PCBA patch processing method

Abstract

The invention relates to the technical field of PCBA patch processing, and discloses a PCBA patch processing method comprising the following steps: S1, PCB processing simulation optimization: obtaining process parameters and a production flow of actual production, and an improved PCB; s2, surface mounting and plug-in processing: SMT surface mounting processing and DIP plug-in processing are carried out to form a PCBA board; s3, PCBA board quality detection and analysis: analyzing the data, and adjusting subsequent process parameters and production processes in real time; and S4, quality evaluation control and early warning: forming a quality evaluation report. The method comprises the following steps: firstly, simulating PCBA patch processing, optimizing preliminarily determined process parameters and production flow, and improving a PCB; then, a standardized production environment is established, and SMT patch processing and DIP plug-in processing are sequentially carried out on the improved PCB; and then quality detection is carried out on the PCBA board, and state and production quality data are analyzed, so that subsequent process parameters and production processes are adjusted in real time, and the yield and the yield of the PCBA board are improved.

Description

Technical Field

[0001] The invention relates to the technical field of PCBA patch processing, and in particular to a PCBA patch processing method. Background Art

[0002] PCBA board plays a vital role in the manufacturing of modern electronic products. It is the core component of electronic equipment. PCBA patch processing is the process of accurately soldering electronic components to printed circuit boards (PCBs), which mainly includes two main steps: SMT patch processing and DIP plug-in processing. Its processing method directly affects the performance, stability and reliability of the product.

[0003] A Chinese patent discloses a PCBA processing method and a PCBA board based on a combination of plug-in component technology and patch technology (authorization announcement number CN104507271B). This patented technology combines the advantages of the plug-in process and the patch process, using plug-in packaged components and PCB boards with patch pads, combined with automatic spot heating and welding technology, saving labor costs and material costs for PCBA processing, reducing the temperature resistance requirements for components, and improving the production efficiency and product qualification rate of PCB boards. It has good economic and social benefits, but it cannot monitor and analyze the quality during the patch process, and thus cannot guarantee the processing quality of the PCBA board. Summary of the invention

[0004] The object of the present invention is to provide a PCBA patch processing method to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A PCBA patch processing method comprises the following steps:

[0007] S1. PCB board processing simulation optimization: According to the design drawings of the PCB board to be processed, as well as the previous processing experience and methods, preliminarily determine the process parameters and production process of PCBA patch processing; use PCBA simulation production verification software to simulate the PCBA patch processing process with the preliminarily determined process parameters and production process; optimize the process parameters and production process based on the feedback information, and identify potential problems in the PCB board design; thereby obtaining the actual production process parameters and production process, as well as the improved PCB board;

[0008] S2, patch and plug-in processing: according to the determined process parameters and production process, a standardized production environment is established, and the improved PCB board is processed by SMT patch and DIP plug-in in turn to form a PCBA board;

[0009] S3, PCBA board quality inspection and analysis: perform automatic optical inspection, online testing and functional testing on PCBA boards in sequence, collect equipment status and production quality data, and analyze the data to adjust subsequent process parameters and production processes in real time to improve yield and output;

[0010] S4. Quality assessment control and early warning: The analyzed data is stored in the database and a quality assessment report is generated. According to the evaluation report, abnormal signs and abnormal development trends are discovered in a timely manner, measures are taken to eliminate their impact, and real-time tracking and verification are carried out. When the abnormal quality development trend is out of control, an early warning signal is immediately issued and corresponding treatment suggestions are provided. At the same time, abnormal data is recorded and stored to facilitate subsequent analysis and management.

[0011] As a further solution of the present invention: in the step S2, the steps of establishing a standardized production environment are as follows:

[0012] S201. Set the temperature and humidity range and air purification level in the production environment;

[0013] S202, maintaining the production environment within a set temperature and humidity range, and ensuring that the air purification degree in the production environment meets the set requirements;

[0014] S203. Use temperature and humidity monitoring equipment and air purity monitoring equipment to monitor the production environment in real time, and make timely adjustments to maintain a stable environment.

[0015] As a further solution of the present invention: in the step S2, the steps of SMT patch processing are as follows:

[0016] S211, solder paste printing: according to the determined process parameters, print solder paste on the PCB board to be processed, so as to provide welding points for the subsequent component electronic parts mounting;

[0017] S212, electronic component placement: according to the determined process parameters, the electronic components are placed on the designated positions of the PCB board by the placement machine, and the placement process is monitored online to ensure the placement accuracy;

[0018] S213, reflow soldering: according to the determined process parameters, the PCB board mounted with electronic components is sent into the reflow soldering furnace, and the solder paste is melted and soldering is completed by reflow soldering, so that the electronic components and the PCB board are firmly soldered together.

[0019] As a further solution of the present invention: in the step S211, the process parameters of solder paste printing include: thickness and uniformity of the solder paste.

