800G optical module and high-precision packaging equipment and method thereof

Abstract

The invention relates to the field of optical module production, and discloses an 800G optical module and a high-precision packaging device and method thereof, and the 800G optical module comprises a first housing which is provided with a buckle used for being connected with a second housing, and the cross section of the first housing is U-shaped; the second shell is used for being connected with the first shell to form a shell of the 800G optical module; the working unit comprises a first intermediate plate, a second intermediate plate, a PCB and an MPO joint, the first intermediate plate is provided with a plurality of transmitting units, the second intermediate plate is provided with a plurality of receiving units, the PCB is respectively coupled with the first intermediate plate and the second intermediate plate, and the plurality of receiving units, the plurality of transmitting units and the MPO joint are connected through optical fibers; and the heat sink unit is used for being connected with the second shell so that the first middle plate, the second middle plate and the working unit can be installed and positioned, and the heat sink unit can be installed in the first shell to be positioned. According to the 800G optical module provided by the invention, the assembly precision of the 800G optical module can be ensured.

Description

Technical Field

[0001] The present application relates to the field of optical module production technology, and more specifically, to an 800G optical module and its high-precision packaging equipment and method. Background Art

[0002] 800G optical modules are optical communication devices used for high-speed data transmission, with excellent characteristics such as high bandwidth, high speed and high density. 800G optical modules are widely used in data centers, high-performance computing (HPC), cloud computing and 5G communications to meet the urgent needs of modern information society for high-bandwidth and low-latency data transmission. 800G optical modules not only support traditional fiber-optic communication technology, but also combine the latest optoelectronic devices and signal processing technology to ensure the efficiency and reliability of data transmission. The modular design of 800G optical modules makes installation and maintenance easier, adapting to the rapidly changing data transmission needs.

[0003] Due to the high-speed data transmission characteristics of the 800G optical module, it is necessary to ensure the assembly accuracy and assembly quality of the 800G optical module to avoid the assembly process affecting the communication quality of the 800G optical module. Patent CN114515963B (application number: CN202210159418.1) provides a fully automatic optical module multi-process assembly equipment, in which a drive toothed belt is installed in the middle of the processing table, and a processing carrier is provided on the outer surface of the drive toothed belt. The automatic hydraulic push rod is fixedly installed on the upper surface of the processing table and is located on both sides of the drive toothed belt. The output end of the automatic hydraulic push rod is fixedly installed with a triangular push block, and both sides of the bottom of the processing carrier are provided with rectangular grooves adapted to the triangular push block. The bottom of the processing carrier is fixedly connected with a transmission rack, and the transmission rack is meshed with the drive toothed belt. The optical module multi-process assembly equipment in patent CN114515963B can automatically assemble optical modules, but it is difficult to ensure the assembly accuracy of the working unit and the shell of the 800G optical module. Summary of the invention

[0004] The purpose of this application is to provide an 800G optical module and its high-precision packaging equipment and method, which solves the technical problem of not being able to ensure the assembly accuracy of the 800G optical module and achieves the technical effect of ensuring the assembly accuracy of the 800G optical module.

[0005] An 800G optical module provided in an embodiment of the present application includes: a first shell body, provided with a snap for connecting to a second shell body, and the cross-section of the first shell body is U-shaped; a second shell body, used to connect with the first shell body to form a shell of the 800G optical module; a working unit, including a first middle plate, a second middle plate, a PCB board and an MPO connector, the first middle plate is provided with a plurality of transmitting units, the second middle plate is provided with a plurality of receiving units, the PCB board is coupled to the first middle plate and the second middle plate respectively, and the plurality of receiving units, the plurality of transmitting units and the MPO connector are connected through optical fibers; a heat sink unit, used to be interconnected with the second shell body to respectively install and position the first middle plate, the second middle plate and the working unit, and the heat sink unit can be loaded into the first shell body for positioning.

[0006] In a possible implementation, a first positioning groove, a second positioning groove and a third positioning groove are provided on the heat sink unit, the first positioning groove is used to position the first middle plate, the second positioning groove is used to position the second middle plate, and the third positioning groove is used to position the PCB board, and the second shell can be connected to the heat sink unit to extrude and position the first middle plate, the second middle plate and the PCB board; the heat sink unit and the second shell are respectively provided with a plurality of mounting holes along the length direction on both side edges, and the plurality of mounting holes are used to connect the heat sink unit and the second shell by screws.

[0007] In another possible implementation, the first positioning groove is provided with a first positioning hole for passing multiple emission units, and a TEC heat sink for dissipating heat from the heat sink is provided on one side of the first shell close to the heat sink unit. The TEC heat sink is electrically connected to the PCB board through a cable.

[0008] In another possible implementation, a first thermally conductive silicone sheet is provided on a side of the TEC heat sink close to the first positioning hole.

[0009] In another possible implementation, a second thermally conductive silicone sheet for dissipating heat to the first intermediate plate is provided in the first positioning groove, an opening is provided on the second thermally conductive silicone sheet corresponding to the first positioning hole, a third thermally conductive silicone sheet for dissipating heat to the second intermediate plate is provided in the second positioning groove, and a fourth thermally conductive silicone sheet for dissipating heat to the PCB board is provided in the third positioning groove.

[0010] In another possible implementation, a fifth thermally conductive silicone sheet is provided on the second shell, and the fifth thermally conductive silicone sheet is used to conduct heat between the second shell and the PCB board. A heat dissipation fin is provided on a side of the second shell away from the fifth thermally conductive silicone sheet.

[0011] In another possible implementation, the thickness of the first thermally conductive silicone sheet is 0.5 mm to 1 mm, the thickness of the second thermally conductive silicone sheet, the third thermally conductive silicone sheet and the fourth thermally conductive silicone sheet is 1 mm to 2 mm, and the compression rate of the second thermally conductive silicone sheet, the third thermally conductive silicone sheet and the fourth thermally conductive silicone sheet is greater than the compression rate of the first thermally conductive silicone sheet.

