FPC hollowed-out circuit board preparation process

Abstract

The invention discloses an FPC hollowed-out circuit board preparation process, which comprises the following steps of cutting, cutting, drilling, hole blackening, copper plating, dry film pasting, alignment exposure, developing, etching, fitting, laminating and patching, and is characterized in that an auxiliary chip mounter used for patching comprises a workbench and a patching device, the workbench is provided with a material preparation table, one side of the material preparation table is provided with a leveling plate, and the other side of the material preparation table is provided with an auxiliary chip mounter; a reserved opening is formed in the lower side of the material preparation table, a recycling opening fixed to the bottom of the workbench is arranged at the bottom of the reserved opening, and the surface mounting device comprises a transmission assembly, an air cylinder and a negative pressure grabbing assembly. The invention belongs to the technical field of FPC (flexible printed circuit) board preparation, and provides an FPC hollow circuit board preparation process, specifically, an auxiliary chip mounter is used in the process, so that the use of manpower can be greatly reduced, the production efficiency is improved, the FPC board after chip mounting can be pressed and leveled by arranging a leveling plate, and the production efficiency is improved. By arranging the transmission assembly, the air cylinder and the negative pressure grabbing assembly, taking and pasting are achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of FPC circuit board preparation, and in particular relates to a process for preparing an FPC hollow circuit board. Background Art

[0002] FPC circuit boards (flexible circuit boards) are currently widely used in mobile phones, digital cameras, laptops, avionics and medical equipment due to their advantages of being light, small, thin, bendable and easy to assemble. FPC hollow circuit boards can achieve double-sided conduction on the basis of a single layer and are particularly widely used, but due to current technical limitations, the industry uses traditional manufacturing processes.

[0003] Flexible circuit board is a kind of printed circuit board with high reliability and excellent flexibility made of polyimide or polyester film as the base material. It is called soft board or FPC for short, and has the characteristics of high wiring density, light weight and thin thickness. It is mainly used in many products such as mobile phones, laptops, PDAs, digital cameras, LCMs, etc. According to the characteristics of the material of flexible circuit board and its wide application fields, in order to save volume more effectively and achieve a certain degree of accuracy, the three-dimensional characteristics and thin thickness are better applied to digital products, mobile phones and laptops.

[0004] During the production process, FPC products need to be mounted on the carrier board. Currently, manual mounting is generally used. Since the work is relatively delicate and intensive, it requires high standards from workers. Therefore, not only is the production efficiency low, but the production cost is also high. Summary of the invention

[0005] In view of the above situation, in order to overcome the defects of the prior art, the purpose of the present invention is to provide a new equipment and process that uses artificial patches on the outside of sanitary ware, which is more delicate and intensive, and has higher requirements on workers. Therefore, it not only has low production efficiency but also high production cost.

[0006] The technical solution adopted by the present invention is as follows:

[0007] A process for preparing a FPC hollow circuit board comprises the following steps:

[0008] Step 1: Use a fully automatic cutting machine to cut the original coil into the required size.

[0009] Step 2: Drill through holes for circuit connection, use chemicals to make carbon powder adhere to the hole wall to form a conductive layer, and spray copper plating.

[0010] Step 3: Paste a photosensitive dry film on the surface of the copper-plated board as a film for pattern transfer, and use film negatives to transfer to the board surface dry film through the principle of light imaging.

[0011] Step 4: The dry film in the unexposed area is developed with potassium carbonate, leaving the dry film pattern in the exposed area. The area where the copper surface is exposed after the circuit pattern is developed is corroded by etching solution, leaving the pattern covered by the dry film.

[0012] Step 5: Use optical inspection equipment to detect line problems.

[0013] Step 6: Cover the copper foil circuit with a layer of protective film and then press it together to prevent the circuit from oxidation or short circuit.

[0014] Step 7: Use the auxiliary placement machine to paste auxiliary materials on the board according to customer requirements.

[0015] Furthermore, the original coiled material includes a substrate, a covering film, and an electromagnetic film.

[0016] Furthermore, the adhesive auxiliary materials include but are not limited to PI, electromagnetic shielding film, FR4, steel sheet, adhesive and other auxiliary materials.

[0017] Furthermore, the auxiliary placement machine includes a workbench and a placement device, the placement device is mounted on the workbench through a lifting frame, the workbench is provided with a material preparation table, a leveling plate is provided on one side of the material preparation table, a reserved opening is provided on the lower side of the material preparation table, and a recycling price fixed to the bottom of the workbench is provided at the bottom of the reserved opening, the placement device includes a transmission assembly, a cylinder and a negative pressure grabbing assembly, the transmission assembly is mounted on the upper side of the workbench through a lifting frame, the cylinder is fixed on the transmission assembly, and the negative pressure grabbing assembly is arranged on the workbench and the cylinder.

