Wafer moving device

Abstract

The invention discloses a wafer moving device. The wafer moving device comprises a carrier, a driving unit and a connecting rod assembly. The wafer moving device is used for the cleaning box, the carrier is used for mounting a wafer and is suitable for being movably arranged in the cleaning box, the driving unit is arranged on the outer side of the cleaning box, at least part of the connecting rod assembly is located in the cleaning box, the connecting rod assembly is connected with the driving unit and the carrier and comprises a guide rod, and the guide rod is movably arranged in the cleaning box in the vertical direction. The driving unit drives the carrier to move by driving the guide rod to move up and down. According to the wafer moving device, the wafer moving device can move the wafer in the cleaning box to improve the cleaning effect, and the transmission stability is high.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer moving device. Background Art

[0002] In the related art, the chip, as the carrier of the integrated circuit, is an integration of electronic components made of semiconductors. In the semiconductor manufacturing process, the wafer needs to be cleaned in a cleaning box after being processed by chemical mechanical polishing. However, since the wafer is in the cleaning box, it is inconvenient for the operator to adjust the position or tilt angle of the wafer, which will affect the cleaning effect of the wafer. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a wafer moving device, which can move wafers in a cleaning box to improve the cleaning effect and has high transmission stability.

[0004] According to an embodiment of the present invention, a wafer moving device comprises: a carrier, a driving unit and a connecting rod assembly. The wafer moving device is used in a cleaning box, the carrier is used to mount wafers and is suitable for being movably arranged in the cleaning box, the driving unit is arranged outside the cleaning box, at least part of the connecting rod assembly is located in the cleaning box, the connecting rod assembly connects the driving unit and the carrier, the connecting rod assembly comprises a guide rod, the guide rod is movably arranged in the cleaning box along the up and down direction, and the driving unit drives the guide rod to move up and down to drive the carrier to move.

[0005] According to the wafer moving device of the embodiment of the present invention, the driving unit outside the cleaning box and the carrier inside the cleaning box are connected by setting a connecting rod assembly, and a guide rod movable in the cleaning box along the up and down direction is set, and the driving unit drives the guide rod to move up and down to drive the carrier installed with the wafer to move, so that the position or tilt angle of the wafer in the cleaning box can be adjusted, so that the wafer can adapt to various cleaning conditions of the cleaning box and meet various cleaning process requirements, and the cleaning effect of the wafer can be improved. At the same time, the electrical performance and operation safety of the driving unit can be guaranteed, and the transmission stability between the driving unit and the carrier can be guaranteed, so as to ensure the operation stability, reliability and safety of the wafer moving device.

[0006] According to some embodiments of the present invention, the connecting rod assembly also includes: a first rod and a connecting rod assembly, wherein one end of the first rod is rotatably connected to the carrier, and the lower end of the guide rod is rotatably connected to the other end of the first rod; the connecting rod assembly is located above the guide rod and one end is connected to the upper end of the guide rod, and the other end is connected to the driving unit, and the driving unit drives the guide rod up and down through the connecting rod assembly to drive the carrier to move.

[0007] In some embodiments of the present invention, the driving unit is a linear motion mechanism, which includes a linear motion component. The connecting rod assembly includes a connecting block, which is fixedly connected to the linear motion component and the guide rod. The moving direction of the linear motion component is the same as the moving direction of the guide rod.

[0008] In some embodiments of the present invention, the driving unit is a rotary motion mechanism, which has a rotating member, and the rotation axis of the rotating member extends in a horizontal direction. The connecting rod assembly includes: a second rod and a third rod, one end of the second rod is fixedly connected to the rotating member; one end of the third rod is rotatably connected to the other end of the second rod, and the other end of the third rod is rotatably connected to the upper end of the guide rod.

[0009] In some embodiments of the present invention, the wafer moving device further comprises a guide seat, wherein the guide seat is disposed in the cleaning box, and the guide rod is passed through the guide seat in an up-and-down direction and is movable in the up-and-down direction.

[0010] In some embodiments of the present invention, a linear bearing is provided on the guide seat, and the linear bearing extends in the up-down direction and is sleeved on the guide rod.

[0011] According to some embodiments of the present invention, the carrier is movably disposed in the cleaning box along a first direction, and the first direction is parallel to a horizontal direction.

[0012] In some embodiments of the present invention, the wafer moving device also includes a slide rail, which is disposed in the cleaning box and extends along the first direction. The carrier is movably disposed on the slide rail, and the carrier is provided with rollers that can roll along the slide rail. The slide rail has limit blocks at both ends along the first direction for limiting the movement of the carrier.

[0013] According to some embodiments of the present invention, the carrier is rotatably disposed in the cleaning box around an axis extending along a second direction, the connection point between the connecting rod assembly and the carrier is spaced apart from the rotation axis of the carrier, and the second direction is parallel to the horizontal direction.

[0014] In some embodiments of the present invention, the wafer moving device further comprises a fixed seat, the fixed seat is disposed in the cleaning box, and the carrier is rotatably disposed on the fixed seat.