[0012] An embodiment of the present application also provides a high-precision packaging device for an 800G optical module, which is used to package any of the above-mentioned 800G optical modules, including: a fixing component for installing and fixing the heat sink unit; a moving component for adsorbing and placing the working unit on the heat sink unit; and an assembling component for connecting the second shell to the heat sink unit to respectively install and position the first intermediate plate, the second intermediate plate and the working unit.

[0013] In another possible implementation, the fixing assembly is provided with a positioning column that can extend into the mounting hole of the heat sink unit, and the positioning column is provided with a spring for supporting the positioning column. The positioning column can compress the spring when the heat sink unit and the second shell are connected by screws, so that the positioning column falls out of the mounting hole.

[0014] In another possible implementation, it also includes a height detection component and a control component, the control component is electrically connected to the moving component, the assembly component, and the height detection component, respectively, the height detection component is used to verify the height after the heat sink unit is placed on the fixed component, the working unit, and the second shell are installed in sequence on the heat sink unit; when the height after the heat sink unit is placed on the fixed component is greater than the first height, the control component controls the moving component to stop and issues a manual processing reminder; when the height of the heat sink unit after the working unit is installed is greater than the second height, the control component controls the assembly component to stop and issues a manual processing reminder; when the height of the heat sink unit after the second shell is installed is greater than the third height, a manual processing reminder is issued.

[0015] In another possible implementation, there are multiple height detection components, and the multiple height detection components are respectively arranged corresponding to the positions of the multiple mounting holes.

[0016] The embodiment of the present application also provides a high-precision packaging method for an 800G optical module, using the above-mentioned high-precision packaging equipment for an 800G optical module, and the method includes: installing and fixing the heat sink unit through a fixing component; adsorbing and placing the working unit on the heat sink unit through a moving component; connecting the second shell to the heat sink unit through an assembling component to respectively install and position the first middle plate, the second middle plate and the working unit; installing the heat sink unit into the first shell for positioning, and connecting the first shell and the second shell through a snap.

[0017] Compared with the prior art, the embodiments of the present invention have the following beneficial effects: The embodiment of the present application provides an 800G optical module, including a first shell, a second shell, a working unit and a heat sink unit, the cross section of the first shell is U-shaped; the first shell is provided with a buckle for connecting with the second shell; the second shell is used to connect with the first shell to form the shell of the 800G optical module; the working unit includes a first middle plate, a second middle plate, a PCB board and an MPO connector, the first middle plate is provided with a plurality of transmitting units, the second middle plate is provided with a plurality of receiving units, the PCB board is coupled with the first middle plate and the second middle plate respectively, and the plurality of receiving units, the plurality of transmitting units and the MPO connector are connected by optical fiber; the heat sink unit is used to be connected to the second shell to install and position the first middle plate, the second middle plate and the PCB board respectively, and the heat sink unit can be loaded into the first shell for positioning. An 800G optical module in the embodiment of the present application can position the working unit through the second shell and the heat sink unit, avoiding the problem of difficulty in accurately positioning the working unit in the existing optical module structure when installing the working unit in the shell with a U-shaped cross section, improving the installation convenience and assembly accuracy of the 800G optical module, and improving the production efficiency of the 800G optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 A schematic diagram of the main decomposition structure of an 800G optical module provided in an embodiment of the present application; Figure 2 A schematic diagram of the structure of the cooperation between the first housing and the heat sink unit of an 800G optical module provided in an embodiment of the present application; Figure 3 for Figure 2 A schematic diagram of the local structure of the first shell and the heat sink unit at A; Figure 4 A schematic diagram of a three-dimensional decomposition structure of an 800G optical module provided in an embodiment of the present application; Figure 5 A schematic diagram of the right-side decomposition structure of an 800G optical module provided in an embodiment of the present application; Figure 6 A schematic diagram of the main structure of a heat sink unit provided in an embodiment of the present application; Figure 7 A schematic diagram of the exploded structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application from the right side; Figure 8 for Figure 7 A schematic diagram of the local structure at B of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application; Fig. 9 A schematic diagram of the main exploded structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application; Fig.10 A schematic diagram of a control structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application; Fig.11 A schematic diagram of a process flow of a high-precision packaging method for an 800G optical module provided in an embodiment of the present application; In the figure, 1. first shell; 11. TEC heat sink; 12. first thermally conductive silicone sheet; 2. second shell; 21. fifth thermally conductive silicone sheet; 22. heat dissipation fins; 3. working unit; 31. first middle plate; 311. transmitting unit; 32. second middle plate; 321. receiving unit; 33. PCB board; 34. MPO connector; 4. heat sink unit; 41. first positioning groove; 411. first positioning hole; 412. second thermally conductive silicone sheet; 42. second positioning groove; 421. third thermally conductive silicone sheet; 43. third positioning groove; 431. fourth thermally conductive silicone sheet; 44. mounting hole; 5. fixing component; 51. positioning column; 52. spring; 6. moving component; 7. assembling component; 8. height detection component; 9. control component. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0021] It should be noted that when a component or structure is referred to as being "fixed to" or "disposed on" another component or structure, it may be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as being "connected to" another component or structure, it may be directly connected to the other component or structure or indirectly connected to the other component or structure.

[0022] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or a component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0024] The optical module assembly equipment in the prior art can automatically assemble the optical module, but it is difficult to ensure the assembly accuracy of the working unit and the shell during the assembly process of the 800G optical module.

[0025] Based on the above reasons, the embodiment of the present application provides an 800G optical module, including a first shell, a second shell, a working unit and a heat sink unit, the cross section of the first shell is U-shaped; the first shell is provided with a buckle for connecting with the second shell; the second shell is used to connect with the first shell to form the shell of the 800G optical module; the working unit includes a first middle plate, a second middle plate, a PCB board and an MPO connector, the first middle plate is provided with a plurality of transmitting units, the second middle plate is provided with a plurality of receiving units, the PCB board is coupled with the first middle plate and the second middle plate respectively, and the plurality of receiving units, the plurality of transmitting units and the MPO connector are connected by optical fiber; the heat sink unit is used to be connected to the second shell to install and position the first middle plate, the second middle plate and the PCB board respectively, and the heat sink unit can be loaded into the first shell for positioning. An 800G optical module in the embodiment of the present application can position the working unit through the second shell and the heat sink unit, avoiding the problem of difficult precise positioning of the working unit in the existing optical module structure when installing the working unit in the shell with a U-shaped cross section, improving the installation convenience and assembly accuracy of the 800G optical module, and improving the production efficiency of the 800G optical module.

