Heat dissipation device with heat insulation channel

Abstract

A heat dissipation device with a heat insulation channel comprises a heat conduction substrate, a plurality of heat dissipation fins stacked on the heat conduction substrate at intervals and at least one insulation guide piece, the heat dissipation fins are at least provided with a configuration space, and the insulation guide piece is arranged in the configuration space. The base is provided with a bottom, two side parts which respectively extend upwards from the bottom, and a channel which is formed by jointly surrounding the bottom and the two side parts; the width of the channel is at least larger than the distance between any two adjacent heat dissipation fins.

Description

Technical Field

[0001] The present application relates to a radiator, and more particularly to a heat dissipation device with a heat-insulating channel. Background Art

[0002] The existing fin-type heat sink or heat dissipation device mainly sets a plurality of heat dissipation fins on the bottom part that receives heat, and the increase in the number of heat dissipation fins can help increase the amount of heat that can be absorbed, thereby improving the heat conduction efficiency. Therefore, the existing fin-type heat sinks continue to increase the number of fins on the limited bottom part, especially by reducing the spacing between the fins to free up more space, so that more fins can be configured.

[0003] However, under the above design, the thermal resistance and flow resistance between the fins will increase due to the continuous reduction in the fin spacing, making it difficult for the outside air to enter through the spacing between the fins and take away the heat. Therefore, although more fins can be used to improve the heat conduction efficiency, the heat dissipation efficiency in convection with the outside air is greatly reduced due to the increase in thermal resistance and flow resistance.

[0004] In view of this, in order to improve and solve the above-mentioned deficiencies, the applicant has devoted himself to research and applied scientific theories, and finally proposed an application with a reasonable design that effectively improves the above-mentioned deficiencies. Summary of the invention

[0005] The main purpose of the present application is to provide a heat dissipation device with an insulating channel, which utilizes a hollow insulating guide to enable the external airflow to maintain its relatively low temperature and be guided to the corresponding heat source in the radiator or the heat dissipation device, so as to help reduce its thermal resistance and flow resistance, and increase the heat dissipation efficiency of the external airflow in convection; secondly, it can also achieve the effect of saving materials.

[0006] In order to achieve the above-mentioned purpose, the present application provides a heat dissipation device with an insulating channel, including a heat-conducting substrate, a plurality of heat-dissipating fins stacked at intervals on the heat-conducting substrate, and at least one insulating guide, and at least one configuration space is opened on the heat-dissipating fins, and the insulating guide is arranged in the configuration space and has a bottom, and two side portions f extending upward from the bottom respectively, and also has a channel formed by the bottom and the two side portions; wherein the width of the channel is at least greater than the interval between any two adjacent heat-dissipating fins.

[0007] In one embodiment, the heat-conducting substrate is in the form of a flat plate, or a temperature-averaging plate, or is composed of a solid plate combined with a heat pipe.

[0008] In one embodiment, at least one heat source corresponds to the bottom of the heat-conducting substrate, and the channel of the insulating guide corresponds to at least the top of the heat source.

[0009] In one embodiment, a plurality of heat dissipation fins are respectively upright and vertically disposed on the heat conductive substrate.

[0010] In one embodiment, two side portions of the insulating guide are consistent with the extension direction of the plurality of heat dissipation fins.

[0011] In one embodiment, the plurality of heat dissipation fins include first fins and second fins, the second fins are arranged in plurality between two groups of first fins arranged in plurality, and the length of the first fins is greater than the length of the second fins.

[0012] In one embodiment, the length of the insulating guide is the difference between the first fin and the second fin.

[0013] In one embodiment, the insulating guide is located between two groups of first fins arranged in a plurality.

[0014] In one embodiment, a plurality of insulating guides are provided.

[0015] In one embodiment, the insulating guide further has a top portion, which is connected to the upper portion between the two side portions and is closed at the upper portion of the channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional exploded schematic diagram of the present application.

[0017] Figure 2 It is a three-dimensional combination schematic diagram of this application.

[0018] Figure 3 This is a schematic plan view of the present application.

[0019] Figure 4 Based on Figure 3 Sectional view of section 4-4.

