Cutting method of metal ceramic composite material

Abstract

The invention provides a cutting method for a metal ceramic composite material. The cutting method comprises the steps that a to-be-cut piece is placed on a cutting platform; the to-be-cut piece comprises a metal layer and a first ceramic layer which are stacked, and the first ceramic layer covers the side, close to the laser, of the metal layer; a laser used for cutting the metal ceramic composite material is provided, and the laser is a composite pulse width laser and can generate nanosecond pulse laser and ultrafast laser with the pulse width below the picosecond level; and adjusting parameters of an output laser beam of the laser. Determining a preset cutting line of the to-be-cut piece; the laser emits ultrafast laser with the power of 1W-30W and the pulse width below the picosecond level to perform cold cutting on the first ceramic layer of the to-be-cut piece; and the laser emits nanosecond pulse laser with the power of 50-500 W, and the nanosecond pulse laser conducts thermal cutting on the metal layer of the to-be-cut piece along the preset cutting line again. The cutting method is good in cutting quality, high in cutting efficiency and low in overall equipment cost.

Description

Technical Field

[0001] The invention relates to the technical field of laser processing, and in particular to a cutting method for a metal-ceramic composite material. Background Art

[0002] Metal-ceramic composite materials are usually composed of one or more layers of metal (such as copper, aluminum, etc.) and ceramic materials. Metal materials have high thermal conductivity and electrical conductivity, and ceramic materials have high thermal conductivity, high temperature resistance, ablation resistance, and high insulation properties. Metal-ceramic composite materials have many application scenarios. For example, in the aerospace field and the semiconductor field, metal-ceramic composite materials are often needed. For example, a metal-ceramic composite material with good electrical properties, thermal conductivity, and high insulation properties is formed by using ceramics to cover the metal layer that has been designed into a circuit.

[0003] In actual production, the metal-ceramic composite material needs to be laser cut to obtain a size and shape that meets production requirements. However, the current laser cutting method for metal-ceramic composite materials generally has the problem of poor cutting quality.

[0004] Specifically, in the current cutting methods of copper, aluminum, silver and other metals, since the molecules of copper, aluminum and silver are ionic bonds with strong bonding force, it is difficult to use low-power femtosecond or picosecond ultrafast lasers for cold cutting, and the cutting efficiency is also relatively poor. If a higher-power ultrafast laser of 50-100W is used for cold cutting, the cost of these lasers is usually quite expensive. Therefore, most laser cutting uses nanosecond pulse lasers to perform thermal processing and cutting on copper, aluminum and silver, that is, melting copper and aluminum above their melting points before cutting.

[0005] However, ceramics are high-hardness, high-melting-point, and brittle materials. It is difficult to reach the melting point of ceramics by hot processing, and high-temperature cutting is prone to ceramic cracking when the temperature drops, reducing the reliability of the material. In addition, when cutting ceramics by hot processing, the notch accuracy is low, the cutting cannot be done neatly, and a certain taper is formed, which is not beautiful. Currently, high-precision ceramic cutting can only be performed by cold processing. Summary of the invention

[0006] In view of this, the present invention provides a cutting method for metal-ceramic composite materials to solve the problems of poor cutting quality and high cost of current metal-ceramic composite materials, that is, it is difficult to simultaneously meet the problems of good cutting quality of the ceramic layer and the metal layer, high cutting efficiency, and low overall equipment cost.

[0007] The present invention provides a cutting method for a metal-ceramic composite material, comprising the following steps:

[0008] S1: placing a workpiece to be cut on a cutting platform, wherein the workpiece to be cut comprises a stacked metal layer and a first ceramic layer, wherein the first ceramic layer covers a side of the metal layer close to the laser;

[0009] S2: Provide a laser for cutting metal-ceramic composite materials, wherein the laser is a composite pulse width laser capable of generating nanosecond pulse laser and ultrafast laser with a pulse width below picosecond level;

[0010] S3: Adjust the parameters of the output laser beam of the laser:

[0011] S4: confirming the preset cutting line of the workpiece to be cut;

[0012] S5: the laser emits an ultrafast laser with a pulse width below the picosecond level and a power of 1W-30W, and the laser with a pulse width below the picosecond level cold-cuts the first ceramic layer of the workpiece to be cut along the preset cutting line, and the cut of the workpiece to be cut is smooth, without taper or cracks;

[0013] S6: the laser emits a nanosecond pulse laser with a power of 50W-500W, and the nanosecond pulse laser again thermally cuts the metal layer of the workpiece to be cut along the preset cutting line.

