth base island 422 is provided with a chip bonding portion with a rectangular groove and a wire bonding portion.

[0082] In an optional implementation of the present embodiment, a plurality of first notches are provided on the first lead bracket, and a plurality of second notches are provided on the second lead bracket, the number of the first notches and the second notches is the same as the number of the first connecting strip, the upper end of the first connecting strip is connected to the bottom edge of the first notch, and the lower end of the first connecting strip is connected to the bottom edge of the second notch, a first welding foot is provided at the upper and lower ends of the first connecting strip, a second welding foot is provided at the bottom end of the first notch and the top end of the second notch, the second welding foot located in the first notch is provided directly above the first welding foot at the upper end of the first connecting strip, and the second welding foot located in the second notch is provided directly above the first welding foot at the lower end of the first connecting strip.

[0083] In an optional implementation of this embodiment, Figure 1 As shown, the first lead bracket 11 is provided with a plurality of first notches 13, and the second lead bracket 12 is provided with a plurality of second notches 14. The number of the first notches 13 and the second notches 14 is the same as the number of the first connecting strip 2. The upper end of the first connecting strip 2 is connected to the bottom edge of the first notch 13, and the lower end of the first connecting strip 2 is connected to the bottom edge of the second notch 14.

[0084] In an optional implementation of this embodiment, Figure 3 and Figure 4 As shown, Figure 3 FIG. 1 shows a schematic diagram of the upper end structure of the first connecting bar in Embodiment 1 of the present invention. Figure 4 FIG. 1 shows a schematic diagram of the lower end structure of the first connecting bar in Embodiment 1 of the present invention. Figure 3 for Figure 1 The enlarged schematic diagram of point e in the middle, Figure 4 for Figure 1In the enlarged schematic diagram at point f, the first connecting strip 2 is provided with a first welding foot 15 at the upper and lower ends, the second welding foot 16 is provided at the bottom end of the first recess 13 and the top end of the second recess 14, the second welding foot 16 located in the first recess 13 is arranged directly above the first welding foot 15 at the upper end of the first connecting strip 2, and the second welding foot 16 located in the second recess 14 is arranged directly above the first welding foot 15 at the lower end of the first connecting strip 2.

[0085] Specifically, Figure 3 As shown, the number of first welding feet 15 set at the upper end of a single first connecting strip 2 is two, which are respectively set at the upper ends of the first connecting rib 21 and the fourth connecting rib 24 of the first connecting strip 2, the second connecting rib 22 and the third connecting rib 23 of the first connecting strip 2 are connected to the bottom edge of the first recess 13, and the number of second welding feet 16 set at the bottom end of the first recess 13 is also two, which are respectively set at the left and right ends of the bottom edge of the first recess 13, and are respectively located directly above the first welding feet 15 at the upper ends of the first connecting rib 21 and the fourth connecting rib 24 of the first connecting strip 2.

[0086] More, such as Figure 4 As shown, the number of first welding feet 15 set at the lower end of a single first connecting strip 2 is two, which are respectively set at the top of the extended section of the upper end of the second connecting rib 22 and the third connecting rib 23 of the first connecting strip 2, the second connecting rib 22 and the third connecting rib 23 of the first connecting strip 2 are connected to the bottom edge of the second recess 14, and the number of second welding feet 16 set at the top of the second recess 14 is also two, which are respectively set at the left and right ends of the top edge of the second recess 14, and are respectively located directly above the first welding feet 15 of the extended section of the upper end of the second connecting rib 22 and the third connecting rib 23 of the first connecting strip 2.

[0087] In an optional implementation of this embodiment, the thickness of the first soldering pin is half the thickness of the lead frame of the optocoupler, and the thickness of the second soldering pin is half the thickness of the lead frame of the optocoupler.

[0088] In an optional implementation of this embodiment, the first welding foot is an upward concave welding foot, and the second welding foot is a downward concave welding foot; or the first welding foot is a downward concave welding foot, and the second welding foot is an upward concave welding foot.

[0089] The first welding foot and the second welding foot are respectively an upper concave welding foot and a lower concave welding foot. After the first connecting strip is translated upward, the first welding foot and the second welding foot can be welded and fixed, and the thickness after welding is consistent with the lead frame. Compared with the positioning and overlapping of the double-piece lead frame, it has higher stability and reliability.

[0090] In an optional implementation of the present embodiment, a plurality of second frame units or a plurality of third frame units are arranged on the second connecting strip, the second frame unit includes a third frame sub-unit and a fourth frame sub-unit, the third frame unit includes a fifth frame sub-unit, the third frame sub-unit is arranged on one side of the second connecting strip, the fourth frame sub-unit is arranged on the other side of the second connecting strip, and the fifth frame sub-unit is arranged on one side of the second connecting strip.

[0091] It should be noted that the third frame unit is arranged on the second connecting bars of the first and last columns between the first lead support and the second lead support, and the second frame unit is arranged on the second connecting bars other than the first and last columns between the first lead support and the second lead support.

[0092] Specifically, Figure 1 As shown, the frame unit arranged on the first column, i.e., the leftmost column, and the frame unit arranged on the second connecting strip 2, i.e., the rightmost column, is a third frame unit 6, and the frame unit arranged on the second connecting strip 2 other than the leftmost and rightmost columns is a second frame unit 5, wherein the third frame unit 6 includes only one frame sub-unit.

[0093] In an optional implementation of this embodiment, Figure 5 As shown, Figure 5 FIG. 2 shows a schematic diagram of the structure of the second frame unit in the first embodiment of the present invention. Figure 5 for Figure 1 In the enlarged schematic diagram at point b, the second frame unit 5 includes a third frame sub-unit 51 and a fourth frame sub-unit 52, wherein the third frame sub-unit 51 is arranged on the left side of the second connecting bar 2, and the fourth frame sub-unit 52 is arranged on the right side of the second connecting bar 2.

[0094] In an optional implementation of this embodiment, the second connecting strip includes a fifth connecting rib, a sixth connecting rib, a seventh connecting rib, and an eighth connecting rib, and the fifth connecting rib, the sixth connecting rib, the seventh connecting rib, and the eighth connecting rib are parallel to each other.

[0095] Specifically, Figure 3As shown, the second connecting strip 3 includes a fifth connecting rib 31, a sixth connecting rib 32, a seventh connecting rib 33, and an eighth connecting rib 34. The fifth connecting rib 31, the sixth connecting rib 32, the seventh connecting rib 33, and the eighth connecting rib 34 are parallel to each other, and adjacent connecting ribs are equidistant.

[0096] In an optional implementation of this embodiment, Figure 5 As shown, the third frame subunit 51 includes a fifth base island 511, a sixth base island 512, a fifth pin 513, and a sixth pin 514, and the fifth pin 513 and the sixth pin 514 are perpendicular to the second connecting strip 3, and the fifth base island 511, the sixth base island 512, one end of the fifth pin 513, and one end of the sixth pin 514 are connected to the fifth connecting rib 31, and the other end of the fifth pin 513 and the other end of the sixth pin 514 are connected to the seventh connecting rib 33.

[0097] In an optional implementation of this embodiment, Figure 5 As shown, the fourth frame subunit 52 includes a seventh base island 521, an eighth base island 522, a seventh pin 523, and an eighth pin 524, and the seventh pin 523 and the eighth pin 524 are perpendicular to the second connecting strip 3, and the seventh base island 521, the eighth base island 522, one end of the seventh pin 523, and one end of the eighth pin 524 are connected to the eighth connecting rib 34, and the other end of the seventh pin 523 and the other end of the eighth pin 524 are connected to the sixth connecting rib 32.

