Bonded substrate, light-emitting device, method for manufacturing bonded substrate, and method for manufacturing light-emitting device

Abstract

Provided is a bonded substrate which is capable of reducing the occurrence of internal peeling and defects and which has excellent thermal conductivity. The bonded substrate (1) has a metal plate (3), a first ceramic (4), and a first metal body (5). The first metal body (5) is disposed between a first surface of the metal plate (3) and a first surface of the first ceramic (4), and at least 80% of a side surface (4C) connected to the first surface (4A) of the first ceramic (4).

Description

Technical Field

[0001] The present disclosure relates to a laminated substrate, a light-emitting device, a method for manufacturing a laminated substrate, and a method for manufacturing a light-emitting device. Background Art

[0002] In a light emitting device having a light emitting element such as a light emitting diode, the amount of light emitted by the mounted light emitting element increases year by year, and the light emitting elements are highly integrated, so the heat generation increases, and heat countermeasures become a problem.

[0003] As a substrate for a light emitting device, a laminated substrate in which a copper circuit board is bonded to a ceramic plate by an active metal brazing method is known, and a technique for dividing a large laminated substrate into individual pieces is also known.

[0004] For example, in order to prevent positioning deviation between the bonding material and the copper circuit board during bonding, a method has been reported in which a plurality of copper circuit boards are aligned and bonded using a positioning fixture and a temporary stopper on a flat ceramic substrate formed by arranging a plurality of ceramic substrates, and then the ceramic substrates are divided between the copper circuit boards to produce a plurality of substrates (for example, refer to patent document 1).

[0005] In addition, in order to suppress warping and deformation during the manufacture of large-scale substrates, a circuit substrate with slits is reported in which a dividing groove is provided on the circuit surface side or both main surfaces of a ceramic circuit substrate, the dividing groove is at a distance of more than 1.0 mm from the end of the circuit pattern, and the bottom wall thickness of the dividing groove is 0.2 to 0.5 mm (for example, refer to patent document 2).

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2014-175425

[0009] Patent Document 2: Japanese Patent Application Publication No. 2005-129625 Summary of the invention

[0010] Problems to be solved by the invention

[0011] An object of the present disclosure is to provide a laminated substrate having excellent thermal conductivity and a method for producing the same, in which the occurrence of internal peeling and defects is reduced.

[0012] Methods for solving problems

[0013] An embodiment of the present disclosure relates to a laminated substrate comprising a metal plate, a first ceramic, and a first metal body, which is arranged between a first surface of the metal plate and a first surface of the first ceramic, and on more than 80% of a side surface connected to the first surface of the first ceramic.

[0014] Furthermore, a light-emitting device according to one embodiment of the present disclosure includes the above-mentioned bonding substrate and a light-emitting element arranged on the above-mentioned bonding substrate.

[0015] In addition, a method for manufacturing a bonded substrate according to an embodiment of the present disclosure includes: arranging a first bonding material in the recessed portion of a first ceramic plate having a first surface, a recessed portion recessed from the first surface, and a second surface on the opposite side of the first surface, and on the first surface; arranging the first surface of the first ceramic plate and the first surface of the metal plate with the first bonding material interposed therebetween; firing the first ceramic plate, the first bonding material, and the metal plate; grinding or polishing the second surface of the first ceramic plate on a laminated body in which the metal plate and the first ceramic plate are bonded via the first metal body, wherein the first bonding material becomes a first metal body through the firing; and cutting the laminated body from the metal plate toward the first ceramic plate in a manner that penetrates the first metal body arranged in the recessed portion on a portion of the first ceramic plate exposed from the first ceramic plate through the grinding or polishing.

[0016] Furthermore, a method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: manufacturing a bonded substrate by the above-mentioned method for manufacturing a bonded substrate, and disposing a light-emitting element on the above-mentioned bonded substrate.

[0017] Effects of the Invention

[0018] According to one embodiment of the present disclosure, it is possible to provide a bonded substrate having excellent thermal conductivity and a method for manufacturing the bonded substrate with reduced occurrence of internal peeling and defects. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a side view schematically showing an example of the bonded substrate according to the present embodiment.

[0020] Figure 2 It is a bottom view schematically showing an example of the bonded substrate according to the present embodiment.

[0021] Figure 3 for Figure 2 Cross-sectional view along line III-III.

[0022] Figure 4 It is a side view schematically showing another example of the bonded substrate according to the present embodiment.

[0023] Figure 5 It is a bottom view schematically showing another example of the bonded substrate according to the present embodiment.

[0024] Figure 6 for Figure 5 Cross-sectional view on line VI-VI.

[0025] Figure 7 It is a perspective view schematically showing the light emitting device according to this embodiment.

[0026] Figure 8 This is a perspective view schematically showing a light emitting device according to this embodiment, with part of its structure omitted.

[0027] Fig. 9 This is a plan view schematically showing a light emitting device according to this embodiment.

[0028] Fig.10 for Figure 7 Cross-sectional view on XX-ray.

[0029] Fig.11 for Figure 7 Cross-sectional view along line XI-XI.

[0030] Fig.12 It is a flowchart which shows an example of the manufacturing method of the bonded substrate which concerns on this embodiment.

[0031] Fig.13 It is a flowchart showing another example of the method for manufacturing the bonded substrate according to the present embodiment.

[0032] Fig.14 It is a cross-sectional view schematically showing a manufacturing process in the manufacturing method of the bonded substrate according to the present embodiment.

[0033] Fig.15 It is a cross-sectional view schematically showing a manufacturing process in the manufacturing method of the bonded substrate according to the present embodiment.

[0034] Fig.16 It is a cross-sectional view schematically showing a manufacturing process in the manufacturing method of the bonded substrate according to the present embodiment.

[0035] Fig.17 It is a cross-sectional view schematically showing a manufacturing process in the manufacturing method of the bonded substrate according to the present embodiment.

[0036] Fig.18 It is a cross-sectional view schematically showing a manufacturing process in the manufacturing method of the bonded substrate according to the present embodiment.

[0037] Fig.19 It is a cross-sectional view schematically showing a manufacturing process in the manufacturing method of the bonded substrate according to the present embodiment.

[0038] Fig. 20 It is a cross-sectional view schematically showing a manufacturing process in the manufacturing method of the bonded substrate according to the present embodiment.

[0039] Fig.21 It is a cross-sectional view schematically showing a manufacturing process in the manufacturing method of the bonded substrate according to the present embodiment.

[0040] Fig. 22 It is a cross-sectional view schematically showing a manufacturing process in the manufacturing method of the bonded substrate according to the present embodiment.

[0041] Fig.23 It is a cross-sectional view schematically showing an example of the bonded substrate according to the present embodiment arranged on the second substrate.

