Electronic device

Abstract

The embodiment of the invention relates to electronic equipment. The electronic equipment comprises a fan, a pipeline and a radiator. The duct includes an upwind plate, a downwind plate, first and second side plates, and a rectifier plate. The duct has an opening portion that opens toward the fan. The upwind plate comprises a first upper plate part and a second upper plate part. The first upper plate portion extends in a first direction from one end of the opening portion. The second upper plate portion is bent from the first upper plate portion toward the heat sink. And the rectifying plate is arranged between the radiator and the upwind plate. The rectifying plate includes a first rectifying portion extending in a first direction, and a first rectifying portion bent from the first rectifying portion toward the heat sink. The downwind plate extends from the other end portion of the opening portion and includes an inclined portion inclined in a direction approaching the first upper plate portion as the downwind plate approaches the heat sink. A space between the inclined portion and the heat sink is open in the third direction.

Description

[0001] Related Applications: This application claims priority based on Japanese Patent Application No. 2023-132964 (filing date: August 17, 2023). This application includes all the contents of the basic application by reference. Technical Field

[0002] An embodiment of the present invention relates to an electronic device. Background Art

[0003] For example, electronic devices include heat-generating electronic components such as CPUs (Central Processing Units). In electronic devices, a heat sink is provided close to the electronic components, and air is blown to the heat sink by a fan, thereby cooling (dissipating heat) the electronic components. Summary of the invention

[0004] The electronic device involved in the embodiment includes a fan, a duct, and a radiator. The duct includes an upper wind deflector, a lower wind deflector, a first side panel and a second side panel connecting the upper wind deflector and the lower wind deflector, and a rectifier. The duct has an opening portion opening toward the fan. The radiator is arranged close to the first electronic component. The upper wind deflector includes a first upper plate portion and a second upper plate portion. The first upper plate portion extends from one end of the opening portion toward the first direction. The second upper plate portion bends from the first upper plate portion toward the radiator. The second upper plate portion includes a wall portion extending along the second direction parallel to the radiator in a second direction perpendicular to the first direction. The rectifier is arranged between the radiator and the upper wind deflector. The rectifier includes a first rectifier portion and a second rectifier portion. The first rectifier portion extends toward the first direction. The second rectifier portion bends from the first rectifier portion toward the radiator. The second rectifier portion includes a portion extending along the second direction parallel to the radiator in the second direction. The downwind plate extends from the other end of the opening portion away from the one end in the second direction. The downwind plate is located between the radiator and the opening portion in the first direction. The downwind plate includes an inclined portion inclined in a direction approaching the first upper plate portion as approaching the radiator. At least a portion of the inclined portion is located between the radiator and the opening portion. The space between the inclined portion and the radiator is open in a third direction perpendicular to the first direction and the second direction. The first side panel and the second side panel are opposed to each other in the third direction. The space between the upwind plate and the downwind plate, and the space between the radiator and the upwind plate are located between the first side panel and the second side panel.

[0005] According to this embodiment, it is possible to provide an electronic device capable of improving cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 It is a schematic plan view illustrating an electronic device according to an embodiment.

[0007] Figure 2 It is a schematic cross-sectional view illustrating an electronic device according to an embodiment.

[0008] Figure 3 It is a schematic perspective view illustrating a fan and a duct of an electronic device according to an embodiment.

[0009] Figure 4 It is a schematic cross-sectional view illustrating a fan, a duct, and a heat sink of an electronic device according to an embodiment.

[0010] Figure 5 This is a schematic perspective view illustrating a duct of an electronic device according to an embodiment.

[0011] Figure 6 This is a schematic perspective view illustrating a duct of an electronic device according to an embodiment.

[0012] Figure 7 This is a schematic perspective view illustrating a duct of an electronic device according to an embodiment.

[0013] Figure 8 This is a schematic cross-sectional view illustrating the flow of air in a duct of the electronic device according to the embodiment.

[0014] Fig. 9 It is a schematic plan view illustrating a portion of an electronic device according to an embodiment.

