Electronic control unit and vehicle including same

By designing the bottom and top cooling water jackets in the electronic control unit and setting up the lower and upper cooling water flow paths, the problems of low cooling efficiency and complex structure in the prior art are solved, and rapid cooling and structural simplification of both sides of the control board are achieved.

CN119629934APending Publication Date: 2025-03-14LG ELECTRONICS INC
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Patent Information

Application Number
CN202311381850.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-12
Filing Date
2023-10-24
Publication Date
2025-03-14

AI Technical Summary

Technical Problem

The existing electronic control units have problems of inefficiency and complex structure when cooling the control panel, making it difficult to quickly and effectively cool the control panel of high heat sources.

Method used

An electronic control unit including a bottom and top cooling water jacket is designed. By setting the lower cooling water flow path and the upper cooling water flow path on both sides of the control board, the control board is quickly cooled by cooling water, and the structure is simple and compact.

Benefits of technology

It realizes rapid cooling of both sides of the control panel, simplifies the structure, improves cooling efficiency and compactness, and can expand the electronic control unit according to vehicle needs.

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Abstract

The invention discloses an electronic control unit and a vehicle including the same. In the electronic control unit comprising at least one control unit of the embodiment, the at least one control unit comprises a first control unit, and the first control unit comprises a bottom cooling water jacket which is provided with a first passage and a second passage separated from the first passage, a lower cooling water flow path and lower cooling fins through which cooling water passes are formed between the first passage and the second passage; the top cooling water jacket is provided with a third passage and a fourth passage which are communicated with the second passage, and an upper cooling water flow path and upper cooling fins through which cooling water passes are formed between the third passage and the fourth passage; and a first control plate disposed between the bottom cooling water jacket and the top cooling water jacket.
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Description

Technical Field

[0001] The invention relates to an electronic control unit and a vehicle comprising the electronic control unit. Background Art

[0002] Examples of components installed in a vehicle include an engine control component (or a motor control component), a power transmission component, a brake component, a suspension component, a steering component, an instrument component, and an information communication control component.

[0003] An electronic control unit (ECU) is a control device having a function of controlling and managing such major components of a vehicle. In a vehicle, a plurality of electronic control units are provided according to the components, thereby controlling each component.

[0004] The electronic control unit may include an electronic control unit with a built-in chip for autonomous driving or infotainment (software or media that adds entertainment to the transmission of information) installed in the vehicle. For such an electronic control unit, it is preferred to properly cool the chip or the substrate (control board) on which the chip is provided to deal with chip overheating.

[0005] As an example of cooling an electronic control unit, there is an electronic module disclosed in the U.S. patent publication US5323292A (authorized on June 21, 1994), which discloses that the electronic module includes aluminum heat sinks 12, 14 directly surrounding circuit chips 28-38 and a substrate 26, and the heat sink includes parallel fins 16, 18 that provide a larger surface area to dissipate heat to the surrounding atmosphere.

[0006] Prior art literature

[0007] Patent Literature

[0008] United States Patent Gazette US5323292A (authorized on June 21, 1994). Summary of the invention

[0009] An object of the present embodiment is to provide an electronic control unit capable of cooling both surfaces of a control panel and a vehicle having the electronic control unit.

[0010] The electronic control unit of this embodiment includes a first control unit, which includes: a bottom cooling water jacket, which is formed with a first passage and a second passage separated from the first passage, and a lower cooling water flow path and lower cooling fins for cooling water to pass through are formed between the first passage and the second passage; a top cooling water jacket, which is formed with a third passage and a fourth passage connected to the second passage, and an upper cooling water flow path and upper cooling fins for cooling water to pass through are formed between the third passage and the fourth passage; and a first control board, which is arranged between the bottom cooling water jacket and the top cooling water jacket.

[0011] The bottom cooling water jacket may include: a bottom jacket formed with a first passage, a second passage, a lower cooling water flow path and lower cooling fins; and an inner bottom cover disposed on a top surface of the bottom jacket and covering the lower cooling water flow path and the lower cooling fins.

[0012] The top cooling water jacket may include: a top jacket formed with a third passage, a fourth passage, an upper cooling water flow path and upper cooling fins; and an inner top cover arranged on the bottom surface of the top jacket and covering the upper cooling water flow path and the upper cooling fins.

[0013] The first control unit may further include an inner gasket sealing between the second passage and the third passage.

[0014] The electronic control unit may further include a second control unit disposed on the bottom surface of the bottom cooling water jacket.

[0015] The second control unit may include: a first lower housing configured on the bottom surface of the bottom cooling water jacket; a second lower housing configured at the lower portion of the first lower housing; and a second control board accommodated between the first lower housing and the second lower housing.

[0016] The invention may further include a lower heat conducting plate arranged between the bottom surface of the bottom cooling water jacket and the top surface of the first lower shell body.

[0017] The electronic control unit may further include a third control unit disposed on the top surface of the top cooling water jacket.

[0018] The third control unit may include: a first upper shell configured on the top surface of the top cooling water jacket; a second upper shell configured on the upper portion of the first upper shell; and a first upper control board accommodated between the first upper shell and the second upper shell.

[0019] The electronic control unit may further include an upper heat conducting plate disposed between the top surface of the top cooling water jacket and the first upper housing.

