Cover plate assembly, semiconductor processing chamber and semiconductor coating equipment

Abstract

The invention relates to the technical field of semiconductor manufacturing, and discloses a cover plate assembly, a semiconductor processing chamber and semiconductor coating equipment, and the cover plate assembly comprises a cover plate which is provided with one or more observation holes in a penetrating manner along the thickness of the cover plate; the observation structure comprises a convex observation window arranged in the observation hole, and the first side face of the convex observation window is a protruding part and deviates from the semiconductor processing chamber. In this way, the heating capacity of the observation window can be effectively improved, and therefore the situations of cracks, fragmentation and the like of the observation window are reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, for example, to a cover assembly, a semiconductor processing chamber and a semiconductor coating device. Background Art

[0002] Currently, semiconductor coating equipment operates within a sealed, invisible chamber during the relevant process. Therefore, to facilitate observation of the wafer's position within the chamber and the corresponding reaction status, an observation window is typically provided in the chamber.

[0003] In the related art, an observation window is usually provided on the cover of the reaction chamber, or the cover is made of a transparent material. For example, a related art provides a wafer processing device, comprising: a reaction chamber covered with a chamber cover, a central observation window provided in the central area of ​​the chamber cover, and a wafer tray provided inside the reaction chamber for placing wafers to be processed.

[0004] During the implementation of the embodiments of the present disclosure, it was found that at least the following problems exist in the related art:

[0005] Most observation windows are made of quartz glass due to its high-temperature resistance. However, due to the structure of the observation window, if the temperature inside the reaction chamber exceeds a certain temperature, the observation window may crack or even break.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, the following is a brief summary. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The embodiments of the present disclosure provide a cover plate assembly, a semiconductor processing chamber, and a semiconductor coating device, which can effectively improve the heat-bearing capacity of the observation window, thereby reducing the occurrence of cracks, breakage, etc. in the observation window.

[0009] In some embodiments, the cover plate assembly includes a cover plate and an observation structure. The cover plate has one or more observation holes extending through its thickness; the observation structure includes a convex observation window disposed in the observation hole, wherein a first side of the convex observation window is a raised portion and faces away from the semiconductor processing chamber.

[0010] Optionally, the second side surface of the convex observation window is a flat portion or a recessed portion facing the semiconductor processing chamber.

[0011] Optionally, the cover plate includes an upper plate body and a lower plate body. The upper plate body is provided with one or more first observation hole segments; the lower plate body is provided with second observation hole segments corresponding to the first observation hole segments, wherein the convex observation window is provided between the first observation hole segments and the second observation hole segments.

[0012] Optionally, the lower plate is adjacent to the semiconductor processing chamber, wherein a set distance is provided between the convex observation window and the lower plate.

[0013] Optionally, the set spacing has a value range of [3 mm, 35 mm].

[0014] Optionally, the observation structure further includes: a boss, which is arranged between the lower plate body and the convex observation window, so that there is a set distance between the convex observation window and the lower plate body.

[0015] Optionally, a through hole communicating with the first observation hole segment and the second observation hole segment is formed on the boss; wherein the ratio of the aperture of the through hole and / or the aperture of the second observation hole segment to the diameter of the convex observation window is in the range of [1:3, 3:4].

[0016] Optionally, the observation structure further includes: a sealing gasket, disposed between the boss and the convex observation window.

[0017] Optionally, the observation structure further includes: a fixing member, which is arranged between the convex observation window and the upper plate body to fix the convex observation window.

[0018] Optionally, the fixing member includes a protective washer and a fixing ring. The protective washer is provided on the convex observation window to protect the convex observation window; the fixing ring is provided on the protective washer to fix the convex observation window.

[0019] Optionally, the cover plate further includes: a support member, disposed between the upper plate body and the lower plate body.

[0020] Optionally, the thickness of the convex observation window is greater than or equal to 5 mm.

[0021] In some embodiments, the semiconductor processing chamber includes: a reaction chamber; and a cover plate assembly as described in the present application, disposed in the reaction chamber.