[0026] In some scenarios, an 800G optical module of an embodiment of the present application can be applied to 800G optical communications. The 800G optical module in the embodiment of the present application has high production and assembly accuracy and production efficiency, which can reduce the use cost of the 800G optical module.

[0027] The following is a detailed description of an 800G optical module provided in an embodiment of the present application with reference to specific examples.

[0028] Figure 1 A schematic diagram of the main decomposition structure of an 800G optical module provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the 800G optical module includes a first shell 1, a second shell 2, a working unit 3 and a heat sink unit 4. The first shell 1, the second shell 2, the working unit 3 and the heat sink unit 4 cooperate with each other to form the 800G optical module.

[0029] like Figure 1 As shown, the cross section of the first shell is U-shaped, and the first shell 1 is provided with a buckle for connecting with the second shell 2.

[0030] Exemplarily, an elastic buckle may be provided on the first shell 1, and the elastic buckle is used to connect with the second shell 2. The first shell 1 and the second shell 2 can cooperate with each other to form the outer shell of the 800G optical module.

[0031] like Figure 1 As shown, the second shell 2 is used to connect with the first shell 1 to form the outer shell of the 800G optical module.

[0032] Exemplarily, the second shell 2 may be a plate-shaped structure.

[0033] like Figure 1 As shown, the second shell 2 can be connected to the first shell 1, so that the second shell 2 can be connected to the first shell 1 to form the housing of the 800G optical module.

[0034] like Figure 1 As shown, the working unit 3 includes a first middle plate 31, a second middle plate 32, a PCB board 33 and an MPO connector 34. The first middle plate 31 is provided with a plurality of transmitting units 311, the second middle plate 32 is provided with a plurality of receiving units 321, the PCB board 33 is coupled to the first middle plate 31 and the second middle plate 32, respectively, and the plurality of transmitting units 311, the plurality of receiving units 321 and the MPO connector 34 are connected via optical fibers.

[0035] Structurally, the working unit 3 includes a first middle plate 31 , a second middle plate 32 , a PCB board 33 and an MPO connector 34 , and the first middle plate 31 , the second middle plate 32 , the PCB board 33 and the MPO connector 34 mutually constitute the working unit 3 .

[0036] Structurally, a plurality of emitting units 311 are provided on the first middle plate 31. The emitting units 311 include an emitting laser, a coupling lens and an emitting end optical fiber array. The coupling lens is used to match the emitting laser, and the emitting end optical fiber array is coupled with the coupling lens. The emitting laser can be an eight-way laser, and the coupling lens is eight groups of coupling lenses.

[0037] Structurally, a plurality of receiving units 321 are provided on the second intermediate board 32. The receiving units 321 include a transimpedance amplifier, a detector and a receiving end optical fiber array. The receiving units 321 transmit the externally transmitted optical signal to the receiving end optical fiber array. The receiving end optical fiber array reflects and transmits the optical signal to the photosensitive surface of the detector. Then the detector converts the multi-path optical signal into an electrical signal, which can be transmitted to the PCB board 33 through the second intermediate board 32.

[0038] like Figure 1 As shown, the PCB board 33 is coupled to the first middle board 31 and the second middle board 32 respectively, so that the electrical signal generated by the PCB board 33 can be transmitted to the first middle board 31, and then the electrical signal can be transmitted to the first middle board 31, and at the same time the electrical signal of the second middle board 32 can be transmitted to the PCB board 33.

[0039] Structurally, silicon photonic chips for processing optical signals can be respectively arranged on the first intermediate plate 31, the second intermediate plate 32, and the PCB board 33. The silicon photonic chips are highly sensitive to temperature. By independently arranging the first intermediate plate 31, the second intermediate plate 32, and the PCB board 33, the silicon photonic chips on the first intermediate plate 31, the second intermediate plate 32, and the PCB board 33 can be prevented from being affected.

[0040] like Figure 1 As shown, the multiple transmitting units 311, the multiple receiving units 321 and the MPO connector 34 are connected via optical fibers, so that the MPO connector 34 can transmit light between the multiple transmitting units 311 and the multiple receiving units 321 via optical fibers.

[0041] like Figure 1 As shown, the heat sink unit 4 is used to be connected to the second shell 2 to respectively install and position the first middle plate 31 , the second middle plate 32 and the working unit 3 , and the heat sink unit 4 can be installed in the first shell 1 for positioning.

[0042] like Figure 1 As shown, the heat sink unit 4 is used to be interconnected with the second shell 2 to respectively install and position the first middle plate 31, the second middle plate 32 and the working unit 3, so that the working unit 3 can be fixed by the heat sink unit 4 and the second shell 2 to form an assembly unit, and then the assembly unit can be installed on the first shell 1 for fixation.

[0043] like Figure 1 As shown, the cross-section of the first shell 1 is U-shaped, so that the housing of the 800G optical module is formed by the first shell 1 and the second shell 2.

[0044] Structurally, since the cross-section of the first shell 1 is U-shaped, it is not convenient for the previous 800G optical module to assemble the working unit onto the first shell 1. When assembling the 800G optical module in the embodiment of the present application, the working unit 3 can be first installed and fixed and then assembled with the first shell 1 to form an 800G optical module, which can avoid the working unit 3 being directly assembled with the first shell 1 to form an 800G optical module.

[0045] During assembly, after the heat sink unit 4 and the second shell 2 are fixed to the working unit 3 to form an assembly unit, the heat sink unit 4 can be installed in the first shell 1 for positioning, so that the second shell 2 can be connected to the first shell 1 to form the outer shell of the 800G optical module, thereby completing the assembly of the 800G optical module.

