Preparation method of copper-titanium composite belt and copper-titanium composite belt

Abstract

The invention relates to the technical field of metal compounding, in particular to a preparation method of a copper-titanium composite belt and the copper-titanium composite belt. The preparation method comprises the following steps: grinding a bonding surface between a copper plate and a titanium plate; and heating the copper plate and the titanium plate to enable the temperature of the copper plate to reach a first temperature and the temperature of the titanium plate to reach a second temperature. According to the preparation method, a copper plate and a titanium plate are respectively heated to a first temperature and a second temperature; in order to mutually compound a copper plate and a titanium plate, the temperature of a crystallization critical point set by a process needs to be reached, and the copper plate can be softened or warped in a high-temperature environment, so that excessive stress is generated in the copper plate, and the mutual compounding quality of the copper plate and the titanium plate is influenced. The copper plate and the titanium plate are respectively controlled at different temperatures, so that the two plates respectively reach proper temperatures, and the interfaces of the two materials are deformed through local deformation stress, so that the effect of better combining the interface layers is achieved, and the copper-titanium composite belt with the characteristics of higher strength and better conductivity is further obtained.

Description

Technical Field

[0001] The present application relates to the field of metal composite technology, and in particular to a preparation method of a copper-titanium composite belt and a copper-titanium composite belt. Background Art

[0002] With the upgrading and iteration of electronic products, the demand for metal materials in current electronic and electrical products is getting higher and higher. A material with high strength and good conductivity can better meet this demand and satisfy the manufacturing requirements of electronic and electrical products.

[0003] In the related art, it is difficult for metal materials to have both high strength and good electrical conductivity. Summary of the invention

[0004] The main purpose of the present invention is to provide a preparation method of a copper-titanium composite belt and a copper-titanium composite belt to solve the problem that it is difficult for metal materials to have both high strength and good electrical conductivity.

[0005] To achieve the above object, the present invention provides a method for preparing a copper-titanium composite strip, comprising: Grinding the bonding surface between the copper plate and the titanium plate; Heating the copper plate and the titanium plate so that the temperature of the copper plate reaches a first temperature and the temperature of the titanium plate reaches a second temperature, wherein the first temperature is not equal to the second temperature; stacking the copper plate and the titanium plate along the thickness direction of the copper plate; rolling the copper plate and the titanium plate to form a composite plate; The composite plate is subjected to a first annealing treatment.

[0006] The method for preparing the copper-titanium composite strip according to the embodiment of the present application has at least the following beneficial effects: The preparation method of the embodiment of the present application heats the copper plate and the titanium plate to a first temperature and a second temperature respectively before rolling the copper plate and the titanium plate. The copper plate and the titanium plate are different in material, and the manifestation at different temperatures is also different. In order to compound the copper plate and the titanium plate, it is necessary to reach the temperature of the critical point of crystallization set by the process, and the copper plate may soften or warp in a high temperature environment, thereby causing excess stress inside the copper plate, affecting the quality of the copper plate and the titanium plate. The copper plate and the titanium plate are controlled at different temperatures respectively, so that the two plates each reach a suitable temperature, and the interface of the two materials is deformed by local deformation and stress, so as to achieve the effect of better combination of the interface layer, and then obtain a copper-titanium composite belt with high strength and good conductivity. Furthermore, grinding the bonding surface between the copper plate and the titanium plate to increase the roughness of the bonding surface can increase the connection strength of the copper plate and the titanium plate after rolling to a certain extent, and the composite quality between the copper plate and the titanium plate is high.

[0007] In some embodiments, the first temperature ranges from 50°C to 120°C, and / or the second temperature ranges from 760°C to 820°C.

[0008] In some embodiments, the step of rolling the copper plate and the titanium plate to form a composite plate comprises: driving the copper plate and the titanium plate through rollers at a preset speed to form the composite plate; Wherein, the preset speed ranges from 0.5m / min to 1.5m / min.

[0009] In some embodiments, the sum of the thicknesses of the copper plate and the titanium plate is the initial thickness, and the ratio of the difference between the initial thickness and the thickness of the composite plate to the initial thickness is 45% to 60%.

[0010] In some embodiments, the step of subjecting the composite plate to a first annealing treatment comprises: The composite plate is heated until the temperature reaches 740°C to 760°C.