[0014] In an optional solution, the metal-ceramic composite material described in the present application may not only be a composite material of a single metal layer and a single ceramic layer, but also be a composite material of multiple metal layers and multiple ceramic layers alternately stacked.

[0015] In an optional solution, the laser includes a first laser seed source, a second laser seed source, an acousto-optic modulator, a beam combiner, an isolator, and an amplifier module. The output end of the first laser seed source is connected to the input end of the acousto-optic modulator, the output end of the acousto-optic modulator is connected to one input end of the beam combiner, the output end of the second laser seed source is connected to the other input end of the beam combiner, the output end of the beam combiner is connected to the input end of the amplifier module 206, the acousto-optic modulator is used to control the on and off of the laser output by the first laser seed source, the first laser seed source is used to output a laser with a pulse width range of picoseconds or less, and the second laser seed source is used to output a laser with a pulse width range of nanoseconds.

[0016] The cutting method of the metal-ceramic composite material of the present application adopts a relatively low-power and relatively cheap ultrafast laser for cold cutting. When cutting the ceramic layer material, the ceramic layer can be cold-cut without reaching the melting point of the ceramic material. High-precision and high-quality ceramic cutting can be performed, and no cracks are generated in the ceramic material after cutting.

[0017] After cutting the ceramic layer, switch to nanosecond pulse laser to perform thermal cutting on the metal layer. The nanosecond pulse laser makes the metal layer reach its melting point and then be cut. Since the melting point of ceramics is higher than that of copper, aluminum, gold, silver and other metal materials, thermal cutting of the metal layer will not produce additional thermal effects on the ceramics, ensuring that the ceramic layer still has a good morphology when cutting the metal layer.

[0018] At the same time, since the ultrafast laser with a pulse width below the picosecond level used for cold cutting of ceramic layers and the nanosecond pulse laser for hot cutting of metal layers are generated by the same laser, they can be switched instantly when the laser is switched, which has high production and processing efficiency and can avoid errors in re-addressing the preset cutting line when different lasers are switched to cut different material layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of an embodiment of a method for cutting a metal-ceramic composite material of the present invention;

[0021] Figure 2 is a schematic diagram of another embodiment of a method for cutting a metal-ceramic composite material of the present invention;

[0022] Figure 3 is a schematic diagram of an embodiment of a laser of the present invention;

[0023] Figure 4 FIG. 4 is a schematic diagram of another embodiment of a laser according to the present invention.

[0024] Reference numerals:

[0025] 11. Metal layer, 12. First ceramic layer, 13. Second ceramic layer, 20. Laser,

[0026] 201. a first laser seed source, 202. a second laser seed source, 203. an acousto-optic modulator,

[0027] 204. beam combiner; 205. isolator; 206. amplification module; 207. frequency doubling module. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0032] Combine the following Figure 1 An embodiment of the method for cutting the metal-ceramic composite material of the present invention is described.

[0033] According to an embodiment of the present invention, a method for cutting a metal-ceramic composite material is provided, comprising the following steps:

[0034] S1: placing a workpiece to be cut on a cutting platform, wherein the workpiece to be cut comprises a stacked metal layer 11 and a first ceramic layer 12, wherein the first ceramic layer 12 covers a side of the metal layer 11 close to the laser 20;

[0035] S2: Provide a laser 20 for cutting metal-ceramic composite materials, wherein the laser 20 is a composite pulse width laser capable of generating nanosecond pulse laser and ultrafast laser with a pulse width below picosecond level.

