Method for improving alignment accuracy of CCD (Charge Coupled Device)

Abstract

The invention provides a CCD (Charge Coupled Device) alignment accuracy improving method, which comprises the following steps of: acquiring a to-be-aligned plate, including an inner-layer plate and an outer-layer plate which are arranged in an attached manner, performing laser ablation on a preset position of the outer-layer plate through a CCD drilling machine so as to expose a plurality of bonding pads on the inner-layer plate, scanning the plurality of bonding pads through the CCD drilling machine, and performing alignment on the plurality of bonding pads through the CCD drilling machine. And aligning the plate to be aligned. According to the CCD alignment precision improving method provided by the invention, the to-be-aligned plate including the inner-layer plate and the outer-layer plate which are arranged in an attached mode is obtained, the preset position of the outer-layer plate is subjected to laser ablation through the CCD drilling machine so as to expose the multiple bonding pads on the inner-layer plate, the multiple bonding pads are scanned through the CCD drilling machine, and the alignment precision of the to-be-aligned plate is improved. According to the method for aligning the to-be-aligned plate, the alignment precision in the process of printing the circuit board can be effectively improved, and the reliability and the stability of the circuit board are improved after the precision of the printed circuit board is improved.

Description

Technical Field

[0001] The invention relates to the field of drilling alignment, and in particular to a method for improving CCD alignment accuracy. Background Art

[0002] With the rapid development of the electronics industry, the PCB industry is moving towards high-layer, small-pitch, and densely packed circuits. This development trend places high demands on the alignment accuracy of PCBs on designers.

[0003] At present, holes processed by drilling technology often have single-angle or local hole position deviations. During the on-site processing follow-up, it was found that when the drilling rig scanned the CCD target hole, some target holes had burrs, burrs, and notches on the hole wall, which reduced the accuracy of the drilling rig scanning and grabbing the target hole, and then affected the generated pre-expansion and shrinkage drill belt, affecting the drilling hole position accuracy capability.

[0004] Therefore, it is necessary to provide a method for improving CCD alignment accuracy to solve the above technical problems. Summary of the invention

[0005] The invention provides a method for improving the alignment accuracy of a CCD, which solves the problem of low accuracy of drilling and catching target holes in existing drilling process.

[0006] In order to solve the above technical problems, the present invention provides a method for improving CCD alignment accuracy, comprising the following steps:

[0007] S1, material preparation and data preparation;

[0008] S11. Ensure that there are sufficient numbers of inner and outer panels that meet the design specifications, prepare the CCD drill and ensure that it is in good working condition, including calibrating the lens, checking the light source and ensuring the normal operation of the software system, prepare the laser ablation equipment, and check the laser power, focusing system and motion control system;

[0009] S12, obtaining the design data of the inner and outer panels, including the pad position, size and shape information, and importing the design data into the control system of the CCD drilling machine and the laser ablation equipment to ensure data format compatibility;

[0010] S2, obtaining the panel to be aligned;

[0011] S21. Panel inspection:

[0012] Check the appearance of the inner and outer panels to ensure there is no obvious physical damage, and confirm the markings of the inner and outer panels to prevent confusion;

[0013] S22, place the panel:

[0014] Place the inner and outer panels on the workbench of the CCD drilling rig, ensure that they are placed stably, and use clamps to fix the panels to prevent them from moving during operation;

[0015] S3, laser ablation is performed on the preset position of the outer plate by using a CCD drilling machine;

[0016] S31, positioning outer panels:

[0017] Use the CCD drilling machine's visual system to locate the preset position of the outer panel, find the reference point through image recognition technology, and determine the area that needs to be laser ablated according to the design data, including the outer target hole and the outer pad position;

[0018] S32, Laser ablation parameter settings:

[0019] According to the material and thickness of the outer plate, set the laser ablation parameters. After adjusting the parameters, conduct laser ablation test, conduct trial ablation on the waste material, check the ablation effect, and adjust the parameters until the ideal ablation effect is achieved;

