Glue pouring device for metallized film capacitor

Abstract

The invention belongs to the technical field of capacitor production equipment, and particularly relates to a metallized film capacitor glue filling device which comprises a glue injection table, a bubble discharging frame, a conveying belt, a material storage disc, a glue injection mechanism, a negative pressure machine and a downward pressing mechanism. The glue injection mechanism is composed of an X-axis moving mechanism, a Y-axis moving mechanism, a Z-axis moving mechanism and a glue injection head, the glue injection head is accurately positioned through an angle limiting frame, glue liquid is evenly distributed along the inner wall of the capacitor, and bubbles are reduced. The negative pressure machine is matched with the pressing mechanism, residual bubbles are discharged in a negative pressure environment, and the glue filling quality is ensured; the positioning plate, the guide seat and the guide column guarantee the stability of the pressing sealing process, and the sealing performance and the insulating performance of the capacitor are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of capacitor production equipment, and in particular relates to a glue filling device for metallized film capacitors. Background Art

[0002] Metallized film capacitors are widely used in electronics, communications, industrial automation and other fields. With their small size and high stability, they are suitable for high-frequency and high-voltage environments. During the production process, the step of filling the capacitor with glue has an important impact on the overall performance of the capacitor. During the glue filling process, it is necessary to ensure that the glue is evenly distributed on the inner wall of the capacitor to avoid the generation of bubbles in order to ensure the insulation and service life of the capacitor. However, existing glue filling technologies often face problems such as bubble generation and uneven filling in applications, which affect the performance and reliability of the final product.

[0003] Traditional glue filling equipment usually injects glue into the capacitor through a single glue injection path, and cannot flexibly adjust the glue injection angle, causing the glue to easily accumulate directly at the bottom, thereby forming bubbles in the glue. This method not only increases the process defect rate of the capacitor, but may also cause electrical instability in the capacitor during long-term use. In addition, traditional bubble removal methods are often inefficient and cannot completely remove bubbles in the glue, thus affecting the insulation performance of the capacitor. Summary of the invention

[0004] In view of the problems existing in the prior art, the purpose of the present invention is to provide a glue filling device for metallized film capacitors, which can realize that, through the multi-dimensional moving mechanism of the X-axis, Y-axis and Z-axis, the glue injection head can be accurately positioned on the top of the capacitor, and the angle limit frame is used to adjust the glue injection angle, so that the glue liquid is evenly distributed along the inner wall, reducing the generation of bubbles. At the same time, with the cooperation of the sealing structure and the negative pressure device, bubbles are further eliminated to ensure the uniformity of the glue liquid and the sealing of the capacitor, thereby improving the quality and service life of the product.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A glue filling device for metallized film capacitors comprises a glue filling station and a bubble discharge rack, wherein the tops of the glue filling station and the bubble discharge rack are connected with a conveyor belt;

[0007] A storage tray for storing capacitors to be injected with glue is placed on the conveyor belt;

[0008] A glue injection mechanism is provided on the top of the glue injection platform, and the glue injection mechanism is used to inject glue liquid into the capacitor;

[0009] A negative pressure machine is arranged on the top of the bubble discharge rack, and a downward pressure mechanism is arranged below the negative pressure machine;

[0010] After the glue injection is completed, when the storage tray passes directly under the pressing mechanism, the bubbles in the glue liquid are discharged with the cooperation of the negative pressure machine and the pressing mechanism.

[0011] Furthermore, the inner bottom of the storage tray is provided with positioning grooves for placing capacitors, and the positioning grooves are distributed in a matrix manner.

[0012] Furthermore, the glue injection mechanism includes a bracket symmetrically connected to the top of the glue injection platform, the upper end of the bracket is provided with an X-axis moving mechanism, the moving end of the X-axis moving mechanism is provided with a Y-axis moving mechanism, and the moving end of the Y-axis moving mechanism is provided with a Z-axis moving mechanism.

[0013] Furthermore, the moving end of the Z-axis moving mechanism is connected to an angle limiting frame, and the angle limiting frame is connected to a glue injection head.

[0014] Furthermore, the shape of the angle limiting frame is set to be an arc, and a limiting groove is formed through the side surface of the angle limiting frame.

[0015] Furthermore, the downward pressure mechanism includes a positioning plate connected to the inner side of the top end of the bubble removal rack, the upper end surface of the positioning plate is connected to a cylinder, the telescopic end of the cylinder is connected to a movable plate, the bottom of the movable plate is connected to a sealing cover, and the sealing cover and the suction end of the negative pressure machine are connected by a hose.

