System-in-package module, electronic equipment, thermal design method and control method

Abstract

The invention relates to the technical field of electronics, in particular to a system-level packaging module, electronic equipment, a thermal design method and a control method.The packaging module comprises a substrate, a heat source, a radiator and a heat sensitive area, and the heat source, the radiator and the heat sensitive area are arranged on the substrate; heat of the heat source is conducted to the radiator through a heat pipe between the heat source and the radiator. A heat insulation layer is arranged between the heat source and the heat sensitive area, and heat of the heat source is isolated from being conducted to the heat sensitive area through the heat insulation layer; and a packaging layer, and the packaging layer and the substrate are integrally designed. Therefore, the problems of poor thermal performance and the like caused by non-uniform heat distribution of the existing system-in-package module are solved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a system-level packaging module, an electronic device, a thermal design method, and a control method. Background Art

[0002] System-in-Package is a technology that integrates multiple functional chips and electronic components in one package. The system-in-package technology aims to improve performance, reduce size and reduce costs through high integration, and is widely used in consumer electronics, communications, medical, automotive and other fields.

[0003] In existing system-level packaging modules, due to unreasonable chip layout or uneven distribution of heat pipes, local hot spots are easily formed in certain areas. These hot spots will cause local temperatures to be too high, affecting the performance and reliability of the chip. In addition, the design of system-level packaging modules often fails to fully consider the optimization of heat flow paths, resulting in uneven heat distribution. Some areas are overheated while other areas are cooler. This uneven heat distribution will affect the thermal performance of the entire system. Summary of the invention

[0004] The present application provides a system-level packaging module, an electronic device, a thermal design method and a control method to solve the problems of uneven heat distribution in existing system-level packaging modules leading to poor thermal performance.

[0005] The first aspect of the present application provides a system-level packaging module, including: a substrate and a heat source, a heat sink and a heat-sensitive area are arranged on the substrate; the heat of the heat source is conducted to the heat sink through a heat pipe between the heat source and the heat sink; a heat insulation layer is arranged between the heat source and the heat-sensitive area, and the heat of the heat source is isolated from the heat conduction to the heat-sensitive area through the heat insulation layer; and a packaging layer, wherein the packaging layer is designed as an integrated whole with the substrate.

[0006] Optionally, a phase change material is disposed in the heat pipe, and the phase change material is used to absorb and / or release heat.

[0007] Optionally, the material of the heat insulation layer is a heat insulation material.

[0008] Optionally, the material of the packaging layer is plastic or ceramic.

[0009] Optionally, the encapsulation layer is encapsulated using a three-dimensional encapsulation technology.

[0010] Optionally, it also includes: a detection component for detecting the current temperature of the heat source; and an intelligent temperature control system for controlling the operation of the radiator according to the current temperature.

[0011] Optionally, the detection component includes a thermistor and a temperature sensor.

[0012] A second aspect of the present application provides an electronic device, including a system-level packaging module as described in the above embodiment.

[0013] A third aspect of the present application provides a thermal design method for a system-level packaging module, which is used for the thermal design of a system-level packaging module as in the above-mentioned embodiment, and includes the following steps: identifying the heat source, heat sink and heat-sensitive area of ​​the system-level packaging module; determining the heat pipe distribution position according to the positions of the heat source and the heat sink, and determining the thermal isolation position according to the thermal sensitive area; and generating a thermal design scheme according to the heat pipe distribution position and the thermal isolation position.

[0014] The fourth aspect of the present application provides a method for thermal control of a system-level packaging module, which is used for thermal control of a system-level packaging module as in the above embodiment, and includes the following steps: detecting the current temperature of the heat source; and controlling the operation of the radiator according to the current temperature.

[0015] Therefore, this application has at least the following beneficial effects:

[0016] The embodiment of the present application can transfer the heat of the heat source to the radiator through a heat pipe. The heat pipe has a high thermal conductivity and can quickly transfer heat from the heat source to the radiator in a short time, thereby effectively reducing the temperature of the heat source. A heat insulation layer is provided between the heat source and the heat-sensitive area to isolate the heat of the heat source, effectively isolating the heat of the heat source, protecting the electronic components and chips in the heat-sensitive area, and preventing high-temperature damage. The packaging layer and the substrate are designed to be integrated, which improves the mechanical strength and environmental protection performance and thermal conductivity and reduces thermal resistance, thereby enabling the system-level packaging module to maintain good thermal stability. As a result, the technical problems of uneven heat distribution of the existing system-level packaging module leading to poor thermal performance are solved.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 A schematic diagram of a system-level packaging module provided according to an embodiment of the present application;

[0020] Figure 2 A flowchart of a thermal design method for a system-level packaging module provided according to an embodiment of the present application;