[0020] S33, performing laser ablation:

[0021] Start the laser ablation equipment and perform laser ablation on the outer plate according to the preset path and parameters. During the ablation process, continuously monitor the ablation status to ensure that the ablation depth and shape meet the design requirements. After the ablation is completed, use the CCD drill rig's visual system to check the ablation results again and perform additional ablation on areas that do not meet the requirements;

[0022] S4, scan multiple pads through the CCD drill to align the panels to be aligned;

[0023] S41, Scan the inner layer board pads:

[0024] Use the CCD drilling machine's visual system to scan multiple pads on the inner layer board to obtain the precise position and shape data of the pads, and compare the scanned data with the design data to ensure the accuracy of the data;

[0025] S42, alignment operation:

[0026] According to the scanned pad data of the inner panel, the position of the outer panel is adjusted to accurately align the pads of the outer panel with the pads of the inner panel. During the alignment process, the CCD drilling rig's visual system is continuously used for monitoring to ensure that the alignment accuracy meets the design requirements;

[0027] S43, alignment verification.

[0028] Preferably, the laser ablation of the preset position of the outer plate in S3 uses a drilling device, and the drilling device includes a workbench, a moving frame is installed on one side of the workbench, a lifting machine is connected to one side of the moving machine, and a drilling machine is installed on one side of the lifting machine;

[0029] A guide plate, the guide plate is connected to one side of the workbench, and a moving component is provided at the bottom of the workbench;

[0030] A fixed frame is arranged above the moving assembly, and a collection box is arranged inside the fixed frame.

[0031] Preferably, the moving assembly comprises two L-shaped fixing rods, one end of each of the L-shaped fixing rods is connected to a round rod, surfaces of the two round rods are sleeved with moving sleeves, and one side of each of the two moving sleeves is connected to the bottom of the fixing frame.

[0032] Preferably, one end of the circular rod is connected to a stopper.

[0033] Preferably, a filter screen is provided on the surface of the workbench.

[0034] Preferably, a pushing device is provided above the workbench, and the pushing device comprises a hydraulic telescopic rod, one end of the hydraulic telescopic rod is connected to a connecting frame, and one end of the connecting frame is connected to a pushing block.

[0035] Preferably, a box body is provided inside the workbench.

[0036] Preferably, an extension component is provided on one side of the workbench, and the extension component includes two fixing sleeves, a rectangular plate is connected between the two fixing sleeves, one end of the rectangular plate is connected to an L-shaped connecting rod, and one end of the L-shaped connecting rod is connected to a mounting seat.

[0037] Preferably, an operating table is fixedly mounted on the mounting seat.

[0038] Preferably, a mounting assembly is provided on one side of the drilling machine, and the mounting assembly includes a connecting rod, both ends of the connecting rod are connected to a mounting head, a mounting sleeve is provided on the surface of the mounting head, one end of the mounting sleeve is connected to a fixing ring, and a drilling head is provided inside the fixing ring.

[0039] Compared with the related art, the CCD alignment accuracy improvement method provided by the present invention has the following beneficial effects:

[0040] The present invention provides a method for improving the CCD alignment accuracy, by obtaining a panel to be aligned, including an inner panel and an outer panel that are bonded together, laser ablating a preset position of the outer panel by a CCD drill to expose a plurality of pads on the inner panel, and scanning the plurality of pads by the CCD drill to align the panel to be aligned, the alignment accuracy can be effectively improved in the process of printing a circuit board, and after the accuracy of the printed circuit board is improved, the reliability and stability of the circuit board are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 A structural schematic diagram of a first embodiment of a method for improving CCD alignment accuracy provided by the present invention;

[0042] Figure 2 A schematic structural diagram of a second embodiment of a method for improving CCD alignment accuracy provided by the present invention;

[0043] Figure 3 for Figure 1 A schematic diagram of the three-dimensional structure of the bottom of the device as a whole is shown;

[0044] Figure 4 A schematic structural diagram of a third embodiment of a method for improving CCD alignment accuracy provided by the present invention;

[0045] Figure 5 for Figure 4 An enlarged schematic diagram of part A is shown;

[0046] Figure 6 for Figure 4 An enlarged schematic diagram of part B is shown.