[0020] The electronic control unit may further include a fourth control unit disposed on the top surface of the top cooling water jacket.

[0021] The fourth control unit may include: a third upper shell configured on the top surface of the top cooling water jacket; a fourth upper shell configured on the upper part of the third upper shell; and a second upper control board accommodated between the third upper shell and the fourth upper shell.

[0022] The electronic control unit may further include an upper heat conducting plate disposed between the top surface of the top cooling water jacket and the third upper housing.

[0023] The fourth control unit may be arranged in a row with the third control unit in the length direction of the first control unit.

[0024] The third control unit may be closer to the fourth passage of the third and fourth passages. The fourth control unit may be closer to the third passage of the third and fourth passages.

[0025] The vehicle including the electronic control unit of the present embodiment includes a first control unit and a water-cooling type cooling device that causes cooling water to flow to the first control unit.

[0026] The first control unit may include: a bottom cooling water jacket, formed with a first passage and a second passage separated from the first passage, a lower cooling water flow path and lower cooling fins for cooling water to pass through formed between the first passage and the second passage; a top cooling water jacket, formed with a third passage and a fourth passage, the third passage is connected to the second passage, an upper cooling water flow path and upper cooling fins for cooling water to pass through formed between the third passage and the fourth passage; and a control board, arranged between the bottom cooling water jacket and the top cooling water jacket; the first control unit may also include: a first connector, arranged in the first passage; and a second connector, arranged in the fourth passage.

[0027] The water-cooled cooling device may include a cooling water valve that supplies cooling water to the first joint or supplies cooling water to the second joint.

[0028] The vehicle including the electronic control unit may further include a second control unit disposed on a bottom surface of the bottom cooling water jacket, and the cooling water valve may supply cooling water to the first connector.

[0029] The vehicle including the electronic control unit may further include: a second control unit arranged on the bottom surface of the bottom cooling water jacket; and a third control unit arranged on the top surface of the top cooling water jacket; the cooling water valve may supply cooling water to the second joint.

[0030] The vehicle including the electronic control unit may further include a fourth control unit disposed on a top surface of the top cooling water jacket.

[0031] The third control unit may be closer to the fourth path of the third path and the fourth path.

[0032] The fourth control unit may be closer to the third passage among the third passage and the fourth passage.

[0033] According to this embodiment, the cooling water sequentially passing through the lower cooling water flow path and the upper cooling water flow path can cool the bottom surface and the top surface of the first control board, and both surfaces of the first control board can be quickly cooled with a simple structure.

[0034] In addition, the cooling water passing through the lower cooling water flow path can cool the first control board and the second control board together, and the lower cooling water flow path can serve as the cooling water flow path for the first control board and the second control board, thereby simplifying the structure and making it compact.

[0035] In addition, the cooling water passing through the upper cooling water flow path can cool both the first control board and the third control board, and the upper cooling water flow path can serve as the cooling water flow path for the first control board and the third control board, thereby simplifying the structure and making it compact.

[0036] In addition, the cooling water passing through the upper cooling water flow path can cool the first control plate, the third control plate and the fourth control plate together, and the upper cooling water flow path can also serve as the cooling water flow path of the first control plate, the cooling water flow path of the third control plate and the cooling water flow path of the fourth control plate, so that the structure is simple and can be compact.

[0037] In addition, the electronic control unit may include a first control unit and a second control unit, or include a first control unit, a second control unit and a third control unit, or include a first control unit, a second control unit, a third control unit and a fourth control unit, so that the electronic control unit can be expanded according to the vehicle.

[0038] In addition, since the cooling water valve can allow the cooling water to flow through the lower cooling water flow path first or the upper cooling water flow path first, the cooling water can cool the control panel, which is a high heat source, more quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a perspective view of an example of the electronic control unit of this embodiment.

[0040] Figure 2 It is an exploded perspective view of an example of the electronic control unit of this embodiment.

[0041] Figure 3 It is a partially cutaway perspective view of an example of the electronic control unit of this embodiment.

[0042] Figure 4 It is an exploded perspective view of an example of the first control unit of this embodiment.

[0043] Figure 5 yes Figure 4 An exploded perspective view of the bottom cooling water jacket and the top cooling water jacket is shown.

[0044] Figure 6 It is a perspective view of another example of the electronic control unit of this embodiment.

[0045] Figure 7 It is a perspective view of still another example of the electronic control unit of this embodiment.

[0046] Figure 8 This is a diagram showing an example in which the electronic control unit of the present embodiment is cooled by a water-cooling type cooling device.

[0047] Fig. 9This is a diagram showing another example in which the electronic control unit of the present embodiment is cooled by the water-cooling type cooling device.

[0048] Fig.10 This is a diagram showing the electronic control unit and the motor of this embodiment being cooled by a water-cooling type cooling device.

[0049] Fig.11 This is a diagram showing the electronic control unit and the additional electronic control unit of the present embodiment being cooled by a water-cooling type cooling device.

[0050] Description of Reference Numerals

[0051] 1: First control unit 5: Bottom cooling water jacket;

[0052] 6: Top cooling water jacket 7: First control board

[0053] 51: First channel 52: Second channel

[0054] 53: Lower cooling water flow path 54: Lower cooling fin

[0055] 61: Third channel 62: Fourth channel

[0056] 63: Upper cooling water flow path 64: Upper cooling fin DETAILED DESCRIPTION

[0057] The following, with the attached Figure 1 The specific embodiments of the present invention will be described in detail.

