Lead frame of photoelectric coupler, laminated structure and photoelectric coupler

Abstract

The invention discloses a lead frame of a photoelectric coupler, a laminated structure and the photoelectric coupler, the lead frame of the photoelectric coupler comprises a first lead support and a second lead support, a plurality of parallel connecting strips are arranged between the first lead support and the second lead support, any connecting strip is provided with a plurality of frame units, and the frame units are connected with the first lead support and the second lead support. Any frame unit comprises a functional area which comprises a first base island, a second base island, a third base island, a first connecting bridge, a second connecting bridge and a third connecting bridge, the first base island is connected with one end of the first connecting bridge, the second base island is connected with one end of the second connecting bridge, and the third base island is connected with one end of the third connecting bridge. The other end of the first connecting bridge, the other end of the second connecting bridge and the other end of the third connecting bridge are connected with the connecting strip, and the first base island, the second base island and the third base island are arranged in a delta shape. The frame unit of the lead frame adopts the three base islands shaped like the Chinese character'pin ', different types of photoelectric couplers can be adapted according to actual requirements, mold opening is not needed again, and the manufacturing cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of photoelectric couplers, and in particular to a lead frame, a stacked structure and a photoelectric coupler of a photoelectric coupler. Background Art

[0002] As a safety device for electric-optical-electrical conversion isolation, photocouplers have a wide range of market applications and environments. Usually, photocouplers contain a light-emitting chip and a photosensitive chip, which are encapsulated in the same package by packaging glue. When an input current signal is applied to the input end of the photocoupler, the light-emitting chip emits light, and the photosensitive chip generates an induced current after receiving the light, thereby realizing the conversion between photoelectric signals.

[0003] Common types of optocouplers include transistor optocouplers, thyristor optocouplers, photorelays, etc. Different types of optocoupler structures require the use of lead frames with different structures for packaging due to their different internal electrical principles and electrical connection methods. There are many types of fixtures, carriers, and molds corresponding to lead frames with different structures, which leads to high costs for redesign and mold opening, resulting in waste of materials and manufacturing costs. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides a lead frame, a stacked structure and a photoelectric coupler of a photoelectric coupler. The frame unit of the lead frame adopts three base islands in a triangular shape, which can be adapted to different types of photoelectric couplers according to actual needs without the need to re-open the mold, thereby reducing the manufacturing cost.

[0005] The present invention provides a lead frame of an optocoupler, the lead frame of the optocoupler comprising a first lead support and a second lead support, a plurality of mutually parallel connecting strips are arranged between the first lead support and the second lead support, a plurality of frame units are arranged on any of the connecting strips, any of the frame units comprises a functional area, the functional area comprises a first base island, a second base island, a third base island, a first connecting bridge, a second connecting bridge and a third connecting bridge, the first base island is connected to one end of the first connecting bridge, the second base island is connected to one end of the second connecting bridge, the third base island is connected to one end of the third connecting bridge, the other end of the first connecting bridge, the other end of the second connecting bridge and the other end of the third connecting bridge are connected to the connecting strip, and the first base island, the second base island and the third base island are arranged in a herringbone shape.

[0006] Furthermore, the first base island is close to the connecting strip, the second base island is located on the upper side of the first base island away from the connecting strip, and the third base island is located on the lower side of the first base island away from the connecting strip. The second base island, the third base island, the second connecting bridge, and the third connecting bridge surround the first base island and the first connecting bridge, and the second base island and the third base island are symmetrically arranged.

[0007] Furthermore, the first base island is far away from the connecting strip, the second base island is located on the upper side of the first base island close to the connecting strip, the third base island is located on the lower side of the first base island close to the connecting strip, the first connecting bridge is sandwiched between the second base island and the third base island, and the second base island and the third base island are symmetrically arranged.

[0008] Furthermore, a chip bonding portion for placing an optical coupling chip is provided on any base island, and the chip bonding portion is a circular groove or a cross-shaped groove.

[0009] Furthermore, the depth of the circular groove or the cross-shaped groove is 0.05mm-0.2mm.

[0010] Furthermore, the diameter of the circular groove is 0.8 mm-2 mm.

[0011] Furthermore, the cross side length of the cross-shaped groove is 0.5 mm-2 mm.

[0012] Furthermore, a high-reflective metal layer is electroplated on a region of any base island except the chip bonding portion.

[0013] Furthermore, the shortest distance between any two adjacent base islands is 0.2 mm-1 mm.

[0014] Further, any one of the connecting strips comprises a first connecting rib, a second connecting rib and a third connecting rib, and the first connecting rib, the second connecting rib and the third connecting rib are parallel to each other;

[0015] The other end of the first connection bridge, the other end of the second connection bridge, and the other end of the third connection bridge are connected to the first connection rib.

[0016] Furthermore, the frame unit also includes a first pin and a second pin, the first pin and the second pin are perpendicular to the connecting strip, one end of the first pin and one end of the second pin are connected to the first connecting rib and the functional area, and the other end of the first pin and the other end of the second pin are connected to the third connecting rib.

[0017] Furthermore, the first lead support and the second lead support are provided with a plurality of groups of docking notches, and each group of docking notches is symmetrical in the upper and lower parts.

[0018] Furthermore, a plurality of docking holes are provided on the first lead bracket and the second lead bracket.

[0019] Furthermore, a bend is formed at the connection between the connection bar and the first lead support and the second lead support.

[0020] Furthermore, the bending angle formed at the connection between the connecting strip and the first lead support and the second lead support is 45°-90°, and the bending height is 0.15mm-0.3mm.

[0021] Furthermore, a bend is formed at the connection between each frame unit and the connection strip where each frame unit is located.

[0022] Furthermore, the bending angle formed at the connection between the frame unit and the connecting strip where the frame unit is located is 45°-90°, and the bending height is 0.4mm-0.8mm.