[0098] In an optional implementation of the present embodiment, a chip bonding portion with a cross-shaped groove is provided on the fifth base island 511, a wire bonding portion is provided on the sixth base island 512, a chip bonding portion with a cross-shaped groove is provided on the seventh base island 521, and a wire bonding portion is provided on the eighth base island 522.

[0099] In an optional implementation of this embodiment, the fifth frame subunit is arranged on a side of the second connecting bar close to the adjacent first connecting bar.

[0100] Specifically, the fifth frame subunit located on the leftmost second connecting bar is located on the right side of the second connecting bar, and the fifth frame subunit located on the rightmost second connecting bar is located on the left side of the second connecting bar.

[0101] In an optional implementation of this embodiment, Figure 6 As shown, Figure 6 shows a first structural diagram of the third frame unit in the first embodiment of the present invention, Figure 6 for Figure 1 The enlarged schematic diagram of point c in the middle, Figure 6The schematic structural diagram of the third frame unit located on the leftmost second connecting bar is shown. The third frame unit 6 includes a fifth frame sub-unit 61 . The fifth frame sub-unit 61 is arranged on the right side of the second connecting bar 3 .

[0102] In an optional implementation of this embodiment, Figure 7 As shown, Figure 7 shows a second structural diagram of the third frame unit in the first embodiment of the present invention, Figure 7 for Figure 1 The enlarged schematic diagram at point d in the middle, Figure 7 The schematic structural diagram of the third frame unit located on the rightmost second connecting bar is shown. The third frame unit 6 includes a fifth frame sub-unit 61 . The fifth frame sub-unit 61 is arranged on the left side of the second connecting bar 3 .

[0103] In an optional implementation of this embodiment, Figure 6 As shown, the fifth frame subunit 61 includes a ninth base island 611, a tenth base island 612, a ninth pin 613, and a tenth pin 614, and the ninth pin 611 and the tenth pin 612 are perpendicular to the second connecting strip 3, and the ninth base island 611, the tenth base island 612, one end of the ninth pin 613, and one end of the tenth pin 614 are connected to the fifth connecting rib 31, and the other end of the ninth pin 613 and the other end of the tenth pin 614 are connected to the seventh connecting rib 33.

[0104] In an optional implementation of this embodiment, Figure 7 As shown, the fifth frame subunit 61 includes a ninth base island 611, a tenth base island 612, a ninth pin 613, and a tenth pin 614, and the ninth pin 611 and the tenth pin 612 are perpendicular to the second connecting strip 3, and the ninth base island 611, the tenth base island 612, one end of the ninth pin 613, and one end of the tenth pin 614 are connected to the eighth connecting rib 34, and the other end of the ninth pin 613 and the other end of the tenth pin 614 are connected to the sixth connecting rib 32.

[0105] It should be noted that in Figure 6 The second connecting strip 3 is only provided with the fifth connecting rib 31, the sixth connecting rib 32, and the seventh connecting rib 33. Figure 7 The second connecting strip 3 is only provided with the sixth connecting rib 32 , the seventh connecting rib 33 and the eighth connecting rib 34 .

[0106] In an optional implementation of this embodiment, a chip bonding portion with a cross-shaped groove is provided on the ninth base island 611 , and a wire bonding portion is provided on the tenth base island 612 .

[0107] In an optional implementation of the present embodiment, the first frame subunit is a first type of frame subunit, the second frame subunit is a first type of frame subunit, the third frame subunit is a second type of frame subunit, the fourth frame subunit is a second type of frame subunit, and the fifth frame subunit is a second type of frame subunit, or the first frame subunit is a first type of frame subunit, the second frame subunit is a second type of frame subunit, the third frame subunit is a first type of frame subunit, the fourth frame subunit is a second type of frame subunit, and the fifth frame subunit is either the first type of frame subunit or the second type of frame subunit.

[0108] Specifically, when the first frame subunit is the first type of frame subunit, the fifth frame subunit located on the leftmost second connecting strip is the second type of frame subunit; when the first frame subunit is the second type of frame subunit, the fifth frame subunit located on the leftmost second connecting strip is the first type of frame subunit.

[0109] Furthermore, when the second frame subunit is the first frame subunit, the fifth frame subunit located on the rightmost second connecting strip is the second frame subunit; when the second frame subunit is the second frame subunit, the fifth frame subunit located on the rightmost second connecting strip is the first frame subunit.

[0110] In this embodiment, the first frame subunit 41 is a first type of frame subunit, the second frame subunit 42 is a first type of frame subunit, the third frame subunit 51 is a second type of frame subunit, the fourth frame subunit 52 is a second type of frame subunit, and the fifth frame subunit 61 is a second type of frame subunit.

[0111] It should be noted that the first type of frame sub-unit is used to place the light-emitting chip, and the second type of frame sub-unit is used to place the photosensitive chip; or the first type of frame sub-unit is used to place the photosensitive chip, and the second type of frame sub-unit is used to place the light-emitting chip; in this embodiment, the first type of frame sub-unit is used to place the light-emitting chip, and the second type of frame sub-unit is used to place the photosensitive chip.

[0112] In an optional implementation of the present embodiment, two groups of translation positioning holes are provided on the first connecting strip, one group is located in the upper half of the first connecting strip, and the other group is located in the lower half of the first connecting strip, each group of translation positioning holes includes more than three translation positioning holes, and the translation positioning holes in the same group are not in the same straight line.

[0113] Specifically, Figure 8 As shown, Figure 8A schematic diagram of the first connecting strip structure in Embodiment 1 of the present invention is shown, wherein two groups of translation positioning holes 25 are provided on the first connecting strip 2, one group of which is located in the upper half of the first connecting strip 2, and the other group of which is located in the lower half of the first connecting strip 2, each group of translation positioning holes 25 includes three translation positioning holes 25, and the three translation positioning holes 25 in the same group are not in the same straight line.

[0114] In an optional implementation of the present embodiment, each translation positioning hole is located between the first connecting rib and the second connecting rib, or between the third connecting rib and the fourth connecting rib; and each translation positioning hole is not located in the gap between two pins of any frame sub-unit, and the diameter of the translation positioning hole is smaller than the gap between the first connecting rib and the second connecting rib, and smaller than the gap between the third connecting rib and the fourth connecting rib.

[0115] Specifically, each translation positioning hole 25 is located between the first connecting rib 21 and the second connecting rib 22, or between the third connecting rib 23 and the fourth connecting rib 24, and each translation positioning hole 25 is not located in the gap between the first pin 413 and the second pin 414 of the first frame sub-unit 41 arranged on the first connecting strip 2, and is not located in the gap between the third pin 423 and the fourth pin 424 of the second frame sub-unit 42 arranged on the first connecting strip 2.

[0116] A translation positioning hole is set here to provide a reference for the first connecting strip to translate upward. At the same time, the translation positioning hole is set in the gap between two pins that are not located in any frame sub-unit. There is no need to remove the connecting rib position where the translation positioning hole is located, which simplifies the production process and improves production efficiency.

[0117] In an optional implementation of this embodiment, a high-reflective metal layer is electroplated on the base island.

[0118] Specifically, the first base island 411, the second base island 412, the third base island 421, the fourth base island 422, the fifth base island 511, the sixth base island 512, the seventh base island 521, the eighth base island 522, the ninth base island 611, and the tenth base island 612 are all electroplated with a high-reflective metal layer.