[0058] Figure 1 is a perspective view of an example of an electronic control unit of this embodiment, Figure 2 is an exploded perspective view of an example of an electronic control unit of this embodiment, Figure 3 is a partially cutaway perspective view of an example of an electronic control unit of this embodiment, Figure 4 is an exploded perspective view of an example of the first control unit of this embodiment, Figure 5 yes Figure 4 An exploded perspective view of the bottom cooling water jacket and the top cooling water jacket is shown.

[0059] The electronic control unit may be provided in the vehicle, and may be a control unit for autonomous driving of the vehicle.

[0060] The electronic control unit may be connected to a water-cooling type cooling device provided to the vehicle, and may be cooled by cooling water circulated through the water-cooling type cooling device.

[0061] The electronic control unit may include at least one control unit. The at least one control unit may include only one first control unit 1 , or may include at least one extended control unit in addition to the first control unit 1 .

[0062] When the electronic control unit also includes an expansion control unit, the expansion control unit may include only the second control unit 2 installed on the first control unit 1, or may include the second control unit 2 and the third control unit 3 installed on the first control unit 1, or may include the second control unit 2, the third control unit 3 and the fourth control unit 4 installed on the first control unit 1.

[0063] The first control unit 1 may be an autonomous driving control unit for executing level 1 or level 2 of the autonomous driving levels.

[0064] The second control unit 2 may be an autonomous driving control unit for executing level 2+ in the autonomous driving level, or may be an infotainment control unit capable of executing infotainment (software or media that adds entertainment to the delivery of information) of the vehicle.

[0065] The second control unit 2 may be a control unit disposed on the bottom surface of the first control unit 1 .

[0066] The third control unit 3 may be an autonomous driving control unit for executing level 3 of the autonomous driving levels.

[0067] The third control unit 3 may be a control unit disposed on the top surface of the first control unit 1 .

[0068] The fourth control unit 4 may be an autonomous driving control unit for executing level 4 of the autonomous driving levels.

[0069] The fourth control unit 4 may be a control unit configured together with the third control unit 3 on the top surface of the first control unit 1 .

[0070] Each of the first control unit 1 , the second control unit 2 , the third control unit 3 , and the fourth control unit 4 may include a control board.

[0071] In the control board, a semiconductor chip such as an MCU (microprogram controller) for executing autonomous driving or infotainment may be provided on a substrate.

[0072] A cooling water flow path capable of cooling a control board configured in the first control unit 1 may be formed in the first control unit 1, and an additional cooling water flow path may not be formed in each of the second control unit 2, the third control unit 3 and the fourth control unit 4, and the control board arranged in each of the second control unit 2, the third control unit 3 and the fourth control unit 4 can be cooled by cooling water via the cooling water flow path formed in the first control unit.

[0073] Each control unit will be described below.

[0074] The first control unit 1 may have a length in the front-rear direction X, a width in the left-right direction Y, and a thickness in the up-down direction Z.

[0075] The first control unit 1 may include a bottom cooling water jacket 5 , a top cooling water jacket 6 and a first control board 7 .

[0076] The bottom cooling water jacket 5 may be formed with a first passage 51 and a second passage 52 spaced apart from the first passage 51 .

[0077] A lower cooling water flow path 53 and lower cooling fins 54 through which cooling water passes may be formed between the first path 51 and the second path 52 of the bottom cooling water jacket 5 .

[0078] The first passage 51 may be formed at one end of the bottom cooling water jacket 5 in the longitudinal direction X. The first passage 51 may be open in the longitudinal direction X of the bottom cooling water jacket 5.

[0079] The second passage 52 may be formed close to the other end of the bottom cooling water jacket 5 in the longitudinal direction X. The second passage 52 may be open in the thickness direction Z of the bottom cooling water jacket 5.

[0080] The lower cooling water flow path 53 may be formed long along the longitudinal direction X of the bottom cooling water jacket 5 .

[0081] The lower cooling fin 54 may be located in the lower cooling water flow path 53 and may be formed long along the length direction X of the bottom cooling water jacket 5 . The length of the lower cooling fin 54 may be shorter than the length of the lower cooling water flow path 53 .

[0082] A plurality of lower cooling fins 54 may be arranged in the lower cooling water flow path 53. The plurality of lower cooling fins 54 may be spaced apart from each other in the width direction Y of the bottom cooling water jacket 5. A unit flow path for distributing cooling water may be formed between a pair of adjacent lower cooling fins 54.

[0083] The bottom cooling water jacket 5 may be composed of a combination of a plurality of components. The bottom cooling water jacket 5 may include a bottom jacket 55 and an inner bottom cover 56 .

[0084] The bottom casing 55 may be formed with a first passage 51 , a second passage 52 , a lower cooling water flow path 53 , and lower cooling fins 54 .

[0085] A lower opening 55 a may be formed on the upper side of the lower cooling water flow path 53 of the bottom casing 55 , and the lower opening 55 a exposes the lower cooling water flow path 53 and the lower cooling fins 54 .