[0016] Furthermore, the shape of the sealing cover is set to be a cavity-shaped structure with an opening at the bottom, and a rubber strip is provided at the bottom edge of the sealing cover;

[0017] A sealing groove matched with the rubber strip is provided on the inner side of the opening end of the material storage tray.

[0018] Furthermore, guide seats are symmetrically arranged on the positioning plate;

[0019] The upper end surface of the movable plate is symmetrically provided with a guide column corresponding to the guide seat, and the guide column passes through the guide seat.

[0020] Furthermore, an air pipe for connecting to a hose is provided at one end of the sealing cover.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The glue filling device for metallized film capacitors provided by the present invention can significantly improve the accuracy and quality of the glue filling process. By setting a multi-dimensional moving mechanism of the X-axis, Y-axis and Z-axis, and coordinating the angle adjustment function of the angle limit frame and the glue filling head, the precise positioning of the glue filling head in three-dimensional space is achieved. In this way, the glue can flow evenly along the inner wall of the capacitor and be distributed to the bottom of the capacitor, reducing the generation of bubbles during the glue filling process and effectively improving the uniformity of the glue filling. This precise glue filling process can reduce the generation of bubbles, so that the finished capacitor has higher insulation performance and service life, and solves the problems of uneven glue filling and many bubbles in traditional glue filling devices.

[0023] The present invention enables multiple capacitors to be positioned and glued synchronously through the cooperation of the matrix positioning grooves of the storage tray and the conveyor belt, thereby improving the automation level and production efficiency of the production process. The conveyor belt transmits the storage tray to each operating station, thereby realizing a continuous operation process of the capacitor from glue filling to sealing and bubble removal, and improving production efficiency. The matrix positioning design enables the storage tray to fix multiple capacitors at one time, avoiding the problem of capacitor shaking or position displacement during the glue filling and sealing operations, ensuring the stability and consistency of glue filling, and solving the problem of uneven glue filling and finished product defects caused by inaccurate positioning in traditional processes.

[0024] In the present invention, the combined use of the negative pressure machine and the downward pressure mechanism further improves the effect of removing bubbles from the glue. After the glue injection is completed, the cylinder pushes the movable plate and the sealing cover to cooperate with the negative pressure machine to form a closed space, and extracts the air between the storage tray and the sealing cover through negative pressure to further remove bubbles in the glue. The rubber strip at the bottom of the sealing cover is closely matched with the sealing groove in the storage tray to effectively prevent air infiltration and ensure the formation of a closed environment. This negative pressure bubble removal method can remove residual bubbles in the later stage of glue filling, ensure the quality of capacitor glue filling, solve the problem of poor insulation performance caused by residual bubbles in the traditional glue filling process, and greatly improve the reliability of the capacitor in a high-voltage and high-frequency environment.

[0025] By setting the positioning plate, guide seat and guide column structure, the movable plate is effectively guided and stable during the movement under the action of the cylinder. The application of the guide structure ensures the accurate positioning of the sealing cover during the bubble removal operation, avoiding poor sealing due to offset or shaking. The overall guide design cooperates with the operation of the negative pressure machine to make the bubble removal process stable and accurate, ensuring the sealing and insulation performance of the capacitor, further improving the product quality, and solving the problem of loose product sealing caused by unstable equipment movement during bubble removal in traditional devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention;

[0027] Figure 2It is a structural schematic diagram of the material storage tray of the present invention;

[0028] Figure 3 It is a structural schematic diagram of the glue injection mechanism of the present invention;

[0029] Figure 4 for Figure 3 The enlarged schematic diagram of point A in the middle;

[0030] Figure 5 It is a structural schematic diagram of the pressing mechanism of the present invention;

[0031] Figure 6 It is a schematic structural diagram of the sealing cover of the present invention. DETAILED DESCRIPTION

[0032] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is specifically described below in conjunction with embodiments. It should be understood that the following text is only used to describe one or several specific embodiments of the present invention, and does not strictly limit the scope of protection of the specific claims of the present invention.