[0011] In some embodiments, after the first annealing treatment of the composite plate, the preparation method further comprises: Performing a first rolling on the composite plate; The composite plate is subjected to a second annealing treatment.

[0012] In some embodiments, the step of performing a first rolling on the composite plate includes: a ratio of a difference between a thickness of the composite plate before rolling and a thickness of the composite plate after rolling to a thickness of the composite plate before rolling is in a range of 30% to 35%.

[0013] In some embodiments, after the first annealing treatment of the composite plate, the preparation method further comprises: The composite sheet is passivated.

[0014] In some embodiments, the step of passivating the composite plate comprises: spraying a passivating agent on the composite plate; The composite plate is driven to pass through a drying channel.

[0015] The embodiment of the present application also provides a copper-titanium composite strip, which is prepared by any one of the above-mentioned preparation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 This is a schematic flow chart of a method for preparing a copper-titanium composite strip according to the first embodiment of the present application; Figure 2 This is a schematic diagram of a process for preparing a copper-titanium composite strip according to a second embodiment of the present application; Figure 3 A schematic diagram of a process for preparing a copper-titanium composite strip according to a third embodiment of the present application; Figure 4 Schematic diagram of the process of preparing the copper-titanium composite strip according to the fourth embodiment of the present application.

[0018] Figure 5 A cross-sectional view of a copper-titanium composite strip according to an embodiment of the present application; Figure 6 This is a simplified structural diagram of a copper-titanium composite strip according to an embodiment of the present application.

[0019] Description of Figure Numbers: 100, copper plate layer; 200, titanium plate layer.

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification of this application and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions.

[0023] In the description of the embodiments of the present application, the technical terms "first", "second", "third", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0024] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0025] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0026] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "top", "bottom", "upper", and "lower" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description. They do not indicate or imply that the referred device or element must have a specific orientation, be constructed, operated, or used in a specific orientation. Therefore, they should not be understood as limitations on the embodiments of the present application.

[0027] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0028] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the technical term "contact" should be understood in a broad sense, and may be direct contact or contact through an intermediate medium layer. It may be contact with essentially no interaction force between the two contacting parties, or it may be contact with interaction force between the two contacting parties.

[0029] In the related technology, titanium alloy materials are usually used for the requirements of higher strength, and pure copper strips are usually used for the requirements of high conductivity. However, with the current update and iteration of electronic appliances, the demand for the characteristics of metal materials is increasing, and a metal material that can take into account both good conductivity and high strength is urgently needed.

[0030] In the embodiment of the present application, the copper plate and the titanium plate are heated to the first temperature and the second temperature respectively, so that the copper plate and the titanium plate are at a relatively suitable temperature before contacting the roller, and then the copper plate and the titanium plate are composited into a composite plate. The composite quality between the copper plate and the titanium plate is good, and the connection strength is high.

[0031] This application provides a method for preparing a copper-titanium composite strip. Figure 1 , the preparation method comprises: Step S1: grinding the bonding surface between the copper plate and the titanium plate; Step S2: heating the copper plate and the titanium plate so that the temperature of the copper plate reaches a first temperature and the temperature of the titanium plate reaches a second temperature, and the first temperature is not equal to the second temperature; Step S3: stacking the copper plate and the titanium plate along the thickness direction of the copper plate; Step S4: rolling the copper plate and the titanium plate to form a composite plate; Step S5: performing a first annealing treatment on the composite plate.

[0032] The bonding surface refers to the large surface facing each other between the copper plate and the titanium plate, for example, the surface of the copper plate facing the titanium plate and the surface of the titanium plate facing the copper plate.

[0033] Grinding refers to rubbing the bonding surface with a tool to increase the roughness of the bonding surface. For example, the bonding surface between the copper plate and the titanium plate is ground so that the roughness of the bonding surface is greater than or equal to 1.6.

[0034] It should be noted that the embodiment of the present application does not limit the number of copper plates and titanium plates. For example, the number of copper plates and titanium plates can be single. Alternatively, the number of copper plates is two, the number of titanium plates is one, and the two copper plates and the titanium plate are stacked in the order of copper plate, titanium plate, and copper plate along the thickness direction of the copper plate.