[0022] In some embodiments, the semiconductor coating equipment includes a semiconductor processing chamber as described in the present application, wherein the semiconductor coating equipment includes an etching equipment, a chemical vapor deposition equipment, or an atomic layer deposition equipment.

[0023] The cover plate assembly, semiconductor processing chamber, and semiconductor coating equipment provided by the embodiments of the present disclosure can achieve the following technical effects:

[0024] One or more observation holes are provided along the thickness of the cover plate, and a convex observation window of the observation structure is positioned within the observation hole. This ensures the sealing of the semiconductor processing chamber, while also allowing the actual conditions of the wafers within the semiconductor processing chamber to be observed through the convex observation window. Furthermore, by optimizing the structure of the observation window, the raised portion of the convex observation window faces away from the semiconductor processing chamber. The raised portion of the convex observation window can withstand greater axial pressure. Therefore, at a specific temperature, the deformation of the observation window can be effectively reduced, thereby effectively improving the observation window's heat-resistance and reducing the possibility of cracks or breakage in the observation window.

[0025] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0027] Figure 1 is a structural schematic diagram of a cover plate assembly provided by an embodiment of the present disclosure;

[0028] Figure 2 is a top view of a cover plate assembly provided in an embodiment of the present disclosure;

[0029] Figure 3 is a side view of a cover plate assembly provided by an embodiment of the present disclosure;

[0030] Figure 4 is a cross-sectional schematic diagram of a cover plate assembly provided by an embodiment of the present disclosure;

[0031] Figure 5 yes Figure 4 A magnified schematic diagram of point A in the middle;

[0032] Figure 6 It is an exploded view of the cover plate assembly provided in an embodiment of the present disclosure.

[0033] Reference numerals:

[0034] 10: Cover plate; 11: Observation hole; 12: Upper plate; 121: First observation hole section; 13: Lower plate; 131: Second observation hole section; 14: Support member;

[0035] 20: Observation structure; 21: Convex observation window; 211: Raised portion; 212: Recessed portion; 22: Boss; 221: Through hole; 23: Sealing gasket;

[0036] 24: fixing piece; 241: protective gasket; 242: fixing ring. DETAILED DESCRIPTION

[0037] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0038] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate to describe the embodiments of the present disclosure herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0039] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to having a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0040] Furthermore, the terms "disposed," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of this disclosure based on the specific circumstances.

[0041] Unless otherwise stated, the term "plurality" means two or more.

[0042] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B means: A or B.

[0043] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0044] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0045] Combine Figures 1 to 3 As shown, an embodiment of the present disclosure provides a cover plate assembly, comprising a cover plate 10 and an observation structure 20. The cover plate 10 has one or more observation holes 11 extending through its thickness; the observation structure 20 includes a convex observation window 21 disposed in the observation hole 11, wherein the first side of the convex observation window 21 is a raised portion 211 and faces away from the semiconductor processing chamber.

[0046] The cover plate assembly provided by the embodiment of the present disclosure is provided with one or more observation holes running through the thickness of the cover plate, and a convex observation window of the observation structure is provided in the observation hole. In this way, the sealing of the semiconductor processing chamber can be ensured, and the actual situation of the wafer in the semiconductor processing chamber can be observed through the convex observation window. On this basis, by optimizing the structure of the observation window, the raised portion of the convex observation window is made to face away from the semiconductor processing chamber. Among them, the raised portion of the convex observation window can withstand greater axial pressure. Therefore, at a specific temperature, the deformation of the observation window can be effectively reduced, thereby effectively improving the heat-bearing capacity of the observation window, and further reducing the possibility of cracks and breakage of the observation window.

[0047] In related technologies, when the wafer is undergoing related processes inside the reaction chamber, especially when undergoing a high-temperature process at 400°C, the reaction chamber is in a sealed and invisible vacuum state. At this time, the pressure inside the reaction chamber is low, and the pressure outside the reaction chamber is high, so that the pressure acts on the observation window. Since most traditional observation windows are flat-plate structures, if the temperature inside the reaction chamber continues to rise (over 400°C), the pressure acting on the observation window will increase. At this time, the simultaneous action of excessive temperature and excessive pressure will cause the observation window to deform, and then cause cracks and breakage in the observation window.