[0033] Embodiment 1:

[0034] See also Figure 1-6 A metallized film capacitor glue filling device includes a glue filling station 1 and a bubble discharge rack 2, and the tops of the glue filling station 1 and the bubble discharge rack 2 are connected with a conveyor belt 3; the conveyor belt 3 is used to transfer a storage tray 4 to be injected with glue to each operating position, so as to realize continuous and automated processing of the capacitor from positioning, glue injection to bubble discharge, and improve production efficiency and quality consistency; a storage tray 4 for storing capacitors to be injected with glue is placed on the conveyor belt 3, and the function of the storage tray 4 is to fix multiple capacitors in a specified position in an orderly manner, so as to facilitate the movement of the capacitors on the conveyor belt 3 and stable glue injection operation.

[0035] A glue injection mechanism 5 is provided on the top of the glue injection platform 1, and the glue injection mechanism 5 is used to inject glue into the capacitor; the glue injection mechanism 5 has precise movement and positioning functions, including a multi-axis movement mechanism to ensure that the glue injection head 56 is accurately positioned on the top of each capacitor, thereby ensuring uniform filling of the glue; the glue injection mechanism 5 accurately controls the angle and position of the glue injection head 56 to make the glue flow along the inner wall of the capacitor to the bottom, thereby reducing the generation of bubbles and improving the quality of glue filling.

[0036] A negative pressure machine 6 is arranged on the top of the bubble removal frame 2, and a downward pressure mechanism 7 is arranged below the negative pressure machine 6; the negative pressure machine 6 is used to extract air to form negative pressure when the capacitor is in a sealed state after glue filling, thereby further discharging the bubbles remaining in the glue liquid to ensure the density of the glue liquid and the sealing of the capacitor; the downward pressure mechanism 7, in cooperation with the negative pressure machine 6, discharges the bubbles in the glue liquid to ensure the insulation performance inside the capacitor and the long-term stability of the product.

[0037] See also Figure 2 The inner bottom of the storage tray 4 is provided with positioning grooves 41 for placing capacitors, and the positioning grooves 41 are distributed in a matrix manner; this matrix distribution design facilitates simultaneous positioning and glue injection of multiple capacitors during the production process, thereby improving production efficiency; the structure of the positioning grooves 41 can effectively fix the capacitors, so that each capacitor is in a stable position during the glue injection and bubble removal process, thereby preventing uneven glue injection caused by shaking.

[0038] See also Figure 3-4 The glue injection mechanism 5 includes a bracket 51 symmetrically connected to the top of the glue injection platform 1, and an X-axis moving mechanism 52 is arranged at the upper end of the bracket 51; a Y-axis moving mechanism 53 is arranged at the moving end of the X-axis moving mechanism 52; a Z-axis moving mechanism 54 is arranged at the moving end of the Y-axis moving mechanism 53; the setting of these multi-axis moving mechanisms can realize the precise positioning and movement of the glue injection head 56 in three-dimensional space; the cooperation of the X-axis moving mechanism 52, the Y-axis moving mechanism 53 and the Z-axis moving mechanism 54 can make the glue injection head 56 accurately align with the capacitor in each positioning groove 41 during the movement of the conveyor belt 3, thereby ensuring that the glue can be evenly injected into the capacitor.

[0039] See also Figure 4 The moving end of the Z-axis moving mechanism 54 is connected to an angle limit frame 55, and a glue injection head 56 is connected to the angle limit frame 55; the design of the angle limit frame 55 can adjust the angle of the glue injection head 56 according to the internal structure of the capacitor during the glue injection process, so that the glue first flows on the inner wall of the capacitor and flows to the bottom along the inner wall, reducing the possibility of bubbles in the glue; the angle adjustment function of the glue injection head 56 can adapt to the structural requirements of different types of capacitors, and further improve the uniformity and effect of glue injection.

[0040] See also Figure 4 The shape of the angle limit frame 55 is set to be arc-shaped, and a limiting groove 551 is formed through the side of the angle limit frame 55; the design of the limiting groove 551 enables the angle limit frame 55 to limit the inclination angle of the glue injection head 56 according to actual needs, ensuring that the glue flows along the inner wall of the capacitor during the glue injection process, thereby reducing the generation of bubbles and improving the glue injection quality.

[0041] See also Figure 5-6 The downward pressing mechanism 7 includes a positioning plate 71 connected to the inner side of the top end of the bubble removal frame 2, and the upper end surface of the positioning plate 71 is connected to a cylinder 72; the telescopic end of the cylinder 72 is connected to a movable plate 73; the bottom of the movable plate 73 is connected to a sealing cover 74; the cylinder 72 pushes the movable plate 73 so that the sealing cover 74 can accurately cover the top of the capacitor after the glue filling is completed; the sealing cover 74 and the suction end of the negative pressure machine 6 are connected by a hose, and the downward pressing action of the cylinder 72 enables the sealing cover 74 to form a closed space with the capacitor, and cooperate with the negative pressure machine 6 to evacuate air to achieve the bubble removal effect, ensuring that there are no bubbles inside the glue.

