Flying probe tester calibration device and method based on high-resolution camera

Abstract

The invention relates to the technical field of flying probe test machine calibration, and discloses a flying probe test machine calibration device and method based on a high-resolution camera, the device comprises a correction plate and a CCD camera, the correction plate is fixedly installed on a flying probe test machine, the correction plate is provided with through holes distributed in an array, the through holes are distributed at equal division points on the correction plate, and the CCD camera is arranged on the correction plate. The two CCD cameras are installed on the flying probe testing machine, and light rays in the through holes are detected through the CCD cameras so that the flying probe testing machine can be calibrated. According to the calibration device, the two CCD cameras are installed on the flying probe testing machine, mechanical errors of the flying probe testing machine are calibrated through the high-resolution CCD cameras, a visual control system is fully utilized, a probe of the flying probe testing machine is accurately pricked in the center position of a corresponding testing bonding pad on a circuit board, the production efficiency of a PCB is improved, and the production cost is reduced. The cost is reduced, the calibration operation of the calibration method is simple, the calibration steps are few, and the calibration efficiency and the calibration precision are improved.

Description

Technical Field

[0001] The invention relates to the technical field of flying probe tester calibration, and in particular to a flying probe tester calibration device based on a high-resolution camera and a method thereof. Background Art

[0002] Flying probe tester is a system for testing PCB in manufacturing environment. Flying probe test uses four to eight independently controlled probes, which are installed on tiny reciprocating parts that can move freely on xy plane. The test points are directly controlled by CADI Gerber data. The unit under test is transported to the tester by belt or other unit under test conveying system, and then fixed. The probe of the tester contacts the test pads and paths to test the single components of the unit under test.

[0003] As electronic products develop towards miniaturization and digitalization, printed circuit boards are also developing towards high density and high precision. In turn, the requirements for the test accuracy of flying probe testers are also correspondingly increased. The general approach to improving the test accuracy of flying probe testers is to focus on the optimization of mechanical structures and the use of transmission components with higher precision levels. However, errors are inevitable in any processing and measurement.

[0004] An industrial camera is a high-performance image acquisition device specifically designed for industrial applications. It converts light signals into digital images through imaging sensors and analyzes and processes images through image processing algorithms.

[0005] In the prior art, as disclosed in the application number: CN201510235763.9, the name is: deviation correction method for flying probe tester, wherein the center of the cross target of the camera image is aligned with the center o of one of the test points of the PCB board to be calibrated; the probe is controlled to detect the PCB board to be calibrated to obtain the probe test point t, and the probe is controlled to find the edge points a1 and a2 on both sides along the X or Y direction with the probe test point t as the initial point, and the center point a3 in the X or Y direction is found according to the two edge points detected in the X or Y direction; the center point a3 in the X or Y direction is controlled to find the edge points b1 and b2 on both sides along the Y or X direction with the center point a3 in the X or Y direction as the starting point, and the center o of the test point of the PCB board to be calibrated is found according to the two edge points detected in the Y or X direction, and the deviation between the probe initial point t and the center o of the test point is the actual offset between the probe and the camera center; the control system compensates for the above actual offset and then performs the test.

[0006] However, the correction methods mentioned in the prior art result in different correction results due to different camera resolutions; the flying probe tester cannot utilize the visual control system to perform self-correction, needle tip correction, and correction of test points on the PCB board. Therefore, it is necessary to provide a flying probe tester calibration device and method based on a high-resolution camera. Summary of the invention

[0007] The object of the present invention is to provide a flying probe tester calibration device based on a high-resolution camera and a method thereof to solve the problems in the prior art.

[0008] The purpose of the present invention can be achieved by the following technical solutions:

[0009] A flying probe tester calibration device based on a high-resolution camera, the calibration device comprising a calibration plate and a CCD camera, the calibration plate being fixedly mounted on the flying probe tester, the calibration plate being provided with through holes distributed in an array, the through holes being distributed at equally divided points on the calibration plate, two CCD cameras being mounted on the flying probe tester, the CCD cameras being used to detect light in the through holes for calibrating the flying probe tester.

