Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a first electrode layer, a pixel defining layer and an isolation structure. The first electrode layer is arranged on one side of the substrate, the pixel limiting layer is arranged on the side, away from the substrate, of the first electrode layer, and the isolation structure is arranged on the side, away from the substrate, of the pixel limiting layer. Wherein the pixel limiting layer comprises a pixel limiting part and a pixel opening, the pixel limiting part comprises a first side wall making contact with the first electrode layer, and the included angle between the first side wall and the plane where the substrate is located is a right angle.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin film electroluminescent device. It has attracted great attention and is widely used in electronic display products due to its advantages such as low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, current electronic display products face the problem of poor display effects, which needs to be solved. Summary of the invention

[0004] An object of the present invention is to provide a display panel and a method for manufacturing the same, and a display device, so as to solve the problem of poor display effect in existing electronic display products.

[0005] To achieve the above-mentioned object, the present invention provides a display panel, which includes a substrate, a first electrode layer, a pixel defining layer and an isolation structure. The first electrode layer is arranged on one side of the substrate, and the first electrode layer includes a plurality of first electrodes arranged at intervals. The pixel defining layer is arranged on the side of the first electrode layer away from the substrate, and the pixel defining layer includes a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion, the pixel openings are arranged corresponding to the first electrodes, and part of the first electrodes are exposed by the corresponding pixel openings. The isolation structure is arranged on the side of the pixel defining portion away from the substrate. The pixel defining portion includes a first side wall in contact with the first electrode, and the angle between the first side wall and the plane where the substrate is located is a right angle.

[0006] Further, along a direction perpendicular to the substrate, the height of the first side wall is less than or equal to 500 angstroms. Preferably, the height of the first side wall is greater than or equal to 200 angstroms.

[0007] Further, the pixel defining portion further comprises a second side wall connected to the first side wall away from the first electrode, the first side wall and the corresponding second side wall enclose the pixel opening, and the angle between the second side wall and the plane where the substrate is located is smaller than the angle between the first side wall and the plane where the substrate is located. Preferably, the angle between the second side wall and the plane where the substrate is located is less than 90 degrees. Preferably, the angle between the second side wall and the plane where the substrate is located is less than or equal to 30 degrees.

[0008] Further, the isolation structure encloses a plurality of isolation openings, the isolation openings are arranged corresponding to the pixel openings, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the corresponding isolation opening on the substrate. Preferably, the isolation structure includes a supporting layer and a blocking layer. The supporting layer is arranged on the side of the pixel defining portion away from the substrate. The blocking layer is arranged on the side of the supporting layer away from the substrate. The orthographic projection of the supporting layer on the substrate is located within the orthographic projection of the blocking layer on the substrate. Preferably, the supporting layer includes a first sub-support layer and a second sub-support layer. The second sub-support layer is located on the side of the first sub-support layer away from the substrate, and the orthographic projection of the first sub-support layer on the substrate is located within the orthographic projection of the second sub-support layer on the substrate. .

[0009] Furthermore, the pixel defining portion further includes a first surface correspondingly connected to the second side wall, and a third side wall connected to the first surface. The first surface is parallel to the plane where the substrate is located; the third side wall is perpendicular to the plane where the substrate is located. Preferably, along the direction perpendicular to the substrate, the height of the first side wall is equal to the height of the third side wall.

[0010] Further, an edge of an orthographic projection of the third side wall on the substrate overlaps with an orthographic projection of an edge of the barrier layer on the substrate.

[0011] Further, the materials of the support layer and the barrier layer include metal materials. Preferably, the material of the support layer includes at least one of aluminum and molybdenum, and the material of the barrier layer includes titanium. Preferably, the material of the first sub-support layer includes molybdenum, and the material of the second sub-support layer includes aluminum.

[0012] Furthermore, the display panel further includes a light-emitting layer and a second electrode layer. The light-emitting layer is arranged on a side of the first electrode layer away from the substrate, and the light-emitting layer includes a plurality of light-emitting units at least partially located in the corresponding pixel openings, and the light-emitting units cover the exposed surface of the first electrode in the corresponding pixel openings. The second electrode layer is arranged on a side of the light-emitting layer away from the substrate, and the second electrode layer includes a plurality of second electrodes, and the second electrodes are arranged on a side of the corresponding light-emitting unit away from the substrate and are electrically connected to the isolation structure. Preferably, the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection range of the corresponding second electrode on the substrate.

[0013] Furthermore, the display panel further comprises an encapsulation layer, the encapsulation layer is arranged on a side of the second electrode layer away from the substrate, the encapsulation layer comprises a plurality of encapsulation parts, the encapsulation parts are arranged corresponding to the light-emitting units. Preferably, the orthographic projection of the second electrode on the substrate is located within the orthographic projection range of the encapsulation part on the substrate.

[0014] Furthermore, the material of the pixel defining layer includes organic material.

[0015] The present invention also provides a display panel, which includes a substrate, a first electrode layer and a pixel defining layer. The first electrode layer is arranged on one side of the substrate, and the first electrode layer includes a plurality of first electrodes arranged at intervals. The pixel defining layer is arranged on the side of the first electrode layer away from the substrate, and the pixel defining layer includes a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion, the pixel openings are arranged corresponding to the first electrodes, and a portion of the first electrode is exposed by the corresponding pixel openings. The pixel defining portion includes a first side wall in contact with the first electrode, and the angle between the first side wall and the plane where the substrate is located is a right angle.

[0016] Further, along a direction perpendicular to the substrate, the height of the first side wall is less than or equal to 500 angstroms. Preferably, the height of the first side wall is greater than or equal to 200 angstroms.