[0042] Explanation of symbols

[0043] 1. Bonding substrate

[0044] 2. Bonding substrate

[0045] 3 Metal Plate

[0046] 3a Metal Plate

[0047] 3A Page 1

[0048] 3B Side 2

[0049] 4 No.1 Ceramics

[0050] 4a 1st ceramic plate

[0051] 4A Page 1

[0052] 4B Side 2

[0053] 4C side

[0054] 4D recess

[0055] 5. The first metal body

[0056] 5a The first bonding material

[0057] 5A Exposed face

[0058] 6. 2nd Ceramics

[0059] 6a 2nd ceramic plate

[0060] 6A Page 1

[0061] 6B Side 2

[0062] 7 Second Metal Body

[0063] 7a Second bonding material

[0064] 8. First conductive member

[0065] 8a Plating

[0066] 9 Second conductive member

[0067] 9a Plating

[0068] 10 1st base board

[0069] 10a Above

[0070] 10r Component placement area

[0071] 11 Terminal 1

[0072] 20 2nd base plate

[0073] 20a above

[0074] 20r Substrate mounting area

[0075] 22 Terminal 2

[0076] 25 Conductive paste

[0077] 30 Light-emitting element

[0078] 40 Wire

[0079] 40t Top

[0080] 50 1st frame

[0081] 60 2nd frame

[0082] 70 Covering components

[0083] 70t Top

[0084] 80 Translucent components

[0085] 90 Reflective components

[0086] 100 Light emitting device. DETAILED DESCRIPTION

[0087] Hereinafter, the manufacturing method of the embodiment of the present invention, the bonded substrate obtained by the manufacturing method (hereinafter, sometimes referred to as the "bonded substrate involved in the embodiment"), and the light-emitting device (hereinafter, sometimes referred to as the "light-emitting device involved in the embodiment") are described with reference to the accompanying drawings. In addition, in the following description, terms indicating specific directions and positions (for example, "upper", "lower", and other terms containing these terms) are used as needed. However, the use of these terms is to facilitate the understanding of the invention with reference to the accompanying drawings, and the technical scope of the present invention is not limited by the meaning of these terms. In addition, parts with the same symbol represented by multiple drawings represent the same or equivalent parts or components.

[0088] In addition, the embodiments shown below illustrate the bonding substrate, light-emitting device, etc. used to concretize the technical idea of ​​the present invention, and the present invention is not limited below. In addition, the dimensions, materials, shapes, relative configurations, etc. of the constituent parts described below, unless otherwise specified, are not intended to limit the scope of the present invention to only these, but are intended to be illustrative. In addition, the contents described in one embodiment can also be applied to other embodiments and variations. In addition, the sizes, positional relationships, etc. of the components shown in the drawings are sometimes exaggerated to make the description clear. Furthermore, in order to avoid the drawings from becoming overly complicated, a schematic diagram in which the illustration of a part of the elements is omitted is sometimes used, and an end view showing only the cut section is used as a cross-sectional view.

[0089] <Laminated substrate according to embodiment>

[0090] One side reference Figure 1 to Figure 3 A laminated substrate 1 as an example of the laminated substrate according to the embodiment will be described. Figure 1 FIG. 1 is a side view schematically showing the laminated substrate 1 . Figure 2 FIG. 1 is a bottom view schematically showing the laminated substrate 1 . Figure 3 for Figure 2 Cross-sectional view along line III-III.

[0091] The bonded substrate 1 comprises a metal plate 3, a first ceramic 4 and a first metal body 5, wherein the first metal body 5 is arranged between the first surface 3A of the metal plate 3 and the first surface 4A of the first ceramic 4, and over more than 80% of the side surface 4C connected to the first surface 4A of the first ceramic 4.

[0092] Figures 4 to 6 It is a figure which shows schematically the laminated substrate 2 which is another example of the laminated substrate concerning embodiment. Figure 4 FIG. 1 is a side view schematically showing the laminated substrate 2 . Figure 5 FIG. 1 is a bottom view schematically showing the laminated substrate 2 . Figure 6 for Figure 5 Cross-sectional view on line VI-VI.

[0093] The laminated substrate 2 is a mode in which the laminated substrate 1 further has a second ceramic 6 and a second metal body 7. The laminated substrate 2 has a metal plate 3, a first ceramic 4, a first metal body 5, a second ceramic 6, and a second metal body 7. The first metal body 5 is arranged between the first surface 3A of the metal plate 3 and the first surface 4A of the first ceramic 4, and more than 80% of the side surface 4C connected to the first surface 4A of the first ceramic 4. The second metal body 7 is arranged between the second surface 3B of the metal plate 3 and the first surface 6A of the second ceramic 6.

[0094] Hereinafter, each structure of the laminated substrate 1 and the laminated substrate 2 will be described.

[0095] (Metal Plate)

[0096] The metal plate 3 is a metal plate having excellent heat dissipation properties. The metal plate 3 has a first surface 3A and a second surface 3B which is the opposite side of the first surface 3A. The plan view shape of the metal plate 3 is, for example, a rectangle, but is not particularly limited.

[0097] The metal plate 3 is preferably a metal such as copper, nickel, aluminum, molybdenum, a laminate of two or more of these metals, or an alloy of two or more of these metals. The thickness of the metal plate 3 can be, for example, 100 μm to 700 μm, preferably 300 μm to 500 μm.

[0098] (First Ceramics)

[0099] The first ceramic 4 is an insulating and plate-shaped component. The first ceramic 4 has a first surface 4A, a second surface 4B which is the opposite side of the first surface 4A, and a side surface 4C other than the first surface 4A and the second surface 4B. The top view shape of the first ceramic 4 is, for example, a rectangle, and the first metal body 5 is arranged on more than 80%, preferably more than 90%, and more preferably 100% of the side surface 4C of the first ceramic 4. The first metal body 5 is arranged on 100% of the side surface 4C of the first ceramic 4, which means that the first metal body 5 covers the entire circumference of the side surface 4C of the first ceramic 4. The thickness of the first ceramic 4 can be, for example, more than 50 μm and less than 300 μm, preferably more than 80 μm and less than 150 μm.

[0100] The first ceramic 4 is sintered to be formed, and is not a ceramic in a softened state before sintering. The first ceramic 4 can be formed by sintering ceramics, and commercial products can be used. The first ceramic 4 can be a ceramic containing at least one of silicon nitride, aluminum nitride, boron nitride, magnesium oxide and aluminum oxide, preferably containing silicon nitride or aluminum nitride. In addition, the first ceramic 4 is preferably a nitride-based ceramic such as silicon nitride, aluminum nitride, and boron nitride, and an oxide-based ceramic such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide can be used. In addition, the first ceramic 4 can use beryllium oxide, silicon carbide, mullite, borosilicate glass, etc.

