Processing method for full-automatic board matching and browning of multi-layer board in pressing process

Abstract

The invention discloses a processing method for full-automatic board matching and browning of a multi-layer board in a pressing process, and belongs to the technical field of board matching and browning of printed circuit boards, and the processing method for full-automatic board matching and browning of the multi-layer board in the pressing process can complete board matching and browning of the multi-layer board in an intelligent and braked mode. No manual operation is needed in the process, and each step of the process can be traced. The production efficiency of board matching, board placing and browning of products is high, the labor cost in the machining process is saved, and the product reject ratio caused by human errors is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board matching and browning, and in particular to a processing method for fully automatic matching and browning of multilayer boards in a pressing process. Background Art

[0002] In the manufacturing process of PCB boards, browning is a chemical treatment process, the core purpose of which is to increase the bonding strength between the original board and PP to avoid problems such as delamination and board explosion in the subsequent multi-layer board manufacturing process. Browning treatment can remove grease, debris, etc. on the surface of the original board to ensure the cleanliness of the board surface, and at the same time form a uniform layer of fluff on the copper surface of the substrate, which helps to increase the bonding strength between the substrate and PP, thereby avoiding problems such as delamination and board explosion. For the browning of multi-layer boards, manual operation is generally required, which has low production efficiency and requires manual board matching after browning. Summary of the invention

[0003] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a processing method for fully automatic panel browning of multi-layer boards in a pressing process, which can automatically complete the panel browning, improve production efficiency and reduce production costs.

[0004] The method for fully automatic browning of multilayer boards in the lamination process according to an embodiment of the present invention comprises:

[0005] Step 1: The AGV takes out different layers from the WIP storage location and places the different layers in the first, second and third stations of the plate placement device respectively;

[0006] Step 2: Preset the transfer order of the first station, the second station and the third station according to the stacking positions of different layers, and place the different layers in sequence by the robot;

[0007] Step 3: The stacked layers enter the browning processing line to clean the panels;

[0008] Step 4: Place the plate into the browning tank, so that the copper surface of the plate contacts the browning liquid to form a brown organic metal layer;

[0009] Step 5: After browning is completed, clean the board again;

[0010] Step 6: Remove moisture from the board through drying technology;

[0011] Step 7: Cool the board to stabilize the browning layer and prepare for final board production.

[0012] The method for fully automatic panel matching and browning of multilayer boards in the lamination process according to the embodiment of the present invention has at least the following beneficial effects: the method for fully automatic panel matching and browning of multilayer boards in the lamination process can complete the panel matching and browning of multilayer boards in an intelligent and automatic manner, without manual operation in the process and each step of the process can be traced. The production efficiency of product matching, placing and browning is high, which saves labor costs in the processing process and reduces the product defect rate caused by human errors.

[0013] According to some embodiments of the present invention, in step 3, cleaning the plate includes pickling, using an acid solution to treat the plate to remove oxides and impurities on the copper surface.

[0014] According to some embodiments of the present invention, in step 3, the cleaning of the plate further includes ultrasonic immersion cleaning, which utilizes high-frequency vibration of ultrasonic waves to remove tiny particles of contaminants on the copper surface.

[0015] According to some embodiments of the present invention, in step 3, cleaning of the plate further comprises alkaline washing, using alkaline to easily clean the surface of the plate and remove grease and residues on the copper surface.

[0016] According to some embodiments of the present invention, in step 3, after the plate is pickled, ultrasonically cleaned and alkaline cleaned, the plate is cleaned under a high-pressure water flow to remove residual chemical solution.

[0017] According to some embodiments of the present invention, in step 4, before the plate is sent into the browning tank, the plate is inspected to ensure that there is no residue on the copper surface of the plate.

[0018] According to some embodiments of the present invention, visual inspection is used to inspect the surface of the sheet material.

[0019] According to some embodiments of the present invention, automated optical inspection is used to inspect the surface of the sheet material.

[0020] According to some embodiments of the present invention, in step 5, the plate is firstly rinsed with a high-pressure water flow, and then the plate is finally cleaned with ionized water.