[0036] S3: Adjust the parameters of the output laser beam of the laser 20:

[0037] S4: confirming the preset cutting line of the workpiece to be cut;

[0038] S5: the laser 20 emits an ultrafast laser with a pulse width of less than picoseconds and a power of 1W-30W, and the laser with a pulse width of less than picoseconds performs cold cutting on the first ceramic layer 12 of the workpiece to be cut along the preset cutting line, and the cut of the workpiece to be cut is smooth, without taper or cracks;

[0039] S6: The laser 20 emits a nanosecond pulse laser with a power of 50W-500W, and the nanosecond pulse laser performs thermal cutting on the metal layer 11 of the workpiece to be cut along the preset cutting line again, with high cutting efficiency.

[0040] Furthermore, the pulse frequency f of the infrared laser output by the laser 20 is controlled to be in the range of 100khz≤f≤1000khz, with the unit khz being kilohertz; the diameter D of the focused spot of the output laser beam of the laser 20 is controlled to be in the range of 30μm≤D≤100μm, with the unit μm being micrometer; the cutting speed v of the laser 20 is controlled to be in the range of 500mm / s≤v≤5000mm / s, with the unit mm / s being millimeter per second; the energy E of the output laser beam of the laser 20 is controlled to be in the range of 100uj≤E≤1000uj, with the unit uj being microjoule.

[0041] In a specific scheme, the pulse width τ of the ultrafast laser beam with a pulse width below the picosecond level output by the laser 20 is controlled to be in the range of 0.1ps≤τ≤200ps, where the unit ps is picosecond; the pulse width τ of the nanosecond pulse laser beam output by the laser 20 is controlled to be in the range of 1ns≤τ≤60ns, where the unit ns is nanosecond.

[0042] Combine the following Figure 2 Embodiments of the present invention are described.

[0043] In step S1, the workpiece to be cut includes, in addition to the stacked metal layer 11 and the first ceramic layer 12, a second ceramic layer 13, wherein the first ceramic layer 12 and the second ceramic layer 13 are respectively covered on both sides of the metal layer 11;

[0044] The cutting method of the metal-ceramic composite material further comprises the following steps:

[0045] S7: The laser 20 emits an ultrafast laser with a pulse width below the picosecond level and a power of 5W-30W. The laser with a pulse width below the picosecond level cold cuts the second ceramic layer 13 of the workpiece to be cut along the preset cutting line. The cut of the workpiece is smooth, without taper or cracks.

[0046] pass Figure 2 The described embodiments are for illustration only. The metal-ceramic composite material described in the present application may be not only a composite material of a single metal layer and a single ceramic layer, but also a composite material of multiple metal layers and multiple ceramic layers alternately stacked. Figure 2 The three-layer composite structure.

[0047] like Figure 3 As shown, Figure 3 The figure is a schematic diagram of an embodiment of the laser of the present invention. The laser 20 comprises a first laser seed source 201, a second laser seed source 202, an acousto-optic modulator 203, a beam combiner 204, an isolator 205 and an amplification module 206. The output end of the first laser seed source 201 is connected to the input end of the acousto-optic modulator 203, the output end of the acousto-optic modulator 203 is connected to one input end of the beam combiner 204, the output end of the second laser seed source 202 is connected to the other input end of the beam combiner 204, the output end of the beam combiner 204 is connected to the input end of the amplification module 206, the acousto-optic modulator 203 is used to control the on and off of the laser output of the first laser seed source 201, the first laser seed source 201 is used to output a laser with a pulse width range of picoseconds or less, and the second laser seed source 202 is used to output a laser with a pulse width range of nanoseconds. The central wavelength of the output laser can be 1000nm-1064nm, the spectral width range is 0.5nm±0.2nm, the power of the output ultrafast laser with a pulse width below picosecond level is 5W-30W, and the power of the output nanosecond pulse laser is 100W-500W. The specific power value can be selected based on the thickness, material and other parameters of the part to be cut in actual production.

[0048] In a preferred embodiment, the first laser seed source 201 is in a normally-on state, and the switching time of the acousto-optic modulator 203 is in the nanosecond order. When the ultrafast laser with a pulse width below the picosecond level and the nanosecond pulse laser are switched, there is no obvious time interval feeling, that is, the switching feeling is instantaneous.