[0015] According to some embodiments of the present invention, the driving unit is disposed at the top of the outer wall of the cleaning tank, and the connecting rod assembly extends into the cleaning tank from the top of the cleaning tank.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is a three-dimensional diagram of a wafer moving device according to an embodiment of the present invention, wherein the carrier is movable along a first direction, and the driving unit is a linear motion mechanism;

[0019] Figure 2 is a side view of a wafer moving device according to an embodiment of the present invention, wherein the carrier is movable along a first direction, the driving unit is a linear motion mechanism and the guide rod moves downward;

[0020] Figure 3 is a side view of a wafer moving device according to an embodiment of the present invention, wherein the carrier is movable along a first direction, the driving unit is a linear motion mechanism and the guide rod moves upward;

[0021] Figure 4 is a three-dimensional diagram of a wafer moving device according to an embodiment of the present invention, wherein the carrier is movable along a first direction, and the driving unit is a rotary motion mechanism;

[0022] Figure 5 is a side view of a wafer moving device according to an embodiment of the present invention, wherein the carrier is movable along a first direction, the driving unit is a rotary motion mechanism and the guide rod moves downward;

[0023] Figure 6 is a side view of a wafer moving device according to an embodiment of the present invention, wherein the carrier is movable along a first direction, the driving unit is a rotary motion mechanism and the guide rod moves upward;

[0024] Figure 7 is a three-dimensional diagram of a wafer moving device according to an embodiment of the present invention, wherein the carrier is rotatable around an axis extending along the second direction, and the driving unit is a linear motion mechanism;

[0025] Figure 8is a side view of a wafer moving device according to an embodiment of the present invention, wherein the carrier is rotatable about an axis extending along a second direction, the driving unit is a linear motion mechanism and the guide rod moves upward;

[0026] Fig. 9 is a side view of a wafer moving device according to an embodiment of the present invention, wherein the carrier is rotatable about an axis extending along a second direction, the driving unit is a linear motion mechanism and the guide rod moves downward;

[0027] Fig.10 is a three-dimensional diagram of a wafer moving device according to an embodiment of the present invention, wherein the carrier is rotatable around an axis extending along the second direction, and the driving unit is a rotary motion mechanism;

[0028] Fig.11 is a side view of a wafer moving device according to an embodiment of the present invention, wherein the carrier is rotatable about an axis extending along a second direction, the driving unit is a rotary motion mechanism and the guide rod moves upward;

[0029] Fig.12 is a side view of a wafer moving device according to an embodiment of the present invention, wherein the carrier is rotatable around an axis extending along a second direction, the driving unit is a rotary motion mechanism, and the guide rod moves downward.

[0030] Reference numerals:

[0031] 100. Wafer moving device;

[0032] 1. Carrier; 11. Groove;

[0033] 2. driving unit; 21. linear motion mechanism; 211. linear motion component; 22. rotary motion mechanism; 221. rotating member;

[0034] 3. Connecting rod assembly; 31. First rod; 32. Guide rod; 33. Connecting rod assembly; 331. Connecting block; 332. Second rod; 333. Third rod; 334. Third pin; 335. Fourth pin; 34. First pin; 35. Second pin;

[0035] 4. Guide seat;

[0036] 5. Slide rail; 51. Limit block;

[0037] 6. Fixed seat; 61. Rotating shaft;

[0038] 7. Mounting seat;

[0039] 200, cleaning box;

[0040] 300. Wafer. DETAILED DESCRIPTION

[0041] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] Reference below Figure 1-Figure 12 A wafer moving apparatus 100 according to an embodiment of the present invention is described.

[0045] like Figure 1 , Figure 4 , Figure 7 and Fig.10 As shown, a wafer moving device 100 according to an embodiment of the present invention includes a carrier 1 , a driving unit 2 and a connecting rod assembly 3 .

[0046] Specifically, Figure 1-Figure 3 and Figure 7-Figure 9 As shown, the wafer moving device 100 is used in the cleaning box 200. After the wafer 300 is processed by the chemical mechanical polishing process, it needs to be cleaned in the cleaning box 200. When the wafer 300 reaches a certain cleanliness level, it is transferred to a wafer box for storage.

[0047] The carrier 1 is used to mount the wafer 300 and is suitable for being movably arranged in the cleaning box 200. The carrier 1 can play a role in positioning and limiting the wafer 300. For example, a groove 11 can be provided on the carrier 1, and the wafer 300 is suitable for being installed in the groove 11, so that the wafer 300 can be stably placed on the carrier 1. When the carrier 1 moves in the cleaning box 200, the carrier 1 can drive the wafer 300 to move together.

[0048] Furthermore, the drive unit 2 is arranged outside the cleaning box 200, and at least a part of the connecting rod assembly 3 is located inside the cleaning box 200. The connecting rod assembly 3 connects the drive unit 2 and the carrier 1. The connecting rod assembly 3 includes a guide rod 32, and the guide rod 32 is movably arranged in the cleaning box 200 along the up and down directions. The drive unit 2 drives the carrier 1 to move by driving the guide rod 32 to move up and down.

