Sealing heat dissipation structure and motor controller

Abstract

The invention discloses a sealed heat dissipation structure and a motor controller, the sealed heat dissipation structure comprises an aluminum-based PCB, a main control board and a shell, the edge of the main control board is arranged on the inner side wall of the shell in an embedded manner, the shell and the aluminum-based PCB are connected and fixed through a buckle, and the shell and the aluminum-based PCB are in sealed connection; and the aluminum-based PCB adopts a thick aluminum substrate. According to the technical scheme, through the innovative design of the sealing heat dissipation structure, the heat dissipation performance is improved, the assembly process is simplified, the cost is reduced, the waterproof sealing performance is enhanced, and the overall competitiveness of the product is improved. Through the technical effects, the controller has wide application prospect and market value in the field of motor control.

Description

Technical Field

[0001] The invention belongs to the technical field of motor controller structures, and in particular relates to a sealed heat dissipation structure and a motor controller. Background Art

[0002] With the further development of new energy technology, electric travel has become the preferred way for people to travel, and people have put forward higher demands on electric vehicles. With the development of science and technology, the performance and quality of electric vehicles are getting higher and higher. Continuous breakthroughs in materials, production processes, technological innovation, economy and environmental protection have greatly improved the performance of more and more electric vehicles, thus serving our work and life more efficiently.

[0003] At present, the annual production and sales volume of electric vehicles in the domestic market exceeds 50 million units, and the supply chain level is continuously improving. As one of the three core electric systems of electric vehicles, the motor controller is a core key component that affects the function, performance, reliability and safety of the entire vehicle. The controller obtains electrical energy from the power battery pack, and after modulation by its own inverter, obtains the current and voltage required to control the motor, and provides it to the motor so that the motor speed and torque meet the requirements of the entire vehicle. The controller is mainly composed of power device MOS tubes, bus capacitors and control circuit boards, power circuit boards, radiators, main power terminals, protective housings, screws, etc.

[0004] Motor controllers currently used in the industry: 1. The power density is low and the space volume is relatively large. The installation space on the vehicle will be limited, which will affect the layout of the vehicle and reduce the space utilization of the vehicle.

[0005] 2. The main reason for low power density is that the heat dissipation thermal resistance of the power tube is high, which is not conducive to the heat dissipation of the device. Generally, the traditional heat dissipation is to isolate the power MOS tube through a layer of thermal insulation pad and press it onto the surface of the heat sink for heat dissipation, or to first weld the MOS tube to the aluminum-based PCB board and then press the aluminum-based PCB board onto the surface of the heat sink for heat dissipation. The disadvantages of these two solutions are large thermal resistance and low heat dissipation efficiency.

[0006] 3. The installation of the shell needs to consider waterproof sealing. Generally, the traditional sealing gasket method or sealant method is used. The four sides need to be tightened with screws in sequence. The disadvantages of this method are complicated installation, high probability of thread stripping, and high process cost.

[0007] 4. In order to meet the heat dissipation requirements, the installation between the aluminum-based PCB board and the radiator requires locking screws, and the radiator needs to have a finely machined surface or be specially coated with thermal conductive silicone grease to fill the gap between the two, which makes the processing and assembly process complicated; 5. In order to meet the needs of mass production of controllers using traditional processes, controller suppliers need to invest a lot of money and manpower to build relatively complex automated production lines. Summary of the invention

[0008] The object of the present invention is to provide a sealed heat dissipation structure and a motor controller to solve the above problems.

[0009] To achieve the above object, the present invention adopts the following technical solutions: A sealed heat dissipation structure comprises an aluminum-based PCB, a main control board and a shell. The edge of the main control board is embedded on the inner wall of the shell. The shell is connected to the aluminum-based PCB. The aluminum-based PCB adopts a thick aluminum substrate.

[0010] Furthermore, the thick aluminum substrate is an aluminum substrate with a thickness greater than or equal to 3 mm, and a conductive column, a MOS tube and a busbar capacitor are arranged on the upper surface of the aluminum substrate, and the aluminum substrate as a whole serves as a heat dissipation structure.

[0011] Furthermore, through holes matching the conductive posts are provided on the main control board and the housing for passing the conductive posts.

[0012] Furthermore, a plurality of buckles are circumferentially arranged on the inner side wall of the shell, and the edge of the main control board is embedded in the shell through the buckles.

[0013] Furthermore, the buckle is a wedge-shaped buckle, and the number of the buckles is greater than or equal to four.

[0014] Furthermore, the housing and the aluminum-based PCB are fixed by a snap connection, and the connection between the housing and the aluminum-based PCB is a sealed connection.

[0015] Furthermore, a plurality of raised limiting pins are provided on the edge of the shell, and pin holes are provided on the aluminum-based PCB board. When the shell and the aluminum-based PCB board are connected, the limiting pins are inserted into the pin holes; and the pin holes are T-shaped holes.

[0016] Furthermore, a sealing adhesive groove is provided at the contact point between the edge of the housing and the aluminum-based PCB board.

[0017] Furthermore, the sealant is spot-coated in the sealant groove.

[0018] A motor controller comprises the sealed heat dissipation structure.

