Waste circuit board element separation device

Abstract

The invention relates to the technical field of waste circuit board processing, in particular to a waste circuit board element separating device which comprises a grabbing assembly located above a circuit board and used for fixing an electronic element to be disassembled; the heating assembly is positioned below the circuit board and comprises a heating head which is arranged corresponding to the position of the welding spot; a double-layer elastic supporting structure is arranged at the lower end of the heating head, the double-layer elastic supporting structure comprises an outer-layer spring and an inner-layer spring which are coaxially arranged, and the upper end of the outer-layer spring and the upper end of the inner-layer spring are both fixedly connected with the heating head; the lower ends of the outer-layer spring and the inner-layer spring are fixedly connected with the first pressure sensor and the second pressure sensor respectively, the waste circuit board element separation device can conveniently separate elements on a circuit board, the elements can be effectively protected, and the percent of pass of recycled elements is increased.

Description

Technical Field

[0001] The invention relates to the technical field of waste circuit board processing, in particular to a waste circuit board component separation device. Background Art

[0002] There are generally two types of recycling of waste circuit boards: the first is to crush the waste circuit boards as a whole and then separate the components. This treatment method is used to recycle some metals in the components, but the components cannot be reused. Another method is to manually separate the components on the circuit board, which can protect the components and achieve secondary utilization. However, manual separation of components is cumbersome, and the strength is difficult to control, which can easily damage the components and affect the qualified rate of recycled components. Summary of the invention

[0003] 1. Technical issues to be resolved In view of the deficiencies in the prior art, the present invention provides a waste circuit board component separation device, which is convenient for separating components on the circuit board and can effectively protect the components, thereby improving the qualified rate of recycled components.

[0004] (II) Technical solution To achieve the above-mentioned objectives, an embodiment of the present application provides a waste circuit board component separation device, comprising: a grabbing assembly located above the circuit board, the grabbing assembly is used to fix the electronic components to be disassembled; a heating assembly located below the circuit board, the heating assembly includes a heating head arranged corresponding to the soldering point position; a double-layer elastic support structure is arranged at the lower end of the heating head, the double-layer elastic support structure includes an outer spring and an inner spring arranged coaxially, the upper ends of the outer spring and the inner spring are fixedly connected to the heating head; the lower ends of the outer spring and the inner spring are fixedly connected to the first pressure sensor and the second pressure sensor, respectively.

[0005] In one possible implementation, the grasping assembly includes a vertical support column, a transverse support fixed on the vertical support column, and a clamping mechanism arranged on the transverse support. The clamping mechanism includes two clamping claws arranged opposite to each other and a telescopic mechanical arm. The clamping claws are connected to the transverse support through the telescopic mechanical arm, and the two clamping claws are driven by a servo motor to move toward each other.

[0006] In a possible implementation, the clamping claw includes a clamping arm hinged to the telescopic mechanical arm and an elastic clamping pad arranged at the end of the clamping arm, and the inner surface of the elastic clamping pad is provided with anti-slip textures.

[0007] In a possible implementation, the heating assembly includes a lifting platform installed on a base and a horizontal moving mechanism arranged on the lifting platform, and the heating head is installed on the horizontal moving mechanism through a double-layer elastic support structure.

[0008] In a possible implementation, the heating head includes a hollow heating head body, a heating wire arranged in the heating head body, and a plurality of temperature sensors arranged around the heating wire. The top of the heating head body is provided with a heating surface matching the welding point.

[0009] In a possible implementation, the heating surface is conical and concave, a thermal conductive coating is provided on the inner wall of the heating surface, and a Teflon coating for preventing solder adhesion is provided on the edge of the heating surface.

[0010] In a possible implementation, a synchronous control system is also included, which includes a main controller arranged on a base, a position sensor electrically connected to the gripping component and the heating component respectively, and an infrared sensor for detecting the melting state of the solder joint.

[0011] In a possible implementation, the synchronous control system also includes a visual positioning device disposed on the gripping component, an image processing module for analyzing the position of the welding point, and an intelligent control module for automatically adjusting the heating parameters according to the image information.