[0049] It is understandable that the drive unit 2 can provide a driving force to drive the connecting rod assembly 3 to move, and the connecting rod assembly 3 is connected to the carrier 1, so that the carrier 1 can be driven to move, and then the wafer 300 can be driven to move in the cleaning box 200. Among them, the drive unit 2 can provide a driving force to drive the guide rod 32 to move up and down, so that the guide rod 32 can drive the carrier 1 to move, thereby driving the wafer 300 to move in the cleaning box 200. For example, the wafer 300 can be translated for a distance, or deflected at a certain angle. Thus, the wafer 300 in the cleaning box 200 can be adjusted by the wafer moving device 100, such as the position or tilt angle, so that the wafer 300 can adapt to various cleaning conditions of the cleaning box 200 and meet various cleaning process requirements, and at the same time, the wafer 300 can achieve a better cleaning effect.

[0050] Among them, the driving unit 2 is arranged on the outside of the cleaning box 200. For example, the driving unit 2 can be arranged on the outer wall surface of the cleaning box 200, or on other independent unit structures outside the cleaning box 200. This can prevent the driving unit 2 from contacting the liquid in the cleaning box 200, and can ensure the electrical performance and operation safety of the driving unit 2, thereby ensuring the stability and safety of the wafer moving device 100.

[0051] In the related art, a first magnetic block is provided on the carrier in the cleaning box, and a second magnetic block with a magnetic pole opposite to that of the first magnetic block is provided on the driving unit outside the cleaning box. When the driving unit moves, the carrier can be driven to move by the attraction between the first magnetic block and the second magnetic block. However, the magnetic force between the first magnetic block and the second magnetic block is greatly affected by the distance, and the first magnetic block and the second magnetic block are separated by the wall of the cleaning box. The attraction between the first magnetic block and the second magnetic block is small and unstable, which makes the stability of the driving force transmitted by the driving unit and the carrier poor.

[0052] In the present application, the connecting rod assembly 3 connects the driving unit 2 outside the cleaning box 200 and the carrier 1 inside the cleaning box 200, and transmits the driving force output by the driving unit 2 to the carrier 1. The reasonable structural design can ensure the stability of the transmission effect between the driving unit 2 and the carrier 1, thereby ensuring the operation stability and reliability of the wafer moving device 100.

[0053] According to the wafer moving device 100 of the embodiment of the present invention, the driving unit 2 outside the cleaning box 200 and the carrier 1 in the cleaning box 200 are connected by setting a connecting rod assembly 3, and a guide rod 32 movable in the cleaning box 200 along the up and down direction is set, and the driving unit 2 drives the guide rod 32 to move up and down to drive the carrier 1 installed with the wafer 300 to move, and the position or tilt angle of the wafer 300 in the cleaning box 200 can be adjusted, so that the wafer 300 can adapt to various cleaning conditions of the cleaning box 200 and meet various cleaning process requirements, and the cleaning effect of the wafer 300 can be improved. At the same time, the electrical performance and operation safety of the driving unit 2 can be guaranteed, and the transmission stability between the driving unit 2 and the carrier 1 can be guaranteed, so that the operation stability, reliability and safety of the wafer moving device 100 can be guaranteed.

[0054] In some embodiments of the present invention, Figure 1 , Figure 4 , Figure 7 and Fig.10 As shown, the connecting rod assembly 3 further includes: a first rod 31 and a connecting rod assembly 33, one end of the first rod 31 is rotatably connected to the carrier 1, and the lower end of the guide rod 32 is rotatably connected to the other end of the first rod 31. The connecting rod assembly 33 is located above the guide rod 32 and one end is connected to the upper end of the guide rod 32, and the other end is connected to the driving unit 2. The driving unit 2 drives the guide rod 32 to move up and down through the connecting rod assembly 33 to drive the carrier 1 to move.

[0055] It is understandable that the drive unit 2 can provide a driving force to move the guide rod 32 up and down, and the connecting rod assembly 33 connects the drive unit 2 outside the cleaning box 200 and the guide rod 32 inside the cleaning box 200, and can transmit the driving force output by the drive unit 2 to the guide rod 32, so that the guide rod 32 moves in the up and down direction. The two ends of the first rod 31 are respectively connected to the guide rod 32 and the carrier 1, so that the guide rod 32 can drive the first rod 31 to move, and the first rod 31 can drive the carrier 1 to move, thereby driving the wafer 300 to move in the cleaning box 200. In this way, the adjustment of the position or tilt angle of the wafer 300 in the cleaning box 200 can be achieved, so that the wafer 300 can adapt to various cleaning conditions of the cleaning box 200 and meet various cleaning process requirements, and the cleaning effect of the wafer 300 can also be improved.

[0056] By configuring the connecting rod assembly 3 to consist of a first rod 31, a guide rod 32 and a connecting rod assembly 33 that cooperate with each other, the driving force output by the driving unit 2 can be stably transmitted to the carrier 1. The reasonable structural design can ensure the stability of the components and structures when they are linked, thereby ensuring the stability of the driving force transmission, and further ensuring the operating stability and reliability of the wafer moving device 100.

