Cabinet server

Abstract

The invention provides a cabinet server which comprises a computing node, a heat exchange assembly and a cabinet, the computing node comprises a box body, a heating element and a liquid cooling assembly, the heating element and the liquid cooling assembly are both located on the inner side of the box body, the box body is provided with a first liquid outlet and a first liquid inlet, and the liquid cooling assembly comprises a first driving pump and a first cold plate. The first liquid inlet, the first driving pump, the first cold plate and the first liquid outlet are sequentially communicated, and the first cold plate is in contact with the heating element; the heat exchange assembly comprises a shell, a heat exchanger and a first fan, the heat exchanger and the first fan are both installed on the inner side of the shell, the shell is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet communicates with the first liquid outlet, the second liquid outlet communicates with the first liquid inlet, and the heat exchanger communicates with the second liquid inlet and the second liquid outlet. The at least one computing node and the at least one heat exchange assembly are both installed on the cabinet. According to the technical scheme provided by the invention, the heat dissipation efficiency of the local area with relatively high power of the cabinet server can be improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation, and in particular to a cabinet server. Background Art

[0002] At present, due to the increase in computing power requirements of cabinet servers, the heat generation power of computing nodes inside cabinet servers is getting higher and higher. However, due to the different powers of nodes of different service types inside the cabinet server, the heat accumulation of different components is different. It is more difficult to dissipate heat for some computing nodes with larger heat generation power, resulting in higher temperatures, which ultimately makes the cabinet server unable to operate efficiently. Summary of the invention

[0003] The embodiments of the present application provide a cabinet server, which can improve the heat dissipation efficiency of a local area of ​​the cabinet server with relatively large power, thereby solving the heat dissipation problem of the cabinet server and improving the operating efficiency of the cabinet server.

[0004] In a first aspect, an embodiment of the present application provides a cabinet server, including:

[0005] At least one computing node, comprising a box, a heating element and a liquid cooling component, wherein the heating element and the liquid cooling component are both located inside the box, the box is provided with a first liquid outlet and a first liquid inlet, the liquid cooling component comprises a first driving pump and a first cold plate, the first liquid inlet, the first driving pump, the first cold plate and the first liquid outlet are connected in sequence, and the first cold plate is in contact with the heating element;

[0006] at least one heat exchange component, the heat exchange component comprising a housing, a heat exchanger and a first fan, the heat exchanger and the first fan are both mounted on the inner side of the housing, the heat exchanger and the first fan are arranged opposite to each other, the housing is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet is communicated with the first liquid outlet, the second liquid outlet is communicated with the first liquid inlet, the heat exchanger is communicated with the second liquid inlet and the second liquid outlet, so as to cool the liquid-cooled medium flowing from the first cold plate into the heat exchanger; and

[0007] A cabinet, wherein the at least one computing node and the at least one heat exchange component are both installed in the cabinet.

[0008] It is understandable that the first driving pump can increase the flow rate of the liquid cooling medium, that is, it can make the liquid cooling medium flow quickly between the first cold plate and the heat exchange component to improve the heat dissipation efficiency of the first cold plate to the heating element. Since the first driving pump is arranged inside the box of the computing node, the first driving unit can adjust the driving speed according to the heating efficiency of the heating element of the corresponding computing node, thereby adjusting the temperature of the liquid cooling medium, so that the temperature of the liquid cooling medium is low enough, thereby ensuring the heat dissipation efficiency of the first cold plate to the heating element.

[0009] The first fan is used to increase the air circulation rate around the heat exchanger, so that the air can take away the heat of the heat exchanger, thereby gradually cooling the liquid cooling medium inside the heat exchange body. The number of first fans can be set corresponding to the number of heat exchangers.

[0010] The first cold plate has a liquid cooling medium channel, and the liquid cooling medium flowing through the liquid cooling medium channel can take away the heat of the heating element. The first driving pump can transfer the liquid cooling medium in the heat exchanger to the first cold plate.

[0011] In a possible implementation manner, the liquid cooling assembly further includes a first joint and a second joint, the first joint is connected to the first liquid inlet, and the second joint is connected to the first liquid outlet;

[0012] The heat exchange assembly further includes a third joint and a fourth joint, the third joint is connected to the second liquid outlet, the fourth joint is connected to the second liquid inlet, the heat exchanger is connected to the second liquid inlet via a pipeline, and the heat exchanger is connected to the second liquid outlet via another pipeline;

[0013] The first connector is matched and connected with the third connector, and the first connector and the third connector cooperate to form a quick connector. The second connector is matched and connected with the fourth connector, and the second connector and the fourth connector cooperate to form a quick connector.