[0119] Furthermore, the highly reflective metal layer may be a gold-plated layer or a silver-plated layer.

[0120] Here, a high-reflective metal layer is electroplated on the surface of the base island. After the photoelectric coupler is made, the reflectivity of the light emitted by the light-emitting chip is improved, and the efficiency of photoelectric conversion of the photoelectric coupler device is improved.

[0121] In an optional implementation of this embodiment, a bend is formed at a connection between each frame subunit and the connecting strip where the frame subunit is located; and the bending directions of the first type of frame subunit and the second type of frame subunit are opposite.

[0122] Specifically, the first frame sub-unit 41, the second frame sub-unit 42 and the first connecting strip 2 form a bend, the third frame sub-unit 51, the fourth frame sub-unit 52, and the fifth frame sub-unit 61 and the second connecting strip 3 form a bend, and the bending direction of the first frame sub-unit 41, the second frame sub-unit 42 and the first connecting strip 2 is opposite to the bending direction of the third frame sub-unit 51, the fourth frame sub-unit 52, the fifth frame sub-unit 61 and the second connecting strip 3.

[0123] In summary, embodiment 1 of the present invention provides a lead frame for an optocoupler, which adopts a single-piece lead frame, alternately arranges a first connecting strip and a second connecting strip, and arranges a double-row frame sub-unit on the connecting strip, which effectively improves the lead frame unit density, improves the unit area utilization rate, improves the lead frame strength, and reduces the material cost; two types of frame sub-units are arranged to respectively fix the light-emitting chip and the photosensitive chip, and the two ends of the first connecting strip are cut off, and the plane is translated in one direction to achieve superposition. Compared with the double-piece lead frame that needs to be flipped before superposition, the movement range is small, the process is less difficult to implement, and the reliability is higher; welding pins are respectively arranged on the first connecting strip and the lead bracket, which can be welded and fixed after translational superposition. Compared with the clamping superposition of the double-piece lead frame, the stability is higher and the reliability is higher; the translation positioning hole is arranged to improve the efficiency and accuracy during translational superposition, thereby improving production efficiency.

[0124] Embodiment 2

[0125] Embodiment 2 of the present invention provides a lead frame of an optocoupler, wherein the lead frame of the optocoupler comprises a first lead support and a second lead support, wherein a plurality of mutually parallel first connecting bars and second connecting bars are arranged between the first lead support and the second lead support, and the first connecting bars and the second connecting bars are arranged alternately.

[0126] In an optional implementation of this embodiment, Fig. 9 As shown, Fig. 9 A schematic diagram of the lead frame structure of the optocoupler in the second embodiment of the present invention is shown, wherein the lead frame of the optocoupler includes a first lead bracket 11 and a second lead bracket 12, wherein a plurality of mutually parallel first connecting bars 2 and second connecting bars 3 are arranged between the first lead bracket 11 and the second lead bracket 12, and the first connecting bars 2 and the second connecting bars 3 are arranged alternately.

[0127] Specifically, the first connecting bars 2 and the second connecting bars 3 are arranged alternately, and the connecting bars located on the leftmost side and the rightmost side are both the second connecting bars 3 .

[0128] In an optional implementation of this embodiment, a plurality of first frame units are arranged on the first connecting strip, and the first frame unit includes a first frame sub-unit and a second frame sub-unit, the first frame sub-unit is arranged on one side of the first connecting strip, and the second frame sub-unit is arranged on the other side of the first connecting strip.

[0129] Specifically, Fig. 9 As shown, a plurality of first frame units 4 are disposed on the first connecting bar 2 , and the first frame units 4 are arranged along the first connecting bar 2 .

[0130] In an optional implementation of this embodiment, Fig.10 As shown, Fig.10 It shows a schematic diagram of the structure of the first frame unit in the second embodiment of the present invention, Fig.10 for Figure 2 In the enlarged schematic diagram at a, the first frame unit 4 includes a first frame sub-unit 41 and a second frame sub-unit 42, wherein the first frame sub-unit 41 is arranged on the left side of the first connecting bar 2, and the second frame sub-unit 42 is arranged on the right side of the first connecting bar 2.

[0131] In an optional implementation of this embodiment, the first connecting strip includes a first connecting rib, a second connecting rib, a third connecting rib, and a fourth connecting rib, and the first connecting rib, the second connecting rib, the third connecting rib, and the fourth connecting rib are parallel to each other.

[0132] Specifically, Fig.10 As shown, the first connecting strip 2 includes a first connecting rib 21, a second connecting rib 22, a third connecting rib 23, and a fourth connecting rib 24. The first connecting rib 1, the second connecting rib 22, the third connecting rib 23, and the fourth connecting rib 24 are parallel to each other, and the intervals between adjacent connecting ribs are equal.

[0133] In an optional implementation of this embodiment, each frame sub-unit includes two base islands and two pins.

[0134] In an optional implementation of this embodiment, Fig.10As shown, the first frame subunit 41 includes a first base island 411, a second base island 412, a first pin 413, and a second pin 414. The first pin 413 and the second pin 414 are perpendicular to the first connecting strip 2. The first base island 411, the second base island 412, one end of the first pin 413, and one end of the second pin 414 are connected to the first connecting rib 21, and the other end of the first pin 413 and the other end of the second pin 414 are connected to the third connecting rib 23.

[0135] Specifically, the first base island 411 and the second base island 412 are vertically symmetrically arranged.

[0136] In an optional implementation of this embodiment, Fig.10 As shown, the second frame subunit 42 includes a third base island 421, a fourth base island 422, a third pin 423, and a fourth pin 424, and the third pin 423 and the fourth pin 424 are perpendicular to the first connecting strip 2, and the third base island 421, the fourth base island 422, one end of the third pin 423, and one end of the fourth pin 424 are connected to the fourth connecting rib 24, and the other end of the third pin 423 and the other end of the fourth pin 424 are connected to the second connecting rib 22.

[0137] In an optional implementation of this embodiment, a chip bonding portion for placing an optocoupler chip and / or a wire bonding portion for wire bonding is provided on the base island, and the chip bonding portion is a circular groove, a cross-shaped groove, or a rectangular groove.

[0138] Specifically, the first base island 411 is provided with a chip bonding portion with a rectangular groove and a welding wire portion, the second base island 412 is provided with a chip bonding portion with a rectangular groove and a welding wire portion, the third base island 421 is provided with a chip bonding portion with a cross-shaped groove, and the fourth base island 422 is provided with a welding wire portion.

[0139] In an optional implementation of the present embodiment, a plurality of first notches are provided on the first lead bracket, and a plurality of second notches are provided on the second lead bracket, the number of the first notches and the second notches is the same as the number of the first connecting strip, the upper end of the first connecting strip is connected to the bottom edge of the first notch, and the lower end of the first connecting strip is connected to the bottom edge of the second notch, a first welding foot is provided at the upper and lower ends of the first connecting strip, a second welding foot is provided at the bottom end of the first notch and the top end of the second notch, the second welding foot located in the first notch is provided directly above the first welding foot at the upper end of the first connecting strip, and the second welding foot located in the second notch is provided directly above the first welding foot at the lower end of the first connecting strip.