[0101] (First metal body)

[0102] The first metal body 5 is a metal body formed by sintering the first bonding material 5a. The first metal body 5 is arranged between the first surface 3A of the metal plate 3 and the first surface 4A of the first ceramic 4, and more than 80% of the side surface 4C connected to the first surface 4A of the first ceramic 4. The first metal body 5 is preferably arranged on the entire surface (100%) of the first surface 3A of the metal plate 3. The first metal body 5 is preferably arranged on the entire surface (100%) of the side surface 4C of the first ceramic 4.

[0103] The first metal body 5 has a main component of metal, including at least one of Cu, Cr, Ni, Ag, Al, Zn, Sn, and Ag-Cu alloy. The first metal body 5 preferably includes Ag and Cu, and the total content of Ag and Cu is 80% by mass or more of the entire first metal body 5. In addition, the first metal body 5 preferably further includes active metal elements such as Ti, Ce, Zr, and Mg.

[0104] (Second ceramic)

[0105] The second ceramic 6 is an insulating plate-shaped member. The second ceramic 6 has a first surface 6A and a second surface 6B that is the opposite side of the first surface 6A. The top view shape of the second ceramic 6 is, for example, a rectangle, but is not particularly limited. The material, shape, etc. of the second ceramic 6 can be appropriately selected from the items described in the first ceramic 4.

[0106] (Second metal body)

[0107] The second metal body 7 is a metal body formed by sintering the second bonding material 7a. The second metal body 7 is arranged between the second surface 3B of the metal plate 3 and the first surface 6A of the second ceramic 6. The second metal body 7 is preferably arranged on the entire surface (100%) of the second surface 3B of the metal plate 3. The composition of the second metal body 7 and the like can be appropriately selected from the items described in the first metal body 5.

[0108] In the laminated substrate 1 , the thermal conductivity of the first metal body 5 is preferably higher than that of the first ceramic 4 . In the laminated substrate 2 , the thermal conductivity of the first metal body 5 is preferably higher than that of the first ceramic 4 and the second ceramic 6 .

[0109] In the laminated substrate 1, the side surface of the metal plate 3 is preferably flush with the side surface of the first metal body 5. In the laminated substrate 2, the side surface of the metal plate 3 is preferably flush with the side surface of the first metal body 5 and the side surface of the second ceramic 6.

[0110] In the laminated substrate 1 and laminated substrate 2 having the above-described structure, the first metal body 5 is disposed between the first surface 3A of the metal plate 3 and the first surface 4A of the first ceramic 4, and at least 80% of the side surface 4C connected to the first surface 4A of the first ceramic 4, so that the metal body is disposed on the bottom surface and edge portion of the laminated substrate 1 and laminated substrate 2. As a result, for example, when mounted on other mounting substrates using a conductive paste, rounded corners can be formed, and laminated substrates 1 and laminated substrates 2 having excellent thermal conductivity can be provided. That is, the conductive paste such as silver paste is disposed on the first metal body 5 on the side surface 4C of the first ceramic 4 to wet and form a rounded corner, and a heat conduction path is not formed through the first ceramic 4, so that the thermal conductivity is further improved.

[0111] Furthermore, the bonded substrate 1 and the bonded substrate 2 can reduce the occurrence of peeling and cracking inside the first ceramic 4 in particular.

[0112] Furthermore, the laminated substrate 1 and the laminated substrate 2 can suppress the warping of the metal plate 3 , and in the laminated substrate 2 , the warping of the metal plate can be further suppressed.

[0113] <Light Emitting Device According to Embodiment>

[0114] The light emitting device 100 according to the embodiment includes the laminated substrate 1 or laminated substrate 2 according to the embodiment and the light emitting element 30 disposed on the laminated substrate 1 or laminated substrate 2. The light emitting device 100 preferably further includes a covering member 70 disposed around the light emitting element 30.

[0115] Figure 7 It is a perspective view schematically showing the light emitting device according to this embodiment. Figure 8 This is a perspective view schematically showing a light emitting device according to this embodiment, with part of its structure omitted. Fig. 9 This is a plan view schematically showing a light emitting device according to this embodiment. Fig.10 for Figure 7 Cross-sectional view on XX-ray. Fig.11 for Figure 7 Cross-sectional view along line XI-XI.

[0116] Figure 7 to Figure 11 As shown, the light emitting device 100 according to this embodiment includes a first substrate 10 as a laminated substrate according to this embodiment, a second substrate 20 , a light emitting element 30 , a wire 40 , a first frame portion 50 , a second frame portion 60 , and a covering member 70 .

[0117] The light emitting device 100 may include a translucent member 80 covering the upper surfaces of the plurality of light emitting elements 30. In addition, the light emitting device 100 may include a reflective member 90 that exposes the upper surfaces of the plurality of light emitting elements 30 and covers the side surfaces in the element mounting region 10r of the upper surface 10a of the first substrate 10. The following describes a case where the light emitting device 100 includes the translucent member 80 and the reflective member 90.

[0118] in addition, Figure 8 In the figure, for the convenience of illustration, a portion of each of the covering member 70, the first frame portion 50, the second frame portion 60, and the light-transmitting member 80 is omitted, and a portion of each of the wire 40 and the light-emitting element 30 is visualized. In addition, Fig. 9 In FIG. 1 , for convenience of illustration, the covering member 70 is omitted, and the lead wire 40 , the first frame portion 50 , the second frame portion 60 , and the like are visualized.

[0119] The first substrate 10 has a device mounting region 10r on the upper surface 10a, and a first terminal 11 arranged outside the device mounting region 10r. The light emitting device 30 is arranged in the device mounting region 10r of the first substrate 10. The second substrate 20 has a substrate mounting region 20r on the upper surface 20a on which the first substrate 10 is mounted, and a second terminal 22 arranged outside the substrate mounting region 20r.

[0120] The first substrate 10 is placed on the substrate placement region 20r of the second substrate 20. A first frame portion 50 surrounding the element placement region 10r is arranged on the inner side of the first terminal 11 of the upper surface 10a of the first substrate 10. A second frame portion 60 surrounding the first substrate 10 is arranged on the outer side of the second terminal 22 of the upper surface 20a of the second substrate 20.

[0121] The first terminal 11 of the first substrate 10 is electrically connected to the second terminal 22 of the second substrate 20 through the wire 40. The first terminal 11, the second terminal 22, and the wire 40 are located between the first frame portion 50 and the second frame portion 60 in a plan view. The first terminal 11, the second terminal 22, and the wire 40 are covered by the covering member 70.