[0023] Furthermore, the lead frame of the photoelectric coupler is made of one or more alloys of aluminum, iron, and copper.

[0024] The present invention also provides a stacking structure of a lead frame of an optocoupler, the stacking structure of the lead frame of the optocoupler comprising a first lead frame and a second lead frame, the first lead frame and the second lead frame are both lead frames of the above-mentioned optocoupler, the first lead frame and the second lead frame are stacked on each other, and the frame units arranged on the first lead frame are stacked one-to-one with the frame units arranged on the second lead frame.

[0025] The present invention also provides a photoelectric coupler, which includes two frame units arranged opposite to each other, a plurality of photocoupler chips, bonding wires, and a packaging body. The two frame units are both frame units in the lead frame of the above-mentioned photocoupler. The functional areas of the two frame units are arranged opposite to each other, and the first base island, the second base island, and the third base island of the two frame units are arranged opposite to each other. The plurality of photocoupler chips and bonding wires are arranged on the two frame units. The packaging body integrally encapsulates and covers the functional areas, the plurality of photocoupler chips, and the bonding wires of the two frame units. The first pins and the second pins of the two frame units extend out of the packaging body and are bent toward the same side outside the packaging body.

[0026] In the lead frame of the optocoupler provided by the present invention, the frame unit adopts three base islands arranged in a triangular shape. Different optocoupler chips can be placed on different base islands according to the actual requirements of different types of optocouplers for the lead frame structure, and different processing methods can be performed. When cutting ribs and removing waste, different effects can be achieved by replacing the rib cutting tool and position, so that it meets the lead frame requirements of the corresponding type of optocoupler, and there is no need to re-open the mold. Its work fixtures, carriers, and molds can all be shared, which maximizes the material utilization rate and the life of the mold tool, effectively reduces costs, shortens the product development cycle and investment, ensures product reliability, improves production efficiency, and has a broader application prospect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 is a schematic diagram of the lead frame structure of the optocoupler in the first embodiment of the present invention;

[0029] Figure 2 is a schematic diagram of the frame unit structure in the first embodiment of the present invention;

[0030] Figure 3 is a schematic side view of the lead frame structure in the first embodiment of the present invention;

[0031] Figure 4 is a schematic side view of the frame unit structure in the first embodiment of the present invention;

[0032] Figure 5 is a schematic diagram of the lead frame structure of the optocoupler in the second embodiment of the present invention;

[0033] Figure 6 is a schematic diagram of the frame unit structure in the second embodiment of the present invention;

[0034] Figure 7 is a schematic side view of the frame unit structure in the second embodiment of the present invention;

[0035] Figure 8 is a schematic diagram of the stacked structure of the lead frame of the optocoupler in the third embodiment of the present invention;

[0036] Fig. 9 is a schematic structural diagram of a photoelectric coupler in a fourth embodiment of the present invention;

[0037] Fig.101 is a schematic diagram of the lead frame structure and a superimposed schematic diagram of the DC input transistor photocoupler in the fourth embodiment of the present invention;

[0038] Fig.11 1 is a schematic diagram of the lead frame structure and a superimposed schematic diagram of the AC input transistor photocoupler in the fourth embodiment of the present invention;

[0039] Fig.12 Schematic diagram of the lead frame structure and the stacking diagram of the thyristor photocoupler in the fourth embodiment of the present invention;

[0040] Fig.13 It is a schematic diagram of the lead frame structure and a superposition schematic diagram of the photorelay in the fourth embodiment of the present invention. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] In the present invention, it should be understood that terms such as "include" or "have" are intended to indicate the existence of features, numbers, steps, behaviors, components, parts or a combination thereof disclosed in the specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, behaviors, components, parts or a combination thereof exist or are added.

[0043] It should also be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0044] Embodiment 1

[0045] Embodiment 1 of the present invention provides a lead frame of an optocoupler, wherein the lead frame of the optocoupler includes a first lead support and a second lead support, wherein a plurality of parallel connecting strips are arranged between the first lead support and the second lead support, wherein a plurality of frame units are arranged on any one of the connecting strips, and wherein any one of the frame units includes a functional area, wherein the functional area includes a first base island, a second base island, a third base island, a first connecting bridge, a second connecting bridge and a third connecting bridge, wherein the first base island is connected to one end of the first connecting bridge, the second base island is connected to one end of the second connecting bridge, the third base island is connected to one end of the third connecting bridge, and the other ends of the first connecting bridge, the second connecting bridge and the third connecting bridge are connected to the connecting strips, and the first base island, the second base island and the third base island are arranged in a herringbone shape.

[0046] In an optional implementation of this embodiment, Figure 1 As shown, Figure 1 A schematic diagram of the lead frame structure of the optocoupler in Embodiment 1 of the present invention is shown, wherein the lead frame includes a first lead support 11a and a second lead support 12a, a plurality of mutually parallel connecting strips 2a are arranged between the first lead support 11a and the second lead support 12a, the connecting strips 2a are perpendicular to the first lead support 11a and the first lead support 12a, a plurality of frame units 3a are arranged on any one of the connecting strips 2a, and the connecting strips 2a are used to support the frame units 3a.

[0047] In an optional implementation of this embodiment, Figure 2 As shown, Figure 2 A schematic diagram of the frame unit structure in embodiment 1 of the present invention is shown, the frame unit 3a includes a functional area 4a, the functional area 4a includes a first base island 51a, a second base island 52a, a third base island 53a, a first connecting bridge 54a, a second connecting bridge 55a, and a third connecting bridge 56a, the first base island 51a is connected to one end of the first connecting bridge 54a, the second base island 52a is connected to one end of the second connecting bridge 55a, the third base island 53a is connected to one end of the third connecting bridge 56a, the other end of the first connecting bridge 54a, the other end of the second connecting bridge 55a, and the other end of the third connecting bridge 56a are connected to the connecting strip 2a, and the first base island 51a, the second base island 52a and the third base island 53a are arranged in a herringbone shape.

