Radiator structure and controller power brick

Abstract

The invention provides a radiator structure and a controller power brick, and the radiator structure comprises a cold plate body which is provided with a plurality of installation holes; a liquid inlet area, a cooling area and a liquid discharge area which are communicated in sequence are arranged in the cold plate body, and the liquid inlet area and the liquid discharge area are respectively communicated with a liquid inlet port and a liquid discharge port; a plurality of patterned protrusions dividing the cooling area into a plurality of cooling flow channels are arranged in the cooling area in a protruding mode. The cooling flow channel comprises at least one of a first medium flow channel and a second medium flow channel, the first medium flow channel is arranged in a linear extension mode in the direction of a connecting line between the liquid inlet port and the liquid outlet port, and the second medium flow channel is arranged in an S-shaped winding mode; according to the application, at least one of the first medium flow channel and the second medium flow channel is applied to the cold plate body, so that the flowing state of the cooling medium flowing into the cooling area can be regulated and controlled, and the cooling efficiency and the cooling uniformity of the radiator structure can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of power bricks, and in particular to a heat sink structure and a controller power brick. Background Art

[0002] In the field of new energy vehicles, with the advancement of technology and the growth of market demand, the electric drive system of the vehicle is developing towards high power density and high compactness; for the motor controller in the electric drive system, it must not only have high efficiency, but also be highly integrated and miniaturized to meet the limited space layout requirements of the vehicle; the power brick is one of the indispensable components in the motor controller. During the operation of the motor controller, especially under high current and high switching frequency, it generates a lot of heat, which can easily cause the temperature of the power brick to be too high, affecting its working performance and even causing permanent damage. Therefore, the power brick is usually combined with a cold plate structure, and the cold plate structure is used as a radiator structure to dissipate heat for the power brick in time to avoid the power brick from being affected by high temperature and malfunctioning; however, in the related art, the flow channel structure inside the radiator structure is relatively simple, and the utilization rate of the cooling medium flowing inside it is poor, which can easily cause the cooling effect of the radiator structure to be uneven, thereby affecting the cooling efficiency of the radiator structure. Summary of the invention

[0003] In view of this, the purpose of this application is to propose a heat sink structure and a controller power brick to solve some or all of the technical problems mentioned above.

[0004] Based on the above purpose, the present application provides a heat sink structure, including:

[0005] A cold plate body, wherein the cold plate body is provided with a plurality of mounting holes for fixing the cold plate body;

[0006] The cold plate body is provided with a liquid inlet area, a cooling area and a liquid discharge area which are connected in sequence, and the liquid inlet area and the liquid discharge area are respectively connected with a liquid inlet port and a liquid discharge port; a plurality of patterned protrusions are protruding from the cooling area, and the plurality of patterned protrusions divide the cooling area into a plurality of cooling channels; the cooling channels include at least one of a first medium channel and a second medium channel, and along the direction of the line between the liquid inlet port and the liquid discharge port, the first medium channel is linearly extended, and the second medium channel is serpentinely meandering.

[0007] Based on the same inventive concept, the present disclosure also provides a controller power brick, including the heat sink structure as described above, and further including:

[0008] A capacitor module, wherein the outer side walls of the capacitor module are respectively provided with a combination surface and a wiring terminal, the combination surface is recessed with an assembly groove, the heat sink structure is adapted to the assembly groove and embedded in the assembly groove; the heat sink structure is respectively provided with a first cooling surface and a second cooling surface on opposite sides, the first cooling surface is in contact with the bottom of the assembly groove, and the heat sink structure cools the capacitor module through the first cooling surface; the wiring terminal is exposed relative to the capacitor module;

[0009] The optional module is arranged on the joint surface of the capacitor module, and the heat sink structure is arranged between the capacitor module and the optional module; the optional module abuts against the second cooling surface, and the heat sink structure performs heat exchange with the optional module through the second cooling surface.

[0010] From the above, it can be seen that the radiator structure and controller power brick provided by the present application can regulate the flow state of the cooling medium flowing into the cooling area by arranging at least one of a linearly arranged first medium flow channel and a serpentinely arranged second medium flow channel on the cold plate body, optimize the utilization rate of the cooling medium in the cooling flow channel, improve the cooling efficiency of the radiator structure and the uniformity of its cooling, thereby improving the overall cooling energy efficiency of the radiator structure, which is beneficial to improving the heat dissipation performance of devices such as controller power bricks using the radiator structure, improving their working stability and extending their service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 It is a structural schematic diagram of the first type of first medium flow channel in the radiator structure;

[0013] Figure 2 is a schematic structural diagram of the second first medium flow channel in the radiator structure;

[0014] Figure 3 It is a structural schematic diagram of the first type of second medium flow channel in the radiator structure;

[0015] Figure 4 is a flow velocity distribution diagram of the cooling medium in the first and second medium flow channels;

[0016] Figure 5 is a schematic structural diagram of a second type of second medium flow channel in a radiator structure;

[0017] Figure 6 is a flow velocity distribution diagram of the cooling medium in the second medium flow channel;

[0018] Figure 7 It is a schematic structural diagram of the third type of second medium flow channel in the radiator structure;

[0019] Figure 8 It is a schematic diagram of the structure of the first controller power brick;

[0020] Fig. 9 This is an exploded view of the first controller power brick;

[0021] Fig.10 This is an exploded view of the second type of power brick;

[0022] Fig.11 It is the structural diagram of the third controller power brick;

[0023] Fig.12 This is a schematic diagram of the structure of the auxiliary heat dissipation module.