[0021] Figure 3 The present invention is a flowchart of a thermal control method for a system-level packaging module provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0022] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0023] The following describes the system-level packaging module, electronic device, thermal design method and control method of the embodiment of the present application with reference to the accompanying drawings. In view of the fact that the design of the existing system-level packaging module mentioned in the above background technology often fails to fully consider the optimization of the heat flow path, resulting in uneven heat distribution, overheating in some areas, and lower temperatures in other areas, this uneven heat distribution will affect the thermal performance of the entire system. The present application provides a system-level packaging module, in which the heat of the heat source is transferred to the radiator through a heat pipe, and the heat pipe has a high thermal conductivity, which can quickly transfer heat from the heat source to the radiator in a short time, thereby effectively reducing the temperature of the heat source, and a heat insulation layer is provided in the heat source and the heat sensitive area to isolate the heat of the heat source, effectively isolate the heat of the heat source, protect the electronic components and chips in the heat sensitive area, and prevent high temperature damage, and the packaging layer and the substrate are integrated, which improves the mechanical strength and environmental protection performance and thermal conductivity and reduces the thermal resistance, thereby enabling the system-level packaging module to maintain good thermal stability. Thus, the existing system-level packaging module is solved. The problem of uneven heat distribution leading to poor thermal performance is solved.

[0024] Specifically, Figure 1 A schematic diagram of a system-level packaging module provided in an embodiment of the present application.

[0025] like Figure 1 As shown, the system-level packaging module 10 includes: a substrate 11, a heat source 12, a heat sink 13, a heat sensitive area 14, a heat pipe 15, a heat insulation layer 16 and a packaging layer 17.

[0026] Among them, the heat source 12, the heat sink 13 and the heat-sensitive area 14 are all arranged on the substrate 11, the heat pipe 15 is used to conduct the heat of the heat source 12 to the heat sink 13, the insulation layer 16 is arranged at the heat source 12 and the heat-sensitive area 14, and is used to isolate the heat from the heat source 12 from being conducted to the heat-sensitive area 14, and the packaging layer 16 is designed to be integrated with the substrate 11.

[0027] It can be understood that the embodiment of the present application can conduct the heat of the heat source 12 to the radiator through the heat pipe 15. The heat pipe 15 has a very high thermal conductivity and can quickly transfer the heat from the heat source 12 to the radiator 13 in a short time, thereby effectively reducing the temperature of the heat source 12. A heat insulation layer 16 is provided between the heat source 12 and the heat-sensitive area 14 to isolate the heat of the heat source 15, effectively isolating the heat of the heat source 15, protecting the electronic components and chips in the heat-sensitive area 14, and preventing high-temperature damage. The packaging layer 17 is integrated with the substrate 11 to improve the mechanical strength, environmental protection performance and thermal conductivity and reduce thermal resistance, thereby enabling the system-level packaging module to maintain good thermal stability.

[0028] The heat source 15 may be a chip, and there are multiple heat sources in the system-level packaging module. Multi-chip module (MCM) technology may be used to improve performance by vertically stacking chips while dissipating heat through an intermediate layer.

[0029] In the embodiment of the present application, a phase change material is disposed in the heat pipe 15 , and the phase change material is used to absorb and / or release heat.

[0030] Among them, the phase change material can be paraffin, salt hydrate, metal alloy and the like.

[0031] It can be understood that the heat pipe in the embodiment of the present application is provided with a phase change material to absorb and release heat to help regulate the temperature.

[0032] In the embodiment of the present application, the material of the heat insulation layer 16 is a heat insulation material.

[0033] It can be understood that the material of the heat insulation layer 16 in the embodiment of the present application is a heat insulation material, which has low thermal conductivity and can effectively isolate the heat of the heat source and protect the heat-sensitive area.

[0034] In the embodiment of the present application, the material of the packaging layer 17 is plastic or ceramic.

[0035] Since plastic or ceramic has good heat dissipation performance and thermal conductivity, the material of the packaging layer 17 in the embodiment of the present application is plastic or ceramic.

[0036] In the embodiment of the present application, the encapsulation layer 17 is encapsulated using three-dimensional encapsulation technology to achieve the integration of more functions in a smaller space, while improving heat distribution through a three-dimensional structure.

[0037] In the embodiment of the present application, the system-level packaging module 10 of the embodiment of the present application further includes: a detection component and an intelligent temperature control system.

[0038] Among them, the detection components include thermistors and temperature devices; the intelligent temperature control system integrates a microprocessor and a control algorithm.

[0039] It is understandable that the embodiment of the present application integrates a thermistor and a temperature sensor in the system-level packaging module 10 to monitor the temperature of the heat source 15 in real time, so that the intelligent temperature control system can control the heat sink 15 to work when the temperature is too high.