[0015] Description of Reference Numerals

[0016] 10: Fan

[0017] 30: Pipeline

[0018] 31: Opening

[0019] 31p: one end

[0020] 31q: The other end

[0021] 32: Upwind plate

[0022] 33: Downwind board

[0023] 34: Rectifier

[0024] 35: First side panel

[0025] 36: Second side panel

[0026] 37, 38, 39: Opening

[0027] 40: Radiator

[0028] 40a: Front section

[0029] 40b: rear section

[0030] 40c: Central

[0031] 41: Base

[0032] 42: Fins

[0033] 51: First electronic component

[0034] 52: Second electronic component

[0035] 53: Power supply unit

[0036] 54: Expansion card holder

[0037] 55: Expansion card installation area

[0038] 56: Substrate

[0039] 57: Memory

[0040] 80: Shell

[0041] 80b: rear surface

[0042] 80f: front surface

[0043] 80s, 80t: Side

[0044] 80t: Side

[0045] 100: Electronic devices

[0046] 311: Inclined part

[0047] 321: First upper plate

[0048] 321e: End

[0049] 322: Second upper plate

[0050] 322w: Wall

[0051] 331: Inclined part

[0052] 331e: Backend

[0053] 331f: Front end

[0054] 341: First rectifier

[0055] 341e: End

[0056] 342: Second rectifier

[0057] 342w: Wall

[0058] 351: Inclined plate

[0059] 352: Board

[0060] 361, 361a, 361b: side holes

[0061] G1: Clearance

[0062] P1, P2: Location

[0063] SP1, SP2, SP3: Space DETAILED DESCRIPTION

[0064] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0065] In the present specification and each drawing, the same elements as those already described are denoted by the same reference numerals, and detailed description thereof will be appropriately omitted.

[0066] Figure 1 It is a schematic plan view illustrating an electronic device according to an embodiment.

[0067] Figure 2 It is a schematic cross-sectional view illustrating an electronic device according to an embodiment.

[0068] Figure 2 express Figure 1 The cross section of the A1-A2 line.

[0069] The electronic device 100 according to the embodiment includes a substantially cubic housing 80 . Figure 1 The inside of the housing 80 is shown. The electronic device 100 is, for example, an electronic computing device such as an industrial computer.

[0070] like Figure 1 As shown, a fan 10, a duct 30 (air duct), a radiator 40, a first electronic component 51, a second electronic component 52, a power supply unit 53, and an expansion card holder 54 are provided in a housing 80 of the electronic device 100. These are fixed directly or indirectly to the housing 80 by a fixing mechanism such as screws. In addition, a substrate 56 and a memory 57 are provided in the housing 80.

[0071] The housing 80 has a front surface 80f and a rear surface 80b on the opposite side to the front surface 80f. The housing 80 has a side surface 80s and a side surface 80t connecting the front surface 80f and the rear surface 80b.

[0072] The fan 10 is provided on the front surface 80f side of the housing 80. The fan 10 is, for example, an axial flow fan. The fan 10 sends air sucked from the outside of the housing 80 through an air inlet of the front surface 80f into the housing 80 such as the duct 30.

[0073] The duct 30 is provided at a position closer to the rear surface 80b than the fan 10. The duct 30 sends the air sent from the fan 10 to the radiator 40, for example.

[0074] The radiator 40 is arranged closer to the rear surface 80b than a part of the duct 30. The front part 40a of the radiator 40 vertically overlaps the duct 30. The rear part 40b of the radiator 40 does not vertically overlap the duct 30.

[0075] The heat sink 40 is disposed close to the first electronic component 51. The first electronic component 51 is, for example, a CPU and serves as a heat source. The first electronic component 51 is disposed substantially below the center of the heat sink 40. The heat sink 40 dissipates the heat of the first electronic component 51.

[0076] like Figure 1 As shown in FIG. 1 , in this example, the planar shape of the heat sink 40 is a rectangular shape. Figure 2 As shown, in this example, the heat sink 40 has a plate-like base 41 and a plurality of fins 42. The base 41 is provided on the first electronic component 51, and the plurality of fins 42 extend upward from the upper surface of the base 41. The fins 42 are plate-like and extend in the front-rear direction, for example.

[0077] like Figure 1 As shown, the second electronic component 52 is disposed on the side surface 80t side relative to the duct 30 and the heat sink 40. The second electronic component 52 is, for example, a HDD (hard disk drive), and serves as a heat source.