[0014] It is understandable that, since the space between the computing node and the heat exchange component is small or substantially free of gap, it is difficult for the operator to fix the first joint with the third joint, and the second joint with the fourth joint in the gap between the computing node and the heat exchange component. The first joint provided in the present application can be blindly plugged with the third joint, and the second joint with the fourth joint can be blindly plugged. Thus, during the installation of the server in the cabinet, the first joint and the third joint, and the second joint and the fourth joint can be directly fixedly connected. This simplifies the connection method between the computing node and the heat exchange component.

[0015] In a possible implementation manner, the liquid cooling assembly further includes a first joint and a second joint, the first joint is connected to the first liquid inlet, and the second joint is connected to the first liquid outlet;

[0016] The heat exchange assembly also includes a third joint and a fourth joint, the third joint and the fourth joint are both connected to the heat exchanger, the third joint passes through the second liquid outlet and is matched with the first joint, the first joint and the third joint cooperate to form a quick joint, the fourth joint passes through the second liquid inlet and is matched with the second joint, and the second joint and the fourth joint cooperate to form a quick joint.

[0017] In a possible embodiment, the liquid cooling assembly further includes a first pipeline, a second pipeline and a third pipeline, the first pipeline connecting the first driving pump with the first liquid inlet, the second pipeline connecting the first driving pump with the flow channel of the first cold plate, and the third pipeline connecting the flow channel of the first cold plate with the first liquid outlet.

[0018] It can be understood that the pipeline is generally a soft structure. Connecting the first liquid inlet, the first drive pump, the first cold plate and the first liquid outlet through the pipeline can flexibly set the installation positions of the first drive pump and the first cold plate, saving the process of aligning the first drive pump with the first liquid inlet, the first cold plate with the first drive pump, and the first cold plate with the first liquid outlet.

[0019] In a possible implementation manner, the computing node further includes a second fan, wherein the second fan is located on an inner side of the box and faces the heating element.

[0020] It is understandable that the second fan can blow air toward the heating element to increase the air flow around the heating element. The air flow can take away the heat of the heating element, thereby cooling the heating element.

[0021] In a possible implementation manner, the height of the heat exchange component is equal to the height of the computing node.

[0022] It can be understood that when the height of the heat exchange assembly is equal to the height of the box, a heat exchange assembly can be installed on one side of the box of each computing node.

[0023] In a possible implementation, there is a plurality of computing nodes, the number of the heat exchange components is the same as the computing nodes, and the plurality of computing nodes and the plurality of heat exchange components are arranged in a one-to-one correspondence.

[0024] It is understandable that in the prior art, generally a heat exchange component is provided for all computing nodes in a cabinet, and the heat exchange component needs to perform heat exchange cooling on the liquid cooling medium of multiple computing nodes in a cabinet. However, since the heat accumulation of multiple cabinet servers in the cabinet is different, and the circulation speed of the liquid cooling medium in each computing node is the same, the heat dissipation effect of the computing node with higher heat generation efficiency is obviously insufficient.

[0025] Each individual computing node of the present application is equipped with a separate heat exchange component. Therefore, the cabinet server of the present application can adjust the power of each heat exchange component individually, thereby adjusting the temperature of the liquid cooling medium and the flow rate of the liquid cooling medium. Specifically, the circulation speed of the liquid cooling medium of each computing node can be adjusted according to the temperature of the heating element. This makes the heat dissipation effect of the computing node better, avoiding the excessive temperature of a heating element or a local area in the computing node, causing the computing node to fail to operate normally.

[0026] In a possible implementation, the cabinet server further includes a mounting frame, the mounting frame includes a plurality of mounting spaces, the mounting spaces are spaced apart along a height direction of the mounting frame, the computing node is installed in the mounting space, the heat exchange component is fixedly connected to the mounting frame, and the heat exchange component is located outside the mounting space.

[0027] It is understandable that existing cabinets are generally used to accommodate computing nodes, so the heat exchange component can be directly connected to the outside of the installation space, so that it is suitable for currently common cabinets.

[0028] In a possible implementation, the cabinet server further includes a mounting frame, the mounting frame includes a plurality of mounting spaces, the mounting spaces are spaced apart along a height direction of the mounting frame, and one of the computing nodes and one of the heat exchange components are installed in one of the mounting spaces.

[0029] It is understandable that placing the heat exchange component inside the cabinet can make the overall structure of the cabinet server more concise and make the overall installation stability of the cabinet server higher.

[0030] In a possible implementation, the cabinet server further includes a slide rail, a slide rail being disposed in one of the installation spaces, the computing node being slidably connected to the slide rail, the computing node being able to slide along an extension direction of the slide rail, and the heat exchange component being opposite to the computing node along the extension direction of the slide rail. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the implementation manner will be briefly introduced below. Obviously, the drawings described below are only some implementation manners of the present application. For ordinary technicians in this field, other drawings can be obtained like these drawings without paying any creative work.