[0020] As a further solution of the present invention: in the step S212, the process parameters of electronic component mounting include: nozzle air pressure of the mounting machine, bonding force, mounting route and mounting speed; online monitoring items include mounting rate, downtime rate and mounting accuracy.

[0021] As a further solution of the present invention: in the step S213, the process parameters of the reflow soldering include: the temperature of the reflow soldering furnace and the soldering time.

[0022] As a further solution of the present invention: in the step S2, DIP plug-in processing is used to process larger or special electronic components. Each electronic component is manually inserted into the PCB board in the correct direction and position, and then after coating with flux, the electronic component is soldered to the PCB board by wave soldering.

[0023] As a further solution of the present invention: in the step S3, the automatic optical inspection is used to detect the welding quality, the online test is used to verify the electrical performance of the circuit board, and the functional test is used to detect whether the function of the PCBA board is normal.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The present invention firstly optimizes the preliminarily determined process parameters and production process through simulation of PCBA patch processing, and improves the PCB board; then establishes a standardized production environment, and sequentially performs SMT patch processing and DIP plug-in processing on the improved PCB board; then performs quality inspection on the PCBA board, and analyzes the status and production quality data, so as to adjust the subsequent process parameters and production process in real time, so as to improve the yield and output of the PCBA board. DETAILED DESCRIPTION

[0026] In an embodiment of the present invention, a PCBA patch processing method includes the following steps: S1. PCB board processing simulation optimization: According to the design drawings of the PCB board to be processed, as well as the previous processing experience and methods, preliminarily determine the process parameters and production process of PCBA patch processing; use PCBA simulation production verification software to simulate the PCBA patch processing process with the preliminarily determined process parameters and production process; optimize the process parameters and production process based on the feedback information, and identify potential problems in the PCB board design; thereby obtaining the actual production process parameters and production process, as well as the improved PCB board; among them, the PCBA simulation production verification software can be Altium Designer software, Eagle software, KiCad software; S2. SMT and DIP processing: According to the determined process parameters and production process, a standardized production environment is established, and the improved PCB board is processed by SMT and DIP in turn to form a PCBA board; S3, PCBA board quality inspection and analysis: Perform automatic optical inspection, online testing and functional testing on the PCBA board in turn, collect equipment status and production quality data, and analyze the data, so as to adjust the subsequent process parameters and production process in real time to improve the yield rate and output; for example, according to the position of the electronic components mounted on the PCB board and the actual position of the electronic components on the PCB board after reflow soldering, determine the best mounting position of the electronic components, so as to adjust the mounting position in time in the subsequent mounting process to improve the accuracy of the electronic components on the PCB board; S4. Quality assessment control and early warning: The analyzed data is stored in the database and a quality assessment report is generated. According to the evaluation report, abnormal signs and abnormal development trends are discovered in a timely manner, measures are taken to eliminate their impact, and real-time tracking and verification are carried out. When the abnormal quality development trend is out of control, an early warning signal is immediately issued and corresponding treatment suggestions are provided. At the same time, abnormal data is recorded and stored to facilitate subsequent analysis and management.

[0031] Preferably, in the step S2, the steps of establishing a standardized production environment are as follows:

[0032] S201. Set the temperature and humidity range and air purification level in the production environment;

[0033] S202, maintaining the production environment within a set temperature and humidity range, and ensuring that the air purification degree in the production environment meets the set requirements;

[0034] S203. Use temperature and humidity monitoring equipment and air purity monitoring equipment to monitor the production environment in real time, and make timely adjustments to maintain a stable environment.

[0035] Preferably, in the step S2, the steps of SMT patch processing are as follows:

[0036] S211, solder paste printing: according to the determined process parameters, print solder paste on the PCB to be processed, so as to provide soldering points for the subsequent assembly of electronic components; the process parameters of solder paste printing include: the thickness and uniformity of solder paste. Therefore, too much or too little solder paste thickness, as well as poor uniformity, may cause subsequent PCBA board failure, reduce the yield rate, and cause a lot of rework, so it is necessary to control the thickness and uniformity of solder paste;

[0037] S212, electronic component placement: according to the determined process parameters, electronic components are placed on the specified position of the PCB board by the placement machine, and the placement process is monitored online to ensure the placement accuracy; the process parameters of electronic component placement include: nozzle air pressure of the placement machine, bonding force, placement route and placement speed; the online monitoring items include placement rate, downtime rate and placement accuracy, among which, the placement rate represents the ratio between the number of placements and the number of adsorption of electronic components in one working day, the number of adsorption errors, the number of recognition errors, the number of stand-up pieces and the number of losses are included in the number of placements, while the number of placements does not include these data; the downtime rate represents the ratio of the downtime time of the placement machine to the working time in one working day, so as to judge the working efficiency and performance of the placement machine; the placement accuracy represents the difference between the actual position and the designed position of the electronic component placed on the PCB board;

[0038] S213, reflow soldering: according to the determined process parameters, the PCB board mounted with electronic components is sent into the reflow soldering furnace, and the solder paste is melted and soldering is completed by reflow soldering, so that the electronic components and the PCB board are firmly soldered together; the process parameters of reflow soldering include: the temperature of the reflow soldering furnace and the soldering time. Therefore, when the temperature is too low or the soldering time is too short, the solder paste may not be completely melted, which is insufficient to form a uniform solder joint contact, thereby causing cold soldering defects; when the temperature is too high or the soldering time is too long, its fluidity and curing time are affected, resulting in unstable solder joints. Therefore, it is necessary to control the temperature and soldering time of the reflow soldering furnace.

