Partitioned laser-assisted bonding system

Abstract

The invention discloses a partitioned laser-assisted bonding system, and the system comprises a light source assembly which is used for emitting light; the light emitting ends of the light guide parts are arranged in a two-dimensional array mode, and emergent light of the light source assembly enters the light guide parts and is emitted from the light emitting ends of the light guide parts after being transmitted; the emergent light of the at least one light guide part is incident to the optical assembly, and is projected after passing through the optical assembly; the light control assembly is used for controlling whether the light source assembly emits light to any one of the at least one light guide piece or not, so that the light source assembly emits light to the selected light guide piece; or the light control assembly is used for controlling whether any one of the at least one light guide piece emits light or not, so that the selected light guide piece emits light, the light spots formed by the light beams projected by the optical assembly are matched with the to-be-bonded core particles, and the arrangement shape of the light emitting ends of the selected light guide piece is matched with the to-be-bonded core particles. According to the partitioned laser-assisted bonding system, the light spot corresponding to the projected light beam can be adjusted more flexibly, and the flexibility and the efficiency are higher.

Description

Technical Field

[0001] The invention relates to the field of laser application, and in particular to a partitioned laser assisted bonding system. Background Art

[0002] As the wafer foundry process continues to shrink and Moore's Law approaches its limit, advanced packaging is an inevitable choice in the post-Moore era. One of the important technologies of advanced packaging is flip chip. There are three bonding packaging technologies for flip chip solder balls: Mass Reflow, Thermo Compression Bonding (TCB) and Laser Assisted Bonding (LAB). Currently, laser-assisted bonding usually uses a single laser, uses a microlens array to homogenize the beam, and uses some optical elements to shape the beam into the spot shape and size required for bonding, such as using a cylindrical lens or an ordinary lens. However, in this laser-assisted bonding solution, the adjustment range of the shape and size of the spot is relatively fixed, the adjustment range is limited, and the flexibility is insufficient. Summary of the invention

[0003] The object of the present invention is to provide a partitioned laser-assisted bonding system, which can more flexibly adjust the corresponding light spot of the light beam projected onto the core particles to be bonded, and has higher flexibility and efficiency.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A laser-assisted bonding system, comprising:

[0006] A light source assembly, for emitting light;

[0007] At least one light guide is disposed on the light emitting side of the light source assembly and the light emitting end of the at least one light guide is arranged in a two-dimensional array, so that the emitted light of the light source assembly is incident on the light guide, is conducted by the light guide and is emitted from the light emitting end of the light guide;

[0008] An optical component is arranged on the light-emitting side of the at least one light guide, so that the outgoing light of the at least one light guide is incident on the optical component and is projected out after passing through the optical component;

[0009] a light control component, the light control component being connected to the light source component and used for controlling whether the light source component injects light into any of the at least one light guide, so that the light source component injects light into a selected light guide of the at least one light guide, so that the selected light guide of the at least one light guide emits light, and a light spot formed by the light beam projected by the optical component matches the core particle to be bonded;

[0010] Alternatively, the optical control component is connected to the at least one light guide and is used to control whether any of the at least one light guide emits light, so that the selected light guide of the at least one light guide emits light, and the light spot formed by the light beam projected by the optical component matches the core particle to be bonded;

[0011] Wherein, the arrangement shape of the light-emitting end of the selected light guide element matches the core particles to be bonded.

[0012] Optionally, the arrangement shape of the light-emitting ends of the selected light guides matches the shape of the core particles to be bonded.

[0013] Optionally, the number of the selected light guides is such that the size of the light spot formed by the light beam projected through the optical component matches the size of the core particle to be bonded.

[0014] Optionally, the light source assembly includes at least one light source, the light source is used to emit light, and the light guide of the at least one light guide is arranged in one-to-one correspondence with the light source of the at least one light source, so that the emitted light of the light source is incident on the corresponding light guide, is conducted by the corresponding light guide and is emitted from the light emitting end of the light guide;

[0015] The light control component includes at least one light control member, and the light control member of the at least one light control member is connected to the light source of the at least one light source in a one-to-one correspondence. The light control member is used to control whether the corresponding light source emits light, so as to control whether the light source incidents light to the corresponding light guide member.

[0016] Optionally, there are a plurality of core particles to be bonded on the carrier;

[0017] A plurality of groups of selected light guides are selected from the at least one light guide, the plurality of groups of selected light guides correspond one-to-one to the plurality of core particles to be bonded, and the arrangement shape of the light output end of any group of selected light guides matches the corresponding core particles to be bonded, so that the light beam projected after the output light of any group of selected light guides passes through the optical component is projected onto the corresponding core particles to be bonded, and the light spot formed by the light beam projected after the output light of any group of selected light guides passes through the optical component matches the corresponding core particles to be bonded.

[0018] Optionally, the arrangement shape of the light-emitting ends of any group of selected light guide members matches the shape of the corresponding core particles to be bonded;

[0019] Or / and, the number of the selected light guides included in any one group of selected light guides satisfies the requirement that a light spot formed by a light beam projected after the outgoing light of the any one group of selected light guides passes through the optical component matches the size of the corresponding core particle to be bonded.

[0020] Optionally, the light source assembly includes at least one light source, the light source is used to emit light, and the light guide of the at least one light guide is arranged in one-to-one correspondence with the light source of the at least one light source, so that the emitted light of the light source is incident on the corresponding light guide, is conducted by the corresponding light guide and is emitted from the light emitting end of the light guide;

[0021] In the two-dimensional array formed by the light emitting ends of the selected light guides, the emitted light power of the light sources corresponding to the selected light guides at the edge of the two-dimensional array is greater than the emitted light power of the light sources corresponding to the selected light guides inside the two-dimensional array.

