Drilling method and system for multilayer circuit board and storage medium

Abstract

The invention discloses a drilling method and system for a multilayer circuit board and a storage medium, and relates to the technical field of circuit board drilling. The method comprises the steps that a feeding mechanism conveys a multi-layer circuit board to a drilling machine, and a manipulator places the multi-layer circuit board on a working platform; the X-RAY detection device obtains a distance test value of the deviation measurement target points of each layer of the inner-layer core board and calculates an expansion and shrinkage value of each layer of the inner-layer core board; according to the expansion and shrinkage value of each layer of inner core board, calculating the average expansion and shrinkage value of the multilayer circuit board; according to the average expansion and contraction value, a drilling belt coefficient is set; according to the drilling belt coefficient, the drilling machine determines a test drilling belt and performs drilling until the drilling deviation condition does not exist; and according to the final drilling band coefficient, a drilling band is determined, and a drilling machine drills the multilayer circuit board according to the drilling band. According to the drilling method of the multi-layer circuit board, the drilling efficiency can be improved, and the situation that the first board for trial drilling is scrapped due to drilling deviation is avoided, so that the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board drilling, and in particular to a drilling method, system and storage medium for a multi-layer circuit board. Background Art

[0002] In the production process of multi-layer circuit boards, due to the effects of processes such as pressing, it is inevitable that there will be expansion and contraction problems. When drilling holes in multi-layer circuit boards, in order to avoid the problem of the circuit board being scrapped due to excessive expansion and contraction values, it is necessary to first detect the expansion and contraction values ​​of the circuit board, and then calculate the drill belt coefficient through the staff, and then enter the drill belt coefficient into the drilling machine to drill the circuit board. At the same time, when starting to drill holes, it is necessary to test drill a first board first, and then remove the drilled circuit board from the drilling machine, check the drilling situation, and confirm that there is no problem with the drilling before drilling the remaining circuit boards. If the first board is not drilled properly, it can only be scrapped and the drill belt should be modified for trial drilling. This method not only has low drilling efficiency, but also causes waste of circuit boards, which is not conducive to reducing costs. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a drilling method, system, and storage medium for a multilayer circuit board, which can improve the drilling efficiency and avoid the first board to be scrapped due to drilling deviation, thereby reducing costs.

[0004] On the one hand, the drilling method of a multilayer circuit board according to an embodiment of the present invention is applied to a drilling system, the drilling system comprising a feeding mechanism, a drilling machine and a manipulator, the feeding mechanism is provided with a plurality of multilayer circuit boards, the multilayer circuit boards comprise a plurality of inner core boards, a test frame is arranged around the inner core boards, a test target area is arranged at the four corners of the test frame, each of the test target areas comprises a plurality of rows of test holes, and a deviation measurement target point is arranged in at least one of the test holes in each of the test target areas; the drilling machine is provided with a working platform and an X-RAY detection device; The method comprises: The loading mechanism transfers the multi-layer circuit board to the drilling machine, and the manipulator places the multi-layer circuit board on the working platform; The X-RAY detection device obtains the spacing test value of the deviation measurement target point of each layer of the inner core plate, and calculates the expansion and contraction value of each layer of the inner core plate according to the spacing test value and the spacing preset value; Calculating the average expansion and contraction value of the multilayer circuit board according to the expansion and contraction value of each layer of the inner core board; According to the average expansion and contraction value, a drill belt coefficient is set; According to the drill belt coefficient, the drilling machine determines the test drill belt of the first row of the test holes and performs drilling, and after drilling, the X-RAY detection device is used to detect whether the drilling is deviated; If there is a drilling deviation, the drilling belt coefficient is updated according to the degree of drilling deviation, and the drilling machine determines the test drilling belt of the next row of test holes according to the updated drilling belt coefficient and drills the holes, and repeats this process until there is no drilling deviation; According to the final drill belt coefficient, a drilling belt is determined, and the drilling machine drills holes in the multi-layer circuit board according to the drilling belt. According to some embodiments of the present invention, the step of the X-RAY detection device obtaining the spacing test value of the deviation measurement target point of each layer of the inner core plate, and calculating the expansion and contraction value of each layer of the inner core plate according to the spacing test value and the spacing preset value includes: The X-RAY detection device obtains a first spacing test value of two deflection measurement target points located on the same X-axis and a second spacing test value of two deflection measurement target points located on the same Y-axis of each inner core plate; Obtaining a first preset distance value between two deflection measurement target points located on the same X-axis and a second preset distance value between two deflection measurement target points located on the same Y-axis of each inner core plate; Obtaining a first expansion / contraction value of each inner core plate according to the first spacing test value and the first spacing preset value; The second expansion and contraction value of each layer of the inner core panel is obtained according to the second spacing test value and the second spacing preset value. According to some embodiments of the present invention, the step of setting the drill belt coefficient according to the average expansion and contraction value includes: When the average expansion and contraction value is less than a first preset value, the drill belt coefficient is set to 1; When the average expansion and contraction value is greater than the first preset value and less than the second preset value, the drill belt coefficient is set to a first value; the first value is the ratio of the average value of the spacing test values ​​of all the inner core plates to the spacing preset value; When the average expansion and contraction value is greater than the second preset value and less than the third preset value, the drill belt coefficient is set to a second value; the second value is the ratio of the spacing preset value plus or minus the average expansion and contraction value to the spacing preset value; When the average expansion and contraction value is greater than the third preset value, an abnormal alarm is issued. According to some embodiments of the present invention, the work platform is provided with a plurality of workstations, a corresponding laser marking device is respectively provided above each of the workstations, and a moving device and an image recognition device are also provided above the workstations, a plurality of drills corresponding to the plurality of the workstations are provided on the moving device, and an adjustment device is provided on the peripheral side of each of the workstations; the drilling belt is determined according to the final drilling belt coefficient, and after the step of the drilling machine drilling the multi-layer circuit board according to the drilling belt, it also includes: The robot places the plurality of multilayer circuit boards at the corresponding working positions; Positioning the multilayer circuit board by using the image recognition device, and adjusting the position of the multilayer circuit board by using the adjustment device; The moving device drives the plurality of drills to move, so that the plurality of drills drill holes on the multilayer circuit board on each of the working positions according to the drilling belt; Detecting whether the multilayer circuit board is drilled off-center by the X-RAY detection device, and marking the drilled off-center multilayer circuit board by the laser marking device; When the number of the multi-layer circuit boards that are drilled off-center exceeds a fourth preset value, the drilling machine stops drilling.