[0032] Figure 1 This is a schematic diagram of the structure of a cabinet server provided in an embodiment of the present application;

[0033] Figure 2 yes Figure 1An exploded schematic diagram of a rack server is shown;

[0034] Figure 3 yes Figure 2 A schematic diagram of the structure of a computing node and a heat exchange component is shown;

[0035] Figure 4 yes Figure 2 The structural schematic diagram of the heat exchange component shown;

[0036] Figure 5 yes Figure 4 The heat exchange assembly shown is installed in the cabinet structure schematic diagram;

[0037] Figure 6 yes Figure 2 A schematic diagram of the circulation of the liquid cooling medium in the box shown;

[0038] Figure 7 yes Figure 2 Another structural schematic diagram of a computing node and a heat exchange component is shown;

[0039] Figure 8 yes Figure 1 Another structural schematic diagram of a cabinet server is shown. DETAILED DESCRIPTION

[0040] For ease of understanding, the terms involved in the embodiments of the present application are first explained.

[0041] And / or: It is just a way to describe the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0042] Multiple: refers to two or more than two.

[0043] Connection: should be understood in a broad sense. For example, A and B are connected, which can be either direct or indirect through an intermediary.

[0044] The specific implementation of the present application will be clearly described below in conjunction with the accompanying drawings.

[0045] Server: A high-performance computer that runs corresponding application software in a network environment, provides shared information resources and various services to online users, and provides various shared services and other applications to terminal users. The server includes a central processing unit, memory, hard disk, various buses, etc., and has high-speed computing capabilities, long-term reliability, and strong external data throughput capabilities.

[0046] The motherboard, also known as the mainboard, system board, or motherboard, is used to connect the various components in the server. The motherboard is used to transmit various electronic signals and preliminarily process some peripheral data.

[0047] BIOS (basic input output system) chip: It carries the computer's basic input and output programs, the self-test program after powering on, and the system startup program. It can provide the computer with the lowest-level and most direct hardware settings and controls. The BIOS chip can also provide some system parameters to the operating system.

[0048] CPU (central processing unit): As the computing and control core of the information processing system, it is the execution unit of information processing and program running.

[0049] DIMM (dual inline memory module): a type of memory module. Memory modules are used to provide operating space for information processing systems and software, and are also used to temporarily store CPU computing data and data exchanged with external memory such as hard disks. The CPU can address the memory through the data bus and perform read and write operations on the memory.

[0050] PCH (Platform Controller Hub) can also be called Southbridge chip. Southbridge chip is used to process low-speed signals and communicate with CPU through Northbridge chip. Northbridge chip is set close to CPU and is mainly responsible for controlling data exchange between AGP (Accelerated Graphics Port) graphics card, memory and CPU; Southbridge chip is set close to PCI (Peripheral Component Interconnect) slot and is mainly responsible for data exchange between floppy drive, hard disk, keyboard and add-on card. Southbridge chip and Northbridge chip are connected through PCI bus to form a motherboard chipset architecture.

[0051] GPU (graphics processing unit): a microprocessor used to perform image and graphics related computing tasks.

[0052] GPU card: also known as a graphics card, including GPU, video memory, circuit board, BIOS firmware, first fan and other components.

[0053] Please refer to Figure 1 and Figure 2 , Figure 1It is a structural diagram of the cabinet server 1000 provided in an embodiment of the present application. Figure 2 yes Figure 1 The exploded schematic diagram of the cabinet server 1000 is shown. Figure 2 The X-marked direction shown is the width direction of the cabinet server 1000. The X-direction is the direction from the right side of the cabinet server 1000 to the left side. Figure 2 The Y-marked direction shown is the length direction of the cabinet server 1000. The Y-direction is the direction from the front side of the cabinet server 1000 to the rear side. Figure 2 The Z direction shown is the height direction of the cabinet server 1000. The Z direction is the direction from the bottom surface of the cabinet server 1000 to the top surface.

[0054] An embodiment of the present application provides a cabinet server 1000. The cabinet server 1000 includes a cabinet 100, a plurality of computing nodes 201, and a plurality of heat exchange components 250. The plurality of computing nodes 201 and the heat exchange components 250 are all installed on the cabinet 100. Exemplarily, the plurality of computing nodes 201 can be communicatively connected to form a cabinet server 1000 network for transmitting data. Optionally, the cabinet 100 includes a mounting frame 110 and a plurality of slide rails 120. The plurality of slide rails 120 are connected to the mounting frame 110, and the plurality of slide rails 120 are sequentially spaced apart along the height direction of the mounting frame 110. Each slide rail 120 is used to connect a computing node 201.