[0057] Preferably, if Figure 1-Figure 12 As shown, one end of the first rod 31 is connected to the carrier 1 through a first pin 34, and the other end of the first rod 31 is connected to the guide rod 32 through a second pin 35. The first rod 31 is provided with a first hole and a second hole at both ends, the carrier 1 is provided with a third hole corresponding to the first hole, and the guide rod 32 is provided with a fourth hole corresponding to the second hole. The first pin 34 is inserted through the first hole and the third hole, thereby realizing the rotation connection between the first rod 31 and the carrier 1. The second pin 35 is inserted through the second hole and the fourth hole, thereby realizing the rotation connection between the first rod 31 and the guide rod 32. The structure is simple and easy to implement, and can ensure the transmission effectiveness and stability of the connecting rod assembly 3.

[0058] In some embodiments of the present invention, Figure 1-Figure 3 and Figure 7-Figure 9 As shown, the driving unit 2 is a linear motion mechanism 21, which includes a linear motion component 211. The connecting rod assembly 33 includes a connecting block 331, which is fixedly connected to the linear motion component 211 and the guide rod 32. The moving direction of the linear motion component 211 is the same as the moving direction of the guide rod 32.

[0059] It is understandable that the output shaft of the linear motion mechanism 21 can provide a driving force in the up and down directions, so that the linear motion component 211 moves up and down. The connecting block 331 fixedly connects the linear motion component 211 outside the cleaning box 200 and the guide rod 32 inside the cleaning box 200 and transmits the driving force, so that the connecting block 331 moves up and down under the force provided by the linear motion component 211, thereby driving the guide rod 32 to move in the up and down directions. In addition, the guide rod 32 can drive the first rod 31 and the carrier 1 to move, so as to drive the wafer 300 to move in the cleaning box 200. In this way, the adjustment of the position or tilt angle of the wafer 300 in the cleaning box 200 can be achieved, so that the wafer 300 can adapt to various cleaning conditions of the cleaning box 200 and meet various cleaning process requirements, and the cleaning effect of the wafer 300 can also be improved.

[0060] For example, Figure 3 and Figure 8 In the example shown, the linear motion mechanism 21 can simultaneously drive the connecting block 331 and the guide rod 32 to move upward when the linear motion component 211 moves upward.

[0061] For example, Figure 2 and Fig. 9 In the example shown, the linear motion mechanism 21 can simultaneously drive the connecting block 331 and the guide rod 32 to move downward when the linear motion component 211 moves downward.

[0062] The driving unit 2 is a linear motion mechanism 21, which can be a cylinder, an electric cylinder, a linear motor or a linear module, etc. It has a simple structure and low cost, so that the driving unit 2 can stably output power and motion. The connecting block 331 can stably transmit the driving force output by the driving unit 2 to the guide rod 32, and then transmit it to the carrier 1. The structural design is reasonable, which can ensure the stability of the linkage of various components and structures, thereby ensuring the stability of the driving force transmission, and further ensuring the operation stability and reliability of the wafer moving device 100.

[0063] In some embodiments of the present invention, Figure 4-Figure 6 and Figure 10-12 As shown, the driving unit 2 is a rotary motion mechanism 22, which has a rotating member 221, and the rotation axis of the rotating member 221 extends in the horizontal direction. The connecting rod assembly 33 includes: a second rod 332 and a third rod 333, one end of the second rod 332 is fixedly connected to the rotating member 221; one end of the third rod 333 is rotatably connected to the other end of the second rod 332, and the other end of the third rod 333 is rotatably connected to the upper end of the guide rod 32.

[0064] It can be understood that the output shaft of the rotary motion mechanism 22 can provide torque force, so that the rotating member 221 rotates around the rotation axis extending in the horizontal direction. The second rod 332 and the third rod 333 fixedly connect the rotating member 221 and the guide rod 32 in the cleaning box 200 and transmit the driving force, so that the second rod 332 rotates around the rotation axis of the rotating member 221 under the torque force provided by the rotating member 221, and the end of the second rod 332 away from the rotating member 221 can drive the third rod 333 to translate and rotate at a certain angle, and the rotation axis of the third rod 333 extends in the horizontal direction, so that the end of the third rod 333 away from the second rod 332 can drive the guide rod 32 to move in the up and down direction. In this way, the guide rod 32 can drive the first rod 31 and the carrier 1 to move, so as to drive the wafer 300 to move in the cleaning box 200. Thereby, the position or tilt angle of the wafer 300 in the cleaning box 200 can be adjusted, so that the wafer 300 can adapt to various cleaning conditions of the cleaning box 200 and meet various cleaning process requirements, and the cleaning effect of the wafer 300 can also be improved.