[0017] Further, the pixel defining portion further comprises a second side wall connected to the first side wall away from the first electrode, the first side wall and the corresponding second side wall enclose the pixel opening, and the angle between the second side wall and the plane where the substrate is located is smaller than the angle between the first side wall and the plane where the substrate is located. Preferably, the angle between the second side wall and the plane where the substrate is located is less than 90 degrees. Preferably, the angle between the second side wall and the plane where the substrate is located is less than or equal to 30 degrees.

[0018] Furthermore, the display panel further comprises a light-emitting layer and a second electrode layer. The light-emitting layer is arranged on a side of the first electrode layer away from the substrate, and the light-emitting layer comprises a plurality of light-emitting units at least partially located in the corresponding pixel openings, and the light-emitting units cover the exposed surface of the first electrode in the corresponding pixel openings. The second electrode layer is arranged on a side of the pixel defining portion away from the substrate, and covers the light-emitting units.

[0019] Furthermore, the display panel further comprises an encapsulation layer, and the encapsulation layer is arranged on a side of the second electrode layer away from the substrate. Preferably, the material of the encapsulation layer comprises an inorganic material.

[0020] The present invention further provides a display device, which includes at least one of the display panels described above.

[0021] The present invention also provides a method for preparing a display panel, which comprises the following steps: preparing a substrate; forming a first electrode layer on one side of the substrate, the first electrode layer comprising a plurality of first electrodes arranged at intervals; forming a pixel defining material layer on the side of the first electrode layer away from the substrate; forming an isolation structure on the side of the pixel defining material layer away from the substrate; patterning the pixel defining material layer to form a pixel defining portion, the pixel defining portion enclosing a plurality of pixel openings. The pixel defining portion comprises a first side wall in contact with the first electrode, and the angle between the first side wall and the plane where the substrate is located is a right angle.

[0022] Furthermore, the step of forming a pixel defining material layer on the side of the first electrode layer away from the substrate includes: forming an initial pixel defining material layer on the side of the first electrode layer away from the substrate, and patterning the initial pixel defining material layer with a gray tone mask plate or a halftone mask plate to form the pixel defining material layer, wherein a groove is formed on the side of the pixel defining material layer away from the first electrode layer, and the depth of the groove is less than the thickness of the pixel defining material layer.

[0023] Further, the step of forming an isolation structure on the side of the pixel defining material layer away from the substrate includes: forming the support material layer on the side of the pixel defining layer away from the substrate; forming the barrier material layer on the side of the support material layer away from the substrate; and patterning the support material layer and the barrier material layer to form a plurality of isolation openings. Preferably, the step of patterning the pixel defining material layer to form a pixel defining portion includes: patterning the groove to form the pixel opening that penetrates the pixel defining material layer. Preferably, the groove is patterned to penetrate the pixel defining material layer by an ashing process.

[0024] Furthermore, the method for manufacturing the display panel further includes: forming a light-emitting unit on a side of the first electrode layer away from the substrate; and forming a second electrode on a side of the light-emitting unit away from the substrate. Preferably, the method for manufacturing the display panel further includes: forming an encapsulation portion on a side of the second electrode away from the substrate.

[0025] The advantages of the present invention are as follows: in a display panel and a preparation method thereof of the present invention, by redesigning the structure of its pixel defining layer, the first electrode layer is protected by retaining part of the material of the pixel defining layer in the preparation method, thereby preventing the first electrode layer from being corroded by the etching solution used in the subsequent process, thereby solving the problem of poor display effects such as dark spots on the display screen and improving the yield rate of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 is a schematic diagram of a layered structure of a display panel in an embodiment of the present invention;

[0028] Figure 2 for Figure 1 The enlarged schematic diagram of the panel structure is shown in the middle frame A;

[0029] Figure 3 is a schematic diagram of a layered structure of a display panel in another embodiment of the present invention;

[0030] Figure 4 for Figure 3 The enlarged schematic diagram of the panel structure is shown in the middle B frame;

[0031] Figure 5 is a schematic flow chart of a method for preparing a display panel in another embodiment of the present invention;

[0032] Figure 6 Schematic diagram of the layered structure of the display panel in step S30 in an embodiment of the present invention;

[0033] Figure 7 Schematic diagram of the layered structure after the pixel defining layer is patterned in step S30 in an embodiment of the present invention;

[0034] Figure 8 This is a schematic diagram of the layered structure after the protrusions are leveled in step S30 in an embodiment of the present invention;

[0035] Fig. 9 Schematic diagram of the top view of the pixel definition layer in step S30 in an embodiment of the present invention

[0036] Fig.10 is a schematic diagram of a layered structure of a display panel in step S40 in an embodiment of the present invention;

[0037] Fig.11 is a schematic diagram of a layered structure of a display panel in step S50 in an embodiment of the present invention;

[0038] Fig.12 is a schematic diagram of a layered structure of a display panel in step S50 in an embodiment of the present invention;

[0039] Fig.13is a schematic diagram of a layered structure of a display panel in step S60 in an embodiment of the present invention;

[0040] Fig.14 FIG. 4 is a schematic diagram of a layered structure of a display panel in step S70 in an embodiment of the present invention.

[0041] The components in the figure are shown as follows:

[0042] Display panels 1, 2; Substrates 110, 210;

[0043] First electrode layers 120, 220; First electrodes 121, 221;

[0044] Pixel defining layers 130, 230; Pixel defining portions 131, 231;

[0045] Pixel openings 132, 232; First side walls 1311, 2311;

[0046] Second side walls 1312, 2312; Third side walls 1313, 2313;

[0047] First surface 1314, 2314; Isolation structure 140;

[0048] Isolation opening 141; Support layer 142;

[0049] Blocking layer 143; Light-emitting layers 150, 250;

[0050] Light-emitting units 151, 251; Second electrode layers 160, 260;

[0051] Second electrodes 161, 261; Encapsulation layers 170, 270;

[0052] Packaging portion 171; Groove 132A;

[0053] Protrusion 132B; Pixel definition material layer 130';

[0054] Support material layer 142'; Barrier material layer 143'. DETAILED DESCRIPTION

[0055] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0056] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0057] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0058] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0059] In relevant display technologies, a wet etching process is required in the manufacturing process of the light-emitting film group. The etching solution used in the wet etching will simultaneously etch the film layer in the anode (such as the ITO film layer). The film layer avoided by the anode cannot completely play a shielding role and will damage the anode, resulting in a large number of dark spots, affecting the display effect of the display panel.