[0048] In the disclosed embodiment, the structure of the observation window is optimized to form a convex observation window 21 having a raised portion 211. This raised portion 211 faces away from the semiconductor processing chamber, i.e., is located outside the semiconductor processing chamber, so that pressure acts on the raised portion 211. Here, the raised portion 211 is an arched surface formed on the first side surface of the convex observation window 21. When the arched surface is under pressure, it disperses the pressure to the arch foot, thereby being able to withstand greater pressure.

[0049] In some embodiments, the second side of the convex viewing window 21 is a flat portion or a recessed portion 212 facing the semiconductor processing chamber.

[0050] Optionally, the second side surface of the convex observation window 21 may be a flat surface.

[0051] Optionally, the second side surface of the convex observation window 21 may also be a recessed portion 212. This allows the second side surface of the convex observation window 21 to be further away from the interior of the semiconductor processing chamber, thereby further effectively reducing the heat generated by thermal radiation and lowering the temperature of the convex observation window 21. This also makes the convex observation window 21 less susceptible to deformation.

[0052] In order to enable the convex observation window 21 to withstand higher temperature and pressure, in some embodiments, the thickness of the convex observation window 21 is greater than or equal to 5 mm.

[0053] In the embodiment of the present disclosure, since the convex observation window 21 is in direct contact with the interior of the semiconductor processing chamber, the convex observation window 21 needs to have a sufficient thickness to ensure the strength of the convex observation window 21. Here, the thickness of the convex observation window 21 is greater than or equal to 5 mm. In this way, the convex observation window 21 can withstand higher temperatures and pressures, and can also avoid ensuring that the situation inside the semiconductor processing chamber can be observed through the convex observation window 21. Optionally, in some specific implementations. The thickness of the convex observation window 21 is 6 mm, 7 mm or 8 mm. Of course, in other applications, taking into account the thickness of the cover assembly and the thickness of the cavity wall of the semiconductor processing chamber, the thickness of the convex observation window 21 can be any thickness greater than or equal to 5 mm, which can be set according to actual needs.

[0054] In the embodiment of the present disclosure, reducing the actual size of the observation window can also further improve the strength of the observation window. Here, a plurality of observation holes 11 are further provided on the cover plate assembly, and a convex observation window 21 is provided on each observation hole 11. Optionally, two observation holes 11 are provided on the cover plate assembly. Optionally, three observation holes 11 are provided on the cover plate assembly. Optionally, four observation holes 11 are provided on the cover plate assembly. By dispersing the large observation window into multiple small observation windows to form an observation window matrix, not only will the actual observation range not be affected, but the strength of each convex observation window 21 can also be further improved.

[0055] Combine Figures 4 to 6 As shown, in some embodiments, the cover plate 10 includes an upper plate body 12 and a lower plate body 13. The upper plate body 12 is provided with one or more first observation hole sections 121; the lower plate body 13 is provided with second observation hole sections 131 corresponding to the first observation hole sections 121, wherein the convex observation window 21 is disposed between the first observation hole sections 121 and the second observation hole sections 131.

[0056] In the embodiment of the present disclosure, the observation hole 11 on the cover plate 10 is composed of a plurality of observation hole segments spliced ​​together. Here, the cover plate 10 includes an upper plate body 12 and a lower plate body 13, and both the upper plate body 12 and the lower plate body 13 are heat insulation plates.

[0057] In the disclosed embodiment, a first observation hole section 121 is provided on the upper plate 12, a second observation hole section 131 is provided on the lower plate 13, and a convex observation window 21 is disposed between the first observation hole section 121 and the second observation hole section 131. The first side surface (the raised portion 211) of the convex observation window 21 faces the first observation hole section 121, while the first side surface (the flat portion or the recessed portion 212) of the convex observation window 21 faces the second observation hole section 131. Thus, through the arrangement of the second observation hole section 131, the convex observation window 21, and the second observation hole section 131, the interior of the semiconductor processing chamber can be observed.