[0048] Specifically, the first base island 51a is close to the connecting strip 5a, the second base island 52a is located on the side of the first base island 51a away from the connecting strip 2a, that is, the upper side of the right side, and the third base island 53a is located on the side of the first base island 51a away from the connecting strip 2a, that is, the lower side of the right side. The second base island 52a, the third base island 53a, the second connecting bridge 55a, and the third connecting bridge 56a surround the first base island 51a and the first connecting bridge 54a, and the second base island 52a and the third base island 53a are symmetrically arranged.

[0049] In an optional implementation of this embodiment, a chip bonding portion for placing an optocoupler chip is provided on any base island, and the chip bonding portion is a circular groove or a cross-shaped groove, and the chip bonding portion is located at the center of the corresponding base island.

[0050] Specifically, Figure 2 As shown, Figure 2 The chip bonding portions provided on the first base island 51a, the second base island 52a and the third base island 53a of the frame unit 3a are circular grooves.

[0051] In an optional implementation of this embodiment, the depth of the circular groove is 0.05 mm-0.2 mm, and can be specifically a value among 0.05 mm, 0.1 mm, 0.15 mm, and 0.2 mm, which is determined according to actual design requirements.

[0052] In an optional implementation of this embodiment, the diameter of the circular groove is 0.8 mm-2 mm, specifically a value among 0.8 mm, 1 mm, 1.5 mm, and 2 mm, which is determined according to actual design requirements.

[0053] Here, a chip bonding part is set on the base island, and the specific structure is a circular groove, which is used to place the optocoupler chip and fix the die.

[0054] In an optional implementation of this embodiment, a high-reflective metal layer is electroplated on a region of any base island except the chip bonding portion.

[0055] Specifically, a high-reflective metal layer is electroplated on the first base island 41a, the second base island 42a, and the third base island 43a except for the groove structure of the chip bonding part.

[0056] Furthermore, the highly reflective metal layer may be a gold-plated layer or a silver-plated layer.

[0057] Here, a highly reflective metal layer is arranged on the surface of the base island, so that the first base island, the second base island and the third base island can serve as a bonding wire connection medium when no optocoupler chip is placed, while improving the reflectivity of the light emitted by the light-emitting chip and the photoelectric conversion efficiency of the optocoupler device.

[0058] In an optional implementation of this embodiment, the shortest distance between any two adjacent base islands is 0.2 mm-1 mm, and specifically can be a value among 0.2 mm, 0.5 mm, 0.8 mm, and 1 mm, which is determined according to actual design requirements.

[0059] Specifically, Figure 2 As shown, Figure 2 The distance s1 between the first base island 51a and the second base island 52a, the distance s2 between the first base island 51a and the third base island 53a, and the distance s3 between the second base island 52a and the third base island 53a are 0.2mm-1mm.

[0060] The shortest distance between adjacent base islands is set here to avoid tiny burrs on the base islands during the production process, or silver paste splashing at the edge of the base islands during the crystal bonding process, which may cause short circuits.

[0061] In an optional implementation of this embodiment, any one of the connecting strips includes a first connecting rib, a second connecting rib and a third connecting rib, and the first connecting rib, the second connecting rib and the third connecting rib are parallel to each other.

[0062] Specifically, Figure 2 As shown, the connecting strip 2a includes a first connecting rib 21a, a second connecting rib 22a, and a third connecting rib 23a, and the first connecting rib 21a, the second connecting rib 22a, and the third connecting rib 23a are parallel to each other.

[0063] In an optional implementation of this embodiment, the other end of the first connection bridge, the other end of the second connection bridge, and the other end of the third connection bridge are connected to the first connection rib.

[0064] Specifically, Figure 2 As shown, the other end of the first connecting bridge 54a, the other end of the second connecting bridge 55a, and the other end of the third connecting bridge 56a are connected to the first connecting rib 21a.

[0065] A first connecting rib is provided here to prevent the inner layer of colloid from overflowing during plastic sealing, a second connecting rib is provided to prevent the outer layer of colloid from overflowing during plastic sealing, and a third connecting rib is provided as the main force point to maintain the structural stability of the lead frame.

[0066] In an optional implementation of this embodiment, Figure 2 As shown, the frame unit 3a also includes a first pin 61a and a second pin 62a, the first pin 61a and the second pin 62a are perpendicular to the connecting strip 2a, one end of the first pin 61a and one end of the second pin 62a are connected to the first connecting rib 21a and the functional area 4a, spanning the second connecting rib 22a, and the other end of the first pin 61a and the other end of the second pin 62a are connected to the third connecting rib 23a.

[0067] Specifically, the other end of the first connecting bridge 54a, the other end of the second connecting bridge 55a, and the other end of the third connecting bridge 56a are connected to the first connecting rib 21a, and one end of the first pin 61a and one end of the second pin 62a are also connected to the first connecting rib 21a, that is, the other end of the first connecting bridge 54a, the other end of the second connecting bridge 55a, and the other end of the third connecting bridge 56a are connected to one end of the first pin 61a and one end of the second pin 62a.

[0068] The first pin and the second pin are set here to connect an external input source and an output source after a photoelectric coupler is subsequently formed, so as to support the photoelectric coupler to work.

[0069] In an optional implementation of this embodiment, a plurality of docking holes are provided on the first lead support and the second lead support.

[0070] Specifically, Figure 1 As shown, a plurality of docking holes 72a are provided on the first lead support 11a and the second lead support 12a.

[0071] In an optional implementation of this embodiment, a bend is formed at the connection between the connection bar and the first lead support and the second lead support.