[0060] Based on the technical problems in the related display technologies, a display panel 1 is provided in an embodiment of the present invention. Figure 1As shown, the display panel 1 includes a substrate 110, a first electrode layer 120, a pixel defining layer 130 and an isolation structure 140. The substrate 110 is used to drive the light-emitting devices. Each light-emitting device is an independent pixel unit. Under the drive of the substrate 10, it can be turned on or off according to the corresponding display signal to provide a light source for the display panel 1; the pixel defining layer 130 is arranged on one side of the substrate, which is used to define the size of the self-luminous device; the isolation structure 140 is arranged on one side of the substrate 110, which is used to block the evaporated material and disconnect the evaporated materials in the adjacent isolation openings 141, thereby isolating a plurality of light-emitting devices. (The composition, preparation, etc. of the isolation structure mentioned below are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, Further descriptions are provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.)

[0061] The substrate 110 is an array substrate, which includes a plurality of thin film transistors arranged in an array, and the first electrode 121 in the first electrode layer 120 is electrically connected to at least one thin film transistor. A signal line is also provided in the substrate 110, one end of the signal line is electrically connected to the driver chip, and the other end of the signal line is electrically connected to the thin film transistor. The driver chip transmits the display signal to the corresponding thin film transistor through the signal line, and the thin film transistor turns on the corresponding light emitting device according to the display signal, and the display screen is formed by lighting up the light emitting device at the corresponding position. At the same time, the driver chip can also realize the change of the display screen by sending different display signals.

[0062] The first electrode layer 120 is disposed on one side of the substrate, and includes a plurality of first electrodes 121 . Each light emitting device is provided with a first electrode 121 , and is electrically connected to a corresponding thin film transistor through the first electrode 121 .

[0063] The pixel defining layer 130 is arranged on the side of the first electrode layer 120 away from the substrate 110, and includes a pixel defining portion 131 and a plurality of pixel openings 132 formed by the pixel defining portion 131. The pixel openings 132 are arranged one-to-one corresponding to the first electrodes 121, and part of the surface of the first electrode 121 is exposed in the corresponding pixel openings 132.

[0064] Furthermore, the display panel 1 further includes a light-emitting layer 150 and a second electrode layer 160. The light-emitting layer 150 is disposed on the side of the first electrode layer 120 away from the substrate 110, and includes a plurality of light-emitting units 151. A portion of each light-emitting unit 151 is located in the corresponding pixel opening 132, covers the exposed surface of the first electrode 121 in the pixel opening 132, and extends from the exposed surface of the first electrode 121 to the side of the pixel defining layer 130 away from the substrate 110. The second electrode 161 is stacked and disposed on the side of the light-emitting layer 150 away from the substrate 110, and includes a plurality of second electrodes 161. A second electrode 161 is correspondingly provided on each light-emitting unit 151, and the orthographic projection of the light-emitting unit 151 on the substrate 110 is located within the orthographic projection range of the second electrode 161 on the substrate 110, that is, the second electrode 161 covers the surface of the light-emitting unit 151 away from the substrate 110, and extends to the side wall of the isolation structure 140, and is electrically connected to the isolation structure 140. The light-emitting layer 150 and the second electrode 161 are isolated by the isolation structure 140 to form a plurality of light-emitting units 151 and a second electrode 161 at least partially located in the corresponding isolation openings 141, and the second electrode 161 can obtain a power signal by being electrically connected to the isolation structure 140. The first electrode 121 in the first electrode layer 120 is combined with the corresponding light-emitting unit 151 and the corresponding second electrode 161 to form a light-emitting device. The first electrode 121 and the second electrode 161 of the light-emitting device transmit electrons and holes to the light-emitting unit 151 respectively after electrical conduction. The electrons and holes are combined in the light-emitting unit 151 to form excitons, thereby converting electrical energy into light energy, prompting the light-emitting unit 151 to emit light, and lighting up the corresponding light-emitting device.

[0065] Specifically, Figure 2As shown in , the pixel defining portion 131 includes a first side wall 1311, a second side wall 1312, a first surface 1314 and a third side wall 1313. The first side wall 1311 contacts the surface of the first electrode 121 away from the substrate 110, and the angle between the first side wall 1311 and the plane where the substrate 110 is located is a right angle. One side of the second side wall 1312 is connected to the side of the first side wall 1311 away from the first electrode 121, and the angle between the second side wall 1312 and the plane where the substrate 110 is located is less than 90 degrees. One side of the first surface 1314 is connected to the side of the second side wall 1312 away from the first side wall 1311, and the first surface 1314 is parallel to the plane where the substrate 110 is located, that is, the first side wall 1311 and the first surface 1314 are perpendicular to each other. The third side wall 1313 is connected to the side of the first surface 1314 away from the second side wall 1312, and the third side wall 1313 is perpendicular to the plane where the substrate 110 is located, that is, the third side wall 1313 is also perpendicular to the first surface 1314, and is parallel to the first side wall 1311. The first side wall 1311 and the corresponding second side wall 1312 enclose a pixel opening 132, and a stepped pixel defining portion 131 structure is formed between the third side wall 1313, the first surface 1314 and the first side wall 1311. In the direction perpendicular to the plane where the substrate 110 is located, the height of the first side wall 1311 is equal to the height of the third side wall 1313, and the heights of the first side wall 1311 and the third side wall 1313 are both less than or equal to 500 angstroms. Preferably, the height of the first side wall 1311 and the third side wall 1313 is greater than or equal to 200 angstroms. For example, the height of the first side wall 1311 and the third side wall 1313 may be 250 angstroms, 300 angstroms or 400 angstroms.