[0122] (Light-emitting element)

[0123] The light-emitting element 30 is, for example, roughly rectangular in shape when viewed from above. The light-emitting element 30 can be, for example, square in shape with one side being 40 μm or more and 100 μm or less when viewed from above. The light-emitting element 30 includes a semiconductor stack and positive and negative electrodes disposed on the surface of the semiconductor stack. The light-emitting element 30 includes positive and negative electrodes on the same side, and is flip-chip mounted on the first substrate 10 with the surface having the electrodes as the bottom. In this case, the top surface on the opposite side to the surface on which the electrodes are disposed becomes the main light-collecting surface of the light-emitting element 30. In addition, in the light-emitting device 100, the light-emitting elements 30 are arranged and mounted on the first substrate 10 with predetermined intervals in each direction of the row and column directions. The size and number of the light-emitting elements 30 used can be appropriately selected according to the form of the light-emitting module to be obtained. Among them, it is preferred to mount smaller light-emitting elements 30 at a higher density. Thus, the irradiation range of the light emitted from the light-emitting device 100 can be controlled with a greater number of divisions. Such a light emitting device 100 can be used as a light source of a high-resolution lighting system. For example, the number of light emitting elements 30 included in the light emitting device 100 can be 1,000 or more and 20,000 or less.

[0124] The light emitting element 30 can be made of a material having any wavelength. For example, a nitride semiconductor (In X Al Y Ga 1-X-YN, 0≤X, 0≤Y, X+Y≤1). In addition, as the light-emitting element 30 emitting red light, a semiconductor represented by GaAlAs or AlInGaP can be used. Furthermore, a semiconductor light-emitting element including materials other than these can be used. The composition and emission color of the light-emitting element 30 used can be appropriately selected according to the purpose.

[0125] The light-emitting element 30 is bonded to the wiring arranged in the element mounting area 10r of the first substrate 10 through a conductive bonding member. When the light-emitting element 30 is flip-chip mounted on the first substrate 10, a bump containing a metal material such as Au, Ag, Cu, Al, etc. can be used as a bonding member. In addition, as a bonding member, a solder such as an AuSn alloy or a Sn-based lead-free solder can be used. In addition, as a bonding member, a conductive adhesive material containing conductive particles of metals, etc. in a resin can be used. The bonding of the light-emitting element 30 to the first substrate 10 can use a plating method. As a material for plating, for example, Cu can be cited. In addition, the electrodes of the light-emitting element 30 and the wiring of the first substrate 10 can be directly bonded without the aid of a bonding member.

[0126] (Covering member)

[0127] The covering member 70 is a light shielding member that covers the lead wire 40 on the outer side of the device mounting region 10r. In addition, the covering member 70 is, as an example, arranged in a frame shape in a plan view so as to surround the device mounting region 10r together with the covered lead wire 40. The covering member 70 is arranged so as to be in contact with the first frame portion 50 and the second frame portion 60.

[0128] The covering member 70 is arranged to be isolated from the light emitting element 30 when viewed from above. The distance separating the light emitting element 30 from the covering member 70 can be exemplified as being greater than 100 μm and less than 500 μm. In addition, in a plan view, the width of the covering member 70 located on the long side of the first substrate 10 is wider than the width of the covering member 70 located on the short side of the first substrate 10. The height of the covering member 70 (i.e., the distance from the upper surface 20a of the second substrate 20 to the upper surface of the covering member 70) is preferably arranged in a manner that is the highest directly above the top 40t of the wire 40. In other words, the covering member 70 is preferably arranged in a manner that the top 70t of the covering member 70 overlaps with the top 40t of the wire 40. In addition, the position of the top 70t of the covering member 70 is preferably arranged in a manner that is located above the top of the first frame portion 50. In addition, in this specification, the width of the covering member 70 located on the long side and the short side of the first substrate 10 refers to the width in the direction perpendicular to the long side and the short side of the first substrate 10 when viewed from above. In addition, the height of the covering member 70 refers to the distance from the upper surface of the second substrate 20 to the upper surface of the covering member 70.

[0129] As the covering member 70, for example, a resin containing a filler having light-shielding properties can be cited. As the resin of the base material, for example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, etc. can be used. As the filler having light-shielding properties, light-absorbing substances such as pigments, carbon black, titanium black, graphite, titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, glass fillers, etc. can be suitably used. Specifically, the appearance color of the covering member 70 can include white with excellent light reflectivity, black with excellent light absorption, and gray with light reflectivity and light absorption. In addition, the covering member 70 can be a resin layer that is stacked in multiple layers. Among them, the covering member 70 takes into account the degradation of the resin caused by light absorption, and the covering member 70 preferably uses a white resin with light reflectivity at least on the outermost surface.

[0130] The light emitting device 100 having the above structure can be used as a light source of a vehicle headlight, for example. In this case, for example, a structure is adopted in which light is irradiated to the outside through a lens from a light source. The light emitting device 100 lights the light emitting element 30 by an external power switch. In addition, the light emitting device 100 is configured so that a part or all of the light emitting elements 30 set in advance can be driven individually.

[0131] <Method for manufacturing laminated substrate according to embodiment>

[0132] The manufacturing method of the laminated substrate involved in the first embodiment includes: arranging a first bonding material in the recessed portion of a first ceramic plate having a first surface, a recessed portion recessed from the first surface, and a second surface on the opposite side of the first surface, and on the first surface; arranging the first surface of the first ceramic plate and the first surface of the metal plate with the first bonding material in between; firing the first ceramic plate, the first bonding material and the metal plate; grinding or polishing the second surface of the first ceramic plate on a laminated body formed by bonding the metal plate and the first ceramic plate via the first metal body, wherein the first bonding material becomes a first metal body through the above-mentioned firing; and cutting the above-mentioned laminated body from the metal plate toward the first ceramic plate in a manner that penetrates the above-mentioned first metal body arranged in the recessed portion on the above-mentioned laminated body in which a part of the above-mentioned first metal body is exposed from the above-mentioned first ceramic plate through the above-mentioned grinding or polishing.

[0133] Thereby, the bonded substrate 1 of this embodiment can be manufactured appropriately.

[0134] The manufacturing method of the laminated substrate involved in the second embodiment includes: before the above-mentioned firing, the above-mentioned first surface of the second ceramic plate and the second surface of the above-mentioned metal plate on the opposite side of the above-mentioned first surface are arranged with a second bonding material in between; during the above-mentioned firing, the above-mentioned second bonding material and the above-mentioned second ceramic plate are fired together with the above-mentioned first ceramic plate, the above-mentioned first bonding material and the above-mentioned metal plate; during the above-mentioned grinding or grinding, the above-mentioned stacked body is further subjected to the above-mentioned firing, and the above-mentioned second bonding material becomes a second metal body, and the above-mentioned metal plate and the above-mentioned second ceramic plate are bonded through the above-mentioned second metal body; during the above-mentioned cutting, the above-mentioned stacked body formed by bonding the above-mentioned second ceramic plate, the above-mentioned second metal body, the above-mentioned metal plate, the above-mentioned first metal body and the above-mentioned first ceramic plate is cut from the above-mentioned second ceramic plate toward the above-mentioned metal plate and the above-mentioned first ceramic plate.