[0019] Compared with the prior art, the present invention has the following technical effects: The aluminum-based PCB board of the present invention is used as a heat dissipation structure: a thick aluminum substrate (thickness greater than or equal to 3mm) is used as the PCB board, and the entire aluminum substrate is directly used as a heat dissipation structure. Aluminum has good thermal conductivity and can effectively conduct away the heat generated by electronic components, thereby improving heat dissipation efficiency.

[0020] Two-in-one design: Traditionally, the PCB board and the heat sink are separate and need to be connected through thermal interface materials (such as thermal grease), which will increase the thermal resistance of heat transfer. This solution combines the aluminum-based PCB board and the heat sink into one, eliminating the thermal interface material, reducing the thermal resistance of heat transfer, and improving the heat dissipation effect.

[0021] The housing of the present invention is fixed to the aluminum-based PCB board by a snap connection, and the edge of the main control board is also embedded in the inner wall of the housing by a snap. This snap-on design avoids the use of screws for fixing, simplifies the assembly process, and improves production efficiency. The entire controller realizes a screw-free design, avoids installation processes such as threading the radiator and screwing in the assembly process, and further simplifies the assembly process.

[0022] The present invention reduces the use of parts such as screws and thermal interface materials through the two-in-one design and snap-on connection, thereby reducing material costs. The simplified assembly process improves production efficiency and reduces labor costs.

[0023] The edge of the housing of the present invention is provided with a sealing glue groove at the contact point with the aluminum-based PCB board, and the sealing glue is dotted in the groove. This design solves the waterproof sealing problem in the case of no radiator waterproof groove, and improves the waterproof performance of the controller.

[0024] The optimized heat dissipation structure and simplified assembly process enable the controller to withstand higher power density and improve product performance.

[0025] Standardized elements such as snap-fit ​​connections and sealant groove design improve manufacturing consistency and ensure product quality.

[0026] This solution has been optimized and improved in many dimensions, including the product's power density competitiveness, assembly process convenience, cost control economy, and production consistency, and has significant advantages over controllers using traditional processes.

[0027] In summary, this technical solution improves heat dissipation performance, simplifies assembly process, reduces cost, enhances waterproof sealing performance, and improves overall product competitiveness through innovative sealed heat dissipation structure design. These technical effects make this controller have broad application prospects and market value in the field of motor control. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is the overall structure diagram of the present invention.

[0029] Figure 2 It is a schematic diagram of the connection structure between the main control board and the shell of the present invention.

[0030] Figure 3 It is a schematic diagram of the connection structure between the housing and the aluminum-based PCB of the present invention.

[0031] Figure 4 It is a schematic diagram of the spot coating of the sealant of the present invention.

[0032] Figure 5 This is a comparison chart of heat dissipation between the present invention and the traditional controller.

[0033] in: 1. Aluminum-based PCB board, 2. Busbar capacitor, 3. Housing, 4. Main control board, 5. Conductive column, 6. MOS tube. DETAILED DESCRIPTION

[0034] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0036] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] See also Figure 1 Embodiment 1, the present invention provides a sealed heat dissipation structure, including an aluminum-based PCB board 1, a main control board 4 and a shell 3, the edge of the main control board 4 is embedded in the inner wall of the shell 3, the shell 3 and the aluminum-based PCB board 1 are fixed by a snap connection, and the connection between the shell 3 and the aluminum-based PCB board 1 is a sealed connection; the aluminum-based PCB board 1 adopts a thick aluminum substrate.

[0038] The present invention combines an aluminum-based PCB board and a radiator into one, thereby reducing heat transfer resistance and simplifying the assembly process; the controller realizes a screwless design, and the snap-fitting of the housing and the aluminum substrate avoids installation processes such as threading the radiator and screwing in the assembly process; the snap-fitting design of the control board and the housing avoids the installation of single-board fixing screws; the design of the housing sealing groove solves the waterproof sealing problem in the absence of a radiator waterproof groove.

[0039] The structure of the controller adopts a stacked arrangement. The bottom layer is an aluminum-based PCB board 1, which carries MOS tubes 6, conductive columns 5 and busbar capacitors 2 devices and circuits. At the same time, the aluminum-based PCB board 1 plays the role of heat dissipation; the next layer up is the main control board 4, which is connected to the aluminum-based PCB board 1 through plug-in terminals to complete the signal interconnection function; the top layer is the shell 3, which is connected to the aluminum-based substrate through snap-fits, and finally sealant is applied around the shell and the terminals to seal.

[0040] Example 2, please refer to Figures 1 to 5 The present invention provides a sealed heat dissipation structure, which is an innovative structural solution that combines the traditional aluminum-based PCB board and the radiator into one, and provides a product structure with low thermal resistance, high heat dissipation efficiency and high integration. Using a thick aluminum-based PCB board instead of a thin aluminum-based PCB board + radiator combination reduces the thermal resistance, increases the power density, and improves the ability of power devices and power circuits to withstand thermal shock; on the other hand, it greatly simplifies the assembly process of the product. In the traditional controller solution, the thickness of the aluminum-based PCB is between 1.6 and 2 mm. The thickness of the aluminum-based PCB board 1 of the product of the present invention is >= 3 mm.