[0018] Furthermore, the transmission assembly includes a screw mounting frame, a transmission motor, a screw and a slider with a nut. The screw mounting frame is mounted on a workbench through a lifting frame, the transmission motor is fixed on one side of the screw mounting frame, one end of the screw is rotatably mounted on the screw mounting frame, and the other end is fixedly connected to an output shaft of the transmission motor. The slider with a nut is threadedly connected to the screw and slides relative to the screw mounting frame, and the cylinder is fixed on the slider with a nut.

[0019] Furthermore, the negative pressure grabbing assembly includes a negative pressure suction pump and a suction cup, the negative pressure suction pump is fixed on the workbench, the suction cup is fixed to the bottom of the cylinder through a mounting bracket, and the negative pressure suction pump and the suction cup are connected by a pipe fitting.

[0020] After adopting the above technical solution, the beneficial effects of the present invention are as follows:

[0021] By using auxiliary placement machines in the process, the use of manpower can be greatly reduced and production efficiency can be improved. By setting up a leveling plate, the FPC circuit board after placement can be pressed and leveled. By setting up transmission components, cylinders and negative pressure grabbing components, picking and pasting can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a process flow chart of an FPC hollow circuit board and its preparation process provided by the present invention;

[0024] Figure 2 It is a schematic diagram of the overall structure of an FPC hollow circuit board and an auxiliary chip mounter used in its preparation process provided by the present invention;

[0025] Figure 3 It is a structural schematic diagram of another angle of an FPC hollow circuit board and an auxiliary chip mounter used in a preparation process thereof provided by the present invention;

[0026] Figure 4 It is a structural schematic diagram of an FPC hollow circuit board and an auxiliary chip mounter used in a preparation process thereof provided by the present invention from a third angle;

[0027] Figure 5 yes Figure 2 A partial enlarged view of the . DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention are clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] A process for preparing a FPC hollow circuit board comprises the following steps:

[0030] Step 1: Use a fully automatic cutting machine to cut the original coils such as substrate, covering film, electromagnetic film, etc. into the required size.

[0031] Step 2: Drill through holes for circuit connection, use chemicals to make carbon powder adhere to the hole wall to form a conductive layer, and spray copper plating.

[0032] Step 3: Paste a photosensitive dry film on the surface of the copper-plated board as a film for pattern transfer, and use film negatives to transfer to the board surface dry film through the principle of light imaging.

[0033] Step 4: The dry film in the unexposed area is developed with potassium carbonate, leaving the dry film pattern in the exposed area. The area where the copper surface is exposed after the circuit pattern is developed is corroded by etching solution, leaving the pattern covered by the dry film.

[0034] Step 5: Use optical inspection equipment to detect line problems.

[0035] Step 6: Cover the copper foil circuit with a layer of protective film and then press it together to prevent the circuit from oxidation or short circuit.

[0036] Step 7: Use the auxiliary placement machine to paste PI, electromagnetic shielding film, FR4, steel sheet, adhesive and other auxiliary materials on the board according to customer requirements.

[0037] The auxiliary placement machine includes a workbench 1 and a placement device 2. The placement device 2 is mounted on the workbench 1 through a lifting frame 7. A preparation table 3 is provided on the workbench 1. A leveling plate 4 is provided on one side of the preparation table 3. A reserved opening 5 is provided on the lower side of the preparation table 3. A recycling price 6 fixed to the bottom of the workbench 1 is provided at the bottom of the reserved opening 5. The placement device 2 includes a transmission component 8, a cylinder 9 and a negative pressure grabbing component 10. The transmission component 8 is mounted on the upper side of the workbench 1 through a lifting frame 7. The cylinder 9 is fixed to the transmission component 8. On the workbench 1, the negative pressure grabbing component 10 is arranged on the workbench 1 and the cylinder 9. After the transmission component 8 is running, the cylinder 9 can be moved back and forth between the preparation table 3 and the workbench 1. The expansion and contraction of the cylinder 9 can contact the patch and the substrate. The operation of the negative pressure grabbing component 10 can realize the picking and pasting of the patch, ensuring the entire process and reducing manual use. The patched material is placed between the workbench 1 and the leveling plate 4 for leveling. After leveling, it passes through the reserved opening 5 and falls into the recycling price 6 for recycling.