[0066] Furthermore, the material of the pixel defining layer 130 includes an organic material. Since the organic material has better fluidity than the inorganic material, the angle between the second side wall 1312 of the pixel defining portion 131 and the plane where the substrate 110 is located can be reduced to 30 degrees or less, for example, the angle can be 25 degrees, 20 degrees or 15 degrees, etc., and the climbing difficulty of the second electrode 161 can be further reduced through a smaller side wall angle, and the risk of the second electrode 161 breaking can be reduced, effectively preventing the second electrode 161 from being disconnected on the side wall of the pixel opening 132. Specifically, the second side wall 1312 can be arc-shaped, so as to further reduce the climbing difficulty of the second electrode 161.

[0067] like Figure 1As shown in , the isolation structure 140 includes a support layer 142 and a barrier layer 143, the support layer 142 and the barrier layer 143 enclose an isolation opening 141, and the isolation opening 141 is connected to the corresponding pixel opening 132. The support layer 142 is arranged on the side of the pixel defining layer 130 away from the substrate 110, and the barrier layer 143 is stacked and arranged on the side of the support layer 142 away from the substrate 110. The materials of the support layer 142 and the barrier layer 143 include metal materials, and the material of the support layer 142 can be selected from at least one of aluminum and molybdenum, and the material of the barrier layer 143 can be selected from titanium. One end of the blocking layer 143 protrudes toward the isolation opening 141 and is arranged with the supporting layer 142, that is, the orthographic projection of the supporting layer 142 on the substrate 110 is located within the orthographic projection of the blocking layer 143 on the substrate 110, so that the blocking layer 143 can completely cover the supporting layer 142, and thus when preparing the light-emitting layer 150, it can prevent the material of the light-emitting layer 150 from being evaporated onto the supporting layer 142. When preparing the second electrode 161, by adjusting the evaporation angle of the second electrode 161 material, the coverage area of ​​the second electrode 161 can be made larger than the coverage area of ​​the light-emitting unit 151, so that the second electrode 161 extends from the surface of the light-emitting unit 151 to the side wall of the supporting layer 142 facing the isolation opening 141, so that the second electrode 161 can be electrically connected to the supporting layer 142. The cross-sectional profile of the support layer 142 located between two adjacent isolation openings 141 is trapezoidal, and the width of the support layer 142 close to the blocking layer 143 is smaller than the width close to the substrate 110, so as to facilitate the climbing of the second electrode 161 and reduce the difficulty of overlapping between the second electrode 161 and the support layer 142.

[0068] Further, the support layer 142 includes a first sub-support layer and a second sub-support layer, the second sub-support layer is located on a side of the first sub-support layer away from the substrate 110, and the first sub-support layer is within the orthographic projection on the substrate 110. The material of the first sub-support layer includes molybdenum, and the material of the second sub-support layer includes aluminum. The electrical connection performance between the support layer 242 and the second electrode 161 can be improved by providing the first sub-support layer 2.

[0069] like Figure 1As shown in , the display panel also includes an encapsulation layer 170, which is arranged on the side of the second electrode 161 away from the substrate 110. The encapsulation layer 170 includes a plurality of encapsulation parts 171, which are arranged one by one with the light-emitting units 151, and extend from the surface of the second electrode 161 away from the substrate 110 to the surface of the barrier layer 143 away from the substrate 110, so that the orthographic projections of the second electrode 161 and the light-emitting unit 151 on the substrate 110 are located within the orthographic projection range of the encapsulation part 171 on the substrate 110, so that the encapsulation part 171 can encapsulate and protect the light-emitting device, and prevent water and oxygen from invading and corroding the light-emitting device. The material of the encapsulation layer 170 includes inorganic materials, such as silicon oxide (SiOx) and silicon nitride (SiNx).

[0070] Another embodiment of the present invention further provides a display panel 2, such as Figure 3 As shown in , the display panel 2 includes a substrate 210, a first electrode layer 220 and a pixel defining layer 230. The substrate 210 is used to drive the light-emitting device. Each light-emitting device is an independent pixel unit. Under the drive of the substrate 210, it can be turned on or off according to the corresponding display signal to increase the light for the display panel 2. The pixel defining layer 230 is arranged on one side of the substrate 210, which is used to define the size of the self-luminous device.

[0071] The substrate 210 is an array substrate, which includes a plurality of thin film transistors arranged in an array, and the first electrode 221 in the first electrode layer 220 is electrically connected to at least one thin film transistor. A signal line is also provided in the substrate, one end of the signal line is electrically connected to the driver chip, and the other end of the signal line is electrically connected to the thin film transistor. The driver chip transmits the display signal to the corresponding thin film transistor through the signal line, and the thin film transistor turns on the corresponding light emitting device according to the display signal, and the display screen is formed by lighting up the light emitting device at the corresponding position. At the same time, the driver chip can also realize the change of the display screen by sending different display signals.

[0072] The first electrode layer 220 is disposed on one side of the substrate 210 , and includes a plurality of first electrodes 221 . Each light emitting device is provided with a first electrode 221 , and is electrically connected to a corresponding thin film transistor through the first electrode 221 .

[0073] The pixel defining layer 230 is arranged on the side of the first electrode layer 220 away from the substrate 210, and includes a pixel defining portion 231 and a plurality of pixel openings 232 formed by the pixel defining portion 231. The pixel openings 232 are arranged one-to-one corresponding to the first electrode 221, and part of the surface of the first electrode 221 is exposed in the corresponding pixel openings 232.