[0040] In addition, the intelligent temperature control system can dynamically manage the heat flow within the package, such as using dynamic heat switching technology to adjust the heat distribution.

[0041] It should be noted that dynamic heat switching technology refers to real-time monitoring and adjustment of heat flow paths through intelligent control systems, optimizing heat distribution, and ensuring that the system maintains optimal thermal performance under different operating conditions. This technology can dynamically change the heat flow path according to the actual workload and environmental conditions, thereby achieving more efficient thermal management. For example, the optimal heat flow path is determined based on the current heat distribution, and a thermal switch (such as a Peltier effect device) is used to switch between different heat flow paths. The thermal switch can be turned on or off in different directions to achieve dynamic adjustment of the heat flow. A thermal valve (such as a thermocouple, thermal resistor) is used to control the size and direction of the heat flow. The thermal valve can adjust the path and flow of the heat flow as needed. A variable heat pipe is used to adjust the thermal conductivity of the heat pipe as needed to achieve dynamic management of the heat flow.

[0042] In summary, the system-level packaging module of the embodiment of the present application is mainly implemented by the following methods:

[0043] 1. Strong heat dissipation materials: Use materials with high thermal conductivity for packaging, such as plastic or ceramic materials with better heat dissipation performance.

[0044] 2. Heat pipes and phase change materials: Heat pipe technology is used to transfer heat from the heat source (such as chips) to the radiator. Phase change materials can absorb and release heat in the heat pipe to help regulate the temperature.

[0045] 3. Thermal isolation: Use thermal insulation materials or insulation layers in the packaging design to reduce heat transfer to undesirable heat-sensitive areas.

[0046] 4. Thermistors and temperature sensors: Integrate thermistors and temperature sensors to monitor chip temperature in real time so that measures can be taken when the temperature is too high.

[0047] 5. Optimized package layout: Consider the distribution of hot spots during the design phase and reduce thermal resistance by optimizing chip layout and package structure.

[0048] For example, thermal simulation software can be used to simulate and predict the thermal distribution of different design schemes, identify potential hot spots and areas with high thermal resistance, and make optimization suggestions based on the simulation structure. High-power chips can be dispersed in different positions on the substrate to avoid local overheating, and the spacing between chips can be reasonably arranged to ensure sufficient heat dissipation space. Heat-sensitive components (such as memory, sensors, etc.) can be kept away from high-power chips to avoid being affected by high temperatures.

[0049] 6. Integrated design of packaging and substrate: Integrate the packaging material and substrate material to reduce thermal resistance and improve thermal conductivity.

[0050] 7. Multi-chip module (MCM) technology: Multi-chip module technology is used in highly integrated modules to improve performance by vertically stacking chips while dissipating heat through the middle layer.

[0051] 8. Three-dimensional packaging technology: The use of three-dimensional packaging technology can integrate more functions in a smaller space, while improving heat distribution through a three-dimensional structure.

[0052] 9. Intelligent temperature control system: Integrates microprocessors and control algorithms to dynamically manage heat flow within the package, such as using dynamic thermal switching technology to adjust heat distribution.

[0053] According to the system-level packaging module proposed in the embodiment of the present application, the heat of the heat source can be conducted to the radiator through the heat pipe. The heat pipe has a very high thermal conductivity and can quickly transfer heat from the heat source to the radiator in a short time, thereby effectively reducing the temperature of the heat source. An insulating layer is provided between the heat source and the heat-sensitive area to isolate the heat of the heat source, effectively isolating the heat of the heat source, protecting the electronic components and chips in the heat-sensitive area, and preventing high-temperature damage. The packaging layer and the substrate are integrated into a design to improve the mechanical strength, environmental protection performance and thermal conductivity, and reduce thermal resistance, thereby enabling the system-level packaging module to maintain good thermal stability.

[0054] An embodiment of the present application also provides an electronic device, comprising the above-mentioned system-level packaging module.

[0055] Next, a thermal design method for a system-level packaging module according to an embodiment of the present application will be described with reference to the accompanying drawings.

[0056] Figure 2 It is a flow chart of a thermal design method of a system-level packaging module according to an embodiment of the present application.

[0057] like Figure 2 As shown, the thermal design method of the system-level packaging module is used for the thermal design of the system-level packaging module as in the above embodiment, and comprises the following steps:

[0058] In step S101 , a heat source, a heat sink, and a heat-sensitive area of ​​a system-in-package module are identified.

[0059] It can be understood that the embodiments of the present application can identify the heat source, heat sink and heat-sensitive area of ​​the system-level packaging module to facilitate the subsequent thermal design of the system-level packaging module.

[0060] In step S102, the heat pipe distribution position is determined according to the positions of the heat source and the heat sink, and the thermal isolation position is determined according to the thermally sensitive area.