[0055] Please refer to Figure 3 , Figure 3 yes Figure 2 The structure diagram of a computing node 201 and a heat exchange component 250 is shown. The heat exchange component 250 and the computing node 201 are connected through a pipe. The computing node 201 includes a box 210, a mainboard 220, a heating element 230 and a liquid cooling component 240.

[0056] Exemplarily, the box body 210 may be in the shape of a cuboid. The box body 210 includes six plates, which may be respectively a first plate 211 and a second plate 212 arranged oppositely along the thickness direction of the box body 210, and a third plate 213, a fourth plate 214, a fifth plate 215, and a sixth plate 216 connected between the first plate 211 and the second plate 212. The third plate 213 and the fourth plate 214 are arranged oppositely, and the fifth plate 215 and the sixth plate 216 are arranged oppositely. The first plate 211, the second plate 212, the third plate 213, the fourth plate 214, the fifth plate 215, and the sixth plate 216 together enclose the internal space 2100 of the box body 210.

[0057] Exemplarily, one or more of the six plates of the box 210 may be an integrated plate structure, or a plate structure formed by stacking and / or splicing a plurality of plates. The outer surfaces of the six plates of the box 210 are surfaces of the six plates facing the power supply device outside the box 210. The outer surfaces of one or more of the six plates of the box 210 may be a plane, or may be provided with a protrusion structure and / or a groove structure, but are generally planar.

[0058] Please refer to Figure 3 , the box 210 has a thickness H, a width W, and a length L. The width direction of the box 210 is the same as the width direction of the cabinet server 1000. The width direction of the box 210 is also indicated by an X mark. The length direction of the box 210 is the same as the length direction of the cabinet server 1000. The length direction of the box 210 is also indicated by an X mark. The height direction of the box 210 is the same as the height direction of the cabinet server 1000. The height direction of the box 210 is also indicated by a Z mark. The first plate 211 and the second plate 212 can be parallel to the width direction X and the length direction Y of the box 210. The third plate 213 and the fourth plate 214 can be parallel to the thickness direction Z and the width direction X of the box 210. The fifth plate 215 and the sixth plate 216 can be parallel to the thickness direction Z and the length direction Y of the box 210. The thickness H of the box 210 is the distance between the outer surface of the first plate 211 and the outer surface of the second plate 212 of the box 210. The length L of the box 210 is the distance between the outer surfaces of the third plate 213 and the fourth plate 214 of the box 210. The width W of the box 210 is the distance between the outer surfaces of the fifth plate 215 and the sixth plate 216 of the box 210.

[0059] In some possible implementations, the box 210 is provided with a sliding member (not shown), which is provided on the outer surface of the box 210. The sliding member can be installed on the slide rail 120. The sliding member can slide relative to the slide rail 120. Thus, the computing node 201 can be installed in the cabinet 100, or the server can be moved out of the cabinet 100.

[0060] After the computing node 201 is accommodated in the installation space of the cabinet 100, a plurality of computing nodes 201 are stacked. The first plate 211 of the box body 210 may be located above the second plate 212. The third plate 213 faces the front side of the cabinet 100. The fourth plate 214 faces the rear side of the cabinet 100. The fifth plate 215 faces the right side of the cabinet 100, and the sixth plate 216 faces the left side of the cabinet 100.

[0061] The fourth plate 214 of the box body 210 is provided with a liquid inlet and a liquid outlet. For the convenience of description below, the liquid inlet provided on the box body 210 is defined as a first liquid inlet 2141, and the liquid outlet provided on the box body 210 is defined as a first liquid outlet 2142. The first liquid inlet 2141 and the first liquid outlet 2142 penetrate the fourth plate 214 along the thickness direction of the fourth plate 214. The first liquid inlet 2141 and the first liquid outlet 2142 can be arranged at intervals.

[0062] The mainboard 220 is connected to the inner space 2100 of the housing 210, and the heating element 230 can be electrically connected to the mainboard 220. The heating element 230 includes components such as a CPU, a GPU, a DIMM, and a PCH.

[0063] In some embodiments, the mainboard 220 may be a hard substrate. Exemplarily, the hard substrate may be a copper clad laminate (CCL), which may be a plate-shaped material made by impregnating a reinforcing material with resin, coating one or both sides with copper foil, and hot pressing. Exemplarily, the reinforcing material of the copper clad laminate may be paper, glass fiber, ceramic, silicon dioxide, boron nitride, metal, resin, and composite material. The material of the mainboard 220 may be selected based on the requirements of the specification, high-speed signal, flow capacity, cost, etc., and the embodiments of the present application do not strictly limit this.

[0064] In some other embodiments, the main board 220 may also be a flexible substrate. When the main board 220 is a flexible substrate, a reinforcing plate may be used to provide a rigid support for the flexible substrate. For example, the flexible substrate may use a polyester material such as polyimide. The reinforcing plate may be a metal, a polymer material, an inorganic non-metallic material, etc., which is not strictly limited in the embodiments of the present application.