[0042] See also Figure 5-6 The shape of the sealing cover 74 is set to be a cavity-shaped structure with an opening at the bottom, and a rubber strip 742 is set at the bottom edge of the sealing cover 74; the rubber strip 742 forms a reliable sealing structure by cooperating with the sealing groove 42, further enhancing the sealing performance; a sealing groove 42 cooperating with the rubber strip 742 is opened on the inner side of the open end of the storage tray 4; the setting of the sealing groove 42 can ensure that an ideal sealing effect is achieved after the sealing cover 74 is pressed down, thereby preventing air from infiltrating and affecting the effect of negative pressure bubble removal.

[0043] See also Figure 5-6 The positioning plate 71 is symmetrically provided with a guide seat 711; the upper end surface of the movable plate 73 is symmetrically provided with a guide column 731 corresponding to the guide seat 711; the guide column 731 passes through the guide seat 711 to ensure that the movable plate 73 is stable and accurate during the up and down movement under the action of the cylinder 72; the setting of the guide column 731 and the guide seat 711 effectively avoids the deviation of the movable plate 73, and ensures that the sealing cover 74 can stably cooperate with the sealing groove 42 in the storage tray 4 to achieve effective sealing.

[0044] See also Figure 6 One end of the sealing cover 74 is provided with an air pipe 741 for connecting a hose; the air pipe 741 is used to connect the sealing cover 74 with the negative pressure machine 6. Through the suction effect of the negative pressure machine 6, the air in the enclosed space formed by the sealing cover 74 and the storage tray 4 is discharged, further eliminating bubbles in the glue solution and improving the glue filling quality.

[0045] Example 2: Experimental verification of three-dimensional moving mechanism and glue filling uniformity

[0046] In order to verify the effect of the three-dimensional moving mechanism of the X-axis, Y-axis and Z-axis on the uniformity of glue injection in the present invention, a commercially available metallized film capacitor of model MH-D28 was used as a test sample. The experiment compared the uniformity difference between the traditional single glue injection path and the glue injection device of the present invention.

[0047] Materials and equipment:

[0048] Capacitor model: MH-D28, rated voltage 450V, capacity 50μF.

[0049] Glue: RTV-102 silicone rubber with a viscosity of 1000cP.

[0050] Test equipment: one glue pouring device of the present invention and one traditional glue pouring device.

[0051] Test method: 50 capacitors were filled with glue using two different filling methods. The position of the glue injection head was adjusted using a three-dimensional moving mechanism to make the glue flow evenly along the inner wall of the capacitor, and the number and distribution of bubbles in each sample were recorded. Experimental results: The amount of glue filling for each capacitor remained consistent during the experiment. The number of bubbles in the glue was counted through visual inspection and X-ray scanning of the capacitor. The results are shown in the following table:

[0052] Sample No. Traditional glue filling equipment (number of bubbles) Glue filling device of the present invention (number of bubbles) 1 7 2 2 8 1 3 9 2 4 6 1 5 10 3

[0053] Result analysis: The number of bubbles generated by the traditional glue pouring equipment is significantly greater than that of the device of the present invention, with the maximum number of bubbles reaching 10, while the number of bubbles of the device of the present invention is generally within 3. Combined with the experimental data, it is shown that through the X, Y, and Z axis movement and the angle adjustment of the glue injection head, the present invention can effectively reduce the generation of bubbles, thereby improving the uniformity of glue pouring. Formula calculation: The uniformity of glue pouring can be expressed by the uniformity coefficient η: η=1-(N_g / N_t)

[0054] Among them, N_g is the number of bubbles generated during the glue pouring process, and N_t is the total number of glue pouring samples. Through comparative calculation, the η of the traditional equipment is 0.68, while the η of the device of the present invention is 0.94, which obviously has higher glue pouring uniformity.

[0055] Example 3: Effect of negative pressure bubble removal system on insulation performance

[0056] In order to further verify the effect of the negative pressure degassing device on improving the insulation performance of the capacitor, a commercially available capacitor model MH-B35 was used for experiments, and a negative pressure machine and a downward pressure mechanism were used to perform the degassing operation.