[0086] The inner bottom cover 56 may be disposed on the top surface of the bottom casing 55. The inner bottom cover 56 may be disposed at the lower opening 55a. The inner bottom cover 56 may cover the lower cooling water flow path 53 and the lower cooling fins 54 on the upper side of the lower cooling water flow path 53.

[0087] The bottom cooling water jacket 5 may include a plurality of supporting legs 55b.

[0088] A plurality of supporting legs 55 b may be formed at the bottom housing 55 to be spaced apart from each other in a horizontal direction.

[0089] The top cooling water jacket 6 can be vertically symmetrical with the bottom cooling water jacket 5 via the first control plate 7 .

[0090] The top cooling water jacket 6 may be formed with a third passage 61 communicating with the second passage 52 and a fourth passage 62 spaced apart from the third passage 61 .

[0091] The top cooling water jacket 6 may be formed with an upper cooling water flow path 63 and upper cooling fins 64 for cooling water to pass between the third path 61 and the fourth path 62 .

[0092] The third passage 61 may be formed close to the other end of the top cooling water jacket 6 in the longitudinal direction X. The third passage 61 may be formed open in the up-down direction Z of the top cooling water jacket 6.

[0093] The fourth passage 62 may be formed at one end of the top cooling water jacket 6 in the longitudinal direction X. The fourth passage 62 may be open in the longitudinal direction X of the top cooling water jacket 6.

[0094] The upper cooling water flow path 63 may be formed to be long along the longitudinal direction X of the top cooling water jacket 6 .

[0095] The upper cooling fin 64 may be located in the upper cooling water flow path 63 and may be formed long along the length direction X of the top cooling water jacket 6 . The length of the upper cooling fin 64 may be shorter than the length of the upper cooling water flow path 63 .

[0096] A plurality of upper cooling fins 64 may be arranged in the upper cooling water flow path 63. The plurality of upper cooling fins 64 may be spaced apart from each other in the width direction Y of the top cooling water jacket 6. A unit flow path for distributing cooling water may be formed between a pair of adjacent upper cooling fins 64.

[0097] The top cooling water jacket 6 may be composed of a combination of a plurality of components. The top cooling water jacket 6 may include a top jacket 65 and an inner top cover 66 .

[0098] The top sleeve 65 may be formed with a third passage 61 , a fourth passage 62 , an upper cooling water flow path 63 , and upper cooling fins 64 .

[0099] An upper opening 65 a that exposes the upper cooling water flow path 63 and the upper cooling fins 64 may be formed at a lower side of the upper cooling water flow path 63 of the top sleeve 65 .

[0100] The inner top cover 66 may be disposed on the bottom surface of the top cover 65. The inner top cover 66 may be disposed on the upper opening 65a. The inner top cover 66 may cover the upper cooling water flow path 63 and the upper cooling fins 64 at the lower side of the upper cooling water flow path 63.

[0101] The bottom cooling water jacket 5 and the top cooling water jacket 6 may be fastened by fastening members such as bolts.

[0102] A space S1 for accommodating the first control board 7 may be formed between the bottom cooling water jacket 5 and the top cooling water jacket 6 .

[0103] The first control board 7 may be disposed between the bottom cooling water jacket 5 and the top cooling water jacket 6. The first control board 7 may be accommodated in a space S1 formed between the bottom cooling water jacket 5 and the top cooling water jacket 6.

[0104] The first control board 7 may include a substrate 71 and a semiconductor chip 72 disposed on the substrate 71 . An example of the semiconductor chip 72 may be an autonomous driving chip such as an MCU capable of executing level 1 or level 2 of the autonomous driving level.

[0105] The first control plate 7 may be in thermal contact with each of the bottom cooling water jacket 5 and the top cooling water jacket 6 .

[0106] The bottom surface of the substrate 71 or the semiconductor chip 72 protruding from the bottom surface of the substrate 71 may be in thermal contact with the bottom cooling water jacket 5 , in particular the inner bottom cover 56 .

[0107] The top surface of the substrate 71 or the semiconductor chip 72 protruding from the top surface of the substrate 71 may be in thermal contact with the top cooling water jacket 6 , in particular the inner top cover 66 .

[0108] The first control plate 7 may have an escape groove 73 formed therein for escaping at least one of the second passage 52 and the third passage 61 .

[0109] The first control unit 1 may further include an inner gasket 8 sealing between the second passage 52 and the third passage 61 .

[0110] The lower portion of the inner gasket 8 may be inserted into the second passage 52 , the upper portion of the inner gasket 8 may be inserted into the third passage 61 , and the protruding portion protruding from the center portion of the inner gasket 8 may be disposed between the bottom cooling water jacket 5 and the top cooling water jacket 6 .

[0111] The cooling water that cools the bottom surface of the first control plate 7 through the lower cooling water flow path 53 can flow to the upper cooling water flow path 63 through the second passage 52, the inside of the inner gasket 8, and the third passage 61 in sequence, and can cool the top surface of the first control plate 7 through the upper cooling water flow path 63.

[0112] The cooling water that cools the top surface of the first control plate 7 through the upper cooling water flow path 63 can flow to the lower cooling water flow path 53 through the third passage 61, the inside of the inner gasket 8, and the second passage 52 in sequence, and can cool the bottom surface of the first control plate 7 through the lower cooling water flow path 53.