[0065] The liquid cooling assembly 240 includes a first joint 241, a second joint 242, a first cold plate 243, a first driving pump 244 and a plurality of pipelines. The number of pipelines can be three, namely a first pipeline 245, a second pipeline 246 and a third pipeline 247. The first cold plate 243 has a flow channel for the liquid cooling medium to flow therein.

[0066] The first connector 241 is connected to one end of the first pipeline 245. The first connector 241 is also used to communicate with the heat exchange component 250. The end of the first pipeline 245 away from the first connector 241 is connected to the liquid inlet of the first drive pump 244. The liquid outlet of the first drive pump 244 is connected to the liquid inlet of the first cold plate 243 through the second pipeline 246. The liquid outlet of the first cold plate 243 is connected to the second connector 242 through the third pipeline 247.

[0067] It is understandable that the first cold plate 243 has a liquid cooling medium channel, and the liquid cooling medium flowing through the liquid cooling medium channel can take away the heat of the heating element 230. The first driving pump 244 can transfer the liquid cooling medium in the first pipeline 245 to the second pipeline 246. The first driving pump 244 can increase the flow rate of the liquid cooling medium, that is, it can make the liquid cooling medium flow quickly between the pipeline and the heat exchange component 250, so as to improve the heat dissipation efficiency of the first cold plate 243 to the heating element 230.

[0068] Specifically, the first joint 241 and the second joint 242 can be connected to the fourth plate 214 of the housing 210. At least part of the first joint 241 can be located in the first liquid inlet 2141. At least part of the second joint 242 can be located in the first liquid outlet 2142. The first pipeline 245, the second pipeline 246, the third pipeline 247, the first drive pump 244 and the first cold plate 243 are all located in the internal space 2100 of the housing 210. The first cold plate 243 can be connected to the heating element 230 on the main board 220. Exemplarily, the first cold plate 243 can be connected to the surface of the heating element 230 away from the main board 220.

[0069] It is understandable that the current server heating element 230 includes CPU, GPU, memory, power chip, etc. During the operation of the server, the heating element 230 will generate heat. The operation of the heating element 230 has strict temperature requirements to ensure the normal operation of the server.

[0070] Therefore, since the first cold plate 243 is in contact with the heating element 230, the heat of the heating element 230 can be transferred to the first cold plate 243. Since there is a liquid cooling medium flowing inside the first cold plate 243, the liquid cooling medium will continuously take away the heat of the first cold plate 243. Therefore, the first cold plate 243 can maintain its own relatively low temperature. As a result, the first cold plate 243 can take away a large amount of heat in the heating element 230 after contacting the heating element 230. In addition, the heating element 230 can work below a certain temperature. The operating stability of the heating element 230 is ensured.

[0071] See also Figure 4 , Figure 4 yes Figure 2 The heat exchange assembly 250 is shown in the figure. The heat exchange assembly 250 includes a heat exchanger 251, a first fan 252, a housing 253, a third joint 2512 and a fourth joint 2513. The housing 253 has a containing space, and the containing space of the housing 253 is used to contain the heat exchanger 251 and the fan 252. The heat exchanger 251 and the first fan 252 are both installed on the inner side of the housing 253, and the heat exchanger 251 and the first fan 252 are arranged opposite to each other.

[0072] Specifically, the housing 253 may include a housing body 2531 and an upper cover 2532. The housing body 2531 and the upper cover 2532 together form a containing space. The housing body 2531 includes a liquid outlet and a liquid inlet. For the convenience of description, the liquid outlet on the housing body 2531 is defined as the second liquid outlet 2514, and the liquid inlet on the housing body 2531 is defined as the second liquid inlet 2515.

[0073] The heat exchanger 251 may have a liquid cooling medium channel inside, and the liquid cooling medium may flow inside the heat exchanger 251 .

[0074] The third joint 2512 is connected to the second liquid outlet 2514 of the housing 253, and the fourth joint 2513 is connected to the second liquid inlet 2515 of the housing 253. The third joint 2512 and the fourth joint 2513 may be arranged on the same side of the housing 253. The third joint 2512 is connected to the liquid outlet of the heat exchanger 251 through a pipe, so as to communicate with the liquid cooling medium channel inside the heat exchanger 251. The fourth joint 2513 is connected to the liquid inlet of the heat exchanger 251 through another pipe, so as to communicate with the liquid cooling medium channel inside the heat exchanger 251.

[0075] In some possible implementations, the third joint 2512 may be directly connected to the liquid outlet of the heat exchanger 251 , and the third joint 2512 may pass through the second liquid outlet 2514 . The fourth joint 2513 may pass through the second liquid inlet 2515 on the housing 253 .

