Test equipment with heat dissipation function

Abstract

The invention discloses test equipment with a heat dissipation function. The test equipment comprises a workbench, two mounting plates arranged in a step shape and a plurality of test mechanisms arranged at the upper parts of the mounting plates, the testing mechanism comprises a base, a first driving assembly, a second driving assembly, a mounting frame and a pressing assembly; the equipment is used for solving the problems that in the process of testing a chip in a circuit board, the chip can heat, the chip can generate a large amount of heat in the testing process, the testing effect can be influenced by temperature rise, heat dissipation cannot be conducted on the chip in time, and the risk of chip damage exists.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a testing device with a heat dissipation function. Background Art

[0002] The electronics industry conducts comprehensive testing of the various performance of the 8155 chip. The functional test of the 8155 chip generally includes three aspects: processing power, communication function, and power consumption test. The processing power test of the 8155 chip includes data calculation speed and multi-tasking efficiency. The communication function test of the 8155 chip will detect the connection stability and data transmission rate between the chip and various devices. The power consumption of the 8155 chip is tested to ensure that it has good capabilities while meeting performance requirements.

[0003] In addition, stress testing will be carried out to simulate high-load operation to test the stability and reliability of the chip. Through a series of rigorous tests, it is verified whether the 8155 chip meets the design requirements and to provide guarantee for its good performance in actual applications.

[0004] The 8155 chip is generally tested by installing it in the corresponding circuit board for related functional tests. At present, during the test of the chip in the circuit board, the chip will heat up. As the chip generates a lot of heat during the test, the temperature rise will affect the test results. If the chip cannot be cooled in time, there will be a risk of chip damage.

[0005] Therefore, there is an urgent need for a test device with heat dissipation function to solve the problem of chip heat dissipation. Summary of the invention

[0006] In order to solve the above technical problems, the present invention provides a testing device with a heat dissipation function, which is used to solve the problem that during the test of the chip in the circuit board, the chip will generate heat. As the chip generates a large amount of heat during the test process, the increase in temperature will affect the test effect. If the chip cannot be cooled in time, there will be a risk of damaging the chip.

[0007] The technical solution of the present invention is: a test device with heat dissipation function, the test device comprising:

[0008] A workbench, two mounting plates arranged in a stepped manner, and a plurality of testing mechanisms arranged on the upper portions of the mounting plates;

[0009] The testing mechanism comprises a base, a first driving assembly, a second driving assembly, a mounting frame and a pressing assembly, wherein the first driving assembly is arranged at the upper part of the base, the mounting frame is arranged at the upper part of the base, the second driving assembly is arranged at the upper part of the mounting frame, and the pressing assembly is arranged at the moving end of the second driving assembly;

[0010] The down-pressing assembly includes a down-pressing fixing plate, an air duct plate, a down-pressing plate and a heat sink, wherein the down-pressing fixing plate is arranged at the lower part of the second driving member, the air duct plate is arranged at the lower part of the down-pressing fixing plate, the down-pressing plate is arranged at the lower part of the air duct plate, and the heat sink is embedded in the lower part of the down-pressing plate.

[0011] Preferably, the air duct plate is provided with two communicating first air ducts and second air ducts, and the first air duct and the second air duct are vertically arranged;

[0012] The lower surface of the air duct plate is provided with an air duct groove, a first mounting groove, a second mounting groove and a third mounting groove, the second mounting groove and the third mounting groove are located on both sides of the first mounting groove, and the first mounting groove, the second mounting groove and the third mounting groove are all communicated with the air duct groove, and the air duct groove is communicated with the first air duct and the second air duct through a center hole.

[0013] Preferably, the lower pressure plate is provided with a first mounting hole, a second mounting hole and a third mounting hole. After the lower pressure plate is assembled with the air duct plate, the position of the first mounting hole corresponds to the first mounting slot, the position of the second mounting hole corresponds to the second mounting slot, and the position of the third mounting hole corresponds to the third mounting slot. The first mounting hole, the second mounting hole and the third mounting hole are all set as stepped holes.

[0014] Preferably, a limiting step is provided on the outer periphery of the upper part of the heat sink, and the heat sink comprises a first heat sink, a second heat sink and a third heat sink, the first heat sink can be installed in the first mounting hole, the second heat sink can be installed in the second mounting hole, the third heat sink can be installed in the third mounting hole, and the upper part of the first heat sink is connected to the first mounting groove through a spring, the upper part of the second heat sink is connected to the second mounting groove through a spring, and the upper part of the third heat sink is connected to the third mounting groove through an elastic member.