[0021] According to some embodiments of the present invention, in step 6, the drying technology includes two hot air dryings, the first hot air drying ensures that the board is completely dried, and the second hot air drying consolidates the drying effect.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0024] Figure 1It is a flow chart of a processing method for fully automatic panel matching and browning of multilayer boards in a lamination process according to an embodiment of the present invention;

[0025] Figure 2 It is a structural schematic diagram of a board placement device in a processing method for fully automatic board placement and browning of multilayer boards in a lamination process according to an embodiment of the present invention;

[0026] Figure 3 It is a structural schematic diagram of a browning processing line in a method for fully automatic browning of multilayer boards in a lamination process according to an embodiment of the present invention.

[0027] Reference numerals:

[0028] Plate placement device 100; first station 110; second station 120; third station 130; robot 140;

[0029] Acid cleaning device 210; ultrasonic immersion cleaning device 220; alkali cleaning device 230; first pressurized water cleaning device 240;

[0030] Prepreg device 310; Browning device 320;

[0031] A second pressurized water washing device 410 ; a DI water washing device 420 ; a first hot air drying device 430 ; a second hot air drying device 440 ; and a cooling device 450 . DETAILED DESCRIPTION

[0032] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0033] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] refer to Figures 1 to 3 A method for fully automatic panel matching and browning of multilayer boards in a lamination process according to an embodiment of the present invention is described.

[0037] like Figures 1 to 3 As shown, the processing method for fully automatic browning of multilayer boards in the lamination process according to an embodiment of the present invention includes:

[0038] Step 1: The AGV takes out different layers from the WIP storage location and places the different layers in the first station 110, the second station 120 and the third station 130 of the plate placement device 100 respectively;

[0039] Step 2: Preset the transfer order of the first station 110, the second station 120 and the third station 130 according to the stacking positions of different layers, and place the different layers in sequence by the robot 140;

[0040] Step 3: The stacked layers enter the browning processing line to clean the panels;

[0041] Step 4: Place the plate into the browning tank, so that the copper surface of the plate contacts the browning liquid to form a brown organic metal layer;

[0042] Step 5: After browning is completed, clean the board again;

[0043] Step 6: Remove moisture from the board through drying technology;

[0044] Step 7: Cool the board to stabilize the browning layer and prepare for final board production.

[0045] like Figure 2As shown, the different layers to be pressed are placed on the first station 110, the second station 120 and the third station 130 of the board placement device 100, respectively, and the manipulator 140 accurately arranges and combines the different layers of the multilayer board according to the predetermined design and number of layers. This process is to ensure that in the subsequent pressing process, the layers can be accurately superimposed together to form a complete multilayer PCB board. The board matching work involves arranging the double-sided copper-clad laminate with the inner layer graphics completed and browned with the semi-cured sheet according to a specific number of layers and sequence to ensure that the circuit layers can be properly connected to avoid open circuits or short circuits. The accuracy of the board matching is crucial to the structural quality and circuit performance of the entire multilayer board. In the context of automated and intelligent manufacturing, the automation of the board matching process can significantly improve production efficiency and reduce human errors, thereby improving the quality and efficiency of the entire PCB manufacturing process.

[0046] The board placement device 100 integrates the board placement process and the board placement process, and sets the transfer sequence of the first station 110, the second station 120, and the third station 130 according to the system preset formula requirements to meet the functions of fully automatic board placement and board placement of multilayer boards. The change from manual board placement to automatic board placement improves the automation and efficiency of board placement, while also improving the accuracy of board placement to avoid defective products caused by human errors. Materials are loaded from the WIP storage location through AGV transportation to achieve unmanned transportation. During transportation, the logistics and information flows are bound and recorded in the system, and are automatically compared with the batch ID in the system to identify mixed materials and mixed batches.

[0047] like Figure 3 As shown, after the board placement is completed, the board placement device 100 sends the board into the browning production line. The browning production line first cleans the board. The pickling device 210, ultrasonic immersion device 220, alkali cleaning device 230 and first pressurized water washing device 240 are sequentially arranged on the browning production line to clean the board before browning; the pre-impregnation device 310 and the browning device 320 brown the board; the second pressurized water washing device 410 and the DI water washing device 420 clean the board after browning; the first hot air drying device 430 and the second hot air drying device 440 dry the board; the cooling device 450 cools the board after drying. Therefore, the processing method of fully automatic board placement and browning of multi-layer boards in the lamination process can complete the board placement and browning of multi-layer boards in an intelligent and automatic manner. There is no manual operation in the process and each step of the process can be traced. The production efficiency of product board placement, board placement and browning is high, which saves labor costs in the processing process and reduces the product defect rate caused by human errors.