[0010] Furthermore, the flying probe tester includes a machine base, on which symmetrically distributed side panels are fixed, on which a top panel is fixed, and on which symmetrically distributed electric slides are fixed, wherein two electric slides are horizontally arranged on both sides of the machine base.

[0011] Furthermore, a symmetrically distributed electric slide 2 is slidably arranged on the electric slide 1, a symmetrically distributed sliding block is slidably arranged on the electric slide 2, and a shell is fixedly arranged on the sliding block.

[0012] Furthermore, a baffle is fixedly provided on one side of the shell, a connecting plate is fixed inside the shell, the connecting plate is located on one side of the baffle, a fixing seat is fixed between the connecting plate and the baffle, and a detection component is fixed on the fixing seat.

[0013] Furthermore, a mounting block is fixed on one side of the connecting plate away from the baffle, a mounting plate is fixed on one end of the mounting block, a CCD camera is fixedly mounted on the mounting plate, the CCD camera is located on the A1BY axis and B1BY axis of the eight-head flying probe tester, and the two CCD cameras are used for calibrating the front and back of the flying probe tester.

[0014] Furthermore, a clamping assembly is fixed on the machine base, and the clamping assembly includes two clamps, and the two clamps are horizontally arranged between the machine base and the top plate, and the two clamps are used to fix the correction plate.

[0015] Furthermore, a precision-grade film is assembled on the correction plate.

[0016] A flying probe tester calibration method based on a high-resolution camera, using the flying probe tester calibration device based on a high-resolution camera to calibrate the flying probe tester, the calibration method comprising the following steps:

[0017] S1. Use the high-resolution CCD camera installed at the A1BY axis and B1BY axis of the eight-head flying probe tester to calibrate the A1BY axis and B1BY axis through a calibration plate loaded with precision-grade film.

[0018] S2. Then, use the high-resolution CCD camera at the A1BY axis and B1BY axis position to calibrate the needle tip of each axis.

[0019] S3. During the flying probe test, the high-resolution CCD camera at the A1BY axis and B1BY axis position is used to detect the exact position of the PCB board on the fixture in the flying probe tester through three-point positioning, so that the probes of each axis can be directly controlled to accurately pierce the corresponding points to complete precise calibration.

[0020] Beneficial effects of the present invention:

[0021] 1. The calibration device of the present invention installs two CCD cameras on the flying probe tester, and calibrates the mechanical error of the flying probe tester through the high-resolution CCD camera, making full use of the visual control system, so that the flying probe tester probe can accurately pierce the center position of the corresponding test pad on the circuit board, thereby improving the production efficiency of the PCB board and reducing the cost;

[0022] 2. The calibration device of the present invention, the flying probe tester uses the visual control system to perform self-calibration, calibrate each axis, calibrate the needle tip, and calibrate the test points of the PCB board. The high-resolution CCD camera can improve the test accuracy of the aircraft tester;

[0023] 3. The calibration method of the present invention has simple calibration operation for the flying probe tester, fewer calibration steps, and improved calibration efficiency and calibration accuracy. The flying probe tester is accurately tested based on a high-resolution CCD camera, and the test position is accurately controlled to ensure that the flying probe is inserted into the corresponding point on the calibration plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below in conjunction with the accompanying drawings.

[0025] Figure 1 It is a structural schematic diagram of a flying probe tester of the present invention;

[0026] Figure 2 The present invention Figure 1 The enlarged structural diagram at A in the middle;

[0027] Figure 3 is a top view of the flying probe tester of the present invention;

[0028] Figure 4 It is a front view of the flying probe tester of the present invention;

[0029] Figure 5It is a partial structural schematic diagram of the flying probe tester of the present invention;

[0030] Figure 6 It is a structural schematic diagram of a calibration device of a flying probe tester of the present invention;

[0031] Figure 7 is a schematic diagram of the calibration operation of the present invention;

[0032] Figure 8 It is a structural schematic diagram of the correction plate of the present invention;

[0033] Fig. 9 It is a schematic diagram of calibration of the flying probe tester of the present invention;