[0076] The heat exchange assembly 250 is installed on the rear side of the mounting frame 110. One heat exchange assembly 250 is arranged opposite to one computing node 201. In some possible implementations, the height of the heat exchange assembly 250 may be the same as the height of the box 210, or the height of the heat exchange assembly 250 is less than the height of the box 210. In other possible implementations, the heat exchange assembly 250 of the present application is not directly fixed to the rear side of the cabinet 100. In this case, the height of the heat exchange assembly 250 is not limited by the height of the cabinet 100 or the box 210. It should be noted that in the cabinet server 1000 provided in the present application, the number of heat exchange assemblies 250 can be the same as the number of computing nodes 201. And multiple heat exchange assemblies 250 are arranged in a one-to-one correspondence with multiple computing nodes 201. That is, one heat exchange assembly 250 is opposite to one computing node 201.

[0077] The first fan 252 is located on the side of the heat exchanger 251 away from the third joint 2512 and the fourth joint 2513, that is, the first fan 252 is located on the side of the heat exchanger 251 away from the box 210. The housing 253 is fixedly connected to the mounting frame 110, so that the heat exchanger 251 and the first fan 252 can be arranged in accordance with the position of the computing node 201.

[0078] It is understandable that the first fan 252 is used to increase the air circulation rate around the heat exchanger 251 so that the air can take away the heat of the heat exchanger 251, thereby gradually cooling the liquid cooling medium inside the heat exchanger 251. The number of first fans 252 can be set corresponding to the number of heat exchangers 251.

[0079] Specifically, see Figure 5 , Figure 5 yes Figure 4 The heat exchange assembly 250 shown is a schematic diagram of a structure installed in a cabinet 100. When the heat exchange assembly 250 is installed outside the cabinet 100 and fixedly connected to the rear side of the mounting frame 110. The position of the third joint 2512 of the heat exchange assembly 250 corresponds to the position of the first joint 241 of the box 210. The position of the fourth joint 2513 of the heat exchange assembly 250 corresponds to the position of the second joint 242 of the box 210. The box 210 can slide from the front side to the rear side of the cabinet 100. When the first joint 241 and the second joint 242 connected to the box 210 are close to the third joint 2512 and the fourth joint 2513, the first joint 241 can be directly blindly plugged with the third joint 2512. The first joint 241 is matched with the third joint 2512 and connected, and the first joint 241 and the third joint 2512 cooperate to form a quick joint. The second joint 242 can be directly blindly plugged with the fourth joint 2513. The second connector 242 is matched with the fourth connector 2513 for connection, and the second connector 242 and the fourth connector 2513 cooperate to form a quick connector.

[0080] That is, along the extension direction of the slide rail 120, the first joint 241 and the third joint 2512 are arranged opposite to each other and plugged, and the second joint 242 and the fourth joint 2513 are arranged opposite to each other and plugged. Thus, the first liquid inlet 2141 of the box body 210 is connected to the second liquid outlet 2514 of the heat exchanger 251, and the first liquid outlet 2142 of the box body 210 is connected to the second liquid inlet 2515 of the heat exchanger 251.

[0081] It is understandable that, since the space between the computing node 201 and the heat exchange assembly 250 is small or substantially free of gap, it is difficult for the operator to fix the first joint 241 with the third joint 2512, and the second joint 242 with the fourth joint 2513 in the gap between the computing node 201 and the heat exchange assembly 250. The first joint 241 provided in the present application can be blindly plugged with the third joint 2512, and the second joint 242 with the fourth joint 2513 can be blindly plugged. Thus, during the process of installing the computing node 201 in the cabinet, the first joint 241 and the third joint 2512, the second joint 242 and the fourth joint 2513 can be directly fixedly connected. This simplifies the connection method between the computing node 201 and the heat exchange assembly 250.

[0082] See also Figure 6 , Figure 6 yes Figure 2 Schematic diagram of the circulation of the liquid-cooling medium in the box 210 shown. After the first drive pump 244 is turned on, the liquid-cooling medium can circulate in the liquid cooling component 240. The first drive pump 244 can transfer the liquid-cooling medium in the first pipeline 245 to the second pipeline 246. The liquid-cooling medium can flow in from the liquid inlet of the first drive pump 244 and then flow out from the liquid outlet of the first drive pump 244. The liquid-cooling medium flowing out of the first drive pump 244 can flow into the liquid inlet of the first cold plate 243 through the second pipeline 246. Since the first cold plate 243 is in contact with the heating element 230, the liquid-cooling medium can absorb the heat of the heating element 230. The liquid-cooling medium flows from the liquid outlet of the first cold plate 243 through the third pipeline 247 to the heat exchanger 251. The liquid-cooling medium that absorbs the heat of the heating element 230 is cooled in the heat exchanger 251. The cooled liquid cooling medium flows again from the heat exchanger 251 through the first pipeline 245 to the first driving pump 244 to perform the next heat dissipation cycle.