[0140] In an optional implementation of this embodiment, Fig. 9 As shown, the first lead bracket 11 is provided with a plurality of first notches 13, and the second lead bracket 12 is provided with a plurality of second notches 14. The number of the first notches 13 and the second notches 14 is the same as the number of the first connecting strip 2. The upper end of the first connecting strip 2 is connected to the bottom edge of the first notch 13, and the lower end of the first connecting strip 2 is connected to the bottom edge of the second notch 14.

[0141] In an optional implementation of this embodiment, Fig.11 and Fig.12 As shown, Fig.11 FIG. 2 shows a schematic diagram of the upper end structure of the first connecting bar in the second embodiment of the present invention. Fig.12 FIG. 2 shows a schematic diagram of the lower end structure of the first connecting bar in the second embodiment of the present invention. Fig.11 for Fig. 9 The enlarged schematic diagram of point e in the middle, Fig.12 for Fig. 9 In the enlarged schematic diagram at point f, the first connecting strip 2 is provided with a first welding foot 15 at the upper and lower ends, the second welding foot 16 is provided at the bottom end of the first recess 13 and the top end of the second recess 14, the second welding foot 16 located in the first recess 13 is arranged directly above the first welding foot 15 at the upper end of the first connecting strip 2, and the second welding foot 16 located in the second recess 14 is arranged directly above the first welding foot 15 at the lower end of the first connecting strip 2.

[0142] Specifically, Fig.11 As shown, the number of first welding feet 15 set at the upper end of a single first connecting strip 2 is two, which are respectively set at the upper ends of the first connecting rib 21 and the fourth connecting rib 24 of the first connecting strip 2, the second connecting rib 22 and the third connecting rib 23 of the first connecting strip 2 are connected to the bottom edge of the first recess 13, and the number of second welding feet 16 set at the bottom end of the first recess 13 is also two, which are respectively set at the left and right ends of the bottom edge of the first recess 13, and are respectively located directly above the first welding feet 15 at the upper ends of the first connecting rib 21 and the fourth connecting rib 24 of the first connecting strip 2.

[0143] More, such as Fig.12As shown, the number of first welding feet 15 set at the lower end of a single first connecting strip 2 is two, which are respectively set at the top of the extended section of the upper end of the second connecting rib 22 and the third connecting rib 23 of the first connecting strip 2, the second connecting rib 22 and the third connecting rib 23 of the first connecting strip 2 are connected to the bottom edge of the second recess 14, and the number of second welding feet 16 set at the top of the second recess 14 is also two, which are respectively set at the left and right ends of the top edge of the second recess 14, and are respectively located directly above the first welding feet 15 of the extended section of the upper end of the second connecting rib 22 and the third connecting rib 23 of the first connecting strip 2.

[0144] In an optional implementation of this embodiment, the thickness of the first soldering pin is half the thickness of the lead frame of the optocoupler, and the thickness of the second soldering pin is half the thickness of the lead frame of the optocoupler.

[0145] In an optional implementation of this embodiment, the first welding foot is an upward concave welding foot, and the second welding foot is a downward concave welding foot; or the first welding foot is a downward concave welding foot, and the second welding foot is an upward concave welding foot.

[0146] The first welding foot and the second welding foot are respectively an upper concave welding foot and a lower concave welding foot. After the first connecting strip is translated upward, the first welding foot and the second welding foot can be welded and fixed, and the thickness after welding is consistent with the lead frame. Compared with the positioning and overlapping of the double-piece lead frame, it has higher stability and reliability.

[0147] In an optional implementation of the present embodiment, a plurality of second frame units or a plurality of third frame units are arranged on the second connecting strip, the second frame unit includes a third frame sub-unit and a fourth frame sub-unit, the third frame unit includes a fifth frame sub-unit, the third frame sub-unit is arranged on one side of the second connecting strip, the fourth frame sub-unit is arranged on the other side of the second connecting strip, and the fifth frame sub-unit is arranged on one side of the second connecting strip.

[0148] It should be noted that the third frame unit is arranged on the second connecting bars of the first and last columns between the first lead support and the second lead support, and the second frame unit is arranged on the second connecting bars other than the first and last columns between the first lead support and the second lead support.

[0149] Specifically, Fig. 9As shown, the frame unit arranged on the first column, i.e., the leftmost column, and the frame unit arranged on the second connecting strip 2, i.e., the rightmost column, is a third frame unit 6, and the frame unit arranged on the second connecting strip 2 other than the leftmost and rightmost columns is a second frame unit 5, wherein the third frame unit 6 includes only one frame sub-unit.

[0150] In an optional implementation of this embodiment, Fig.13 As shown, Fig.13 FIG. 2 shows a schematic diagram of the structure of the second frame unit in the second embodiment of the present invention. Fig.13 for Fig. 9 In the enlarged schematic diagram at point b, the second frame unit 5 includes a third frame sub-unit 51 and a fourth frame sub-unit 52, wherein the third frame sub-unit 51 is arranged on the left side of the second connecting bar 2, and the fourth frame sub-unit 52 is arranged on the right side of the second connecting bar 2.

[0151] In an optional implementation of this embodiment, the second connecting strip includes a fifth connecting rib, a sixth connecting rib, a seventh connecting rib, and an eighth connecting rib, and the fifth connecting rib, the sixth connecting rib, the seventh connecting rib, and the eighth connecting rib are parallel to each other.

[0152] Specifically, Fig.11 As shown, the second connecting strip 3 includes a fifth connecting rib 31, a sixth connecting rib 32, a seventh connecting rib 33, and an eighth connecting rib 34. The fifth connecting rib 31, the sixth connecting rib 32, the seventh connecting rib 33, and the eighth connecting rib 34 are parallel to each other, and adjacent connecting ribs are equidistant.

[0153] In an optional implementation of this embodiment, Fig.13 As shown, the third frame subunit 51 includes a fifth base island 511, a sixth base island 512, a fifth pin 513, and a sixth pin 514, and the fifth pin 513 and the sixth pin 514 are perpendicular to the second connecting strip 3, and the fifth base island 511, the sixth base island 512, one end of the fifth pin 513, and one end of the sixth pin 514 are connected to the fifth connecting rib 31, and the other end of the fifth pin 513 and the other end of the sixth pin 514 are connected to the seventh connecting rib 33.

[0154] In an optional implementation of this embodiment, Fig.13As shown, the fourth frame subunit 52 includes a seventh base island 521, an eighth base island 522, a seventh pin 523, and an eighth pin 524, and the seventh pin 523 and the eighth pin 524 are perpendicular to the second connecting strip 3, and the seventh base island 521, the eighth base island 522, one end of the seventh pin 523, and one end of the eighth pin 524 are connected to the eighth connecting rib 34, and the other end of the seventh pin 523 and the other end of the eighth pin 524 are connected to the sixth connecting rib 32.

[0155] In an optional implementation of the present embodiment, the fifth base island 511 is provided with a chip bonding portion with a rectangular groove, the sixth base island 512 is provided with a chip bonding portion with a rectangular groove and a welding wire portion, the seventh base island 521 is provided with a chip bonding portion with a cross-shaped groove, and the eighth base island 522 is provided with a welding wire portion.

[0156] In an optional implementation of this embodiment, the fifth frame subunit is arranged on a side of the second connecting bar close to the adjacent first connecting bar.

[0157] Specifically, the fifth frame subunit located on the leftmost second connecting bar is located on the right side of the second connecting bar, and the fifth frame subunit located on the rightmost second connecting bar is located on the left side of the second connecting bar.