[0078] The expansion card holder 54 is provided on the rear surface 80b side of the heat sink 40. An expansion card mounting area 55 is provided between the expansion card holder 54 and the heat sink 40.

[0079] The power supply unit 53 is disposed on the side surface 80t side of the expansion card mounting area 55 and on the rear surface 80b side of the second electronic component 52. The substrate 56 (e.g., RAID substrate) and the memory 57 are disposed, for example, on the side surface 80s side of the heat sink 40 and on the rear surface 80b side of the duct 30.

[0080] Figure 3 It is a schematic perspective view illustrating a fan and a duct of an electronic device according to an embodiment.

[0081] Figure 4It is a schematic cross-sectional view illustrating a fan, a duct, and a heat sink of an electronic device according to an embodiment. Figure 4 Corresponds to Figure 3 A3-A4 line section.

[0082] Figure 5 to Figure 7 This is a schematic perspective view illustrating a duct of an electronic device according to an embodiment.

[0083] For example Figures 4 to 6 As shown in FIG. 1 , the duct 30 has an opening 31 that opens toward the fan 10. The fan 10 blows air into the duct 30 from the opening 31. Figure 4 As shown in FIG. 1 , the duct 30 has an upper wind deflector 32, a lower wind deflector 33, and a straightening plate 34. Figure 5 , Figure 6 As shown, the duct 30 has a first side panel 35 and a second side panel 36. The opening 31 is formed by the upper wind deflector 32, the lower wind deflector 33, the first side panel 35, and the front end of the second side panel 36, and has a substantially rectangular shape.

[0084] like Figure 4 As shown, the upper air directing plate 32 includes a first upper plate portion 321 and a second upper plate portion 322. The first upper plate portion 321 extends from one end portion 31p of the opening portion 31 in the first direction D1.

[0085] In the description of the embodiment, the direction perpendicular to the first direction D1 is set as the second direction D2, and the direction perpendicular to the first direction D1 and the second direction D2 is set as the third direction D3. In addition, for the convenience of description, the direction from the fan 10 toward the duct 30 or the radiator 40 is referred to as the "rear", and the opposite direction of the rear is referred to as the "front". The rear is, for example, the air supply direction of the fan 10. The front is, for example, the opening direction of the opening portion 31 of the duct 30. The first direction D1 is a direction along the front-to-back direction (for example, a direction parallel to the front-to-back direction). In addition, the direction from the downwind plate 33 or the radiator 40 toward the upwind plate 32 is set as "above", and the opposite direction of the above is set as "below". The second direction D2 is a direction along the up-down direction (for example, a direction parallel to the up-down direction).

[0086] The second upper plate portion 322 extends in a curved manner from the end 321e (the end opposite to the opening portion 31) of the first upper plate portion 321 toward the heat sink 40. The second upper plate portion 322 has a wall portion 322w at its lower end. The wall portion 322w extends in the second direction D2 in parallel with the heat sink 40.

[0087] An opening 39 is provided on the rear surface of the duct 30 below the wall 322w. The radiator 40 is disposed at the opening 39. More specifically, the front portion of the radiator 40 is disposed inside the duct 30 at the front from the opening 39, and the rear portion of the radiator 40 is disposed outside the duct 30 at the rear from the opening 39. A portion of the air sent from the opening 31 to the duct 30 can flow to the outside from the opening 39.

[0088] The rectifying plate 34 is disposed between the radiator 40 and the upper wind deflector 32. The rectifying plate 34 includes a first rectifying portion 341 and a second rectifying portion 342. For example, the first rectifying portion 341 extends along the first direction D1 between the radiator 40 and a portion of the first upper plate portion 321 and between the radiator 40 and a portion of the second upper plate portion 322.

[0089] The second rectifying portion 342 extends in a curved manner from the end 341e (the end opposite to the opening 31) of the first rectifying portion 341 toward the heat sink 40. The second rectifying portion 342 has a wall portion 342w at its lower end. The wall portion 342w extends in the second direction D2 in parallel with the heat sink 40.