[0135] Thereby, the bonded substrate 2 of this embodiment can be suitably manufactured.

[0136] Fig.12 It is a flowchart which shows the manufacturing method S1 of the bonded substrate which concerns on 1st Embodiment. Fig.13 It is a flowchart which shows the manufacturing method S2 of the bonded substrate which concerns on 2nd Embodiment.

[0137] Figure 14 to Figure 22 FIG. 1 is a diagram schematically showing an example of a manufacturing process of a method for manufacturing a light emitting module according to the present embodiment. Specifically, Figure 14 to Figure 22 The cross-sectional view is a diagram illustrating a manufacturing process in a manufacturing method of a laminated substrate. In the description of the manufacturing method, the preparation of components is not limited to manufacturing components, and includes the acquisition of components such as purchased components and transferred components.

[0138] (Configure the first bonding material)

[0139] The first bonding material is disposed in step S10 by disposing the first bonding material 5a in the recess 4D of the first ceramic plate 4a having the first surface 4A, the recess 4D recessed from the first surface 4A, and the second surface 4B opposite to the first surface 4A, and on the first surface 4A. Figure 14-15 ).

[0140] The first ceramic plate 4a is formed by firing a predetermined green sheet, etc., and is fired to solidify the ceramic powder. The recess 4D is preferably formed by irradiating a laser after firing the ceramic, grinding or grinding using a cutting machine, etc., and a depression can be set on the green sheet before firing, and the green sheet, etc. can be fired. The first ceramic plate 4a can be formed by aggregating a plurality of predetermined green sheets. The inner wall of the recess 4D becomes the side surface 4C of the first ceramic 4.

[0141] Fig.14The cross-sectional view schematically shows a first ceramic plate 4a having a first surface 4A, a recessed portion 4D recessed from the first surface 4A, and a second surface 4B on the opposite side of the first surface 4A. Fig.14 The width direction includes a first ceramic plate 4a such as a first ceramic 4, which can be Fig.14 The first ceramic plate 4a includes a plurality of first ceramics 4 in the width direction and the depth direction. The recessed portion 4D can be appropriately formed in a manner that becomes the top view shape of the first ceramic 4 in the target laminated substrate. For example, by using the first ceramic plate 4a in which the recessed portion 4D is lattice-shaped when viewed from above, a large number of laminated substrates can be manufactured.

[0142] The recess 4D in the first ceramic plate 4a having the recess 4D can be formed by laser processing, cutting, etc. The cross-sectional shape of the recess 4D can be rectangular or tapered. The width of the recess 4D can be appropriately selected according to the accuracy of grinding or grinding, for example, it can be 50 μm to 300 μm. The depth of the recess 4D can be, for example, 50 μm to 300 μm, preferably 80 μm to 150 μm.

[0143] then, Fig.15 As shown in the figure, the first bonding material 5a is arranged in the recessed portion 4D of the first ceramic plate 4a and on the first surface 4A. The first bonding material 5a can be arranged by screen printing, for example.

[0144] The first bonding material 5a is a component containing metal and having fluidity, preferably an active metal welding material. The first bonding material 5a can be applied and arranged in a manner that is closely fitted in the recess 4D and on the surface of the first surface 4A. Here, the recess 4D is filled, and the first bonding material 5a is further applied to the first surface 4A, and the first bonding material 5a is arranged in a manner that does not produce unevenness on the surface of the first bonding material 5a. The first bonding material 5a is preferably arranged in a manner that becomes a uniform thickness from the first surface 4A.

[0145] Furthermore, the first bonding material 5 a becomes the first metal body 5 by being fired.

[0146] The first bonding material 5a includes at least one selected from Cu, Cr, Ni, Ag, Al, Zn, Sn, and Ag-Cu alloy. Among these, Ag-Cu alloy that can be sintered at a relatively low temperature of 780° C. to 850° C. is preferred. In addition, at least one of Cu and Ag having high electrical conductivity is preferred.

[0147] The first bonding material 5a preferably includes active metal powder. The active metal powder can be at least one selected from TiH2, CeH2, ZrH2, and MgH2. Among these, TiH2 is preferred. By including TiH2, it reacts with the nitrogen contained in the first ceramic plate 4a, and a metal compound layer that becomes a reaction layer such as TiN is formed on the interface with the first ceramic plate 4a. As a result, the adhesion between the first metal body 5 formed by sintering the first bonding material 5a and the first ceramic plate 4a is improved, and the first metal body 5 is firmly adhered to the inside of the recess 4D and on the first surface 4A.

[0148] The first bonding material 5a may include an organic binder. The viscosity of the first bonding material 5a can be adjusted according to the type and amount of the organic binder. As the organic binder, for example, a resin material such as a solvent, acrylic acid, epoxy resin, urethane, ethyl cellulose, silicone, phenol, polyimide, polyurethane, melamine, urea, etc., which is generally used as a conductive paste, can be used. In addition, the organic binder is decomposed by the sintering described later and evaporated to be removed.

[0149] The first bonding material 5a may contain an inorganic filler other than metal. By containing the inorganic filler, the volume shrinkage of the first bonding material 5a during firing can be reduced. As the inorganic filler, for example, AlN, Si3N4, etc. can be used.

[0150] Measured in terms of the mass % of the first bonding material 5a relative to the total amount, the combined content of silver and copper is preferably greater than 80 mass %, the content of TiH2 as a metal active powder is preferably greater than 0.5 mass % and less than 10 mass %, the content of organic binder is preferably greater than 0.1 mass % and less than 10 mass %, and the content of inorganic filler is preferably greater than 1 mass % and less than 20 mass %.

[0151] (Configuration metal plate)

[0152] In the step S20 of arranging the metal plate, the first surface 4A of the first ceramic plate 4a and the first surface 3A of the metal plate 3a are arranged with the first bonding material 5a interposed therebetween (see Fig.16 ). Thus, a laminated body before firing for producing the laminated substrate 1 can be obtained.

[0153] The metal plate 3 a may be an assembly of a plurality of metal plates 3 , or may be a metal plate 3 separated into individual pieces by cutting as described later.

[0154] (Configure the second ceramic plate)

[0155] In the method for manufacturing a laminated substrate of the second embodiment, when manufacturing a laminated substrate 2 further having a second ceramic 6 and a second metal body 7 for the laminated substrate 1, the method further includes S25 (see S26) of configuring a second ceramic plate 6a. Fig.17). Thus, a laminated body before firing for producing the laminated substrate 2 can be obtained.

[0156] In S25 of arranging the second ceramic plate 6a, the first surface 6A of the second ceramic plate 6a and the second surface 3B of the metal plate 3a are arranged with the second bonding material 7a interposed therebetween before the above-mentioned firing.