[0034] Fig.10 It is a schematic diagram of the imaging center correction operation of the present invention;

[0035] Fig.11 It is a structural schematic diagram of a flying probe tester of the present invention;

[0036] Fig.12 It is a front view of the flying probe tester of the present invention;

[0037] Fig.13 It is a structural schematic diagram of the correction plate of the present invention;

[0038] Fig.14 It is a schematic diagram of the imaging center correction operation of the present invention;

[0039] Fig.15 It is a schematic diagram of the imaging center correction operation of the present invention;

[0040] Fig.16 It is a schematic diagram of the imaging center correction operation of the present invention;

[0041] Fig.17 It is a schematic diagram of the imaging center correction operation of the present invention;

[0042] Fig.18 It is a pixel count map of 400,000 pixels of the present invention;

[0043] Fig.19 This is a pixel count diagram of 6 million pixels of the present invention.

[0044] The accompanying drawings are as follows:

[0045] 1. Machine base; 2. Side panel; 3. Electric slide 1; 4. Electric slide 2; 5. Slider; 6. Mounting block; 7. Housing; 8. Baffle; 9. Connecting plate; 10. Fixed seat; 11. Mounting plate; 12. Correction plate; 13. Detection assembly. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] A flying probe test machine calibration device based on a high-resolution camera, such as Figure 1 , Figure 2 As shown, the flying probe tester includes a machine base 1, on which are fixedly provided symmetrically distributed side panels 2, on which a top plate is fixedly installed, and on which are fixedly provided symmetrically distributed electric slides 3. Two electric slides 3 are horizontally arranged on both sides of the machine base 1, and are located between the machine base 1 and the top plate.

[0048] A symmetrically distributed electric slide 2 4 is slidably provided on the electric slide 1 3, a symmetrically distributed slider 5 is slidably provided on the electric slide 2 4, a shell 7 is fixedly provided on the slider 5, a baffle 8 is fixedly provided on one side of the shell 7, a connecting plate 9 is fixedly provided inside the shell 7, the connecting plate 9 is located on one side of the baffle 8, a fixing seat 10 is fixedly provided between the connecting plate 9 and the baffle 8, and a detection component 13 is fastened on the fixing seat 10.

[0049] A mounting block 6 is fixedly provided on one side of the connecting plate 9 away from the baffle 8, a mounting plate 11 is fixedly provided at one end of the mounting block 6, a CCD camera is fixedly installed on the mounting plate 11, and the CCD camera is installed on the A1BY axis and B1BY axis of the eight-head flying probe tester, that is, a set of CCD cameras are installed on the A side (front) A1BY axis and the B side (back) B1BY axis respectively, which reciprocate up and down with the A1BY or B1BY axis, and can also reciprocate left and right with the A1X or B1X axis, but does not move with the A1BX or B1BX axis.

[0050] Assume that the motion time functions of the A1BY axis and B1BY axis CCD cameras in the x-axis direction are:

[0051] X A =X(t A )

[0052] X B =X(t B )

[0053] Assume that the motion time functions of the A1BY axis and B1BY axis CCD cameras in the y-axis direction are:

[0054] y2 A =f(T A )

[0055] y2 B=f(T B )

[0056] The corresponding movements are controlled by the servo motors of each axis, such as Figure 3-Figure 5 shown.

[0057] like Figure 6 As shown, a clamping assembly is fixedly provided on the machine base 1, and the clamping assembly includes two clamps. The two clamps are located between the machine base 1 and the top plate, and the clamps are located between two electric slides 3. The two clamps are arranged in an upper and lower horizontal state, respectively, and a correction plate 12 is fixedly provided between the two clamps. A precision-grade film is assembled on the correction plate 12. When the correction plate 12 is fixedly installed on the flying probe tester, the position is adjusted.