[0113] The first control unit 1 may include a first nipple 9 disposed at the first passage 51 and a second nipple 10 disposed at the fourth passage 62 .

[0114] A portion of the first joint 9 may be inserted into the first passage 51 .

[0115] A portion of the second joint 10 may be inserted into the fourth passage 62 .

[0116] The second control unit 2 may be parallel to the first control unit 1. The second control unit 2 may have a length in the front-rear direction X, a width in the left-right direction Y, and a thickness in the up-down direction Z.

[0117] The second control unit 2 may be disposed on the bottom surface of the bottom cooling water jacket 3 .

[0118] The second control unit 2 may include a first lower case 21 , a second lower case 22 , and a second control board 23 .

[0119] The second control unit 2 may be disposed on the bottom surface of the bottom cooling water jacket 5 of the first control unit 1 without an additional cooling water flow path, and may be cooled by cooling water through the lower cooling water flow path 53 .

[0120] The first lower shell 21 may be disposed on the bottom surface of the bottom cooling water jacket 5 .

[0121] The second lower case 22 may be disposed at a lower portion of the first lower case 21. The second lower case 22 may be fastened to the first lower case 21 by fastening members such as bolts.

[0122] The second control board 23 may be accommodated between the first lower case 21 and the second lower case 22 .

[0123] A space S2 for accommodating the second control board 23 may be formed between the first lower case 21 and the second lower case 22 .

[0124] The second control board 23 may include a substrate 24 and a semiconductor chip 25 disposed on the substrate 24 . An example of the semiconductor chip 25 may be an autonomous driving chip such as an MCU capable of executing level 2+ of the autonomous driving level or infotainment.

[0125] The second control plate 23 may be in thermal contact with the bottom cooling water jacket 5 .

[0126] The top surface of the substrate 24 or the semiconductor chip 25 protruding from the top surface of the substrate 24 may be in thermal contact with the cooling water passing through the lower cooling water flow path 53 through the first lower case 21 and the bottom sleeve 55 .

[0127] The electronic control unit may further include a lower heat conducting plate 26 disposed between the bottom cooling water jacket 5 and the top surface of the second control unit 2. The lower heat conducting plate 26 may be disposed between the bottom surface of the bottom cooling water jacket 5 and the top surface of the first lower housing 21.

[0128] When the electronic control unit also includes a lower heat conducting plate 26 , the top surface of the substrate 24 or the semiconductor chip 25 protruding from the top surface of the substrate 24 can be in thermal contact with the cooling water via the lower cooling water flow path 53 through the first lower shell 21 , the lower heat conducting plate 26 and the bottom sleeve 55 .

[0129] The third control unit 3 may be parallel to the first control unit 1. The third control unit 3 may have a length in the front-rear direction X, a width in the left-right direction Y, and a thickness in the up-down direction Z.

[0130] The third control unit 3 may be disposed on the top surface of the top cooling water jacket 6 .

[0131] The size of the third control unit 3 may be smaller than that of the first control unit 1 .

[0132] The third control unit 3 may include a first upper housing 31 , a second upper housing 32 , and a first upper control board 33 .

[0133] The third control unit 3 may be disposed on the top surface of the top cooling water jacket 6 of the first control unit 1 without an additional cooling water flow path, and may be cooled by cooling water through the upper cooling water flow path 63 .

[0134] The first upper shell 31 may be disposed on the top surface of the top cooling water jacket 6 .

[0135] The second upper housing 32 may be disposed on an upper portion of the first upper housing 31 .

[0136] The second upper case 32 may be fastened to the first upper case 31 by fastening members such as bolts.

[0137] The first upper control board 33 may be received between the first upper case 31 and the second upper case 32 .

[0138] A space S3 for accommodating the first upper control board 33 may be formed between the first upper housing 31 and the second upper housing 32 .

[0139] The first upper control board 33 may include a substrate 34 and a semiconductor chip 35 disposed on the substrate 34 . An example of the semiconductor chip 35 may be an autonomous driving chip such as an MCU capable of executing level 3 of the autonomous driving levels.

[0140] The first upper control plate 33 may be in thermal contact with the top cooling water jacket 6 .

[0141] The bottom surface of the substrate 34 or the semiconductor chip 35 protruding from the bottom surface of the substrate 34 may be in thermal contact with the cooling water passing through the upper cooling water flow path 63 through the first upper case 31 and the top sleeve 65 .

[0142] The electronic control unit may include a first upper heat conducting plate 36 disposed between the top surface of the top cooling water jacket 6 and the bottom surface of the third control unit 3. The first upper heat conducting plate 36 may be disposed between the top surface of the top cooling water jacket 6 and the first upper housing 31.

[0143] When the electronic control unit also includes a first upper heat conducting plate 36 , the bottom surface of the substrate 34 or the semiconductor chip 35 protruding from the bottom surface of the substrate 34 can be in thermal contact with the cooling water through the upper cooling water flow path 63 through the first upper shell 31 , the first upper heat conducting plate 36 and the top sleeve 65 .

[0144] The fourth control unit 4 may be parallel to the first control unit 1. The fourth control unit 4 may have a length in the front-rear direction X, a width in the left-right direction Y, and a thickness in the up-down direction Z.