[0072] Specifically, Figure 3 As shown, Figure 3 A side view schematic diagram of the lead frame structure in the first embodiment of the present invention is shown, wherein the connection strip 2a is bent at the connection with the first lead bracket 11a and the second lead bracket 12a, and the bending angle α1 is 45°-90°, specifically a value among 45°, 60°, 75°, and 90°, and the bending height h1 is 0.15mm-0.3mm, specifically a value among 0.15mm, 0.2mm, 0.25mm, and 0.3mm, which is determined according to actual design requirements.

[0073] Here, a bend is formed at the connection between the connecting strip and the first lead support and the second lead support, and a bend angle and a bend height are set to improve the subsequent manufacturing efficiency of the photoelectric coupler device.

[0074] In an optional implementation of this embodiment, a bend is formed at the connection between each frame unit and the connecting strip where each frame unit is located.

[0075] Specifically, Figure 4 As shown, Figure 4 FIG. 4 shows a schematic side view of the frame unit structure in the first embodiment of the present invention. Figure 4 As shown, a bend is formed at the connection between the frame unit 3a and the connecting strip 2a, and the bending angle α2 is 45°-90°, specifically a value among 45°, 60°, 75°, and 90°, and the bending height h2 is 0.4mm-0.8mm, specifically a value among 0.4mm, 0.5mm, 0.6mm, 0.7mm, and 0.8mm, which is determined according to actual design requirements.

[0076] Here, a bend is formed at the connection between the frame unit and the connecting strip, and a bend angle and a bend height are set to improve the manufacturing efficiency of subsequent photoelectric coupler devices.

[0077] In an optional implementation of this embodiment, the lead frame of the optocoupler is made of one or more alloys of aluminum, iron, and copper.

[0078] In summary, the first embodiment of the present invention provides a lead frame for an optocoupler, wherein the frame unit adopts three base islands arranged in a triangular shape. Different chips can be placed on different base islands and processed in different ways according to the actual requirements of different types of optocouplers for the lead frame structure. Different effects can be achieved by replacing the rib cutting tool and position when cutting ribs and removing waste, so that it meets the lead frame requirements of the corresponding type of optocoupler. There is no need to re-open the mold, and its work fixtures, carriers, and molds can all be shared, thereby maximizing material utilization and mold tool life, effectively reducing costs, shortening product development cycle and investment, ensuring product reliability, and improving production efficiency, with a broader application prospect.

[0079] Embodiment 2

[0080] Embodiment 2 of the present invention provides a lead frame of an optocoupler, wherein the lead frame of the optocoupler comprises a first lead support and a second lead support, wherein a plurality of parallel connecting strips are arranged between the first lead support and the second lead support, wherein a plurality of frame units are arranged on any one of the connecting strips, and wherein any one of the frame units comprises a functional area, wherein the functional area comprises a first base island, a second base island, a third base island, a first connecting bridge, a second connecting bridge and a third connecting bridge, wherein the first base island is connected to one end of the first connecting bridge, the second base island is connected to one end of the second connecting bridge, the third base island is connected to one end of the third connecting bridge, the other end of the first connecting bridge, the other end of the second connecting bridge and the other end of the third connecting bridge are connected to the connecting strip, and the first base island, the second base island and the third base island are arranged in a herringbone shape.

[0081] In an optional implementation of this embodiment, Figure 5 As shown, Figure 5 A schematic diagram of the lead frame structure of the optocoupler in the second embodiment of the present invention is shown, the lead frame includes a first lead bracket 11b and a second lead bracket 12b, a plurality of mutually parallel connecting strips 2b are arranged between the first lead bracket 11b and the second lead bracket 12b, the connecting strips 2b are perpendicular to the first lead bracket 11b and the first lead bracket 12b, a plurality of frame units 3b are arranged on any one of the connecting strips 2b, and the connecting strips 2b are used to carry the frame units 3b.

[0082] In an optional implementation of this embodiment, Figure 6 As shown, Figure 6A schematic diagram of the frame unit structure in embodiment 2 of the present invention is shown, the frame unit 3b includes a functional area 4b, the functional area 4b includes a first base island 51b, a second base island 52b, a third base island 53b, a first connecting bridge 54b, a second connecting bridge 55b, and a third connecting bridge 56b, the first base island 51b is connected to one end of the first connecting bridge 54b, the second base island 52b is connected to one end of the second connecting bridge 55b, the third base island 53b is connected to one end of the third connecting bridge 56b, the other end of the first connecting bridge 54b, the other end of the second connecting bridge 55b, and the other end of the third connecting bridge 56b are connected to the connecting strip 2b, and the first base island 51b, the second base island 52b and the third base island 53b are arranged in a herringbone shape.

[0083] Specifically, the first base island 51b is far away from the connecting strip 2b, the second base island 52b is located on the side of the first base island 51b close to the connecting strip 2b, that is, the upper side of the left side, the third base island 53b is located on the side of the first base island 51b close to the connecting strip 2b, that is, the lower side of the left side, the first connecting bridge 54b is sandwiched between the second base island 52b and the third base island 53b, and the second base island 52b and the third base island 53b are symmetrically arranged.

[0084] In an optional implementation of this embodiment, a chip bonding portion for placing an optocoupler chip is provided on any base island, and the chip bonding portion is a circular groove or a cross-shaped groove, and the chip bonding portion is located at the center of the corresponding base island.

[0085] Specifically, Figure 6 As shown, Figure 6 The chip bonding portions provided on the first base island 51b, the second base island 52b and the third base island 53b of the frame unit 3b are cross-shaped grooves.

[0086] In an optional implementation of this embodiment, the depth of the cross-shaped groove is 0.05 mm-0.2 mm, and can be specifically a value among 0.05 mm, 0.1 mm, 0.15 mm, and 0.2 mm, which is determined according to actual design requirements.