[0058] Depend on Figure 6 It can be seen that the area where the correction plate 12 is installed is equivalent to the effective test area of ​​the flying probe tester;

[0059] Using the equal division property of the calibration board, the effective test area of ​​the flying probe tester is divided into the following equal parts:

[0060] In the x-axis direction, it is divided into 18 equal parts at a spacing of 40 mm;

[0061] In the y-axis direction, it is divided into 15 equal parts at a spacing of 40 mm;

[0062] The CCD cameras at the A1BY and B1BY positions use their own LED lights to form corresponding images in each other's CCD cameras through the 0.2286mm diameter through-holes of the correction plate. Through the working principle of the visual system, the through-hole targets to be detected can be converted into image signals and transmitted to the dedicated image processing system. According to the pixel distribution and brightness on the through-holes, the center position of the image is confirmed. At this time, the CCD cameras at the A1BY and B1BY positions are manually adjusted to adjust the center position of the imaging to a one-to-one correspondence with the center position of the image.

[0063] That is: let the center position of the image on the calibration plate seen by the CCD camera on A1BY be point a;

[0064] The CCD camera on B1BY sees the center of the image on the calibration plate as point b;

[0065] The center position of any through hole with a diameter of 0.2286 mm on the correction plate is point c;

[0066] If the CCD camera on A1BY sees the position a=c on the calibration plate;

[0067] At the same time, the CCD camera on B1BY sees the position b=c on the calibration plate;

[0068] Then: a=c=b, such as Figure 7 As shown:

[0069] Let the coordinates of point c be (xi,yj), where i = 1, 2, ..., 19; j = 1, 2, ..., 16;

[0070] By analogy with the above principle, the center position of the CCD camera imaging at the A1BY and B1BY positions can be made to correspond to point c, which is the center position of any through hole with a diameter of 0.2286 mm on the correction plate, that is, a=c(xi,yj)=b;

[0071] Finally, a reference coordinate system of the effective test area of ​​the flying probe tester is formed, thereby further correcting the negative effects of machining errors and assembly errors and improving the overall test accuracy of the equipment. Figure 8 shown.

[0072] Furthermore, when the center position of the CCD camera imaging is aligned with the first point c(x1, y1) on the correction plate, that is: a=c(x1, y1)=b, this point can be set as the coordinate origin of the entire effective test, and then the automatic identification and correction function of the remaining points can be realized according to the preset tolerance and other conditions.

[0073] The calibration device is composed of the correction plate 12 and the CCD camera, and the flying probe tester is calibrated accurately.

[0074] CCD camera calibration method:

[0075] S1. The correction direction is set to: from bottom to top, from left to right, the x-axis and y-axis directions move at equal intervals of 40 mm, that is:

[0076] From the first column as x1, from y1→y16;

[0077] The second column is x2, from y1→y16;

[0078] …

[0079] The nineteenth column is x19, from y1→y16;

[0080] S2. Take point c(x1, y1) as the starting point and use the manual mode to let the CCD cameras on the A1BY and B1BY axes capture this point respectively. Fig. 9 As shown;

[0081] S3, then move upwards in 40mm intervals along the y-axis direction, the purpose of which is to use the reference coordinates on the correction plate to compensate for the machining and assembly errors, and to correct the position of the center position of the imaging and the center position of the image through the servo motor, and adjust them to be consistent, such as Fig.10 shown.

[0082] S4, similarly, complete the steps of identification, alignment, correction, etc. of the remaining points until the final point, and then reset each axis back to the origin, such as Fig.11 , Fig.12 shown.

[0083] Probe calibration method:

[0084] S1. On the two independently moving modules superimposed on the y-axis moving direction, a moving module along the x-axis direction is set respectively, that is:

[0085] The displacement time function in the Y-axis direction is:

[0086] Top y module: y1 = f(t);

[0087] Bottom y module: y2 = f(T);

[0088] The displacement-time function in the x-axis direction is:

[0089] Top y module: The time displacement function of the small x-axis is x1=x(z);

[0090] Bottom y module: The time displacement function of the small x-axis is x2=x(Z);

[0091] Thus, 8 probes are formed:

[0092] A1X axis system: A1TZ, A1BZ;

[0093] A2X axis: A2TZ, A2BZ;

[0094] B1X axis: B1TZ, B1BZ;

[0095] B2X axis: B2TZ, B2BZ;

[0096] S2, 8 probe calibration method:

[0097] S2.1, the principle is the same as above, such as Fig.13 As shown, the correction plate 12 is removed, and the corrected position coordinates after capturing the light spot on the correction plate with a CCD camera are used as new coordinates, that is, the coordinates of point c' are (xi', yj'),

[0098] Where i=1, 2,…, 19; j=1, 2,…, 16.