[0074] Furthermore, the display panel 2 further includes a light-emitting layer 250 and a second electrode layer 260. The light-emitting layer 250 is disposed on the side of the first electrode layer 220 away from the substrate 210, and includes a plurality of light-emitting units 251. A portion of each light-emitting unit 251 is located in the corresponding pixel opening 232, covering the exposed surface of the first electrode 221 in the pixel opening 232. The second electrode layer 260 is stacked and disposed on the side of the pixel defining portion 231 away from the substrate 210, and covers the surface of the light-emitting unit 251 away from the substrate 210. The first electrode 221 in the first electrode layer 220 is combined with the corresponding light-emitting unit 251 and the corresponding second electrode layer 260 to form a light-emitting device. After being electrically conductive, the first electrode 221 and the second electrode layer 260 of the light-emitting device respectively transmit electrons and holes to the light-emitting unit 251, and the electrons and holes are combined in the light-emitting unit 251 to form excitons, thereby converting electrical energy into light energy, prompting the light-emitting unit 251 to emit light, and lighting up the corresponding light-emitting device. In an embodiment of the present invention, the second electrode layer 260 is a conductive film layer that is evaporated on the entire surface. In other embodiments of the present invention, the second electrode layer 260 may be disconnected by a partition structure such as an isolation structure 240 or an undercut structure.

[0075] Specifically, Figure 4As shown in , the pixel defining portion 231 includes a first side wall 2311, a second side wall 2312, a first surface 2314 and a third side wall 2313. The first side wall 2311 contacts the surface of the first electrode 221 away from the substrate 210, and the angle between the first side wall 2311 and the plane where the substrate 210 is located is a right angle. One side of the second side wall 2312 is connected to the side of the first side wall 2311 away from the first electrode 221, and the angle between the second side wall 2312 and the plane where the substrate 210 is located is less than 90 degrees. One side of the first surface 2314 is connected to the side of the second side wall 2312 away from the first side wall 2311, and the first surface 2314 is parallel to the plane where the substrate 210 is located, that is, the first side wall 2311 and the first surface 2314 are perpendicular to each other. The third side wall 2313 is connected to the side of the first surface 2314 away from the second side wall 2312, and the third side wall 2313 is perpendicular to the plane where the substrate 210 is located, that is, the third side wall 2313 is also perpendicular to the first surface 2314, and is parallel to the first side wall 2311. The first side wall 2311 and the corresponding second side wall 2312 enclose a pixel opening 232, and a stepped pixel defining portion 231 structure is formed between the third side wall 2313, the first surface 2314 and the first side wall 2311. The stepped pixel defining portion 231 structure can reduce the slope of the side wall of the pixel opening 232, thereby reducing the climbing difficulty of the second electrode 261 in the second electrode layer 260, and preventing the second electrode 261 from breaking on the side wall of the pixel opening 232. In a direction perpendicular to the plane where the substrate 210 is located, the height of the first side wall 2311 is equal to the height of the third side wall 2313, and the heights of the first side wall 2311 and the third side wall 2313 are both less than or equal to 500 angstroms. Preferably, the heights of the first side wall 2311 and the third side wall 2313 are greater than or equal to 200 angstroms, for example, the heights of the first side wall 2311 and the third side wall 2313 may be 250 angstroms, 300 angstroms, or 400 angstroms.

[0076] Furthermore, the material of the pixel defining layer 230 includes organic material. Since organic material has better fluidity than inorganic material, the angle between the second side wall 2312 of the pixel defining portion 231 and the plane where the substrate 210 is located can be reduced to 30 degrees or below. For example, the angle can be 25 degrees, 20 degrees or 15 degrees, etc. The smaller side wall angle can further reduce the difficulty of the second electrode 261 in climbing, reduce the risk of the second electrode 261 breaking, and effectively prevent the second electrode 261 from being disconnected on the side wall of the pixel opening 232.

[0077] like Figure 3As shown in , the display panel 2 also includes an encapsulation layer 70, and the encapsulation layer 170 covers the surface of the second electrode layer 260 away from the substrate 210. The encapsulation part is used to encapsulate and protect the light-emitting device to prevent water and oxygen from invading and corroding the light-emitting device. The material of the encapsulation layer 170 includes inorganic materials, such as silicon oxide (SiOx) and silicon nitride (SiNx). Furthermore, the encapsulation layer 170 can be prepared by TFE (Thin Film Encapsulation), that is, the encapsulation layer 170 can include at least two inorganic film layers and at least one organic film layer located between the adjacent inorganic film layers on both sides.

[0078] Another embodiment of the present invention further provides a display device, which may be an OLED display device, comprising the display panel 1 or the display panel 2 as described above, and the display panel 1 or the display panel 2 may be used to display image information for the display device. The display device may be any display device with a display function, such as a mobile phone, a laptop computer, a tablet computer, a car display, etc.

[0079] Another embodiment of the present invention further provides a method for preparing a display panel 1, which is used to prepare the display panel 1 as described above. The process of the method for preparing the display panel 1 is as follows: Figure 5 As shown in , it includes steps S10-S80.

[0080] Step S10 ) Preparing the substrate 110 : Forming the substrate 110 including a plurality of thin film transistors through an array process.

[0081] Step S20) forming a first electrode layer 120 on one side of the substrate 110: depositing a layer of conductive material on the surface of the substrate 110 to form the first electrode layer 120; patterning the first electrode layer 120 by an etching process, thereby forming a plurality of first electrodes 121 spaced apart in the first electrode layer 120; wherein the conductive material in the first electrode layer 120 may include at least one of a metal and a metal oxide, which may be a single-layer metal structure formed by a single material through a single deposition process, or a stacked structure formed by multiple different materials through multiple deposition processes; for example, the first electrode layer 120 may be an indium tin oxide / silver / indium tin oxide (ITO / Ag / ITO) stacked structure, an indium tin oxide / silver (ITO / Ag) stacked structure, a titanium / aluminum / titanium (Ti / Al / Ti) stacked structure, etc.