[0158] In an optional implementation of this embodiment, Fig.14 As shown, Fig.14 shows a first structural diagram of the third frame unit in the second embodiment of the present invention, Fig.14 for Fig. 9 The enlarged schematic diagram of point c in the middle, Fig.14 The schematic structural diagram of the third frame unit located on the leftmost second connecting bar is shown. The third frame unit 6 includes a fifth frame sub-unit 61 . The fifth frame sub-unit 61 is arranged on the right side of the second connecting bar 3 .

[0159] In an optional implementation of this embodiment, Fig.15 As shown, Fig.15 shows a second structural diagram of the third frame unit in the second embodiment of the present invention, Fig.15 for Fig. 9 The enlarged schematic diagram at point d in the middle, Fig.15 The schematic structural diagram of the third frame unit located on the rightmost second connecting bar is shown. The third frame unit 6 includes a fifth frame sub-unit 61 . The fifth frame sub-unit 61 is arranged on the left side of the second connecting bar 3 .

[0160] In an optional implementation of this embodiment, Fig.14As shown, the fifth frame subunit 61 includes a ninth base island 611, a tenth base island 612, a ninth pin 613, and a tenth pin 614, and the ninth pin 611 and the tenth pin 612 are perpendicular to the second connecting strip 3, and the ninth base island 611, the tenth base island 612, one end of the ninth pin 613, and one end of the tenth pin 614 are connected to the fifth connecting rib 31, and the other end of the ninth pin 613 and the other end of the tenth pin 614 are connected to the seventh connecting rib 33.

[0161] In an optional implementation of this embodiment, Fig.15 As shown, the fifth frame subunit 61 includes a ninth base island 611, a tenth base island 612, a ninth pin 613, and a tenth pin 614, and the ninth pin 611 and the tenth pin 612 are perpendicular to the second connecting strip 3, and the ninth base island 611, the tenth base island 612, one end of the ninth pin 613, and one end of the tenth pin 614 are connected to the eighth connecting rib 34, and the other end of the ninth pin 613 and the other end of the tenth pin 614 are connected to the sixth connecting rib 32.

[0162] It should be noted that in Fig.14 The second connecting strip 3 is only provided with the fifth connecting rib 31, the sixth connecting rib 32, and the seventh connecting rib 33. Fig.15 The second connecting strip 3 is only provided with the sixth connecting rib 32 , the seventh connecting rib 33 and the eighth connecting rib 34 .

[0163] In an optional implementation of the present embodiment, a chip bonding portion with a cross-shaped groove is provided on the ninth base island 611 located on the second connecting strip on the far left, and a welding wire portion is provided on the tenth base island 612; a chip bonding portion with a rectangular groove and a welding wire portion are provided on the ninth base island 611 located on the second connecting strip on the far right, and a chip bonding portion with a rectangular groove and a welding wire portion are provided on the tenth base island 612.

[0164] In an optional implementation of the present embodiment, the first frame subunit is a first type of frame subunit, the second frame subunit is a first type of frame subunit, the third frame subunit is a second type of frame subunit, the fourth frame subunit is a second type of frame subunit, and the fifth frame subunit is a second type of frame subunit, or the first frame subunit is a first type of frame subunit, the second frame subunit is a second type of frame subunit, the third frame subunit is a first type of frame subunit, the fourth frame subunit is a second type of frame subunit, and the fifth frame subunit is either the first type of frame subunit or the second type of frame subunit.

[0165] Specifically, when the first frame subunit is the first type of frame subunit, the fifth frame subunit located on the leftmost second connecting strip is the second type of frame subunit; when the first frame subunit is the second type of frame subunit, the fifth frame subunit located on the leftmost second connecting strip is the first type of frame subunit.

[0166] Furthermore, when the second frame subunit is the first frame subunit, the fifth frame subunit located on the rightmost second connecting strip is the second frame subunit; when the second frame subunit is the second frame subunit, the fifth frame subunit located on the rightmost second connecting strip is the first frame subunit.

[0167] In this embodiment, the first frame sub-unit 41 is a first type of frame sub-unit, the second frame sub-unit 42 is a second type of frame sub-unit, the third frame sub-unit 51 is a first type of frame sub-unit, the fourth frame sub-unit 52 is a second type of frame sub-unit, the fifth frame sub-unit 61 located on the leftmost second connecting strip 3 is a second type of frame sub-unit, and the fifth frame sub-unit 61 located on the rightmost second connecting strip 3 is a first type of frame sub-unit.

[0168] It should be noted that the first type of frame sub-unit is used to place the light-emitting chip, and the second type of frame sub-unit is used to place the photosensitive chip; or the first type of frame sub-unit is used to place the photosensitive chip, and the second type of frame sub-unit is used to place the light-emitting chip; in this embodiment, the first type of frame sub-unit is used to place the light-emitting chip, and the second type of frame sub-unit is used to place the photosensitive chip.

[0169] In an optional implementation of the present embodiment, two groups of translation positioning holes are provided on the first connecting strip, one group is located in the upper half of the first connecting strip, and the other group is located in the lower half of the first connecting strip, each group of translation positioning holes includes more than three translation positioning holes, and the translation positioning holes in the same group are not in the same straight line.

[0170] Specifically, Fig.16 As shown, Fig.16 A schematic diagram of the first connecting strip structure in embodiment 2 of the present invention is shown, wherein two groups of translation positioning holes 25 are provided on the first connecting strip 2, one group of which is located in the upper half of the first connecting strip 2, and the other group of which is located in the lower half of the first connecting strip 2, each group of translation positioning holes 25 includes three translation positioning holes 25, and the three translation positioning holes 25 in the same group are not in the same straight line.

[0171] In an optional implementation of the present embodiment, each translation positioning hole is located between the first connecting rib and the second connecting rib, or between the third connecting rib and the fourth connecting rib; and each translation positioning hole is not located in the gap between two pins of any frame sub-unit, and the diameter of the translation positioning hole is smaller than the gap between the first connecting rib and the second connecting rib, and smaller than the gap between the third connecting rib and the fourth connecting rib.

[0172] Specifically, each translation positioning hole 25 is located between the first connecting rib 21 and the second connecting rib 22, or between the third connecting rib 23 and the fourth connecting rib 24, and each translation positioning hole 25 is not located in the gap between the first pin 413 and the second pin 414 of the first frame sub-unit 41 arranged on the first connecting strip 2, and is not located in the gap between the third pin 423 and the fourth pin 424 of the second frame sub-unit 42 arranged on the first connecting strip 2.

[0173] A translation positioning hole is set here to provide a reference for the first connecting strip to translate upward. At the same time, the translation positioning hole is set in the gap between two pins that are not located in any frame sub-unit. There is no need to remove the connecting rib position where the translation positioning hole is located, which simplifies the production process and improves production efficiency.

[0174] In an optional implementation of this embodiment, a high-reflective metal layer is electroplated on the base island.

[0175] Specifically, the first base island 411, the second base island 412, the third base island 421, the fourth base island 422, the fifth base island 511, the sixth base island 512, the seventh base island 521, the eighth base island 522, the ninth base island 611, and the tenth base island 612 are all electroplated with a high-reflective metal layer.

[0176] Furthermore, the highly reflective metal layer may be a gold-plated layer or a silver-plated layer.

[0177] Here, a high-reflective metal layer is electroplated on the surface of the base island. After the photoelectric coupler is made, the reflectivity of the light emitted by the light-emitting chip is improved, and the efficiency of photoelectric conversion of the photoelectric coupler device is improved.