[0005] According to some embodiments of the present invention, the adjustment device includes a first cylinder, a second cylinder, a third cylinder and a fourth cylinder arranged around the working position, the output shaft of the first cylinder is connected to a first positioning block, the output shaft of the second cylinder is connected to a second positioning block, the output shaft of the third cylinder is connected to a third positioning block, and the output shaft of the fourth cylinder is connected to a fourth positioning block. According to some embodiments of the present invention, a first drill box, a second drill box and a first detection device are provided beside each of the workstations, a second detection device is provided on the drill, and a plurality of drills are placed in the first drill box; the moving device drives the plurality of drills to move, so that the plurality of drills drill holes in the multilayer circuit board on each of the workstations according to the drilling drill belt, respectively, comprising: The moving device drives the drill to move to the first drill box to grab the drill bit, and detects the size of the drill bit through the first detection device; When the first detection device detects that the size of the drill bit meets the requirement, the moving device drives the multiple drills to move, so that the multiple drills drill holes on the multilayer circuit board on each of the working positions according to the drilling drill belt; When the drilling times of the drill bit reaches a preset number, or when the second detection device detects that the size of the drill bit does not meet the requirements, the moving device drives the drill to place the drill bit into the second drill bit box and replace the new drill bit in the first drill bit box.

[0006] According to some embodiments of the present invention, the feeding mechanism includes a carrier, an adsorption device, a driving device, a flipping device and a conveying device, and a receiving platform is provided on a side of the drilling machine close to the conveying device; the feeding mechanism conveys the multilayer circuit board to the drilling machine, and the manipulator places the multilayer circuit board on the working platform, comprising: Placing a plurality of the multilayer circuit boards on the carrier; The driving device drives the supporting frame to approach the adsorption device; The adsorption device adsorbs the multi-layer circuit board on the carrier; The flipping device drives the multi-layer circuit board on the adsorption device to flip onto the conveying device, and the conveying device conveys the multi-layer circuit board to the receiving platform; The robot places the multi-layer circuit board on the receiving platform on the working platform.

[0007] According to some embodiments of the present invention, the conveying device includes a body and a conveyor belt, the conveyor belt is arranged on the surface of the body, and an installation cavity is formed between the bottom of the conveyor belt and the body; the bearing frame includes a support base and a support backrest, the support base is arranged in the installation cavity on a side close to the conveying device, the bottom of the support backrest is arranged on the surface of the support base on a side away from the conveying device, the surface of the support base is used to place the multi-layer circuit board, and the support backrest is used to support the multi-layer circuit board; the adsorption device is arranged between the bearing frame and the conveying device, the adsorption device includes a plurality of suction cups and a telescopic part for driving the suction cups to approach or move away from the bearing frame; the flipping device includes a rotating rod and a rotating plate, the rotating rod is arranged on a side of the body close to the bearing frame, the rotating plate is connected to the rotating rod, the bottom of the rotating plate is provided with a barb, and the rotating rod is used to drive the rotating plate to rotate.

[0008] On the other hand, a drilling system for a multilayer circuit board according to an embodiment of the present invention comprises: a loading mechanism, a drilling machine and a manipulator, and the drilling system is used to execute the drilling method for a multilayer circuit board described in the above-mentioned embodiment.

[0009] On the other hand, according to the storage medium of the embodiment of the present invention, the storage medium stores computer executable instructions, and the computer executable instructions are used to enable a computer to execute the drilling method of the multilayer circuit board described in the above embodiment.

[0010] The drilling method, system, and storage medium of a multilayer circuit board according to an embodiment of the present invention have at least the following beneficial effects: when drilling a multilayer circuit board, a feeding mechanism feeds the multilayer circuit board, and a manipulator places the multilayer circuit board on a work platform, thereby realizing automatic feeding of the multilayer circuit board, which can improve feeding efficiency compared to manual feeding. By setting an X-RAY detection device on the drilling machine, the deviation measurement target point of the inner core board of the multilayer circuit board can be detected to obtain the expansion and contraction value, and the drill belt coefficient can be calculated based on the expansion and contraction value. After setting the drill belt coefficient, it is also necessary to test drill the test hole according to the test drill belt to verify whether the drill belt coefficient is correct. Only after determining that the drill belt coefficient is accurate, the multilayer circuit board will be formally drilled to avoid deviation. If the drill belt coefficient is inaccurate, it is also necessary to adjust the drill belt coefficient. Since the test drilling is carried out on the test frame, and the test frame does not contain the functional circuits of the multi-layer circuit board, the test frame can be removed after the multi-layer circuit board is processed. Therefore, in the process of verifying whether the drill belt coefficient is correct, the multi-layer circuit board will not be scrapped, thereby reducing costs.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 A schematic structural diagram of a drilling system according to an embodiment of the present invention; Figure 2 A schematic diagram of the structure of a multilayer circuit board according to an embodiment of the present invention; Figure 3 A flowchart of the steps of a drilling method for a multilayer circuit board according to an embodiment of the present invention; Figure 4 A schematic diagram of the structure of a drilling machine according to an embodiment of the present invention; Figure 5 for Figure 4 An enlarged schematic diagram of part A; Figure 6 It is a structural schematic diagram of a feeding mechanism according to an embodiment of the present invention; Figure 7 Schematic diagram of the structure of a rotating plate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0013] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limitations on the present application. For the step numbers in the following embodiments, they are only provided for the convenience of explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiment can be adaptively adjusted according to the understanding of those skilled in the art.