[0047] Numbers in the figure: 1, workbench; 2, mobile machine; 3, lift; 4, drilling machine; 5, filter screen; 6, pushing device; 61, hydraulic telescopic rod; 62, connecting frame; 63, pushing block;

[0048] 7. Guide plate;

[0049] 8. Moving assembly; 81. L-shaped fixing rod; 82. Round rod; 83. Moving sleeve; 84. Stopper;

[0050] 9. Fixed frame; 10. Collection box; 11. Box body;

[0051] 12. extension assembly; 121. fixing sleeve; 122. rectangular plate; 123. L-shaped connecting rod; 124. mounting seat;

[0052] 13. Operation table;

[0053] 14. Mounting assembly; 141. Connecting rod; 142. Mounting head; 143. Mounting sleeve; 144. Fixing ring;

[0054] 15. Drilling head. DETAILED DESCRIPTION

[0055] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0056] First embodiment

[0057] Please refer to Figure 1 ,in, Figure 1 A structural schematic diagram of a first embodiment of a method for improving CCD alignment accuracy provided by the present invention. A method for improving CCD alignment accuracy comprises the following steps:

[0058] S1, material preparation and data preparation;

[0059] S11. Ensure that there are sufficient numbers of inner and outer panels that meet the design specifications, prepare the CCD drill and ensure that it is in good working condition, including calibrating the lens, checking the light source and ensuring the normal operation of the software system, prepare the laser ablation equipment, and check the laser power, focusing system and motion control system;

[0060] S12, obtaining the design data of the inner and outer panels, including the pad position, size and shape information, and importing the design data into the control system of the CCD drilling machine and the laser ablation equipment to ensure data format compatibility;

[0061] S2, obtaining the panel to be aligned;

[0062] S21. Panel inspection:

[0063] Check the appearance of the inner and outer panels to ensure there is no obvious physical damage, and confirm the markings of the inner and outer panels to prevent confusion;

[0064] S22, place the panel:

[0065] Place the inner and outer panels on the workbench of the CCD drilling rig, ensure that they are placed stably, and use clamps to fix the panels to prevent them from moving during operation;

[0066] S3, laser ablation is performed on the preset position of the outer plate by using a CCD drilling machine;

[0067] S31, positioning outer panels:

[0068] Use the CCD drilling machine's visual system to locate the preset position of the outer panel, find the reference point through image recognition technology, and determine the area that needs to be laser ablated according to the design data, including the outer target hole and the outer pad position;

[0069] S32, Laser ablation parameter settings:

[0070] According to the material and thickness of the outer plate, set the laser ablation parameters. After adjusting the parameters, conduct laser ablation test, conduct trial ablation on the waste material, check the ablation effect, and adjust the parameters until the ideal ablation effect is achieved;

[0071] S33, performing laser ablation:

[0072] Start the laser ablation equipment and perform laser ablation on the outer plate according to the preset path and parameters. During the ablation process, continuously monitor the ablation status to ensure that the ablation depth and shape meet the design requirements. After the ablation is completed, use the CCD drill rig's visual system to check the ablation results again and perform additional ablation on areas that do not meet the requirements;

[0073] S4, scan multiple pads through the CCD drill to align the panels to be aligned;

[0074] S41, Scan the inner layer board pads:

[0075] Use the CCD drilling machine's visual system to scan multiple pads on the inner layer board to obtain the precise position and shape data of the pads, and compare the scanned data with the design data to ensure the accuracy of the data;

[0076] S42, alignment operation:

[0077] According to the scanned pad data of the inner panel, the position of the outer panel is adjusted to accurately align the pads of the outer panel with the pads of the inner panel. During the alignment process, the CCD drilling rig's visual system is continuously used for monitoring to ensure that the alignment accuracy meets the design requirements;

[0078] S43, alignment verification.