[0012] In a possible implementation, a waste collection device is further included, which includes a collection trough arranged around the heating head, a suction pipe connected to the collection trough, and a negative pressure device connected to the suction pipe.

[0013] In a possible implementation, the heating assembly further includes a protective cover disposed around the heating head and a gas path system filled with an inert gas in the protective cover.

[0014] (III) Beneficial effects Compared with the prior art, the present invention provides a waste circuit board component separation device, which has the following beneficial effects: the waste circuit board component separation device approaches the solder joint position from the back of the circuit board through a heating head, the top surface of the heating head is in direct contact with the solder joint, and the solder joint is heated by heat conduction. The heating temperature and time are controllable to avoid damage to the circuit board and components. The outer spring has a large stiffness and provides basic support force. The inner spring has a small stiffness and is used to finely adjust the pressure. The two layers of springs work together to form a nonlinear pressure adjustment characteristic. When the heating head rises, the inner spring is first compressed to achieve soft contact. When it continues to rise, the outer spring participates in the work and provides stable support force. The first pressure sensor detects the pressure of the outer spring to monitor the overall support force, and the second pressure sensor detects the pressure of the inner spring to reflect the slight pressure change. The data of the two sensors are fed back in real time to adjust the position of the heating head. The grabbing component is located above the circuit board, and the components to be disassembled are grabbed by an adaptive clamping mechanism. The clamping force is adjustable to ensure that the components will not be displaced during the heating process. At the same time, an upward pre-tightening force is provided for the components to facilitate the detachment of the components after the solder joints are melted. It is convenient to separate the components on the waste circuit boards, and can effectively protect the components, thereby improving the qualified rate of recycled components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic structural diagram of a waste circuit board component separation device provided in an embodiment of the present application is shown; Figure 2 A schematic diagram showing the structure of a heating assembly provided in an embodiment of the present application is shown; Figure 3 A schematic diagram of the structure of a clamping claw provided in an embodiment of the present application is shown; Figure 4 A schematic diagram of the planar structure of an elastic clamping pad provided in an embodiment of the present application is shown; Figure 5 A schematic structural diagram of a waste collection device provided in an embodiment of the present application is shown.

[0016] Markings in the accompanying drawings: a. Circuit board; b. Components; 1. Grabbing assembly; 11. Vertical support column; 12. Horizontal support; 13. Clamping mechanism; 131. Clamping claw; 1311. Clamping arm; 1312. Elastic clamping pad; 1313. Anti-slip pattern; 132. Telescopic mechanical arm; 2. Heating assembly; 21. Heating head; 211. Heating head body; 2111. Heating surface; 2112. Thermal conductive coating; 2113. Teflon coating; 212. Heating wire; 213. Temperature sensor; 22. Outer spring; 23. Inner spring; 24. First pressure sensor; 25. Second pressure sensor; 26. Lifting platform; 27. Horizontal moving mechanism; 28. Protective cover; 29. ​​Gas system; 3. Waste collection device; 31. Collection tank; 32. Suction pipe; 33. Negative pressure device; 4. Base. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figures 1 to 5 The embodiment of the present application provides a waste circuit board component separation device, comprising: a gripping assembly 1 located above the circuit board a, the gripping assembly 1 is used to fix the electronic component b to be disassembled; a heating assembly 2 located below the circuit board a, the heating assembly 2 includes a heating head 21 arranged corresponding to the soldering point position; a double-layer elastic support structure is arranged at the lower end of the heating head 21, the double-layer elastic support structure includes an outer spring 22 and an inner spring 23 arranged coaxially, and the upper ends of the outer spring 22 and the inner spring 23 are fixedly connected to the heating head 21; the lower ends of the outer spring 22 and the inner spring 23 are fixedly connected to the first pressure sensor 24 and the second pressure sensor 25 respectively. Specifically, the circuit board a can be placed on the support table, or it can be conveyed between the heating assembly 2 and the gripping assembly 1 by a conveyor belt.