[0145] The size of the fourth control unit 4 may be smaller than that of the first control unit 1 .

[0146] The fourth control unit 4 may be disposed on the top surface of the top cooling water jacket 6 .

[0147] The fourth control unit 4 may include a third upper housing 41 , a fourth upper housing 42 , and a second upper control board 43 .

[0148] The fourth control unit 4 may be disposed on the top surface of the top cooling water jacket 6 of the first control unit 1 without an additional cooling water flow path, and may be cooled by cooling water through the upper cooling water flow path 63 .

[0149] The third upper shell 41 may be disposed on the top surface of the top cooling water jacket 6 .

[0150] The fourth upper housing 42 may be disposed on an upper portion of the third upper housing 41 .

[0151] The fourth upper case 42 may be fastened to the third upper case 41 by fastening members such as bolts.

[0152] The second upper control board 43 may be received between the third upper case 41 and the fourth upper case 42 .

[0153] A space S4 in which the second upper control board 43 can be accommodated may be formed in the third upper case 41 and the fourth upper case 42 .

[0154] The second upper control board 43 may include a substrate 44 and a semiconductor chip 45 disposed on the substrate 44 . An example of the semiconductor chip 45 may be an autonomous driving chip such as an MCU capable of executing level 4 of the autonomous driving levels.

[0155] The second upper control plate 43 may be in thermal contact with the top cooling water jacket 6 .

[0156] The bottom surface of the substrate 44 or the semiconductor chip 45 protruding from the bottom surface of the substrate 44 can be in thermal contact with the cooling water passing through the upper cooling water flow path 63 through the third upper case 41 and the top sleeve 65 .

[0157] The electronic control unit may further include a second upper heat conducting plate 46 disposed between the top surface of the top cooling water jacket 6 and the bottom surface of the fourth control unit 4. The second upper heat conducting plate 46 may be disposed between the top surface of the top cooling water jacket 6 and the third upper housing 41.

[0158] When the electronic control unit also includes a second upper heat conducting plate 46, the bottom surface of the substrate 44 or the semiconductor chip 45 protruding from the bottom surface of the substrate 44 can be in thermal contact with the cooling water through the upper cooling water flow path 63 through the third upper shell 41, the second upper heat conducting plate 46 and the top sleeve 65.

[0159] The third control unit 3 and the fourth control unit 4 may be arranged in a row along the length direction X of the first control unit. The third control unit 3 may be arranged closer to the fourth passage of the third and fourth passages. The fourth control unit 4 may be arranged closer to the third passage of the third and fourth passages.

[0160] An example of an electronic control unit may include a first control unit 1, a second control unit 2, a third control unit 3 and a fourth control unit 4, and the semiconductor chips of the first control board 7, the second control board 23, the first upper control board 33 and the second upper control board 43 may be driven together for level 4 autonomous driving.

[0161] In the case of an example of an electronic control unit, the first control board 7, the first upper control board 33, and the second upper control board 43 can be a higher heat source than the second control board 23, preferably, as Figure 1 As shown, cooling water is supplied to the electronic control unit via a second connection 10 .

[0162] Figure 6 It is a perspective view of another example of the electronic control unit of this embodiment.

[0163] like Figure 6 As shown, another example of an electronic control unit may include a first control unit 1, a second control unit 2, and a third control unit 3 without including a fourth control unit 4, and the semiconductor chips of the first control board 7, the second control board 23, and the first upper control board 33 may be driven together for level 3 autonomous driving.

[0164] As another example of an electronic control unit, the first control board 7 and the first upper control board 33 may be a higher heat source than the second control board 23, preferably, as Figure 6 As shown, cooling water is supplied to the electronic control unit via a second connection 10 .

[0165] Figure 7 It is a perspective view of still another example of the electronic control unit of this embodiment.

[0166] like Figure 7 As shown, another example of an electronic control unit may include a first control unit 1 and a second control unit 2 but not a third control unit 3 and a fourth control unit 4, and the semiconductor chips of the first control board 7 and the second control board 23 may be driven for level 1, level 2, or level 2+ autonomous driving.

[0167] In the case of yet another example of an electronic control unit, it is preferred that Figure 7 As shown, cooling water is supplied to the electronic control unit through the first joint 9 so that each of the first control board 7 and the second control board 23 can be quickly cooled.

[0168] Figure 8 FIG. 1 is a diagram showing an example of an electronic control unit of the present embodiment being cooled by a water-cooling type cooling device. Fig. 9 FIG. 1 is a diagram showing another example in which the electronic control unit of the present embodiment is cooled by a water-cooling type cooling device.

[0169] The water-cooling type cooling device 300 may be provided in a vehicle, and may circulate and supply cooling water to an electronic control unit provided in the vehicle.

[0170] The water-cooling type cooling device 300 is connected to the electronic control unit by means of a water pipe.

[0171] The water-cooled cooling device 300 may include: a heat exchanger 301; a cooling water tank 303, which is connected to the heat exchanger 301 via a heat exchanger outlet pipe 302; a pump 305, which is connected to the cooling water tank 303 via a pump inlet pipe 304; and a pump outlet pipe 306, which connects the pump 305 and an electronic control unit. The electronic control unit and the heat exchanger 301 may be connected via a heat exchanger inlet pipe 307.