[0048] The pickling device 210 uses an acidic solution to treat the plate to remove oxides and impurities on the copper surface in preparation for subsequent processing. The ultrasonic immersion cleaning device 220 uses the high-frequency vibration of ultrasound to accelerate the cleaning process, remove tiny particles and contaminants on the copper surface, and improve cleaning efficiency. The alkaline cleaning device 230 uses an alkaline solution to further clean the copper surface, remove grease and residues, and ensure that the copper surface is clean. The first pressurized water washing device 240 washes the board under high-pressure water flow to remove the solution remaining after chemical treatment and ensure that the board surface is clean.

[0049] After cleaning, visual inspection or automatic optical inspection is performed to ensure that the cleaning process is thorough and there is no residue, so as to prepare for browning. Before browning, the board is pre-impregnated by the pre-impregnation device 310 to prepare the copper surface to receive the browning layer. Then the board is sent to the browning device 320, where the copper surface contacts the browning liquid in the browning tank to form a brown organic metal layer. This film can increase the bonding strength between copper and PP, avoiding problems such as delamination and board explosion.

[0050] After the browning, the second pressurized water washing device 410 uses high-pressure water to wash the board again to remove the residues that may be produced during the browning process. The DI water washing device 420 uses deionized water for the final cleaning to ensure that the board surface is clean and prepare for the subsequent processes. After the cleaning is completed, the board is dried, and the first hot air drying device 430 performs the first hot air drying on the board to ensure that the board is completely dry. The second hot air drying device 440 performs the second hot air drying on the board to further consolidate the drying effect. The dried board is cooled by the cooling device 450 to stabilize the browning layer and prepare for the final board output.

[0051] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A method for fully automatic panel browning of multilayer boards in a lamination process, characterized in that: include: Step 1: The AGV takes out different layers from the WIP storage location and places the different layers in the first, second and third stations of the plate placement device respectively; Step 2: Preset the transfer order of the first station, the second station and the third station according to the stacking positions of different layers, and place the different layers in sequence by the robot; Step 3: The stacked layers enter the browning processing line to clean the panels; Step 4: Place the plate into the browning tank, so that the copper surface of the plate contacts the browning liquid to form a brown organic metal layer; Step 5: After browning is completed, clean the board again; Step 6: Remove moisture from the board through drying technology; Step 7: Cool the board to stabilize the browning layer and prepare for final board production.

2. The method for fully automatic panel matching and browning of multilayer boards in the lamination process according to claim 1, characterized in that: In step 3, the cleaning of the plate includes pickling, using an acid solution to treat the plate to remove oxides and impurities on the copper surface.

3. The method for fully automatic browning of multilayer boards in the lamination process according to claim 2, characterized in that: In step 3, the cleaning of the plate also includes ultrasonic immersion cleaning, which uses high-frequency vibration of ultrasonic waves to remove tiny particles of contaminants on the copper surface.

4. The method for fully automatic panel matching and browning of multilayer boards in the lamination process according to claim 3 is characterized in that: In step 3, the cleaning of the plate also includes alkaline washing, using alkaline to easily clean the surface of the plate and remove grease and residues on the copper surface.

5. The method for fully automatic panel matching and browning of multilayer boards in the lamination process according to claim 4, characterized in that: In step 3, after the plate is pickled, ultrasonically dipped and alkaline washed, the plate is cleaned under a high-pressure water flow to remove the residual chemical solution.

6. The method for fully automatic panel matching and browning of multilayer boards in the lamination process according to claim 5, characterized in that: In step 4, before the plate is sent to the browning tank, the plate is inspected to ensure that there is no residue on the copper surface of the plate.

7. The method for fully automatic panel matching and browning of multilayer boards in the lamination process according to claim 6, characterized in that: The surface of the board is inspected by visual inspection.

8. The method for fully automatic panel matching and browning of multilayer boards in the lamination process according to claim 6, characterized in that: The surface of the panels is inspected using automated optical inspection.

9. The method for fully automatic panel matching and browning of multilayer boards in the lamination process according to claim 1, characterized in that: In step 5, the board is first rinsed with a high-pressure water stream and then finally rinsed with deionized water.

10. The method for fully automatic panel matching and browning of multilayer boards in the lamination process according to claim 1, characterized in that: In step 6, the drying technique includes two hot air dryings, the first hot air drying ensures that the board is completely dry, and the second hot air drying consolidates the drying effect.

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