[0087] In an optional implementation of the present embodiment, the length of the cross side of the cross-shaped groove is 0.5 mm-2 mm, and can be specifically a value among 0.5 mm, 1 mm, 1.5 mm, and 2 mm, which is determined according to actual design requirements.

[0088] It should be noted that the cross sides of the cross-shaped groove are two mutually perpendicular line segments forming a "cross".

[0089] Here, a chip bonding part is set on the base island, and the specific structure is a cross-shaped groove, which is used to place the optocoupler chip and fix the die.

[0090] In an optional implementation of this embodiment, a high-reflective metal layer is electroplated on a region of any base island except the chip bonding portion.

[0091] Specifically, a high-reflective metal layer is electroplated on the first base island 51b, the second base island 52b, and the third base island 53b except for the groove structure of the chip bonding part.

[0092] Furthermore, the highly reflective metal layer may be a gold-plated layer or a silver-plated layer.

[0093] Here, a highly reflective metal layer is arranged on the surface of the base island, so that the first base island, the second base island and the third base island can serve as a bonding wire connection medium when no optocoupler chip is placed, while improving the reflectivity of the light emitted by the light-emitting chip and the photoelectric conversion efficiency of the optocoupler device.

[0094] In an optional implementation of this embodiment, the shortest distance between any two adjacent base islands is 0.2 mm-1 mm, and specifically can be a value among 0.2 mm, 0.5 mm, 0.8 mm, and 1 mm, which is determined according to actual design requirements.

[0095] Specifically, Figure 6 As shown, Figure 6 The interval s1 between the first base island 51b and the second base island 52b, the interval s2 between the first base island 51b and the third base island 53b, and the interval s3 between the second base island 52b and the third base island 53b are 0.2mm-1mm.

[0096] The shortest distance between adjacent base islands is set here to avoid tiny burrs on the base islands during the production process, or silver paste splashing at the edge of the base islands during the crystal bonding process, which may cause short circuits.

[0097] In an optional implementation of this embodiment, any one of the connecting strips includes a first connecting rib, a second connecting rib and a third connecting rib, and the first connecting rib, the second connecting rib and the third connecting rib are parallel to each other.

[0098] Specifically, Figure 6 As shown, the connecting strip 2b includes a first connecting rib 21b, a second connecting rib 22b, and a third connecting rib 23b, and the first connecting rib 21b, the second connecting rib 22b, and the third connecting rib 23b are parallel to each other.

[0099] In an optional implementation of this embodiment, the other end of the first connection bridge, the other end of the second connection bridge, and the other end of the third connection bridge are connected to the first connection rib.

[0100] Specifically, Figure 6 As shown, the other end of the first connection bridge 54b, the other end of the second connection bridge 55b, and the other end of the third connection bridge 56b are connected to the first connection rib 21b.

[0101] A first connecting rib is provided here to prevent the inner layer of colloid from overflowing during plastic sealing, a second connecting rib is provided to prevent the outer layer of colloid from overflowing during plastic sealing, and a third connecting rib is provided as the main force point to maintain the structural stability of the lead frame.

[0102] In an optional implementation of this embodiment, Figure 6 As shown, the frame unit 3b also includes a first pin 61b and a second pin 62b, the first pin 61b and the second pin 62b are perpendicular to the connecting strip 2b, one end of the first pin 61b and one end of the second pin 62b are connected to the first connecting rib 21b and the functional area 4b, spanning the second connecting rib 22b, and the other end of the first pin 61b and the other end of the second pin 62b are connected to the third connecting rib 23b.

[0103] Specifically, the other end of the first connecting bridge 54b, the other end of the second connecting bridge 55b, and the other end of the third connecting bridge 56b are connected to the first connecting rib 21b, and one end of the first pin 61b and one end of the second pin 62b are also connected to the first connecting rib 21b, that is, the other end of the first connecting bridge 54b, the other end of the second connecting bridge 55b, and the other end of the third connecting bridge 56b are connected to one end of the first pin 61b and one end of the second pin 62b.

[0104] The first pin and the second pin are set here to connect an external input source and an output source after a photoelectric coupler is subsequently formed, so as to support the photoelectric coupler to work.

[0105] In an optional implementation of this embodiment, a plurality of groups of docking notches are provided on the first lead support and the second lead support, and each group of docking notches is symmetrical in the upper and lower parts.

[0106] Specifically, Figure 5 As shown, a plurality of groups of butt joint notches 71 b are provided on the first lead support 11 b and the second lead support 12 b , and each group of butt joint notches 71 b is symmetrical up and down.

[0107] Specifically, a butt joint notch 71b is provided on the first lead support 11b, and a butt joint notch 71b is provided at a symmetrical position of the second lead support 12b, so as to form a group of butt joint notches 71b.

[0108] Specifically, the number of each group of docking notches 71b is 2-4.

[0109] It should be noted that the docking recess 71b is disposed between two adjacent connecting strips on the lead support.

[0110] In an optional implementation of this embodiment, a plurality of docking holes are provided on the first lead support and the second lead support.

[0111] Specifically, Figure 5 As shown, a plurality of docking holes 72b are provided on the first lead support 11b and the second lead support 12b.

[0112] In an optional implementation of this embodiment, a bend is formed at the connection between each frame unit and the connecting strip where each frame unit is located.

[0113] Specifically, Figure 7 As shown, Figure 7 FIG. 4 shows a schematic side view of the frame unit structure in the second embodiment of the present invention. Figure 7 As shown, a bend is formed at the connection between the frame unit 3b and the connecting strip 2b, and the bending angle α2 is 45°-90°, specifically a value among 45°, 60°, 75°, and 90°, and the bending height h2 is 0.4mm-0.8mm, specifically a value among 0.4mm, 0.5mm, 0.6mm, 0.7mm, and 0.8mm, which is determined according to actual design requirements.

[0114] Here, a bend is formed at the connection between the frame unit and the connecting strip, and a bend angle and a bend height are set to improve the manufacturing efficiency of subsequent photoelectric coupler devices.