[0049] In a specific solution, the pulse width range of the laser output by the first laser seed source 201 is less than 200ps, and the pulse width range of the laser output by the second laser seed source 202 is 1ns-500ns, that is, the switching time of the acousto-optic modulator 3 with instantaneous switching sensation is 2ns-200ns.

[0050] like Figure 4 As shown, Figure 4Schematic diagram of another embodiment of the laser of the present invention. The laser 20 also includes a frequency doubling module 207, which is located behind the amplification module 206 and is used to frequency-double the 1000nm-1064nm infrared laser amplified by the amplification module 206 to generate a 500nm-550nm green laser. For example, it can be used to convert an infrared laser with a central wavelength of 1030 nanometers or 1064 nanometers into a green laser with a central wavelength of 515 nanometers or 532 nanometers. By setting the frequency doubling module 207, an output laser with a shorter wavelength can be obtained. Since the absorption rate of metal materials such as copper, aluminum, and silver to green laser is much greater than that of infrared laser, the use of a 500nm-550nm green laser to process metal materials will have better processing efficiency and quality. The power of the ultrafast green laser with a pulse width below the picosecond level output is 1W-20W, and the power of the nanosecond pulse green laser output is 50W-200W. Similarly, the specific power value can be selected based on the thickness, material and other parameters of the piece to be cut in actual production.

[0051] Furthermore, the pulse frequency f of the green laser output of the laser 20 is controlled to be within the range of 200khz≤f≤2000khz; the diameter D of the focused spot of the output laser beam of the laser 20 is controlled to be within the range of 10μm≤D≤50μm; the cutting speed v of the laser 20 is controlled to be within the range of 500mm / s≤v≤5000mm / s; the energy E of the output laser beam of the laser 20 is controlled to be within the range of 50uj≤E≤500uj.

[0052] In a specific solution, the pulse width τ of the ultrafast laser beam with a pulse width below picosecond level output by the laser 20 is controlled to be within the range of 1ps≤τ≤200ps; the pulse width τ of the nanosecond pulse laser beam output by the laser 20 is controlled to be within the range of 5ns≤τ≤200ns.

[0053] In a specific solution, the metal layer 11 can be an aluminum layer, a copper layer, or a silver layer. When the laser of the present application is used to process metal materials with a higher melting point, for example, when cutting copper-based ceramic composite materials, the energy of the laser 20 can be adjusted higher, and when cutting aluminum materials, the energy of the laser 20 can be adjusted lower.

[0054] In a specific solution, the materials of the first ceramic layer 12 and the second ceramic layer 13 at least include components such as aluminum oxide, zirconium oxide and silicon dioxide.

[0055] In a preferred embodiment, the materials of the first ceramic layer 12 and the second ceramic layer 13 further include boehmite, and the boehmite is used to bond various other components in the ceramic material.

[0056] Taking a double-layer metal-ceramic composite material as an example, the specific cutting procedure of the cutting method of the metal-ceramic composite material of the present application is as follows:

[0057] An ultrafast laser is firstly used to focus on the first ceramic layer 12, which is suitable for breaking the molecular bonds of the first ceramic layer 12, and does not generate high temperature during the cutting process, so as to cold cut the first ceramic layer 12. After the ultrafast laser cuts the first ceramic layer 12, it is switched to a nanosecond pulse laser focused on the metal layer 11, and the energy of the nanosecond pulse laser reaches or exceeds the melting point of the metal layer 11, so as to perform pulsed thermal cutting on the metal layer 11, thereby completing the cutting of the entire metal-ceramic composite material.

[0058] In an optional solution, the thickness H1 of the metal layer 11 can be selected within the range of 5 μm≤H1≤100 μm, and the thickness H2 of the first ceramic layer 12 and the second ceramic layer 13 can be selected within the range of 10 μm≤H2≤1000 μm, where the unit μm is micrometer.