[0079] Compared with the related art, the CCD alignment accuracy improvement method provided by the present invention has the following beneficial effects:

[0080] The present invention provides a method for improving the CCD alignment accuracy, by obtaining a panel to be aligned, including an inner panel and an outer panel that are bonded together, laser ablating a preset position of the outer panel by a CCD drill to expose a plurality of pads on the inner panel, and scanning the plurality of pads by the CCD drill to align the panel to be aligned, the alignment accuracy can be effectively improved in the process of printing a circuit board, and after the accuracy of the printed circuit board is improved, the reliability and stability of the circuit board are improved.

[0081] Second embodiment

[0082] Please refer to Figure 2 and Figure 3Based on a method for improving CCD alignment accuracy provided by the first embodiment of the present application, another method for improving CCD alignment accuracy is proposed in the second embodiment of the present application. The second embodiment is only a preferred method of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0083] Specifically, the difference of a CCD alignment accuracy improvement method provided by the second embodiment of the present application is that, in a CCD alignment accuracy improvement method, a drilling device is used for laser ablation of the preset position of the outer plate in S3, and the drilling device includes a workbench 1, a moving frame 2 is installed on one side of the workbench 1, a lift 3 is connected to one side of the moving machine 2, and a drilling machine 4 is installed on one side of the lift 3;

[0084] A guide plate 7, wherein the guide plate 7 is connected to one side of the workbench 1, and a moving component 8 is provided at the bottom of the workbench 1;

[0085] A fixed frame 9 is arranged above the moving assembly 8 , and a collecting box 10 is arranged inside the fixed frame 9 .

[0086] The mobile machine 2 is composed of a mounting box, a motor, a threaded rod and a threaded sleeve with a circular block, and the lifter 3 is composed of a U-shaped mounting frame, a hydraulic lift rod, two circular fixed rods, two movable sleeves and a rectangular connecting plate.

[0087] The moving assembly 8 includes two L-shaped fixing rods 81, one end of each of the L-shaped fixing rods 81 is connected to a circular rod 82, the surfaces of the two circular rods 82 are sleeved with a moving sleeve 83, and one side of each of the two moving sleeves 83 is connected to the bottom of the fixing frame 9.

[0088] The L-shaped fixing rod 81 is connected to the bottom of the workbench 1. The use of the movable sleeve 83 and the fixing frame 9 can drive the collection box 10 to move. When the rear side position of the circuit board placed on the surface of the workbench 1 is limited, the hydraulic telescopic rod 61 is first started to drive the push block 63 to adjust through the connecting frame 62. After the position of the push block 63 is adjusted, the hydraulic telescopic rod 61 is stopped and the rear side of the circuit board can be brought into contact with the push block 63. The use of the filter 5 can collect the residues generated when drilling the circuit board and fall into the interior of the box body 11 for centralized collection.

[0089] One end of the circular rod 82 is connected to a stopper 84 .

[0090] A filter screen 5 is provided on the surface of the workbench 1 .

[0091] A pushing device 6 is arranged above the workbench 1 , and the pushing device 6 includes a hydraulic telescopic rod 61 , one end of the hydraulic telescopic rod 61 is connected to a connecting frame 62 , and one end of the connecting frame 62 is connected to a pushing block 63 .

[0092] A box body 11 is disposed inside the workbench 1 .

[0093] The working principle of a CCD alignment accuracy improvement method provided by the present invention is as follows:

[0094] When in use, after the processing of the circuit board on the workbench 1 is completed, it is moved to the inside of the collection box 10 through the guide plate 7 on the side of the workbench 1. After the circuit boards are stacked on one side of the collection box 10, the collection box 10 is pushed to drive the fixed frame 9 to move. When the fixed frame 9 moves, it drives the movable sleeve 83 at the bottom to move on the surface of the circular rod 82. When the other side of the collection box 10 moves to the bottom of the guide plate 7, the circuit boards can be stacked.