[0022] Optionally, a pressure component is also included, which includes a pressure piece and a pressure sensor. The pressure piece is arranged on the side of the core to be bonded close to the optical component, and is used to apply pressure to the core to be bonded and make the light beam projected by the optical component pass through the pressure piece and projected onto the core to be bonded. The pressure sensor is used to measure the pressure applied by the pressure piece to the core to be bonded.

[0023] Optionally, a temperature measuring component is also included, which includes a temperature sensor and a feedback controller. The temperature sensor is arranged on one side of the optical component and is used to measure the temperature of the position of the core particle to be bonded when the light beam projected by the optical component irradiates the core particle to be bonded. The feedback controller is connected to the light source component and is used to control the output light power of the light source component according to the temperature signal returned by the temperature sensor.

[0024] Optionally, it also includes:

[0025] A camera device, disposed on one side of the optical component, for acquiring an image of the core particle to be bonded;

[0026] An observation device, connected to the camera device, for displaying the acquired image of the core particle to be bonded, so as to monitor the working condition of the bonding area of ​​the core particle to be bonded;

[0027] An alignment device is connected to the camera device and is used to control the movement of the core particle to be bonded according to the acquired image of the core particle to be bonded, so that the light beam projected by the optical component is projected onto the core particle to be bonded.

[0028] It can be seen from the above technical scheme that a partitioned laser assisted bonding system provided by the present invention includes: a light source assembly for emitting light; at least one light guide, which is arranged on the light emitting side of the light source assembly and the light emitting end of the at least one light guide is arranged in a two-dimensional array, so that the emitted light of the light source assembly is incident on the light guide, is conducted by the light guide and is emitted from the light emitting end of the light guide; an optical assembly, which is arranged on the light emitting side of the at least one light guide, so that the emitted light of the at least one light guide is incident on the optical assembly and is projected after passing through the optical assembly; a light control assembly is connected to the light source assembly and is used to control the light source assembly to emit light to the at least one light guide. Whether any light guide in the at least one light guide emits light, so that the light source component emits light to the selected light guide in the at least one light guide, so that the selected light guide in the at least one light guide emits light, and the light spot formed by the light beam projected by the optical component matches the core grain to be bonded; or, the light control component is connected to the at least one light guide, and is used to control whether any light guide in the at least one light guide emits light, so that the selected light guide in the at least one light guide emits light, and the light spot formed by the light beam projected by the optical component matches the core grain to be bonded; wherein, the arrangement shape of the light output end of the selected light guide matches the core grain to be bonded.

[0029] The partitioned laser-assisted bonding system of the present invention is provided with at least one light guide and its light output end is arranged in a two-dimensional array. The light output of the light guide can be controlled by partitioning, and a selected light guide is selected from the light guide according to the core particles to be bonded, so that the arrangement shape of the light output end of the selected light guide matches the core particles to be bonded, and the light spot formed by the light beam projected after the output light of the selected light guide passes through the optical component matches the core particles to be bonded. Compared with the existing laser-assisted bonding scheme, the partitioned laser-assisted bonding system of the present invention can more flexibly adjust the light spot corresponding to the projected light beam, and has higher flexibility and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] FIG1 is a schematic diagram of a partitioned laser-assisted bonding system provided by an embodiment of the present invention;

[0032] FIG2 is a schematic diagram of the arrangement of optical fiber light-emitting ends of an optical fiber array of a partitioned laser-assisted bonding system provided by an embodiment of the present invention;

[0033] FIG3 is a schematic diagram of a core particle to be bonded and a carrier board to which a partitioned laser-assisted bonding system is applied provided by an embodiment of the present invention;

[0034] FIG4 is a schematic diagram of bonding between the core particle to be bonded and the carrier shown in FIG3 ;

[0035] FIG5 is a schematic diagram of a partitioned laser-assisted bonding system provided by yet another embodiment of the present invention;

[0036] FIG6 is a schematic diagram of a partitioned laser-assisted bonding system provided by an embodiment of the present invention being applied to bonding two core particles to be bonded to the same carrier;

[0037] FIG7 is a top view of bonding two core particles to be bonded to a carrier shown in FIG6 ;

[0038] FIG8 is a schematic diagram of a partitioned laser-assisted bonding system provided by yet another embodiment of the present invention.

[0039] The reference numerals in the drawings of the specification include:

[0040] 101-light control element, 102-light source, 103-fiber coupler, 104-optical fiber, 105-optical component, 106-third carrier, 110-first group of optical fibers, 111-second group of optical fibers, 112-first output light beam, 113-second output light beam;

[0041] 201 - first core particle to be bonded, 202 - second core particle to be bonded, 203 - bare chip, 204 - copper pillar, 205 - solder ball, 206 - non-conductive film, 207 - carrier;

[0042] 301-loading and unloading device, 302-patch control device, 303-human-machine interface, 304-bonding control device, 305-suction and flipping component, 306-first camera and alignment device, 307-suction and patch component, 308-glue dipping component, 309-second camera and alignment device, 310-third camera and alignment device, 311-temperature measurement component, 312-first carrying platform, 313-second carrying platform, 314-transmission device. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0044] This embodiment provides a partitioned laser assisted bonding system, including:

[0045] A light source assembly, for emitting light;

[0046] At least one light guide is disposed on the light emitting side of the light source assembly and the light emitting end of the at least one light guide is arranged in a two-dimensional array, so that the emitted light of the light source assembly is incident on the light guide, is conducted by the light guide and is emitted from the light emitting end of the light guide;

[0047] An optical component is arranged on the light-emitting side of the at least one light guide, so that the output light of the at least one light guide is incident on the optical component and is projected after passing through the optical component;

[0048] a light control component, the light control component being connected to the light source component and used for controlling whether the light source component injects light into any of the at least one light guide, so that the light source component injects light into a selected light guide of the at least one light guide, so that the selected light guide of the at least one light guide emits light, and a light spot formed by the light beam projected by the optical component matches the core particle to be bonded;

[0049] Alternatively, the optical control component is connected to the at least one light guide and is used to control whether any of the at least one light guide emits light, so that the selected light guide of the at least one light guide emits light, and the light spot formed by the light beam projected by the optical component matches the core particle to be bonded;

[0050] Wherein, the arrangement shape of the light-emitting end of the selected light guide element matches the core particles to be bonded.