[0059] Preferably, in the cutting method of the metal-ceramic composite material, the value range of the above-mentioned laser 20 parameters is obtained through multiple cutting tests.

[0060] Obviously, the above embodiments are only examples for clear explanation, and are not intended to limit the implementation methods. Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the present invention.

Claims

1. A method for cutting a metal-ceramic composite material, characterized in that: include: S1: placing a workpiece to be cut on a cutting platform, the workpiece to be cut comprising a stacked metal layer (11) and a first ceramic layer (12), the first ceramic layer (12) covering a side of the metal layer (11) close to the laser (20); S2: providing a laser (20) for cutting a metal-ceramic composite material, wherein the laser (20) is capable of generating nanosecond pulsed laser and ultrafast laser with a pulse width below picosecond level; S3: Adjust the parameters of the output laser beam of the laser (20): S4: confirming the preset cutting line of the workpiece to be cut; S5: the laser (20) emits an ultrafast laser with a pulse width of less than picoseconds and a power of 1W-30W, and the laser with a pulse width of less than picoseconds performs cold cutting on the first ceramic layer (12) of the workpiece to be cut along the preset cutting line; S6: the laser (20) emits a nanosecond pulse laser with a power of 50W-500W, and the nanosecond pulse laser again performs thermal cutting on the metal layer (11) of the workpiece to be cut along the preset cutting line.

2. The method for cutting a metal-ceramic composite material according to claim 1, characterized in that: The metal-ceramic composite material also includes other metal layers and ceramic layers stacked alternately.

3. The method for cutting a metal-ceramic composite material according to claim 1, characterized in that: The laser (20) comprises a first laser seed source (201), a second laser seed source (202), an acousto-optic modulator (203), a beam combiner (204), an isolator (205) and an amplification module (206); The first laser seed source (201) is used to output laser light with a pulse width range of picoseconds or less, and the second laser seed source (202) is used to output laser light with a pulse width range of nanoseconds; The output end of the first laser seed source 1 is connected to the input end of an acousto-optic modulator (203), the output end of the acousto-optic modulator (203) is connected to an input end of a beam combiner (204), the output end of the second laser seed source (202) is connected to the other input end of the beam combiner (204), the output end of the beam combiner (204) is connected to the input end of an amplification module (206), and the acousto-optic modulator (203) is used to control the on and off of the laser output of the first laser seed source (201).

4. The method for cutting a metal-ceramic composite material according to claim 1, characterized in that: The central wavelength of the output laser can be 1000nm-1064nm, the power of the output ultrafast laser with a pulse width below the picosecond level is 5W-30W, and the power of the output nanosecond pulse laser is 100W-500W.

5. The method for cutting a metal-ceramic composite material according to claim 4, characterized in that: The pulse width range of the laser output by the first laser seed source (201) is less than 200 ps, ​​and the pulse width range of the laser output by the second laser seed source (202) is 1 ns-500 ns.

6. The method for cutting a metal-ceramic composite material according to claim 4, characterized in that: The laser (20) further comprises a frequency doubling module 207, and the frequency doubling module 207 is located behind the amplification module (206).

7. The method for cutting a metal-ceramic composite material according to claim 6, characterized in that: The frequency doubling module 207 frequency-doubles the 1000nm-1064nm infrared laser to generate 500nm-550nm green laser. The output power of the ultrafast green laser with a pulse width below the picosecond level is 1W-20W, and the output power of the nanosecond pulse green laser is 50W-200W.

8. The method for cutting a metal-ceramic composite material according to claim 7, characterized in that: The value of the diameter D of the focus spot of the output laser beam of the laser (20) is controlled to be within the range of 10 μm-50 μm.

9. The method for cutting a metal-ceramic composite material according to claim 1, characterized in that: The thickness H1 of the metal layer (11) is in the range of 5 μm-100 μm, and the thickness H2 of the first ceramic layer (12) is in the range of 10 μm-1000 μm.

10. The method for cutting a metal-ceramic composite material according to claim 1, characterized in that: The material of the first ceramic layer (12) includes at least alumina, zirconium oxide, silicon dioxide and boehmite.

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