[0046] The beneficial effect brought about by the above-mentioned implementation method is that the working unit is installed and fixed by the heat sink unit and the second shell and then assembled with the first shell to form an 800G optical module. The working unit is fixed by the heat sink unit and the second shell, which can improve the stability and accuracy of fixing the working unit, and improve the accuracy and convenience of assembling the 800G optical module.

[0047] The beneficial effect brought about by the above-mentioned implementation method is that after the heat sink unit and the second shell are fixed to the working unit to form an assembly unit, the working unit can be protected by the heat sink unit and the second shell, which improves the safety of fixing the working unit and improves the assembly quality of the 800G optical module.

[0048] The beneficial effect brought about by the above-mentioned implementation method is that the cross-section of the first shell is U-shaped, and the heat sink unit and the second shell are fixed to the working unit to form an assembly unit, and then the working unit is installed and fixed. The heat sink unit and the second shell can protect the working unit and prevent the first shell from scratching the working unit, thereby improving the assembly quality of the 800G optical module.

[0049] The beneficial effect brought about by the above-mentioned implementation method is that the first middle plate, the second middle plate and the PCB board of the working unit are independently arranged, so that the deformation of the PCB board, the first middle plate and the second middle plate caused by heat is less affected, thereby reducing the impact of the thermal deformation of the PCB board, the first middle plate and the second middle plate on the chip performance and improving the performance of the 800G optical module.

[0050] In some implementations, a first positioning groove 41, a second positioning groove 42 and a third positioning groove 43 are provided on the heat sink unit 4, the first positioning groove 41 is used to position the first middle plate 31, the second positioning groove 42 is used to position the second middle plate 32, and the third positioning groove 43 is used to position the PCB board 33, and the second shell 2 can be connected to the heat sink unit 4 to squeeze and position the first middle plate 31, the second middle plate 32 and the PCB board 33.

[0051] Figure 2 A schematic diagram of the structure of the first housing and the heat sink unit of an 800G optical module provided in an embodiment of the present application, Figure 3 for Figure 2 A schematic diagram of the local structure of the first shell and the heat sink unit in FIG. Figures 1 to 3 As shown, structurally, the heat sink unit 4 is provided with a first positioning groove 41 , a second positioning groove 42 and a third positioning groove 43 , which are used to position the working unit 3 to improve the stability of positioning the working unit 3 .

[0052] Structurally, the first positioning groove 41 is used to position the first middle plate 31 to improve the stability of the positioning of the first middle plate 31 .

[0053] Structurally, the second positioning groove 42 is used to position the second middle plate 32 to improve the stability of positioning the second middle plate 32 .

[0054] Structurally, the third positioning groove 43 is used to position the PCB board 33 to improve the stability of positioning the PCB board 33 .

[0055] Structurally, the second shell 2 can be connected to the heat sink unit 4 to extrude and position the first middle plate 31, the second middle plate 32 and the PCB board 33, so that the second shell 2 can cooperate with the heat sink unit 4 to position the first middle plate 31, the second middle plate 32 and the PCB board 33.

[0056] In some implementations, the heat sink unit 4 and the second shell 2 are respectively provided with a plurality of mounting holes 44 along the length direction on both side edges, and the plurality of mounting holes 44 are used to connect the heat sink unit 4 and the second shell 2 by screws.

[0057] Figure 4 A schematic diagram of a three-dimensional decomposition structure of an 800G optical module provided in an embodiment of the present application, Figure 5 A right-view decomposition structure diagram of an 800G optical module provided in an embodiment of the present application, such as Figure 4 and Figure 5As shown, the heat sink unit 4 and the second shell 2 are respectively provided with a plurality of mounting holes 44 along the length direction on both side edges, and the plurality of mounting holes 44 are used to connect the heat sink unit 4 and the second shell 2 by screws, thereby enabling a stable connection of the heat sink unit 4 and the second shell 2 to be achieved by screws.

[0058] Exemplarily, three screws may be provided on one side of the heat sink unit 4 and the second shell 2 .

[0059] The beneficial effect brought about by the above-mentioned implementation method is that the first positioning groove positions the first middle plate, the second positioning groove positions the second middle plate, and the third positioning groove positions the PCB board, so as to improve the stability of positioning the working unit, ensure the stability of positioning of each component of the working unit, and further improve the positioning effect of the working unit.

[0060] The beneficial effect brought about by the above-mentioned implementation method is that the heat sink unit and the second shell are respectively provided with multiple mounting holes for connection by screws along the length direction on both sides, which improves the stability of the connection between the heat sink unit and the second shell, ensures the stability of the installation of the working unit, and improves the packaging accuracy and packaging quality of the 800G optical module.

[0061] In some implementations, a first positioning hole 411 is provided on the first positioning groove 41 for passing multiple emitting units 311, and a TEC heat sink 11 for dissipating heat from the heat sink unit 4 is provided on one side of the first shell 1 close to the heat sink unit 4. The TEC heat sink 11 is electrically connected to the PCB board 33 via a cable.

[0062] Figure 6 A schematic diagram of the main structure of a heat sink unit provided in an embodiment of the present application is shown in FIG. Figure 6 As shown, the first positioning groove 41 is provided with a first positioning hole 411 for passing multiple launching units 311, so that the first positioning hole 411 can make way for multiple launching units 311, and at the same time facilitate the positioning of multiple launching units 311, while increasing the space for structural design of multiple launching units 311.

[0063] like Figure 3 As shown, a TEC heat sink 11 for dissipating heat from the heat sink 4 is provided on one side of the first shell 1 close to the heat sink unit 4 . The TEC heat sink 11 is electrically connected to the PCB board 33 via a cable, so that the heat dissipation efficiency of the heat sink unit 4 can be improved through the TEC heat sink 11 .

[0064] Structurally, since the emitting unit 311 generates a large amount of heat, multiple emitting units 311 can be positioned through the first positioning hole 411, so that the multiple emitting units 311 can be easily abutted against the TEC heat sink 11 for heat conduction and heat dissipation, further improving the heat dissipation efficiency of the multiple emitting units 311.