[0051] The outgoing light of the light source assembly is incident on the at least one light guide member. For any light guide member, when the light is incident on the light guide member, it is conducted by the light guide member and emitted from the light emitting end of the light guide member.

[0052] In one embodiment, the light control component is connected to the light source component, and can control whether the light source component incidents light to any one of the at least one light guide. For any light guide, when the light source component incidents light to the light guide, the outgoing light of the light source component is incident to the light guide, conducted by the light guide and emitted from the light output end of the light guide.

[0053] In another embodiment, the light control component is connected to the at least one light guide and can control whether any of the at least one light guide emits light. For any light guide, when the light guide can emit light, light is emitted from the light emitting end of the light guide.

[0054] The light output end of at least one light guide is arranged in a two-dimensional array, and the light output of the light guide can be controlled by partitioning. The selected light guide can be selected according to the core particles to be bonded, so that the arrangement shape of the light output end of the selected light guide matches the core particles to be bonded. Then, the selected light guide outputs light, and the light spot formed by the light beam projected after the output light of the selected light guide passes through the optical component can be matched with the core particles to be bonded, so as to perform a bonding operation on the core particles to be bonded. Compared with the existing laser-assisted bonding scheme, the partitioned laser-assisted bonding system of this embodiment can more flexibly adjust the light spot corresponding to the projected light beam, and has higher flexibility and efficiency.

[0055] In some embodiments, the arrangement shape of the light output end of the selected light guide matches the shape of the core particle to be bonded, so that after the output light of the selected light guide passes through the optical component, the light spot formed by the projected light beam matches the shape of the core particle to be bonded.

[0056] In some embodiments, the number of selected light guides is such that the light spot size formed by the light beam projected through the optical component matches the size of the core particle to be bonded. The light guides can be partitioned to control the light emission according to the shape and size of the core particle to be bonded, and partitions are set in the two-dimensional array formed by the light output end of the at least one light guide. The light guides in the partitions are selected light guides, and the arrangement shape of the light output end of the selected light guide matches the shape of the core particle to be bonded. The number of selected light guides can satisfy the requirement that the light spot size formed by the output light of the selected light guide after passing through the optical component is projected matches the size of the core particle to be bonded.

[0057] In some embodiments, the output light power of the light source assembly is adjustable, and the output light power and light emission duration of the light source assembly can be controlled according to the material of the core particle to be bonded and the required bonding temperature. The output light power of the light source assembly satisfies that when the output light of the selected light guide is projected onto the core particle to be bonded after passing through the optical assembly, the temperature reached meets the bonding temperature required by the core particle to be bonded.

[0058] In some embodiments, the light guide includes an optical fiber, and the light input end of the optical fiber is arranged corresponding to the light source assembly so that the output light of the light source assembly is incident on the optical fiber, and the light output ends of multiple optical fibers are arranged in a two-dimensional array to form a fiber array.

[0059] In some embodiments, the light source assembly may include at least one light source, which is used to emit light. The light guide of the at least one light guide is arranged in a one-to-one correspondence with the light source of the at least one light source, so that the emitted light of the light source is incident on the corresponding light guide, transmitted by the corresponding light guide and emitted from the light output end of the light guide; the light control assembly includes at least one light control element, which is connected to the light source of the at least one light source in a one-to-one correspondence, and is used to control whether the corresponding light source emits light, so as to control whether the light source incidents light on the corresponding light guide.

[0060] The light guide of the at least one light guide is arranged in one-to-one correspondence with the light source of the at least one light source, so that the outgoing light of the light source is incident on the corresponding light guide, conducted by the corresponding light guide and emitted from the light emitting end of the light guide. The light control member of the at least one light control member is connected in one-to-one correspondence with the light source of the at least one light source, and the light control member can control whether the corresponding light source emits light. The light emitting end of the at least one light guide is arranged in a two-dimensional array, and a selected light guide is selected from it according to the core particles to be bonded, and the light source corresponding to the selected light guide is controlled to emit light, so that the selected light guide outputs light.

[0061] In some embodiments, the output light power of the light source is adjustable. The output light power of the light source corresponding to each selected light guide member satisfies that the temperature reached by the output light of the selected light guide member when it passes through the optical component and is projected onto the core particle to be bonded meets the bonding temperature required by the core particle to be bonded. In some embodiments, the light control member is also used to control the output light power of the corresponding light source. The light control member may use a laser controller. In some embodiments, the light source may use a laser that can output laser light.

[0062] For example, reference may be made to FIG. 1 , which is a schematic diagram of a partitioned laser assisted bonding system provided by an embodiment. As shown in the figure, the partitioned laser assisted bonding system includes a plurality of light control components 101, a plurality of light sources 102, and a plurality of optical fibers 104. The plurality of light sources 102 are connected to the plurality of light control components 101 in a one-to-one correspondence, and the plurality of optical fibers 104 are arranged in a one-to-one correspondence with the plurality of light sources 102. The light source 102 may be connected to the corresponding optical fiber 104 through a corresponding optical fiber coupler 103. The outgoing light of any light source 102 is incident on the corresponding optical fiber 104 and may be emitted from the light emitting end of the optical fiber 104. The optical component 105 is arranged on the light emitting side of the plurality of optical fibers 104, and the outgoing light of the plurality of optical fibers 104 is projected after passing through the optical component 105. The light control component 101 may control whether the corresponding light source 102 emits light and the outgoing light power.