[0015] Preferably, the first heat sink block, the second heat sink block and the third heat sink block are all configured as copper heat sink blocks.

[0016] Preferably, a plurality of guide rods are provided at the lower portion of the mounting frame, and the downward pressing fixing plate is provided with guide holes for matching with the plurality of guide rods.

[0017] Preferably, the upper part of the base is provided with two parallel slide rails, and the lower part of the mounting frame is provided with a sliding block matching the two slide rails;

[0018] The lower part of the base is provided with two parallel guide bars, and the lower part of the base is provided with a plurality of rolling ball heads. In addition, the lower part of the base is provided with a fixing block.

[0019] Preferably, a plurality of guide components for guiding the base are arranged on the upper part of the workbench;

[0020] The guide assembly includes a limit plate and two groups of symmetrically arranged guide units. The guide unit includes two symmetrically arranged guide plates. A guide groove is formed between the two guide plates. The guide groove matches the guide strip.

[0021] Preferably, chamfers are provided on opposite sides of one end of the two guide plates away from the limiting plate.

[0022] Preferably, a plurality of limiting columns are provided at the lower portion of the air duct plate.

[0023] The beneficial technical effects of the present invention are:

[0024] First, the heat sink is installed in a floating manner in the lower pressing plate, and the upper part of the heat sink is connected to the installation groove through a spring. After the second driving component drives the lower pressing plate to press the circuit board, the heat sink contacts the chip in the circuit board. At this time, the spring is in a compressed state to ensure that the heat sink is in full contact with the chip in the circuit board. The compressed cold air can enter the first air duct and the second air duct, and enter the air duct groove through the center hole to directly blow away the heat of the heat sink, thereby cooling the chip in the circuit board to prevent the chip in the circuit board from being overheated and damaged during testing.

[0025] In addition, the heat sink adopts a copper heat sink block, which has good thermal conductivity and can quickly transfer the heat of the chip in the circuit board to the heat sink.

[0026] At the same time, the present invention realizes automated testing, improves testing efficiency, saves testing costs, reduces labor costs, and further improves testing safety, avoiding the occurrence of personnel safety accidents. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 It is a schematic diagram of the structure of the testing mechanism of the present invention;

[0029] Figure 3 It is a schematic diagram of the structure of the pressing assembly of the present invention;

[0030] Figure 4 It is a schematic diagram of the structure of the air duct plate of the present invention;

[0031] Figure 5 It is a schematic diagram of the structure of the lower pressing plate of the present invention;

[0032] Figure 6 It is a schematic diagram of the heat sink structure of the present invention;

[0033] Figure 7 It is a schematic diagram of the structure of the air duct plate and the lower pressure plate of the present invention;

[0034] Figure 8It is a schematic diagram of the base structure of the present invention;

[0035] Fig. 9 It is a schematic diagram of the structure of the guide assembly of the present invention.

[0036] The accompanying drawings are marked as follows:

[0037] 100. Workbench;

[0038] 200, mounting plate; 201, guide assembly; 2011, limit plate; 2012, guide unit; 20121, guide plate; 2013, guide groove;

[0039] 300, test mechanism; 301, base; 3011, slide rail; 3012, guide bar; 3013, rolling ball head; 3014, fixed block; 302, first drive assembly; 303, second drive assembly; 304, mounting frame; 3041, guide rod; 3042, slider; 305, pressing assembly; 3051, pressing fixing plate; 30511, guide hole; 3052, air duct plate; 30521, first air duct; 30522, second air duct; 305 23. Air duct slot; 30524. First mounting slot; 30525. Second mounting slot; 30526. Third mounting slot; 30527. Center hole; 30528. Limiting column; 3053. Lower pressure plate; 30531. First mounting hole; 30532. Second mounting hole; 30533. Third mounting hole; 3054. Heat sink; 30541. Limiting step; 30542. First heat sink; 30543. Second heat sink; 30544. Third heat sink. DETAILED DESCRIPTION

[0040] In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0041] like Figure 1-9 As shown, the present invention specifically relates to a test device with a heat dissipation function, the test device comprising:

[0042] A workbench 100, two mounting plates 200 arranged in a stepped manner, and a plurality of testing mechanisms 300 arranged on the upper part of the mounting plates 200;