[0014] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0015] The terms "first", "second", "third" and "fourth" etc. in the specification and claims of the present invention and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0016] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0017] In the production process of multi-layer circuit boards, due to the effects of processes such as pressing, it is inevitable that there will be expansion and contraction problems. When drilling holes in multi-layer circuit boards, in order to avoid the problem of the circuit board being scrapped due to excessive expansion and contraction values, it is necessary to first detect the expansion and contraction values ​​of the circuit board, and then calculate the drill belt coefficient through the staff, and then enter the drill belt coefficient into the drilling machine to drill the circuit board. At the same time, when starting to drill holes, it is necessary to test drill a first board first, and then remove the drilled circuit board from the drilling machine, check the drilling situation, and confirm that there is no problem with the drilling before drilling the remaining circuit boards. If the first board is not drilled properly, it can only be scrapped and the drill belt should be modified for trial drilling. This method not only has low drilling efficiency, but also causes waste of circuit boards, which is not conducive to reducing costs.

[0018] To this end, the embodiment of the present invention provides a drilling method, system and storage medium for a multilayer circuit board. When drilling the multilayer circuit board, the feeding mechanism feeds the multilayer circuit board, and the manipulator places the multilayer circuit board on the work platform to realize automatic feeding of the multilayer circuit board. Compared with manual feeding, the feeding efficiency can be improved. By setting an X-RAY detection device on the drilling machine, the deviation target point of the inner core board of the multilayer circuit board can be detected to obtain the expansion and contraction value, and the drill belt coefficient is calculated according to the expansion and contraction value. After setting the drill belt coefficient, it is also necessary to test drill the test hole according to the test drill belt to verify whether the drill belt coefficient is correct. Only after determining that the drill belt coefficient is accurate, the multilayer circuit board will be formally drilled to avoid the occurrence of drilling deviation. If the drill belt coefficient is inaccurate, it is also necessary to adjust the drill belt coefficient. Since the test drilling is performed on the test frame, and the test frame does not contain the functional circuit of the multilayer circuit board, the test frame can be removed after the multilayer circuit board is processed. Therefore, in the process of verifying whether the drill belt coefficient is correct, the multilayer circuit board will not be scrapped, thereby reducing costs. The following describes in detail the drilling method, system and storage medium for a multilayer circuit board according to the embodiments of the present invention in conjunction with the accompanying drawings.

[0019] On the one hand, an embodiment of the present invention provides a method for drilling a multilayer circuit board, the method being applied to a drilling system, such as Figure 1 As shown, the drilling system includes a feeding mechanism 100, a drilling machine 200 and a manipulator 300. The feeding mechanism 100 is provided with a plurality of multilayer circuit boards 400. Figure 2 As shown, the multilayer circuit board 400 includes a plurality of inner core boards 401, and a test frame 410 is arranged around the inner core board 401. Test target areas 420 are arranged at the four corners of the test frame 410. Each test target area 420 includes a plurality of rows of test holes 430, and at least one test hole 430 of each test target area 420 is provided with a deviation measurement target point 440; Figure 4As shown, the drilling machine 200 is provided with a working platform 220 and an X-RAY detection device (not shown). Figure 3 As shown, the drilling method of the multilayer circuit board includes the following steps: Step S100: the loading mechanism 100 transfers the multilayer circuit board 400 to the drilling machine 200, and the manipulator 300 places the multilayer circuit board 400 on the working platform 220; Step S200: the X-RAY detection device obtains the spacing test value of the deviation measurement target point 440 of each inner core plate 401, and calculates the expansion and contraction value of each inner core plate 401 according to the spacing test value and the spacing preset value; Step S300: Calculating the average expansion and contraction value of the multilayer circuit board 400 according to the expansion and contraction value of each inner core board 401; Step S400: setting the drill belt coefficient according to the average expansion and contraction value; Step S500: According to the drill belt coefficient, the drilling machine determines the test drill belt of the first row of test holes 430 and performs drilling. After drilling, an X-RAY detection device is used to detect whether the drilling is deviated; Step S600: If there is a drilling deviation, the drilling belt coefficient is updated according to the degree of drilling deviation, and the drilling machine 200 determines the test drilling belt of the next row of test holes 430 according to the updated drilling belt coefficient and drills the holes, and repeats this process until there is no drilling deviation; Step S700: Determine the drilling tape according to the final drilling tape coefficient, and the drilling machine 200 drills the multi-layer circuit board 400 according to the drilling tape.

[0020] Specifically, Figure 6 As shown, in some embodiments of the present invention, the loading mechanism 100 includes a carrier 110, an adsorption device 120, a driving device, a flipping device 130 and a conveying device 140; wherein the carrier 110 is used to place a multi-layer circuit board 400, the adsorption device 120 is arranged opposite to the carrier 110, and is used to adsorb the multi-layer circuit board 400 on the carrier 110, the driving device is used to drive the carrier 110 to move, so that the carrier 110 is close to or away from the adsorption device 120, and the flipping device 130 is used to drive the multi-layer circuit board 400 on the adsorption device 120 to flip; as shown in FIG. Figure 4 As shown, a receiving platform 260 is provided on one side of the drilling machine 200 close to the conveying device 140, and the conveying device 140 is used to receive the flipped multilayer circuit board 400 and convey the multilayer circuit board 400 to the receiving platform 260. In this example, the above step S100: the feeding mechanism 100 conveys the multilayer circuit board 400 to the drilling machine 200, and the manipulator 300 places the multilayer circuit board 400 on the working platform 220, specifically includes the following five steps: Step S110: placing a plurality of multilayer circuit boards 400 on the carrier 110; Step S120: the driving device drives the carrier 110 to approach the adsorption device 120; Step S130: The adsorption device 120 adsorbs the multilayer circuit board 400 on the carrier 110; Step S140: the flipping device 130 drives the multi-layer circuit board 400 on the adsorption device 120 to flip onto the conveying device 140, and the conveying device 140 conveys the multi-layer circuit board 400 to the receiving platform 260; Step S150 : the robot arm 300 places the multi-layer circuit board 400 on the receiving platform 260 on the working platform 220 .

