Mask assembly and method of manufacturing same

Abstract

The invention provides a mask assembly and a method of manufacturing the same. The mask assembly includes: a frame including a frame opening; and an open mask including a cell opening overlapping the frame opening. The open mask further includes a support portion overlapping a remaining one of the cell openings other than the first cell opening.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0113973 filed in the Korean Intellectual Property Office on August 29, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments relate to a mask assembly and a method of manufacturing the mask assembly. Background Art

[0004] With the development of information technology, the importance of display devices as a connection medium between users and information has been highlighted. Accordingly, the use of display devices such as liquid crystal display devices, organic light emitting display devices, etc. has been increasing.

[0005] The display device may include a plurality of pixels. Each of the plurality of pixels may include a light emitting layer disposed between opposing electrodes. The light emitting layer may be formed by various methods, one of which may be a deposition method using a mask assembly.

[0006] The mask assembly can be manufactured by attaching a plurality of masks to a frame. In the process of attaching the plurality of masks, the shapes of the masks are deformed, which deteriorates the deposition accuracy and reliability of the light emitting layer.

[0007] It should be understood that the background technology of the technical section is intended in part to provide useful background technology for understanding technology. However, the background technology of the technical section may also include ideas, concepts or cognitions that were not known or understood by a technician in the relevant field before the corresponding effective application date of the subject matter disclosed in this article. Summary of the invention

[0008] Embodiments are directed to providing a mask assembly having improved deposition accuracy and reliability and a method of manufacturing the mask assembly.

[0009] According to one embodiment, a mask assembly may include: a frame including a frame opening; and an open mask including a plurality of unit openings overlapping the frame opening, wherein the open mask may further include a plurality of support portions overlapping the remaining unit openings of the plurality of unit openings except a first unit opening.

[0010] Each of the plurality of unit openings may have a substantially rectangular shape.

[0011] The diagonal length of each of the plurality of unit openings may be approximately 11 inches or greater.

[0012] The mask assembly may further include a first deposition mask including a first deposition region overlapping the first unit opening.

[0013] Each of the plurality of support portions may extend in a first direction, and may be disposed in a second direction substantially perpendicular to the first direction.

[0014] The plurality of supporting parts may include: a plurality of first sub-support parts, each of which extends in a first direction and is arranged in a second direction substantially perpendicular to the first direction; and a plurality of second sub-support parts, each of which extends in the second direction and is arranged in the first direction.

[0015] According to one embodiment, a method for manufacturing a mask assembly may include: manufacturing an open mask, the open mask including n unit openings, and a plurality of support portions overlapping with the remaining unit openings of the n unit openings except a first unit opening, wherein n is a natural number of 3 or greater; attaching the open mask to a frame including a frame opening so that the n unit openings overlap with the frame opening; and attaching a first deposition mask including a first deposition area to the open mask so that the first deposition area overlaps with the first unit opening.

[0016] The method of the mask assembly may further include: removing the (k-1)th supporting portion among the multiple supporting portions that overlaps with the kth unit opening; and attaching a kth deposition mask in which a kth deposition area is defined to the open mask so that the kth deposition area overlaps with the kth unit opening, where k is a natural number greater than 2 and less than n.

[0017] The removing of the (k-1)th supporting portion and the attaching of the kth deposition mask may be repeated until the value of k becomes n.

[0018] The attaching of the first deposition mask may include: applying a tensile force to the first deposition mask; welding the stretched first deposition mask to the open mask; and releasing the tensile force.

[0019] The attaching of the kth deposition mask may include: applying a tensile force to the kth deposition mask; welding the stretched kth deposition mask to the open mask; and releasing the tensile force.

[0020] Each of the n unit openings may have a substantially rectangular shape.

[0021] The diagonal length of each of the n unit openings may be approximately 11 inches or greater.

[0022] Each of the plurality of support portions may extend in a first direction, and may be disposed in a second direction substantially perpendicular to the first direction.

[0023] The plurality of support parts may include: a plurality of first sub-support parts, each of which extends in a first direction and is arranged in a second direction substantially perpendicular to the first direction; and a plurality of second sub-support parts, each of which extends in the second direction and is arranged in the first direction.

[0024] According to one embodiment, a method for manufacturing a mask assembly may include: attaching a mask to a frame including a frame opening; forming a kth unit opening in the mask; and attaching a kth deposition mask including a kth deposition area to the mask so that the kth deposition area overlaps with the kth unit opening, wherein k is a natural number greater than or equal to 1 and less than or equal to n, and n is a natural number greater than or equal to 3.

[0025] The forming of the kth cell opening and the attaching of the kth deposition mask may be repeated until a value of k becomes n.

[0026] The k-th cell opening may be formed by irradiating the mask with a laser beam.

[0027] The kth unit opening may have a substantially rectangular shape.

[0028] The diagonal length of the kth unit opening may be about 11 inches or greater.

[0029] According to the embodiment, by forming a plurality of support portions overlapping the plurality of openings in the open mask to prevent the open mask from being deformed, deposition accuracy can be improved. By sequentially removing the plurality of support portions to ensure space in the openings, deposition reliability can be improved.

[0030] However, the effects of the present disclosure are not limited to the effects described above, and various extensions can be made without departing from the spirit and scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other features of the present disclosure will become more apparent by further describing the embodiments of the present disclosure in detail with reference to the accompanying drawings, in which:

[0032] Figure 1 A schematic perspective view illustrating a mask assembly according to an embodiment.

[0033] Figure 2 and Figure 3 A manufacturing process of a mask assembly is illustrated.

[0034] Figure 4A mask assembly according to an embodiment is illustrated.

[0035] Figures 5 to 12 A manufacturing process of a mask assembly according to an embodiment is schematically illustrated.

[0036] Fig.13 A mask assembly according to an embodiment is illustrated.

[0037] Figures 14 to 24 A manufacturing process of a mask assembly according to an embodiment is schematically illustrated.