[0172] The heat exchanger 301 can dissipate the heat of the cooling water into the atmosphere in an air-cooling manner.

[0173] The water-cooled cooling device 300 may include a cooling water valve 308 .

[0174] like Figure 8 As shown, the cooling water valve 308 can supply cooling water to the second connector 10. Fig. 9 As shown, the cooling water valve 308 can supply cooling water to the first connection 9 .

[0175] An example of the cooling water valve 308 may be a four-way valve.

[0176] The pump outlet pipe 306 may be connected to a cooling water valve 308 .

[0177] The heat exchanger inlet pipe 307 may be connected to a cooling water valve 308 .

[0178] The cooling water valve 308 and the first joint 9 can be connected by a first joint connecting pipe 309 .

[0179] The cooling water valve 308 and the second joint 10 can be connected by a second joint connecting pipe 310 .

[0180] In such Figure 1 In the case where the electronic control unit shown includes a first control unit 1, a second control unit 2, a third control unit 3 and a fourth control unit 4, or includes a first control unit 1, a second control unit 2 and a third control unit 3, the cooling water valve 308 can be as follows Figure 8 As shown, switching is performed to supply cooling water to the second connection 10 .

[0181] In such Figure 7 In the case where the electronic control unit shown includes the first control unit 1 and the second control unit 2 but does not include the third control unit 3 and the fourth control unit 4, the cooling water valve 808 can be as follows: Fig. 9 As shown, a switch is performed to supply cooling water to the first connection 9 .

[0182] The cooling water can circulate between the heat exchanger 301 and the electronic control unit, so as to dissipate heat from the electronic control unit.

[0183] Fig.10 This is a diagram showing the electronic control unit and the motor of this embodiment being cooled by a water-cooling type cooling device.

[0184] The water-cooling type cooling device 300 ′ may be connected to the electronic control unit and the motor 400 , and circulates ice-cold cooling water to the electronic control unit and the motor 400 .

[0185] An example of the motor 400 may be a drive motor that is provided in an electric vehicle and provides a driving force to wheels.

[0186] The motor 400 may include a motor housing 403 formed with a cooling water inlet port 401 and a cooling water outlet port 402 .

[0187] The water-cooling type cooling device 300 ′ may be connected to the electronic control unit and the motor 400 by using a water pipe.

[0188] The water-cooled cooling device 300′ may include: a heat exchanger 301; a cooling water tank 303, connected to the heat exchanger 301 via a heat exchanger outlet pipe 302; a pump 305, connected to the cooling water tank 303 via a pump inlet pipe 304; a pump outlet pipe 306′, connecting the pump 305 and an electronic control unit; a connecting flow path 311, connecting the electronic control unit and the motor 400; and a heat exchanger inlet pipe 307′, connecting the motor 400 and the heat exchanger 301.

[0189] Heat exchanger 301, heat exchanger outlet pipe 302, cooling water tank 303, pump inlet pipe 304, pump 305 and Fig. 9 The water-cooling cooling device 300 shown is the same, and its description is omitted to avoid duplication of description.

[0190] The pump outlet pipe 306 ′ may be connected to either the first joint 9 or the second joint 10 .

[0191] The heat exchanger inlet pipe 307 ′ may be connected to the cooling water outlet port 402 of the motor 400 .

[0192] One end of the connecting flow path 311 may be connected to the other of the first connector 9 or the second connector 10 of the electronic control unit.

[0193] The other end of the connection flow path 311 may be connected to the cooling water inlet port 401 of the motor 400 .

[0194] The cooling water may circulate in the heat exchanger 301 , the electronic control unit, and the motor 400 , and may dissipate heat from the electronic control unit and the motor 400 in sequence.

[0195] Fig.11 This is a diagram showing the electronic control unit and the additional electronic control unit of the present embodiment being cooled by a water-cooling type cooling device.

[0196] The water-cooling cooling device 300 ″ may be connected to the electronic control unit and the additional electronic control unit 500 , and circulate cold cooling water to the electronic control unit and the additional electronic control unit 500 .

[0197] The additional electronic control unit 500 may include an additional cooling water jacket formed with a cooling water inlet 501 and a cooling water outlet 502 .

[0198] As an example of the additional electronic control unit 500 , it may be an electronic control unit independent of the electronic control unit, and may include a plurality of additional cooling water jackets 503 , 504 , 505 .

[0199] The plurality of additional cooling water jackets 503 , 504 , and 505 may be configured such that cooling water flow paths are connected in parallel.

[0200] The water-cooling type cooling device 300 ″ may be connected to the electronic control unit and the additional electronic control unit 500 by using a water pipe.

[0201] The water-cooled cooling device 300″ may include: a heat exchanger 301; a cooling water tank 303, connected to the heat exchanger 301 via a heat exchanger outlet pipe 302; a pump 305, connected to the cooling water tank 303 via a pump inlet pipe 304; a pump outlet pipe 306′, connecting the pump 305 and an electronic control unit; a connecting flow path 311′, connecting the electronic control unit and an additional electronic control unit 500; and a heat exchanger inlet pipe 307″, connecting the additional electronic control unit and the heat exchanger 301.