[0157] The second bonding material 7a is a fluid member containing metal, preferably an active metal welding material. The second bonding material 7a can be applied and arranged on the first surface 6A of the second ceramic plate 6a or on the second surface 3B of the metal plate 3a, and can be selected appropriately.

[0158] The components and the like of the second bonding material 7a can be appropriately selected from those described for the first bonding material 5a.

[0159] The first bonding material 5a disposed in the recess 4D of the first ceramic plate 4a and on the first surface 4A may be the same as or different from the second bonding material 7a disposed on the first surface 6A side of the second ceramic plate 6a, but is preferably the same. The first bonding material 5a preferably has a lower organic solvent content than the second bonding material 7a, and preferably has a smaller volume shrinkage rate due to drying during firing.

[0160] (Firing)

[0161] Next, in the firing step S30, the first bonding material 5a and the second bonding material 7a are fired to obtain a laminated body having the first metal body 5 and the second metal body 7 (see Fig.18 ).

[0162] In the firing step S30, the first bonding material 5a is fired to bond the first ceramic plate 4a and the metal plate 3a. The first bonding material 5a is fired to obtain the first metal body 5.

[0163] In the method for manufacturing a laminated substrate according to the second embodiment, the first bonding material 5a and the second bonding material 7a are fired to bond the first ceramic plate 4a to the metal plate 3a and the second ceramic plate 6a to the metal plate 3a. Fig.17 and Fig.18 Each of the drawings shows a laminated body before firing and a laminated body after firing in the method for producing a laminated substrate according to the second embodiment.

[0164] The firing temperature can be 700° C. to 1200° C., preferably 800° C. to 1100° C. The firing atmosphere is preferably 10 -5 A vacuum atmosphere below Pa or an Ar atmosphere above 99.9%.

[0165] By firing the first bonding material 5a and the second bonding material 7a, the organic solvent is decomposed, volatilized and removed. By removing the organic solvent, the volume of the first metal body 5 and the second metal body 7 shrinks relative to the volume of the first bonding material 5a and the second bonding material 7a. By this shrinkage, in order to prevent the first metal body 5 and the second metal body 7 from being deformed or peeled off from the first ceramic plate 4a and the second ceramic plate 6a on the resulting fired laminate, and in order to reduce the warping of the first ceramic plate 4a and the second ceramic plate 6a, it is preferred to perform load firing. The load can be, for example, 0.001 kg / cm in the stacking direction in a manner that the load on the laminate before firing becomes uniform. 2 Above 2kg / cm 2 the following.

[0166] In addition, by firing, metal compound layers containing the reaction products of the non-metallic elements contained in the first ceramic plate 4a and the second ceramic plate 6a and the active metal elements contained in the first bonding material 5a and the second bonding material 7a are formed respectively. That is, the first metal body 5 has a metal compound layer formed from active metal powder at the interface between the first ceramic plate 4a and the first metal body 5. In the case of having the second metal body 7, the second metal body 7 has a metal compound layer formed from active metal powder at the interface between the second ceramic plate 6a and the second metal body 7. Here, the metal compound layer preferably contains TiN as a reaction product of nitrogen contained in the first ceramic plate 4a and the second ceramic plate 6a and TiH2 contained in the active metal powder of the first bonding material 5a and the second bonding material 7a. The first ceramic plate 4a and the first metal body 5 and the second ceramic plate 6a and the second metal body 7 all have metal compound layers at the interface, so that the reliability of bonding can be improved.

[0167] (grinding or grinding)

[0168] Next, the ground or milled S40 is placed on the obtained fired laminate (see Fig.18 ), the second surface 4B of the first ceramic plate 4a is ground or shaved. By grinding or shaving, a laminated body is obtained in which a portion of the first metal body 5 is exposed from the first ceramic plate 4a (see Fig.19 ).

[0169] In the grinding or grinding S40, the first bonding material 5a becomes the first metal body 5 by firing, and the second surface 4B of the first ceramic plate 4a is ground or ground on the stacked body formed by bonding the metal plate 3a and the first ceramic plate 4a via the first metal body 5.

[0170] In the grinding or grinding step S40 of the method for manufacturing a laminated substrate of the second embodiment, the laminate is further fired to form the second bonding material 7a into the second metal body 7, and the metal plate 3a and the first ceramic plate 4a are bonded via the second metal body 7. Furthermore, the second surface 6B of the second ceramic plate 6a may be ground or grinded.

[0171] It is preferable that the second surface 4B of the first ceramic plate 4a and the first metal body 5 are ground or polished so that the second surface 4B of the first ceramic plate 4a and the exposed surface of the first metal body 5 are flush with each other.

[0172] (Plating)

[0173] After grinding or milling and before cutting, the obtained ground or milled laminate (see Fig.19 ), further comprising plated S45 (refer to Fig. 22 ).

[0174] After the plated S45 is polished or ground and before being cut, the first conductive member 8 is arranged on the second surface 4B of the first ceramic plate 4a and the exposed surface 5A of the first metal body 5, and the plating layer 8a is applied to the first conductive member 8 (see Fig. 22 ).

[0175] The first conductive member 8 can be formed by sputtering a metal such as copper, for example. The plated layer 8a can be formed by electroless plating, and a plated wiring can be formed. The metal sputtering and plating can be performed through a mask.

[0176] Furthermore, in the method for manufacturing the laminated substrate of the second embodiment, it is preferred that the second conductive member 9 is disposed on the second surface 6B of the second ceramic plate 6a after grinding or lapping and before cutting. Furthermore, the second conductive member 9 may be plated 9a (see Fig. 22 ).

[0177] (Cutting the laminate)

[0178] S50 of cutting the laminated body is to grind or grind the obtained laminated body (see Fig.19 ) cut off (refer to Fig. 20 ), and obtain the bonded substrates separated into individual pieces (refer to Fig.21 ). The laminate before cutting is preferably an aggregate of a plurality of bonded substrates.

[0179] In the manufacturing method of the laminated substrate of the second embodiment, S50 of cutting the laminate is performed by grinding or grinding, so that the laminate ( S50 ) is cut from the metal plate 3a toward the first ceramic plate 4a in a manner that passes through the first metal body 5 arranged in the recessed portion 4D on the laminate where a portion of the first metal body 5 is exposed from the first ceramic plate 4a. Fig. 20, see the dotted arrow).

[0180] In the manufacturing method of the laminated substrate of the second embodiment, the S50 of cutting the laminated body is from the second ceramic plate 6a toward the metal plate 3a and the first ceramic plate 4a, and the laminated body ( Fig. 20 , see the dotted arrow).

[0181] The stacked body is preferably cut by at least one of irradiation with a water jet laser and cutting with a cutter. The cutting is performed along the shape of the pre-formed recess 4D in the stacking direction of the stacked body by means of the first metal body 5 disposed in the recess 4D of the first ceramic plate 4a.