[0115] In an optional implementation of this embodiment, the lead frame of the optocoupler is made of one or more alloys of aluminum, iron, and copper.

[0116] In summary, the second embodiment of the present invention provides a lead frame for an optocoupler, wherein the frame unit adopts three base islands arranged in a triangular shape. Different chips can be placed on different base islands and processed in different ways according to the actual requirements of different types of optocouplers for the lead frame structure. Different effects can be achieved by replacing the rib cutting tool and position when cutting ribs and removing waste, so that it meets the lead frame requirements of the corresponding type of optocoupler. There is no need to re-open the mold, and its work fixtures, carriers, and molds can all be shared, thereby maximizing material utilization and mold tool life, effectively reducing costs, shortening product development cycle and investment, ensuring product reliability, and improving production efficiency. It has a broader application prospect.

[0117] Embodiment 3

[0118] Embodiment 3 of the present invention provides a stacking structure of a lead frame of an optocoupler, wherein the stacking structure of the lead frame of the optocoupler comprises a first lead frame and a second lead frame, wherein the first lead frame is the lead frame in Embodiment 1, and the second lead frame is the lead frame in Embodiment 2, wherein the first lead frame and the second lead frame are stacked on each other, and the frame units arranged on the first lead frame are stacked one-to-one with the frame units arranged on the second lead frame.

[0119] In an optional implementation of this embodiment, Figure 8 As shown, Figure 8 A schematic diagram of the overlapping structure of the lead frame of the optocoupler in the third embodiment of the present invention is shown, wherein the first lead frame 81 and the first lead frame 82 are overlapped with each other, and the frame units arranged on the first lead frame 81 are overlapped one-to-one with the frame units arranged on the second lead frame 82, and the first lead frame 81 corresponds one-to-one with the docking holes 72a arranged thereon and the docking holes 72b of the second lead frame 82.

[0120] Specifically, the first base island of the frame unit on the first lead frame 81 overlaps with the first base island of the frame unit on the second lead frame 82, the second base island of the frame unit on the first lead frame 81 overlaps with the second base island of the frame unit on the second lead frame 82, and the third base island of the frame unit on the first lead frame 81 overlaps with the third base island of the frame unit on the second lead frame 82, that is, the light-emitting chip arranged on the base island of the first lead frame 81 and the photosensitive chip arranged on the base island of the second lead frame 82 are arranged opposite to each other.

[0121] In summary, embodiment three of the present invention provides a stacking structure of a lead frame of an optocoupler, wherein the stacking structure of the lead frame of the optocoupler includes a lead frame in embodiment one and a lead frame in embodiment two, and the frame unit adopts three base islands arranged in a triangular shape. Different optocoupler chips can be placed on different base islands according to the actual requirements of different types of optocouplers for the lead frame structure, and different processing methods can be performed. When cutting ribs and removing waste, different effects can be achieved by replacing the rib cutting tool and position to make it meet the lead frame requirements of the corresponding type of optocoupler, without the need to re-open the mold, and its work fixtures, carriers, and molds can all be shared, thereby maximizing material utilization and mold tool life, effectively reducing costs, shortening product development cycle and investment, ensuring product reliability, and improving production efficiency, with a broader application prospect.

[0122] Embodiment 4

[0123] Embodiment 4 of the present invention provides a photoelectric coupler, which includes two frame units arranged opposite to each other, a plurality of photocoupler chips, bonding wires, and a package body. The first frame unit of the two frame units is the frame unit of the lead frame in Embodiment 1, and the second frame unit is the frame unit of the lead frame in Embodiment 2. The functional areas of the two frame units are arranged opposite to each other, and the first base island, the second base island, and the third base island of the two frame units are arranged opposite to each other. The plurality of photocoupler chips and bonding wires are arranged on the two frame units. The package body integrally encapsulates and covers the functional areas, the plurality of photocoupler chips, and the bonding wires of the two frame units. The first pins and the second pins of the two frame units extend out of the package body and are bent toward the same side outside the package body.

[0124] In an optional implementation of this embodiment, Fig. 9 As shown, Fig. 9 The structure schematic diagram of the photoelectric coupler in the fourth embodiment of the present invention is shown, the photoelectric coupler 9 includes a first frame unit 91, a second frame unit 92, a plurality of photocoupler chips, bonding wires, and a package 93, wherein the first frame unit 91 is the frame unit of the lead frame in the first embodiment, the second frame unit 92 is the frame unit of the lead frame in the second embodiment, the functional area of ​​the first frame unit 91 is arranged opposite to the functional area of ​​the second frame unit 92, the first base island of the first frame unit 91 is arranged opposite to the first base island of the second frame unit 92, and the first frame unit 91 is arranged opposite to the first base island of the second frame unit 92. The second base island is arranged opposite to the second base island of the second frame unit 92, the third base island of the first frame unit 91 is arranged opposite to the third base island of the second frame unit 92, the several optocoupler chips and bonding wires are arranged on the first frame unit 91 and the second frame unit 92 according to actual design requirements, the package body 93 integrally encapsulates and covers the functional area of ​​the first frame unit 91, the functional area of ​​the second frame unit 92, the several optocoupler chips, and the bonding wires, and the pins 94 of the first frame unit 91 and the second frame unit 92 extend out of the package body and bend toward the same side outside the package body 93.

[0125] In an optional implementation of this embodiment, types of the photocoupler include a direct current input transistor photocoupler, an alternating current input transistor photocoupler, a thyristor photocoupler, and a photorelay.