[0021] Specifically, when loading the multilayer circuit board 400, multiple multilayer circuit boards 400 are placed on the carrier 110 together, and then the driving device drives the entire carrier 110 and the multilayer circuit boards 400 on the carrier 110 to move toward the adsorption device 120. When the distance between the carrier 100 and the adsorption device 120 is close enough, the adsorption device 120 adsorbs the outermost multilayer circuit board 400 on the carrier 100. At this time, the flipping device 130 receives the multilayer circuit board 400 adsorbed by the adsorption device 120, and at the same time, the adsorption device 120 releases the multilayer circuit board 400, and then the flipping device 130 flips the multilayer circuit board 400 again, so that the multilayer circuit board 400 is placed horizontally instead of vertically, and then the conveying device 140 receives the multilayer circuit board 400, so that the multilayer circuit board 400 is conveyed to the receiving platform 260, so that the robot 300 transfers the multilayer circuit board 400 from the receiving platform 260 to the working platform 220. The feeding mechanism 100 can realize automatic feeding of the multilayer circuit board 400 and can continuously and automatically convey the multilayer circuit board 400 without the need for workers to feed the multilayer circuit boards 400 one by one, thereby improving production efficiency and reducing labor costs.

[0022] Furthermore, if Figure 6 and Figure 7As shown, in some embodiments of the present invention, the conveying device 140 includes a body 141 and a conveyor belt 142, the conveyor belt 142 is arranged on the surface of the body 141, and a mounting cavity 143 is formed between the bottom of the conveyor belt 142 and the body 141; the carrier 110 includes a support base 111 and a support backrest 112, the side of the support base 111 close to the conveying device 140 is arranged in the mounting cavity 143, the bottom of the support backrest 112 is arranged on the surface of the support base 111 away from the conveying device 140, and the surface of the support base 111 is used to place the multilayer circuit board 400 , the support backrest 112 is used to support the multi-layer circuit board 400; the adsorption device 120 is arranged between the carrier 110 and the conveying device 140, and the adsorption device 120 includes a plurality of suction cups 121 and a telescopic member 122 for driving the suction cups 121 to approach or move away from the carrier 110; the flip device 130 includes a rotating rod 131 and a rotating plate 132, the rotating rod 131 is arranged on the side of the body 141 close to the carrier 110, the rotating plate 132 is connected to the rotating rod 131, and a barb 133 is arranged at the bottom of the rotating plate 132, and the rotating rod 131 is used to drive the rotating plate 132 to rotate. Specifically, when the multi-layer circuit boards 400 are to be loaded, the plurality of multi-layer circuit boards 400 are placed on the support base 111, and the multi-layer circuit boards 400 are placed against the support backrest 112 to prevent the multi-layer circuit boards 400 from falling. Then, when the driving device drives the carrier 110 to approach the adsorption device 120 to a certain distance, the telescopic member 122 drives the suction cup 121 to extend a certain distance toward the carrier 110, so that the suction cup 121 contacts the outermost multi-layer circuit board 400 of the carrier 110, and after the multi-layer circuit board 400 is adsorbed, the telescopic member 122 drives the suction cup 121 to reset, thereby obtaining a multi-layer circuit board 400 from the carrier 110. The telescopic member 122 can be a device such as a cylinder. When the suction cup 121 absorbs the multi-layer circuit board 400 on the outermost side of the carrier frame 110, and the telescopic member 122 drives the suction cup 121 to reset, at this time, the multi-layer circuit board 400 absorbed by the suction cup 121 is just placed on the barb 133 of the rotating plate 132. After supporting the multi-layer circuit board 400 by the barb 133, the suction cup 121 releases the multi-layer circuit board 400. Subsequently, the rotating rod 131 rotates, driving the rotating plate 132 to flip, so that the multi-layer circuit board 400 is changed from vertical placement to horizontal placement, and is placed on the conveyor belt 142. The conveyor belt 142 conveys the multi-layer circuit board 400 to the receiving platform 260, and then the robot 300 places the multi-layer circuit board 400 on the receiving platform 260 onto the working platform 220. It should be noted that the driving device can adopt a screw transmission assembly or a cylinder pushing assembly, etc. The driving device can be set in the installation cavity 143 of the body 141 and connected to the carrier 110. Through the structure of the screw transmission assembly or the cylinder pushing assembly, etc., the carrier 110 is driven to approach or move away from the adsorption device 120.Alternatively, the driving device may also be disposed on a side of the support frame 110 away from the adsorption device 120 , and the support frame 110 may be driven to move by pushing the support backrest 112 .

[0023] After placing the multi-layer circuit board 400 on the working platform 220, the X-RAY detection device detects the spacing test value of the deviation measurement target point 440 of each inner core board, and calculates the expansion and contraction value of each inner core board according to the spacing test value and the spacing preset value. Specifically, the above step S200 includes the following four steps: Step S210: The X-RAY detection device obtains a first spacing test value of two deviation measurement target points 440 located on the same X-axis and a second spacing test value of two deviation measurement target points 440 located on the same Y-axis of each inner core plate 401; Step S220: obtaining a first preset distance value between two deflection measuring target points 440 of each inner core plate 401 located on the same X-axis, and a second preset distance value between two deflection measuring target points 440 located on the same Y-axis; Step S230: obtaining a first expansion / contraction value of each inner core plate 401 according to the first spacing test value and the first spacing preset value; Step S240: Obtain the second expansion and contraction value of each inner core plate 401 according to the second spacing test value and the second spacing preset value.