[0202] The heat exchanger 301, the heat exchanger outlet piping 302, the cooling water tank 303, the pump inlet piping 304, the pump 305 and the pump outlet piping 306′ and Fig.10 The water-cooling cooling device 300 ′ shown is the same, and the description thereof is omitted to avoid duplication of description.

[0203] The pump outlet pipe 306 ′ may be connected to any one of the first joint 9 and the second joint 10 .

[0204] One end of the connecting flow path 311 ′ may be connected to the other of the first connector 9 and the second connector 10 .

[0205] The other end of the connecting flow path 311 ′ may be connected to a cooling water inlet 501 of the additional electronic control unit 500 .

[0206] The heat exchanger inlet pipe 307 ″ may be connected to the cooling water outlet 502 of the additional electronic control unit 500 .

[0207] The cooling water may circulate through the heat exchanger 301 , the electronic control unit, and the additional electronic control unit 500 , and may sequentially dissipate heat from the electronic control unit and the additional electronic control unit 500 .

[0208] The cooling water can be moved in the flow path at a specific flow rate Q by the pump 305 , and the cooling water can flow into the electronic control unit and cool the heat source and then flow out from the outlet.

[0209] The cooling water flowing out of the electronic control unit flows into the additional electronic control unit 500 and cools the heat source, and then can be cooled to the initial temperature when passing through the heat exchanger 301 . The cooling water with the initialized temperature can be stored in the cooling water tank 303 .

[0210] The cooling water stored in the cooling water tank 303 can repeat the above process.

[0211] The above description is only intended to exemplify the technical concept of the present invention, and those skilled in the art can make various modifications and variations without departing from the essential features of the present invention.

[0212] Therefore, the embodiments and drawings disclosed in the present invention are not used to limit the technical concept of the present invention, but are used for explanation, and the scope of the technical concept of the present invention is not limited to the above embodiments.

[0213] The protection scope of the present invention should be interpreted by the appended claims, and all technical ideas within the equivalent scope should be included in the protection scope of the present invention.

Claims

1. An electronic control unit, wherein: comprising a first control unit, The first control unit comprises: A bottom cooling water jacket is formed with a first passage and a second passage separated from the first passage, and a lower cooling water flow path and a lower cooling fin for cooling water to pass through are formed between the first passage and the second passage; a top cooling water jacket, formed with a third passage and a fourth passage communicating with the second passage, an upper cooling water flow path and upper cooling fins for cooling water to pass through formed between the third passage and the fourth passage; and The first control plate is arranged between the bottom cooling water jacket and the top cooling water jacket.

2. The electronic control unit according to claim 1, wherein: The bottom cooling water jacket comprises: a bottom sleeve, forming the first passage, the second passage, the lower cooling water flow path, and the lower cooling fins; and The inner bottom cover is arranged on the top surface of the bottom sleeve and covers the lower cooling water flow path and the lower cooling fins.

3. The electronic control unit according to claim 1, wherein: The top cooling water jacket comprises: a top sleeve, forming the third passage, the fourth passage, the upper cooling water flow path and the upper cooling fins; and The inner top cover is arranged on the bottom surface of the top sleeve and covers the upper cooling water flow path and the upper cooling fins.

4. The electronic control unit according to claim 1, wherein: The first control unit further includes an inner gasket sealing between the second passage and the third passage.

5. The electronic control unit according to claim 1, wherein: It also includes a second control unit arranged on the bottom surface of the bottom cooling water jacket.

6. The electronic control unit according to claim 5, wherein: The second control unit comprises: A first lower shell, disposed on the bottom surface of the bottom cooling water jacket; a second lower shell, disposed at a lower portion of the first lower shell; and The second control board is accommodated between the first lower shell and the second lower shell.

7. The electronic control unit according to claim 6, wherein: It also includes a lower heat conduction plate arranged between the bottom surface of the bottom cooling water jacket and the top surface of the first lower shell.

8. The electronic control unit according to claim 5, wherein: It also includes a third control unit arranged on the top surface of the top cooling water jacket.

9. The electronic control unit according to claim 8, wherein: The third control unit comprises: A first upper shell, arranged on the top surface of the top cooling water jacket; a second upper shell, disposed on an upper portion of the first upper shell; and The first upper control board is accommodated between the first upper shell and the second upper shell.

10. A vehicle comprising: a first control unit; and a water-cooled cooling device, which allows cooling water to flow toward the first control unit, wherein: The first control unit comprises: A bottom cooling water jacket is formed with a first passage and a second passage separated from the first passage, and a lower cooling water flow path and a lower cooling fin for cooling water to pass through are formed between the first passage and the second passage; a top cooling water jacket, formed with a third passage and a fourth passage communicating with the second passage, an upper cooling water flow path and upper cooling fins for cooling water to pass through formed between the third passage and the fourth passage; and A control panel is arranged between the bottom cooling water jacket and the top cooling water jacket, The first control unit also includes: A first connector, disposed in the first passage; and A second connector is disposed in the fourth passage, The water-cooled cooling device includes a cooling water valve for supplying cooling water to the first joint or supplying cooling water to the second joint.

Citation Information

Patent Citations

  • Integrated multi-chip module having a conformal chip / heat exchanger interface

    US5323292A