[0019] In the present application, the heating head 21 approaches the solder joint position from the back of the circuit board a, and the top surface of the heating head 21 is in direct contact with the solder joint. The solder joint is heated by heat conduction. The heating temperature and time are controllable to avoid damage to the circuit board a and the component b. The outer spring 22 has a large rigidity and provides basic support force. The inner spring 23 has a small rigidity and is used to finely adjust the pressure. The two layers of springs work together to form a nonlinear pressure adjustment characteristic. When the heating head 21 rises, the inner spring 23 is first compressed to achieve soft contact. When it continues to rise, the outer spring 22 participates in the work and provides stable support force. The first pressure sensor 24 detects the pressure of the outer spring 22 to monitor the overall support force. The second pressure sensor 25 detects the pressure of the inner spring 23 to reflect the slight pressure change. The data of the two sensors are fed back in real time to adjust the position of the heating head 21. The grabbing component 1 is located above the circuit board a, and the component b to be disassembled is grabbed by the adaptive clamping mechanism 13. The clamping force is adjustable to ensure that the component b will not be displaced during the heating process. At the same time, an upward preload force is provided for the component b to facilitate the detachment of the component b after the solder joint melts. It is convenient to separate the component b on the waste circuit board a, and the component b can be effectively protected, thereby improving the qualified rate of the recycled component b.

[0020] In some embodiments, the grasping assembly 1 includes a vertical support column 11, a transverse support 12 fixed on the vertical support column 11, and a clamping mechanism 13 arranged on the transverse support 12. The clamping mechanism 13 includes two clamping claws 131 arranged opposite to each other and a telescopic mechanical arm 132. The clamping claws 131 are connected to the transverse support 12 through the telescopic mechanical arm 132, and the two clamping claws 131 are driven by a servo motor to move toward each other.

[0021] Specifically, the vertical support column 11 provides a stable vertical support force to offset the upward pulling force when the component b is disassembled. It is made of high-strength material to prevent deformation and ensure positioning accuracy. The bottom is fixed on the base, and the upper part can adjust the height along the axial direction. The horizontal bracket 12 forms an "L"-shaped structure with the vertical support column 11 to provide horizontal support. The height can be adjusted by sliding along the vertical support column 11. The end is provided with a reinforcing rib to improve the rigidity and prevent deformation. The clamping mechanism 13 is connected to the horizontal bracket 12 through a telescopic mechanical arm 132, and the clamping claw 131 can be extended and retracted. The two clamping claws 131 of the clamping mechanism 13 are driven by a servo motor to move synchronously toward each other. The screw drive is used to convert the rotational motion into linear motion. The servo motor provides precise displacement and torque control. The distance between the clamping claws 131 can be automatically adjusted according to the size of the component b. The clamping mechanism 13 is moved above the component b to be separated, and then the servo motor provides precise displacement control to protect the safety of the component b, and the torque closed-loop control prevents excessive clamping.

[0022] In some embodiments, the clamping claw 131 includes a clamping arm 1311 hinged to the telescopic mechanical arm 132 and an elastic clamping pad 1312 disposed at the end of the clamping arm 1311 , and an inner surface of the elastic clamping pad 1312 is provided with anti-slip patterns 1313 .

[0023] In the present application, the clamping arm 1311 adopts a lightweight design to reduce inertia, the hinged structure provides rotational freedom, and a force sensor is installed inside to monitor the force value in real time; the elastic clamping pad 1312 adopts a specially formulated elastic material, has a certain compression deformation ability, and the surface friction coefficient is controllable; the anti-slip texture 1313 is a microscopic scale concave and convex structure, which increases the contact area, and the special texture design provides directional friction, thereby improving the clamping reliability, the elastic material provides a buffering effect, the anti-slip texture 1313 increases friction, real-time force feedback ensures stability, protects the surface of component b, flexible contact reduces stress concentration, uniform force avoids local damage, and controllable deformation prevents excessive extrusion.

[0024] Specifically, when the clamping mechanism 13 clamps component b, the elastic clamping pad 1312 first contacts the surface of component b, and the texture structure gradually fits the surface of component b to generate initial friction; then the elastic material deforms moderately, and the anti-slip texture 1313 increases the contact area to form a stable clamping torque; finally, force feedback adjustment is performed, and the force sensor detects the actual clamping force, and adjusts the servo motor output according to the feedback to maintain a constant clamping force.