[0038] Figures 25 to 34 A manufacturing process of a mask assembly according to an embodiment is schematically illustrated. DETAILED DESCRIPTION

[0039] In the following description, for the purpose of explanation, many details are set forth in order to provide a detailed understanding of various embodiments or implementations. "Embodiments" and "implementations" used in this article are interchangeable words, which are non-limiting examples of the devices or methods disclosed herein. However, it is apparent that various embodiments can be practiced without these specific details or with one or more equivalent arrangements. Here, various embodiments do not have to be exclusive, nor do they have to limit the present disclosure. For example, the specific shape, configuration, and characteristics of an embodiment can be used or implemented in another embodiment.

[0040] Unless otherwise specified, the illustrated embodiments should be understood to provide features of the present disclosure. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as "elements") can be combined, separated, interchanged and / or rearranged in other ways without departing from the present disclosure.

[0041] The use of cross-hatching and / or shading in the drawings is generally provided to clarify boundaries between adjacent elements. As such, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for specific materials, material properties, dimensions, proportions, commonalities between illustrated elements, and / or any other features, attributes, properties, etc. of elements, unless otherwise specified.

[0042] Furthermore, in the drawings, the sizes and relative sizes of elements may be exaggerated for clarity and / or descriptive purposes.

[0043] When the embodiments can be implemented differently, a specific process order can be performed in a different order than described. For example, two processes described in succession can be performed substantially simultaneously, or in an order opposite to the order described. Moreover, the same reference numerals represent the same elements.

[0044] When an element, such as a layer, is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical, electrical, and / or fluid connection with or without intervening elements.

[0045] In addition, the DR1 axis, the DR2 axis, and the DR3 axis are not limited to the three axes of a rectangular coordinate system, such as the X, Y, and Z axes, and can be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the DR3 axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. In addition, the X axis, the Y axis, and the Z axis are not limited to the three axes of a rectangular coordinate system, such as the x, y, and z axes, and can be interpreted in a broader sense. For example, the X axis, the Y axis, and the Z axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0046] For the purpose of the present disclosure, “at least one of A and B” may be interpreted as only A, only B, or any combination of A and B.

[0047] Moreover, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be construed as any combination of only X, only Y, only Z, or two or more of X, Y, and Z.

[0048] In the specification and claims, the term "and / or" is intended to include any combination of the terms "and" and "or" for the purposes of its meaning and interpretation. For example, "A and / or B" may be understood to mean "A, B, or A and B". The terms "and" and "or" may be used in a conjunctive sense or a disjunctive sense and may be understood to be equivalent to "and / or".

[0049] Although the terms "first", "second", etc. can be used in this article to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, the first element discussed below can be referred to as the second element without departing from the teachings of the present disclosure.

[0050] Spatially relative terms such as "below," "below," "below," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), and the like may be used herein for descriptive purposes, and thereby describe the relationship of one element to another element as illustrated in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture, in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is flipped, an element described as being "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the term "below" may encompass both above and below orientations. Additionally, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and as such, the spatially relative descriptors used herein are interpreted accordingly.

[0051] The term "overlap" or "overlapping" means that a first object can be above or below or to one side of a second object, and vice versa. In addition, the term "overlap" may include layering, stacking, facing or facing, extending, covering, partially covering, or any other suitable term that a person of ordinary skill in the art will recognize and understand.

[0052] When an element is described as “not overlaying” or “not overlapping” another element, this may include the elements being spaced apart, offset, or separated from each other, or any other suitable terminology that one of ordinary skill in the art would recognize and understand.

[0053] The terms "facing" and "facing" mean that the first element may be directly or indirectly opposed to the second element. In the case where a third element is interposed between the first and second elements, the first and second elements may be understood to be indirectly opposed to each other, although still facing each other.

[0054] The terminology used herein is for the purpose of describing embodiments and is not intended to be limiting.

[0055] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0056] In addition, the terms “include” and / or “comprising” when used in this specification explicitly indicate the existence of stated features, integers, steps, operations, elements, components and / or groups thereof, but do not preclude the existence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0057] It is also noted that as used herein, the terms "substantially," "about," and other similar terms are used as terms of approximation rather than terms of degree, and as such, are used to account for the inherent variations in measured, calculated, and / or provided values ​​that those of ordinary skill in the art would recognize.

[0058] Various embodiments are described herein with reference to cross-sectional views and / or exploded views as schematic diagrams of embodiments and / or intermediate structures. As such, variations in the shapes illustrated are to be expected due to, for example, manufacturing techniques and / or tolerances. Therefore, the embodiments disclosed herein need not be interpreted as being limited to the shapes of the illustrated regions, but rather include shape deviations, for example, caused by manufacturing. In this manner, the regions illustrated in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and as such, need not be intended to be restrictive.

[0059] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

[0060] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0061] Hereinafter, embodiments will be described in more detail with reference to the accompanying drawings.

[0062] Figure 1 A schematic perspective view illustrating a mask assembly according to an embodiment.

[0063] refer to Figure 1 , a mask assembly MA according to an embodiment may include a frame FR, an open mask OM, and a deposition mask DM.

[0064] The frame FR may be disposed below or under the open mask OM and the deposition mask DM to support the open mask OM and the deposition mask DM. In a plan view, the frame FR may have a rectangular shape having long sides extending in the first direction DR1 and short sides extending in the second direction DR2. However, the shape of the frame FR is not particularly limited, and any shape capable of supporting the open mask OM and the deposition mask DM is sufficient.

[0065] The frame FR may include a frame opening OP-F. For example, the frame opening OP-F may be defined in the frame FR. The deposition material may pass through the frame opening OP-F to pass through the openings defined in the open mask OM and the deposition mask DM. The deposition material may be ejected in the form of vapor from a deposition source (not shown) disposed under the mask assembly MA. The deposition material may be, for example, a luminescent material that forms a luminescent layer.

[0066] The frame FR may be made of a metal material. For example, within the spirit and scope of the present disclosure, the frame FR may include nickel, nickel-cobalt alloy, nickel-iron alloy, etc.