[0065] The beneficial effect brought about by the above implementation method is that the first positioning hole can make way for multiple transmitting units, and at the same time it is convenient to position the multiple transmitting units, and at the same time increases the space for structural design of the multiple transmitting units.

[0066] The beneficial effect brought about by the above implementation method is that, by making way for multiple emitting units through the first positioning holes, the multiple emitting units are convenient for direct heat conduction and heat dissipation with the TEC heat sink, further improving the heat dissipation efficiency of the multiple emitting units.

[0067] In some implementations, a first thermally conductive silicone sheet 12 is disposed on one side of the TEC heat sink 11 close to the first positioning hole 411 .

[0068] like Figure 2 and Figure 3 As shown, in terms of structure, a first thermally conductive silicone sheet 12 is provided on one side of the TEC heat sink 11 close to the first positioning hole 411 , and the first thermally conductive silicone sheet 12 can improve the heat dissipation efficiency between the TEC heat sink 11 and the heat sink unit 4 .

[0069] Structurally, the first thermally conductive silicone sheet 12 can provide a buffer between the multiple emitting units 311 passing through the first positioning holes 411 and the TEC heat sink 11 , thereby protecting the multiple emitting units 311 and ensuring the heat dissipation effect for the multiple emitting units 311 .

[0070] The beneficial effect brought about by the above implementation method is that the first thermally conductive silicone sheet can improve the heat dissipation efficiency between the TEC heat sink and the heat sink unit.

[0071] The beneficial effect brought about by the above-mentioned implementation method is that the first thermally conductive silicone sheet can ensure the heat dissipation effect of multiple transmitting units while providing buffer protection for multiple transmitting units, thereby improving the use effect of the 800G optical module.

[0072] In some implementations, a second thermally conductive silicone sheet 412 for dissipating heat to the first intermediate plate 31 is provided in the first positioning groove 41, an opening is provided on the second thermally conductive silicone sheet 412 corresponding to the first positioning hole 411, a third thermally conductive silicone sheet 421 for dissipating heat to the second intermediate plate 32 is provided in the second positioning groove 42, and a fourth thermally conductive silicone sheet 431 for dissipating heat to the PCB board 33 is provided in the third positioning groove 43.

[0073] Structurally, a second thermally conductive silicone sheet 412 for dissipating heat from the first middle plate 31 is disposed in the first positioning groove 41 , so that the second thermally conductive silicone sheet 412 can provide buffering protection for the first middle plate 31 .

[0074] In terms of structure, an opening is provided on the second heat-conducting silicone sheet 412 corresponding to the first positioning hole 411 , so that the first positioning hole 411 can make way for the emitting unit 311 .

[0075] Structurally, a third thermally conductive silicone sheet 421 for dissipating heat from the second middle plate 32 is disposed in the second positioning groove 42 , so that the third thermally conductive silicone sheet 421 can conduct heat and dissipate heat from the second middle plate 32 while providing buffer protection.

[0076] Structurally, a fourth thermally conductive silicone sheet 431 for dissipating heat from the PCB board 33 is disposed in the third positioning groove 43 , so that the fourth thermally conductive silicone sheet 431 can conduct heat and dissipate heat from the PCB board 33 while providing buffer protection.

[0077] The beneficial effect brought about by the above implementation method is that the second thermally conductive silicone sheet can conduct heat and dissipate heat for the first intermediate plate, while providing buffer protection.

[0078] The beneficial effect brought about by the above implementation method is that the third thermally conductive silicone sheet can conduct heat and dissipate heat for the second intermediate plate while providing buffer protection, and the fourth thermally conductive silicone sheet can conduct heat and dissipate heat for the PCB board while providing buffer protection.

[0079] In some implementations, a fifth thermally conductive silicone sheet 21 is provided on the second shell 2 for conducting heat between the second shell 2 and the PCB board 33 , and a heat dissipation fin 22 is provided on a side of the second shell 2 away from the fifth thermally conductive silicone sheet 21 .

[0080] Structurally, a fifth thermally conductive silicone sheet 21 is provided on the second shell 2 , and the fifth thermally conductive silicone sheet 21 is used to conduct heat between the second shell 2 and the PCB board 33 , so that the heat on the PCB board 33 can be efficiently conducted to the second shell 2 .

[0081] Structurally, a heat dissipation fin 22 is provided on a side of the second housing 2 away from the fifth heat-conducting silicone sheet 21 . The heat dissipation fin 22 can improve the heat dissipation efficiency of the PCB board 33 and the working unit 3 .

[0082] The beneficial effect brought about by the above implementation method is that the heat on the PCB board can be efficiently conducted to the second shell through the fifth thermally conductive silicone sheet, thereby facilitating the heat dissipation of the PCB board.

[0083] The beneficial effect brought about by the above implementation method is that, while the working unit is fixed in advance by the second shell, the heat dissipation efficiency of the PCB board and the working unit can be improved by the heat dissipation fins on the second shell.

[0084] In some implementations, the thickness of the first thermally conductive silicone sheet 12 is 0.5 mm to 1 mm, the thickness of the second thermally conductive silicone sheet 412 , the third thermally conductive silicone sheet 421 , and the fourth thermally conductive silicone sheet 431 is 1 mm to 2 mm, and the compression rate of the second thermally conductive silicone sheet 412 , the third thermally conductive silicone sheet 421 , and the fourth thermally conductive silicone sheet 431 is greater than the compression rate of the first thermally conductive silicone sheet 12 .

[0085] In terms of structure, Figure 3 As shown, the thickness D1 of the first thermally conductive silicone sheet 12 is 0.5 mm to 1 mm. The first thermally conductive silicone sheet 12 has a relatively small thickness, so that the first thermally conductive silicone sheet 12 can reduce the internal space occupied by the optical module while conducting heat, thereby increasing the layout space of electronic components in the optical module.