[0025] Optionally, the material of the clamping arm 1311 can be carbon fiber composite material, aviation aluminum alloy, engineering plastic, etc.; the elastic clamping pad 1312 can be made of silicone material, composite rubber, or memory foam; the anti-slip pattern 1313 can adopt a honeycomb structure, a herringbone pattern, or a bionic microstructure.

[0026] In some embodiments, the heating assembly 2 includes a lifting platform 26 installed on the base 4 and a horizontal moving mechanism 27 arranged on the lifting platform 26; the heating head 21 is installed on the horizontal moving mechanism 27 through a double-layer elastic support structure.

[0027] In this application, the lifting platform 26 adopts a high-precision screw linear mechanism to achieve Z-axis movement, and the servo motor drives the screw through a belt deceleration; the horizontal moving mechanism 27 adopts a dual-axis cross slide structure, and both the X-axis and Y-axis use linear modules. Each axis is equipped with an independent servo drive, and the reverse clearance is reduced through synchronous belt transmission.

[0028] In some embodiments, the heating head 21 includes a hollow heating head body 211, a heating wire 212 disposed in the heating head body 211, and a plurality of temperature sensors 213 disposed around the heating wire 212; a heating surface 2111 matching the welding point is provided at the top of the heating head body 211.

[0029] Specifically, the heating head body 211 is made of high thermal conductivity material to form a hollow structure, with a heat dissipation channel inside, a heat insulation coating on the outside, and a special shape design on the top to match the solder joint; the heating wire 212 is made of a special alloy heating wire, spirally wound to increase the heating area, multiple sections in parallel to provide uniform heat, and PWM control to achieve precise temperature adjustment; the temperature sensor 213 has multiple sensors distributed in a ring array to collect temperature field distribution in real time, feedback control heating power, and monitor temperature uniformity. The special curved surface design of the heating surface 2111 increases the contact area, the surface treatment improves the thermal conductivity, the edge transition zone prevents heat diffusion, and the coating protection prevents oxidation. It can improve the heating efficiency, optimize the heat conduction path, multi-point temperature closed-loop control intelligent power regulation, protect the circuit board a and component b, and achieve precise temperature control, local heating without diffusion, and uniform temperature distribution.

[0030] Specific operation process: in the preheating stage, the heating wire 212 is powered on for preheating, and the temperature rise curve is monitored to maintain the preset temperature; in the heating process, the temperature rises rapidly after contacting the solder joint, and the temperature of multiple points is monitored in real time, the heating power is intelligently adjusted, and the melting state of the solder joint is detected; in the cooling process, the power is turned off and the system cools naturally, the cooling rate is monitored, and the system evacuates after reaching a safe temperature.

[0031] In some embodiments, the heating surface 2111 is conical and concave; a thermal conductive coating 2112 is provided on the inner wall of the heating surface 2111; and a Teflon coating 2113 for preventing solder adhesion is provided on the edge of the heating surface 2111.

[0032] Specifically, a conical pit is formed in the center area of ​​the conical depression to increase the contact area with the solder joint. The angle of the pit is optimized to ensure the natural flow of molten solder. The edge is designed with a gradual transition zone to prevent solder overflow. The surface micro-roughness is controlled to improve the thermal conductivity. The Teflon coating 2113 is a nano-level coating that is evenly attached to the surface to form a solder-sparse surface property. It is resistant to high temperatures and does not decompose or deteriorate, and has a self-cleaning effect. During the heat transfer process, the contact area is increased through the conical depression, and the heat is quickly conducted to the solder joint. After the solder melts, it automatically flows into the pit, and the anti-sticking effect is achieved; the Teflon coating 2113 prevents the solder from adhering, and the molten solder automatically shrinks, so the surface always remains clean.

[0033] In some embodiments, a synchronous control system is also included, which includes a main controller arranged on a base, position sensors electrically connected to the grasping component 1 and the heating component 2 respectively, and an infrared sensor for detecting the melting state of the solder joint.