[0039] Preferably, in the step S2, DIP plug-in processing is used to process larger or special electronic components, and each electronic component is manually inserted into the PCB board in the correct direction and position, and then after applying flux, the electronic component is soldered to the PCB board by wave soldering.

[0040] Preferably, in the step S3, automatic optical inspection is used to detect welding quality, such as identifying welding defects, misalignment, and missing paste problems; online testing is used to verify the electrical performance of the circuit board, such as whether there are short circuits, empty solder joints, cold solder joints, broken wires, missing parts, wrong materials, and defective electronic components; functional testing is used to detect whether the function of the PCBA board is normal, such as whether signal transmission can be performed, whether the heat dissipation and protection are qualified, and whether the mechanical support mechanism is stable.

[0041] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A PCBA patch processing method, characterized in that: The following steps are involved: S1. PCB board processing simulation optimization: According to the design drawings of the PCB board to be processed, as well as previous processing experience and methods, the process parameters and production process of PCBA patch processing are preliminarily determined; PCBA simulation production verification software is used to simulate the PCBA patch processing process with the preliminarily determined process parameters and production process; Optimize process parameters and production processes based on feedback information, and identify potential problems in PCB board design; Thus, the actual production process parameters and production process, as well as the improved PCB board, can be obtained; S2, patch and plug-in processing: according to the determined process parameters and production process, a standardized production environment is established, and the improved PCB board is processed by SMT patch and DIP plug-in in turn to form a PCBA board; S3, PCBA board quality inspection and analysis: perform automatic optical inspection, online testing and functional testing on PCBA boards in sequence, collect equipment status and production quality data, and analyze the data to adjust subsequent process parameters and production processes in real time to improve yield and output; S4. Quality assessment control and early warning: The analyzed data is stored in the database and a quality assessment report is generated. According to the evaluation report, abnormal signs and abnormal development trends are discovered in a timely manner, measures are taken to eliminate their impact, and real-time tracking and verification are carried out. When the abnormal quality development trend is out of control, an early warning signal is immediately issued and corresponding treatment suggestions are provided. At the same time, abnormal data is recorded and stored to facilitate subsequent analysis and management.

2. A PCBA patch processing method according to claim 1, characterized in that: In the S2 step, the steps for establishing a standardized production environment are as follows: S201. Set the temperature and humidity range and air purification level in the production environment; S202, maintaining the production environment within a set temperature and humidity range, and ensuring that the air purification degree in the production environment meets the set requirements; S203. Use temperature and humidity monitoring equipment and air purity monitoring equipment to monitor the production environment in real time, and make timely adjustments to maintain a stable environment.

3. A PCBA patch processing method according to claim 1, characterized in that: In the S2 step, the steps of SMT patch processing are as follows: S211, solder paste printing: according to the determined process parameters, print solder paste on the PCB board to be processed, so as to provide welding points for the subsequent component electronic parts mounting; S212, electronic component placement: according to the determined process parameters, the electronic components are placed on the designated positions of the PCB board by the placement machine, and the placement process is monitored online to ensure the placement accuracy; S213, reflow soldering: according to the determined process parameters, the PCB board mounted with electronic components is sent into the reflow soldering furnace, and the solder paste is melted and soldering is completed by reflow soldering, so that the electronic components and the PCB board are firmly soldered together.

4. A PCBA patch processing method according to claim 3, characterized in that: In the step S211, the process parameters of solder paste printing include: thickness and uniformity of the solder paste.

5. A PCBA patch processing method according to claim 3, characterized in that: In the step S212, the process parameters of electronic component mounting include: nozzle air pressure of the mounting machine, mounting force, mounting route and mounting speed; and the items to be monitored online include mounting rate, downtime rate and mounting accuracy.

6. A PCBA patch processing method according to claim 3, characterized in that: In the step S213, the process parameters of the reflow soldering include: the temperature of the reflow soldering furnace and the soldering time.

7. A PCBA patch processing method according to claim 1, characterized in that: In the step S2, DIP plug-in processing is used to process larger or special electronic components. Each electronic component is manually inserted into the PCB board in the correct direction and position, and then the electronic component is soldered to the PCB board by wave soldering after being coated with flux.

8. A PCBA patch processing method according to claim 1, characterized in that: In the step S3, the automatic optical inspection is used to detect the welding quality, the online test is used to verify the electrical performance of the circuit board, and the functional test is used to detect whether the function of the PCBA board is normal.