[0038] In order to realize the switching of workstations, the transmission assembly 8 includes a screw mounting frame 11, a transmission motor 12, a screw 13 and a slider with a nut 14. The screw mounting frame 11 is mounted on the workbench 1 through the lifting frame 7, the transmission motor 12 is fixed on one side of the screw mounting frame 11, one end of the screw 13 is rotatably arranged on the screw mounting frame 11 and the other end is fixedly connected to the output shaft of the transmission motor 12, the slider with a nut 14 is threadedly connected to the screw 13 and slides relatively with the screw mounting frame 11, and the cylinder 9 is fixed on the slider with a nut 14.

[0039] In order to pick up and place the adhesive patch, the negative pressure grabbing assembly 10 includes a negative pressure suction pump 15 and a suction cup 16. The negative pressure suction pump 15 is fixed on the workbench 1, and the suction cup 16 is fixed to the bottom of the cylinder 9 through a mounting bracket. The negative pressure suction pump 15 and the suction cup 16 are connected by a pipe.

[0040] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art may make various modifications or variations within the scope of the claims, which do not affect the essence of the present invention.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0043] The present invention and its implementation methods are described above, and such description is not restrictive, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design structures and embodiments similar to the technical solution without creativity, which should all fall within the protection scope of the present invention.

Claims

1. A process for preparing a hollow FPC circuit board, characterized in that: The steps include: Step 1: Use a fully automatic cutting machine to cut the original coil into the required size. Step 2: Drill through holes for circuit connection, use chemicals to make carbon powder adhere to the hole wall to form a conductive layer, and spray copper plating. Step 3: Paste a photosensitive dry film on the surface of the copper-plated board as a film for pattern transfer, and use film negatives to transfer to the board surface dry film through the principle of light imaging. Step 4: The dry film in the unexposed area is developed with potassium carbonate, leaving the dry film pattern in the exposed area. The area where the copper surface is exposed after the circuit pattern is developed is corroded by etching solution, leaving the pattern covered by the dry film. Step 5: Use optical inspection equipment to detect line problems. Step 6: Cover the copper foil circuit with a layer of protective film and then press it together to prevent the circuit from oxidation or short circuit. Step 7: Use the auxiliary placement machine to paste auxiliary materials on the board according to customer requirements.

2. The process for preparing a hollow FPC circuit board according to claim 1, characterized in that: The original roll material includes substrate, cover film and electromagnetic film.

3. The process for preparing a hollow FPC circuit board according to claim 2, characterized in that: The adhesive auxiliary materials include but are not limited to PI, electromagnetic shielding film, FR4, steel sheet, adhesive and other auxiliary materials.

4. The auxiliary chip mounter used in the FPC hollow circuit board preparation process according to claim 1, characterized in that: The invention comprises a workbench (1) and a patch device (2), wherein the patch device (2) is mounted on the workbench (1) via a lifting frame (7), a material preparation table (3) is provided on the workbench (1), a leveling plate (4) is provided on one side of the material preparation table (3), a reserved opening (5) is provided on the lower side of the material preparation table (3), a recycling price (6) fixed to the bottom of the workbench (1) is provided at the bottom of the reserved opening (5), and the patch device (2) comprises a transmission component (8), a cylinder (9) and a negative pressure grabbing component (10), wherein the transmission component (8) is mounted on the upper side of the workbench (1) via a lifting frame (7), the cylinder (9) is fixed on the transmission component (8), and the negative pressure grabbing component (10) is provided on the workbench (1) and the cylinder (9).

5. The auxiliary placement machine according to claim 4, characterized in that: The transmission assembly (8) comprises a screw mounting frame (11), a transmission motor (12), a screw (13) and a slider with a nut (14); the screw mounting frame (11) is mounted on the workbench (1) via a lifting frame (7); the transmission motor (12) is fixed to one side of the screw mounting frame (11); one end of the screw (13) is rotatably mounted on the screw mounting frame (11) and the other end is fixedly connected to the output shaft of the transmission motor (12); the slider with a nut (14) is threadedly mounted on the screw (13) and slides relatively with the screw mounting frame (11); and the cylinder (9) is fixed to the slider with a nut (14).

6. The auxiliary placement machine according to claim 5, characterized in that: The negative pressure grabbing assembly (10) comprises a negative pressure suction pump (15) and a suction cup (16); the negative pressure suction pump (15) is fixed on the workbench (1); the suction cup (16) is fixed to the bottom of the cylinder (9) via a mounting bracket; the negative pressure suction pump (15) and the suction cup (16) are connected via a pipe fitting.

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