[0083] It is understandable that in the prior art, generally a heat exchanger is provided for all servers in a cabinet, and the heat exchanger needs to perform heat exchange cooling on the liquid cooling medium of multiple servers in a cabinet. However, since the heat accumulation of multiple servers in the cabinet is different, and the circulation speed of the liquid cooling medium in each server is the same, the heat dissipation effect of the server with higher heating efficiency is obviously insufficient.

[0084] Please refer to Figure 1 , each individual computing node 201 of the present application is connected to a heat exchanger 251. Therefore, the computing node 201 of the present application can adjust the temperature of the liquid-cooling medium and the flow rate of the liquid-cooling medium by adjusting the power of its corresponding heat exchanger 251 individually. Specifically, the circulation rate of the liquid-cooling medium in each computing node 201 can be adjusted according to the temperature of the heating element 230. Thereby, the heat dissipation effect of the computing node 201 is better, and the temperature of a heating element 230 or a local area in the computing node 201 is prevented from being too high, causing the computing node 201 to fail to operate normally.

[0085] In addition, since the first driving pump 244 of the present application is separately arranged from the heat exchanger 251, the first driving pump 244 of the present application is closer to the heating element 230, and when the power of the first driving pump 244 is adjusted, the circulation speed of the liquid cooling medium in the liquid cooling assembly 240 can be more effectively adjusted. The circulation speed of the liquid cooling medium can directly affect the temperature of the first cold plate 243, thereby affecting the heat dissipation efficiency of the heating element 230.

[0086] For example, when the temperature of the heating element 230 of the server is too high, the power of the first driving pump 244 can be increased, so that the circulation rate of the liquid cooling medium is accelerated, thereby lowering the temperature of the first cold plate 243. The first cold plate 243 with a lower temperature can absorb more heat from the heating element 230, so that the heating element 230 can be cooled quickly. When the temperature of the heating element 230 is normal, the power of the first driving pump 244 can be appropriately reduced, thereby reducing the power consumption of the first driving pump 244 and reducing the noise generated by the first driving pump 244.

[0087] In some other implementations, the computing node 201 further includes a second fan 260 . The second fan 260 is located in the inner space of the box 210 , and the second fan 260 faces the heating element 230 .

[0088] It is understandable that the second fan 260 can blow air toward the heating element 230 to increase the air flow around the heating element 230 . The air flow can take away the heat of the heating element 230 , thereby cooling the heating element 230 .

[0089] For some other implementations, see Figure 7 , Figure 7 yes Figure 2 Another structural schematic diagram of a computing node 201 and a heat exchange component 250 is shown. The liquid cooling component 240 also includes a second cold plate 270 and a fourth pipeline 280. The second cold plate 270 has a flow channel for the liquid cooling medium to flow. The second cold plate 270 is connected to the first cold plate 243 through the fourth pipeline 280, and the second cold plate 270 is connected to the heat exchange component 250 through the third pipeline 247.

[0090] It is understandable that when the liquid cooling medium passes through the first cold plate 243, the liquid cooling medium absorbs the heat of the heating element 230 located under the first cold plate 243, thereby reducing the temperature of the heating element 230 and increasing the temperature of the liquid cooling medium itself. The temperature of the liquid cooling medium will gradually approach the temperature of the heating element 230 from a lower temperature.

[0091] When the accumulated heat of the heating element 230 in the computing node 201 is small, the temperature change of the liquid cooling medium is small and the temperature is low. At this time, the liquid cooling medium can also flow into the second cold plate 270 and cool the heating element 230 in contact with the second cold plate 270 .

[0092] Exemplarily, the liquid cooling assembly 240 further includes a second driving pump 290 and a fifth pipeline 300 . The second driving pump 290 is connected to the first cold plate 243 through the fourth pipeline 280 , and the second driving pump 290 is connected to the second cold plate 270 through the fifth pipeline 300 .

[0093] It is understandable that the second drive pump 290 can also regulate the flow rate of the liquid-cooling medium again. When the liquid inlet of the first cold plate 243 is connected to the first drive pump 244, and the liquid outlet of the first cold plate 243 is connected to the second drive pump 290, the first drive pump 244 and the second drive pump 290 can jointly adjust the flow rate of the liquid-cooling medium, thereby providing more power for the circulation of the liquid-cooling medium, so that the circulation speed of the liquid-cooling medium can be faster. The faster the flow rate of the liquid-cooling medium, the more heat it takes away in the same time, thereby making the heat dissipation efficiency of the heating element 230 faster.