[0043] The testing mechanism 300 includes a base 301, a first driving assembly 302, a second driving assembly 303, a mounting frame 304 and a pressing assembly 305, wherein the first driving assembly 302 is arranged on the upper part of the base 301, the mounting frame 304 is arranged on the upper part of the base 301, the second driving assembly 303 is arranged on the upper part of the mounting frame 304, and the pressing assembly 305 is arranged at the moving end of the second driving assembly 303;

[0044] The down-pressing assembly 305 includes a down-pressing fixing plate 3051, an air duct plate 3052, a down-pressing plate 3053 and a heat sink 3054, wherein the down-pressing fixing plate 3051 is arranged at the lower part of the second driving member, the air duct plate 3052 is arranged at the lower part of the down-pressing fixing plate 3051, the down-pressing plate 3053 is arranged at the lower part of the air duct plate 3052, and the heat sink 3054 is embedded in the lower part of the down-pressing plate 3053.

[0045] The heat sink 3054 is floatedly installed in the lower pressure plate 3053, and the upper part of the heat sink 3054 is connected to the installation groove through a spring. After the second driving assembly 303 drives the lower pressure plate 3053 to press the circuit board, the heat sink 3054 contacts the chip in the circuit board. At this time, the spring is in a compressed state, ensuring that the heat sink 3054 is in full contact with the chip in the circuit board. The compressed cold air can enter the first air duct 30521 and the second air duct 30522, and enter the air duct groove 30523 through the center hole 30527 to directly dissipate the heat of the heat sink 3054, thereby cooling the chip in the circuit board to prevent the chip in the circuit board from overheating and damage during testing.

[0046] Further, refer to Figure 2 As shown, the air duct plate 3052 is provided with two communicating first air ducts 30521 and second air ducts 30522, and the first air duct 30521 and the second air duct 30522 are vertically arranged;

[0047] The lower surface of the air duct plate 3052 is provided with an air duct groove 30523, a first mounting groove 30524, a second mounting groove 30525 and a third mounting groove 30526, the second mounting groove 30525 and the third mounting groove 30526 are located on both sides of the first mounting groove 30524, and the first mounting groove 30524, the second mounting groove 30525 and the third mounting groove 30526 are all communicated with the air duct groove 30523, and the air duct groove 30523 is communicated with the first air duct 30521 and the second air duct 30522 through the center hole 30527.

[0048] Both ends of the first air duct 30521 extend to both ends of the air duct plate 3052, and both ends of the second air duct 30522 extend to both ends of the air duct plate 3052. During operation, the two open ends of the second air duct 30522 are sealed by a plug, one open end of the first air duct 30521 is sealed by a plug, and the other open end of the first air duct 30521 is connected to the air source through an air pipe.

[0049] In addition, the lower pressure plate 3053 is provided with a first mounting hole 30531, a second mounting hole 30532 and a third mounting hole 30533. After the lower pressure plate 3053 is assembled with the air duct plate 3052, the position of the first mounting hole 30531 corresponds to the first mounting groove 30524, the position of the second mounting hole 30532 corresponds to the second mounting groove 30525, and the position of the third mounting hole 30533 corresponds to the third mounting groove 30526. The first mounting hole 30531, the second mounting hole 30532 and the third mounting hole 30533 are all set as stepped holes.

[0050] A limiting step 30541 is provided on the periphery of the upper part of the heat sink 3054, and the heat sink 3054 includes a first heat sink 30542, a second heat sink 30543 and a third heat sink 30544, the first heat sink 30542 can be installed in the first mounting hole 30531, the second heat sink 30543 can be installed in the second mounting hole 30532, the third heat sink 30544 can be installed in the third mounting hole 30533, and the upper part of the first heat sink 30542 is connected to the first mounting groove 30524 through a spring, the upper part of the second heat sink 30543 is connected to the second mounting groove 30525 through a spring, and the upper part of the third heat sink 30544 is connected to the third mounting groove 30526 through an elastic member.