[0082] Step S30) forming a pixel defining material layer 130' on the side of the first electrode layer 120 away from the substrate 110: depositing a layer of insulating material on the substrate 110 to form an initial pixel defining material layer; forming a pixel defining material layer 130' on the side of the initial pixel defining material layer away from the first electrode layer 120 by photolithography. Figure 6The pixel defining material layer 130' shown in the figure has a groove 132A, and the groove 132A does not penetrate the pixel defining material layer 130', that is, the depth of the groove 132A is less than the thickness of the pixel defining material layer 130', and the bottom surface of the groove 132A is located on the side of the surface of the pixel defining layer 130 facing the substrate 110 away from the substrate 110; wherein, the insulating material used in the pixel defining material layer 130' can be an organic material, such as polyimide or an organic flat glue (that is, the same organic glue as the flat layer in the substrate 110).

[0083] Specifically, the step of forming the groove 132A on the pixel defining material layer 130' by photolithography includes: etching a plurality of protrusions 132B on the surface of the pixel defining material layer 130' away from the first electrode layer 120 by a gray-tone mask; Figure 7 and Figure 8 As shown in , the protrusions 132B extend along the first direction X and are arranged along the second direction Y perpendicular to the first direction X. The orthographic projection of the protrusions 132B on the substrate 110 may be a thin strip shape such as a rectangle or an ellipse extending along the first direction X. There is a depression between two adjacent protrusions 132B. Since the material used in the pixel defining material layer 130' is an organic material, according to the fluidity of the organic material, the protrusions 132B flow to the depressions on both sides thereof and automatically level, forming a structure as shown in FIG. Fig. 9 The bottom surface of the groove 132A shown in FIG. 1 is flat. The thickness of the pixel defining material layer 130' is less than or equal to 8000 angstroms, and the depth of the groove 132A is less than or equal to 7000 angstroms, that is, the groove 132A retains at least 1000 angstroms of organic material within the orthographic projection range on the pixel defining material layer 130', so that the first electrode layer 120 can be protected in the subsequent process, and the etching solution used in the subsequent film patterning can be prevented from corroding the first electrode layer 120, effectively reducing the damage to the first electrode layer 120 in the subsequent process, thereby improving the product yield. For example, the thickness of the pixel defining material layer 130' can be 7000 angstroms or 7500 angstroms, and the depth of the groove 132B can be 5000 angstroms or 6000 angstroms.

[0084] Further, in another embodiment of the present invention, a plurality of grooves 132A can be etched on the surface of the initial pixel defining material layer away from the first electrode layer 120 by a half-tone mask. The half-tone mask has a light-shielding area and a semi-transparent area. The light-shielding area can be set corresponding to the area where the pixel defining portion 131 needs to be formed, and the semi-transparent area can be set corresponding to the position where the groove 132A needs to be formed, and exposure, development, etching and other processes are performed to pattern the groove 132A on the initial pixel defining material layer. Specifically, in this embodiment, the semi-transparent area of ​​the half-tone mask can be set corresponding to the position where the groove 132A needs to be formed, and the transmittance of the semi-transparent area of ​​the half-tone mask is less than 100% and greater than 0%. Preferably, the transmittance of the semi-transparent area of ​​the half-tone mask can be one of 30%, 40% or 50%.

[0085] Step S40) forming an isolation structure 140 on the side of the pixel defining material layer 130' away from the substrate 110: depositing a layer of metal material on the surface of the pixel defining layer material 130' away from the substrate 110 to form a support material layer 142'; depositing a layer of metal material on the surface of the support material layer 142' away from the substrate 110 to form a barrier material layer 143'; patterning the support material layer 142' and the barrier material layer 143' in sequence to form a Fig.10 There are multiple isolation openings 141 penetrating the supporting material layer 142' and the blocking material layer 143', the isolation openings 141 are arranged one by one corresponding to the grooves 132A, and the remaining supporting material layer 142' and the blocking material layer 143' form the supporting layer 142 and the blocking layer 143; wherein the deposition thickness of the supporting material layer 142' is greater than the deposition thickness of the blocking material layer 143'.

[0086] Step S50) patterning the pixel defining material layer 130' to form a pixel defining portion 131 and a plurality of pixel openings 132: performing secondary patterning on the pixel defining material layer 130', removing the pixel defining material layer 130' in the orthographic projection area of ​​the groove 132A on the substrate 110, to form Fig.12 The pixel defining portion 131 and the pixel opening 132 that passes through the pixel defining portion 131 are shown in the figure; preferably, since the pixel defining material layer 130' is made of organic material, the secondary patterning of the pixel defining material layer 130' can be performed by an ashing process, and the isolation structure 140 made of a metal material is used as a mask, so there is no need to set up an additional mask for patterning, thereby saving a mask and reducing production costs.

[0087] Specifically, Fig.11As shown in FIG. 1 , when the pixel defining layer 130 is subjected to secondary patterning by an ashing process, the pixel defining layer material 130' located directly below the groove 132A is completely removed, thereby forming a first sidewall 1311 perpendicular to the plane where the substrate 110 is located. To prevent the isolation structure 140 from affecting the preparation of the light emitting layer 150, the diameter of the isolation opening 141 is larger than the diameter of the pixel opening 132, as shown in FIG. Fig.12 As shown in , the pixel defining material layer 130' around the groove 132A cannot be blocked by the isolation structure 140, so the unblocked pixel defining material layer 130' will be removed during the ashing process, so that the thickness of the pixel defining portion 131 located within the orthographic projection range of the isolation structure 140 on the substrate 110 is greater than the thickness of the pixel defining portion 130 located outside the orthographic projection range of the isolation structure 140 on the substrate 110, thereby forming a step-shaped pixel defining portion 131. The orthographic projection of the third side wall 1313 of the pixel defining portion 131 of the step-shaped structure parallel to the first side wall 1311 on the substrate 110 overlaps with the orthographic projection of the edge of the barrier layer 143 on the substrate 110. Further, the third side wall 1313 and the side wall of the barrier layer 143 may be located in the same plane.