[0182] The method for manufacturing a laminated substrate having the above-described structure can particularly reduce the occurrence of interlayer delamination between the first ceramic 4 and the metal plate 3 and the occurrence of defects in the first ceramic 4 , and can manufacture a laminated substrate with reduced occurrence of internal delamination and defects.

[0183] Here, through the research of the present inventors, the following problems of the prior art were found. That is, it was found that, in particular, when a large-scale substrate of the prior art in which a copper plate is sandwiched between two ceramic plates with an active metal welding material is used, when it is cut from the copper plate toward the ceramic plate by irradiation of a water jet laser or by cutting with a cutting machine and singulated, there are problems such as peeling between the layers of the ceramic plate and the copper plate, and defects inside the ceramic plate. The manufacturing method of the laminated substrate of the present embodiment, in particular, by removing the first ceramic plate 4a located at the pre-cut location and replacing it with the first metal body 5, can eliminate the problems of the prior art, and can manufacture a laminated substrate with reduced internal peeling and defects.

[0184] In addition, the manufacturing method of the laminated substrate of the present embodiment can manufacture a laminated substrate with excellent thermal conductivity. That is, in the manufactured laminated substrate, the first metal body 5 is arranged between the first surface 3A of the metal plate 3 and the first surface 4A of the first ceramic 4, and more than 80% of the side surface 4C connected to the first surface 4A of the first ceramic 4, so that the first metal body 5 is arranged on the bottom surface and edge of the laminated substrate, for example, when it is installed on other mounting substrates using conductive paste, rounded corners can be formed, and a laminated substrate with excellent thermal conductivity can be manufactured.

[0185] <Method for manufacturing light emitting device according to embodiment>

[0186] The method for manufacturing a light emitting device according to the embodiment includes: manufacturing a bonded substrate by the method for manufacturing a bonded substrate according to the above-mentioned embodiment (S1 or S2); and arranging a light emitting element on the bonded substrate.

[0187] (Configure light emitting elements)

[0188] The step S3 of configuring the light emitting element only requires configuring the light emitting element 30 on the laminated substrate, and a conventionally known method can be appropriately selected. For example, the light emitting element can be configured after the laminated substrate is manufactured or during the manufacturing process of the laminated substrate.

[0189] When a light emitting element is arranged during the manufacturing process of a laminated substrate, for example Fig. 22 As shown in FIG. 1 , the laminated body after grinding or lapping and before cutting can be provided with the second conductive member 9 on the second surface 6B of the second ceramic plate 6a, and the laminated body in which the second conductive member 9 is plated with a layer 9a can be provided with the light emitting element 30, for example, via a conductive bonding member. Then, it is possible to Fig. 22 The laminate is cut in the direction of the dotted arrow in the figure to obtain individual bonded substrates.

[0190] Fig.23 As shown, when the bonded substrate of this embodiment is installed by using a conductive paste 25 on the second substrate 20, the first metal body 5 is arranged between the first surface of the metal plate 3 and the first surface of the first ceramic 4, and on more than 80% of the side surface 4C connected to the first surface 4A of the first ceramic 4, so that the metal body is arranged on the bottom surface and edge portion of the bonded substrate, thereby forming rounded corners and manufacturing a bonded substrate with excellent thermal conductivity.

[0191] As mentioned above, although the preferred embodiments and the like have been described in detail, the embodiments and the like are not limited to the above embodiments and the like, and various modifications and substitutions can be made to the above embodiments and the like without departing from the scope described in the claims.

[0192] In addition to the above embodiment, the following supplementary notes are further disclosed.

[0193] (Note 1)

[0194] A laminated substrate comprising:

[0195] Metal sheets,

[0196] No. 1 Ceramics, and

[0197] The first metal body is arranged between the first surface of the metal plate and the first surface of the first ceramic, and covers more than 80% of the side surface connected to the first surface of the first ceramic.

[0198] (Note 2)

[0199] The laminated substrate according to Supplementary Note 1 further comprises:

[0200] Second ceramics, and

[0201] The second metal body is arranged between a second surface of the metal plate opposite to the first surface and the first surface of the second ceramic.

[0202] (Note 3)

[0203] The laminated substrate according to Supplementary Note 1 or 2,

[0204] The first metal body comprises silver and copper,

[0205] The total content of silver and copper is 80 mass % or more of the entire first metal body.

[0206] (Note 4)

[0207] The laminated substrate according to any one of appendices 1 to 3,

[0208] The thermal conductivity of the first metal body is higher than the thermal conductivity of the first ceramic.

[0209] (Note 5)

[0210] The laminated substrate according to any one of appendices 1 to 4,

[0211] The first metal body is disposed on the entire side surface of the first ceramic.

[0212] (Note 6)

[0213] In the laminated substrate according to any one of Supplementary Notes 1 to 5, the first metal body is arranged on the entire first surface of the metal plate.

[0214] (Note 7)

[0215] The laminated substrate according to any one of Supplementary Notes 1 to 6, wherein the side surface of the metal plate is flush with the side surface of the first metal body.

[0216] (Note 8)

[0217] A light emitting device comprising:

[0218] The laminated substrate according to any one of appendices 1 to 7, and

[0219] The light emitting element is arranged on the above-mentioned bonding substrate.

[0220] (Note 9)

[0221] The light emitting device according to Supplementary Note 8 further comprises:

[0222] A covering member is arranged around the light emitting element.

[0223] (Note 10)

[0224] A method for manufacturing a laminated substrate, comprising:

[0225] A first bonding material is disposed in the recessed portion of a first ceramic plate having a first surface, a recessed portion recessed from the first surface, and a second surface opposite to the first surface, and on the first surface.

[0226] The first surface of the first ceramic plate and the first surface of the metal plate are arranged with the first bonding material interposed therebetween.

[0227] The first ceramic plate, the first bonding material and the metal plate are fired.

[0228] After the first bonding material becomes a first metal body through the sintering, the second surface of the first ceramic plate is ground or milled on a laminated body formed by laminating the metal plate and the first ceramic plate via the first metal body.

[0229] By the grinding or polishing, a portion of the first metal body is exposed from the first ceramic plate on the laminate, and the laminate is cut from the metal plate toward the first ceramic plate in a manner that penetrates the first metal body arranged in the recess.

[0230] (Note 11)

[0231] According to the method for manufacturing a laminated substrate as described in Supplementary Note 10,

[0232] Before the firing, the first surface of the second ceramic plate and the second surface of the metal plate opposite to the first surface are arranged with a second bonding material interposed therebetween.

[0233] During the firing, the second bonding material and the second ceramic plate are fired together with the first ceramic plate, the first bonding material and the metal plate.