[0065] For example, Fig.11In the example shown, when the rotating mechanism 22 causes the rotating member 221 to rotate counterclockwise, the rotating member 221 can drive the second rod 332 to rotate counterclockwise, thereby driving the third rod 333 to translate upward while rotating clockwise around the rotation axis between the third rod 333 and the guide rod 32 by a certain angle, so that the lower end of the third rod 333 can drive the guide rod 32 to move upward.

[0066] For example, Fig.12 In the example shown, when the rotating mechanism 22 causes the rotating member 221 to rotate clockwise, the rotating member 221 can drive the second rod 332 to rotate clockwise, thereby driving the third rod 333 to translate downward while rotating counterclockwise around the rotation axis between the third rod 333 and the guide rod 32 by a certain angle, so that the lower end of the third rod 333 can drive the guide rod 32 to move downward.

[0067] The driving unit 2 is a rotary motion mechanism 22, which can be a motor or a rotary cylinder, etc., with a compact structure and can realize complex transmission functions in a limited space, and can also achieve high transmission efficiency, so that the driving unit 2 can stably output power and motion. The second rod 332 and the third rod 333 can stably transmit the torque force output by the driving unit 2 to the guide rod 32, and convert the rotary motion of the rotating member 221 into the linear motion of the guide rod 32, so as to transmit it to the carrier 1. The structural design is reasonable, which can ensure the stability of the linkage of various components and structures, thereby ensuring the stability of the driving force transmission, and further ensuring the operation stability and reliability of the wafer moving device 100.

[0068] Preferably, if Figure 4-Figure 6 and Figure 10-12 As shown, one end of the third rod 333 is connected to the rotating member 221 through the third pin 334, and the other end of the third rod 333 is connected to the guide rod 32 through the fourth pin 335. The third rod 333 is provided with a fifth hole and a sixth hole at both ends, the rotating member 221 is provided with a seventh hole corresponding to the fifth hole, and the guide rod 32 is provided with an eighth hole corresponding to the sixth hole. The third pin 334 is inserted through the fifth hole and the seventh hole, thereby realizing the rotational connection between the third rod 333 and the rotating member 221. The fourth pin 335 is inserted through the sixth hole and the eighth hole, thereby realizing the rotational connection between the third rod 333 and the guide rod 32. The structure is simple and easy to implement, and can ensure the transmission effectiveness and stability of the connecting rod assembly 33.

[0069] In some embodiments of the present invention, Figure 1-Figure 12As shown, the wafer moving device 100 also includes a guide seat 4, which is arranged in the cleaning box 200, and the guide rod 32 is penetrated on the guide seat 4 in the up-down direction and can move in the up-down direction. The guide seat 4 is provided with a guide hole, which extends in the up-down direction and penetrates the guide seat 4, and the guide rod 32 is penetrated in the guide hole. The guide seat 4 can play a role in positioning and limiting the guide rod 32, so that the guide rod 32 can only move in the up-down direction in the guide hole, and will not produce horizontal movement, and the structural design is reasonable. The end where the first rod 31 and the guide rod 32 are connected can only be subjected to the force in the up-down direction, and the first rod 31 can rotate around the rotation axis between the first rod 31 and the guide rod 32, so that the other end of the first rod 31 can drive the carrier 1 to move, which can ensure the effectiveness and stability of the transmission, and further ensure the effectiveness and stability of the operation of the wafer moving device 100.

[0070] In some embodiments of the present invention, a linear bearing is provided on the guide seat 4, and the linear bearing extends in the up-down direction and is sleeved on the guide rod 32. The linear bearing is penetrated through the guide seat 4 and a plurality of balls are provided in the linear bearing, which can effectively reduce the friction between the guide rod 32 and the guide seat 4, thereby facilitating the transmission effect of the connecting rod assembly 3.

[0071] Furthermore, the linear bearing can specifically be a ceramic linear bearing, which can improve the corrosion resistance and structural stability of the linear bearing, and can prevent the linear bearing from being corroded by the liquid in the cleaning box 200, thereby increasing the service life of the linear bearing.

[0072] In some embodiments of the present invention, Figure 1-Figure 6 As shown, the carrier 1 is movably disposed in the cleaning box 200 along a first direction, and the first direction is parallel to the horizontal direction. One end of the connecting rod assembly 3 connected to the carrier 1 can move along the first direction under the drive of the driving unit 2, so that the wafer 300 in the cleaning box 200 can be moved in the first direction, that is, the position of the wafer 300 in the cleaning box 200 can be adjusted, so that the wafer 300 can adapt to various cleaning conditions of the cleaning box 200 and meet various cleaning process requirements, and the cleaning effect of the wafer 300 can also be improved.

[0073] Furthermore, the connecting rod assembly 3 includes a first rod 31, a guide rod 32 and a connecting rod assembly 33, one end of the first rod 31 is rotatably connected to the carrier 1, the guide rod 32 is movably arranged in the cleaning box 200 along the up and down directions, the lower end of the guide rod 32 is rotatably connected to the other end of the first rod 31, and the driving unit 2 drives the guide rod 32 to move up and down through the connecting rod assembly 33.