[0086] Structurally, the thickness D2 of the second thermally conductive silicone sheet 412, the third thermally conductive silicone sheet 421 and the fourth thermally conductive silicone sheet 431 is 1 mm to 2 mm, so that the second thermally conductive silicone sheet 412, the third thermally conductive silicone sheet 421 and the fourth thermally conductive silicone sheet 431 and various parts of the working unit 3 have a large clearance space for cooperation, which can ensure the buffering protection effect of the working unit 3 while ensuring the heat dissipation efficiency.

[0087] In terms of material, the compression rate of the second thermally conductive silicone sheet 412, the third thermally conductive silicone sheet 421 and the fourth thermally conductive silicone sheet 431 is greater than that of the first thermally conductive silicone sheet 12. The compression rate refers to the degree of deformation of the material under pressure, so that the second thermally conductive silicone sheet 412, the third thermally conductive silicone sheet 421 and the fourth thermally conductive silicone sheet 431 can provide a larger buffer space for the working unit 3, thereby further improving the protection effect of the working unit 3.

[0088] In terms of material, the compression rate of the first thermally conductive silicone sheet 12 is lower than the compression rates of the second thermally conductive silicone sheet 412 , the third thermally conductive silicone sheet 421 and the fourth thermally conductive silicone sheet 431 , so that the first thermally conductive silicone sheet 12 is not easily compressed and flattened, thereby improving the supporting effect on the heat sink unit 4 and ensuring the overall structural stability of the optical module.

[0089] The beneficial effect brought about by the above implementation method is that the thickness and compression rate of the second thermally conductive silicone sheet, the third thermally conductive silicone sheet and the fourth thermally conductive silicone sheet are relatively large, which can ensure the buffering protection effect of the working unit while ensuring the heat dissipation efficiency.

[0090] The beneficial effect brought about by the above-mentioned implementation method is that the thickness of the first thermally conductive silicone sheet is relatively small, which can provide a larger design space for the structure of the optical module. At the same time, the first thermally conductive silicone sheet has a small compression rate and is not easily compressed and flattened, thereby improving the support effect of the heat sink unit and ensuring the overall structural stability of the optical module.

[0091] The embodiment of the present application also provides a high-precision packaging device for an 800G optical module. Figure 7 A schematic diagram of a right-side decomposition structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application is shown in FIG. Figure 7 As shown, it is used to package any of the above-mentioned 800G optical modules, including a fixed component 5, a movable component 6 and an assembly component 7. The fixed component 5, the movable component 6 and the assembly component cooperate with each other to package the 800G optical module.

[0092] like Figure 7 As shown, the fixing assembly 5 is used to install and fix the heat sink unit 4 .

[0093] Structurally, the fixing assembly 5 is used to install and fix the heat sink unit 4 , so that the heat sink unit 4 is positioned under the fixing action of the fixing assembly 5 , so as to facilitate the assembly of other structures of the optical module on the heat sink unit 4 .

[0094] like Figure 7 As shown, the moving assembly 6 is used to adsorb and place the working unit 3 onto the heat sink unit 4 .

[0095] Structurally, the moving assembly 6 is used to adsorb and place the working unit 3 onto the heat sink unit 4 , so that the working unit 3 can be transferred to the heat sink unit 4 , which is convenient for the subsequent assembly of the working unit 3 .

[0096] Exemplarily, the moving component 6 can adsorb and place the working unit 3 via a suction cup.

[0097] like Figure 7 As shown, the assembly component 7 is used to connect the second housing 2 to the heat sink unit 4 to respectively install and position the first middle plate 31 , the second middle plate 32 and the PCB board 33 .

[0098] Structurally, the assembly component 7 is used to connect the second shell 2 to the heat sink unit 4 to install and position the first middle plate 31, the second middle plate 32 and the PCB board 33 respectively. The second shell 2 can be connected to the heat sink unit 4 through the assembly component 7 to install and position the first middle plate 31, the second middle plate 32 and the PCB board 33 respectively, so as to achieve the installation and fixation of the first middle plate 31, the second middle plate 32 and the PCB board 33.

[0099] After the second shell 2 is connected to the heat sink unit 4 to form an assembly unit, the assembly unit formed by the second shell 2 , the working unit 3 and the heat sink unit 4 can be connected to the first shell 1 to complete the assembly of the optical module.

[0100] Exemplarily, the assembly component 7 may be a mobile mechanical arm with a screw automatic installation function, and the second housing 2 and the heat sink unit 4 can be automatically connected through the assembly component 7 .

[0101] After the first housing 1 and the second housing 2 are connected, optical module accessories such as a pull ring may be installed.

[0102] Exemplarily, when the first shell 1 and the second shell 2 are connected, the first shell 1 and the second shell 2 can be connected and assembled manually. When the first shell 1 and the second shell 2 are connected, since the assembly of the working unit has been completed in advance, the connection of the first shell 1 and the second shell 2 will not cause structural impact or damage to the working unit, thereby improving the protection effect of the 800G optical module.

[0103] The beneficial effect brought about by the above-mentioned implementation method is that the heat sink unit is positioned under the fixing action of the fixing component, the moving component can adsorb the working unit and place it on the heat sink unit to load the working unit, and then the second shell is connected to the heat sink unit to facilitate the assembly of the working unit by the second shell and the heat sink unit. Subsequently, only the first shell and the second shell need to be connected to complete the assembly of the 800G optical module, which improves the assembly efficiency and assembly accuracy of the 800G optical module.

[0104] The beneficial effect brought about by the above-mentioned implementation method is that the assembly process of the second shell, the working unit and the heat sink unit is automatically completed by the equipment, thereby improving the assembly accuracy and efficiency of the 800G optical module.

[0105] The beneficial effect brought about by the above-mentioned implementation method is that when the first shell and the second shell are connected, there will be no structural impact or damage to the working unit, thereby improving the protection effect of the 800G optical module.

[0106] In some implementations, the fixing assembly 5 is provided with a positioning column 51 that can extend into the mounting hole 44 of the heat sink unit 4, and the positioning column 51 is provided with a spring 52 that supports the positioning column 51. The positioning column 51 can compress the spring 52 when the heat sink unit 4 and the second shell 2 are connected by screws, so that the positioning column 51 is out of the mounting hole.