[0063] For example, reference may be made to FIG2 , which is a schematic diagram of the arrangement of optical fiber light-emitting ends of an optical fiber array of a partitioned laser-assisted bonding system provided in one embodiment. As shown in the figure, the light-emitting ends of multiple optical fibers 104 are arranged in a two-dimensional array.

[0064] This partitioned laser-assisted bonding system can be applied to bonding a single core particle to a carrier. For example, in a specific example, a laser is used as the light source, and an optical fiber is used as the light guide. For a silicon-based core particle with a size of 2×2×0.2mm, each of the N×N optical fibers that are closely adjacent to each other outputs a laser, and the light beam forms a square light spot with a size of 2×2mm after passing through the optical component 105. It can be combined with a partition on the right side of reference Figure 2, that is, a group of optical fibers on the right are selected, where N=5. In practical applications, it can be combined with the output light power of the selected laser, the total number of rows and columns of the laser array, and the magnification of the optical component 105. According to the needs of the process configuration, N can select other suitable values, such as 2, 3, 4, 6, 7 or 8. The optical component 105 can also make the light spots of each optical fiber overlap to fill the gaps between the light spots corresponding to adjacent optical fibers caused by the distance between adjacent fiber cores of the optical fiber array, and the output power and output time of the laser can be set according to the chip thickness and solder ball size to achieve the required bonding temperature and meet the time required for solder ball melting and welding. The laser output and processing time here are usually in the order of seconds, so compared with hot compression bonding, the bonding efficiency and hourly bonding capacity can be greatly improved.

[0065] In some embodiments, the core particles to be bonded include a bare chip and a solder ball disposed on the bare chip, and the core particles to be bonded are welded to the carrier. For example, reference may be made to FIG3 , which is a schematic diagram of a core particle to be bonded and a carrier to which a partitioned laser-assisted bonding system provided in one embodiment is applied, and FIG4 is a schematic diagram of the bonding of the core particle to be bonded and the carrier shown in FIG3 . As shown in FIG3 , the first core particle to be bonded 201 includes a bare chip 203, a copper pillar 204 and a solder ball 205, and a non-conductive film 206 is also provided. To weld the first core particle to be bonded 201 to the carrier 207, the carrier 207 is provided with a solder pad. Before bonding, the first core particle to be bonded 201 needs to be aligned with the carrier 207, specifically, the solder ball 205 of the first core particle to be bonded 201 needs to be aligned with the solder pad of the carrier 207. The alignment operation can be performed using a third camera and alignment device 310. As shown in FIG. 4 , the generated light beam is irradiated to the first core particle to be bonded 201 to perform a bonding operation.

[0066] In practical applications, light guides of corresponding quantity and arrangement shape can be selected from the light guide array according to the shape, length and width of the core particles to be bonded, and the output light power of the light source and the light emission time of the selected light guide can be determined according to the thickness, solder ball size and material of the core particles to be bonded.

[0067] In some embodiments, there are multiple core particles to be bonded on the carrier; multiple groups of selected light guides are selected from the at least one light guide, and the multiple groups of selected light guides correspond one-to-one to the multiple core particles to be bonded, and the arrangement shape of the light output end of any group of selected light guides matches the corresponding core particles to be bonded, so that the light beam projected after the output light of any group of selected light guides passes through the optical component 105 is projected to the corresponding core particle to be bonded, and the light spot formed by the light beam projected after the output light of any group of selected light guides passes through the optical component 105 matches the corresponding core particle to be bonded.

[0068] Exemplarily, there are M core particles to be bonded on the carrier. According to the shapes and sizes of the M core particles to be bonded and the relative positions between the M core particles to be bonded, M groups of selected light guides are selected from the light guide array. The arrangement shape of the light output ends of the mth group of selected light guides matches the mth core particle to be bonded on the carrier. The positions of the mth group of selected light guides in the two-dimensional array formed at the light output ends of the light guides correspond to the positions of the mth core particles to be bonded on the carrier, m∈[1,M], M is a positive integer greater than or equal to 2. Then, the output light of the mth group of selected light guides corresponds to the mth light beam after passing through the optical component 105. The mth light beam is projected onto the mth core particle to be bonded on the carrier, and the light spot formed by the mth light beam projected onto the mth core particle to be bonded matches the mth core particle to be bonded. In this embodiment, for multiple core particles to be bonded on the carrier, according to the shapes and sizes of the multiple core particles to be bonded on the carrier and the relative positions between the core particles to be bonded, the light guides in the light guide array are controlled to emit light in a partitioned manner, so as to realize the graphical and partitioned control of the light spot corresponding to the light beam projected by the system. A group of selected light guides corresponds to a partition, corresponding to a core particle to be bonded on the carrier, and according to the shapes and sizes of the multiple core particles to be bonded on the carrier and the relative positions between the core particles to be bonded, the arrangement shape of the light emitting end of the light guides in each partition and the number of light guides are selected respectively, so that the emitted light of the selected light guides in any partition passes through the optical component 105 and is projected to the corresponding core particle to be bonded on the carrier, so that the emitted light of the light guides in any partition passes through the optical component 105 and the projected light beam matches the corresponding core particle to be bonded on the carrier. Then, this partitioned laser-assisted bonding system can perform bonding operations on multiple core particles to be bonded on the carrier, which can significantly reduce the packaging steps, improve efficiency, and multiply the packaging efficiency and hourly production capacity.