[0035] In the scheme of the embodiment of the present application, the preparation method heats the copper plate and the titanium plate to the first temperature and the second temperature respectively before rolling the copper plate and the titanium plate. The copper plate and the titanium plate are different in material, and the manifestation at different temperatures is also different. In order to compound the copper plate and the titanium plate, it is necessary to reach the temperature of the critical point of crystallization set by the process, and the copper plate may soften or warp in a high temperature environment, thereby causing excess stress inside the copper plate, affecting the quality of the copper plate and the titanium plate. The copper plate and the titanium plate are controlled at different temperatures respectively, so that the two plates each reach a suitable temperature, and the interface of the two materials is deformed by local deformation and stress, so as to achieve the effect of better combination of the interface layer, and then obtain a copper-titanium composite belt with high strength and good conductivity. Furthermore, grinding the bonding surface between the copper plate and the titanium plate to increase the roughness of the bonding surface can increase the connection strength of the copper plate and the titanium plate after rolling to a certain extent, and the composite quality between the copper plate and the titanium plate is high.

[0036] In one embodiment, the step of rolling the copper plate and the titanium plate to form a composite plate includes: introducing a reducing atmosphere into a closed space where the copper plate and the titanium plate are located. The introduction of a reducing atmosphere into the space where the copper plate and the titanium plate are located can reduce the bonding surface of the ground materials, reduce the influence of the oxide layer on the bonding surface on the composite process, and thus increase the bonding strength between the copper plate and the titanium plate.

[0037] Illustratively, the reducing atmosphere may be ammonia gas.

[0038] In one embodiment, the first temperature ranges from 50°C to 120°C, and / or the second temperature ranges from 760°C to 820°C.

[0039] Exemplarily, the first temperature is 50° C., 55° C., 58° C., 65° C., 80° C., 90° C., 100° C., 110° C., 118° C. or 120° C. It is understood that the first temperature can be measured by a temperature sensor under normal pressure.

[0040] Exemplarily, the second temperature is 760° C., 780° C., 790° C., 800° C., 810° C. or 820° C. It can be understood that the first temperature can be measured by a temperature sensor under normal pressure.

[0041] In the scheme of the embodiment of the present application, the first temperature within a suitable range can not only reduce the generation of water vapor on the surface of the copper plate during the rolling process, but also reduce the warping and prestressing of the copper plate. The second temperature within a suitable range can enable the copper plate and the titanium plate to quickly reach the vicinity of the eutectic temperature point during the composite process, thereby increasing the bonding quality and preparation efficiency of the copper plate and the titanium plate. In the process of composite between the copper plate and the titanium plate, the titanium plate and the copper plate fit each other, and the heat of the titanium plate can be quickly transferred to the copper plate through heat conduction, so that the temperature of the copper plate rises rapidly, thereby realizing the composite of the copper plate and the titanium plate into one.

[0042] It should be noted that the applicant discovered in the experiment of compounding the copper plate and the titanium plate that when the copper plate is compounded with the titanium plate at room temperature, a layer of water vapor will be generated on the bonding surface of the copper plate, thereby affecting the composite quality of the copper plate and the titanium plate, and the connection strength is poor or even difficult to compound. When the copper plate is heated to a higher temperature, the copper material will be stretched and warped, and the bonding surface will be deformed in a wavy shape, making it difficult for the copper material to be combined with the titanium plate.

[0043] It is understandable that after the copper plate and the titanium plate are stacked, they are pressed by rollers to form a composite. The speed at which the copper plate and the titanium plate move the rollers will also affect the composite quality of the copper plate and the titanium plate. If the speed at which the copper plate and the titanium plate are driven to move is high, the speed at which the copper plate and the titanium plate deform will also be high, which may cause the copper plate and the titanium plate to break, and it is difficult for the copper plate and the titanium plate to generate a bonding force, resulting in a low connection strength between the copper plate and the titanium plate, or even failure to connect.

[0044] In one embodiment, please refer to Figure 2 The steps of rolling the copper plate and the titanium plate to form a composite plate include: Step S40: driving the copper plate and the titanium plate through rollers at a preset speed to form a composite plate; Among them, the preset speed range is 0.5m / min~1.5m / min.

[0045] Exemplarily, the preset speed is 0.5 m / min, 0.7 m / min, 1.0 m / min, 1.3 m / min or 1.5 m / min.

[0046] In the solution of the embodiment of the present application, driving the copper plate and the titanium plate through the rollers at a suitable speed can give the copper plate and the titanium plate enough time to be combined into one, so that the connection strength between the copper plate and the titanium plate is relatively high. Furthermore, driving the copper plate and the titanium plate to move at a relatively fast speed can increase the manufacturing efficiency of the copper-titanium composite strip to a certain extent and speed up the production cycle.