[0074] When the guide rod 32 moves in the up and down directions, it can drive the first rod 31 to translate in the up and down directions while causing the first rod 31 to rotate at a certain angle around the rotation axis between the first rod 31 and the guide rod 32. The rotation axis of the first rod 31 extends in the horizontal direction, so that the carrier 1 moves in the first direction under the force transmitted by the first rod 31, and then the wafer 300 in the cleaning box 200 can be moved in the first direction, that is, the position of the wafer 300 in the cleaning box 200 can be adjusted.

[0075] For example, Figure 3 and Figure 6 In the example shown, the guide rod 32 moves upward under the drive of the driving unit 2, which can drive the upper end of the first rod 31 to move upward, and at the same time make the first rod 31 rotate counterclockwise around the rotation axis between the first rod 31 and the guide rod 32, so that the carrier 1 moves along the first direction toward the direction close to the first rod 31, thereby making the wafer 300 move along the first direction toward the direction close to the first rod 31, and the position of the wafer 300 in the cleaning box 200 can be adjusted.

[0076] For example, Figure 2 and Figure 5 In the example shown, the guide rod 32 moves downward under the drive of the drive unit 2, which can drive the upper end of the first rod 31 to move downward, and at the same time make the first rod 31 rotate clockwise around the rotation axis between the first rod 31 and the guide rod 32, so that the carrier 1 moves along the first direction away from the first rod 31, thereby making the wafer 300 move along the first direction away from the first rod 31, so as to achieve the position adjustment of the wafer 300 in the cleaning box 200.

[0077] In some embodiments of the present invention, Figure 1-Figure 6 As shown, the wafer moving device 100 also includes a slide rail 5, which is arranged in the cleaning box 200 and extends along the first direction, and the carrier 1 is movably arranged on the slide rail 5, so that the carrier 1 can be moved along the first direction, so that the movement of the carrier 1 in the cleaning box 200 is smoother, so that the position of the wafer 300 in the first direction can be adjusted, and the structure is simple and easy to implement. For example, the slide rail 5 may include a slide table and a guide rail, the slide table and the guide rail are slidably connected, the guide rail is fixed in the cleaning box 200, and the bottom of the carrier 1 is fixedly connected to the slide table, so that the carrier 1 can slide easily and freely along the first direction on the guide rail along with the slide table.

[0078] In some embodiments of the present invention, the carrier 1 is provided with rollers, which can roll along the slide rail 5. There are multiple rollers, which are arranged at the bottom of the carrier 1, and the outer surfaces of the rollers in the circumferential direction are provided with V-shaped grooves, and the top of the slide rail 5 can be provided with convex ridges matching the V-shaped grooves, so that the rollers at the bottom of the carrier 1 can be stuck on the convex ridges at the top of the slide rail 5 to roll back and forth, which is convenient for realizing the movement of the carrier 1 along the first direction, and at the same time, the carrier 1 can be kept from shaking, thereby enhancing the transmission stability.

[0079] In some embodiments of the present invention, Figure 1-Figure 6 As shown, the two ends of the slide rail 5 along the first direction have limit blocks 51 for limiting the movement of the carrier 1. The limit blocks 51 can play a limiting role, preventing the carrier 1 from falling off the slide rail 5 and preventing the carrier 1 from colliding with structures such as the wall of the cleaning box 200 during movement, thereby ensuring the safety and stability of the movement of the carrier 1.

[0080] Preferably, the limit block 51 is fixed on the bottom wall of the cleaning box 200, and the limit block 51 is provided with a waist-shaped hole, so that the installation position of the limit block 51 on the bottom wall of the cleaning box 200 can be adjusted in a small range according to actual conditions, which is convenient for installation.

[0081] In some embodiments of the present invention, Figure 7-Figure 12 As shown, the carrier 1 is rotatably disposed in the cleaning box 200 around an axis extending along the second direction, the connection point between the connecting rod assembly 3 and the carrier 1 is spaced apart from the rotation axis of the carrier 1, and the second direction is parallel to the horizontal direction. The connection point between the connecting rod assembly 3 and the carrier 1 can rotate around the axis extending along the second direction under the drive of the driving unit 2, so that the wafer 300 in the cleaning box 200 can be deflected at a certain angle, that is, the inclination angle of the wafer 300 in the cleaning box 200 can be adjusted, so that the wafer 300 can adapt to various cleaning conditions of the cleaning box 200 and meet various cleaning process requirements, and the cleaning effect of the wafer 300 can also be improved.

[0082] Furthermore, the connecting rod assembly 3 includes a first rod 31, a guide rod 32 and a connecting rod assembly 33, one end of the first rod 31 is rotatably connected to the carrier 1, the guide rod 32 is movably arranged in the cleaning box 200 along the up and down directions, the lower end of the guide rod 32 is rotatably connected to the other end of the first rod 31, and the driving unit 2 drives the guide rod 32 to move up and down through the connecting rod assembly 33.