[0069] In some embodiments, the arrangement shape of the light-emitting ends of any selected group of light guides matches the shape of the corresponding core grain to be bonded. For any core grain to be bonded on the carrier, a light guide can be selected from the light guide array according to the shape of the core grain to be bonded, so that the arrangement shape of the light-emitting ends of the selected group of light guides matches the shape of the core grain to be bonded, so that after the output light of the selected group of light guides passes through the optical component 105, the light spot formed by the projected light beam matches the shape of the core grain to be bonded.

[0070] In some embodiments, the number of the selected light guides included in any one group of selected light guides satisfies the requirement that the light spot formed by the light beam projected after the outgoing light of the selected light guides passes through the optical component 105 matches the size of the corresponding core grain to be bonded. For any core grain to be bonded on the carrier, light guides can be selected from the light guide array according to the shape and size of the core grain to be bonded, so that the arrangement shape of the light output end of the selected group of light guides matches the shape of the core grain to be bonded, and the number of the selected group of light guides can satisfy the requirement that the light spot size formed by the outgoing light of the selected light guides passes through the optical component 105 and matches the size of the core grain to be bonded.

[0071] In some embodiments, the light source assembly may include at least one light source, the light source is used to emit light, and the light guide of the at least one light guide is arranged in a one-to-one correspondence with the light source of the at least one light source, so that the emitted light of the light source is incident on the corresponding light guide, is conducted by the corresponding light guide, and is emitted from the light emitting end of the light guide. Wherein, the emitted light power of the light source corresponding to each selected light guide of any group of selected light guides satisfies that the temperature reached by the emitted light of any group of selected light guides, when projected to the corresponding core particle to be bonded after passing through the optical component 105, meets the bonding temperature required by the corresponding core particle to be bonded. In the present embodiment, any light guide is provided with a corresponding light source, and the output light power of the light source is adjustable, so that the output light power of the corresponding light guide is adjustable. For any core particle to be bonded on the carrier, the output light power of the light sources corresponding to each light guide in a group of selected light guides corresponding to the core particle to be bonded can be controlled according to the bonding temperature required for the core particle to be bonded, so that the output light of a group of selected light guides corresponding to the core particle to be bonded reaches the bonding temperature required for the core particle to be bonded when it is projected onto the core particle to be bonded after passing through the optical component 105.

[0072] The shapes of the multiple core particles to be bonded on the carrier may be the same or different. The sizes of the multiple core particles to be bonded on the carrier may be the same or different. The bonding temperatures required for the multiple core particles to be bonded on the carrier may be the same or different. The partitioned laser-assisted bonding system can perform bonding operations on multiple core particles to be bonded, which can improve efficiency, and for each core particle to be bonded, the shape and size of the light spot corresponding to the light beam projected onto the core particle to be bonded can be more flexibly adjusted, with higher flexibility. For example, referring to Figure 2, a group of optical fibers on the right and a group of optical fibers on the left are selected from the optical fiber array, which are the first group of optical fibers 110 and the second group of optical fibers 111, respectively. The first group of optical fibers 110 includes five rows and five columns of optical fibers 104, and the arrangement shape is square; the second group of optical fibers 111 includes five rows and nine columns of optical fibers 104, and the arrangement shape is rectangular.

[0073] The partitioned laser-assisted bonding system can also be used to bond multiple core particles to the same carrier, and can be used to bond multiple core particles of different shapes or / and different sizes or / and different materials to the same carrier. Exemplarily, there are a first core particle to be bonded and a second core particle to be bonded on the carrier, and a first group of selected light guides and a second group of selected light guides are selected from the at least one light guide. In the two-dimensional array formed by the light-emitting end of the light guide array, the first group of selected light guides corresponds to a partition, and the arrangement shape of the light-emitting end of the first group of selected light guides matches the first core particle to be bonded, and the second group of selected light guides corresponds to another partition, and the arrangement shape of the light-emitting end of the second group of selected light guides matches the second core particle to be bonded, so that the light beam projected by the first group of selected light guides after passing through the optical component 105 is projected to the first core particle to be bonded on the carrier, and the light beam projected by the second group of selected light guides after passing through the optical component 105 is projected to the second core particle to be bonded on the carrier. For example, reference may be made to FIG5 , which is a schematic diagram of a partitioned laser-assisted bonding system provided by another embodiment, in which the solid line with an arrow in the figure indicates the direction of light propagation. The light guide member uses an optical fiber 104. As shown in the figure, a first group of optical fibers and a second group of optical fibers are selected from the optical fiber array. The first group of optical fibers includes three columns of optical fibers 104, and the light sources 102 corresponding to the three columns of optical fibers 104 are in a light-emitting state. The second group of optical fibers includes four columns of optical fibers 104, and the light sources 102 corresponding to the four columns of optical fibers 104 are in a light-emitting state. The outgoing light of the first group of optical fibers forms a first outgoing light beam 112 of the optical fiber array, and the outgoing light of the second group of optical fibers forms a second outgoing light beam 113 of the optical fiber array. The first outgoing light beam 112 passes through the optical component 105 and is projected onto the first core particle 201 to be bonded, and the second outgoing light beam 113 passes through the optical component 105 and is projected onto the second core particle 202 to be bonded.