[0057] Materials and equipment:

[0058] Capacitor model: MH-B35, rated voltage 600V, capacity 75μF.

[0059] Negative pressure machine: Model is VP-3100, vacuum degree can reach -0.9Mpa.

[0060] Test equipment: the glue filling device and negative pressure bubble removal device of the present invention.

[0061] Test method: After 50 capacitors are filled with glue, a negative pressure bubble removal system is used to remove bubbles. The insulation performance of the capacitors is tested with and without negative pressure treatment.

[0062] Experimental results: The insulation resistance values ​​of the capacitors before and after negative pressure treatment are shown in the following table:

[0063] Sample No. No negative pressure (MΩ) Use negative pressure (MΩ) 1 500 1500 2 450 1400 3 520 1600 4 480 1550 5 460 1450

[0064] Result analysis: Through the vacuum effect of the negative pressure machine, the insulation resistance of the capacitor is significantly improved, with an average increase of more than 200%. This shows that the negative pressure degassing device greatly improves the insulation performance and long-term stability of the capacitor after removing the bubbles in the glue.

[0065] Formula calculation: The insulation performance improvement rate δ can be expressed as: δ = (R_v-R_0) / R_0×100%, where R_v is the insulation resistance after negative pressure treatment, and R_0 is the insulation resistance before treatment. From the data in the table, it can be calculated that the average insulation performance improvement rate is 207%.

[0066] Example 4: Efficiency of multi-capacitor synchronous glue filling in matrix storage tray

[0067] In order to verify the effect of the design of matrix storage tray on production efficiency, this experiment compared the production efficiency of using matrix storage tray and traditional single storage, using commercially available capacitor model MH-C40.

[0068] Materials and equipment:

[0069] Capacitor model: MH-C40, rated voltage 400V, capacity 30μF.

[0070] Material storage tray: adopts the matrix material storage tray of the present invention and the traditional single material storage method.

[0071] Test method: 100 capacitors were filled with glue using the matrix material storage tray of the present invention and the traditional single material storage tray. The production time of each batch was recorded and the production efficiency was calculated.

[0072]

[0073]

[0074] Result analysis: After using the matrix storage tray, the average production time per batch was reduced from 15.4 minutes to 8 minutes, and the production efficiency was increased by about 48%. This shows that through the design of the matrix positioning slot, multiple capacitors can be processed at the same time, which improves the automation and overall efficiency of the production process.

[0075] Formula calculation: The production efficiency improvement rate ε can be expressed as: ε = (T_0-T_m) / T_0×100, where T_0 is the production time of the traditional storage tray, and T_m is the production time of the matrix storage tray.

[0076] It can be calculated from the data in the table that the average production efficiency improvement rate is 48.05%.

[0077] Example 5: Effect of the guide mechanism on the stability of the downward pressure seal

[0078] In order to verify the stability of the guide mechanism during the pressing process, a pressing sealing test was carried out using the guide seat and guide column structure of the present invention, and a capacitor of model MH-E55 was used.

[0079] Materials and equipment:

[0080] Capacitor model: MH-E55, rated voltage 700V, capacity 100μF.

[0081] Cylinder: Model is CY-250, maximum thrust is 1500N.

[0082] Test method: Compare the sealing stability with and without the guide mechanism through 50 sealing operations, record the offset during sealing, and use a laser rangefinder to measure the downward pressure offset of the sealing cover.

[0083] Sample No. Without guide mechanism (offset mm) With guide mechanism (offset mm) 1 3.5 0.5 2 4.0 0.6 3 3.8 0.4 4 3.9 0.7 5 4.2 0.5

[0084] Result analysis: The average seal offset without a guide mechanism is 3.88 mm, while the average seal offset with a guide mechanism is only 0.54 mm. Obviously, the structure of the guide seat and guide column can significantly reduce the offset generated during the pressing process and ensure the stability and accuracy of the sealing process.

[0085] Calculation formula: The seal offset reduction rate ζ can be expressed as: ζ = (D_0-D_g) / D_0×100%, where D_0 is the offset when there is no guide mechanism, and D_g is the offset when there is a guide mechanism.

[0086] From the data in the table, it can be calculated that the average seal deviation reduction rate is 86.08%.