[0083] When the guide rod 32 moves in the up and down directions, it can drive the first rod 31 to translate in the up and down directions, and at the same time, the first rod 31 can rotate at a certain angle around the rotation axis between the first rod 31 and the guide rod 32. The rotation axis of the first rod 31 extends in the horizontal direction, so that the connection point between the carrier 1 and the first rod 31 rotates around the axis extending in the second direction, and then the wafer 300 can be deflected at a certain angle, that is, the inclination angle of the wafer 300 in the cleaning box 200 can be adjusted.

[0084] For example, Figure 8 and Fig.11 In the example shown, the guide rod 32 moves upward when driven by the driving unit 2, which can drive the upper end of the first rod 31 to move upward, and at the same time make the first rod 31 rotate counterclockwise around the rotation axis between the first rod 31 and the guide rod 32, so that the connection point between the carrier 1 and the first rod 31 rotates clockwise around the axis extending along the second direction, so that the wafer 300 can be deflected at a certain angle, thereby realizing the adjustment of the inclination angle of the wafer 300 in the cleaning box 200.

[0085] For example, Fig. 9 and Fig.12 In the example shown, the guide rod 32 moves downward under the drive of the driving unit 2, which can drive the upper end of the first rod 31 to move downward, and at the same time make the first rod 31 rotate clockwise around the rotation axis between the first rod 31 and the guide rod 32, so that the connection point between the carrier 1 and the first rod 31 rotates counterclockwise around the axis extending along the second direction, so that the wafer 300 can be deflected at a certain angle, thereby realizing the adjustment of the inclination angle of the wafer 300 in the cleaning box 200.

[0086] In some embodiments of the present invention, Figure 7-Figure 12 As shown, the wafer moving device 100 also includes a fixed seat 6, which is disposed in the cleaning box 200, and the carrier 1 is rotatably disposed on the fixed seat 6, so that it is easy to realize the rotation of the carrier 1 around the axis extending along the second direction. While realizing the rotatability of the carrier 1, the stability of the carrier 1 in the cleaning box 200 is guaranteed, and the structure is simple and easy to realize. For example, a rotating shaft 61 can be provided on the fixed seat 6, and the rotating shaft 61 extends along the second direction. The rotating shaft 61 passes through the carrier 1 and the fixed seat 6, and the carrier 1 is fixedly connected to the rotating shaft 61, and the rotating shaft 61 is rotatably connected to the fixed seat 6, so that the carrier 1 can be rotated around the rotating shaft 61.

[0087] In some embodiments of the present invention, Figure 1-Figure 12As shown, the driving unit 2 is arranged at the top of the outer wall of the washing box 200, and the connecting rod assembly 3 extends from the top of the washing box 200 into the washing box 200. In this way, the connecting rod assembly 3 can connect the driving unit 2 outside the washing box 200 and the carrier 1 inside the washing box 200, and can also avoid operations such as punching holes in the washing box 200, thereby ensuring the structural integrity of the washing box 200 and preventing liquid leakage in the washing box 200.

[0088] If the output shaft and the connecting rod assembly of the driving unit are directly passed through the side wall of the cleaning box and thus extend into the cleaning box, it is necessary to set a bearing and other structures between the side wall of the cleaning box and the connecting rod assembly. The structure is complex and the cost is high. At the same time, it is difficult to meet the sealing requirements of the side wall of the cleaning box. The liquid in the cleaning box is easy to seep out from between the side wall of the cleaning box and the connecting rod assembly.

[0089] In some embodiments of the present invention, Figure 1-Figure 12 As shown, the wafer moving device 100 further includes a mounting seat 7, which is disposed on the outer wall surface of the cleaning box 200, and the driving unit 2 is disposed on the mounting seat 7. By providing the mounting seat 7, it is convenient to fix the driving unit 2 on the wall surface of the cleaning box 200, which can reduce the difficulty of installing the driving unit 2, thereby improving the installation efficiency, and is also conducive to enhancing the connection stability between the driving unit 2 and the cleaning box 200.

[0090] In some embodiments of the present invention, the position of the mounting seat 7 on the outer wall of the cleaning box 200 is adjustable, and the mounting hole for connecting the mounting seat 7 and the cleaning box 200 can be designed as a transverse or longitudinal waist-shaped hole, so that the installation position of the mounting seat 7 on the outer wall of the cleaning box 200 can be adjusted in a small range according to actual conditions, which is convenient for installation.

[0091] In some embodiments of the present invention, the position of the drive unit 2 on the mounting base 7 is adjustable, and the mounting hole for connecting the mounting base 7 and the drive unit 2 can be designed as a transverse or longitudinal waist-shaped hole, so that the installation position of the drive unit 2 on the mounting base 7 can be adjusted in a small range according to actual conditions, which is convenient for installation.

[0092] In some embodiments of the present invention, the carrier 1 is made of a corrosion-resistant material, which can improve the corrosion resistance and structural stability of the carrier 1, and can prevent the carrier 1 from being corroded by the liquid in the cleaning tank 200, thereby increasing the service life of the carrier 1. Specifically, the carrier 1 can be made of PEEK (Poly-ether-ether-ketone), PP (Polypropylene), etc. Of course, other corrosion-resistant materials can also be used, and this application does not specifically limit this.