[0020] Figure 5 It is a schematic exploded perspective view of another embodiment of the present application.

[0021] Description of reference numerals:

[0022] 1: Thermally conductive substrate;

[0023] 2: cooling fins;

[0024] 2a: Configuration space;

[0025] 20: first fin;

[0026] 21: second fin;

[0027] 22: third fin;

[0028] 3: Insulation guide;

[0029] 30: bottom;

[0030] 300: channel;

[0031] 31: lateral part;

[0032] 32: Top;

[0033] 4: Heat source;

[0034] D: width;

[0035] d: spacing;

[0036] L1: length;

[0037] L2: length;

[0038] L3: Length. DETAILED DESCRIPTION

[0039] In order to enable you, the examiner, to further understand the features and technical contents of this application, please refer to the following detailed description and drawings of this application. However, the attached drawings are only provided for reference and explanation and are not intended to limit this application.

[0040] See also Figure 1 and Figure 2 , which are respectively a three-dimensional exploded schematic diagram and a three-dimensional combined schematic diagram of the present application. The present application provides a heat dissipation device with a heat-insulating channel, comprising a heat-conducting substrate 1, a plurality of heat-dissipating fins 2 arranged on the heat-conducting substrate 1, and at least one insulating guide 3; wherein:

[0041] The thermally conductive substrate 1 is made of a material with good thermal conductivity, such as copper or aluminum. In the embodiment of the present application, the thermally conductive substrate 1 may be in the form of a flat plate, and the bottom of the thermally conductive substrate 1 is used to be attached to the surface of a heat source 4 such as an electronic heating component to help the heat source 4 dissipate heat; in other feasible embodiments, the thermally conductive substrate 1 may also be a vapor chamber, or a solid plate combined with a heat pipe (heat pipe) (not shown).

[0042] The plurality of heat sink fins 2 are also made of a material with good thermal conductivity, such as copper or aluminum. The plurality of heat sink fins 2 are stacked and arranged on the thermal conductive substrate 1 at intervals; Figure 3 As shown, in the embodiment of the present application, each heat sink fin 2 is vertically disposed on the thermally conductive substrate 1, and any two adjacent heat sink fins 2 are stacked at a distance and have a distance d therebetween, and can provide external airflow (i.e. Figure 4 As shown in the figure, the heat source 4 is absorbed by each heat sink fin 2 and enters through the interval d between any two adjacent heat sink fins 2 to take away the heat generated by each heat sink fin 2 absorbing the heat source 4.

[0043] Please see again Figure 1 and Figure 2 As shown, the insulating guide 3 is made of insulating material, preferably plastic with good heat insulation. The insulating guide 3 has a bottom 30 and two side portions 31 extending upward from the bottom 30, and has a channel 300 formed by the bottom 30 and the two side portions 31. A configuration space 2a is provided on the plurality of heat sink fins 2, so that the insulating guide 3 is arranged in the configuration space 2a, and the bottom 30 of the insulating guide 3 is attached to the thermal conductive substrate 1, and the two side portions are consistent with the extension direction of the plurality of heat sink fins 2; and as shown Figure 3 As shown, the width D of the configuration space 2a (or channel 300) is at least greater than the distance d between any two adjacent heat sink fins 2 to avoid the distance d being too small to increase the flow resistance and hinder the entry of external airflow.

[0044] like Figure 1 , Figure 2 and Figure 4 As shown, in this embodiment, the plurality of heat sink fins 2 may include a first fin 20, a second fin 21 and a third fin 22; wherein the second fin 21 is arranged in a plurality between two groups of first fins 20 arranged in a plurality, and the length L1 of the first fin 20 is greater than the length L2 of the second fin 21, and the insulating guide 3 is also located between the two groups of first fins 20 arranged in a plurality, and the length L3 of the insulating guide 3 can be configured in the configuration space 2a (the length of the configuration space 2a is L1-L2==L3). One end of the channel 300 of the insulating guide 3 can be directly oriented to the external airflow (i.e., Figure 4 As shown in the figure, when the external airflow passes through the channel 300 and enters the insulating guide 3, the heat insulation performance of the bottom 30 and the two side portions 31 of the insulating guide 3 can slow down the temperature rise caused by the heat absorbed by the heat sink 2 before the external airflow reaches the upper part of the heat source 4 corresponding to the heat sink 2, and then the external airflow can be guided to the upper part of the heat source 4 corresponding to the heat sink 2 in a relatively low temperature state, so as to help reduce the thermal resistance and flow resistance in the heat sink fins 2, thereby increasing the heat dissipation efficiency of the external airflow in convection.