[0090] The region between the wall portions 342w and 322w overlaps with, for example, the center in the first direction D1 of the heat sink 40. For example, the region between the wall portions 342w and 322w overlaps with the heat source (first electronic component) in the second direction D2.

[0091] The heat sink 40 is arranged in parallel with the opening 31 in the first direction D1. In this example, the heat sink 40 is located below the one end 31p of the opening 31 and above the other end 31q of the opening 31. The other end 31q is an end away from the one end 31p in the second direction D2.

[0092] The downwind plate 33 extends from the other end 31q of the opening 31 of the duct 30. The downwind plate 33 is located between the radiator 40 and the opening 31 (or the fan 10) in the first direction D1. In other words, the position of the downwind plate 33 in the first direction D1 is between the position of the radiator 40 in the first direction D1 and the position of the opening 31 (or the fan 10) in the first direction D1.

[0093] The rear side of the leeward plate 33 forms an inclined portion 331. The inclined portion 331 is inclined toward the first upper plate portion 321 as it approaches the radiator 40. In other words, the inclined portion 331 is a plate-shaped portion that is inclined upward toward the rear.

[0094] At least a portion of the inclined portion 331 is located between the heat sink 40 and the opening 31 (or the fan 10). In this example, the front end 331f of the inclined portion 331 is located below the heat sink 40. The rear end 331e of the inclined portion 331 is aligned with the fin 42 in the first direction D1 and is located below the upper end of the fin 42. Figure 4 As shown, the first rectifying portion 341 is located in the second direction D2 between the rear end 331 e (end on the heat sink 40 side) of the inclined portion 331 and the first upper plate portion 321 in the second direction D2.

[0095] A space SP3 is formed between the heat sink 40 and the inclined portion 331 . The space SP3 is located behind the inclined portion 331 and in front of the heat sink 40 .

[0096] like Figure 5 as well as Figure 6 As shown, the upwind plate 32 and the downwind plate 33 extend along the third direction D3. The first side panel 35 and the second side panel 36 extend rearward from the opening 31 of the duct 30. The first side panel 35 and the second side panel 36 face each other in the third direction D3.

[0097] The first side panel 35 connects one end of the wind deflector 32 and one end of the wind deflector 33. The second side panel 36 connects the other end of the wind deflector 32 and the other end of the wind deflector 33.

[0098] The space SP1 between the upper wind deflector 32 and the lower wind deflector 33 and the space SP2 between the radiator 40 and the upper wind deflector 32 are located between the first side panel 35 and the second side panel 36 .

[0099] like Figure 5 as well as Figure 7 As shown in FIG. 1 , the first side panel 35 and the second side panel 36 do not cover the side of the space SP3. The space SP3 is open to the third direction D3. In other words, an opening 37 (see FIG. 1 ) located on the side of the space SP3 and communicating with the space SP3 is provided on the side of the duct 30. Figure 7 ) and the opening 38 (see Figure 5 A portion of the air sent into the duct 30 from the opening 31 can flow to the outside from the opening 37 and the opening 38.

[0100] For example Figure 5 (or Figure 3), the second side panel 36 has one or more side holes 361 (side hole 361a and side hole 361b). The side hole 361 penetrates the second side panel 36 along the third direction D3. The side hole 361a is located above the inclined portion 311. The side hole 361a is located on the side of the space SP1. The side hole 361b is located behind the inclined portion 331. The side hole 361b is located, for example, on the side of the heat sink 40 or the space SP2.

[0101] like Figure 4 As shown in the figure, a gap G1 is provided between the end (rear end 331e) of the inclined portion 331 on the heat sink 40 side and the front end of the first rectifying portion 341. That is, the space SP2 is divided into a portion located above the first rectifying portion 341 and continuous with the space SP1, and a portion located below the first rectifying portion 341 and continuous with the space SP1.

[0102] Figure 8 This is a schematic cross-sectional view illustrating the flow of air in a duct of the electronic device according to the embodiment.

[0103] Figure 8 Based on the flow rate analysis simulation, Figure 8 The arrows in the figure indicate the direction of air flow. When the fan 10 is operated, the fan 10 sends air from the opening 31 into the duct 30 .