[0061] Since the heat pipe is used to conduct the heat generated by the heat source to the radiator for heat dissipation, and the thermal isolation is used to isolate the heat source and the heat-sensitive area, the embodiment of the present application can determine the heat pipe distribution position according to the position of the heat source and the radiator, and determine the thermal isolation position according to the heat-sensitive area.

[0062] In step S103, a thermal design scheme is generated according to the heat pipe distribution positions and the thermal isolation positions.

[0063] It can be understood that the embodiments of the present application can comprehensively consider the heat pipe distribution position and the thermal isolation position to make the generated thermal design scheme more reasonable, effectively improve the thermal performance and reliability of the system-level packaging module, and ensure that the system-level packaging module can maintain optimal thermal performance under different working conditions.

[0064] It should be noted that the aforementioned explanation of the system-level packaging module embodiment is also applicable to the thermal design method of the system-level packaging module of this embodiment, and will not be repeated here.

[0065] According to the thermal design method of the system-level packaging module proposed in the embodiment of the present application, the heat pipe distribution position can be determined according to the position of the heat source and the heat sink of the system-level packaging module, and the thermal isolation position can be determined according to the thermally sensitive area of ​​the system-level packaging module. Then, a thermal design scheme is generated according to the heat pipe distribution position and the thermal isolation position, so that the generated scheme is more reasonable, effectively improving the thermal performance and reliability of the system-level packaging module, and ensuring that the system-level packaging module can maintain optimal thermal performance under different working conditions.

[0066] The embodiment of the present application also provides a thermal control method for a system-level packaging module.

[0067] like Figure 3 As shown, the thermal control method of the system-level packaging module is used for thermal control of the system-level packaging module as in the above embodiment, and comprises the following steps:

[0068] In step S201 , the current temperature of the heat source is detected.

[0069] Among them, the embodiment of the present application can detect the current temperature of the heat source through a detection component.

[0070] In step S202, the operation of the radiator is controlled according to the current temperature.

[0071] It can be understood that the embodiments of the present application can control the operation of the radiator according to the current temperature. For example, when the current temperature exceeds the preset temperature threshold, the radiator is controlled to start working. When the temperature is lower than the preset temperature threshold, the radiator is controlled to stop working, thereby achieving on-demand heat dissipation, effectively saving energy, and extending the service life of the radiator.

[0072] According to the control method of the system-level packaging module proposed in the embodiment of the present application, the operation of the radiator can be controlled based on the current temperature to achieve on-demand heat dissipation, effectively save energy, and extend the service life of the radiator.

[0073] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or N embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0074] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0075] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or N executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present application belong.

[0076] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above embodiment, the N steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one or a combination of multiple of the following technologies known in the art: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0077] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

Claims

1. A system-level packaging module, characterized in that: include: The substrate and the substrate are provided with a heat source, a heat sink and a heat sensitive area; The heat source and the radiator are connected by a heat pipe to transfer the heat of the heat source to the radiator; A heat insulation layer is provided between the heat source and the heat sensitive area, and the heat of the heat source is isolated from being conducted to the heat sensitive area by the heat insulation layer; The encapsulation layer is designed to be integrated with the substrate.

2. The system-in-package module according to claim 1, characterized in that: A phase change material is arranged in the heat pipe, and the phase change material is used to absorb and / or release heat.

3. The system-in-package module according to claim 1, wherein: The material of the heat insulation layer is a heat insulation material.

4. The system-in-package module according to claim 1, wherein: The material of the packaging layer is plastic or ceramic.

5. The system-in-package module according to claim 1, wherein: The encapsulation layer is encapsulated by using three-dimensional encapsulation technology.

6. The system-in-package module according to claim 1, characterized in that: Also includes: A detection component, used for detecting the current temperature of the heat source; An intelligent temperature control system is used to control the operation of the radiator according to the current temperature.

7. The system-in-package module according to claim 6, characterized in that: The detection component includes a thermistor and a temperature sensor.

8. An electronic device, characterized in that: Comprising a system-level packaging module as described in any one of claims 1-7.

9. A thermal design method for a system-level packaging module, characterized in that: The method is used for thermal design of a system-level packaging module according to any one of claims 1 to 7, comprising the following steps: Identify heat sources, heat sinks, and thermally sensitive areas of system-level package modules; Determine the heat pipe distribution position according to the positions of the heat source and the heat sink, and determine the heat isolation position according to the heat sensitive area; A thermal design scheme is generated according to the heat pipe distribution positions and the thermal isolation positions.

10. A thermal control method for a system-level packaging module, characterized in that: The method is used for thermal control of the system-level packaging module according to any one of claims 1 to 7, comprising the following steps: Detect the current temperature of the heat source; The operation of the radiator is controlled according to the current temperature.

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