[0074] Exemplarily, two core particles of different sizes are bonded to the same carrier, and reference may be made to Figures 5 and 6. Figure 6 is a schematic diagram of a partitioned laser-assisted bonding system provided in an embodiment for bonding two core particles to be bonded to the same carrier, specifically bonding the first core particle 201 to be bonded and the second core particle 202 to be bonded to the carrier 207. And reference may be made to Figure 7, which is a top view of the two core particles to be bonded to the carrier shown in Figure 6. In this specific example, a laser is used as the light source, and an optical fiber is used as the light guide. For example, one core particle is 2×2×0.2mm, and its solder ball diameter is 80μm, and the other core particle is 4×3×0.4mm, and its solder ball diameter is 160μm, and the distance between the two core particles is 1mm. As shown in reference figure 2, a group of optical fibers on the right can be selected, and 5×5 optical fibers arranged in a square can be selected to output lasers, and 9×5 optical fibers arranged in a rectangular manner with two rows of optical fibers on the left can be set to output lasers, and the output optical power of each laser corresponding to the group of optical fibers on the left can be set to be greater than the output optical power of the laser corresponding to the group of 5×5 optical fibers on the right. Different process curves can be applied to two core particles and solder balls of different specifications within the same processing time, and different welding temperatures and durations can be achieved.

[0075] In some embodiments, the light source assembly includes at least one light source, and the light source is used to emit light. The light guide of the at least one light guide is arranged in a one-to-one correspondence with the light source of the at least one light source, so that the emitted light of the light source is incident on the corresponding light guide, conducted by the corresponding light guide and emitted from the light output end of the light guide; in the two-dimensional array formed by the light output ends of the selected light guides, the emitted light power of the light source corresponding to the selected light guide at the edge of the two-dimensional array is greater than the emitted light power of the light source corresponding to the selected light guide inside the two-dimensional array. In this embodiment, in the two-dimensional array formed by the light output ends of the selected light guides, the emitted light power of the light source corresponding to the selected light guide at the edge is greater, that is, a greater output light power is set at the edge of the light spot to compensate for the temperature loss at the edge of the projected light spot, which helps to form a processing area with uniform temperature in the bonding pattern area and improve the bonding yield and quality.

[0076] In some embodiments, the magnification of the optical component 105 can be small, the focal depth can be large, and the focal depth can be provided in the millimeter level, and good bonding performance can be produced within the longitudinal height difference formed by the core particles and solder balls of different thicknesses. Since the outgoing light beam of the light guide array forms an inverted real image after passing through the optical component 105, the light spot formed by the light beam projected to the core particle to be bonded is opposite to the position of the corresponding light guide in the light guide array.

[0077] In this embodiment, the structure of the optical component 105 is not limited, and the optical component 105 may include a convex lens or a concave lens. In some embodiments, the magnification of the optical component 105 is adjustable, so that the light beam emitted from the light guide array passes through the optical component 105 and forms a light spot of a corresponding size when projected onto the core particle to be bonded.

[0078] In some embodiments, the output light power of the light source assembly is adjustable according to a preset gradient. In this embodiment, the preset gradient is not limited, and the range of the preset gradient can be 1 / 100 power gradient to 1 / 1000 power gradient. In some embodiments, considering the optimal thermal efficiency, the output light of the light source assembly can be infrared light.

[0079] In some embodiments, the partitioned laser assisted bonding system may further include a pressure component, the pressure component including a pressure piece and a pressure sensor, the pressure piece is disposed on the side of the core to be bonded close to the optical component 105, and is used to apply pressure to the core to be bonded and allow the light beam projected by the optical component 105 to pass through the pressure piece and be projected onto the core to be bonded, and the pressure sensor is used to measure the pressure applied by the pressure piece to the core to be bonded. The pressure piece can be light-transmitting, resulting in less energy loss. While laser heating, a certain pressure is applied to the core through the light-transmitting pressure piece, so that the warping during the bonding process and the tightness of the solder ball welding are controlled by external force. The pressure piece can be made of, but not limited to, a quartz crystal, so that the outgoing light beam can pass through the crystal.

[0080] In some embodiments, the partitioned laser assisted bonding system may further include a temperature measurement component, the temperature measurement component includes a temperature sensor and a feedback controller, the temperature sensor is disposed on one side of the optical component 105, and is used to measure the temperature of the position of the core particle to be bonded when the light beam projected by the optical component 105 irradiates the core particle to be bonded, and the feedback controller is connected to the light source component, and is used to control the output light power of the light source component according to the temperature signal returned by the temperature sensor. In this way, the partitioned laser assisted bonding system can monitor the temperature of the position of the core particle to be bonded in real time, and feedback control the output light power of the light source component to ensure that the required bonding temperature can be reached when bonding the core particle to be bonded. In an embodiment in which the light source assembly includes at least one light source, the light guide of the at least one light guide is arranged in a one-to-one correspondence with the light source of the at least one light source, the light control assembly includes at least one light control element, the light control element of the at least one light control element is connected to the light source of the at least one light source in a one-to-one correspondence, and the light control element is used to control whether the corresponding light source emits light, the feedback controller can be connected to the at least one light control element, and can control the output light power of the corresponding light source through the light control element according to the temperature signal returned by the temperature sensor.

[0081] In some embodiments, the partitioned laser assisted bonding system may also include: a camera device, disposed on one side of the optical component 105, for acquiring an image of the core particle to be bonded; an observation device, connected to the camera device, for displaying the acquired image of the core particle to be bonded to monitor the working condition of the bonding area of ​​the core particle to be bonded.

[0082] In some embodiments, the partitioned laser assisted bonding system may also include: a camera device, disposed on one side of the optical component 105, for acquiring an image of the core particle to be bonded; an alignment device, connected to the camera device, for controlling the movement of the core particle to be bonded according to the acquired image of the core particle to be bonded, so that the light beam projected by the optical component 105 is projected onto the core particle to be bonded.