[0024] like Figure 2 As shown, the inner core plate 401 is provided with four deflection measuring target points 440, which are respectively located in the four test target areas 420 of the inner core plate 401. The X-RAY detection device will detect the distance between the two deflection measuring target points 440 located on the same horizontal line in the X-axis direction to obtain a first distance test value. At the same time, the X-RAY detection device will detect the distance between the two deflection measuring target points 440 located on the same vertical line in the Y-axis direction to obtain a second distance test value. When setting the four deflection measuring target points 440, the distance between the four deflection measuring target points 440 is preset, wherein the initial distance between the two deflection measuring target points located on the same horizontal line in the X-axis direction is the first distance preset value; the initial distance between the two deflection measuring target points 440 located on the same vertical line in the Y-axis direction is the second distance preset value. According to the first distance test value and the first distance preset value, it can be known that the first expansion and contraction value of the inner core plate of the nth layer is Q1n= , where the total number of inner core panels is N, D1n represents the first spacing test value of the inner core panel of the nth layer, 1≤n≤N, d1 represents the first spacing preset value, and the second expansion and contraction value of the inner core panel of the nth layer is Q2n= , where D2n represents the second spacing test value of the inner core board of the nth layer, and d2 represents the second spacing preset value. After obtaining the first expansion and contraction value and the second expansion and contraction value of each inner core board, the average expansion and contraction value of the multilayer circuit board 400 (including the first average expansion and contraction value and the second average expansion and contraction value) can be calculated, where the first average expansion and contraction value is S1= , the second average expansion and contraction value is S2= .

[0025] After obtaining the average expansion and contraction value of the multilayer circuit board 400, the drill belt coefficient is set according to the average expansion and contraction value. Specifically, the above step S400 includes the following four steps: Step S410: when the average expansion and contraction value is less than the first preset value, the drill belt coefficient is set to 1; Step S420: when the average expansion and contraction value is greater than the first preset value and less than the second preset value, the drill belt coefficient is set to a first value; the first value is the ratio of the average value of the spacing test values ​​of all inner core plates 401 to the spacing preset value; Step S430: When the average expansion and contraction value is greater than the second preset value and less than the third preset value, the drill belt coefficient is set to a second value; the second value is the ratio of the spacing preset value plus or minus the average expansion and contraction value to the spacing preset value; Step S440: When the average expansion and contraction value is greater than the third preset value, an abnormal alarm is issued.

[0026] Specifically, when the average expansion and contraction value is less than the first preset value, it indicates that the expansion and contraction of the multilayer circuit board 400 is relatively slight and basically does not affect the drilling accuracy. At this time, the drill belt coefficient is set to 1, that is, the original preset drill belt is kept unchanged. When the average expansion and contraction value is greater than the first preset value and less than the second preset value, if drilling is performed according to the original drill belt, drilling deviation will occur. Therefore, it is necessary to set the drill belt coefficient to the first value to compensate for the deviation caused by expansion and contraction. Among them, the first value is the ratio of the average value of the spacing test values ​​of all inner core boards to the spacing preset value. The first value includes the first value in the X-axis direction and the first value in the Y-axis direction. The first value in the X-axis direction is X1= , the first value of the Y axis is Y1= . When the average expansion and shrinkage value is greater than the second preset value and less than the third preset value, the expansion and shrinkage is serious, and the drill belt coefficient needs to be set to the second value to compensate for the deviation caused by the expansion and shrinkage. The second value is the ratio of the spacing preset value plus or minus the average expansion and shrinkage value (when the sum of the difference between the spacing test value of all inner core panels and the spacing preset value is positive, the average expansion and shrinkage value is added here, and when it is negative, the average expansion and shrinkage value is subtracted) to the spacing preset value. The second value includes the second value in the X-axis direction and the second value in the Y-axis direction. The second value in the X-axis direction is X2= , the second value in the Y-axis direction is Y1= , where A is the average expansion and contraction value. When the average expansion and contraction value is greater than the third preset value, it indicates that the expansion and contraction of the multilayer circuit board 400 is abnormal, and an abnormal alarm needs to be issued to prompt the staff to check whether there is a problem in the production process of the multilayer circuit board 400. It should be noted that the first preset value, the second preset value and the third preset value can be set according to actual needs, for example, set to 2mil, 4mil, 6mil, etc., and their specific values ​​are not limited here.

[0027] After determining the drill belt coefficient, the drilling machine 200 determines the test drill belt of the first row of test holes 430 and performs drilling. After drilling, the X-RAY detection device is used to detect whether the drilling is deviated. It should be noted that the drilling machine 200 is pre-set with multiple test drill belts for test drilling and drilling drill belts for actual drilling, and each test drill belt corresponds to a row of test holes 430 in the test target area 420. If there is a drill deviation after drilling, the drill belt coefficient is updated according to the degree of drill deviation. The specific updating method is to multiply the drill belt coefficient by the adjustment coefficient, wherein the adjustment coefficient is the ratio of the actual drilling coordinates of the test holes 430 minus the theoretical coordinates to the theoretical coordinates. Then, the drilling machine 200 determines the test drill belt of the second row of test holes 430 according to the updated drill belt coefficient and performs drilling, and repeats this process until there is no drill deviation, and the final drill belt coefficient is obtained. The final drill belt coefficient is set as the drill belt coefficient of the drilling drill belt, and the drilling machine 200 drills the multi-layer circuit board 400 according to the drilling drill belt.

[0028] According to the drilling method of the multilayer circuit board of the embodiment of the present invention, when drilling the multilayer circuit board 400, the feeding mechanism 100 feeds the multilayer circuit board 400, and the manipulator 300 places the multilayer circuit board 400 on the working platform 220, so as to realize automatic feeding of the multilayer circuit board 400, which can improve the feeding efficiency compared with manual feeding. By setting an X-RAY detection device on the drilling machine 200, the deviation measurement target point of the inner core board of the multilayer circuit board 400 can be detected, so as to obtain the expansion and contraction value, and calculate the drill belt coefficient according to the expansion and contraction value. After setting the drill belt coefficient, it is also necessary to conduct a trial drilling according to the trial drilling drill belt to verify whether the drill belt coefficient is correct. Only after determining that the drill belt coefficient is accurate, the multilayer circuit board 400 will be formally drilled to avoid the occurrence of deviation drilling. If the drill belt coefficient is inaccurate, it is also necessary to adjust the drill belt coefficient. Since the test drilling is performed on the test frame 410, and the test frame 410 does not contain the functional circuits of the multi-layer circuit board 400, the test frame can be removed after the multi-layer circuit board 400 is processed. Therefore, in the process of verifying whether the drill belt coefficient is correct, the multi-layer circuit board 400 will not be scrapped, thereby reducing costs.