[0051] The second driving component 303 is configured as a cylinder. The second driving component 303 drives the pressing fixing plate 3051, the pressing fixing plate 3051 drives the air duct plate 3052, the air duct plate 3052 drives the pressing plate 3053, the pressing plate 3053 drives the heat sink 3054 to press the chip in the circuit board. When the heat sink 3054 contacts the chip, the spring between the first heat sink 30542 and the first mounting groove 30524 is gradually compressed, and the spring between the second heat sink 30543 and the second mounting groove 30525 is gradually compressed. The spring is gradually compressed, and the spring between the third heat sink 30544 and the third mounting slot 30526 is gradually compressed. When the lower pressure plate 3053 contacts the circuit board, the pressing action is completed. At this time, the spring between the first heat sink 30542 and the first mounting slot 30524, the spring between the second heat sink 30543 and the second mounting slot 30525, and the spring between the third heat sink 30544 and the third mounting slot 30526 are all in a compressed state, ensuring that the heat sink 3054 is in full contact with the chip in the circuit board.

[0052] Among them, refer to Figure 3 As shown, the first heat sink 30542 , the second heat sink 30543 and the third heat sink 30544 are all configured as copper heat sinks to improve the thermal conductivity of the first heat sink 30542 , the second heat sink 30543 and the third heat sink 30544 .

[0053] It should be further explained that a plurality of guide rods 3041 are provided at the lower portion of the mounting frame 304 , and the downward pressing fixing plate 3051 is provided with guide holes 30511 for matching with the plurality of guide rods 3041 .

[0054] The stability of the movement of the pressing fixing plate 3051 is improved to improve the accuracy of the contact position between the heat sink 3054 and the chip in the circuit board, and ensure that the chip can fully contact the heat sink 3054.

[0055] In addition, two parallel slide rails 3011 are disposed on the upper portion of the base 301, and a slider 3042 matching the two slide rails 3011 is disposed on the lower portion of the mounting frame 304;

[0056] Two parallel guide bars 3012 are disposed at the bottom of the base 301 , and a plurality of rolling ball heads 3013 are disposed at the bottom of the base 301 . In addition, a fixing block 3014 is disposed at the bottom of the base 301 .

[0057] The first driving member is configured as a cylinder. The first driving member contracts to drive the mounting frame 304 to contract, and the circuit board to be tested is placed on the upper part of the station of the base 301. The first driving member extends to drive the mounting frame 304, and the mounting frame 304 drives the pressing assembly 305 to move to the upper part of the circuit board.

[0058] The upper part of the workbench 100 is provided with a plurality of guide components 201 for guiding the base 301;

[0059] The guide assembly 201 includes a limit plate 2011 and two groups of symmetrically arranged guide units 2012 . The guide unit 2012 includes two symmetrically arranged guide plates 20121 . A guide groove 2013 is formed between the two guide plates 20121 . The guide groove 2013 matches the guide strip 3012 .

[0060] The two guide plates 20121 are chamfered on opposite sides of one end away from the limiting plate 2011 .

[0061] The base 301 can be quickly inserted into the two symmetrically arranged guide plates 20121 through the guide strip 3012 arranged at the bottom, and the position of the base 301 can be accurately fixed. During the process of inserting the base 301 into the guide plate 20121, the rolling ball head 3013 arranged at the bottom of the base 301 slides on the upper part of the workbench 100, which can reduce the friction between the base 301 and the workbench 100 and reduce the wear of the base 301.

[0062] In addition, the fixing block 3014 is locked to the workbench 100 by bolts to prevent the base 301 from moving during the test.

[0063] Finally, a plurality of limiting columns 30528 are provided at the lower portion of the air duct plate 3052 .

[0064] During the pressing process of the lower pressing plate 3053 , the movement of the lower pressing plate 3053 can be limited to prevent the lower pressing plate 3053 from damaging the chip in the circuit board.

[0065] Working principle:

[0066] First, the test mechanism 300 can be quickly inserted into the two symmetrically arranged guide plates 20121 through the guide strip 3012 arranged at the lower part of the base 301 to accurately fix the position of the base 301. The fixed block 3014 and the workbench 100 are locked by bolts to prevent the base 301 from moving during the test.

[0067] Secondly, the robot places the circuit board on the upper part of the work station of the base 301, the first driving member extends to drive the mounting frame 304, the mounting frame 304 drives the pressing assembly 305 to move to the upper part of the circuit board, the second driving assembly 303 drives the pressing fixing plate 3051, the pressing fixing plate 3051 drives the air duct plate 3052, the air duct plate 3052 drives the pressing plate 3053, the pressing plate 3053 drives the heat sink 3054 to press the chip in the circuit board, when the heat sink 3054 contacts the chip, the spring is in a compressed state to ensure that the heat sink 3054 is in full contact with the chip in the circuit board.