[0088] Step S60) forming a light emitting unit 151 on the side 132 of the first electrode layer 120 away from the substrate 110: depositing or printing a layer of organic material in the pixel opening 132 to form a light emitting unit 151 as shown in FIG. Fig.13 The light-emitting layer 150 shown in the figure is divided into a plurality of light-emitting units 151 by an isolation structure 140; wherein the orthographic projection of the light-emitting unit 151 on the substrate 110 overlaps with the orthographic projection of the pixel opening 132 on the substrate 110, and does not overlap with the orthographic projection of the supporting layer 142 on the substrate 110, that is, the deposition range of the material of the light-emitting unit 151 covers the exposed surface of the first electrode 131 in the pixel opening 132, and is smaller than the orthographic projection range of the isolation opening 141, thereby ensuring that the light-emitting unit 151 can be in contact and connected with the corresponding first electrode 121, and remains disconnected from the supporting layer 142.

[0089] Step S70) forming a second electrode 161 on the side of the light emitting unit 151 away from the substrate 110: depositing a layer of conductive material in the isolation opening 132 to form a Fig.14 The second electrode layer 160 shown in the figure is separated into a plurality of second electrodes 161 by the isolation structure 140. When depositing the second electrode 161, the deposition angle can be adjusted to make the deposition range of the second electrode 161 larger than the deposition range of the light-emitting unit 151, so that the second electrode 161 in the same isolation opening 141 can cover the light-emitting unit 151 and extend from the surface of the light-emitting unit 151 to the side wall of the support layer 142, thereby making the second electrode 161 electrically connected to the support layer 142.

[0090] Step S80) forming an encapsulation portion on the side of the second electrode 161 away from the substrate 110: depositing one or more layers of encapsulation material on the side of the second electrode layer 160 away from the substrate 110 to form an encapsulation layer 170, the encapsulation layer comprising a plurality of encapsulation portions, the encapsulation portions extending from the surface of the second electrode layer 160 away from the substrate 110 to the side of the barrier layer 143 away from the substrate 110, thereby forming Figure 1 The display panel 1 shown in FIG.

[0091] In the display panel provided by the embodiment of the present invention, the side wall slope of the pixel opening / pixel defining portion is improved by redesigning the structure of the pixel defining layer, so as to facilitate the climbing of the second electrode layer and prevent the second electrode layer from breaking on the side wall of the pixel opening / pixel defining portion. Secondly, in the preparation process of the display panel, the first electrode layer can be protected by retaining part of the material of the pixel defining layer to prevent the first electrode layer from being corroded by the etching solution used in the subsequent process, thereby solving the problem of poor display effects such as dark spots on the display screen and improving the yield rate of the display panel. At the same time, when removing the residual pixel defining layer material, the material used in the pixel defining layer can be removed by an ashing process, so that the use of a photomask can be reduced in the preparation method of the display panel, thereby reducing the production process and reducing the production cost.

[0092] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display panel, characterized in that: include: substrate; A first electrode layer, disposed on one side of the substrate, the first electrode layer comprising a plurality of first electrodes disposed at intervals; a pixel defining layer, disposed on a side of the first electrode layer away from the substrate, the pixel defining layer comprising a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion, the pixel openings being disposed corresponding to the first electrode, and a portion of the first electrode being exposed by the corresponding pixel opening; An isolation structure, disposed on a side of the pixel defining portion away from the substrate; The pixel defining portion includes a first side wall in contact with the first electrode, and an angle between the first side wall and a plane where the substrate is located is a right angle.

2. The display panel according to claim 1, wherein: In a direction perpendicular to the substrate, a height of the first side wall is less than or equal to 500 angstroms; Preferably, the height of the first sidewall is greater than or equal to 200 angstroms.

3. The display panel according to claim 1, wherein: The pixel defining portion further includes a second side wall connected to a side of the first side wall away from the first electrode, the first side wall and the corresponding second side wall enclose the pixel opening, and an angle between the second side wall and the plane where the substrate is located is smaller than an angle between the first side wall and the plane where the substrate is located; Preferably, the angle between the second side wall and the plane where the substrate is located is less than 90 degrees; Preferably, an angle between the second side wall and the plane where the substrate is located is less than or equal to 30 degrees.

4. The display panel according to claim 3, wherein: The isolation structure encloses a plurality of isolation openings, the isolation openings are arranged corresponding to the pixel openings, and the orthographic projections of the pixel openings on the substrate are located within the orthographic projections of the corresponding isolation openings on the substrate; Preferably, the isolation structure comprises: A supporting layer, disposed on a side of the pixel defining portion away from the substrate; A barrier layer, disposed on a side of the support layer facing away from the substrate; Wherein, the orthographic projection of the support layer on the substrate is located within the orthographic projection of the barrier layer on the substrate; Preferably, the support layer comprises: a first sub-support layer; The second sub-support layer is located at a side of the first sub-support layer away from the substrate, and an orthographic projection of the first sub-support layer on the substrate is located within an orthographic projection of the second sub-support layer on the substrate.

