Preparation process of multilayer circuit board

Abstract

The invention discloses a preparation process of a multilayer circuit board, which comprises the following steps of: drilling a substrate, pouring and filling a conductive substance, respectively pressing a layer of copper foil on two sides of the substrate, respectively etching circuits, and communicating the circuits on two sides of the substrate through the conductive substance to form a conductive circuit board layer; drilling a cured sheet, and pouring and filling a conductive substance to serve as a bearing plate; a bearing plate is clamped between two conductive circuit board layers to form a group of circuit boards, insulating shading layers are arranged among the multiple groups of circuit boards, pressing operation is carried out, so that the insulating shading layers are clamped among the multiple groups of circuit boards, and a semi-finished product of the multi-layer circuit board is obtained; and finally, performing exposure and development operation on the obtained semi-finished product of the multilayer circuit board to obtain the multilayer circuit board. The method has the advantages of small plate thickness and high preparation efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a preparation process of a multilayer circuit board. Background Art

[0002] A multilayer circuit board includes multiple stacked plates. In the prior art, there are usually two methods for preparing a multilayer circuit board: Method 1, first make an inner chip, then press it with an outer plate, and then complete the outer circuit. After pressing these materials, open holes mechanically or by laser, and chemically deposit conductive layer materials (copper / graphite, etc.) on the hole wall, and then electroplate a copper layer of a certain thickness to achieve layer-by-layer conduction of the plates. The more layers of plates in a multilayer circuit board, the more times they are pressed. This method has a lengthy process and high process and scrap costs. Method 2, separately prepare the plates required for the multilayer circuit board, stack the required plates together, and complete the pressing by laminating once. This method is that the circuits between adjacent plates are in direct contact. During use, the multilayer circuit board prepared by this method is prone to external factors causing the circuits between adjacent plates to be out of conduction. Summary of the invention

[0003] In view of the above problems, the present invention provides a preparation process of a multi-layer circuit board, which has the advantages of small board thickness and high preparation efficiency.

[0004] The technical solution adopted by the present invention is as follows:

[0005] A process for preparing a multilayer circuit board comprises the following steps:

[0006] S1. Prepare several substrates, perform surface treatment on the preset positions of the conductive circuit board on the substrates by laser ablation and ion cutting, remove the metal at the preset positions, drill holes and fill them with conductive materials, then press a layer of copper foil on both sides of the substrates, and etch circuits respectively, and the circuits on both sides of the substrates are connected by conductive materials to form a conductive circuit board layer;

[0007] S2, prepare a cured sheet, prepare a via hole on the cured sheet by drilling, and fill it with a conductive material to serve as a carrier plate;

[0008] S3, two layers of conductive circuit boards are sandwiched with a carrier board to form a group of circuit boards, an insulating light shielding layer is arranged between the multiple groups of circuit boards, and a pressing operation is performed so that the insulating light shielding layer is sandwiched between the multiple groups of circuit boards to obtain a semi-finished multi-layer circuit board;

[0009] S4, performing exposure and development operations on the obtained multi-layer circuit board semi-finished product to obtain a multi-layer circuit board. DETAILED DESCRIPTION

[0010] The embodiments of the present invention are described in detail below.

[0011] Example:

[0012] A process for preparing a multilayer circuit board comprises the following steps:

[0013] S1. Prepare several substrates, perform surface treatment on the preset positions of the conductive circuit board on the substrates by laser ablation and ion cutting, remove the metal at the preset positions, drill holes and fill them with conductive materials, then press a layer of copper foil on both sides of the substrates, and etch circuits respectively, and the circuits on both sides of the substrates are connected by conductive materials to form a conductive circuit board layer;

[0014] S2, prepare a cured sheet, prepare a via hole on the cured sheet by drilling, and fill it with a conductive material to serve as a carrier plate;

[0015] S3, two layers of conductive circuit boards are sandwiched with a carrier board to form a group of circuit boards, an insulating light shielding layer is arranged between the multiple groups of circuit boards, and a pressing operation is performed so that the insulating light shielding layer is sandwiched between the multiple groups of circuit boards to obtain a semi-finished multi-layer circuit board;

[0016] S4, performing exposure and development operations on the obtained multi-layer circuit board semi-finished product to obtain a multi-layer circuit board.

[0017] The above-mentioned embodiments only express the specific implementation of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A process for preparing a multilayer circuit board, characterized in that: The following steps are involved: S1. Prepare several substrates, perform surface treatment on the preset positions of the conductive circuit board on the substrates by laser ablation and ion cutting, remove the metal at the preset positions, drill holes and fill them with conductive materials, then press a layer of copper foil on both sides of the substrates, and etch circuits respectively, and the circuits on both sides of the substrates are connected by conductive materials to form a conductive circuit board layer; S2, prepare a cured sheet, prepare a via hole on the cured sheet by drilling, and fill it with a conductive material to serve as a carrier plate; S3, two layers of conductive circuit boards are sandwiched with a carrier board to form a group of circuit boards, an insulating light shielding layer is arranged between the multiple groups of circuit boards, and a pressing operation is performed so that the insulating light shielding layer is sandwiched between the multiple groups of circuit boards to obtain a semi-finished multi-layer circuit board; S4, performing exposure and development operations on the obtained multi-layer circuit board semi-finished product to obtain a multi-layer circuit board.