[0094] See also Figure 8 , Figure 8 yes Figure 1 Another structural diagram of the cabinet server 1000 is shown. Figure 1 The difference between the cabinet server 1000 shown is that the heat exchange component 250 can also be located inside the cabinet 100. A heat exchange component 250 and a computing node 201 are installed in an installation space. The heat exchange component 250 can be located on one side of the fourth plate 214 of the box body 210. Exemplarily, the heat exchange component 250 can be fixed on the mounting frame 110, or the heat exchange component 250 can also be installed on 120 through a guide rail. Placing the heat exchange component 250 inside the cabinet 100 can make the overall structure of the cabinet server 1000 more concise. And make the overall installation stability of the cabinet server 1000 higher.

[0095] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A cabinet server, characterized in that: include: At least one computing node, comprising a box, a heating element and a liquid cooling component, wherein the heating element and the liquid cooling component are both located inside the box, the box is provided with a first liquid outlet and a first liquid inlet, the liquid cooling component comprises a first driving pump and a first cold plate, the first liquid inlet, the first driving pump, the first cold plate and the first liquid outlet are connected in sequence, and the first cold plate is in contact with the heating element; at least one heat exchange component, the heat exchange component comprising a housing, a heat exchanger and a first fan, the heat exchanger and the first fan are both mounted on the inner side of the housing, the heat exchanger and the first fan are arranged opposite to each other, the housing is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet is communicated with the first liquid outlet, the second liquid outlet is communicated with the first liquid inlet, the heat exchanger is communicated with the second liquid inlet and the second liquid outlet, so as to cool the liquid-cooled medium flowing from the first cold plate into the heat exchanger; and A cabinet, wherein the at least one computing node and the at least one heat exchange component are both installed in the cabinet.

2. The cabinet server according to claim 1, characterized in that: The number of the computing nodes is multiple, the number of the heat exchange components is the same as the computing nodes, and the multiple computing nodes are arranged in a one-to-one correspondence with the multiple heat exchange components.

3. The cabinet server according to claim 1 or 2, characterized in that: The liquid cooling assembly further comprises a first joint and a second joint, the first joint being connected to the first liquid inlet, and the second joint being connected to the first liquid outlet; The heat exchange assembly further includes a third joint and a fourth joint, the third joint is connected to the second liquid outlet, the fourth joint is connected to the second liquid inlet, the heat exchanger is connected to the second liquid inlet via a pipeline, and the heat exchanger is connected to the second liquid outlet via another pipeline; The first connector is matched and connected with the third connector, and the first connector and the third connector cooperate to form a quick connector. The second connector is matched and connected with the fourth connector, and the second connector and the fourth connector cooperate to form a quick connector.

4. The cabinet server according to claim 1 or 2, characterized in that: The liquid cooling assembly further comprises a first joint and a second joint, the first joint being connected to the first liquid inlet, and the second joint being connected to the first liquid outlet; The heat exchange assembly also includes a third joint and a fourth joint, the third joint and the fourth joint are both connected to the heat exchanger, the third joint passes through the second liquid outlet and is matched with the first joint, the first joint and the third joint cooperate to form a quick joint, the fourth joint passes through the second liquid inlet and is matched with the second joint, and the second joint and the fourth joint cooperate to form a quick joint.

5. The cabinet server according to any one of claims 1 to 4, characterized in that: The liquid cooling assembly also includes a first pipeline, a second pipeline and a third pipeline. The first pipeline connects the first driving pump with the first liquid inlet, the second pipeline connects the first driving pump with the flow channel of the first cold plate, and the third pipeline connects the flow channel of the first cold plate with the first liquid outlet.

6. The cabinet server according to any one of claims 1 to 5, characterized in that: The computing node further includes a second fan, which is located inside the box and faces the heating element.

7. The cabinet server according to any one of claims 1 to 6, characterized in that: The height of the heat exchange component is equal to the height of the computing node.

8. The cabinet server according to any one of claims 1 to 7, characterized in that: The cabinet also includes a mounting frame, which includes a plurality of mounting spaces, the mounting spaces are spaced apart along a height direction of the mounting frame, the computing nodes are installed in the mounting spaces, the heat exchange assembly is fixedly connected to the mounting frame, and the heat exchange assembly is located outside the mounting spaces.

9. The cabinet server according to any one of claims 1 to 7, characterized in that: The cabinet further includes a mounting frame, the mounting frame includes a plurality of mounting spaces, the mounting spaces are arranged at intervals along the height direction of the mounting frame, and one computing node and one heat exchange component are installed in one of the mounting spaces.

10. The cabinet server according to claim 8 or 9, characterized in that: The cabinet server also includes a slide rail, a slide rail is arranged in one of the installation spaces, the computing node is slidably connected to the slide rail, the computing node can slide along the extension direction of the slide rail, and along the extension direction of the slide rail, the heat exchange component is opposite to the computing node.

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