[0029] like Figure 4As shown, the work platform 220 is provided with a plurality of work positions 221, and a corresponding laser marking device (not shown) is respectively provided above each work position 221, and a moving device 240 and an image recognition device (not shown) are also provided above the work position 221, and a plurality of drills 250 corresponding to the plurality of work positions 221 are provided on the moving device 240, and an adjustment device 230 is provided around each work position 221. The drilling method for a multilayer circuit board according to an embodiment of the present invention further includes the following five steps: Step S800: The robot 300 places a plurality of multi-layer circuit boards 400 at corresponding workstations 221; Step S900: positioning the multilayer circuit board 400 by using the image recognition device, and adjusting the position of the multilayer circuit board 400 by using the adjustment device 230; Step S1000: the moving device 240 drives the multiple drills 250 to move, so that the multiple drills 250 drill holes on the multilayer circuit board 400 on each work station 221 according to the drilling drill belt; Step S1100: using an X-RAY detection device to detect whether the multilayer circuit board 400 is drilled off-center, and using a laser marking device to mark the multilayer circuit board 400 that is drilled off-center; Step S1200: When the number of the multi-layer circuit boards 400 that are drilled off-center exceeds a fourth preset value, the drilling machine 200 stops drilling.

[0030] Specifically, after the final drilling zone is determined, batch drilling of the multilayer circuit board 400 begins. During batch drilling, the multilayer circuit board 400 is sequentially transferred to the receiving platform 260 by the feeding mechanism 100, and then the manipulator 300 places the multilayer circuit board 400 on the receiving platform 260 on the corresponding work position 221, and the multilayer circuit board 400 is positioned by the image recognition device, and then the position of the multilayer circuit board 400 is adjusted by the adjustment device 230 to ensure that the position of the multilayer circuit board 400 is accurate, so as to improve the subsequent drilling accuracy. Figure 4As shown, in some embodiments of the present invention, the adjustment device 230 includes a first cylinder 232, a second cylinder 234, a third cylinder 236 and a fourth cylinder (not shown) arranged around the working position 221, the output shaft of the first cylinder 232 is connected to the first positioning block 231, the output shaft of the second cylinder 234 is connected to the second positioning block 233, the output shaft of the third cylinder 236 is connected to the third positioning block 235, and the output shaft of the fourth cylinder is connected to the fourth positioning block. After the manipulator 300 places the multi-layer circuit board 400 on the working position 221, the first cylinder 232, the second cylinder 234, the third cylinder 236 and the fourth cylinder push the first positioning block 231, the second positioning block 233, the third positioning block 235 and the fourth positioning block to clamp the multi-layer circuit board 400, so as to realize the positioning of the multi-layer circuit board 400. Then, the mobile device 240 drives the multiple drills 250 to move, so that the multiple drills 250 drill holes in the multilayer circuit board 400 on each work station 221 according to the drilling drill belt. It should be noted that the mobile device 240 includes an X-axis moving mechanism, a Y-axis moving mechanism and a Z-axis moving mechanism, which can drive the drilling device 250 to move in the XYZ three-axis direction. After drilling, it is also necessary to detect whether the multilayer circuit board 400 is drilled off by an X-RAY detection device. If drilling off occurs, it is also necessary to mark the multilayer circuit board 400 that is drilled off by a laser marking device, so that the multilayer circuit board 400 that is drilled off can be scrapped later to avoid the outflow of defective products. When the number of multilayer circuit boards 400 that are drilled off is large and exceeds the fourth preset value, the drilling machine 200 stops drilling, and after the staff eliminates the abnormality or readjusts the drilling drill belt, subsequent drilling is carried out to avoid a large number of scrapped products. The fourth preset value can be set according to actual needs.

[0031] Furthermore, if Figure 5 As shown, in some embodiments of the present invention, a first drill box 270, a second drill box 280 and a first detection device 291 are arranged beside each work station 221, a second detection device (not shown) is arranged on the drill 250, and a plurality of drills 290 are placed in the first drill box 270. The above-mentioned step S1000: the moving device 240 drives the plurality of drills 250 to move, so that the plurality of drills 250 drill holes on the multilayer circuit board 400 on each work station 221 according to the drilling drill belt, includes the following three steps: Step S1001: the moving device 240 drives the drill 250 to move to the first drill box 270 to grab the drill 290, and the size of the drill 290 is detected by the first detection device 291; Step S1002: When the first detection device 291 detects that the size of the drill bit 290 meets the requirement, the moving device 240 drives the multiple drills 250 to move, so that the multiple drills 250 drill holes on the multilayer circuit board 400 on each work station 221 according to the drilling drill belt; Step S1003: When the drilling times of the drill bit 290 reaches a preset number, or when the second detection device detects that the size of the drill bit 290 does not meet the requirements, the mobile device 240 drives the drill 250 to place the drill bit 290 into the second drill bit box 280 and replace the new drill bit 290 in the first drill bit box 270.