[0095] Compared with the related art, the CCD alignment accuracy improvement method provided by the present invention has the following beneficial effects:

[0096] The present invention provides a method for improving the CCD alignment accuracy. A guide plate 7 is arranged on the side of a workbench 1, a moving component 8 is arranged at the bottom of the workbench 1, and a fixed frame 9 is used in conjunction with a collection box 10. After the circuit board processing is completed, it is convenient for workers to sort and stack the circuit boards.

[0097] Third embodiment

[0098] Please refer to Figure 4 , Figure 5 and Figure 6 Based on the CCD alignment accuracy improvement method provided in the first embodiment of the present application, the third embodiment of the present application proposes another CCD alignment accuracy improvement method. The third embodiment is only a preferred method of the first embodiment, and the implementation of the third embodiment will not affect the independent implementation of the first embodiment.

[0099] Specifically, the difference of a method for improving CCD alignment accuracy provided in the third embodiment of the present application is that, in a method for improving CCD alignment accuracy, an extension component 12 is provided on one side of the workbench 1, and the extension component 12 includes two fixed sleeves 121, and a rectangular plate 122 is connected between the two fixed sleeves 121, one end of the rectangular plate 122 is connected to an L-shaped connecting rod 123, and one end of the L-shaped connecting rod 123 is connected to a mounting seat 124.

[0100] The operating platform 13 is fixedly mounted on the mounting seat 124 .

[0101] A mounting assembly 14 is provided on one side of the drilling machine 4, and the mounting assembly 14 includes a connecting rod 141, both ends of the connecting rod 141 are connected to a mounting head 142, the surface of the mounting head 142 is sleeved with a mounting sleeve 143, one end of the mounting sleeve 143 is connected to a fixing ring 144, and a drilling head 15 is provided inside the fixing ring 144.

[0102] The two mounting sleeves 143 are connected to the fixing ring 144 and the drilling machine 4 respectively. The mounting head 142 and the mounting sleeve 143 can be used to install and remove the drilling head 15.

[0103] The working principle of a CCD alignment accuracy improvement method provided by the present invention is as follows:

[0104] During use, when multiple circuit boards are to be processed simultaneously, the operating table 13 is first placed inside the mounting seat 124. After the operating table 13 is installed, the mounting head 142 at one end of the connecting rod 141 is connected to the mounting sleeve 143 on the drilling machine 4. Then, the mounting sleeve 143 on the side of the fixing ring 144 with the drilling head 15 is connected to the mounting head 142 at the other end of the connecting rod 141 to perform processing operations on multiple circuit boards.

[0105] Compared with the related art, the CCD alignment accuracy improvement method provided by the present invention has the following beneficial effects:

[0106] The present invention provides a method for improving the alignment accuracy of a CCD. An extension component 12, an operating table 13, a mounting component 14 and a drilling head 15 are arranged on one side of a workbench 1 and used in conjunction with each other to perform processing operations on multiple circuit boards at the same time.