[0104] The air taken in from the opening 31 flows from the space SP1 to the space SP2. For example, in the upper part of the space SP1, the air flows backward along the first upper plate portion 321 of the upper wind deflector 32. Also, for example, in the lower part of the space SP1, the air rises upward along the inclination of the inclined portion 331 of the lower wind deflector 33.

[0105] Of the air flowing from the space SP1 to the space SP2 , the air flowing into the space SP2 above the rectifying plate 34 flows downward along the second upper plate portion 322 and the second rectifying portion 342 , and contacts the central portion 40 c of the heat sink 40 from above.

[0106] Of the air flowing from the space SP1 to the space SP2 , the air flowing into the space SP2 below the rectifying plate 34 flows downward through the second rectifying portion 342 , and contacts the radiator 40 from above the radiator 40 , in front of the central portion 40 c .

[0107] A portion of the air that has hit the radiator 40 from above flows rearward over the radiator 40 , and flows rearward of the duct 30 from the opening 39 provided at the rear of the duct 30 .

[0108] Another part of the air that contacts the heat sink 40 from above flows forward on the heat sink 40 and flows to the space SP3 behind and below the inclined portion 331. The air that flows into the space SP3 flows from, for example, the opening 37 (see FIG. 1 ) on the side of the space SP3. Figure 7 ) or opening 38 (see Figure 5 ) flows to the side of the pipe.

[0109] For example, consider a reference example in which wind contacts the radiator from the front of the radiator. In this case, the wind flows from the front end to the rear end of the radiator. Here, on the radiator, the flow resistance is high due to pressure loss caused by fins, for example, so the flow velocity of the wind is sometimes reduced.

[0110] In addition, in the radiator, the temperature is highest at the base portion receiving heat from the heat source, and the temperature decreases from the root of the fin toward the tip of the fin. Here, in the reference example where the wind contacts the radiator from the front, the wind contacts mainly the tip and root of the fin. At the base portion where the temperature is the highest, the wind sometimes contacts only the end surface.

[0111] On the other hand, in the embodiment, as described above, the upper wind deflector 32 has the first upper plate portion 321 and the second upper plate portion 322. In addition, the rectifying plate 34 has the first rectifying portion 341 and the second rectifying portion 342. Figure 8 As described above, the wind can be brought into contact with the radiator 40 from above. Here, since the downwind plate 33 has an inclined portion 331, the wind can be sent upward at one time. Thus, the air can be brought into contact with the radiator 40 from above efficiently. In addition, since the rectifying plate 34 is located between the radiator 40 and the upwind plate 32, the generation of vortex can be suppressed. When the wind is brought into contact with the radiator 40 from above, for example, the wind is sent from the center of the upper surface of the radiator 40 toward the base 41. Thus, for example, the cooling efficiency can be improved. Moreover, the wind that has come into contact with the radiator 40 from above flows, for example, to the front or rear. For example, compared with the reference example in which the wind flows from the front end to the rear end of the radiator 40, the wind on the radiator is exhausted from both the front and rear sides of the radiator 40, thereby increasing the area where the wind is exhausted. Moreover, the distance that the wind flows on the radiator 40 becomes shorter, so the flow path resistance can be reduced. Thus, for example, the flow velocity can be suppressed from decreasing and the cooling efficiency can be improved. In addition, the space SP3 between the inclined portion 331 and the radiator 40 is open in the third direction D3. Therefore, the air flowing forward on the radiator 40 and flowing into the space SP3 can flow to the outside of the duct from the side of the space SP3. As a result, the flow resistance of the air flowing forward on the radiator 40 and exhausted can be reduced. The flow velocity can be suppressed and the cooling efficiency can be further improved. In addition, in the case where the gap G1 ( Figure 4), the wind can contact a wider range of the radiator 40 from above through the gap G1.

[0112] For example, industrial computers and other industrial-use devices are based on the premise of 24-hour 365-day operation. In order to shorten the downtime of the assembled system, maintenance is required to be shorter. Therefore, the CPU cooling fan, which is a consumable, is used in the following manner: it is arranged on the front surface of the main body for easy replacement, and blows air to the heating element and the radiator. The CPU is in a trend of increasing heat generation as its performance increases. For example, when the CPU reaches a high temperature, the safety circuit is activated and the performance is reduced, so sufficient cooling is desired. In addition, for example, other devices, ICs, etc. are also preferably cooled sufficiently in order to extend their life.