[0083] In some embodiments, the partitioned laser assisted bonding system may further include a suction and placement component 307, a glue dipping component 308, a carrier component and a conveying device 314, wherein the carrier component includes a third carrier platform 106 and a second carrier platform 313, wherein the second carrier platform 313 is disposed below the suction and placement component 307 and the glue dipping component 308, and the third carrier platform 106 is disposed below the optical component 105, and the conveying device 314 is used to transfer the core grain to be bonded from the second carrier platform 313 to the third carrier platform 106. In some embodiments, the partitioned laser assisted bonding system may further include a suction and flipping component 305, wherein the carrier component further includes a first carrier platform 312 disposed below the suction and flipping component 305, and the first carrier platform 312 is provided with a core grain ejector pin.

[0084] For example, reference may be made to Figure 8, which is a schematic diagram of a partitioned laser-assisted bonding system provided by another embodiment. As shown in the figure, it includes a suction and flipping component 305, a suction and mounting component 307 and a dipping component 308. The first carrier 312 is arranged below the suction and flipping component 305, the second carrier 313 is arranged below the suction and mounting component 307 and the dipping component 308, the third carrier 106 is arranged below the optical component 105, and the conveying device 314 is arranged between the second carrier 313 and the third carrier 106.

[0085] The first camera and alignment device 306 is provided corresponding to the suction and flipping component 305, and the second camera and alignment device 309 is provided corresponding to the suction and patch component 307 and the glue dipping component 308. The third camera and alignment device 310 is provided corresponding to the optical component 105. The first camera and alignment device 306, the second camera and alignment device 309 and the third camera and alignment device 310 are respectively used to obtain images to implement alignment operations according to the obtained images.

[0086] The partitioned laser assisted bonding system may further include a temperature measuring component 311, which is disposed on one side of the optical component 105 and is used to measure the temperature of the position where the core particles to be bonded are located. The carrier plate 207 including the core particles to be bonded is placed on the third carrier platform 106. During the process of bonding the core particles to be bonded to the carrier plate 207, the temperature of the position where the core particles to be bonded are located is monitored, and the output light power of the corresponding light source can be adjusted in real time according to the temperature to avoid excessively high or low temperatures and ensure the bonding quality.

[0087] The partitioned laser-assisted bonding system includes two parts: a patch part and a bonding part. The patch part includes a patch control device 302, a loading and unloading device 301, a suction and flipping component 305, a suction and patch component 307, a glue dipping component 308, a first camera and alignment device 306, a second camera and alignment device 309, a first carrier 312, and a second carrier 313. The above devices or components can be configured with 1 set, 2 sets or even more sets according to actual application needs. For example, if two different types of core particles are packaged on the same carrier at the same time, it is hoped that the patch bonding can be completed at one time. In order to improve the patch efficiency, at least two wafer carriers are required.

[0088] The bonding part includes a bonding control device 304, an optical control component array, a light source array, a light guide component array, an optical component 105, a third camera and alignment device 310, a pressure component and a temperature measurement component 311. For the same carrier board with different core particles installed, the bonding can be completed at one time by setting the spot shape, size and power of different areas as needed. The partitioned laser assisted bonding system may also include a human-machine interface 303.

[0089] For existing laser bonding solutions, a single laser is usually used, and a microlens array is used to homogenize the light beam. The light beam is shaped into the shape and size of the light spot required for bonding through some optical elements, such as using a cylindrical lens or an ordinary lens. First, the adjustment range of the shape and size of the light spot is relatively rigid, the adjustment range is limited, and the flexibility is insufficient. In addition, some adjustment methods are mechanical operations such as rotating the lens barrel, which have a slow adjustment speed and a limited adjustment range. Second, since this solution uses a single laser as a light source to form a light spot, only one laser power can be set at a time. In the scenario where multiple chips with different power requirements are packaged on the same carrier board, it is necessary to set the corresponding laser power for each chip with each power requirement to perform laser bonding independently, resulting in a large number of bonding times and low efficiency. Third, a microlens array is used to mix and homogenize the beams. Since the beams come from the same light source, the light emitted by the microlenses is coherent, which can easily lead to power density differences between different areas. If the laser irradiation power in one area is low, resulting in insufficient welding temperature, poor contact defects will occur; while in other areas, due to receiving excessively high-power laser irradiation, bridging defects will occur. In some extreme cases, the core particles may even be burned.

[0090] The laser-assisted bonding system of this embodiment mainly has the following advantages:

[0091] First, the light beam generated by the light guide can be quickly lit up in a graphical manner, which is flexible and quick: the pixel composed of any light spot can be selected to have laser output or be completely turned off; the output power of a single light guide spot can be set through the light control component, so the light spot pattern and graphic grayscale can be flexibly formed. Therefore, it can flexibly meet the packaging of flip chip core particles of different shapes and sizes, or realize the packaging of multiple flip chip core particles of different types and sizes on a carrier, significantly reducing the packaging steps and doubling the packaging efficiency and hourly production capacity.

[0092] Second, because the laser beam is output in the form of a light guide, the edge of the bonding pattern can be easily compensated for heat. When the laser spot irradiates the material to be processed, there is a large temperature gradient at the edge of the material irradiated by the spot. The area inside the spot is the processed area, and the area outside the spot is the non-processing area. Due to the existence of heat transfer effects such as heat conduction and heat radiation, the temperature generated by the edge of the flat-top beam irradiating the material is lower than that inside the spot. The laser beam formed by the light guide can set the laser at the edge of the spot to output a higher power to compensate for the temperature loss at the edge of the spot. A processing area with consistent temperature is formed within the spot to avoid insufficient processing temperature and processing quality problems.

[0093] Third, because the light beams of the light source array come from different light sources and each light beam is incoherent, there is no interference effect between the light spots output by the light guide, the light spot homogenization effect is better, the heating temperature of the solder is more uniform, and the packaging quality can be significantly improved.