[0024] Description of reference numerals:

[0025] 10. Radiator structure; 101. Cold plate body; 102. Mounting hole; 103. Liquid inlet area; 10301. Liquid inlet port; 104. Cooling area; 105. Drainage area; 10501. Drainage port; 106. Patterned protrusion; 107. First medium flow channel; 10711. Expanded flow channel opening; 10712. Reduced flow channel opening; 10721. First sub-flow channel structure; 10722. Second sub-flow channel structure; 108. Second medium flow channel; 10811. Third sub-flow channel structure; 10901. In-board sealing groove; 10902. In-board sealing ring; 10903. Cover plate body; 10904. Open; 10905. Out-board sealing groove; 10906. Out-board sealing ring; 10907. Blocking plate;

[0026] 20. capacitor module; 201. joint surface; 202. connection terminal; 203. assembly groove;

[0027] 31. Auxiliary heat dissipation module; 310. Connecting plate; 311. Groove portion; 312. Heat pipe; 320. Fin; 32. Electric drive module. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0029] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0030] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0031] With the improvement of global awareness of environmental protection and the pursuit of sustainable development, the development of new energy vehicles has become an irreversible trend in the automotive industry. As one of the core components of new energy vehicles, the stability and work efficiency of the motor controller directly affect the performance of the whole vehicle; as one of the core components of the electric drive system, the motor controller not only needs to meet the requirements of high performance, but also needs to achieve a high degree of integration and miniaturization to adapt to the limited space layout requirements of the vehicle; the power brick, as a key component in the motor controller, can maintain the stability and reliability of the system operation. For example, the power brick of the motor controller is usually equipped with an IGBT (insulated gate bipolar transistor) module and serves as the electric drive module of the motor controller. The quality of its working state is affected by its working temperature and is directly related to the reliability and service life of the motor controller. When the motor controller is running, especially under high current and high switching frequency, the controller power brick will generate a lot of heat and the temperature will rise rapidly. If the heat generated by the controller power brick is not dissipated in time, the temperature of the IGBT module of the controller power brick will be too high. In the long run, it will not only affect its working performance, but also cause irreversible damage, and even cause serious consequences such as vehicle loss of control. Therefore, controller power bricks with good heat dissipation are very important for new energy vehicles.

[0032] In the related art, in order to make the power brick have a good heat dissipation effect, liquid cooling is usually used to dissipate the heat of the power brick, that is, a cold plate structure such as a water-cooled plate is used as a radiator structure, and is applied to the controller power brick, so as to perform efficient thermal management of the controller power brick through the radiator structure to prevent performance degradation or failure caused by overheating. However, the applicant found that in the related art, when a cold plate structure is used as a radiator structure, since the internal flow channel structure of the cold plate structure is usually a single hollow structure, or a plurality of long strip flow channel structures of equal width, when the cooling medium flows through the flow channel structure inside the radiator structure, due to the lack of control effect on the flow state of the cooling medium, it is easy to cause the cooling medium to be inefficiently utilized and the cooling effect to be uneven, which not only limits the overall cooling efficiency of the cold plate, but also indirectly affects the working stability and life of the motor controller.

[0033] In view of this, the present application provides a radiator structure 10, including a cold plate body 101, the cold plate body 101 is provided with a plurality of mounting holes 102 for fixing the cold plate body 101; a liquid inlet area 103, a cooling area 104 and a liquid discharge area 105 which are connected in sequence are provided in the cold plate body 101, and the liquid inlet area 103 and the liquid discharge area 105 are respectively connected with a liquid inlet port 10301 and a liquid discharge port 10501; a plurality of patterned protrusions 106 are protruded in the cooling area 104, and the plurality of patterned protrusions 106 divide the cooling area 104 into a plurality of cooling channels; the cooling channel includes at least one of a first medium channel 107 and a second medium channel 108, and along the direction of the line between the liquid inlet port 10301 and the liquid discharge port 10501, the first medium channel 107 is linearly extended, and the second medium channel 108 is serpentinely arranged.

[0034] The present application provides a heat sink structure 10 with good cooling efficiency and high uniformity; Figure 1-Figure 7 As shown, the radiator structure 10 includes a cold plate body 101, which is used as a supporting carrier of the radiator structure 10; the radiator structure 10 is provided with a plurality of mounting holes 102 for fixing the cold plate body 101, so as to assemble and fix the radiator structure 10, improve the application flexibility of the radiator structure 10, and expand its adaptability range.

[0035] Specifically, with respect to the cold plate body 101, a liquid inlet area 103, a cooling area 104 and a liquid discharge area 105 which are connected in sequence can be provided in the cold plate body 101, and the liquid inlet area 103 and the liquid discharge area 105 are respectively connected to a liquid inlet port 10301 and a liquid discharge port 10501, that is, when the cooling medium is provided to the cooling medium, the cooling medium can flow into the liquid inlet area 103 through the liquid inlet port 10301, and the cooling medium is provided and distributed to the cooling area 104 by the liquid inlet area 103; the cooling medium flows from the liquid inlet area 103 into the cooling area 104, and the flowing cooling medium in the cooling area 104 is used to perform heat exchange with the components connected to the radiator structure 10, absorb the heat released by the components connected to the radiator structure 10, and release the heat as the cooling medium flows; the temperature of the cooling medium that has absorbed the heat increases and flows into the liquid discharge area 105, and then flows out through the liquid discharge port 10501 of the liquid discharge area 105, so that it achieves the corresponding heat dissipation effect.