[0041] Heat dissipation principle Aluminum-based PCB boards use thick aluminum substrates. Aluminum has a high thermal conductivity and can quickly transfer the heat generated by heating components (such as MOS tubes, busbar capacitors, etc.) to the entire aluminum substrate.

[0042] Integrated design: The aluminum substrate is not only used as a carrier of the circuit board, but also directly used as a heat sink, eliminating the thermal resistance caused by the thermal interface material in the traditional heat dissipation structure and improving the heat dissipation efficiency.

[0043] Heat conduction path Heating element to aluminum substrate: The heat generated by the heating element (such as MOS tube, bus capacitor) is in direct contact with the aluminum substrate through the welding point, and the heat is quickly transferred to the aluminum substrate.

[0044] Aluminum substrate to housing: The aluminum substrate is tightly connected to the housing through buckles, and the heat is further transferred to the housing. The housing acts as a heat dissipation surface to exchange heat with the external environment.

[0045] The main control board 4 and the housing 3 are installed and fixed in such a way that the main control board 4 is embedded in the plastic housing 3 to play the role of installation and fixing. The fixing method is through a snap connection, and there is no need for any screws in the entire assembly process; The housing 3 and the aluminum-based PCB board 1 are fixed by snap connection, avoiding the traditional screw locking method in the industry; the housing has a raised limit pin, and the aluminum-based board has a T-shaped hole, which can clamp the limit pin and protect it at the same time. The connection method without screw fastening simplifies the process of controller assembly to the greatest extent.

[0046] The housing 3 and the aluminum-based PCB board 1 are sealed by applying sealant, which is embodied in a sealant groove structure, which can solve the problem that there is no sealant groove on the aluminum substrate and the contact surface with the housing is a flat surface, and the sealant groove needs to be effectively sealed. By leaving a sealant groove on the upper cover, the glue filling process can be simplified and the waterproof effect can be improved.

[0047] In view of the shortcomings of traditional motor controllers, a high-power density controller with low heat transfer resistance and high heat dissipation efficiency is designed. The controller has a compact and reasonable structure, simple assembly process and beautiful appearance.

[0048] The controller combines the aluminum-based PCB board and the heat sink into one, which reduces the heat transfer resistance and simplifies the assembly process. The controller realizes a screwless design, and the snap-fitting combination of the shell and the aluminum substrate avoids the installation processes such as threading the radiator and screwing during assembly. The snap-fitting design of the control board and the shell avoids the installation of single-board fixing screws. The design of the shell sealing groove solves the waterproof sealing problem in the absence of a radiator waterproof groove.

[0049] This controller is optimized and improved in multiple dimensions, including the product's power density competitiveness, assembly process convenience, cost control economy, and production consistency, and has many significant advantages over controllers using traditional processes.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A sealed heat dissipation structure, characterized in that: The invention comprises an aluminum-based PCB board (1), a main control board (4) and a shell (3); the edge of the main control board (4) is embedded in the inner wall of the shell (3); the shell (3) is connected to the aluminum-based PCB board (1); and the aluminum-based PCB board (1) adopts a thick aluminum base plate.

2. A sealed heat dissipation structure according to claim 1, characterized in that: The thick aluminum substrate is an aluminum substrate with a thickness greater than or equal to 3 mm. A conductive column (5), a MOS tube (6) and a busbar capacitor (2) are arranged on the upper surface of the aluminum substrate, and the entire aluminum substrate serves as a heat dissipation structure.

3. A sealed heat dissipation structure according to claim 2, characterized in that: Through holes matching the conductive pillars (5) are provided on the main control board (4) and the housing (3) for passing the conductive pillars (5).

4. A sealed heat dissipation structure according to claim 1, characterized in that: A plurality of buckles are circumferentially arranged on the inner side wall of the outer shell (3), and the edge of the main control board (4) is embedded in the outer shell (3) through the buckles.

5. A sealed heat dissipation structure according to claim 4, characterized in that: The buckles are wedge-shaped buckles, and the number of the buckles is greater than or equal to four.

6. The sealed heat dissipation structure according to claim 1, characterized in that: The housing (3) and the aluminum-based PCB board (1) are fixed via a snap connection, and the connection between the housing (3) and the aluminum-based PCB board (1) is a sealed connection.

7. A sealed heat dissipation structure according to claim 6, characterized in that: A plurality of protruding limit pins are provided on the edge of the housing (3), and a pin hole is provided on the aluminum-based PCB board (1). When the housing (3) and the aluminum-based PCB board (1) are connected, the limit pins are inserted into the pin holes; the pin holes are T-shaped holes.

8. The sealed heat dissipation structure according to claim 6, characterized in that: A sealing adhesive groove is provided at the contact point between the edge of the housing (3) and the aluminum-based PCB board (1).

9. A sealed heat dissipation structure according to claim 8, characterized in that: Apply a little sealant to the sealant groove.

10. A motor controller, characterized in that: It comprises a sealed heat dissipation structure as described in any one of claims 1 to 9.

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