[0113] When the fan is arranged on the front surface of the main body, the cooling air becomes difficult to flow due to the flow resistance between the fins of the radiator. In particular, when the spacing between the fins is narrow, the cooling performance is sometimes reduced. In the past, an air duct was used to form a flow path for sending air to the front of the radiator (the surface perpendicular to the fins), and the flow path was throttled in the middle, thereby increasing the wind speed and improving the cooling performance. However, in the method of conveying cooling air from the front of the radiator through the air duct, as described above, most of the air contacts the front end of the fin and the root of the fin, and only the end surface of the base with the highest temperature contacts the air.

[0114] In contrast, in the embodiment, the cooling air is brought into contact with the radiator 40 from above through the duct 30, thereby sending high-speed cooling air to the heating element. In addition, the air is exhausted not only from the rear of the duct but also from the front surface side and the side bottom to reduce the flow resistance, thereby improving the cooling efficiency. For example, it is possible to take into account the front surface installation of the fan and the structure of sufficiently cooling the CPU.

[0115] Fig. 9 It is a schematic plan view illustrating a portion of an electronic device according to an embodiment.

[0116] Fig. 9 The arrows in the diagram indicate the direction of air flow.

[0117] like Fig. 9 As shown, the second electronic component 52 and the duct 30 are arranged side by side in the third direction D3 when viewed from above. The second side panel 36 is between the second electronic component 52 and the first side panel 35 in the third direction D3.

[0118] The second side panel 36 extends in the first direction D1. The first side panel 35 has an inclined plate portion 351 and a plate portion 352. The inclined plate portion 351 is inclined toward the second side panel 36 as it approaches the heat sink 40. The plate portion 352 extends from the rear end of the inclined plate portion 351 toward the first direction D1.

[0119] The center of the fan 10 is offset relative to the center of the heat sink 40 (or the first electronic component 51). That is, the position P1 of the center of the heat sink 40 (or the first electronic component 51) in the third direction D3 is between the position P2 of the center of the fan 10 in the third direction D3 and the position of the second side panel 36 in the third direction D3.

[0120] The flow direction of a portion of the air sent from the opening 31 to the duct 30 by the fan 10 changes from the first direction D1 to a direction inclined more toward the second side panel 36 than the first direction D1 due to the inclined plate portion 351. A portion of the air flowing toward the second side panel 36 can pass through the side holes 361 (see FIG. Figure 5 ) flows toward the second electronic component 52. Thus, the second electronic component 52 can be cooled.

[0121] For example, the oil in the bearing of the HDD (second electronic component 52) ​​may evaporate due to heat, shortening its life. In contrast, according to the embodiment, the HDD arranged in parallel with the CPU can be efficiently cooled. The inclined plate portion 351 throttles the flow path in the duct 30, increases the pressure inside the duct, and increases the wind speed from the side hole 361.

[0122] The embodiment may include the following configurations.

[0123] (Composition 1)

[0124] An electronic device comprising:

[0125] fan;

[0126] A duct including an upper wind deflector plate, a lower wind deflector plate, a first side panel and a second side panel connecting the upper wind deflector plate and the lower wind deflector plate, and a rectifying plate, and having an opening portion opening toward the fan; and

[0127] a heat sink disposed close to the first electronic component,

[0128] The upwind plate comprises:

[0129] A first upper plate portion extending from one end of the opening portion in a first direction; and

[0130] A second upper plate portion is bent from the first upper plate portion toward the heat sink and includes a wall portion extending in a second direction perpendicular to the first direction and parallel to the heat sink along the second direction.

[0131] The rectifying plate is arranged between the radiator and the upwind plate.

[0132] The rectifier plate comprises:

[0133] A first rectifying portion extending along the first direction; and

[0134] a second rectifying portion, bent from the first rectifying portion toward the heat sink, including a portion extending along the second direction in parallel with the heat sink in the second direction,

[0135] The downwind plate extends from the other end of the opening portion away from the one end in the second direction, is located between the radiator and the opening portion in the first direction, and includes an inclined portion that is inclined toward the first upper plate portion as it approaches the radiator.