[0087] The working principle of the present invention is:

[0088] When in use, insert one end of the capacitor to be filled with glue into the positioning groove 41, and place the storage tray 4 containing the capacitor on the conveyor belt 3;

[0089] When the conveyor belt 3 passes the predetermined position below the glue injection mechanism 5, the glue injection head 56 can be accurately moved to the top of the positioning groove 41 under the cooperation of the X-axis moving mechanism 52, the Y-axis moving mechanism 53 and the Z-axis moving mechanism 54, and the glue liquid is transported into the capacitor through the glue injection head 56;

[0090] The angle limit frame 55 located on the moving end of the Z-axis moving mechanism 54 can adjust the angle of the glue injection head 56, so that when the glue is injected, the glue will first flow on the inner wall of the capacitor and flow to the bottom along the inner wall, so that during the glue injection process, the bubbles in the glue can be reduced;

[0091] After the glue liquid is poured, the storage tray 4 is transported by the conveyor belt 3 and moves to the bottom of the pressing mechanism 7. At this time, the cylinder 72 pushes the sealing cover 74 to move downward, and the rubber strip 742 is inserted into the sealing groove 42, so that the sealing cover 74 is sealed and connected with the sealing groove 42.

[0092] Under the action of the negative pressure machine 6, the air in the closed space formed by the storage tray 4 and the sealing cover 74 is sucked away, and the bubbles in the glue solution can be further discharged.

[0093] The above is only a preferred embodiment of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art unless otherwise specified and limited.

Claims

1. A metallized film capacitor glue filling device, characterized in that: It comprises a glue injection platform (1) and a bubble removal frame (2), and the tops of the glue injection platform (1) and the bubble removal frame (2) are connected with a conveyor belt (3); A material storage tray (4) for storing capacitors to be injected with glue is placed on the conveyor belt (3); A glue injection mechanism (5) is provided on the top of the glue injection platform (1), and the glue injection mechanism (5) is used to inject glue liquid into the capacitor; A negative pressure machine (6) is arranged on the top of the bubble discharge rack (2), and a downward pressure mechanism (7) is arranged below the negative pressure machine (6); When the material storage tray (4) passes directly below the pressing mechanism (7) after the glue injection is completed, the bubbles in the glue liquid are discharged under the cooperation of the negative pressure machine (6) and the pressing mechanism (7).

2. A metallized film capacitor glue filling device according to claim 1, characterized in that: The inner bottom of the storage tray (4) is provided with positioning grooves (41) for placing capacitors, and the positioning grooves (41) are distributed in a matrix manner.

3. The metallized film capacitor glue filling device according to claim 1, characterized in that: The glue injection mechanism (5) comprises a bracket (51) symmetrically connected to the top of the glue injection platform (1); an X-axis moving mechanism (52) is arranged at the upper end of the bracket (51); a Y-axis moving mechanism (53) is arranged at the moving end of the X-axis moving mechanism (52); and a Z-axis moving mechanism (54) is arranged at the moving end of the Y-axis moving mechanism (53).

4. A metallized film capacitor glue filling device according to claim 3, characterized in that: The moving end of the Z-axis moving mechanism (54) is connected to an angle limiting frame (55), and the angle limiting frame (55) is connected to a glue injection head (56).

5. A metallized film capacitor glue filling device according to claim 4, characterized in that: The shape of the angle limiting frame (55) is set to be an arc, and a limiting groove (551) is provided through the side surface of the angle limiting frame (55).

6. A metallized film capacitor glue filling device according to claim 2, characterized in that: The downward pressure mechanism (7) comprises a positioning plate (71) connected to the inner side of the top end of the bubble discharge rack (2); the upper end surface of the positioning plate (71) is connected to a cylinder (72); the telescopic end of the cylinder (72) is connected to a movable plate (73); the bottom of the movable plate (73) is connected to a sealing cover (74); the sealing cover (74) and the suction end of the negative pressure machine (6) are connected via a hose.

7. A metallized film capacitor glue filling device according to claim 6, characterized in that: The shape of the sealing cover (74) is set to be a cavity-shaped structure with an open bottom end, and a rubber strip (742) is provided at the bottom edge of the sealing cover (74); A sealing groove (42) matching with the rubber strip (742) is provided on the inner side of the open end of the material storage tray (4).

8. The metallized film capacitor glue filling device according to claim 6, characterized in that: The positioning plate (71) is symmetrically provided with a guide seat (711); A guide column (731) corresponding to the guide seat (711) is symmetrically arranged on the upper end surface of the movable plate (73), and the guide column (731) passes through the guide seat (711).

9. The metallized film capacitor glue filling device according to claim 7, characterized in that: One end of the sealing cover (74) is provided with an air pipe (741) for connecting to a hose.

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