[0036] As for the cooling region 104, a plurality of patterned protrusions 106 are protruding from the cooling region 104, and a patterned structure can be formed in the cooling region 104. The patterned structure formed by the plurality of patterned protrusions 106 can divide the cooling region 104 into a plurality of cooling channels; specifically, the cooling channel can include at least one of a first medium channel 107 and a second medium channel 108, and the cooling medium located in the liquid inlet region 103 can flow into the liquid discharge region 105 through the first medium channel 107 and / or the second medium channel 108 provided in the cooling region 104; more specifically, as Figure 1 and Figure 2 As shown, along the line between the liquid inlet port 10301 and the liquid outlet port 10501, the first medium flow channel 107 can be extended linearly, such as Figure 3-Figure 7 As shown, the second medium flow channel 108 is arranged in a serpentine shape. Through the first medium flow channel 107 arranged in a linear extension and the second medium flow channel 108 arranged in a serpentine shape, the cooling medium flowing into the cooling area 104 can be regulated, and the flow state of the cooling medium in the cooling flow channel is optimized, so as to improve the cooling efficiency of the radiator structure 10 and the uniformity of its cooling, improve the overall cooling energy efficiency of the radiator structure 10, and help to improve the heat dissipation effect of devices such as controller power bricks using the radiator structure 10, improve its working stability and extend its service life.

[0037] In some embodiments, a plurality of first medium flow channels 107 are provided and distributed side by side, and the plurality of first medium flow channels 107 are symmetrically distributed relative to the line between the liquid inlet port 10301 and the liquid discharge port 10501; a plurality of expanded diameter flow channel openings 10711 and reduced diameter flow channel openings 10712 are respectively provided in the liquid inlet area 103 and the liquid discharge area 105, and any expanded diameter flow channel opening 10711 is respectively connected to the liquid inlet port 10301 and a first medium flow channel 107, and any reduced diameter flow channel opening 10712 is respectively connected to a first medium flow channel 107 and the liquid discharge port 10501.

[0038] As for the cooling flow channel, the cooling flow channel may include a first medium flow channel 107 extending linearly in the cooling area 104. When the medium flows through the first medium flow channel 107, the flow state of the cooling medium can be regulated by the first medium flow channel 107 to improve the cooling efficiency and uniformity of the heat sink structure 10; Figure 1 As shown, a plurality of first medium flow channels 107 can be arranged side by side in the cooling area 104; when the cooling medium flows into the first medium flow channel 107 from the liquid inlet area 103, the cooling medium can be distributed by using a plurality of first medium flow channels 107, so that the cooling medium can be evenly distributed after flowing into the cooling area 104, thereby ensuring a more uniform cooling effect on the surface of the radiator structure 10, which is beneficial to uniform cooling of the components used in combination with the radiator structure 10, and improving the cooling effect and heat dissipation capacity of the radiator structure 10.

[0039] Meanwhile, as for the first medium flow channel 107, Figure 1 As shown, in the cold plate body 101, a plurality of expanded diameter flow channel openings 10711 and reduced diameter flow channel openings 10712 are respectively arranged in the liquid inlet area 103 and the liquid discharge area 105, any expanded diameter flow channel opening 10711 is respectively connected to the liquid inlet port 10301 and a first medium flow channel 107, and any reduced diameter flow channel opening 10712 is respectively connected to a first medium flow channel 107 and the liquid discharge port 10501; specifically, along the direction of the line between the liquid inlet port 10301 and the liquid discharge port 10501, the width of the expanded diameter flow channel opening 10711 gradually increases, When the cooling medium in the liquid inlet area 103 flows into the first medium flow channel 107 through the expanded flow channel opening 10711, the flow rate of the cooling medium flowing into the first medium flow channel 107 can be reduced and the pressure can be increased due to the action of the expanded flow channel opening 10711. Since the fluid medium fully fills the internal space of the first medium flow channel 107, the cooling effect of the radiator structure 10 is improved. In addition, since the flow rate of the cooling medium flowing into the first medium flow channel 107 is slow, the cooling medium has sufficient time to exchange heat, thereby improving the utilization efficiency of the cooling medium.

[0040] Similarly, along the direction of the line between the liquid inlet port 10301 and the liquid discharge port 10501, the width of the reduced diameter flow channel opening 10712 gradually decreases. When the cooling medium in the first medium flow channel 107 flows into the liquid discharge area 105 through the reduced diameter flow channel opening 10712, the flow rate of the cooling medium flowing out of the first medium flow channel 107 can be increased and the pressure can be reduced. The cooling medium can be quickly discharged into the liquid discharge area 105 and the cooling medium can be discharged in a centralized manner, thereby shortening the discharge time of the cooling medium, avoiding the cooling medium from staying for too long and transferring heat to the cold plate body 101, and improving the heat dissipation performance of the radiator structure 10.

[0041] In some embodiments, the first medium flow channel 107 includes a plurality of first sub-flow channel structures 10721 and second sub-flow channel structures 10722 connected in sequence, and the first sub-flow channel structures 10721 and the second sub-flow channel structures 10722 are alternately distributed along the direction of the line between the liquid inlet port 10301 and the liquid discharge port 10501; the first sub-flow channel structure 10721 and the second sub-flow channel structure 10722 each include two spiral flow channel portions that are interconnected and spirally arranged in opposite directions, and the spiral flow channel portions of adjacent first sub-flow channel structures 10721 are connected to the spiral flow channel portions of the second sub-flow channel structure 10722.

[0042] As for the cooling channel in the heat sink structure 10, the cooling channel may include a first medium channel 107 extending linearly in the cooling area 104. When the medium flows through the first medium channel 107, the flow state of the cooling medium can be regulated by the first medium channel 107 to improve the cooling efficiency and uniformity of the heat sink structure 10. Figure 2 As shown, the first medium flow channel 107 may include a plurality of first sub-flow channel structures 10721 and second sub-flow channel structures 10722 connected in sequence, and the flow state of the cooling medium flowing into it can be regulated by using the first sub-flow channel structures 10721 and the second sub-flow channel structures 10722 respectively; and the first sub-flow channel structures 10721 and the second sub-flow channel structures 10722 are alternately distributed along the direction of the line between the liquid inlet port 10301 and the liquid discharge port 10501, which is beneficial to improve the uniformity of the distribution of the cooling medium in the first medium flow channel 107.