[0126] In an optional implementation of this embodiment, Fig.10 As shown, Fig.10The schematic diagram and the stacking diagram of the lead frame structure of the DC input transistor photocoupler in the fourth embodiment of the present invention are shown. A light-emitting chip is placed on the first base island of the first frame unit 91, and a photosensitive chip is placed on the first base island of the second frame unit 92. The light-emitting chip arranged on the first base island of the first frame unit 91 is connected to the bonding wire portion composed of a highly reflective metal layer on the third base island of the first frame unit 91 based on bonding wires, and the photosensitive chip arranged on the first base island of the second frame unit 92 is connected to the bonding wire portion composed of a highly reflective metal layer on the second base island of the second frame unit 92 based on bonding wires. The welding wire parts are connected. When the first frame unit 91 and the second frame unit 92 are superimposed, the light-emitting chip located on the first base island of the first frame unit 91 is opposite to the photosensitive chip located on the first base island of the second frame unit 92. When the ribs are cut and shaped, the connecting part between the first base island and the third base island on the first connecting rib where the first frame unit 91 is located is removed, and the connecting part between the first base island and the second base island on the first connecting rib where the second frame unit 92 is located is removed to prevent short circuit. Then the ribs are cut to form four pins 94, which are packaged and coated to form a DC input transistor photocoupler.

[0127] In an optional implementation of this embodiment, Fig.11 As shown, Fig.11 A schematic diagram and a superimposed schematic diagram of the lead frame structure of the AC input transistor optocoupler in the fourth embodiment of the present invention are shown. A light-emitting chip is placed on the second base island and the third base island of the first frame unit 91, and a photosensitive chip is placed on the first base island of the second frame unit 92. The light-emitting chip arranged on the second base island of the first frame unit 91 is connected to the bonding wire portion composed of a highly reflective metal layer on the third base island of the first frame unit 91 based on bonding wires. The light-emitting chip arranged on the third base island of the first frame unit 91 is connected to the bonding wire portion composed of a highly reflective metal layer on the second base island of the first frame unit 91 based on bonding wires. The photosensitive chip arranged on the first base island of the second frame unit 92 is connected to the bonding wire portion composed of a highly reflective metal layer on the second base island of the first frame unit 91 based on bonding wires. It is connected to the welding wire portion composed of a high-reflective metal layer on the second base island of the second frame unit 92. When the first frame unit 91 and the second frame unit 92 are overlapped, the photosensitive chip on the first base island of the second frame unit 92 is at an equal distance from the light-emitting chips on the second base island and the third base island of the first frame unit 91. When cutting and shaping, the connecting parts between the first base island and the second base island and the first base island and the third base island on the first connecting rib of the first frame unit 91 are removed, and the connecting part between the first base island and the second base island on the first connecting rib of the second frame unit 92 is removed to prevent short circuit, and then the ribs are cut to form four pins 94, which are packaged and coated to form an AC input transistor photocoupler.

[0128] In an optional implementation of this embodiment, Fig.12 As shown, Fig.12 The schematic diagram of the lead frame structure and the stacking diagram of the thyristor photocoupler in the fourth embodiment of the present invention are shown. For thyristor photocouplers with different parameters, the light-emitting chip can be placed at any of the first base island, the second base island or the third base island of the first frame unit 91. Fig.11 In the embodiment, a light-emitting chip is placed on the first base island of the first frame unit 91, and a photosensitive chip is placed on the first base island of the second frame unit 92. The light-emitting chip arranged on the first base island of the first frame unit 91 is connected to the welding wire portion consisting of a high-reflective metal layer on the third base island of the first frame unit 91 based on bonding wires, and the photosensitive chip arranged on the first base island of the second frame unit 92 is connected to the welding wire portions consisting of a high-reflective metal layer on the second base island and the third base island of the second frame unit 92 based on bonding wires. When the first frame unit 91 and the second frame unit 92 are overlapped and rib cutting and shaping is performed, the connecting portion between the first base island and the third base island on the first connecting rib where the first frame unit 91 is located is removed, and the connecting portion between the first base island and the second base island, and the first base island and the third base island on the first connecting rib where the second frame unit 92 is located is removed to prevent short circuit, and then the rib cutting is performed to form four pins 94, and the packaging and coating are performed to form a thyristor photocoupler.

[0129] In an optional implementation of this embodiment, Fig.13 As shown, Fig.13The schematic diagram of the lead frame structure and the stacking diagram of the photorelay in the fourth embodiment of the present invention are shown. A light emitting chip is placed on the first base island of the first frame unit 91, a photosensitive chip is placed on the first base island of the second frame unit 92, and the photosensitive chip is a photoelectric MOSFET chip. A photovoltaic generator PVG (Photovoltaic The photosensitive chip on the first base island of the second frame unit 92 is respectively connected to the photoelectric generator chips on the second base island and the third base island of the second frame unit 92 based on bonding wires. The photosensitive chip on the first base island of the second frame unit 92, the photoelectric generator chips on the second base island and the third base island are all connected to the bonding wires on the first base island of the second frame unit 92 based on bonding wires. When the first frame unit 91 and the second frame unit 92 are superimposed, the light-emitting chip and the photosensitive chip are facing each other. When the ribs are cut and shaped, the connection between the first base island and the third base island on the first connecting rib of the first frame unit 91 is removed, and the connection between the first base island and the second base island, and the connection between the first base island and the third base island on the first connecting rib of the second frame unit 92 is removed to prevent short circuit. Then the ribs are cut to form four pins 94, and the packaging and coating are performed to form a photorelay.

[0130] In an optional implementation of this embodiment, the package body 93 includes an inner package body and an outer package body, the inner package body covers the first frame unit 91, the second frame unit 92, a plurality of optical coupling chips, and bonding wires, and the outer package body covers the inner package body.