[0099] S2.2. Use the CCD camera on B1BY to calibrate the probe tip points of A1TZ and A1BZ on the A1X axis system, and A2TZ and A2BZ on the A2X axis system, as follows:

[0100] S2.2.1. Assume that the center position of the CCD camera imaging on B1BY is point c', and the probe tip is point d, then

[0101] The displacement time function of point d in the x-axis direction is: X = X[x(t)]

[0102] The displacement time function of point d in the y-axis direction is: y = y(t);

[0103] The displacement time function of point d in the z-axis direction is: z = z(t);

[0104] S2.2.2, let the starting point be c'(x1', y1'), which means that during calibration, the center position of the CCD camera imaging on B1BY is first moved to this position to form c'(x1', y1'), and then A1X or A2X drives the probe point d to the position of point c', and the CCD camera converts the detected target into an image signal and transmits it to a dedicated image processing system, such as Fig.14 As shown, the center position of the image is determined according to the pixel distribution and brightness, and then the center position of the image is corrected to the center position of the CCD camera imaging by the Y-axis and small x-axis motion modules;

[0105] S2.2.3, At this time, the A1X or A2X axis remains stationary, and the probe d point is driven by the small x-axis to move 40mm along the positive direction of the x-axis. At the same time, the B1BY camera is also driven by the B1X axis to move 40mm along the positive direction of the y-axis, that is, to c'(x2', y1'). The CCD camera then converts the detected target into an image signal and transmits it to a dedicated image processing system, such as Fig.15 As shown, the center position of the image is determined according to the pixel distribution and brightness, and then the center position of the image is corrected to the center position of the CCD camera imaging by the Y-axis and small x-axis motion modules;

[0106] S2.2.4, at this time, the A1X or A2X axis will still remain stationary, and the entire small x module, i.e. A1BX (A1TX / A2BX / A2TX), will move upward by 40mm in the y-axis direction driven by A1BY (A1TY / A2BY / A2TY). At the same time, the probe d point will return to the zero point driven by the small x axis A1BX (A1TX / A2BX / A2TX). On the other hand, the B1BY camera will move to c'(x1', y2') driven by the B1X axis and B1BY. The CCD camera will then convert the detected target into an image signal and transmit it to a dedicated image processing system. The center position of the image is determined according to the pixel distribution and brightness, such as Fig.16 As shown, the center position of the image is corrected to the center position of the CCD camera imaging by the Y-axis and small x-axis motion modules;

[0107] S2.2.5, At this time, the A1X or A2X axis remains stationary, and the probe d point is driven by the small x-axis to move 40mm along the positive direction of the x-axis. At the same time, the B1BY camera is also driven by the B1X axis to move 40mm along the positive direction of the x-axis, that is, to c'(x2', y2'). The CCD camera then converts the detected target into an image signal and transmits it to a dedicated image processing system, such as Fig.17 As shown, the center position of the image is determined according to the pixel distribution and brightness, and then the center position of the image is corrected to the center position of the CCD camera imaging by the Y-axis and small x-axis motion modules;

[0108] S2.2.7, and so on, until the position coordinates of the probe tip point d start from c'(x1', y1') and c'(x2', y1'), to c'(x1', y2') and c'(x2, y2'), ..., until c'(x1', y16') and c'(x2', y16') are corrected, and then driven by the A1X or A2X axis to c'(x2', y1') and c'(x3', y1'), and then c'(x2', y1') and c'(x3', y1') are corrected in sequence according to the above steps. 2'), …, c'(x2', y16') and c'(x3', y16'), and finally c'(x17', y1') and c'(x18', y1'), c'(x17', y2') and c'(x18', y2'), …, c'(x17', y16') and c'(x18', y16'), etc., and then the CCD camera on B1BY completes the calibration of the probe needle tip points of A1TZ, A1BZ on the A1X axis system and A2TZ, A2BZ on the A2X axis system;

[0109] S3. Use the CCD camera on A1BY to calibrate the probe tip points of A1TZ, B1BZ on the B1X axis system and B2TZ, B2BZ on the B2X axis system respectively, the principle is the same as above.