[0032] It should be noted that in order to ensure that the grabbed drill bit 290 meets the drilling requirements, after the drill 250 grabs the drill bit 290, it is necessary to first move the drill bit 290 to the first detection device 291 to detect whether the size of the drill bit 290 meets the drilling requirements. Only after confirming that the size of the drill bit 290 meets the requirements will the drill bit 290 be used for drilling. If it is detected that the size of the drill bit 290 does not meet the requirements, the drill bit 290 will be placed in the second drill bit box 280, and a new drill bit 290 will be grabbed from the first drill bit box 270 to avoid the grabbed drill bit 290 being defective. At the same time, since the drill bit 290 will be worn to a certain extent during the drilling of the multi-layer circuit board 400 using the drill bit 290, the drill bit 290 has a certain service life. For this reason, the present application also detects the degree of wear of the drill bit 290 used for drilling in real time through the second detection device located on the drill 250. When the number of drilling times of the drill bit 290 reaches a preset number, or when the second detection device detects that the degree of wear of the drill bit 290 reaches a preset degree, the drill bit 290 is scrapped, and the drill 250 puts the drill bit 290 back into the second drill box 280, grabs a new drill bit 290 from the first drill box 270, and repeats the above operation. By setting the first detection device 291 and the second detection device, it is ensured that the size of the drill bit 290 meets the requirements, thereby improving the accuracy of drilling. It should be noted that a plurality of drill bits 290 of different sizes are arranged in the first drill box 270 to meet the drilling requirements of through holes of different sizes of the multi-layer circuit board 400.

[0033] On the other hand, the embodiment of the present invention also provides a drilling system for a multi-layer circuit board, such as Figure 1 As shown, the drilling system includes a feeding mechanism 100, a drilling machine 200 and a manipulator 300, and the drilling system is used to implement the drilling method of the multi-layer circuit board described in the above-mentioned embodiment.

[0034] It should be noted that the contents of the above method embodiments are all applicable to the present system embodiments, the functions specifically implemented by the present embodiment are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0035] On the other hand, an embodiment of the present invention further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned multi-layer circuit board drilling method is implemented.

[0036] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0037] Although specific embodiments are described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any of the functions and / or processing capabilities described in conjunction with a particular device or component may be performed by any other device or component. In addition, although various exemplary implementations and architectures have been described according to embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of the present disclosure.

[0038] Some aspects of the present disclosure are described above with reference to the block diagram and flow chart of the system, method, system and / or computer program product according to the exemplary embodiments.It should be understood that the combination of one or more blocks in the block diagram and the flow chart and the blocks in the block diagram and the flow chart can be realized by executing computer executable program instructions respectively.Equally, according to some embodiments, some blocks in the block diagram and the flow chart may not need to be executed in the order shown, or may not need to be executed in full.In addition, additional components and / or operations beyond those components and / or operations shown in the blocks in the block diagram and the flow chart may be present in certain embodiments.

[0039] Therefore, the blocks in the block diagrams and flow charts support the combination of devices for performing the specified functions, the combination of elements or steps for performing the specified functions, and the program instruction devices for performing the specified functions. It should also be understood that each block in the block diagrams and flow charts and the combination of blocks in the block diagrams and flow charts can be implemented by a special-purpose hardware computer system or a combination of special-purpose hardware and computer instructions that performs a specific function, element or step.

[0040] The program modules, applications, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the illustrative methods described herein) to be performed.

[0041] Software components can be encoded with any of various programming languages. An exemplary programming language can be a low-level programming language, such as an assembly language associated with a specific hardware architecture and / or an operating system platform. The software component comprising assembly language instructions may need to be converted to executable machine code by an assembler before being executed by hardware architecture and / or platform. Another exemplary programming language can be a higher-level programming language, which can be transplanted across multiple architectures. The software component comprising a higher-level programming language may need to be converted to an intermediate representation by an interpreter or a compiler before execution. Other examples of programming languages ​​include but are not limited to macro languages, shells or command languages, job control languages, scripting languages, database queries or search languages ​​or report writing languages. In one or more exemplary embodiments, the software component comprising the instruction of one of the above-mentioned programming language examples can be directly executed by an operating system or other software components, without first being converted into another form.

[0042] Software components may be stored as files or other data storage structures. Software components of similar type or related functions may be stored together, such as in a specific directory, folder, or library. Software components may be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0043] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A method for drilling a multilayer circuit board, characterized in that: Applied to a drilling system, the drilling system comprises a feeding mechanism, a drilling machine and a manipulator, the feeding mechanism is provided with a plurality of multi-layer circuit boards, the multi-layer circuit boards comprise a plurality of inner core boards, a test frame is arranged around the inner core boards, a test target area is arranged at the four corners of the test frame, each of the test target area comprises a plurality of rows of test holes, and a deviation measurement target point is arranged in at least one of the test holes in each of the test target areas; the drilling machine is provided with a working platform and an X-RAY detection device; The method comprises: The loading mechanism transfers the multi-layer circuit board to the drilling machine, and the manipulator places the multi-layer circuit board on the working platform; The X-RAY detection device obtains the spacing test value of the deviation measurement target point of each layer of the inner core plate, and calculates the expansion and contraction value of each layer of the inner core plate according to the spacing test value and the spacing preset value; Calculating the average expansion and contraction value of the multilayer circuit board according to the expansion and contraction value of each layer of the inner core board; According to the average expansion and contraction value, a drill belt coefficient is set; According to the drill belt coefficient, the drilling machine determines the test drill belt of the first row of the test holes and performs drilling, and after drilling, the X-RAY detection device is used to detect whether the drilling is deviated; If there is a drilling deviation, the drilling belt coefficient is updated according to the degree of drilling deviation, and the drilling machine determines the test drilling belt of the next row of test holes according to the updated drilling belt coefficient and drills the holes, and repeats this process until there is no drilling deviation; According to the final drill belt coefficient, a drilling belt is determined, and the drilling machine drills holes in the multi-layer circuit board according to the drilling belt.