[0178] In an optional implementation of this embodiment, a bend is formed at a connection between each frame subunit and the connecting strip where the frame subunit is located; and the bending directions of the first type of frame subunit and the second type of frame subunit are opposite.

[0179] Specifically, the first frame sub-unit 41, the second frame sub-unit 42 and the first connecting strip 2 form a bend, and the third frame sub-unit 51, the fourth frame sub-unit 52, and the fifth frame sub-unit 61 and the second connecting strip 3 form a bend, and the bending direction of the first frame sub-unit 41 and the first connecting strip 2, the bending direction of the third frame sub-unit 51 and the second connecting strip 3, and the bending direction of the fifth frame sub-unit 61 located on the rightmost second connecting strip 3 and the second connecting strip 3 are opposite to the bending direction of the second frame sub-unit 42 and the first connecting strip 2, the bending direction of the fourth frame sub-unit 52 and the second connecting strip 3, and the bending direction of the fifth frame sub-unit 61 located on the leftmost second connecting strip 3 and the second connecting strip 3.

[0180] In summary, the second embodiment of the present invention provides a lead frame for an optocoupler, which adopts a single-piece lead frame, alternately arranges a first connecting strip and a second connecting strip, and arranges a double-row frame sub-unit on the connecting strip, which effectively improves the lead frame unit density, improves the unit area utilization rate, improves the lead frame strength, and reduces the material cost; two types of frame sub-units are arranged to respectively fix the light-emitting chip and the photosensitive chip, and the two ends of the first connecting strip are cut off, and the plane is translated in one direction to achieve superposition. Compared with the double-piece lead frame that needs to be flipped before superposition, the movement range is small, the process is less difficult to implement, and the reliability is higher; welding pins are respectively arranged on the first connecting strip and the lead bracket, which can be welded and fixed after translation superposition. Compared with the clamping superposition of the double-piece lead frame, the stability is higher and the reliability is higher; the translation positioning hole is arranged to improve the efficiency and accuracy during translation superposition, thereby improving production efficiency.

[0181] Embodiment 3

[0182] Embodiment three of the present invention provides a photoelectric coupler, which includes two relatively arranged frame sub-units, a light-emitting chip, a photosensitive chip, bonding wires, and a packaging body. One of the two frame sub-units is the first frame sub-unit or the second frame sub-unit described in Embodiment one, and the other is the third frame sub-unit or the fourth frame sub-unit or the fifth frame sub-unit described in Embodiment one. The light-emitting chip is arranged on a base island of one of the frame sub-units, and the photosensitive chip is arranged on a base island of the other frame sub-unit. The two base islands with the light-emitting chip and the photosensitive chip are arranged relatively to each other, and the packaging body encapsulates and covers the two frame sub-units, the light-emitting chip, the photosensitive chip, and the bonding wires as a whole.

[0183] In an optional implementation of this embodiment, Fig.17 As shown, Fig.17A schematic diagram of the structure of the photoelectric coupler in the third embodiment of the present invention is shown, wherein the photoelectric coupler includes a light-emitting chip frame subunit 71, a photosensitive chip frame subunit 72, a light-emitting chip, a photosensitive chip, bonding wires, and a packaging body 73, wherein the light-emitting chip frame subunit 71 is the first frame subunit or the second frame subunit in the first embodiment, and the photosensitive chip frame subunit 72 is the third frame subunit or the fourth frame subunit or the fifth frame subunit in the first embodiment, that is, the light-emitting chip frame subunit 71 is the first frame subunit for placing the light-emitting chip in the first embodiment, and the photosensitive chip frame subunit 72 is the second frame subunit for placing the photosensitive chip in the first embodiment.

[0184] In an optional implementation of this embodiment, the bonding wires connect the light-emitting chip, the photosensitive chip and the corresponding base island.

[0185] In an optional implementation of this embodiment, the packaging body 73 integrally packages and encapsulates the two frame sub-units, the light-emitting chip, the photosensitive chip, and the bonding wires.

[0186] In an optional implementation of the present embodiment, the pins 74 of the light-emitting chip frame subunit 71 and the photosensitive chip frame subunit 72 extend out of the package body 73 and are bent toward the same side outside the package body 73 .

[0187] In summary, the third embodiment of the present invention provides a photoelectric coupler, including the first frame subunit or the second frame subunit or the third frame subunit or the fourth frame subunit or the fifth frame subunit described in the first embodiment, and the lead frame of the photoelectric coupler in which it is located adopts a single-piece lead frame, and the first connecting strip and the second connecting strip are alternately arranged, and the double-row frame subunits are arranged on the connecting strip, which effectively improves the lead frame unit density, improves the unit area utilization rate, improves the lead frame strength, and reduces the material cost; two types of frame subunits are arranged to respectively fix the light-emitting chip and the photosensitive chip, and the two ends of the first connecting strip are cut off and the plane is translated in one direction to achieve superposition. Compared with the double-piece lead frame that needs to be flipped before superposition, the movement range is small, the process implementation difficulty is small, and the reliability is higher; welding pins are respectively arranged on the first connecting strip and the lead bracket, which can be welded and fixed after translation superposition. Compared with the clamping superposition of the double-piece lead frame, the stability is higher and the reliability is higher; the translation positioning hole is arranged to improve the efficiency and accuracy of the translation superposition, thereby improving the production efficiency.

[0188] Embodiment 4

[0189] Embodiment 4 of the present invention provides a method for manufacturing a photoelectric coupler, which is used to manufacture the photoelectric coupler in Embodiment 3.

[0190] In an optional implementation of this embodiment, Fig.18 As shown, Fig.18 A flow chart of a method for manufacturing a photoelectric coupler in a fourth embodiment of the present invention is shown, comprising the following steps:

[0191] S101, respectively soldering the light-emitting chip and the photosensitive chip in the frame units of the lead frame of the photoelectric coupler;

[0192] In an optional implementation of the present embodiment, the light-emitting chip and the photosensitive chip are respectively fixedly soldered on each frame sub-unit on the lead frame of the optocoupler in the first embodiment, wherein the light-emitting chip is fixedly soldered on the first base island, the second base island of the first frame sub-unit, and the third base island and the fourth base island of the second frame sub-unit which are the first type of frame sub-units, and the photosensitive chip is fixedly soldered on the fifth base island, the sixth base island of the third frame sub-unit, the seventh base island, the eighth base island of the fourth frame sub-unit, the ninth base island of the fifth frame sub-unit, and the ninth base island and the tenth base island of the fifth frame sub-unit.

[0193] In an optional implementation of this embodiment, after the light-emitting chip and the photosensitive chip are fixedly soldered to the corresponding frame sub-units, welding of structures such as bonding wires is performed.

[0194] S102, cutting off the first connecting strip section between the first welding pin at the upper end of the first connecting strip on the lead frame of the photoelectric coupler and the second welding pin at the bottom end of the first notch, and cutting off the connection between the lower end of the first connecting strip on the lead frame of the photoelectric coupler and the second notch;

[0195] In an optional implementation of the present embodiment, the first connecting strip is fixed by a positioning pin, the first connecting strip segment between the first welding pin at the upper end of all the first connecting strips on the lead frame in the first embodiment adopted to the second welding pin at the bottom end of the first recess is cut off, and the connection between the lower end of the first connecting strip on the lead frame in the first embodiment adopted and the second recess is cut off.