[0093] In some embodiments of the present invention, the connecting rod assembly 3 is made of a corrosion-resistant material, which can improve the corrosion resistance and structural stability of the connecting rod assembly 3, and can prevent the connecting rod assembly 3 from being corroded by the liquid in the cleaning tank 200, thereby improving the service life of the connecting rod assembly 3. Specifically, the connecting rod assembly 3 can be made of PEEK, ceramics, etc. Of course, other corrosion-resistant materials can also be used, and this application does not make specific limitations on this.

[0094] In some embodiments of the present invention, the guide seat 4 is made of a corrosion-resistant material with a low friction coefficient, which can improve the corrosion resistance and structural stability of the guide seat 4, and can prevent the guide seat 4 from being eroded by the liquid in the cleaning tank 200, thereby increasing the service life of the guide seat 4. At the same time, the friction of the up and down movement of the guide rod 32 can be reduced, which is conducive to enhancing the transmission effect of the connecting rod assembly 3. Specifically, the guide seat 4 can be made of PTFE (Polytetrafluoroethylene, polytetrafluoroethylene), of course, other corrosion-resistant materials with a low friction coefficient can also be used, and this application does not make specific restrictions on this.

[0095] In some embodiments of the present invention, the fixing seat 6 is made of a corrosion-resistant material, which can improve the corrosion resistance and structural stability of the fixing seat 6, and can prevent the fixing seat 6 from being corroded by the liquid in the cleaning tank 200, thereby improving the service life of the fixing seat 6. Specifically, the fixing seat 6 can be made of PEEK, PP, etc. Of course, other corrosion-resistant materials can also be used, and this application does not make specific limitations on this.

[0096] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0097] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer moving device, characterized in that: For washing tank and comprising: A carrier, the carrier is used to mount the wafer and is suitable for being movably arranged in the cleaning box; A driving unit, wherein the driving unit is arranged outside the cleaning box; A connecting rod assembly, at least part of which is located in the cleaning box, the connecting rod assembly connects the drive unit and the carrier, the connecting rod assembly includes a guide rod, and the guide rod is movably arranged in the cleaning box along the up and down directions. The drive unit drives the carrier to move by driving the guide rod up and down.

2. The wafer moving device according to claim 1, characterized in that: The connecting rod assembly also includes: a first rod, one end of which is rotatably connected to the carrier, and a lower end of the guide rod is rotatably connected to the other end of the first rod; A connecting rod assembly is located above the guide rod and has one end connected to the upper end of the guide rod and the other end connected to the driving unit. The driving unit drives the guide rod to move up and down through the connecting rod assembly to drive the carrier to move.

3. The wafer moving device according to claim 2, characterized in that: The driving unit is a linear motion mechanism, the linear motion mechanism includes a linear motion component, and the connecting rod assembly includes: A connecting block is fixedly connected to the linear motion component and the guide rod, and the moving direction of the linear motion component is the same as the moving direction of the guide rod.

4. The wafer moving device according to claim 2, characterized in that: The driving unit is a rotary motion mechanism, the rotary motion mechanism has a rotating member, the rotation axis of the rotating member extends in a horizontal direction, and the connecting rod assembly includes: a second rod, one end of which is fixedly connected to the rotating member; A third rod, one end of the third rod is rotatably connected to the other end of the second rod, and the other end of the third rod is rotatably connected to the upper end of the guide rod.

5. The wafer moving device according to claim 1, characterized in that: The wafer moving device also includes: A guide seat is arranged in the cleaning box, and the guide rod is passed through the guide seat along the up-down direction and is movable along the up-down direction.

6. The wafer moving device according to claim 5, characterized in that: A linear bearing is arranged on the guide seat, and the linear bearing extends in the up-down direction and is sleeved on the guide rod.

7. The wafer moving device according to claim 1, characterized in that: The carrier is movably disposed in the cleaning box along a first direction, and the first direction is parallel to a horizontal direction.

8. The wafer moving device according to claim 7, characterized in that: The wafer moving device also includes: a slide rail, the slide rail being arranged in the cleaning box and extending along the first direction, the carrier being movably arranged on the slide rail, The carrier is provided with a roller, and the roller can roll along the slide rail. The two ends of the slide rail along the first direction have limit blocks for limiting the movement of the carrier.

9. The wafer moving device according to claim 1, characterized in that: The carrier is rotatably disposed in the cleaning box around an axis extending along a second direction, the connection point between the connecting rod assembly and the carrier is spaced apart from the rotation axis of the carrier, and the second direction is parallel to the horizontal direction.

10. The wafer moving device according to claim 9, characterized in that: The wafer moving device also includes: A fixed seat is arranged in the cleaning box, and the carrier is rotatably arranged on the fixed seat.

11. The wafer moving device according to claim 1, characterized in that: The driving unit is arranged on the top of the outer wall of the cleaning box, and the connecting rod assembly extends into the cleaning box from the top of the cleaning box.

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