[0047] It is understandable that other embodiments of the present application do not limit the speed at which the copper plate and the titanium plate are driven to pass through the rollers.

[0048] It can be understood that after the copper plate and the titanium plate are stacked in the thickness direction and then rolled by rollers, the rollers can exert a force perpendicular to the large surface on the copper plate and the titanium plate, thereby making the copper plate and the titanium plate compound with each other, and the total thickness of the copper plate and the titanium plate will also be reduced.

[0049] In one embodiment, the sum of the thicknesses of the copper plate and the titanium plate is the initial thickness, and the ratio of the difference between the initial thickness and the thickness of the composite plate to the initial thickness is 45% to 60%.

[0050] Initial thickness refers to the total thickness of the copper plate and titanium plate after they are stacked in the thickness direction before rolling. For example, when there are two copper plates and one titanium plate, the initial thickness is the sum of the thicknesses of the three plates before rolling. The difference between the initial thickness and the thickness of the composite plate and the ratio of the initial thickness can reflect the deformation of the copper plate and titanium plate after rolling.

[0051] Exemplarily, the ratio of the difference between the initial thickness and the thickness of the composite plate to the initial thickness is 45%, 46%, 50%, 55%, 57% or 60%.

[0052] In the scheme of the embodiment of the present application, the ratio of the difference between the initial thickness and the thickness of the composite plate to the initial thickness is within an appropriate range, which can make the connection strength between the titanium plate and the copper plate higher, thereby facilitating subsequent processing steps and reducing the situation where the titanium plate and the copper plate are broken by the rolling roller during the rolling process.

[0053] It is understandable that other embodiments of the present application do not limit the size of the ratio of the difference between the initial thickness and the thickness of the combined plate to the initial thickness.

[0054] It is understandable that after the copper plate and the titanium plate are rolled to form a composite plate, the brittleness and hardness of the copper plate and the titanium plate will be increased to a certain extent, and a certain stress will be generated inside the copper plate and the titanium plate, which may affect the mechanical properties of the composite plate. Annealing can release the internal stress of the combined plate, reduce the hardness of the composite plate, improve the plasticity and toughness of the composite plate, and facilitate subsequent processing and forming.

[0055] In one embodiment, please refer to Figure 2 The steps of the first annealing treatment of the composite plate include: Step S50: heating the composite plate until the temperature reaches 740°C to 760°C.

[0056] Exemplarily, in the step of performing the first annealing treatment on the composite plate, the composite plate is heated until the temperature reaches 740°C, 750°C or 760°C.

[0057] For example, in the step of performing the first annealing treatment on the composite plate, the holding time at any point of the composite plate is in the range of 0.7 min to 1.2 min. The holding time of the composite plate in the annealing step is within a suitable range so that the composite plate can fully eliminate the internal stress and reduce the increase of the brittleness of the composite plate.

[0058] In the solution of the embodiment of the present application, the temperature of the first annealing treatment of the composite plate can be within a suitable range to refine the grains of the metal plate, thereby further improving the toughness of the material and reducing the occurrence of cracks in the composite plate during processing. It can also reduce the energy consumption required during the annealing process and improve energy utilization efficiency.

[0059] It can be understood that other embodiments of the present application do not limit the temperature of the composite plate during the annealing process.

[0060] It is understandable that the thickness of the composite plate obtained by compositing the copper plate and the titanium plate is smaller than the initial thickness. In order to obtain a metal material with a smaller thickness, the composite plate can be further rolled.

[0061] In one embodiment, please refer to Figure 3 After the composite plate is subjected to the first annealing treatment, the preparation method further comprises: Step S6: performing the first rolling on the composite plate; Step S7: performing a second annealing treatment on the composite plate.

[0062] For example, in the step of performing a second annealing on the composite plate, the composite plate is heated until the temperature reaches 740° C. to 760° C. The metal properties of the copper plate and the titanium plate after rolling to form the composite plate tend to be stable, and the annealing temperature after the additional rolling of the composite plate is basically the same, so that the internal stress of the composite plate can be better released, and the toughness and plasticity of the composite plate can be increased.