[0196] It should be noted that the length cut off at the upper end of the first connecting strip needs to be greater than the straight-line distance between the center of the light-emitting chip and the center of the photosensitive chip in two frame sub-units that need to be overlapped on adjacent connecting strips.

[0197] If the cut length here is smaller than the straight-line distance between the center of the light-emitting chip and the center of the photosensitive chip in the two frame sub-units that need to be overlapped on the adjacent connecting strips, in the subsequent translation process, the upper end of the first connecting strip will press against the first lead bracket, resulting in insufficient translation, making it impossible to achieve direct alignment between the light-emitting chip and the photosensitive chip, thus affecting the quality and precision of the output products.

[0198] In an optional implementation of this embodiment, Fig.19 As shown, Fig.19 The schematic diagram shows the structure of the first connecting strip of the lead frame after both ends are cut off in the fourth embodiment of the present invention. At this time, the upper end of the first connecting strip 2 has been cut off and separated from the first lead support 11 and cut off to a certain length, and the lower end has been cut off and separated from the second lead support 12.

[0199] S103, translate the first connecting strip upward, so that the first welding pin at the upper end of the first connecting strip overlaps with the second welding pin at the bottom end of the first notch, and the first welding pin at the lower end of the first connecting strip overlaps with the second welding pin at the top end of the second notch;

[0200] In an optional implementation of the present embodiment, the translation amount of the first connecting strip is calculated, and the translation amount is the straight-line distance between the center of the light-emitting chip and the center of the photosensitive chip in the two frame sub-units that need to be overlapped on the adjacent connecting strips mentioned in step S102.

[0201] In an optional implementation of the present embodiment, the first connecting strip is fixed with a positioning pin, and the entire first connecting strip is translated upward, and the amount of translation is the straight-line distance between the center of the light-emitting chip and the center of the photosensitive chip in the two frame sub-units that need to be overlapped on adjacent connecting strips. When the center of the light-emitting chip and the center of the photosensitive chip in the two frame sub-units that need to be overlapped on the adjacent connecting strips are facing each other, and the first welding pin at the upper end of the first connecting strip coincides with the second welding pin on the first lead bracket, and the first welding pin at the lower end of the first connecting strip coincides with the second welding pin on the second lead bracket, the translation ends.

[0202] In an optional implementation of this embodiment, Fig. 20 As shown, Fig. 20 A schematic diagram of the structure of the lead frame in Embodiment 4 of the present invention is shown after the first connecting bar is translated. At this time, the center of the light-emitting chip and the center of the photosensitive chip in the two frame sub-units that need to be overlapped on adjacent connecting bars are aligned, that is, the frame sub-units on the first connecting bar 2 in the figure are overlapped with the frame sub-units on the adjacent second connecting bar 3, respectively, and the first welding pin at the upper end of the first connecting bar 2 coincides with the second welding pin on the first lead bracket 11, and the first welding pin at the lower end of the first connecting bar 2 coincides with the second welding pin on the second lead bracket 12.

[0203] It should be noted that in order to better express the translation effect of the first connecting bar, Fig.19 and Fig. 20 The light-emitting chip, photosensitive chip and bonding wires are hidden.

[0204] In an optional implementation of this embodiment, during the translation process, the translation position can be monitored through the translation positioning holes provided on the first connecting bar to ensure accurate translation.

[0205] Here, the stacking is achieved by cutting off the two ends of the first connecting strip and performing a single-direction translation in the plane. Compared with the double-piece lead frame that needs to be flipped before stacking, the movement range is small, the process is less difficult to implement, and the reliability is higher.

[0206] S104, welding and fixing the first welding pin and the second welding pin;

[0207] In an optional implementation of the present embodiment, when the first welding pin at the upper end of the first connecting strip overlaps with the second welding pin at the bottom end of the first notch, and the first welding pin at the lower end of the first connecting strip overlaps with the second welding pin at the top end of the second notch, the lead frame is heated to melt the solder paste pre-coated on the first welding pin and the second welding pin, and the heating is stopped to weld the corresponding first welding pin and the second welding pin together.

[0208] Furthermore, the first welding pin and the second welding pin may be welded and fixed together by laser welding.

[0209] Welding pins are provided here, and the welding pins are welded and fixed together after the translation is completed. Compared with the positioning and overlapping of the double-piece lead frame, it has higher stability and reliability.

[0210] S105, cutting and shaping, and packaging to form a plurality of photoelectric couplers.

[0211] In an optional implementation of this embodiment, after completing steps S101 to S104, rib cutting and molding are performed, and packaging is performed to form a plurality of photoelectric couplers as in the third embodiment.

[0212] In summary, the fourth embodiment of the present invention provides a method for manufacturing a photoelectric coupler, which is used to manufacture the photoelectric coupler in the third embodiment. The lead frame where the frame sub-unit is located adopts a single-piece lead frame, and the first connecting strip and the second connecting strip are alternately arranged. The double-row frame sub-units are arranged on the connecting strips, which effectively improves the lead frame unit density, improves the unit area utilization rate, improves the lead frame strength, and reduces the material cost; two types of frame sub-units are arranged to respectively fix the light-emitting chip and the photosensitive chip, and the two ends of the first connecting strip are cut off and the plane is translated in one direction to achieve superposition. Compared with the double-piece lead frame that needs to be flipped before superposition, the movement range is small, the process is less difficult to achieve, and the reliability is higher; welding pins are respectively arranged on the first connecting strip and the lead bracket, which can be welded and fixed after translational superposition. Compared with the clamping superposition of the double-piece lead frame, the stability is higher and the reliability is higher; the translation positioning hole is arranged to improve the efficiency and accuracy of the translational superposition, thereby improving the production efficiency.

[0213] A person of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc.

[0214] In addition, the embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A lead frame for an optocoupler, characterized in that: The lead frame of the photoelectric coupler comprises a first lead support and a second lead support, a plurality of mutually parallel first connecting bars and second connecting bars are arranged between the first lead support and the second lead support, and the first connecting bars and the second connecting bars are arranged alternately; A plurality of first frame units are arranged on the first connecting bar, wherein the first frame unit includes a first frame sub-unit and a second frame sub-unit, wherein the first frame sub-unit is arranged on one side of the first connecting bar, and the second frame sub-unit is arranged on the other side of the first connecting bar; The first lead bracket is provided with a plurality of first notches, and the second lead bracket is provided with a plurality of second notches, the number of the first notches and the second notches is the same as the number of the first connecting strip, the upper end of the first connecting strip is connected to the bottom edge of the first notch, and the lower end of the first connecting strip is connected to the bottom edge of the second notch, the upper end and the lower end of the first connecting strip are provided with first welding pins, the bottom end of the first notch and the top end of the second notch are provided with second welding pins, the second welding pin located in the first notch is arranged directly above the first welding pin at the upper end of the first connecting strip, and the second welding pin located in the second notch is arranged directly above the first welding pin at the lower end of the first connecting strip.

2. The lead frame of the optocoupler according to claim 1, wherein: The first connecting bar includes a first connecting rib, a second connecting rib, a third connecting rib, and a fourth connecting rib, and the first connecting rib, the second connecting rib, the third connecting rib, and the fourth connecting rib are parallel to each other.

3. The lead frame of the optocoupler according to claim 2, wherein: The first frame subunit includes a first base island, a second base island, a first pin, and a second pin. The first pin and the second pin are perpendicular to the first connecting strip. The first base island, the second base island, one end of the first pin, and one end of the second pin are connected to the first connecting rib, and the other end of the first pin and the other end of the second pin are connected to the third connecting rib.