[0094] Finally, due to the use of a light source array, multiple light sources synthesize the total output power, the power requirement for a single light source in the array is lower, and cheaper lasers can be used; in addition, when a light source in the array is damaged, only the damaged light source can be replaced without replacing the entire light source array, and the light source maintenance cost is lower.

[0095] The above is a detailed introduction to a partitioned laser-assisted bonding system provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A partitioned laser assisted bonding system, characterized in that: include: A light source assembly, for emitting light; At least one light guide is disposed on the light emitting side of the light source assembly and the light emitting end of the at least one light guide is arranged in a two-dimensional array, so that the emitted light of the light source assembly is incident on the light guide, is conducted by the light guide and is emitted from the light emitting end of the light guide; An optical component is arranged on the light-emitting side of the at least one light guide, so that the output light of the at least one light guide is incident on the optical component and is projected after passing through the optical component; a light control component, the light control component being connected to the light source component and used for controlling whether the light source component injects light into any of the at least one light guide, so that the light source component injects light into a selected light guide of the at least one light guide, so that the selected light guide of the at least one light guide emits light, and a light spot formed by the light beam projected by the optical component matches the core particle to be bonded; Alternatively, the optical control component is connected to the at least one light guide and is used to control whether any of the at least one light guide emits light, so that the selected light guide of the at least one light guide emits light, and the light spot formed by the light beam projected by the optical component matches the core particle to be bonded; Wherein, the arrangement shape of the light-emitting end of the selected light guide element matches the core particles to be bonded.

2. The partitioned laser assisted bonding system according to claim 1, characterized in that: The arrangement shape of the light emitting ends of the selected light guides matches the shape of the core particles to be bonded.

3. The partitioned laser assisted bonding system according to claim 2, characterized in that: The number of the selected light guides is such that the size of the light spot formed by the light beam projected through the optical component matches the size of the core particle to be bonded.

4. The partitioned laser assisted bonding system according to claim 1, characterized in that: The light source assembly comprises at least one light source, the light source is used to emit light, the light guide of the at least one light guide is arranged in one-to-one correspondence with the light source of the at least one light source, so that the emitted light of the light source is incident on the corresponding light guide, is conducted by the corresponding light guide and is emitted from the light emitting end of the light guide; The light control component includes at least one light control member, and the light control member of the at least one light control member is connected to the light source of the at least one light source in a one-to-one correspondence. The light control member is used to control whether the corresponding light source emits light, so as to control whether the light source incidents light to the corresponding light guide member.

5. The partitioned laser assisted bonding system according to claim 1, characterized in that: There are a plurality of core particles to be bonded on the carrier; A plurality of groups of selected light guides are selected from the at least one light guide, the plurality of groups of selected light guides correspond one-to-one to the plurality of core particles to be bonded, and the arrangement shape of the light output end of any group of selected light guides matches the corresponding core particles to be bonded, so that the light beam projected after the output light of any group of selected light guides passes through the optical component is projected onto the corresponding core particles to be bonded, and the light spot formed by the light beam projected after the output light of any group of selected light guides passes through the optical component matches the corresponding core particles to be bonded.

6. The partitioned laser assisted bonding system according to claim 5, characterized in that: The arrangement shape of the light-emitting ends of any group of selected light guide members matches the shape of the corresponding core particles to be bonded; Or / and, the number of the selected light guides included in any one group of selected light guides satisfies the requirement that a light spot formed by a light beam projected after the outgoing light of the any one group of selected light guides passes through the optical component matches the size of the corresponding core particle to be bonded.

7. The partitioned laser assisted bonding system according to claim 1, characterized in that: The light source assembly comprises at least one light source, the light source is used to emit light, the light guide of the at least one light guide is arranged in one-to-one correspondence with the light source of the at least one light source, so that the emitted light of the light source is incident on the corresponding light guide, is conducted by the corresponding light guide and is emitted from the light emitting end of the light guide; In the two-dimensional array formed by the light emitting ends of the selected light guides, the emitted light power of the light sources corresponding to the selected light guides at the edge of the two-dimensional array is greater than the emitted light power of the light sources corresponding to the selected light guides inside the two-dimensional array.

8. The partitioned laser assisted bonding system according to any one of claims 1 to 7, characterized in that: It also includes a pressure component, which includes a pressure piece and a pressure sensor. The pressure piece is arranged on the side of the core particle to be bonded close to the optical component, and is used to apply pressure to the core particle to be bonded and make the light beam projected by the optical component pass through the pressure piece and projected to the core particle to be bonded. The pressure sensor is used to measure the pressure applied by the pressure piece to the core particle to be bonded.

9. The partitioned laser assisted bonding system according to any one of claims 1 to 7, characterized in that: It also includes a temperature measuring component, which includes a temperature sensor and a feedback controller. The temperature sensor is arranged on one side of the optical component and is used to measure the temperature of the position of the core particle to be bonded when the light beam projected by the optical component irradiates the core particle to be bonded. The feedback controller is connected to the light source component and is used to control the output light power of the light source component according to the temperature signal returned by the temperature sensor.

10. The partitioned laser assisted bonding system according to any one of claims 1 to 7, characterized in that: Also includes: A camera device, disposed on one side of the optical component, for acquiring an image of the core particle to be bonded; An observation device, connected to the camera device, for displaying the acquired image of the core particle to be bonded, so as to monitor the working condition of the bonding area of ​​the core particle to be bonded; An alignment device is connected to the camera device and is used to control the movement of the core particle to be bonded according to the acquired image of the core particle to be bonded, so that the light beam projected by the optical component is projected onto the core particle to be bonded.

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