[0063] In the solution of the embodiment of the present application, after the composite plate is formed, the composite plate can be further rolled to further extend the composite plate to obtain a thinner composite plate, so as to adapt to various use conditions. After the composite plate is rolled for the first time, the composite plate is subjected to a second annealing treatment to reduce the hardness of the composite plate, release the internal stress of the composite plate, and reduce the brittle fracture of the composite plate.

[0064] It is understandable that in the process of compositing the copper plate and the titanium plate, the thickness of the copper plate and the titanium plate has been compressed to a certain extent by the rollers. In the process of rolling the composite plate multiple times, the composite plate is more likely to break than in the process of compositing the copper plate and the titanium plate.

[0065] In one embodiment, the step of performing the first rolling on the composite plate includes: the ratio of the difference between the thickness of the composite plate before rolling and the thickness of the composite plate after rolling to the thickness of the composite plate before rolling is in the range of 30% to 35%.

[0066] Exemplarily, in the step of performing the first rolling on the composite plate, the ratio of the difference between the thickness of the composite plate before rolling and the thickness of the composite plate after rolling to the thickness of the composite plate before rolling is 30%, 31%, 32%, 33%, 34% or 35%. It can be understood that the ratio of the difference between the thickness of the composite plate before rolling and the thickness of the composite plate after rolling to the thickness of the composite plate before rolling can reflect the deformation of the composite plate after the first rolling.

[0067] In the solution of the embodiment of the present application, the deformation of the composite plate in the first rolling step can increase the preparation efficiency to a certain extent within an appropriate range, so that the composite plate can approach the target thickness more quickly, and can reduce the occurrence of fracture of the composite plate during the rolling process. Furthermore, the copper plate and the titanium plate have already produced a certain degree of strain after rolling. In order to reduce the composite plate to reach the maximum allowable strain more quickly and reduce the internal stress generated by the composite plate during the rolling process, the deformation of the composite plate during the rolling process is less than the deformation of the copper plate and the titanium plate during the compounding process.

[0068] For example, in order to reduce the impact of impurities generated during the composite process of the copper plate and the titanium plate on subsequent processes of the composite plate, the preparation method further includes a step of surface cleaning the composite plate before the first rolling step of the composite plate.

[0069] In one embodiment, please refer to Figure 3 After the composite plate is subjected to the first annealing treatment, the preparation method further comprises: Step S8: passivating the composite board.

[0070] Passivation refers to the process of forming a very thin and dense oxide film or compound film on the surface of a metal plate through a specific chemical or electrochemical treatment process. This film can effectively prevent the metal from further chemically reacting with the surrounding environment (such as air, water, acid, alkali, etc.), thereby significantly improving the corrosion resistance of the metal.

[0071] For example, when the composite plate has multiple rolling steps, the step of passivating the composite plate is located after the last annealing step, that is, the passivation is performed when the thickness of the composite plate reaches the target thickness.

[0072] In the scheme of the embodiment of the present application, the preparation method also includes passivating the composite plate. After passivation, a thin film can be formed on the surface of the composite plate, thereby reducing the degree of oxidation on the surface of the composite plate and reducing rust on the surface of the composite plate, thereby increasing the service life of the copper-titanium composite belt.

[0073] In one embodiment, please refer to Figure 4 , the steps of passivating the composite plate include: Step S80: spraying a passivating agent on the composite plate; Step S81: driving the composite board through a drying channel.

[0074] Exemplarily, the passivator is a copper passivator.

[0075] Exemplarily, the temperature in the drying channel ranges from 85° C. to 95° C. When the composite board passes through the drying channel, any part of the composite board is located in the drying channel for a time greater than or equal to 5 seconds.

[0076] In the solution of the embodiment of the present application, after the passivator is sprayed on the composite plate, the composite plate needs to be driven through drying, so that the passivator can adhere to the surface of the composite plate quickly and more evenly, thereby further increasing the protective effect of the passivator on the composite plate.

[0077] It is understandable that during the rolling process of the composite plate, the deformation of the composite plate needs to be limited to reduce the occurrence of fracture of the composite plate during the rolling process. In order to obtain a thinner copper-titanium composite strip, the composite plate can be rolled multiple times.

[0078] Exemplarily, after the step of performing a second annealing treatment on the composite plate, the preparation method further comprises: Step S9: rolling the composite plate for the second time; Step S10: cutting the composite plate; Step S11: performing a third annealing treatment on the composite plate; Step S12: rolling the composite plate for the third time; Step S13: performing a fourth annealing treatment on the composite plate.