[0068] Finally, the other open end of the first air duct 30521 is connected to the air source through an air pipe, and compressed cold air can enter the first air duct 30521 through the open end, enter the air duct groove 30523 through the center hole 30527 to directly blow away the heat of the heat sink 3054, and then the wind enters the air through the air duct groove 30523, thereby cooling the chip in the circuit board to prevent the chip in the circuit board from overheating and damage during testing.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A test device with heat dissipation function, characterized in that: The test equipment includes: A workbench, two mounting plates arranged in a stepped manner, and a plurality of testing mechanisms arranged on the upper portions of the mounting plates; The testing mechanism comprises a base, a first driving assembly, a second driving assembly, a mounting frame and a pressing assembly, wherein the first driving assembly is arranged at the upper part of the base, the mounting frame is arranged at the upper part of the base, the second driving assembly is arranged at the upper part of the mounting frame, and the pressing assembly is arranged at the moving end of the second driving assembly; The down-pressing assembly includes a down-pressing fixing plate, an air duct plate, a down-pressing plate and a heat sink, wherein the down-pressing fixing plate is arranged at the lower part of the second driving member, the air duct plate is arranged at the lower part of the down-pressing fixing plate, the down-pressing plate is arranged at the lower part of the air duct plate, and the heat sink is embedded in the lower part of the down-pressing plate.

2. The test device with heat dissipation function according to claim 1, characterized in that: The air duct plate is provided with a first air duct and a second air duct which are interconnected, and the first air duct and the second air duct are vertically arranged; The lower surface of the air duct plate is provided with an air duct groove, a first mounting groove, a second mounting groove and a third mounting groove, the second mounting groove and the third mounting groove are located on both sides of the first mounting groove, and the first mounting groove, the second mounting groove and the third mounting groove are all communicated with the air duct groove, and the air duct groove is communicated with the first air duct and the second air duct through a center hole.

3. The test device with heat dissipation function according to claim 2, characterized in that: The lower pressure plate is provided with a first mounting hole, a second mounting hole and a third mounting hole. After the lower pressure plate is assembled with the air duct plate, the position of the first mounting hole corresponds to the first mounting slot, the position of the second mounting hole corresponds to the second mounting slot, the position of the third mounting hole corresponds to the third mounting slot, and the first mounting hole, the second mounting hole and the third mounting hole are all set as stepped holes.

4. The test device with heat dissipation function according to claim 3, characterized in that: A limiting step is provided on the outer periphery of the upper part of the heat sink, and the heat sink comprises a first heat sink, a second heat sink and a third heat sink, the first heat sink can be installed in the first mounting hole, the second heat sink can be installed in the second mounting hole, the third heat sink can be installed in the third mounting hole, and the upper part of the first heat sink is connected to the first mounting groove through a spring, the upper part of the second heat sink is connected to the second mounting groove through a spring, and the upper part of the third heat sink is connected to the third mounting groove through an elastic member.

5. The test device with heat dissipation function according to claim 4, characterized in that: The first heat sink block, the second heat sink block and the third heat sink block are all copper heat sink blocks.

6. The test device with heat dissipation function according to claim 5, characterized in that: A plurality of guide rods are arranged at the lower part of the mounting frame, and a guide hole for matching with the plurality of guide rods is arranged on the downward pressing fixing plate.

7. The test device with heat dissipation function according to claim 1, characterized in that: The upper part of the base is provided with two parallel slide rails, and the lower part of the mounting frame is provided with a sliding block matching with the two slide rails; The lower part of the base is provided with two parallel guide bars, and the lower part of the base is provided with a plurality of rolling ball heads. In addition, the lower part of the base is provided with a fixing block.

8. The test device with heat dissipation function according to claim 7, characterized in that: The upper part of the workbench is provided with a plurality of guide components for guiding the base; The guide assembly includes a limit plate and two groups of symmetrically arranged guide units. The guide unit includes two symmetrically arranged guide plates. A guide groove is formed between the two guide plates. The guide groove matches the guide strip.

9. The test device with heat dissipation function according to claim 8, characterized in that: The opposite sides of the two guide plates away from one end of the limiting plate are provided with chamfers.

10. The test device with heat dissipation function according to claim 9, characterized in that: A plurality of limit columns are arranged at the lower part of the air duct plate.

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