[0067] As an example, Figure 1 One frame FR in which one frame opening OP-F is defined is exemplified, but the present disclosure is not limited thereto. For example, a plurality of frame openings OP-F may be defined in the frame FR, and the open mask OM and the deposition mask DM may be supported by the plurality of frames FR.

[0068] The open mask OM may be disposed on the frame FR to support the deposition mask DM. In a plan view, the open mask OM may have a rectangular shape having long sides extending in the first direction DR1 and short sides extending in the second direction DR2. However, the shape of the open mask OM is not particularly limited, and any shape that can support the deposition mask DM is sufficient.

[0069] The open mask OM may be made of a metal material, for example, the open mask OM may include at least one of stainless steel, Invar, nickel, cobalt, a nickel alloy, and a nickel-cobalt alloy.

[0070] The open mask OM may include a plurality of unit openings OP-O. For example, a plurality of unit openings OP-O may be defined in the open mask OM. The plurality of unit openings OP-O may be arranged (or disposed) in the first direction DR1. Figure 1 It is illustrated that the plurality of unit openings OP-O are arranged in 3×1, but the arrangement and number of the plurality of unit openings OP-O are not limited thereto. For example, the plurality of unit openings OP-O may be arranged in the first direction DR1 and the second direction DR2.

[0071] In a plan view, each of the plurality of unit openings OP-O may have a rectangular shape having short sides extending in the first direction DR1 and long sides extending in the second direction DR2. However, the present disclosure is not limited thereto, and the shape of each of the plurality of unit openings OP-O may be changed to correspond to the shape of a display device forming a light emitting layer.

[0072] In the present embodiment, the open mask OM can be used to form a light-emitting layer in a medium-sized to large-sized display device. For example, within the spirit and scope of the present disclosure, the medium-sized to large-sized display device may include a television, an external billboard, a monitor, a personal computer, a notebook computer, etc. However, the present disclosure is not limited thereto, and the open mask OM can also be used to form a light-emitting layer of a small-sized to medium-sized display device, such as a tablet personal computer, a smart phone, a car navigation unit, a camera, a center information display (CID) provided in a car, a watch-type electronic device, a personal digital assistant (PDA), a portable multimedia player (PMP), and a game console.

[0073] The plurality of unit openings OP-O may overlap with the frame opening OP-F. Accordingly, the deposition material may be provided to the plurality of unit openings OP-O through the frame opening OP-F.

[0074] A plurality of deposition masks DM may be disposed on the open mask OM. The plurality of deposition masks DM may be disposed to correspond to the plurality of unit openings OP-O. For example, each of the plurality of deposition masks DM may be disposed to overlap with the corresponding unit opening OP-O.

[0075] A plurality of deposition masks DM may be arranged in the first direction DR1. Figure 1 The plurality of deposition masks DM are illustrated as being arranged in 3×1, but the arrangement and number of the plurality of deposition masks DM are not limited thereto. For example, the plurality of deposition masks DM may be arranged in the first direction DR1 and the second direction DR2 corresponding to the plurality of cell openings OP-O.

[0076] In a plan view, each of the plurality of deposition masks DM may have a rectangular shape having short sides extending in the first direction DR1 and long sides extending in the second direction DR2. However, it is not limited thereto, and the shapes of the plurality of deposition masks DM may be changed to correspond to the shapes of the plurality of unit openings OP-O, respectively.

[0077] The plurality of deposition masks DM may be made of a metal material. For example, the plurality of deposition masks DM may include at least one of stainless steel, Invar, nickel, cobalt, a nickel alloy, and a nickel-cobalt alloy.

[0078] Each of the plurality of deposition masks DM may include a deposition area DA and a welding area WA. For example, the deposition area DA and the welding area WA may be defined in each of the plurality of deposition masks DM.

[0079] The deposition area DA may be disposed at the center of the deposition mask DM. The deposition area DA may overlap with the unit opening OP-O. The deposition area DA may be an area through which the deposition material passes. The deposition area DA may include a plurality of deposition openings OP-D. For example, a plurality of deposition openings OP-D may be defined in the deposition area DA. The deposition material may pass through the plurality of deposition openings OP-D to be deposited on an object (e.g., a base substrate).

[0080] The welding area WA may be an area disposed outside the deposition mask DM. The welding area WA may surround the deposition area DA. The welding area WA may be a portion coupled or connected to the open mask OM. For example, the deposition mask DM may be attached to the open mask OM through the welding area WA.

[0081] Figure 2 and Figure 3 A manufacturing process of a mask assembly is illustrated.

[0082] The mask assembly MA may be manufactured by attaching an open mask OM to a frame FR and then attaching a deposition mask DM to the open mask OM. Figure 2 , the deposition mask DM may be stretched so that the deposition area DA of the deposition mask DM corresponds to the cell opening OP-O of the opening mask OM. For example, a stretching machine may be used to apply a selectable tensile force to the deposition mask DM. Thereafter, the welding area WA of the deposition mask DM may be welded to the opening mask OM in a state where the deposition mask DM is stretched.

[0083] refer to Figure 3 , the process of attaching the deposition mask DM to the opening mask OM can be completed by releasing the tension applied to the deposition mask DM. In this case, the size of the cell opening OP-O (eg, the diagonal length DD (see Figure 2 )) is larger, the greater the pulling force applied to the deposition mask DM. As a result, in the process of releasing the pulling force, the shapes of the opening mask OM and the deposition mask DM may be deformed, so that the deposition accuracy of the light emitting layer may be deteriorated. For example, in the case where the diagonal length DD of the unit opening OP-O is about 11 inches or more, the degradation of the deposition accuracy of the light emitting layer may worsen due to the deformation of the shapes of the opening mask OM and the deposition mask DM.

[0084] Figure 4 A mask assembly according to an embodiment is illustrated.

[0085] refer to Figure 4 , the mask assembly MA1 according to an embodiment may include an open mask OM1 on which a plurality of support portions SP are formed.