[0045] Based on the above, further, the insulating guide 3 may also have a top 32, and the top 32 is connected to the top between the two side parts 31 and is closed at the top of the channel 300; this can help guide the external airflow to actually enter the channel 300.

[0046] In addition, if Figure 1 and Figure 2As shown, in this embodiment, the third fin 22 can be further expanded. Therefore, the heat dissipation fins 2 of the present application are not limited to the first and second fins 20 and 21, and can also be added as needed and arranged on the thermal conductive substrate 1 in multiple numbers, such as the third fin 22.

[0047] Furthermore, if Figure 5 As shown, in other feasible embodiments of the present application, the above-mentioned insulating guide members 3 can also be set in multiple numbers, and can be set according to the heat source corresponding to the thermal conductive substrate 1 (omitted in this figure), so as to ensure that the external airflow can maintain its relatively low temperature through each insulating guide member 3, and is actually introduced to the top of the heat source corresponding to each heat sink fin 2. The lower temperature state maintained by the external airflow is used to reduce the heat concentrated above the heat source, which can effectively increase the heat dissipation efficiency of the airflow in convection, and can reduce the thermal resistance and flow resistance in each heat sink fin 2 by guiding the airflow. Overall, the configuration of the insulating guide member 3 can also reduce the cost of the heat sink fin 2, so it also has the effect of saving materials.

[0048] Therefore, by means of the above-mentioned structure, the heat dissipation device with the heat-insulating channel of the present application can be obtained.

Claims

1. A heat dissipation device with an insulating channel, characterized in that: include: Thermally conductive substrate; A plurality of heat dissipation fins are stacked and arranged on the heat conductive substrate at intervals, and at least a configuration space is provided on the plurality of heat dissipation fins; as well as At least one insulating guide, disposed in the configuration space, and having a bottom, and two side portions extending upward from the bottom, respectively, and a channel formed by the bottom and the two side portions; Wherein, the width of the channel is at least greater than the distance between any two adjacent heat sink fins.

2. The heat dissipation device with a heat-insulating channel according to claim 1, characterized in that: The heat-conducting substrate is in the form of a flat plate, or a temperature-averaging plate, or is composed of a solid plate combined with a heat pipe.

3. The heat dissipation device with a heat-insulating channel according to claim 1 or 2, characterized in that: At least one heat source corresponds to the bottom of the heat-conducting substrate, and the channel of the insulating guide component corresponds to at least the top of the heat source.

4. The heat dissipation device with a heat-insulating channel according to claim 1, characterized in that: The plurality of heat dissipation fins are respectively upright and vertically arranged on the heat-conducting substrate.

5. The heat dissipation device with a heat-insulating channel according to claim 1 or 4, characterized in that: Two side portions of the insulating guide are consistent with an extending direction of the plurality of heat dissipation fins.

6. The heat dissipation device with a heat-insulating channel according to claim 1, characterized in that: The plurality of heat dissipation fins include first fins and second fins. The second fins are arranged in plurality between two groups of the first fins arranged in plurality. The length of the first fins is greater than the length of the second fins.

7. The heat dissipation device with a heat-insulating channel according to claim 6, characterized in that: The length of the insulating guide is the difference between the first fin and the second fin.

8. The heat dissipation device with a heat-insulating channel according to claim 6 or 7, characterized in that: The insulating guide is located between two groups of the first fins arranged in a plurality.

9. The heat dissipation device with a heat-insulating channel according to claim 1, characterized in that: The insulating guide is provided in plurality.

10. The heat dissipation device with a heat-insulating channel according to claim 1 or 9, characterized in that: The insulating guide also has a top portion, which is connected to the upper portion between the two side portions and is closed at the upper portion of the channel.

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