[0058] In some embodiments, the lower plate 13 is positioned adjacent to the semiconductor processing chamber, with a predetermined distance between the convex observation window 21 and the lower plate 13. Thus, when the second side surface of the convex observation window 21 is formed as a recessed portion 212, the distance between the convex observation window 21 and the interior of the semiconductor processing chamber can be further increased, thereby reducing the heating temperature of the convex observation window 21 and minimizing thermal expansion of the convex observation window 21, thereby making it less susceptible to cracking and breakage.

[0059] Optionally, in some embodiments, the range of the set spacing is [3 mm, 35 mm]. That is, a distance is ensured between the convex observation window 21 and the lower plate 13. Optionally, the range of the set spacing is [4 mm, 32 mm]. Optionally, the range of the set spacing is [5 mm, 30 mm]. Optionally, the range of the set spacing is [6 mm, 25 mm].

[0060] In a specific application, for example, the spacing between the convex observation window 21 and the lower plate 13 is 3 mm, 5 mm, 7 mm, 10 mm, 15 mm, 20 mm, 25 mm, 30 mm, 35 mm, etc., without specific limitation herein. Of course, in other applications, the spacing can be set to any distance within [3 mm, 35 mm], and can be set according to actual needs.

[0061] Combine Figures 4 to 6 As shown, in some embodiments, the observation structure 20 further includes a boss 22 disposed between the lower plate 13 and the convex observation window 21, so that a predetermined distance exists between the convex observation window 21 and the lower plate 13. This can further reduce the heat temperature of the convex observation window 21.

[0062] In the embodiment of the present disclosure, a boss 22 is provided between the lower plate body 13 and the convex observation window 21, which can prevent the convex observation window 21 from directly contacting the lower plate body 13, so that heat will not be transferred to the convex observation window 21 in the first place, thereby reducing the temperature of the convex observation window 21.

[0063] In the disclosed embodiment, the provided boss 22 enables the aforementioned set spacing between the convex observation window 21 and the lower plate 13. The height range of the boss 22 falls within the aforementioned set spacing range. The height range of the boss 22 is not further described. Thus, adjusting the height of the boss 22 adjusts the spacing between the convex observation window 21 and the lower plate 13.

[0064] Combine Figures 4 to 6 As shown, in some embodiments, a through hole 221 is provided on the boss 22, which is connected to the first observation hole segment 121 and the second observation hole segment 131; wherein the ratio of the aperture of the through hole 221 and / or the aperture of the second observation hole segment 131 to the diameter of the convex observation window 21 is in the range of [1:3, 3:4].

[0065] In the disclosed embodiment, the boss 22 is a cylindrical structure with a through-hole 221 defined in its center. To ensure that the convex observation window 21 can observe the interior of the semiconductor processing chamber, the through-hole 221 is positioned between and communicates with the first observation hole section 121 and the second observation hole section 131. Specifically, the boss 22 is integrally formed with the lower plate 13, with the through-hole 221 directly communicating with the second observation hole section 131. The convex observation window 21 is positioned between the through-hole 221 and the first observation hole section 121.

[0066] In conjunction with the above embodiment, by changing the size of the observation window, the temperature of the convex observation window 21 can be effectively reduced. Here, because the through hole 221 and the second observation hole segment 131 are located between the convex observation window 21 and the interior of the semiconductor processing chamber, the aperture of the through hole 221 and / or the second observation hole segment 131 corresponds to the actual heated area of ​​the convex observation window 21. In other words, optimizing the through hole 221 and / or the second observation hole segment 131 can both reduce the temperature of the convex observation window 21.

[0067] In the embodiment of the present disclosure, since the space for installing the convex observation window 21 is limited, it is necessary to control the size of the convex observation window 21. The size of the convex observation window 21 needs to match the aperture of the through hole 221 and / or the aperture of the second observation hole section 131.