[0086] In the present embodiment, the open mask OM1 may include a plurality of unit openings OP-O. For example, a plurality of unit openings OP-O may be defined in the open mask OM1. The plurality of unit openings OP-O may be divided according to the order in which a plurality of deposition masks DM1, DM2, and DM3, which will be described later, are attached to the open mask OM1. For example, the first deposition mask DM1 (see Figure 5 ), the second deposition mask DM2 (see Figure 8 ) and a third deposition mask DM3 (see Fig.11 ) may be sequentially attached to the open mask OM1 to correspond to the first unit opening OP-O1, the second unit opening OP-O2, and the third unit opening OP-O3, respectively. For example, the first deposition mask DM1 may be attached to the open mask OM1 to correspond to the first unit opening OP-O1, then the second deposition mask DM2 may be attached to correspond to the second unit opening OP-O2, and then the third deposition mask DM3 may be attached to correspond to the third unit opening OP-O3.

[0087] The positions and arrangements of the plurality of unit openings OP-O1, OP-O2, and OP-O3 are not limited to Figure 4 For example, the positions and arrangements of the plurality of unit openings OP-O1, OP-O2, and OP-O3 may be changed according to process conditions.

[0088] Figure 4 The illustrated open mask OM1 may include three unit openings OP-O, but the number of unit openings OP-O included in the open mask OM1 is not limited thereto. In other words, the number of unit openings OP-O may vary according to process conditions.

[0089] In the present embodiment, the diagonal length DD1 of each of the plurality of unit openings OP-O may be about 11 inches or more. However, the present disclosure is not limited thereto, and the diagonal length of each of the plurality of unit openings OP-O may vary according to the specifications of a display device to be manufactured.

[0090] In the present embodiment, the open mask OM1 may include a plurality of supporting portions SP overlapping the remaining unit openings OP-O except for the unit opening at the start of the process. For example, the open mask OM1 may include a plurality of supporting portions SP overlapping the remaining unit openings OP-O2 and OP-O3 except for the first unit opening OP-O1. The plurality of supporting portions SP may prevent the first deposition mask DM1 (see Figure 5 ) is attached to the open mask OM1 to correspond to deformation of the open mask OM1 and the first deposition mask DM1 when the first unit opening OP-O1 is formed.

[0091] In the present embodiment, a plurality of support portions SP may extend in the first direction DR1 and be arranged in the second direction DR2. Figure 4 , but the number of the supporting portions SP is not limited thereto. For example, as the diagonal length DD1 of each of the plurality of unit openings OP-O increases, the number of the supporting portions SP may increase.

[0092] In the present embodiment, the plurality of supporting portions SP may include a plurality of first supporting portions SP1 and a plurality of second supporting portions SP2.

[0093] The plurality of first supporting portions SP1 may overlap with a cell opening from which a subsequent process starts. For example, the plurality of first supporting portions SP1 may overlap with the second cell opening OP-O2. The plurality of first supporting portions SP1 may exist in the first deposition mask DM1 (see Figure 5 ) is attached to the open mask OM1 to correspond to the first unit opening OP-O1 in the process, but may be removed thereafter. This will be described later. Figure 4 Four first supporting portions SP1 are illustrated in FIG. 1 , but the number of the first supporting portions SP1 is not limited thereto.

[0094] The plurality of second supporting portions SP2 may overlap with a unit opening from which a next subsequent process starts. For example, the plurality of second supporting portions SP2 may overlap with the third unit opening OP-O3. The plurality of second supporting portions SP2 may exist in the second deposition mask DM2 (see Figure 8 ) is attached to the open mask OM1 to correspond to the second unit opening OP-O2 in the process, but may be removed thereafter. This will be described later. Figure 4 Four second supporting portions SP2 are illustrated in FIG. 1 , but the number of the second supporting portions SP2 is not limited thereto.

[0095] Figures 5 to 12 A manufacturing process of a mask assembly according to an embodiment is schematically illustrated.

[0096] refer to Figure 5 , the first deposition mask DM1 may be attached to the open mask OM1 to correspond to the first unit opening OP-O1 (see Figure 4 ). First, the first deposition mask DM1 may be stretched so that the deposition area DA1 overlaps the first unit opening OP-O1. For example, a selective pulling force may be applied to two opposite surfaces of the first deposition mask DM1. Thereafter, the welding area WA1 may be welded to the opening mask OM1 in a state where the first deposition mask DM1 is stretched.

[0097] refer to Figure 6, the tension applied to the first deposition mask DM1 is released so that the first deposition mask DM1 can be completely attached to the open mask OM1. In this case, due to the plurality of first supporting portions SP1 and the plurality of second supporting portions SP2, deformation of the open mask OM1 and the first deposition mask DM1 can be prevented. For example, the restoring force generated when the tension applied to the first deposition mask DM1 is released is distributed to the plurality of first supporting portions SP1 and the plurality of second supporting portions SP2, so that deformation of the open mask OM1 and the first deposition mask DM1 can be prevented.

[0098] refer to Figure 7 After the first deposition mask DM1 is attached to the open mask OM1, the plurality of first support portions SP1 overlapping the second unit openings OP-O2 where the subsequent process starts may be removed (see Figure 6 ). For example, the first support portion SP1 may be removed using a laser. Accordingly, a second deposition mask DM2 (see Figure 8 ) of the deposition area DA2 (see Figure 8 ) overlaps the space of the second unit opening OP-O2. As a result, the deposition material can pass through the second unit opening OP-O2 without interference, thereby improving the deposition reliability of the light emitting layer.

[0099] refer to Figure 8 , the second deposition mask DM2 may be attached to the open mask OM1 to correspond to the second unit opening OP-O2 (see Figure 7 ). First, the second deposition mask DM2 may be stretched so that the deposition area DA2 overlaps the second unit opening OP-O2. For example, a selective pulling force may be applied to two opposite surfaces of the second deposition mask DM2. Thereafter, the welding area WA2 may be welded to the open mask OM1 in a state where the second deposition mask DM2 is stretched.