[0043] As for the first sub-channel structure 10721 and the second sub-channel structure 10722, the first sub-channel structure 10721 and the second sub-channel structure 10722 each include two spiral channel portions that are interconnected and spirally arranged in opposite directions, and the spiral channel portions of the adjacent first sub-channel structure 10721 are connected to the spiral channel portions of the second sub-channel structure 10722; Figure 2 As shown, after the cooling medium flows into the second medium flow channel 108, it can Figure 2The cooling medium flows in the direction indicated by the arrow, that is, in one set of interconnected first sub-channel structures 10721 and second sub-channel structures 10722, the fluid medium can flow in a spiral flow channel portion of the first sub-channel structure 10721 until it flows to the central area of ​​the first sub-channel structure 10721, and then enters another spiral flow channel portion from the spiral flow channel portion and flows in a reverse spiral direction until the cooling medium flows out of the first sub-channel structure 10721 and enters a spiral flow channel portion in the second sub-channel structure 10722; the first channel structure and the second channel structure are alternately distributed and can be symmetrically arranged along the boundary line, so that the cooling medium flows out of the first sub-channel structure 10721 and enters a spiral flow channel portion in the second sub-channel structure 10722. The flow direction of the medium in the two spiral flow channel portions in the second sub-channel structure 10722 is opposite to the flow direction of the cooling medium in the two spiral flow channel portions in the first sub-channel structure 10721, thereby extending the path of the first medium flow channel 107 of the cooling medium and improving the utilization efficiency of the cooling medium; since the first sub-channel structure 10721 and the second sub-channel structure 10722 both include two spiral flow channel portions arranged in a spiral shape, it is beneficial to limit the width of the first medium flow channel 107 and enable the second medium flow channel 108 to fill the cooling area 104, that is, to improve the space utilization of the cooling area 104, and also improve the uniformity of the cooling effect of the radiator structure 10.

[0044] In some embodiments, the second medium flow channel 108 includes a plurality of third sub-flow channel structures 10811 connected in sequence. Any third sub-flow channel structure 10811 is arranged to be serpentine in a direction perpendicular to the line between the liquid inlet port 10301 and the liquid outlet port 10501 .

[0045] As for the cooling flow channel, the cooling flow channel may include a second medium flow channel 108 arranged in a serpentine shape in the cooling area 104, specifically as follows: Figure 3 As shown, by setting the second medium flow channel 108 to be serpentine, the flow path of the second medium flow channel 108 in the cooling area 104 can be extended, and the cooling effect of the heat sink structure 10 can be improved; however, Figure 4 As shown, when the cooling medium flows from the liquid inlet area 103 into the second medium flow channel 108, the cooling medium is easily affected by the flow inertia of the cooling medium, and a "heat exchange dead zone" is generated near the turn of the second medium flow channel 108, that is, an area that cannot be filled with the cooling medium. Figure 4 As shown in area A in FIG. 1 , a “weak heat exchange area” is formed near each turn on the side close to the liquid inlet area 103, i.e., an area where the cooling medium is relatively sparsely distributed. Figure 4 As shown in area B, Figure 4As shown in the figure, for example, the flow velocity of the cooling medium in area B is 0-2 m / s, while the flow velocity of the cooling medium in the surrounding area is at least 5 m / s; therefore, it can be seen that the flow velocity and filling uniformity of the cooling medium in the second medium flow channel 108 vary greatly, so the cooling utilization rate of the cooling medium is low and the cooling effect is relatively low.

[0046] In order to solve the problem that the flow rate and filling uniformity of the cooling medium in the second medium flow channel 108 vary greatly, as Figure 5 As shown, the second medium flow channel 108 includes a plurality of third sub-flow channel structures 10811 connected in sequence. For any third sub-flow channel structure 10811, along a direction perpendicular to the line between the liquid inlet port 10301 and the liquid discharge port 10501, by making the third sub-flow channel structure 10811 serpentine, the second medium flow channel 108 can be fractalized, which is conducive to limiting and reducing the width of the second medium flow channel 108, so that the flow path of the cooling medium in the cooling area 104 is further extended, and the utilization efficiency of the cooling medium is improved; as shown in FIG. Figure 6 As shown, since the third sub-channel structure 10811 is also set to a serpentine shape, that is, the second medium channel 108 and the third sub-channel structure 10811 are self-similar figures to each other, the formation of "heat exchange dead zone" and "heat exchange weak zone" in the second medium channel 108 can be reduced, and the flow velocity difference of the cooling medium in the second medium channel 108 can be reduced, so that the flow characteristics of the cooling medium are more stable, and the local instability and fluctuation of the second medium channel 108 are reduced, the reliability and stability of the cooling medium flow are improved, and the uniformity of the distribution of the cooling medium in the cooling area 104 is improved, thereby improving the cooling effect and heat dissipation efficiency of the radiator structure 10.

[0047] In addition, by setting the third sub-channel structure 10811 in the second medium flow channel 108 and making the second medium flow channel 108 and the third sub-channel structure 10811 self-similar to each other, on the one hand, the pressure loss of the cooling medium in the second medium flow channel 108 can be effectively reduced, so that the flow state of the cooling medium is smoother, and the energy loss and resistance caused by mutations are reduced; on the other hand, the third sub-channel structure 10811 and the second medium flow channel 108 are self-similar to each other, that is, the local structure and the overall structure are similar, which can make the flow characteristics of the fluid medium at different positions tend to be consistent, thereby reducing the occurrence of local turbulence and unevenness.

[0048] In some embodiments, any third sub-channel structure 10811 includes a plurality of serpentine channel portions connected in series, and the plurality of serpentine channel portions are distributed side by side in a direction perpendicular to a line between the liquid inlet port 10301 and the liquid discharge port 10501, and any serpentine channel portion is arranged in a winding direction along a line between the liquid inlet port 10301 and the liquid discharge port 10501.