[0034] In this application, infrared sensors are used to detect the melting state of solder joints, and position sensors ensure that the grabbing component 1 and the heating component 2 can be accurately positioned on the upper and lower sides of the circuit board a. The main controller uses an industrial-grade PLC as the core controller, equipped with a high-speed motion control card and a real-time operating system to ensure stability and multi-task parallel processing capabilities; improve the level of automation, increase production efficiency, optimize the operation process, and quickly respond.

[0035] In some embodiments, the synchronous control system further includes a visual positioning device disposed on the gripping component 1, an image processing module for analyzing the position of the welding point, and an intelligent control module for automatically adjusting the heating parameters according to the image information.

[0036] In the present application, component b is photographed by a visual positioning device, and the photographed image information is sent to an image processing module, the image information is analyzed and processed by the image processing module, and the heating parameters are automatically adjusted by the control module to ensure precise control of the heating temperature.

[0037] In some embodiments, a waste collection device 3 is further included. The waste collection device 3 includes a collection trough 31 arranged around the heating head 21, a suction pipe 32 connected to the collection trough 31, and a negative pressure device 33 connected to the suction pipe 32.

[0038] In the present application, the negative pressure device 33 adopts a high-speed turbine fan with adjustable suction control, and the generated waste is sucked into the collecting tank 31 through the suction pipe 32, thereby reducing environmental pollution during the operation.

[0039] In some embodiments, the heating assembly 2 further includes a protective cover 28 disposed around the heating head 21 and a gas circuit system 29 filled with an inert gas in the protective cover 28 .

[0040] In the present application, when the heating head 21 heats the circuit board a, the protective cover 28 covers the bottom of the circuit board a, and an inert gas is injected into the protective cover 28 through the gas path system 29 to perform gas protection to prevent oxidation.

[0041] The waste circuit board a component b separation device approaches the solder joint position from the back of the circuit board a through the heating head 21. The top surface of the heating head 21 is in direct contact with the solder joint, and the solder joint is heated by heat conduction. The heating temperature and time are controllable to avoid damage to the circuit board a and the component b. The outer spring 22 has a large rigidity and provides basic support force. The inner spring 23 has a small rigidity and is used to finely adjust the pressure. The two layers of springs work together to form a nonlinear pressure adjustment characteristic. When the heating head 21 rises, the inner spring 23 is first compressed to achieve soft contact. When it continues to rise, the outer spring 22 participates in the work and provides stable support force. The first pressure sensor 24 detects the pressure of the outer spring 22 to monitor the overall support force. The second pressure sensor 25 detects the pressure of the inner spring 23 to reflect the slight pressure change. The data of the two sensors are fed back in real time to adjust the position of the heating head 21. The grabbing assembly 1 is located above the circuit board a, and grabs the component b to be removed through the adaptive clamping mechanism 13. The clamping force can be adjusted to ensure that the component b does not move during the heating process, and at the same time provide an upward pre-tightening force for the component b to facilitate the detachment of the component b after the solder joint melts. It is convenient to separate the component b on the waste circuit board a, and the component b can be effectively protected, thereby improving the qualified rate of the recycled component b.

[0042] Specific operation process: In the initial positioning stage, the visual system identifies the position of the target component b, the grasping component 1 moves to the top of the component b, the clamping mechanism 13 descends and clamps the component b, and the heating component 2 is aligned with the solder joint position on the back of the circuit board a. In the heating preparation stage, the heating head 21 slowly rises and approaches the solder joint, and establishes initial contact through the double-layer elastic support structure. The pressure sensor confirms the contact state and starts the inert gas protection system. In the heating separation stage, the heating head 21 is powered on and starts heating, and the temperature and pressure changes are monitored in real time. When the solder joint is detected to be melted (pressure mutation), the grasping component 1 drives the component b to move upward to achieve separation. In the collection and cleaning stage, the waste collection system promptly absorbs the molten solder, and the heating head 21 is reset to prepare for the next operation.