[0100] refer to Fig. 9 , the tension applied to the second deposition mask DM2 is released, so that the second deposition mask DM2 can be completely attached to the open mask OM1. In this case, due to the plurality of second supporting portions SP2, deformation of the open mask OM1 and the second deposition mask DM2 can be prevented. For example, the restoring force generated when the tension applied to the second deposition mask DM2 is released is distributed to the plurality of second supporting portions SP2, so that deformation of the open mask OM1 and the second deposition mask DM2 can be prevented.

[0101] refer to Fig.10 After the second deposition mask DM2 is attached to the open mask OM1, the plurality of second support portions SP2 overlapping the third unit opening OP-O3 where the next subsequent process starts may be removed (see Fig. 9). For example, the second support portion SP2 may be removed using a laser. Accordingly, a third deposition mask DM3 (see Fig.11 ) of the deposition area DA3 (see Fig.11 ) overlaps the space of the third unit opening OP-O3. As a result, the deposition material can pass through the third unit opening OP-O3 without interference, thereby improving the deposition reliability of the light emitting layer.

[0102] refer to Fig.11 , the third deposition mask DM3 may be attached to the open mask OM1 to correspond to the third unit opening OP-O3 (see Fig.10 ). First, the third deposition mask DM3 may be stretched so that the deposition area DA3 overlaps the third unit opening OP-O3. For example, a selective pulling force may be applied to two opposite surfaces of the third deposition mask DM3. Thereafter, the welding area WA3 may be welded to the open mask OM1 in a state where the third deposition mask DM3 is stretched.

[0103] refer to Fig.12 , the tension applied to the third deposition mask DM3 is released, so that the third deposition mask DM3 can be completely attached to the open mask OM1. In this case, since the first deposition mask DM1 and the second deposition mask DM2 adjacent to the third deposition mask DM3 are attached to the open mask OM1, deformation of the open mask OM1 and the third deposition mask DM3 can be prevented. In this way, the mask assembly MA1 can be manufactured without deformation of the first deposition mask DM1, the second deposition mask DM2, the third deposition mask DM3, and the open mask OM1, thereby improving deposition accuracy and reliability.

[0104] Fig.13 A mask assembly according to an embodiment is illustrated.

[0105] refer to Fig.13 , the mask assembly MA2 according to an embodiment may include an open mask OM2 on which a plurality of support portions SP are formed.

[0106] In the present embodiment, the open mask OM2 may include a plurality of unit openings OP-O. For example, a plurality of unit openings OP-O may be defined in the open mask OM2. The plurality of unit openings OP-O may be divided according to the order in which a plurality of deposition masks DM1, DM2, DM3, and DM4, which will be described later, are attached to the open mask OM2. For example, the first deposition mask DM1 (see Fig.14 ), the second deposition mask DM2 (see Fig.17 ), the third deposition mask DM3 (see Fig. 20 ) and a fourth deposition mask DM4 (see Fig.23) may be sequentially attached to the open mask OM2 to correspond to the first unit opening OP-O1, the second unit opening OP-O2, the third unit opening OP-O3, and the fourth unit opening OP-O4, respectively. For example, the first deposition mask DM1 may be attached to the open mask OM2 to correspond to the first unit opening OP-O1, then the second deposition mask DM2 may be attached to correspond to the second unit opening OP-O2, then the third deposition mask DM3 may be attached to correspond to the third unit opening OP-O3, and then the fourth deposition mask DM4 may be attached to correspond to the fourth unit opening OP-O4.

[0107] The positions and arrangements of the plurality of unit openings OP-O1, OP-O2, OP-O3 and OP-O4 are not limited to Fig.13 For example, the positions and arrangements of the plurality of unit openings OP-O1, OP-O2, OP-O3, and OP-O4 may be changed according to process conditions.

[0108] Fig.13 The illustrated open mask OM2 may include four unit openings OP-O, but the number of unit openings OP-O included in the open mask OM2 is not limited thereto. In other words, the number of unit openings OP-O may vary according to process conditions.

[0109] In the present embodiment, the diagonal length DD2 of each of the plurality of unit openings OP-O may be about 11 inches or more. However, the present disclosure is not limited thereto, and the diagonal length of each of the plurality of unit openings OP-O may vary according to the specifications of a display device to be manufactured.

[0110] In the present embodiment, the open mask OM2 may include a plurality of support portions SP overlapping the remaining unit openings OP-O except for the unit opening at the start of the process. For example, the open mask OM2 may include a plurality of support portions SP overlapping the remaining unit openings OP-O2, OP-O3, and OP-O4 except for the first unit opening OP-O1. The plurality of support portions SP may prevent the first deposition mask DM1 (see Fig.14 ) is attached to the open mask OM2 to correspond to deformation of the open mask OM2 and the first deposition mask DM1 when the first unit opening OP-O1 is formed.

[0111] In the present embodiment, the plurality of supporting portions SP may include a plurality of first supporting portions SP1 , a plurality of second supporting portions SP2 , and a plurality of third supporting portions SP3 .

[0112] The plurality of first supporting portions SP1 may overlap with a cell opening from which a subsequent process starts. For example, the plurality of first supporting portions SP1 may overlap with the second cell opening OP-O2. The plurality of first supporting portions SP1 may exist in the first deposition mask DM1 (see Fig.14 ) is attached to the open mask OM2 to correspond to the first unit opening OP-O1 in the process, but may be removed thereafter. This will be described later. Fig.13 Four first supporting portions SP1 are illustrated in FIG. 1 , but the number of the first supporting portions SP1 is not limited thereto. In other words, the number of the first supporting portions SP1 may be changed according to process conditions.

[0113] In the present embodiment, the plurality of first supporting portions SP1 may include a plurality of sub-supporting portions SP11 extending in the first direction DR1 and arranged in the second direction DR2 and a plurality of sub-supporting portions SP12 extending in the second direction DR2 and arranged in the first direction DR1. Fig.13 Two sub-support portions SP11 and two sub-support portions SP12 are exemplified, but the number of the sub-support portions SP11 and SP12 is not limited thereto. In other words, the number of the sub-support portions SP11 and SP12 may be changed according to process conditions.