[0136] At least a portion of the inclined portion is located between the heat sink and the opening.

[0137] The space between the inclined portion and the heat sink is open to a third direction perpendicular to the first direction and the second direction.

[0138] The first side panel and the second side panel are opposite to each other in the third direction,

[0139] The space between the upper wind deflector plate and the lower wind deflector plate, and the space between the radiator and the upper wind deflector plate, are located between the first side panel and the second side panel.

[0140] (Composition 2)

[0141] The electronic device as described in configuration 1, wherein:

[0142] The position of the first rectifying portion in the second direction is between the position of the end of the inclined portion on the heat sink side in the second direction and the position of the first upper plate portion in the second direction.

[0143] A gap is provided between the end portion of the inclined portion on the heat sink side and the first rectifying portion.

[0144] (Composition 3)

[0145] An electronic device as described in configuration 1 or 2, wherein:

[0146] further comprising a second electronic component arranged side by side with the duct in the third direction when viewed from above,

[0147] The second side panel has a side hole located between the first side panel and the second electronic component in the third direction and penetrating the second side panel in the third direction.

[0148] The center of the radiator is located in the third direction, and the center of the fan is located in the third direction between the second side panel and the second side panel.

[0149] The first side panel has an inclined plate portion that is inclined in a direction approaching the second side panel as it approaches the heat sink from the opening.

[0150] According to the embodiment, it is possible to provide an electronic device capable of improving cooling efficiency.

[0151] In the present specification, “perpendicular” and “parallel” include not only strict perpendicularity and strict parallelism, but also include, for example, variations in the manufacturing process, as long as they are substantially perpendicular and substantially parallel.

[0152] Several embodiments of the present invention are illustrated above, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the main purpose of the invention. These embodiments and their modifications are included in the scope and main purpose of the invention, and are included in the invention recorded in the scope of the patent claim and its equivalent scope. In addition, the above-mentioned embodiments can be implemented in combination with each other.

Claims

1. An electronic device comprising: fan; The duct includes an upper wind deflector plate, a lower wind deflector plate, a first side panel and a second side panel connecting the upper wind deflector plate and the lower wind deflector plate, and a rectifying plate, and has an opening portion opening toward the fan; as well as a heat sink disposed close to the first electronic component, The upwind plate comprises: A first upper plate portion extending from one end of the opening portion in a first direction; and A second upper plate portion is bent from the first upper plate portion toward the heat sink and includes a wall portion extending in a second direction perpendicular to the first direction and parallel to the heat sink along the second direction. The rectifying plate is arranged between the radiator and the upwind plate. The rectifier plate comprises: A first rectifying portion extending along the first direction; and a second rectifying portion, bent from the first rectifying portion toward the heat sink, including a portion extending along the second direction in parallel with the heat sink in the second direction, The downwind plate extends from the other end of the opening portion away from the one end in the second direction, is located between the radiator and the opening portion in the first direction, and includes an inclined portion that is inclined toward the first upper plate portion as it approaches the radiator. At least a portion of the inclined portion is located between the heat sink and the opening. The space between the inclined portion and the heat sink is open to a third direction perpendicular to the first direction and the second direction. The first side panel and the second side panel are opposite to each other in the third direction, The space between the upper wind deflector plate and the lower wind deflector plate, and the space between the radiator and the upper wind deflector plate, are located between the first side panel and the second side panel.

2. The electronic device according to claim 1, wherein: The position of the first rectifying portion in the second direction is between the position of the end of the inclined portion on the heat sink side in the second direction and the position of the first upper plate portion in the second direction. A gap is provided between the end portion of the inclined portion on the heat sink side and the first rectifying portion.

3. The electronic device according to claim 1 or 2, wherein: further comprising a second electronic component arranged side by side with the duct in the third direction when viewed from above, The second side panel has a side hole located between the first side panel and the second electronic component in the third direction and penetrating the second side panel in the third direction. The center of the radiator is located in the third direction, and the center of the fan is located in the third direction between the second side panel and the second side panel. The first side panel has an inclined plate portion that is inclined in a direction approaching the second side panel as it approaches the heat sink from the opening.

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