[0234] During the grinding or polishing, the laminate is further sintered, the second bonding material becomes a second metal body, and the metal plate and the second ceramic plate are bonded together via the second metal body.

[0235] During the cutting, the stacked body formed by laminating the second ceramic plate, the second metal body, the metal plate, the first metal body and the first ceramic plate is cut from the second ceramic plate toward the metal plate and the first ceramic plate.

[0236] (Note 12)

[0237] The method for manufacturing a laminated substrate according to Supplementary Note 10 or 11,

[0238] In the cutting, the stacked body is cut by at least one of irradiation with a water jet laser and cutting with a cutter.

[0239] (Note 13)

[0240] The method for producing a laminated substrate according to any one of Supplementary Notes 10 to 12,

[0241] In the above configuration, the first joining material is an active metal welding material.

[0242] (Note 14)

[0243] The method for producing a laminated substrate according to any one of Supplementary Notes 10 to 13,

[0244] During the calcination, the calcination temperature is 800°C or higher and 1100°C or lower.

[0245] (Note 15)

[0246] According to the manufacturing method of a laminated substrate described in any one of Notes 10 to 14, during the above-mentioned grinding or grinding, the above-mentioned second surface of the above-mentioned first ceramic plate and the above-mentioned first metal body are ground or ground in such a manner that the above-mentioned second surface of the above-mentioned first ceramic plate and the exposed surface of the above-mentioned first metal body become the same surface.

[0247] (Note 16)

[0248] The method for manufacturing a bonded substrate according to Supplementary Note 15 further comprises:

[0249] After the grinding or lapping and before the cutting, a first conductive member is disposed on the second surface of the first ceramic plate and the exposed surface of the first metal body, and the first conductive member is plated.

[0250] (Note 17)

[0251] The method for manufacturing a bonded substrate according to Supplementary Note 11 further comprises:

[0252] After the grinding or lapping and before the cutting, a second conductive member is disposed on the second surface of the second ceramic plate.

[0253] (Note 18)

[0254] The method for producing a laminated substrate according to any one of Supplementary Notes 10 to 17,

[0255] When the first bonding material is arranged in the recessed portions and on the first surface of the first ceramic plate, the recessed portions on the first surface of the first ceramic plate have a lattice shape in a plan view.

[0256] (Note 19)

[0257] A method for manufacturing a light emitting device, comprising:

[0258] A laminated substrate is manufactured by the method for manufacturing a laminated substrate according to any one of Supplementary Notes 10 to 18, and

[0259] A light emitting element is arranged on the laminated substrate.

Claims

1. A laminated substrate, comprising: Metal sheets, No. 1 Ceramics, and The first metal body is arranged between the first surface of the metal plate and the first surface of the first ceramic and covers more than 80% of the side surface connected to the first surface of the first ceramic.

2. The laminated substrate according to claim 1, further comprising: Second ceramics, and The second metal body is arranged between a second surface of the metal plate opposite to the first surface and the first surface of the second ceramic.

3. The laminated substrate according to claim 1 or 2, The first metal body comprises silver and copper, The total content of silver and copper is 80 mass % or more of the entire first metal body.

4. The laminated substrate according to any one of claims 1 to 3, The thermal conductivity of the first metal body is higher than the thermal conductivity of the first ceramic.

5. The laminated substrate according to any one of claims 1 to 4, The first metal body is disposed on the entire side surface of the first ceramic.

6. The laminated substrate according to any one of claims 1 to 5, The first metal body is arranged on the entire first surface of the metal plate.

7. The laminated substrate according to any one of claims 1 to 6, The side surface of the metal plate is flush with the side surface of the first metal body.

8. A light emitting device comprising: The laminated substrate according to any one of claims 1 to 7, and A light emitting element is disposed on the bonding substrate.

9. The light emitting device according to claim 8, further comprising: A covering member is arranged around the light emitting element.

10. A method for manufacturing a laminated substrate, comprising: A first bonding material is disposed in a first ceramic plate having a first surface, a recessed portion recessed from the first surface, and a second surface opposite to the first surface, in the recessed portion and on the first surface. The first surface of the first ceramic plate and the first surface of the metal plate are arranged with the first bonding material interposed therebetween. The first ceramic plate, the first bonding material and the metal plate are fired. The first bonding material becomes a first metal body through the firing, and the second surface of the first ceramic plate is ground or milled on a laminated body formed by bonding the metal plate and the first ceramic plate via the first metal body. In the laminated body where a portion of the first metal body is exposed from the first ceramic plate by the grinding or polishing, the laminated body is cut from the metal plate toward the first ceramic plate so as to penetrate the first metal body arranged in the recessed portion.

11. The method for manufacturing a bonded substrate according to claim 10, comprising: Before the firing, the first surface of the second ceramic plate and the second surface of the metal plate opposite to the first surface are arranged with a second bonding material interposed therebetween. During the firing, the second bonding material and the second ceramic plate are fired together with the first ceramic plate, the first bonding material and the metal plate. During the grinding or polishing, the laminate is further sintered, the second bonding material becomes a second metal body, and the metal plate and the second ceramic plate are bonded together via the second metal body. During the cutting, the laminated body formed by laminating the second ceramic plate, the second metal body, the metal plate, the first metal body, and the first ceramic plate is cut from the second ceramic plate toward the metal plate and the first ceramic plate.

12. The method for manufacturing a laminated substrate according to claim 10 or 11, In the cutting, the stacked body is cut by at least one of irradiation with a water jet laser and cutting with a cutter.

13. The method for producing a laminated substrate according to any one of claims 10 to 12, In the above configuration, the first joining material is an active metal welding material.

14. The method for producing a laminated substrate according to any one of claims 10 to 13, During the calcination, the calcination temperature is 800° C. or higher and 1100° C. or lower.

15. The method for producing a laminated substrate according to any one of claims 10 to 14, During the grinding or polishing, the second surface of the first ceramic plate and the first metal body are ground or polished so that the second surface of the first ceramic plate and the exposed surface of the first metal body become flush with each other.

16. The method for manufacturing a bonded substrate according to claim 15, further comprising: After the grinding or lapping and before the cutting, a first conductive member is disposed on the second surface of the first ceramic plate and the exposed surface of the first metal body, and the first conductive member is plated.

17. The method for manufacturing a bonded substrate according to claim 11, further comprising: After the grinding or lapping and before the cutting, a second conductive member is disposed on the second surface of the second ceramic plate.

18. The method for producing a laminated substrate according to any one of claims 10 to 17, When the first bonding material is arranged in the recessed portions and on the first surface of the first ceramic plate, the recessed portions on the first surface of the first ceramic plate have a lattice shape in a plan view.

19. A method for manufacturing a light emitting device, comprising: A laminated substrate is manufactured by the method for manufacturing a laminated substrate according to any one of claims 10 to 18, and A light emitting element is disposed on the laminated substrate.

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