[0049] As for the third flow channel structure, Figure 7 As shown, in order to further reduce the flow velocity difference of the cooling medium in the second medium flow channel 108 and improve the uniformity of the distribution of the cooling medium in the cooling area 104, as shown in FIG. Figure 7 Any third sub-channel structure 10811 includes a plurality of serpentine channel portions connected in sequence, and the plurality of serpentine channel portions can be arranged side by side in a direction perpendicular to the line between the liquid inlet port 10301 and the liquid discharge port 10501, and any serpentine channel portion can be arranged in a winding direction along the line between the liquid inlet port 10301 and the liquid discharge port 10501, which is beneficial to improving the distribution density of the serpentine channel portions in the cooling area 104, improving the space utilization rate of the second medium channel 108 to the cooling area 104, thereby increasing the content of the cooling medium in the second medium channel 108, and is beneficial to enhancing the cooling performance of the radiator structure 10.

[0050] In addition, if Figure 7 As shown, by making multiple serpentine flow channel portions arranged side by side in a direction perpendicular to the line between the liquid inlet port 10301 and the liquid discharge port 10501, any serpentine flow channel portion is arranged in a serpentine direction along the line between the liquid inlet port 10301 and the liquid discharge port 10501, the distance between adjacent serpentine flow channel portions can be shortened, thereby limiting and shortening the width of the third sub-flow channel structure 10811, which is beneficial to further extend the flow path of the second medium flow channel 108 in the cooling area 104 and improve the utilization efficiency of the cooling medium; wherein, since the serpentine flow channel portion is arranged in a serpentine shape, this The third sub-channel structure 10811 and the serpentine channel portion can be self-similar figures to each other, which can further reduce the probability of forming a "heat exchange dead zone" and a "heat exchange weak zone" in the third sub-channel structure 10811, reduce the flow velocity difference of the cooling medium in the third sub-channel structure 10811, make the flow characteristics of the cooling medium more stable, reduce the local instability and volatility of the cooling medium, improve the reliability and stability of the cooling medium flow, and improve the uniformity of the cooling medium in the cooling area 104, thereby improving the cooling effect of the radiator structure 10.

[0051] In addition, by arranging a serpentine flow channel portion in the third sub-flow channel structure 10811 and making the third sub-flow channel structure 10811 and the serpentine flow channel portion self-similar to each other, on the one hand, the pressure loss of the cooling medium in the third sub-flow channel structure 10811 can be effectively reduced, so that the flow state of the cooling medium is smoother, and the energy loss and resistance caused by mutations are reduced; on the other hand, since the third sub-flow channel structure 10811 and the serpentine flow channel portion are self-similar to each other, that is, the local structure and the overall structure are similar, the flow characteristics of the fluid medium at different positions can be made consistent, thereby reducing the occurrence of local turbulence and unevenness.

[0052] Based on the same inventive concept, the present application also provides a controller power brick, comprising a heat sink structure 10 as described in the above embodiment, and also comprising a capacitor module 20 and an optional module, the outer side walls of the capacitor module 20 are respectively provided with a bonding surface 201 and a wiring terminal 202, the bonding surface 201 is recessed with an assembly groove 203, the heat sink structure 10 is adapted to the assembly groove 203 and embedded in the assembly groove 203; the heat sink structure 10 is respectively provided with a first cooling surface and a second cooling surface on opposite sides, the first cooling surface is in contact with the bottom of the assembly groove 203, the heat sink structure 10 cools the capacitor module 20 through the first cooling surface and dissipates the heat generated by it; the wiring terminal 202 is exposed relative to the capacitor module 20; the optional module is arranged on the bonding surface 201 of the capacitor module 20, and the heat sink structure 10 is arranged between the capacitor module 20 and the optional module; the optional module abuts against the second cooling surface, and the heat sink structure 10 performs heat exchange with the optional module through the second cooling surface.

[0053] The present application also provides a controller power brick with relatively balanced heat dissipation efficiency, such as Figure 8-Figure 12 As shown, the controller power brick includes not only the above-mentioned heat sink structure 10, but also a capacitor module 20; wherein, the outer wall of the capacitor module 20 is exposedly provided with a wiring terminal 202 for electrically connecting to an optional module with an electric drive function; the outer wall of the capacitor module 20 is also provided with a bonding surface 201, and the bonding surface 201 is recessed with an assembly groove 203. At this time, a plurality of mounting holes 102 can be respectively provided at the bonding surface 201 and the bottom of the assembly groove 203, and the bonding surface 201 can be fixedly connected to the optional module through the mounting holes 102 and bolt fasteners, and the assembly groove 203 is adapted to the heat sink structure 10 and embedded in the assembly groove 203, and the mounting hole 102 of the heat sink structure 10 is arranged opposite to the mounting hole 102 at the bottom of the assembly groove 203, so that the heat sink structure 10 and the capacitor module 20 are connected by bolt fasteners, thereby improving the firmness between the heat sink structure 10 and the capacitor module 20, and ensuring that the first cooling surface of the heat sink structure 10 is in full contact with the capacitor module 20.

[0054] In addition, with regard to the radiator structure 10, a first cooling surface and a second cooling surface are respectively provided on opposite sides of the radiator structure 10, wherein the first cooling surface is in contact with the bottom of the assembly groove 203. When the temperature of the capacitor module 20 rises, the radiator structure 10 can perform heat exchange with the capacitor module 20 through the first cooling surface so as to transfer the heat to the external environment in time, thereby realizing cooling and heat dissipation of the capacitor module 20, so as to improve the working environment of the capacitor module 20 in the controller power brick and improve its operation stability and safety.