[0107] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for improving CCD alignment accuracy, characterized in that: The following steps are involved: S1, material preparation and data preparation; S11. Ensure that there are sufficient numbers of inner and outer panels that meet the design specifications, prepare the CCD drill and ensure that it is in good working condition, including calibrating the lens, checking the light source and ensuring the normal operation of the software system, prepare the laser ablation equipment, and check the laser power, focusing system and motion control system; S12, obtaining the design data of the inner and outer panels, including the pad position, size and shape information, and importing the design data into the control system of the CCD drilling machine and the laser ablation equipment to ensure data format compatibility; S2, obtaining the panel to be aligned; S21. Panel inspection: Check the appearance of the inner and outer panels to ensure there is no obvious physical damage, and confirm the markings of the inner and outer panels to prevent confusion; S22, place the panel: Place the inner and outer panels separately on the workbench of the CCD drilling rig, ensure that they are placed stably, and use clamps to fix the panels to prevent them from moving during operation; S3, laser ablation is performed on the preset position of the outer plate by using a CCD drilling machine; S31, positioning outer panels: Use the CCD drilling machine's visual system to locate the preset position of the outer panel, find the reference point through image recognition technology, and determine the area that needs to be laser ablated according to the design data, including the outer target hole and the outer pad position; S32, Laser ablation parameter settings: According to the material and thickness of the outer plate, set the laser ablation parameters. After adjusting the parameters, conduct laser ablation test, conduct trial ablation on the waste material, check the ablation effect, and adjust the parameters until the ideal ablation effect is achieved; S33, performing laser ablation: Start the laser ablation equipment and perform laser ablation on the outer plate according to the preset path and parameters. During the ablation process, continuously monitor the ablation status to ensure that the ablation depth and shape meet the design requirements. After the ablation is completed, use the CCD drill rig's visual system to check the ablation results again and perform additional ablation on areas that do not meet the requirements; S4, scan multiple pads through the CCD drill to align the panels to be aligned; S41, Scan the inner layer board pads: Use the CCD drilling machine's visual system to scan multiple pads on the inner layer board to obtain the precise position and shape data of the pads, and compare the scanned data with the design data to ensure the accuracy of the data; S42, alignment operation: According to the scanned data of the pads of the inner layer panels, the position of the outer layer panels is adjusted so that the pads of the outer layer panels are accurately aligned with the pads of the inner layer panels. During the alignment process, the visual system of the CCD drilling rig is continuously used for monitoring to ensure that the alignment accuracy meets the design requirements. S43, alignment verification.

2. The method for improving CCD alignment accuracy according to claim 1, characterized in that: The laser ablation of the preset position of the outer plate in S3 uses a drilling device, which includes a workbench, a moving frame is installed on one side of the workbench, a lifting machine is connected to one side of the moving machine, and a drilling machine is installed on one side of the lifting machine; A guide plate, the guide plate is connected to one side of the workbench, and a moving component is provided at the bottom of the workbench; A fixed frame is arranged above the moving assembly, and a collection box is arranged inside the fixed frame.

3. The method for improving CCD alignment accuracy according to claim 2, characterized in that: The moving assembly includes two L-shaped fixing rods, one end of each of the L-shaped fixing rods is connected to a circular rod, the surfaces of the two circular rods are sleeved with moving sleeves, and one side of each of the two moving sleeves is connected to the bottom of the fixing frame.

4. The method for improving CCD alignment accuracy according to claim 3, characterized in that: One end of the circular rod is connected with a stopper.

5. The method for improving CCD alignment accuracy according to claim 2, characterized in that: A filter screen is arranged on the surface of the workbench.

6. The method for improving CCD alignment accuracy according to claim 2, characterized in that: A pushing device is arranged above the workbench, and the pushing device comprises a hydraulic telescopic rod, one end of the hydraulic telescopic rod is connected to a connecting frame, and one end of the connecting frame is connected to a pushing block.

7. The method for improving CCD alignment accuracy according to claim 2, characterized in that: A box body is arranged inside the workbench.

8. The method for improving CCD alignment accuracy according to claim 2, characterized in that: An extension component is arranged on one side of the workbench, and the extension component comprises two fixing sleeves, a rectangular plate is connected between the two fixing sleeves, one end of the rectangular plate is connected to an L-shaped connecting rod, and one end of the L-shaped connecting rod is connected to a mounting seat.

9. The method for improving CCD alignment accuracy according to claim 8, characterized in that: An operating table is fixedly mounted on the mounting seat.

10. The method for improving CCD alignment accuracy according to claim 2, characterized in that: A mounting assembly is provided on one side of the drilling machine, and the mounting assembly includes a connecting rod, both ends of the connecting rod are connected to a mounting head, a mounting sleeve is provided on the surface of the mounting head, one end of the mounting sleeve is connected to a fixing ring, and a drilling head is provided inside the fixing ring.

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