[0114] The plurality of second supporting portions SP2 may overlap with a unit opening from which a next subsequent process starts. For example, the plurality of second supporting portions SP2 may overlap with the third unit opening OP-O3. The plurality of second supporting portions SP2 may exist in the second deposition mask DM2 (see Fig.17 ) is attached to the open mask OM2 to correspond to the second unit opening OP-O2 in the process, but can be removed thereafter. This will be described later. Fig.13 Four second supporting portions SP2 are illustrated in FIG. 1 , but the number of the second supporting portions SP2 is not limited thereto. In other words, the number of the second supporting portions SP2 may be changed according to process conditions.

[0115] In the present embodiment, the plurality of second supporting portions SP2 may include a plurality of sub-supporting portions SP21 extending in the first direction DR1 and arranged in the second direction DR2 and a plurality of sub-supporting portions SP22 extending in the second direction DR2 and arranged in the first direction DR1. Fig.13 Two sub-support portions SP21 and two sub-support portions SP22 are exemplified, but the number of the sub-support portions SP21 and SP22 is not limited thereto. In other words, the number of the sub-support portions SP21 and SP22 may be changed according to process conditions.

[0116] The plurality of third supporting portions SP3 may overlap with a unit opening from which a next subsequent process starts. For example, the plurality of third supporting portions SP3 may overlap with a fourth unit opening OP-O4. The plurality of third supporting portions SP3 may exist in the third deposition mask DM3 (see Fig. 20 ) is attached to the open mask OM2 to correspond to the third unit opening OP-O3 in the process, but can be removed thereafter. This will be described later. Fig.13 Four third supporting portions SP3 are illustrated in FIG. 1 , but the number of the third supporting portions SP3 is not limited thereto. In other words, the number of the third supporting portions SP3 may be changed according to process conditions.

[0117] In the present embodiment, the plurality of third supporting portions SP3 may include a plurality of sub-supporting portions SP31 extending in the first direction DR1 and arranged in the second direction DR2 and a plurality of sub-supporting portions SP32 extending in the second direction DR2 and arranged in the first direction DR1. Fig.13 Two sub-support portions SP31 and two sub-support portions SP32 are illustrated, but the number of the sub-support portions SP31 and SP32 is not limited thereto. In other words, the number of the sub-support portions SP31 and SP32 may be changed according to process conditions.

[0118] Figures 14 to 24 A manufacturing process of a mask assembly according to an embodiment is schematically illustrated.

[0119] refer to Fig.14 , the first deposition mask DM1 may be attached to the open mask OM2 to correspond to the first unit opening OP-O1 (see Fig.13 ). First, the first deposition mask DM1 may be stretched so that the deposition area DA1 overlaps the first unit opening OP-O1. For example, a selective pulling force may be applied to two opposite surfaces of the first deposition mask DM1. Thereafter, the welding area WA1 may be welded to the open mask OM2 in a state where the first deposition mask DM1 is stretched.

[0120] refer to Fig.15 , the tension applied to the first deposition mask DM1 is released, so that the first deposition mask DM1 can be completely attached to the open mask OM2. In this case, due to the plurality of first supporting portions SP1, the plurality of second supporting portions SP2, and the plurality of third supporting portions SP3, deformation of the open mask OM2 and the first deposition mask DM1 can be prevented. For example, the restoring force generated when the tension applied to the first deposition mask DM1 is released is distributed to the plurality of first supporting portions SP1, the plurality of second supporting portions SP2, and the plurality of third supporting portions SP3, so that deformation of the open mask OM2 and the first deposition mask DM1 can be prevented.

[0121] refer to Fig.16 After the first deposition mask DM1 is attached to the open mask OM2, the plurality of first support portions SP1 overlapping the second unit openings OP-O2 where the subsequent process starts may be removed (see Fig.15 ). For example, the first support portion SP1 may be removed using a laser. Accordingly, a second deposition mask DM2 (see Fig.17 ) of the deposition area DA2 (see Fig.17 ) overlaps the space of the second unit opening OP-O2. As a result, the deposition material can pass through the second unit opening OP-O2 without interference, thereby improving the deposition reliability of the light emitting layer.

[0122] refer to Fig.17 , the second deposition mask DM2 may be attached to the open mask OM2 to correspond to the second unit opening OP-O2 (see Fig.16 ). First, the second deposition mask DM2 may be stretched so that the deposition area DA2 overlaps the second unit opening OP-O2. For example, a selective pulling force may be applied to two opposite surfaces of the second deposition mask DM2. Thereafter, the welding area WA2 may be welded to the opening mask OM2 in a state where the second deposition mask DM2 is stretched.

[0123] refer to Fig.18 , the tension applied to the second deposition mask DM2 is released, so that the second deposition mask DM2 can be completely attached to the open mask OM2. In this case, due to the plurality of second supporting portions SP2 and the plurality of third supporting portions SP3, deformation of the open mask OM2 and the second deposition mask DM2 can be prevented. For example, the restoring force generated when the tension applied to the second deposition mask DM2 is released is distributed to the plurality of second supporting portions SP2 and the plurality of third supporting portions SP3, so that deformation of the open mask OM2 and the second deposition mask DM2 can be prevented.

[0124] refer to Fig.19 After the second deposition mask DM2 is attached to the open mask OM2, the plurality of second support portions SP2 overlapping the third unit opening OP-O3 where the next subsequent process starts may be removed (see Fig.18 ). For example, the second support portion SP2 may be removed using a laser. Accordingly, a third deposition mask DM3 (see Fig. 20 ) of the deposition area DA3 (see Fig. 20 ) overlaps the space of the third unit opening OP-O3. As a result, the deposition material can pass through the third unit opening OP-O3 without interference, thereby improving the deposition reliability of the light emitting layer.