[0043] Specifically, the waste circuit board a and component b separation device provided in the present application can effectively protect the integrity of component b. The double-layer elastic support provides buffering to avoid mechanical impact. The precise pressure control prevents excessive extrusion. The real-time temperature monitoring avoids overheating and improves separation efficiency. The automated positioning system reduces manual operation. Multiple sensors work together to ensure heating accuracy. Automatic waste collection improves work efficiency and reliability. Inert gas protection prevents oxidation. Visual assistance ensures accurate positioning. The intelligent control system ensures process stability.

[0044] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0045] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0046] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0047] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for separating components of waste circuit boards, characterized in that: include: A gripping assembly (1) located above the circuit board, the gripping assembly (1) being used to fix the electronic component to be disassembled; A heating component (2) located below the circuit board, the heating component (2) comprising a heating head (21) arranged corresponding to the position of the soldering point; A double-layer elastic support structure is provided at the lower end of the heating head (21), the double-layer elastic support structure comprising an outer spring (22) and an inner spring (23) which are coaxially arranged, and the upper ends of the outer spring (22) and the inner spring (23) are both fixedly connected to the heating head (21); The lower ends of the outer layer spring (22) and the inner layer spring (23) are fixedly connected to the first pressure sensor (24) and the second pressure sensor (25), respectively.

2. The waste circuit board component separation device according to claim 1, characterized in that: The gripping assembly (1) comprises a vertical support column (11), a transverse support (12) fixed to the vertical support column (11), and a clamping mechanism (13) arranged on the transverse support (12); the clamping mechanism (13) comprises two clamping claws (131) arranged opposite to each other and a telescopic mechanical arm (132); the clamping claws (131) are connected to the transverse support (12) via the telescopic mechanical arm (132); and the two clamping claws (131) are driven by a servo motor to move towards each other.

3. The waste circuit board component separation device according to claim 2, characterized in that: The clamping claw (131) comprises a clamping arm (1311) hinged to the telescopic mechanical arm (132) and an elastic clamping pad (1312) arranged at the end of the clamping arm (1311), and the inner surface of the elastic clamping pad (1312) is provided with anti-slip patterns (1313).

4. The waste circuit board component separation device according to claim 1, characterized in that: The heating component (2) comprises a lifting platform (26) mounted on a base (4) and a horizontal moving mechanism (27) arranged on the lifting platform (26); the heating head (21) is mounted on the horizontal moving mechanism (27) via the double-layer elastic support structure.

5. The waste circuit board component separation device according to claim 4, characterized in that: The heating head (21) comprises a hollow heating head body (211), a heating wire (212) arranged in the heating head body (211), and a plurality of temperature sensors (213) arranged around the heating wire (212); a heating surface (2111) matching a welding point is provided at the top end of the heating head body (211).

6. The waste circuit board component separation device according to claim 5 is characterized in that: The heating surface (2111) is in a conical concave shape, a thermal conductive coating (2112) is provided on the inner wall of the heating surface (2111), and a Teflon coating (2113) for preventing solder adhesion is provided on the edge of the heating surface (2111).

7. The waste circuit board component separation device according to claim 1, characterized in that: It also includes a synchronous control system: the synchronous control system includes a main controller arranged on a base (4), a position sensor electrically connected to the grasping component (1) and the heating component (2) respectively, and an infrared sensor for detecting the melting state of the welding point.

8. The waste circuit board component separation device according to claim 7, characterized in that: The synchronous control system further comprises a visual positioning device arranged on the grasping component (1), an image processing module for analyzing the position of the welding point, and an intelligent control module for automatically adjusting the heating parameters according to the image information.

9. The waste circuit board component separation device according to claim 1, characterized in that: It also includes a waste collection device (3), the waste collection device (3) comprising a material collection trough (31) arranged around the heating head (21), a suction pipe (32) connected to the material collection trough (31), and a negative pressure device (33) connected to the suction pipe (32).

10. The waste circuit board component separation device according to claim 1, characterized in that: The heating assembly (2) further comprises: a protective cover (28) arranged around the heating head (21) and a gas circuit system (29) for filling the protective cover (28) with inert gas.

Images