[0068] Optionally, the ratio of the aperture of the through hole 221 to the diameter of the convex observation window 21 is in the range of [1:3, 3:4]; optionally, the ratio of the aperture of the second observation hole section 131 to the diameter of the convex observation window 21 is in the range of [1:3, 3:4]; optionally, the ratio of the aperture of the through hole 221 to the diameter of the second observation hole section 131 to the diameter of the convex observation window 21 is in the range of [1:3, 3:4].

[0069] Here, the aperture of through hole 221 is the same as the aperture of second observation hole segment 131. The ratio of the aperture of through hole 221 and second observation hole segment 131 to the diameter of convex observation window 21 is in the range of [1:3, 3:4]. Alternatively, the ratio of the aperture of through hole 221 and second observation hole segment 131 to the diameter of convex observation window 21 is in the range of [1:2, 2:3]. This ratio facilitates installation of convex observation window 21, effectively reduces the heating temperature of convex observation window 21, and facilitates observation of the interior of the semiconductor processing chamber.

[0070] In combination with the above embodiment, by optimizing the structure and related parameters of the convex observation window 21, the convex observation window 21 can withstand a working condition with a temperature of about 650°C.

[0071] Combine Figures 4 to 6 As shown, in some embodiments, the observation structure 20 further includes: a sealing gasket 23 disposed between the boss 22 and the convex observation window 21 .

[0072] In the disclosed embodiment, a sealing groove is provided on the edge of the boss 22 facing the convex observation window 21. The sealing gasket 23 is disposed in the sealing groove, and the convex observation window 21 presses the sealing gasket 23. In this way, the sealing of the semiconductor processing chamber can be ensured.

[0073] Combine Figures 4 to 6 As shown, in some embodiments, the observation structure 20 further includes: a fixing member 24 disposed between the convex observation window 21 and the upper plate body 12 to fix the convex observation window 21 .

[0074] In the disclosed embodiment, to facilitate installation of the convex observation window 21, a fixing member 24 secures the convex observation window 21 to the lower plate 13. If the lower plate 13 and the boss 22 are integrally formed, the convex observation window 21 is secured to the boss 22. This prevents the convex observation window 21 from moving and potentially affecting the seal. Furthermore, the fixing member 24 provides a degree of protection for the convex observation window 21.

[0075] In some embodiments, the fixing member 24 includes a protective washer 241 and a fixing ring 242. The protective washer 241 is disposed on the convex observation window 21 to protect the convex observation window 21; the fixing ring 242 is disposed on the protective washer 241 to fix the convex observation window 21.

[0076] In the disclosed embodiment, the fixing ring 242 can secure the convex observation window 21. Since the fixing ring 242 abuts against the edge of the convex observation window 21, a protective gasket 241 is provided between the fixing ring 242 and the convex observation window 21 to prevent the fixing ring 242 from damaging the edge of the convex observation window 21 when the convex observation window 21 is under pressure. Specifically, the protective gasket 241 is provided at the edge of the convex observation window 21 where the fixing ring 242 contacts the convex observation window 21.

[0077] Here, the fixing ring 242 may be made of polytetrafluoroethylene (PTFE).

[0078] Combine Figures 4 to 6 As shown, in some embodiments, the cover plate 10 further includes: a support member 14 disposed between the upper plate body 12 and the lower plate body 13 .

[0079] In the disclosed embodiment, the observation structure 20 is disposed between the upper plate 12 and the lower plate 13 of the cover 10. To ensure overall stability, a support member 14 is disposed between the upper plate 12 and the lower plate 13. The support member 14 provides support and prevents excessive pressure between the upper plate 12 and the lower plate 13 from damaging components within the observation structure 20.

[0080] In the disclosed embodiment, the support member 14 is a “door”-shaped structure, and the upper plate 12 or the lower plate 13 is overlapped with the crossbeam of the support member 14 .