5. The display panel according to claim 4, wherein: The pixel defining portion further includes a first surface correspondingly connected to the second side wall, and a third side wall connected to the first surface; Wherein, the first surface is parallel to the plane where the substrate is located; the third side wall is perpendicular to the plane where the substrate is located; Preferably, along a direction perpendicular to the substrate, a height of the first side wall is equal to a height of the third side wall.

6. The display panel according to claim 5, wherein: An edge of an orthographic projection of the third side wall on the substrate overlaps with an orthographic projection of an edge of the barrier layer on the substrate.

7. The display panel according to claim 4, wherein: The materials of the support layer and the barrier layer include metal materials; Preferably, the material of the support layer includes at least one of aluminum and molybdenum, and the material of the barrier layer includes titanium; Preferably, the material of the first sub-support layer includes molybdenum, and the material of the second sub-support layer includes aluminum.

8. The display panel according to claim 7, wherein: Also includes: A light-emitting layer, disposed on a side of the first electrode layer away from the substrate, the light-emitting layer comprising a plurality of light-emitting units at least partially located in the corresponding pixel openings, the light-emitting units covering the exposed surface of the first electrode in the corresponding pixel openings; A second electrode layer, disposed on a side of the light-emitting layer away from the substrate, the second electrode layer comprising a plurality of second electrodes, the second electrodes being disposed on a side of the corresponding light-emitting unit away from the substrate and electrically connected to the isolation structure; Preferably, the orthographic projection of the light emitting unit on the substrate is located within the orthographic projection range of the corresponding second electrode on the substrate.

9. The display panel according to claim 8, wherein: Also includes: An encapsulation layer, disposed on a side of the second electrode layer away from the substrate, the encapsulation layer comprising a plurality of encapsulation parts, and the encapsulation parts are disposed corresponding to the light-emitting units; Preferably, the orthographic projection of the second electrode on the substrate is located within the orthographic projection range of the packaging portion on the substrate.

10. The display panel according to claim 1, wherein: The material of the pixel defining layer includes an organic material.

11. A display panel, characterized in that: include: substrate; A first electrode layer, disposed on one side of the substrate, the first electrode layer comprising a plurality of first electrodes disposed at intervals; a pixel defining layer, disposed on a side of the first electrode layer away from the substrate, the pixel defining layer comprising a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion, the pixel openings being disposed corresponding to the first electrode, and a portion of the first electrode being exposed by the corresponding pixel opening; The pixel defining portion includes a first side wall in contact with the first electrode, and an angle between the first side wall and a plane where the substrate is located is a right angle.

12. The display panel according to claim 11, wherein: In a direction perpendicular to the substrate, a height of the first side wall is less than or equal to 500 angstroms; Preferably, the height of the first sidewall is greater than or equal to 200 angstroms.

13. The display panel according to claim 11, wherein: The pixel defining portion further includes a second side wall connected to a side of the first side wall away from the first electrode, the first side wall and the corresponding second side wall enclose the pixel opening, and an angle between the second side wall and the plane where the substrate is located is smaller than an angle between the first side wall and the plane where the substrate is located; Preferably, the angle between the second side wall and the plane where the substrate is located is less than 90 degrees; Preferably, an angle between the second side wall and the plane where the substrate is located is less than or equal to 30 degrees.

14. The display panel according to claim 11, wherein: Also includes: A light-emitting layer, disposed on a side of the first electrode layer away from the substrate, the light-emitting layer comprising a plurality of light-emitting units at least partially located in the corresponding pixel openings, the light-emitting units covering the exposed surface of the first electrode in the corresponding pixel openings; The second electrode layer is arranged on a side of the pixel defining portion away from the substrate and covers the light emitting unit.

15. The display panel according to claim 14, wherein: Also includes: an encapsulation layer, disposed on a side of the second electrode layer away from the substrate; Preferably, the material of the encapsulation layer includes inorganic material.

16. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-10; or, comprising a display panel as described in any one of claims 11-15.

17. A method for preparing a display panel, characterized in that: include: preparing a substrate; forming a first electrode layer on one side of the substrate, wherein the first electrode layer includes a plurality of first electrodes arranged at intervals; forming a pixel defining material layer on a side of the first electrode layer facing away from the substrate; forming an isolation structure on a side of the pixel defining material layer facing away from the substrate; Patterning the pixel defining material layer to form a pixel defining portion, wherein the pixel defining portion encloses a plurality of pixel openings; The pixel defining portion includes a first side wall in contact with the first electrode, and an angle between the first side wall and a plane where the substrate is located is a right angle.

18. The method for manufacturing a display panel according to claim 17, wherein: The step of forming a pixel defining material layer on a side of the first electrode layer facing away from the substrate comprises: An initial pixel defining material layer is formed on the side of the first electrode layer away from the substrate, and the initial pixel defining material layer is patterned using a gray tone mask plate or a half tone mask plate to form the pixel defining material layer, wherein a groove is formed on the side of the pixel defining material layer away from the first electrode layer, and the depth of the groove is less than the thickness of the pixel defining material layer.

19. The method for preparing a display panel according to claim 18, wherein: The step of forming an isolation structure on a side of the pixel defining material layer away from the substrate includes: forming the support material layer on a side of the pixel defining layer away from the substrate; forming the barrier material layer on a side of the support material layer facing away from the substrate; patterning the support material layer and the barrier material layer to form a plurality of isolated openings; Preferably, the step of patterning the pixel defining material layer to form a pixel defining portion includes: patterning the groove to form the pixel opening penetrating the pixel defining material layer; Preferably, the groove is patterned by an ashing process to form the pixel opening penetrating the pixel defining material layer.

20. The method for preparing a display panel according to claim 17, wherein: Also includes: forming a light-emitting unit on a side of the first electrode layer away from the substrate; forming a second electrode on a side of the light emitting unit away from the substrate; Preferably, the method for manufacturing the display panel further comprises: forming a packaging portion on a side of the second electrode facing away from the substrate.

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