[0131] In summary, the fourth embodiment of the present invention provides an optocoupler, which adopts the frame unit of the lead frame in the first and second embodiments, and adopts three base islands arranged in a triangular shape. Different chips can be placed on different base islands according to the actual requirements of different types of optocouplers for the lead frame structure, and different processing methods can be performed. When cutting ribs and removing waste, different effects can be achieved by replacing the rib cutting tool and position to make it meet the lead frame requirements of the corresponding type of optocoupler. There is no need to re-open the mold, and its workpieces, carriers, and molds can all be shared, maximizing material utilization and mold tool life, effectively reducing costs, shortening product development cycle and investment, ensuring product reliability, and improving production efficiency. It has a broader application prospect.

[0132] A person of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc.

[0133] In addition, the embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A lead frame for an optocoupler, characterized in that: The lead frame of the photoelectric coupler includes a first lead support and a second lead support, a plurality of parallel connecting strips are arranged between the first lead support and the second lead support, a plurality of frame units are arranged on any of the connecting strips, and any of the frame units includes a functional area, and the functional area includes a first base island, a second base island, a third base island, a first connecting bridge, a second connecting bridge and a third connecting bridge, the first base island is connected to one end of the first connecting bridge, the second base island is connected to one end of the second connecting bridge, the third base island is connected to one end of the third connecting bridge, the other end of the first connecting bridge, the other end of the second connecting bridge, and the other end of the third connecting bridge are connected to the connecting strip, and the first base island, the second base island and the third base island are arranged in a herringbone shape.

2. The lead frame of the optocoupler according to claim 1, wherein: The first base island is close to the connecting strip, the second base island is located on the upper side of the first base island away from the connecting strip, and the third base island is located on the lower side of the first base island away from the connecting strip. The second base island, the third base island, the second connecting bridge, and the third connecting bridge surround the first base island and the first connecting bridge, and the second base island and the third base island are symmetrically arranged.

3. The lead frame of the optocoupler according to claim 1, wherein: The first base island is far away from the connecting strip, the second base island is located on the upper side of the first base island close to the connecting strip, the third base island is located on the lower side of the first base island close to the connecting strip, the first connecting bridge is sandwiched between the second base island and the third base island, and the second base island and the third base island are symmetrically arranged.

4. The lead frame of the optocoupler according to claim 1, wherein: A chip bonding portion for placing an optical coupling chip is arranged on any base island, and the chip bonding portion is a circular groove or a cross-shaped groove.

5. The lead frame of the optocoupler according to claim 4, characterized in that: The depth of the circular groove or the cross-shaped groove is 0.05mm-0.2mm.

6. The lead frame of the optocoupler according to claim 4, wherein: The diameter of the circular groove is 0.8mm-2mm.

7. The lead frame of the optocoupler according to claim 4, characterized in that: The cross side length of the cross-shaped groove is 0.5mm-2mm.

8. The lead frame of the optocoupler according to claim 4, wherein: A high-reflective metal layer is electroplated on the area of ​​any base island except the chip bonding portion.

9. The lead frame of the optocoupler according to claim 1, wherein: The shortest distance between any two adjacent base islands is 0.2mm-1mm.

10. The lead frame of the optocoupler according to claim 1, wherein: Any one of the connecting strips comprises a first connecting rib, a second connecting rib and a third connecting rib, and the first connecting rib, the second connecting rib and the third connecting rib are parallel to each other; The other end of the first connection bridge, the other end of the second connection bridge, and the other end of the third connection bridge are connected to the first connection rib.

11. The lead frame of the optocoupler according to claim 10, wherein: The frame unit also includes a first pin and a second pin, the first pin and the second pin are perpendicular to the connecting bar, one end of the first pin and one end of the second pin are connected to the first connecting rib and the functional area, and the other end of the first pin and the other end of the second pin are connected to the third connecting rib.

12. The lead frame of the optocoupler according to claim 1, wherein: The first lead support and the second lead support are provided with a plurality of groups of butt joint notches, and each group of butt joint notches is symmetrical in the upper and lower parts.

13. The lead frame of the optocoupler according to claim 1, wherein: The first lead support and the second lead support are provided with a plurality of docking holes.

14. The lead frame of the optocoupler according to claim 1, wherein: A bend is formed at the connection between the connection bar and the first lead support and the second lead support.

15. The lead frame of the optocoupler according to claim 14, wherein: The bending angle formed at the connection between the connecting strip and the first lead support and the second lead support is 45°-90°, and the bending height is 0.15mm-0.3mm.

16. The lead frame of the optocoupler according to claim 1, wherein: A bend is formed at the connection between each frame unit and the connecting strip where each frame unit is located.

17. The lead frame of the optocoupler according to claim 16, wherein: The bending angle formed at the connection between the frame unit and the connecting strip where the frame unit is located is 45°-90°, and the bending height is 0.4mm-0.8mm.

18. The lead frame of the optocoupler according to claim 1, wherein: The lead frame of the photoelectric coupler is made of one or more alloys of aluminum, iron and copper.

19. A stacked structure of a lead frame of an optocoupler, characterized in that: The stacked structure of the lead frame of the optocoupler includes a first lead frame and a second lead frame, wherein the first lead frame and the second lead frame are both lead frames of the optocoupler according to any one of claims 1 to 18, and the first lead frame and the second lead frame are stacked on each other, and the frame units arranged on the first lead frame are stacked one by one with the frame units arranged on the second lead frame.

20. A photoelectric coupler, characterized in that: The optocoupler includes two frame units arranged opposite to each other, a plurality of optocoupler chips, bonding wires, and a packaging body. The two frame units are frame units in the lead frame of the optocoupler described in any one of claims 1 to 18. The functional areas of the two frame units are arranged relatively to each other, and the first base island, the second base island, and the third base island of the two frame units are arranged relatively to each other. The plurality of optocoupler chips and bonding wires are arranged on the two frame units. The packaging body integrally encapsulates and covers the functional areas, the plurality of optocoupler chips, and the bonding wires of the two frame units. The first pin and the second pin of the two frame units extend out of the packaging body and are bent toward the same side outside the packaging body.

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