[0081] Here, there are two or more support members 14, and they are evenly distributed between the upper plate 12 and the lower plate 13. The location of the support members 14 is not limited. It can be set according to the structure of the upper plate 12 and the lower plate 13 or the space inside the two.

[0082] An embodiment of the present disclosure further provides a semiconductor processing chamber, comprising: a reaction chamber; and a cover assembly as described in the present application, disposed in the reaction chamber.

[0083] In the disclosed embodiment, the reaction chamber is adapted to be filled with a process gas or source for processing. In addition, the reaction chamber may also be filled with a cleaning gas for chamber cleaning.

[0084] In the embodiment of the present disclosure, the semiconductor processing chamber includes the above-mentioned cover plate assembly. Referring to the above-mentioned embodiment, it has at least the beneficial effects brought by the technical solutions of the above-mentioned embodiment, which will not be described one by one here.

[0085] An embodiment of the present disclosure further provides a semiconductor coating device, comprising a semiconductor processing chamber as described in the present application, wherein the semiconductor coating device comprises an etching device, a chemical vapor deposition device or an atomic layer deposition device.

[0086] In the embodiments of the present disclosure, semiconductor coating equipment includes, but is not limited to, etching equipment, chemical vapor deposition equipment, or atomic layer deposition equipment. However, it should be noted that the semiconductor coating equipment of the present application is not limited thereto. After reading the following technical solution, it will be apparent to a person skilled in the art that the invention can also be applied to other process equipment.

[0087] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless expressly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A cover plate assembly, characterized in that: include: a cover plate having one or more viewing holes extending through its thickness; The observation structure comprises a convex observation window arranged on the observation hole, wherein the first side surface of the convex observation window is a protrusion and faces away from the semiconductor processing chamber.

2. The cover plate assembly according to claim 1, characterized in that: The cover plate comprises: An upper plate body, on which one or more first observation hole sections are formed; A lower plate body is provided with a second observation hole section corresponding to the first observation hole section, wherein the convex observation window is arranged between the first observation hole section and the second observation hole section.

3. The cover plate assembly according to claim 2, characterized in that: The lower plate is adjacent to the semiconductor processing chamber, wherein a set distance is provided between the convex observation window and the lower plate.

4. The cover plate assembly according to claim 3, characterized in that: The value range of the set spacing is [3mm, 35mm].

5. The cover plate assembly according to claim 3 or 4, characterized in that: The observation structure also includes: The boss is arranged between the lower plate body and the convex observation window so that a set distance exists between the convex observation window and the lower plate body.

6. The cover plate assembly according to claim 5, characterized in that: The boss is provided with a through hole connected with the first observation hole segment and the second observation hole segment; wherein the ratio of the aperture of the through hole and / or the aperture of the second observation hole segment to the diameter of the convex observation window is in the range of [1:3, 3:4].

7. The cover plate assembly according to claim 5, characterized in that: The observation structure also includes: A sealing gasket is arranged between the boss and the convex observation window.

8. The cover plate assembly according to any one of claims 2 to 4, characterized in that: The observation structure also includes: The fixing piece is arranged on the convex observation window to fix the convex observation window.

9. The cover plate assembly according to claim 8, characterized in that: The fixing member comprises: A protective gasket is arranged on the convex observation window to protect the convex observation window; Fixed ring; set on the protective gasket to fix the convex observation window.

10. The cover plate assembly according to any one of claims 2 to 4, characterized in that: The cover plate also includes: The support member is arranged between the upper plate body and the lower plate body.

11. The cover plate assembly according to any one of claims 1 to 4, characterized in that: The thickness of the convex observation window is greater than or equal to 5 mm.

12. A semiconductor processing chamber, characterized in that: include: Reaction chamber; The cover plate assembly according to any one of claims 1 to 11 is arranged in a reaction chamber.

13. A semiconductor coating device, characterized in that: It comprises a semiconductor processing chamber as described in claim 12, wherein the semiconductor coating equipment comprises an etching equipment, a chemical vapor deposition equipment or an atomic layer deposition equipment.

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