[0055] The power brick provided in the present application also includes an optional module, wherein the optional module is arranged on the joint surface 201 of the capacitor module 20, and the heat sink structure 10 is arranged between the capacitor module 20 and the optional module, so that the optional module abuts against the second cooling surface, so that the heat sink structure 10 and the optional module perform heat exchange through the second cooling surface; wherein, when the optional module is a heating module, such as an IGBT module or an electric drive module 32 such as a drive circuit board, by arranging the heat sink structure 10 between the capacitor module 20 and the optional module, the capacitor module 20 and the optional module can be cooled and dissipated at the same time, thereby improving the heat dissipation. The cooling efficiency of the heat sink structure 10 is improved, and it is also beneficial to control the production cost of the controller power brick and realize the miniaturization and lightweight design of the controller power brick; when the optional module is the auxiliary heat dissipation module 31, the radiator structure 10 can exchange heat with the optional module through the second cooling surface, so as to transfer heat to the auxiliary heat dissipation module 31 through the second cooling surface, and can be combined with air cooling and other methods to dissipate the heat of the auxiliary heat dissipation module 31 to the external environment, which is beneficial to improve the cooling effect of the radiator structure 10 and accelerate the heat dissipation speed of the capacitor module to maintain the stability of the working environment of the capacitor module 20.

[0056] In addition, since the controller power brick in the present application includes the above-mentioned embodiment, the controller power brick has all the beneficial effects of the above-mentioned heat sink structure 10, which will not be described in detail here.

[0057] In some embodiments, the cold plate body 101 cooperates with the assembly groove 203 and is embedded in the assembly groove 203; one of the two opposite sides of the cold plate body 101 is provided with a first cooling surface, the first cooling surface abuts against the bottom of the assembly groove 203, and the other is provided with an in-plate sealing groove 10901, and an in-plate sealing ring 10902 is provided in the in-plate sealing groove 10901, and the in-plate sealing ring 10902 is arranged around the liquid inlet area 103, the cooling area 104 and the liquid discharge area 105.

[0058] As for the heat sink structure 10 in the controller power brick, Fig. 9 and Fig.10As shown, the cold plate body 101 cooperates with the assembly groove 203 and is embedded in the assembly groove 203. Since the cold plate body 101 is provided with a mounting hole 102, the cold plate body 101 can be fixed in the mounting groove on the surface of the capacitor module 20 through the mounting hole 102, so that it can cool the capacitor module 20; wherein, one of the opposite sides of the cold plate body 101 is provided with a first cooling surface, and the first cooling surface abuts against the bottom of the assembly groove 203, so that the first cooling surface is fully in contact with the bottom of the assembly groove 203, which can ensure the cooling effect of the radiator structure 10 on the capacitor module 20; the other side of the cold plate body 101 is provided with An in-board sealing groove 10901 is provided with an in-board sealing ring 10902. By providing the in-board sealing groove 10901 and the in-board sealing ring 10902 that match each other on the side, and providing the in-board sealing ring 10902 around the liquid inlet area 103, the cooling area 104 and the liquid discharge area 105, the liquid inlet area 103, the cooling area 104 and the liquid discharge area 105 in the radiator structure 10 can be sealed to prevent the cooling medium from leaking and affecting the cooling effect of the controller power brick, and also to avoid short circuit of the controller power brick to ensure the safety of the controller power brick.

[0059] In some embodiments, a cover body 10903 is provided on one side of the cold plate body 101 away from the bottom of the assembly groove 203, a second cooling surface is provided on one of the opposite sides of the cover body 10903, the second cooling surface abuts against the optional module, and the internal plate sealing ring 10902 is located between the cover body 10903 and the cold plate body 101.

[0060] As for the radiator structure 10, a first cooling surface and a second cooling surface are respectively provided on opposite sides of the radiator structure 10. The radiator structure 10 can cool the capacitor module 20 through the first cooling surface and can exchange heat with the optional module through the second cooling surface; Fig. 9 and Fig.10 As shown, a cover body 10903 is provided on one side of the cold plate body 101 away from the bottom of the assembly groove 203, and a second cooling surface is provided on one of the opposite sides of the cover body 10903. By abutting the second cooling surface of the radiator structure 10 against the optional module, the heat exchange efficiency and heat exchange effect between the radiator structure 10 and the optional module can be guaranteed. At the same time, since the inner plate sealing ring 10902 is located between the cover body 10903 and the cold plate body 101, the cover body 10903 can be used to seal the liquid inlet area 103, the cooling area 104 and the drainage area 105 set in the cold plate body 101, so as to ensure that the radiator structure 10 has good performance.

[0061] In some embodiments, an opening 10904 and an external sealing groove 10905 are provided on a side of the cover body 10903 away from the cold plate body 101; the external sealing groove 10905 is arranged around the opening 10904, an external sealing ring 10906 is arranged in the external sealing groove 10905, and the external sealing ring 10906 is located between the cover body 10903 and the optional module; or, an opening 10904 and a sealing plate 10907 are provided on a side of the cover body 10903 away from the cold plate body 101; the sealing plate 10907 covers the opening 10904 in the orthographic projection of the cover body 10903, at least a portion of the second cooling surface is arranged on the sealing plate 10907, and the optional module abuts against one side of the sealing plate 10907.

[0062] As for the heat sink structure 10, the heat sink structure 10 is configured to cool the capacitor module 20 and is also configured to exchange heat with the optional module; Fig. 9 and Fig.10 As shown, the radiator structure 10 can select different cooling modes according to the types of optional modules, thereby achieving efficient use of the radiator structure 10.