[0107] Figure 8 for Figure 7 A schematic diagram of the local structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application at B, Fig. 9A schematic diagram of the main decomposition structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application is shown in FIG. Figure 8 and Fig. 9 As shown, the fixing assembly 5 is provided with a positioning column 51 which can extend into the mounting hole 44 of the heat sink unit 4. The mounting hole 44 can be positioned by the positioning column 51 so as to facilitate the installation and fixing of the heat sink unit 4.

[0108] Structurally, a spring 52 is provided inside the positioning column 51 to support the positioning column 51. The spring 52 can be used to support and reset the positioning column 51. When the heat sink unit 4 and the second shell 2 are installed and fixed, the positioning column 51 can be connected to the heat sink unit 4 and the second shell 2 by screws. The screws support the positioning column 51 so that the spring 52 is compressed through the positioning column 51, so that the positioning column 51 is removed from the installation hole to facilitate the subsequent unloading of the heat sink unit 4.

[0109] The beneficial effect brought about by the above implementation manner is that the mounting hole can be positioned by the positioning column, and thus the heat sink unit can be positioned.

[0110] The beneficial effect brought about by the above-mentioned implementation method is that after the spring is compressed when the heat sink unit and the second shell are connected by screws, the positioning column is disengaged from the mounting hole to facilitate the unloading of the heat sink unit and the assembly of the 800G optical module.

[0111] In some implementations, the high-precision packaging equipment for 800G optical modules also includes a height detection component 8 and a control component 9. The control component 9 is electrically connected to the moving component 6, the assembly component 7, and the height detection component 8, respectively. The height detection component 8 is used to verify the height after the heat sink unit 4 is placed on the fixed component 5, and the working unit 3 and the second shell 2 are installed on the heat sink unit 4 in sequence.

[0112] Fig.10 A schematic diagram of a control structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application, Fig.11 A flow chart of a high-precision packaging method for an 800G optical module provided in an embodiment of the present application is shown in FIG. Figures 7 to 11 As shown, the high-precision packaging equipment for 800G optical modules also includes a height detection component 8 and a control component 9. The control component 9 is electrically connected to the moving component 6, the assembly component 7, and the height detection component 8, respectively, so that the control component 9 can centrally control the moving component 6, the assembly component 7, and the height detection component 8.

[0113] During operation, the height detection component 8 is used to verify the height after the heat sink unit 4 is placed on the fixed component 5, and the working unit 3 and the second shell 2 are installed on the heat sink unit 4 in sequence. Then, the assembly process of the 800G optical module can be controlled by the height after the heat sink unit 4 is placed on the fixed component 5, and the working unit 3 and the second shell 2 are installed on the heat sink unit 4 in sequence.

[0114] Exemplarily, the height detection component 8 may be a photoelectric sensor.

[0115] In some implementations, when the height of the heat sink unit 4 after being placed on the fixed component 5 is greater than the first height, the control component 9 controls the moving component 6 to stop and issues a manual processing reminder. When the height of the heat sink unit 4 after being installed on the working unit 3 is greater than the second height, the control component 9 controls the assembly component 7 to stop and issues a manual processing reminder. When the height of the heat sink unit 4 after being installed on the second housing 2 is greater than the third height, a manual processing reminder is issued.

[0116] During packaging, when the height of the heat sink unit 4 after being placed on the fixed component 5 is greater than the first height, it indicates that the placement position of the heat sink unit 4 is not good, and the control component 9 can be used to control the moving component 6 to stop and issue a manual processing reminder.

[0117] During packaging, when the height of the heat sink unit 4 after installing the working unit 3 is greater than the second height, it means that the position of the working unit 3 is bad after the working unit 3 and the heat sink unit 4 are assembled. The control component 9 can be used to control the assembly component 7 to stop and issue a manual processing reminder.

[0118] During packaging, when the height of the heat sink unit 4 after being installed in the second shell 2 is greater than the third height, it indicates that the installation height of the heat sink unit 4 is not good, and a manual processing reminder may be issued.

[0119] The beneficial effect brought about by the above-mentioned implementation method is that the assembly process of the 800G optical module is controlled by placing the heat sink unit on the fixed component, installing the working unit on the heat sink unit in sequence, and the height of the second shell, thereby improving the control effect of the packaging process of the 800G optical module and avoiding poor packaging.

[0120] In some implementations, there are multiple height detection components 8 in the high-precision packaging equipment for 800G optical modules, and the multiple height detection components 8 are respectively arranged corresponding to the positions of the multiple mounting holes 44.

[0121] Structurally, there are multiple height detection components 8 in the high-precision packaging equipment for 800G optical modules. The multiple height detection components 8 are respectively arranged corresponding to the positions of the multiple mounting holes 44, so that the installation status of the multiple mounting holes 44 can be detected, thereby avoiding defects in the packaging process at each mounting hole 44, thereby improving the packaging control effect of the 800G optical module.

[0122] The beneficial effect brought about by the above-mentioned implementation method is that it can avoid defects in the packaging process at each mounting hole, thereby improving the packaging control effect of the 800G optical module.

[0123] An embodiment of the present application also provides a high-precision packaging method for an 800G optical module, using a high-precision packaging device for an 800G optical module as described in any of the above items. The method includes S110 to S140, and S110 to S140 are described in detail below.

[0124] S110 , installing and fixing the heat sink unit 4 through the fixing assembly 5 .

[0125] During the high-precision packaging of the 800G optical module, the heat sink unit 4 can be first installed and fixed by the fixing component 5 .

[0126] Exemplarily, when the heat sink unit 4 is installed and fixed, the heat sink unit 4 can be loaded onto the fixing assembly 5 by a robot arm, so that the heat sink unit 4 can be fixed and positioned by the fixing assembly 5 .

[0127] S120 , the working unit 3 is adsorbed and placed on the heat sink unit 4 by the moving component 6 .

[0128] When performing high-precision packaging of 800G optical modules, the working unit 3 can be adsorbed and placed on the heat sink unit 4 through the moving component 6, so that the working unit 3 can be effectively loaded.