2. The method for drilling a multilayer circuit board according to claim 1, characterized in that: The step of obtaining the spacing test value of the deviation measurement target point of each layer of the inner core plate by the X-RAY detection device, and calculating the expansion and contraction value of each layer of the inner core plate according to the spacing test value and the spacing preset value, comprises: The X-RAY detection device obtains a first spacing test value of two deflection measurement target points located on the same X-axis and a second spacing test value of two deflection measurement target points located on the same Y-axis of each inner core plate; Obtaining a first preset distance value between two deflection measurement target points located on the same X-axis and a second preset distance value between two deflection measurement target points located on the same Y-axis of each inner core plate; Obtaining a first expansion / contraction value of each inner core plate according to the first spacing test value and the first spacing preset value; The second expansion and contraction value of each layer of the inner core panel is obtained according to the second spacing test value and the second spacing preset value.

3. The drilling method for a multilayer circuit board according to claim 1, characterized in that: The step of setting the drill belt coefficient according to the average expansion and contraction value comprises: When the average expansion and contraction value is less than a first preset value, the drill belt coefficient is set to 1; When the average expansion and contraction value is greater than the first preset value and less than the second preset value, the drill belt coefficient is set to a first value; the first value is the ratio of the average value of the spacing test values ​​of all the inner core plates to the spacing preset value; When the average expansion and contraction value is greater than the second preset value and less than the third preset value, the drill belt coefficient is set to a second value; the second value is the ratio of the spacing preset value plus or minus the average expansion and contraction value to the spacing preset value; When the average expansion and contraction value is greater than the third preset value, an abnormal alarm is issued.

4. The drilling method for a multilayer circuit board according to claim 1, characterized in that: The working platform is provided with a plurality of working positions, each of which is provided with a corresponding laser marking device above, and a moving device and an image recognition device are also provided above the working position, a plurality of drills corresponding to the plurality of working positions are provided on the moving device, and an adjustment device is provided on the peripheral side of each working position; the drilling belt is determined according to the final drilling belt coefficient, and after the drilling machine drills the multi-layer circuit board according to the drilling belt, it also includes: The robot places the plurality of multilayer circuit boards at the corresponding working positions; Positioning the multilayer circuit board by the image recognition device, and adjusting the position of the multilayer circuit board by the adjustment device; The moving device drives the plurality of drills to move, so that the plurality of drills drill holes on the multilayer circuit board on each of the working positions according to the drilling belt; Detecting whether the multilayer circuit board is drilled off-center by the X-RAY detection device, and marking the drilled off-center multilayer circuit board by the laser marking device; When the number of the multi-layer circuit boards that are drilled off-center exceeds a fourth preset value, the drilling machine stops drilling.

5. The method for drilling a multilayer circuit board according to claim 4, characterized in that: The adjustment device includes a first cylinder, a second cylinder, a third cylinder and a fourth cylinder arranged around the working position, the output shaft of the first cylinder is connected to a first positioning block, the output shaft of the second cylinder is connected to a second positioning block, the output shaft of the third cylinder is connected to a third positioning block, and the output shaft of the fourth cylinder is connected to a fourth positioning block.

6. The drilling method for a multilayer circuit board according to claim 4, characterized in that: A first drill box, a second drill box and a first detection device are arranged beside each of the working positions, a second detection device is arranged on the drill, and a plurality of drills are placed in the first drill box; the moving device drives the plurality of drills to move, so that the plurality of drills drill holes in the multilayer circuit board on each of the working positions according to the drilling drill belt, including: The moving device drives the drill to move to the first drill box to grab the drill bit, and detects the size of the drill bit through the first detection device; When the first detection device detects that the size of the drill bit meets the requirement, the moving device drives the multiple drills to move, so that the multiple drills drill holes on the multilayer circuit board on each of the working positions according to the drilling drill belt; When the drilling times of the drill bit reaches a preset number, or when the second detection device detects that the size of the drill bit does not meet the requirements, the moving device drives the drill to place the drill bit into the second drill bit box and replace the new drill bit in the first drill bit box.

7. The drilling method for a multilayer circuit board according to claim 1, characterized in that: The feeding mechanism includes a carrier, an adsorption device, a driving device, a flipping device and a conveying device, and a receiving platform is provided on one side of the drilling machine close to the conveying device; The step of the feeding mechanism transferring the multilayer circuit board to the drilling machine, and the manipulator placing the multilayer circuit board on the working platform comprises: Placing a plurality of the multilayer circuit boards on the carrier; The driving device drives the supporting frame to approach the adsorption device; The adsorption device adsorbs the multi-layer circuit board on the carrier; The flipping device drives the multi-layer circuit board on the adsorption device to flip onto the conveying device, and the conveying device conveys the multi-layer circuit board to the receiving platform; The robot places the multi-layer circuit board on the receiving platform on the working platform.

8. The method for drilling a multilayer circuit board according to claim 7, characterized in that: The conveying device comprises a body and a conveyor belt, wherein the conveyor belt is arranged on the surface of the body, and a mounting cavity is formed between the bottom of the conveyor belt and the body; the bearing frame comprises a support base and a support backrest, wherein a side of the support base close to the conveying device is arranged in the mounting cavity, and the bottom of the support backrest is arranged on a surface of the support base away from the conveying device, the surface of the support base is used to place the multi-layer circuit board, and the support backrest is used to support the multi-layer circuit board; The adsorption device is arranged between the carrier and the conveying device, and the adsorption device includes a plurality of suction cups and a telescopic member for driving the suction cups to approach or move away from the carrier; the flipping device includes a rotating rod and a rotating plate, the rotating rod is arranged on a side of the machine body close to the carrier, the rotating plate is connected to the rotating rod, a barb is arranged at the bottom of the rotating plate, and the rotating rod is used to drive the rotating plate to rotate.

9. A drilling system for a multi-layer circuit board, characterized in that: include: A feeding mechanism, a drilling machine and a manipulator, wherein the drilling system is used to execute the drilling method for a multilayer circuit board according to any one of claims 1 to 8.

10. A storage medium, characterized in that: The storage medium stores computer executable instructions, and the computer executable instructions are used to enable a computer to execute the drilling method for a multilayer circuit board according to any one of claims 1 to 8.

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