[0125] refer to Fig. 20, the third deposition mask DM3 may be attached to the open mask OM2 to correspond to the third unit opening OP-O3 (see Fig.19 ). First, the third deposition mask DM3 may be stretched so that the deposition area DA3 overlaps the third unit opening OP-O3. For example, a selective pulling force may be applied to two opposite surfaces of the third deposition mask DM3. Thereafter, the welding area WA3 may be welded to the open mask OM2 in a state where the third deposition mask DM3 is stretched.

[0126] refer to Fig.21 , the tension applied to the third deposition mask DM3 is released, so that the third deposition mask DM3 can be completely attached to the open mask OM2. In this case, due to the plurality of third supporting portions SP3, deformation of the open mask OM2 and the third deposition mask DM3 can be prevented. For example, the restoring force generated when the tension applied to the third deposition mask DM3 is released is distributed to the plurality of third supporting portions SP3, so that deformation of the open mask OM2 and the third deposition mask DM3 can be prevented.

[0127] refer to Fig. 22 After the third deposition mask DM3 is attached to the open mask OM2, the plurality of third support portions SP3 overlapping the fourth unit opening OP-O4 where the next subsequent process starts may be removed (see Fig.21 ). For example, the third support portion SP3 may be removed using a laser. Accordingly, a fourth deposition mask DM4 (see Fig.23 ) of the deposition area DA4 (see Fig.23 ) overlaps the space of the fourth unit opening OP-O4. As a result, the deposition material can pass through the fourth unit opening OP-O4 without interference, thereby improving the deposition reliability of the light emitting layer.

[0128] refer to Fig.23 , the fourth deposition mask DM4 may be attached to the open mask OM2 to correspond to the fourth unit opening OP-O4 (see Fig. 22 ). First, the fourth deposition mask DM4 may be stretched so that the deposition area DA4 overlaps the fourth unit opening OP-O4. For example, a selective pulling force may be applied to two opposite surfaces of the fourth deposition mask DM4. Thereafter, the welding area WA4 may be welded to the open mask OM2 in a state where the fourth deposition mask DM4 is stretched.

[0129] refer to Fig.24, the tension applied to the fourth deposition mask DM4 is released, so that the fourth deposition mask DM4 can be completely attached to the open mask OM2. In this case, since the first deposition mask DM1, the second deposition mask DM2, and the third deposition mask DM3 adjacent to each other are attached to the open mask OM2, deformation of the open mask OM2 and the fourth deposition mask DM4 can be prevented. In this way, the mask assembly MA2 can be manufactured without deformation of the first deposition mask DM1, the second deposition mask DM2, the third deposition mask DM3, the fourth deposition mask DM4, and the open mask OM2, thereby improving deposition accuracy and reliability.

[0130] Figures 25 to 34 A manufacturing process of a mask assembly according to an embodiment is schematically illustrated.

[0131] refer to Fig.25 , the mask MK may be attached to the frame FR. In this embodiment, the mask MK may be attached to the frame FR without forming an opening. For example, the mask MK may be attached to the frame FR with a plurality of openings OP-O (see Figure 2 ) is attached to the frame FR in the open mask OM (see Figure 2 )different.

[0132] refer to Fig.26 , a cell opening at which the process starts may be formed in the mask MK. For example, a first cell opening OP-O1 may be formed in the mask MK. The first cell opening OP-O1 may be formed by irradiating the mask MK with a laser beam. The position of the first cell opening OP-O1 is not limited to Fig.26 , and may be changed according to process conditions. In the present embodiment, the diagonal length DD3 of the first unit opening OP-O1 may be about 11 inches or more. However, the present disclosure is not limited thereto, and the diagonal length DD3 of the first unit opening OP-O1 may be changed according to the specifications of the display device to be manufactured.

[0133] refer to Fig. 27 , the first deposition mask DM1 may be attached to the mask MK to correspond to the first unit opening OP-O1 (see Fig.26 ). First, the first deposition mask DM1 may be stretched so that the deposition area DA1 overlaps the first unit opening OP-O1. For example, a selective pulling force may be applied to two opposite surfaces of the first deposition mask DM1. Thereafter, the welding area WA1 may be welded to the mask MK in a state where the first deposition mask DM1 is stretched.

[0134] refer to Fig.28 , the tension applied to the first deposition mask DM1 is released so that the first deposition mask DM1 can be completely attached to the mask MK. In this case, except for the first unit opening OP-O1 (see Fig.26 ), no separate unit opening is formed in the mask MK, so deformation of the mask MK and the first deposition mask DM1 can be prevented. For example, the restoring force generated when the tension applied to the first deposition mask DM1 is released is distributed throughout the mask MK, so deformation of the mask MK and the first deposition mask DM1 can be prevented.

[0135] refer to Fig.29 , a cell opening at which a subsequent process starts can be formed in the mask MK. For example, the second cell opening OP-O2 can be formed in the mask MK. The second cell opening OP-O2 can be formed by irradiating the mask MK with a laser beam. The position of the second cell opening OP-O2 is not limited to Fig.29 The diagonal length of the second unit opening OP-O2 may be the same as the first unit opening OP-O1 (see Fig.26 ) diagonal length DD3 (see Fig.26 However, the present disclosure is not limited thereto, and the diagonal length of the second unit opening OP-O2 may be changed according to the specification of a display device to be manufactured to be different from the diagonal length DD3 of the first unit opening OP-O1.

[0136] refer to Fig.30 , the second deposition mask DM2 may be attached to the mask MK to correspond to the second unit opening OP-O2 (see Fig.29 ). First, the second deposition mask DM2 may be stretched so that the deposition area DA2 overlaps the second unit opening OP-O2. For example, a selective pulling force may be applied to two opposite surfaces of the second deposition mask DM2. Thereafter, the welding area WA2 may be welded to the mask MK in a state where the second deposition mask DM2 is stretched.

[0137] refer to Fig.31 , the tension applied to the second deposition mask DM2 is released so that the second deposition mask DM2 can be completely attached to the mask MK. In this case, except for the first unit opening OP-O1 (see Fig.26 ) and the second unit opening OP-O2 (see Fig.29 ), no separate unit opening is formed in the mask MK, so deformation of the mask MK and the second deposition mask DM2 can be prevented. For example, the restoring force generated when the tension applied to the second deposition mask DM2 is released is distributed throughout the mask MK, so deformation of the mask MK and the second deposition mask DM2 can be prevented.