4. The lead frame of the optocoupler according to claim 2, wherein: The second frame subunit includes a third base island, a fourth base island, a third pin, and a fourth pin. The third pin and the fourth pin are perpendicular to the first connecting strip. The third base island, the fourth base island, one end of the third pin, and one end of the fourth pin are connected to the fourth connecting rib, and the other end of the third pin and the other end of the fourth pin are connected to the second connecting rib.

5. The lead frame of the optocoupler according to claim 1, wherein: The thickness of the first soldering pin is half of the thickness of the lead frame of the photocoupler, and the thickness of the second soldering pin is half of the thickness of the lead frame of the photocoupler.

6. The lead frame of the optocoupler according to claim 1, wherein: The first welding foot is an upward concave welding foot, and the second welding foot is a downward concave welding foot; Or the first welding foot is a downward concave welding foot, and the second welding foot is an upward concave welding foot.

7. The lead frame of the optocoupler according to claim 1, wherein: A plurality of second frame units or a plurality of third frame units are arranged on the second connecting strip, the second frame unit includes a third frame sub-unit and a fourth frame sub-unit, the third frame unit includes a fifth frame sub-unit, the third frame sub-unit is arranged on one side of the second connecting strip, the fourth frame sub-unit is arranged on the other side of the second connecting strip, and the fifth frame sub-unit is arranged on one side of the second connecting strip.

8. The lead frame of the optocoupler according to claim 7, wherein: The third frame unit is arranged on the second connecting bars of the first and last columns between the first lead support and the second lead support, and the second frame unit is arranged on the second connecting bars between the first lead support and the second lead support except the first and last columns; The fifth frame subunit is arranged on a side of the second connecting bar close to the adjacent first connecting bar.

9. The lead frame of the optocoupler according to claim 7, wherein: The second connecting bar includes a fifth connecting rib, a sixth connecting rib, a seventh connecting rib, and an eighth connecting rib, and the fifth connecting rib, the sixth connecting rib, the seventh connecting rib, and the eighth connecting rib are parallel to each other.

10. The lead frame of the optocoupler according to claim 9, wherein: The third frame subunit includes a fifth base island, a sixth base island, a fifth pin, and a sixth pin, the fifth pin and the sixth pin are perpendicular to the second connecting strip, the fifth base island, the sixth base island, one end of the fifth pin, and one end of the sixth pin are connected to the fifth connecting rib, and the other end of the fifth pin and the other end of the sixth pin are connected to the seventh connecting rib.

11. The lead frame of the optocoupler according to claim 9, wherein: The fourth frame sub-unit includes a seventh base island, an eighth base island, a seventh pin, and an eighth pin. The seventh pin and the eighth pin are perpendicular to the second connecting strip. The seventh base island, the eighth base island, one end of the seventh pin, and one end of the eighth pin are connected to the eighth connecting rib, and the other end of the seventh pin and the other end of the eighth pin are connected to the sixth connecting rib.

12. The lead frame of the optocoupler according to claim 9, wherein: The fifth frame subunit includes a ninth base island, a tenth base island, a ninth pin, and a tenth pin, wherein the ninth pin and the tenth pin are perpendicular to the second connecting bar, the ninth base island, the tenth base island, one end of the ninth pin, and one end of the tenth pin are connected to the fifth connecting rib, and the other end of the ninth pin and the other end of the tenth pin are connected to the seventh connecting rib; Or the ninth base island, the tenth base island, one end of the ninth pin, and one end of the tenth pin are connected to the eighth connecting rib, and the other end of the ninth pin and the other end of the tenth pin are connected to the sixth connecting rib.

13. The lead frame of the optocoupler according to claim 7, wherein: The first frame subunit is a first type of frame subunit, the second frame subunit is a first type of frame subunit, the third frame subunit is a second type of frame subunit, the fourth frame subunit is a second type of frame subunit, and the fifth frame subunit is a second type of frame subunit; Or the first frame subunit is the first type of frame subunit, the second frame subunit is the second type of frame subunit, the third frame subunit is the first type of frame subunit, the fourth frame subunit is the second type of frame subunit, and the fifth frame subunit is the first type of frame subunit or the second type of frame subunit.

14. The lead frame of the optocoupler according to claim 13, wherein: The first type of frame subunit is used to place a light-emitting chip, and the second type of frame subunit is used to place a photosensitive chip; Or the first type of frame sub-unit is used for placing a photosensitive chip, and the second type of frame sub-unit is used for placing a light-emitting chip.

15. The lead frame of the optocoupler according to claim 14, wherein: A bend is formed at the connection between each frame subunit and the connecting strip where the frame subunit is located; The bending directions of the first frame subunit and the second frame subunit are opposite.

16. The lead frame of the optocoupler according to claim 7, wherein: Each frame subunit includes two base islands and two pins. The base islands are provided with chip bonding parts for placing optocoupler chips and / or wire bonding parts for wire bonding. The chip bonding parts are circular grooves, cross grooves or rectangular grooves.

17. The lead frame of the optocoupler according to claim 16, wherein: A high reflective metal layer is electroplated on the base island.

18. The lead frame of the optocoupler according to claim 1, wherein: The first connecting strip is provided with two groups of translation positioning holes, one group of which is located at the upper half of the first connecting strip, and the other group of which is located at the lower half of the first connecting strip, each group of translation positioning holes includes more than three translation positioning holes, and the translation positioning holes in the same group are not located on the same straight line; Each translation positioning hole is located between the first connecting rib and the second connecting rib, or between the third connecting rib and the fourth connecting rib; Each translation positioning hole is not located in the gap between two pins of any frame subunit; The diameter of the translation positioning hole is smaller than the gap between the first connecting rib and the second connecting rib, and smaller than the gap between the third connecting rib and the fourth connecting rib.

19. A photoelectric coupler, characterized in that: The photocoupler includes two relatively arranged frame sub-units, a light-emitting chip, a photosensitive chip, bonding wires, and a packaging body. One of the two frame sub-units is the first frame sub-unit or the second frame sub-unit described in any one of claims 1 to 18, and the other is the third frame sub-unit or the fourth frame sub-unit or the fifth frame sub-unit described in any one of claims 1 to 18. The light-emitting chip is arranged on a base island of one of the frame sub-units, and the photosensitive chip is arranged on a base island of the other frame sub-unit. The two base islands with the light-emitting chip and the photosensitive chip are arranged relatively to each other, and the packaging body encapsulates and covers the two frame sub-units, the light-emitting chip, the photosensitive chip, and the bonding wires as a whole.

20. A method for manufacturing a photoelectric coupler, characterized in that: The manufacturing method is used to manufacture the optocoupler according to claim 19, and the method comprises: Soldering the light-emitting chip and the photosensitive chip in the frame units of the lead frame of the photocoupler respectively; Cutting off the first connecting strip section between the first welding pin at the upper end of the first connecting strip on the lead frame of the photocoupler and the second welding pin at the bottom end of the first notch, and cutting off the connection between the lower end of the first connecting strip on the lead frame of the photocoupler and the second notch; The first connecting strip is translated upward, so that the first welding foot at the upper end of the first connecting strip coincides with the second welding foot at the bottom end of the first notch, and the first welding foot at the lower end of the first connecting strip coincides with the second welding foot at the top end of the second notch; Welding the first welding pin and the second welding pin to fix; The ribs are cut, shaped, and packaged to form several optocouplers.

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