[0063] In one case, when the optional module can be in direct contact with the cooling medium, the radiator structure 10 can adopt an open cooling mode, that is, the cooling medium in the radiator structure 10 can be in direct contact with the optional module; Fig. 9 As shown, when the optional module is cooled in an open cooling mode, an opening 10904 and an external sealing groove 10905 are provided on the side of the cover body 10903 away from the cold plate body 101, the external sealing groove 10905 is arranged around the opening 10904, an external sealing ring 10906 is arranged in the external sealing groove 10905, the external sealing ring 10906 is located between the cover body 10903 and the optional module, and the opening 10904 is arranged opposite to the cooling area 104; when the cooling medium flows to the cooling area 104, the cooling medium will directly contact the optional module through the opening 10904, and the contact surface between the cooling medium and the optional module is used as the second cooling surface for heat exchange; due to the direct contact between the two, the heat exchange efficiency between the cooling medium and the optional module can be further improved, the heat dissipation performance of the controller power brick is optimized, and thus the operation performance of the controller power brick is improved;

[0064] In addition, when the capacitor module 20 is used in combination with the optional module, the cooling medium will directly contact the optional module through the opening 10904, and an external sealing ring 10906 is provided in the external sealing groove 10905. The external sealing ring 10906 is located between the cover body 10903 and the optional module. At this time, the external sealing groove 10905 can provide an installation position for the external sealing ring 10906. The external sealing ring 10906 can seal the radiator structure 10 and the optional module to prevent the cooling medium from leaking and affecting the normal use of the controller power brick.

[0065] In another case, when the optional module cannot be in direct contact with the cooling medium, a closed cooling mode can be used, that is, the cooling medium in the radiator structure 10 does not directly contact with the optional module; Fig.10 As shown, when the closed cooling mode is used to cool the optional module, an opening 10904 and a sealing plate 10907 are provided on the side of the cover body 10903 away from the cold plate body 101, and the opening 10904 is arranged opposite to the cooling area 104; the sealing plate 10907 covers the opening 10904 in the orthographic projection of the cover body 10903, at least part of the second cooling surface is provided on the sealing plate 10907, and the optional module abuts against one side of the sealing plate 10907; at this time, the side of the sealing plate 10907 away from the capacitor module 20 can be used as the second cooling surface, and when the cooling medium flows through the cooling area 104, the cooling medium can be sealed and blocked by the sealing plate 10907 to avoid direct contact between the cooling medium and the optional module and damage to the optional module, and to ensure the cooling effect of the cooling medium on the optional module.

[0066] In some embodiments, the optional module is an electric drive module 32, the driving module is connected to the coupling surface 201 of the capacitor module 20 and abuts the second cooling surface, and the driving module is electrically connected to the capacitor module 20 through the terminal block 202; or the optional module is an auxiliary heat dissipation module 31, including a connecting plate 310 and a plurality of fins 320, the connecting plate 310 is connected to the coupling surface 201 and abuts the second cooling surface; the plurality of fins 320 are arranged on the side of the connecting plate 310 away from the capacitor module 20; a groove portion 311 is recessed on the side of the connecting plate 310 close to the capacitor module 20; a heat pipe 312 is arranged in the groove portion 311 and is filled with a heat conducting medium, the heat conducting medium covers the heat conducting pipe 312, and the surface of the heat conducting medium is flush with the side of the connecting plate 310 close to the capacitor module 20.

[0067] In terms of controller power bricks, Figure 8-Figure 11 As shown, the optional modules can choose different module structures according to the type of controller power brick; in one case, Figure 8-Figure 10As shown, as for the optional module, the optional module can be an electric drive module 32, wherein the electric drive module 32 can be an IGBT module, a GTO (gate turn-off thyristor) module, a BJT (bipolar transistor) module, an IGCT (integrated gate commutated thyristor) module, and a PCB (printed circuit board) module, etc. When the electric drive module 32 is used, the joint surface 201 of the drive module and the capacitor module 20 is connected and abuts against the second cooling surface, and the drive module is electrically connected to the capacitor module 20 through the terminal block 202. At this time, the electric drive module 32 can cooperate with the capacitor module 20 for operation; since the electric drive module 32 is a heating module, by arranging the heat sink structure 10 between the capacitor module 20 and the electric drive module 32, and making the first cooling surface and the second cooling surface of the heat sink structure 10 contact the capacitor module 20 and the electric drive module 32 respectively, the electric drive module 32 and the capacitor module 20 with higher temperatures can be cooled at the same time, thereby improving the cooling efficiency of the heat sink structure 10 and improving its heat dissipation performance, which is conducive to realizing the miniaturization design and lightweight design of the controller power brick.

[0068] In another case, the optional module can be set as an auxiliary heat dissipation module 31, which can include a connecting plate 310 and a plurality of fins 320, wherein the connecting plate 310 is connected to the joint surface 201 and abuts against the second cooling surface; the plurality of fins 320 are arranged on a side of the connecting plate 310 away from the capacitor module 20; Fig.11 As shown, with regard to the optional module, by evenly arranging a plurality of fins 320 on one side of the connecting plate 310, the heat dissipation area of ​​the auxiliary heat dissipation module 31 can be increased. When the radiator structure 10 transfers heat to the auxiliary heat dissipation module 31, the heat can be dissipated to the external environment through the fins 320 of the auxiliary heat dissipation module 31, thereby accelerating the heat dissipation rate and improving the overall performance of the controller power brick.

[0069] In addition, if Fig.12 As shown, a groove portion 311 is recessed on one side of the connecting plate 310 close to the capacitor module 20; a heat pipe 312 is arranged in the groove portion 311 and is filled with a heat conducting medium, the heat conducting medium covers the heat pipe 312, and the surface of the heat conducting medium is flush with the side of the connecting plate 310 close to the capacitor module 20; by arranging the heat pipe 312 and the heat conducting medium in the groove portion 311, and making the surface of the heat conducting medium flush with the side of the connecting plate 310 close to the capacitor module 20, a larger contact area can be provided between the heat conducting medium and the radiator structure 10, which is beneficial to optimizing the heat transfer efficiency between the radiator structure 10 and the auxiliary heat dissipation module 31, avoiding the situation where the controller power brick is overheated, and thus improving the overall performance of the controller power brick.