[0138] refer to Fig.32, a cell opening at which the next subsequent process starts can be formed in the mask MK. For example, the third cell opening OP-O3 can be formed in the mask MK. The third cell opening OP-O3 can be formed by irradiating the mask MK with a laser beam. The position of the third cell opening OP-O3 is not limited to Fig.32 The diagonal length of the third unit opening OP-O3 may be the same as that of the first unit opening OP-O1 (see Fig.26 ) diagonal length DD3 (see Fig.26 However, the present disclosure is not limited thereto, and the diagonal length of the third unit opening OP-O3 may be changed according to the specification of a display device to be manufactured to be different from the diagonal length DD3 of the first unit opening OP-O1.

[0139] refer to Fig.33 , the third deposition mask DM3 may be attached to the mask MK to correspond to the third unit opening OP-O3 (see Fig.32 ). First, the third deposition mask DM3 may be stretched so that the deposition area DA3 overlaps the third unit opening OP-O3. For example, a selective pulling force may be applied to two opposite surfaces of the third deposition mask DM3. Thereafter, the welding area WA3 may be welded to the mask MK in a state where the third deposition mask DM3 is stretched.

[0140] refer to Fig.34 , the tension applied to the third deposition mask DM3 is released, so that the third deposition mask DM3 can be completely attached to the mask MK. In this case, since the first deposition mask DM1 and the second deposition mask DM2 adjacent to the third deposition mask DM3 are attached to the mask MK, deformation of the mask MK and the third deposition mask DM3 can be prevented. In this way, the mask assembly MA3 can be manufactured without deformation of the first deposition mask DM1, the second deposition mask DM2, the third deposition mask DM3, and the mask MK, thereby improving deposition accuracy and reliability.

[0141] Although the present disclosure has been described according to the embodiments described above, it should be noted that the embodiments described above are used to describe the present disclosure rather than to limit the scope of the present disclosure. A person skilled in the art will understand that various modifications are possible within the scope of the technical spirit of the present disclosure.

[0142] The scope of the present disclosure is not limited to the details described in the specific embodiments of the specification, but should also be defined by the claims. It should be interpreted that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present disclosure.

Claims

1. A mask assembly, comprising: Frames, including frame openings; as well as an open mask including a plurality of unit openings overlapping the frame opening, The open mask further includes a plurality of support portions overlapping the remaining unit openings of the plurality of unit openings except the first unit opening. 2 . The mask assembly of claim 1 , wherein each of the plurality of unit openings has a rectangular shape. 3 . The mask assembly of claim 2 , wherein a diagonal length of each of the plurality of unit openings is 11 inches or greater.

4. The mask assembly according to claim 1, further comprising: A first deposition mask includes a first deposition region overlapping the first unit opening. 5 . The mask assembly of claim 1 , wherein each of the plurality of support portions extends in a first direction and is disposed in a second direction perpendicular to the first direction.

6. The mask assembly of claim 1, wherein the plurality of support portions comprises: a plurality of first sub-support portions, each of the first sub-support portions extending in a first direction and arranged in a second direction perpendicular to the first direction; as well as A plurality of second sub-support portions, each of the second sub-support portions extending in the second direction and arranged in the first direction.

7. A method for manufacturing a mask assembly, the method comprising: manufacturing an open mask including n unit openings and a plurality of support portions overlapping with remaining unit openings of the n unit openings except the first unit opening, wherein n is a natural number of 3 or more; attaching the open mask to a frame including a frame opening such that the n unit openings overlap the frame opening; as well as A first deposition mask including a first deposition region is attached to the open mask such that the first deposition region overlaps the first cell opening.

8. The method according to claim 7, further comprising: removing a (k-1)th supporting portion overlapping with the kth unit opening among the plurality of supporting portions; as well as A kth deposition mask in which a kth deposition region is defined is attached to the open mask so that the kth deposition region overlaps the kth cell opening, where k is a natural number greater than or equal to 2 and less than or equal to n. 9 . The method of claim 8 , wherein the removing of the (k−1)th supporting portion and the attaching of the kth deposition mask are repeated until a value of k becomes n.

10. The method of claim 7, wherein the attaching of the first deposition mask comprises: applying a tensile force to the first deposition mask; welding the stretched first deposition mask to the open mask; as well as The tension is released.

11. The method of claim 8, wherein the attaching of the kth deposition mask comprises: applying a tensile force to the kth deposition mask; welding the stretched kth deposition mask to the open mask; as well as The tension is released. 12 . The method according to claim 7 , wherein each of the n unit openings has a rectangular shape.

13. The method of claim 12, wherein a diagonal length of each of the n unit openings is 11 inches or greater. 14 . The method of claim 7 , wherein each of the plurality of support portions extends in a first direction and is disposed in a second direction perpendicular to the first direction.

15. The method of claim 7, wherein the plurality of support portions comprises: a plurality of first sub-support portions, each of the first sub-support portions extending in a first direction and arranged in a second direction perpendicular to the first direction; as well as A plurality of second sub-support portions, each of the second sub-support portions extending in the second direction and arranged in the first direction.

16. A method of manufacturing a mask assembly, the method comprising: attaching a mask to a frame including a frame opening; forming a kth cell opening in the mask; as well as A kth deposition mask including a kth deposition region is attached to the mask such that the kth deposition region overlaps the kth unit opening, where k is a natural number greater than or equal to 1 and less than or equal to n, and n is a natural number greater than or equal to 3. 17 . The method of claim 16 , wherein the forming of the kth cell opening and the attaching of the kth deposition mask are repeated until a value of k becomes n. 18 . The method of claim 17 , wherein the k-th cell opening is formed by irradiating the mask with a laser beam. The method according to claim 16 , wherein the k th unit opening has a rectangular shape.

20. The method of claim 19, wherein a diagonal length of the kth unit opening is 11 inches or greater.

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