[0129] S130 , connecting the second housing 2 to the heat sink unit 4 through the assembling component 7 to respectively install and position the first middle plate 31 , the second middle plate 32 and the PCB board 33 .

[0130] When performing high-precision packaging of the 800G optical module, the second shell 2 can be connected to the heat sink unit 4 through the assembly component 7 to install and position the first middle plate 31, the second middle plate 32 and the PCB board 33 respectively, so as to achieve the fixation of the first middle plate 31, the second middle plate 32 and the PCB board 33, and complete the assembly of the second shell 2, the heat sink unit 4 and the working unit 3 to form an assembly unit assembled from the second shell 2, the heat sink unit 4 and the working unit 3.

[0131] S140, insert the heat sink unit 4 into the first shell 1 for positioning, and connect the first shell 1 and the second shell 2 by snapping.

[0132] After obtaining the assembly unit composed of the second shell 2, the heat sink unit 4 and the working unit 3, the heat sink unit 4 can be installed into the first shell 1 for positioning, and the first shell 1 and the second shell 2 can be connected by snap-fit, so that the outer shell structure of the 800G optical module can be formed by the first shell 1 and the second shell 2.

[0133] The beneficial effect brought about by the above implementation manner is that the assembly unit obtained by assembling the second shell, the heat sink unit and the working unit can protect the working unit and prevent the working unit from being damaged during the packaging process.

[0134] The beneficial effect brought about by the above-mentioned implementation method is that the cross-section of the first shell is U-shaped, and the heat sink unit and the second shell are fixed to the working unit to form an assembly unit, and then the working unit is installed and fixed. The heat sink unit and the second shell can protect the working unit and prevent the first shell from scratching the working unit, thereby improving the assembly quality of the 800G optical module.

[0135] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An 800G optical module, characterized in that: include: The first shell is provided with a buckle for connecting with the second shell, and the cross section of the first shell is U-shaped; The second housing is used to connect with the first housing to form a housing of the 800G optical module; The working unit includes a first middle board, a second middle board, a PCB board and an MPO connector, wherein the first middle board is provided with a plurality of transmitting units, the second middle board is provided with a plurality of receiving units, the PCB board is coupled with the first middle board and the second middle board respectively, and the plurality of receiving units, the plurality of transmitting units and the MPO connector are connected via optical fibers; The heat sink unit is used to be connected to the second shell to respectively install and position the first middle plate, the second middle plate and the working unit. The heat sink unit can be installed in the first shell for positioning.

2. The 800G optical module according to claim 1, wherein: The heat sink unit is provided with a first positioning groove, a second positioning groove and a third positioning groove, the first positioning groove is used to position the first middle plate, the second positioning groove is used to position the second middle plate, and the third positioning groove is used to position the PCB board, and the second housing can be connected to the heat sink unit to squeeze and position the first middle plate, the second middle plate and the PCB board; The heat sink unit and the second shell are respectively provided with a plurality of mounting holes along the length direction on both side edges thereof, and the plurality of mounting holes are used to connect the heat sink unit and the second shell by screws.

3. The 800G optical module according to claim 2, wherein: The first positioning groove is provided with a first positioning hole for passing through a plurality of emitting units, and a TEC heat sink for dissipating heat from the heat sink unit is provided on one side of the first shell body close to the heat sink unit. The TEC heat sink is electrically connected to the PCB board through a cable.

4. The 800G optical module according to claim 3, characterized in that: A first heat-conducting silicone sheet is provided on one side of the TEC heat sink close to the first positioning hole.

5. The 800G optical module according to claim 4, characterized in that: A second thermally conductive silicone sheet for dissipating heat to the first intermediate plate is provided in the first positioning groove, an opening is provided on the second thermally conductive silicone sheet corresponding to the first positioning hole, a third thermally conductive silicone sheet for dissipating heat to the second intermediate plate is provided in the second positioning groove, and a fourth thermally conductive silicone sheet for dissipating heat to the PCB board is provided in the third positioning groove.

6. The 800G optical module according to claim 5, characterized in that: A fifth thermally conductive silicone sheet is arranged on the second shell, and the fifth thermally conductive silicone sheet is used for conducting heat between the second shell and the PCB board. A heat dissipation fin is arranged on a side of the second shell away from the fifth thermally conductive silicone sheet.

7. The 800G optical module according to claim 6, wherein: The thickness of the first thermally conductive silicone sheet is 0.5 mm to 1 mm, the thickness of the second thermally conductive silicone sheet, the third thermally conductive silicone sheet and the fourth thermally conductive silicone sheet is 1 mm to 2 mm, and the compression rate of the second thermally conductive silicone sheet, the third thermally conductive silicone sheet and the fourth thermally conductive silicone sheet is greater than the compression rate of the first thermally conductive silicone sheet.

8. A high-precision packaging device for 800G optical modules, characterized in that: Used to package the 800G optical module according to any one of claims 1 to 7, comprising: A fixing component, used for installing and fixing the heat sink unit; A moving component, used for adsorbing and placing the working unit onto the heat sink unit; The assembly component is used to connect the second shell to the heat sink unit to respectively install and position the first middle plate, the second middle plate and the working unit.

9. The high-precision packaging equipment according to claim 8, characterized in that: The fixing assembly is provided with a positioning column that can extend into the mounting hole of the heat sink unit. The positioning column is provided with a spring that supports the positioning column. The positioning column can compress the spring when the heat sink unit and the second shell are connected by screws, so that the positioning column falls out of the mounting hole.

10. A high-precision packaging method for an 800G optical module, characterized in that: Using the high-precision packaging device for an 800G optical module according to claim 8 or 9, the method comprises: Installing and fixing the heat sink unit by means of a fixing component; The working unit is adsorbed and placed on the heat sink unit by moving the components; Connecting the second housing to the heat sink unit through an assembly component to respectively install and position the first middle plate, the second middle plate and the working unit; The heat sink unit is installed in the first shell for positioning, and the first shell and the second shell are connected by snap fastening.

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