[0110] The principle of PCB board testing is the same as above. The flying probe test uses four to eight independently controlled probes. The four to eight probes are installed on tiny reciprocating parts that can move freely on the xy plane. The test points are directly controlled by CADI Gerber data.

[0111] The UUT is transported to the test machine by a belt or other UUT transport system and then fixed. The probes of the test machine contact the test pads and vias to test the individual components of the UUT.

[0112] A flying probe tester calibration method based on a high-resolution camera, the calibration method comprising the following steps:

[0113] S1, using a high-resolution CCD camera installed at the A1BY axis and B1BY axis position of the eight-head flying probe tester, calibrating the A1BY axis and the B1BY axis through a calibration plate 12 loaded with a precision film;

[0114] S2. Then use the high-resolution CCD camera at the A1BY axis and B1BY axis position to calibrate the needle tip of each axis, respectively:

[0115] A1X axis system: A1TZ, A1BZ;

[0116] A2X axis: A2TZ, A2BZ;

[0117] B1X axis: B1TZ, B1BZ;

[0118] B2X axis: B2TZ, B2BZ;

[0119] S3. During the flying probe test, the high-resolution CCD camera at the A1BY axis and B1BY axis position is used to detect the exact position of the PCB board on the fixture in the flying probe tester through three-point positioning, so that the probes of each axis can be directly controlled to accurately pierce the corresponding points to complete precise calibration.

[0120] Industrial CCD cameras have different resolutions and bring different results:

[0121] Assuming the size of the object to be detected is: 12*9.6mm (A*B), calculate the difference between the pixel accuracy reflected by 400,000 pixels and 6 million pixels, and conclude that high resolution is more conducive to improving the accuracy of the equipment, as follows:

[0122] Select CCD1 / 3" chip (width 4.8mm, height 3.6mm), camera resolution 400,000 pixels (768*576), working distance 78mm, and get:

[0123] Pixel size = sensor width size / width resolution = 4.8 / 768*1000 = 6.25μm;

[0124] Magnification = sensor width / field of view width = 4.8 / 12 = 0.4;

[0125] 400,000-pixel camera, the width of a single pixel = 12 / 768 = 15.6 μm;

[0126] The height of a single pixel = 9.6 / 576 = 16.7 μm;

[0127] Select CCD1 / 1.8” chip (width 7.2mm, height 5.4mm), camera resolution 6 megapixels (3072*2048), working distance 78mm, and we can get:

[0128] Pixel size = sensor width size / width resolution = 7.2 / 3072*1000 = 2.34μm;

[0129] Magnification ratio = sensor width / field of view width = 7.2 / 12 = 0.6;

[0130] For a 6-megapixel camera, the width of a single pixel = 12 / 3072 = 3.9 μm;

[0131] The height of a single pixel = 9.6 / 2048 = 4.69 μm;

[0132] In summary:

[0133] In the PCB board manufacturing process, there are the following limitations:

[0134] The minimum pad spacing is 4mil, i.e. 4*0.0254mm=0.1016mm=101.6μm;

[0135] The minimum pad size is 2mil, i.e. 2*0.0254mm=0.0508mm=50.8μm;

[0136] The probe tip size is: 50μm;

[0137] In the range of 4mil*4mil, the number of pixels occupied by 400,000 and 6 million is as follows Fig.18 , Fig.19 As shown:

[0138] The following conclusions were drawn:

[0139] A. Choose 1 / 3", 400,000-pixel (768*576) CCD. There are only 42 pixels in the range of 101.6*101.6μm. The size of each pixel is 15.6*16.7μm. The proportion of a pixel in the range of 101.6*101.6μm is about 15%, which means that for every missing pixel, the accuracy is lost by 15%;

[0140] B. Choose 1 / 1.8”, 6 megapixel (3072*2048) CCD. There are 572 pixels in the range of 101.6*101.6μm. The size of each pixel is 3.9*4.69μm. The proportion of one pixel in the range of 101.6*101.6μm is about 3.83%.