[0079] It is understandable that in the steps of the second rolling and the third rolling of the combination, the deformation of the composite plate after rolling is between 30% and 35%. And in the process of the third annealing treatment and the fourth annealing treatment of the composite plate, the annealing temperature ranges from 740°C to 760°C. In the process of cutting the composite plate, the flash and burrs of the composite plate can be removed to a certain extent, the appearance quality of the composite plate can be improved, and the potential safety hazards in the processing process can be reduced.

[0080] The embodiment of the present application also provides a copper-titanium composite strip, which is prepared by any of the above-mentioned preparation methods.

[0081] For example, see Figure 5 and Figure 6 The copper-titanium composite strip includes a copper plate layer 100 and a titanium plate layer 200 .

[0082] The ratio of the copper plate layer 100 to the copper-titanium composite strip can be adjusted according to actual needs. For example, along the thickness direction of the copper-titanium composite strip, the ratio of the size of the copper plate layer 100 to the size of the copper-titanium composite strip ranges from 5% to 30%.

[0083] For example, the thickness direction of the copper-titanium composite strip is as follows: Figure 5 The direction indicated by the arrow R1.

[0084] The thickness direction of the copper-titanium composite belt refers to the direction perpendicular to the large surface of the copper-titanium composite belt. It can be understood that the surface area of ​​the large surface of the copper-titanium composite belt is much larger than the surface area of ​​the copper-titanium composite belt in other directions, and the copper-titanium composite belt has two large surfaces along the thickness direction.

[0085] It is understood that the embodiments of the present application do not limit the number of copper plate layers 100 and titanium plate layers 200. In one embodiment, the number of copper plate layers 100 and titanium plate layers 200 can be single. In another embodiment, the number of copper plate layers 100 is two, the number of titanium plate layers 200 is single, and along the thickness direction of the copper-titanium composite strip, the titanium plate layer 200 is located between the two copper plate layers 100.

[0086] Exemplarily, the thickness of the copper-titanium composite strip ranges from 0.07 mm to 0.50 mm.

[0087] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application is described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of protection.

Claims

1. A method for preparing a copper-titanium composite belt, characterized in that: include: Grinding the bonding surface between the copper plate and the titanium plate; Heating the copper plate and the titanium plate so that the temperature of the copper plate reaches a first temperature and the temperature of the titanium plate reaches a second temperature, wherein the first temperature is not equal to the second temperature; stacking the copper plate and the titanium plate along the thickness direction of the copper plate; rolling the copper plate and the titanium plate to form a composite plate; The composite plate is subjected to a first annealing treatment.

2. The preparation method according to claim 1, characterized in that: The first temperature ranges from 50°C to 120°C, and / or the second temperature ranges from 760°C to 820°C.

3. The preparation method according to claim 1, characterized in that: The step of rolling the copper plate and the titanium plate to form a composite plate comprises: driving the copper plate and the titanium plate through rollers at a preset speed to form the composite plate; Wherein, the preset speed ranges from 0.5m / min to 1.5m / min.

4. The preparation method according to claim 1, characterized in that: The sum of the thicknesses of the copper plate and the titanium plate is the initial thickness, and the ratio of the difference between the initial thickness and the thickness of the composite plate to the initial thickness is 45% to 60%.

5. The preparation method according to claim 1, characterized in that: The steps of first annealing the composite plate include: The composite plate is heated until the temperature reaches 740°C to 760°C.

6. The preparation method according to any one of claims 1 to 5, characterized in that: After the composite plate is subjected to the first annealing treatment, the preparation method further comprises: Performing a first rolling on the composite plate; The composite plate is subjected to a second annealing treatment.

7. The preparation method according to claim 5, characterized in that: The step of rolling the composite plate for the first time includes: the ratio of the difference between the thickness of the composite plate before rolling and the thickness of the composite plate after rolling to the thickness of the composite plate before rolling is in the range of 30% to 35%.

8. The preparation method according to any one of claims 1 to 5, characterized in that: After the composite plate is subjected to the first annealing treatment, the preparation method further comprises: The composite sheet is passivated.

9. The preparation method according to claim 8, characterized in that: The step of passivating the composite plate comprises: spraying a passivating agent on the composite plate; The composite plate is driven to pass through a drying channel.

10. Copper-titanium composite belt, characterized in that: The method is prepared according to any one of claims 1 to 9.

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