[0070] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0071] The various embodiments in the present application are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0072] The description of the present application is given for the purpose of illustration and description, and is not intended to be exhaustive or to limit the present application to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present application, and to enable those of ordinary skill in the art to understand the present application and thus design various embodiments with various modifications suitable for specific purposes.

[0073] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0074] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0075] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A heat sink structure, characterized in that: include: A cold plate body, wherein the cold plate body is provided with a plurality of mounting holes for fixing the cold plate body; The cold plate body is provided with a liquid inlet area, a cooling area and a liquid discharge area which are connected in sequence, and the liquid inlet area and the liquid discharge area are respectively connected with a liquid inlet port and a liquid discharge port; a plurality of patterned protrusions are protruding from the cooling area, and the plurality of patterned protrusions divide the cooling area into a plurality of cooling channels; the cooling channels include at least one of a first medium channel and a second medium channel, and along the direction of the line between the liquid inlet port and the liquid discharge port, the first medium channel is linearly extended, and the second medium channel is a serpentine winding structure.

2. The heat sink structure according to claim 1, characterized in that: There are multiple first medium flow channels and they are distributed side by side, and the multiple first medium flow channels are symmetrically distributed relative to the line between the liquid inlet port and the liquid discharge port; multiple expanding flow channel openings and reducing flow channel openings are respectively provided in the liquid inlet area and the liquid discharge area, and any of the expanding flow channel openings is respectively connected to the liquid inlet port and a corresponding first medium flow channel, and any of the reducing flow channel openings is respectively connected to a corresponding first medium flow channel and the liquid discharge port.

3. The heat sink structure according to claim 1, characterized in that: The first medium flow channel includes a plurality of first sub-flow channel structures and second sub-flow channel structures connected in sequence, and the first sub-flow channel structures and the second sub-flow channel structures are alternately distributed along the direction of the line between the liquid inlet port and the liquid discharge port; the first sub-flow channel structure and the second sub-flow channel structure each include two spiral flow channel portions that are connected to each other and spirally arranged in opposite directions, and the spiral flow channel portions of adjacent first sub-flow channel structures are connected to the spiral flow channel portions of the second sub-flow channel structure.

4. The heat sink structure according to claim 1, characterized in that: The second medium flow channel includes a plurality of third sub-flow channel structures connected in sequence, and any of the third sub-flow channel structures is arranged to meander in a serpentine shape along a direction perpendicular to a line connecting the liquid inlet port and the liquid discharge port.

5. The heat sink structure according to claim 4, characterized in that: Any of the third sub-channel structures includes a plurality of serially connected serpentine channel portions, wherein the plurality of serpentine channel portions are arranged side by side in a direction perpendicular to a line connecting the liquid inlet port and the liquid discharge port, and any of the serpentine channel portions is arranged in a winding direction along a line connecting the liquid inlet port and the liquid discharge port.

6. A controller power brick, characterized in that: The heat sink structure according to any one of claims 1 to 5 further comprises: A capacitor module, wherein the outer side walls of the capacitor module are respectively provided with a combination surface and a wiring terminal, the combination surface is recessed with an assembly groove, the heat sink structure is adapted to the assembly groove and embedded in the assembly groove; the heat sink structure is respectively provided with a first cooling surface and a second cooling surface on opposite sides, the first cooling surface is in contact with the bottom of the assembly groove, and the heat sink structure cools the capacitor module through the first cooling surface; the wiring terminal is exposed relative to the capacitor module; The optional module is arranged on the joint surface of the capacitor module, and the heat sink structure is arranged between the capacitor module and the optional module; the optional module abuts against the second cooling surface, and the heat sink structure performs heat exchange with the optional module through the second cooling surface.

7. The controller power brick according to claim 6, characterized in that: The cold plate body cooperates with the assembly groove and is embedded in the assembly groove; one of the opposite sides of the cold plate body is provided with the first cooling surface, the first cooling surface abuts against the bottom of the assembly groove, and the other is provided with an inner-plate sealing groove, and an inner-plate sealing ring is provided in the inner-plate sealing groove, and the inner-plate sealing ring is arranged around the liquid inlet area, the cooling area and the liquid discharge area.

8. The controller power brick according to claim 7, characterized in that: A cover body is arranged on one side of the cold plate body away from the bottom of the assembly groove, a second cooling surface is arranged on one of the opposite sides of the cover body, the second cooling surface abuts against the optional module, and the inner plate sealing ring is located between the cover body and the cold plate body.

9. The controller power brick according to claim 8, characterized in that: The cover plate body is provided with an opening and an outer sealing groove on one side away from the cold plate body; the outer sealing groove is provided around the opening, an outer sealing ring is provided in the outer sealing groove, and the outer sealing ring is located between the cover plate body and the optional module; Alternatively, an opening and a sealing plate are provided on one side of the cover body away from the cold plate body; the sealing plate covers the opening in the orthographic projection of the cover body, at least a portion of the second cooling surface is provided on the sealing plate, and the optional module abuts against one side of the sealing plate.

10. The controller power brick according to claim 8, characterized in that: The optional module is an electric drive module, the coupling surface of the drive module and the capacitor module is connected and abuts against the second cooling surface, and the drive module is electrically connected to the capacitor module through the wiring terminal; or, the optional module is an auxiliary heat dissipation module, including a connecting plate and a plurality of fins, the connecting plate is connected to the coupling surface and abuts against the second cooling surface; the plurality of fins are arranged on a side of the connecting plate away from the capacitor module; a groove portion is recessed on a side of the connecting plate close to the capacitor module; a heat pipe is arranged in the groove portion and filled with a heat conducting medium, the heat conducting medium covers the heat pipe, and the surface of the heat conducting medium is flush with a side of the connecting plate close to the capacitor module.

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