[0141] Therefore, the use of high-resolution industrial cameras can better overcome the poor light in the working environment, or the loss of pixels caused by the reflection of light during the movement of the CCD, so that the equipment can obtain better operating accuracy. Therefore, the use of high-resolution industrial cameras can accurately test the flying probe tester.

[0142] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A flying probe tester calibration device based on a high-resolution camera, characterized in that: The calibration device comprises a calibration plate (12) and a CCD camera. The calibration plate (12) is fixedly mounted on a flying probe tester. The calibration plate (12) is provided with through holes distributed in an array. The through holes are distributed at equally divided points on the calibration plate (12). Two CCD cameras are mounted on the flying probe tester. The CCD cameras detect light in the through holes for calibrating the flying probe tester.

2. The flying probe tester calibration device based on a high-resolution camera according to claim 1, characterized in that: The flying probe tester comprises a machine base (1), symmetrically distributed side panels (2) are fixed on the machine base (1), a top panel is fixed on the side panels (2), and a symmetrically distributed electric slide platform (3) is fixed on the machine base (1), and two electric slide platforms (3) are respectively horizontally arranged on both sides of the machine base (1).

3. The flying probe tester calibration device based on a high-resolution camera according to claim 2, characterized in that: The electric slide table 1 (3) is provided with a symmetrically distributed electric slide table 2 (4) for sliding, the electric slide table 2 (4) is provided with a symmetrically distributed sliding block (5) for sliding, and a housing (7) is fixed on the sliding block (5).

4. The flying probe tester calibration device based on a high-resolution camera according to claim 3, characterized in that: A baffle (8) is fixedly provided on one side of the housing (7), a connecting plate (9) is fixed inside the housing (7), the connecting plate (9) is located on one side of the baffle (8), a fixing seat (10) is fixedly provided between the connecting plate (9) and the baffle (8), and a detection assembly (13) is fixed on the fixing seat (10).

5. The flying probe tester calibration device based on a high-resolution camera according to claim 4, characterized in that: A mounting block (6) is fixed to one side of the connecting plate (9) away from the baffle (8); a mounting plate (11) is fixed to one end of the mounting block (6); a CCD camera is fixedly mounted on the mounting plate (11); the CCD camera is located at the A1BY axis and the B1BY axis of the eight-head flying probe tester; and the two CCD cameras are used for calibrating the front and back of the flying probe tester.

6. The flying probe tester calibration device based on a high-resolution camera according to claim 2, characterized in that: A clamping assembly is fixed on the machine base (1), the clamping assembly comprising two clamps, the two clamps are horizontally arranged between the machine base (1) and the top plate, and the two clamps are used to fix the correction plate (12).

7. The flying probe tester calibration device based on a high-resolution camera according to claim 1, characterized in that: The correction plate (12) is assembled with a precision-grade film.

8. A flying probe tester calibration method based on a high-resolution camera, using the flying probe tester calibration device based on a high-resolution camera as described in any one of claims 1 to 7 to calibrate the flying probe tester, characterized in that: The calibration method comprises the following steps: S1, using a high-resolution CCD camera installed at the A1BY axis and B1BY axis position of the eight-head flying probe tester, and calibrating the A1BY axis and B1BY axis through a calibration plate (12) loaded with a precision film; S2, then use the high-resolution CCD camera at the A1BY axis and B1BY axis position to calibrate the needle tip of each axis; S3. During the flying probe test, the high-resolution CCD camera at the A1BY axis and B1BY axis position is used to detect the exact position of the PCB board on the fixture in the flying probe tester through three-point positioning, so that the probes of each axis can be directly controlled to accurately pierce the corresponding points to complete precise calibration.

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