Display module and electronic equipment

Abstract

The invention relates to the technical field of display equipment, in particular to a display module and electronic equipment. The coil and the welding side face are connected through the first bonding pad, the first bonding pad is arranged on the side face of the antenna device, and the coil and the screen body are fixedly and electrically connected on the side face through the first bonding pad, so that the occupied space in the thickness direction (namely the direction from the display face to the non-display face) can be reduced, and the thickness of the display panel is reduced. Compared with the prior art, a foam / PET (Polyethylene Terephthalate) buffer material for attachment is also omitted between the screen body and the antenna device. Therefore, through the combination of the design, the overall thickness of the display module is reduced, and the thinning design of the product is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a display module and an electronic device. Background Art

[0002] There are many types of display screens, including liquid crystal display (LCD) and organic light-emitting diode (OLED).

[0003] NFC (Near Field Communication) is a short-range wireless communication technology that allows contactless point-to-point data transmission between electronic devices (within ten centimeters). NFC technology is considered to have great application prospects in areas such as mobile phone payments.

[0004] With the development of mobile payment, simply installing NFC antenna can no longer meet the design requirements of product thinning. Summary of the invention

[0005] The purpose of this application is to provide a display module and an electronic device.

[0006] The present application provides a display module, comprising: a screen body, the screen body having a display surface, a non-display surface and a welding side surface, the display surface and the non-display surface are arranged back to back, the welding side surface connects the display surface and the non-display surface, and the welding side surface is provided with a welding area; an antenna device, the antenna device comprises a coil and a first welding pad connected to each other, the coil is arranged on the non-display surface, the first welding pad is located on the side of the antenna device, and is fixedly electrically connected to the welding area.

[0007] In an exemplary embodiment of the present application, the welding area and the first pad abut against each other, welding points are provided on the welding area and the first pad, and the welding area and the first pad are connected through the welding points; preferably, the welding area and the first pad are fixed by welding; preferably, the welding area and the first pad are located on the same side of the welding points. .

[0008] In an exemplary embodiment of the present application, the first solder pad is connected to the outer circle end of the coil, and the antenna device includes a second solder pad, which is connected to the inner circle end of the coil; preferably, the first solder pad and the second solder pad are rectangular in shape; preferably, the first solder pad and the second solder pad are square in shape.

[0009] In an exemplary embodiment of the present application, the coil is arranged to be surrounded from the inside to the outside, and the coil includes a first coil, a second coil and a third coil, the first coil is located on the outer peripheral side, the second coil is located on the inner peripheral side, and the third coil is located between the second coil and the first coil, the end of the first coil is connected to the first solder pad, and the first solder pad protrudes toward the side of the first coil away from the third coil, the end of the second coil is connected to the second solder pad, and the second solder pad protrudes toward the side of the second coil away from the third coil, and the second solder pad is spaced apart from the third coil; preferably, the number of coils between the first coil and the second coil can be configured as multiple.

[0010] In an exemplary embodiment of the present application, the antenna device includes a first substrate, which is arranged between the coil and the screen body, and the coil is arranged on the first substrate; the display module includes a circuit board, which is electrically connected to the screen body, and the circuit board is bent and extended toward the side of the antenna device away from the screen body, and the circuit board extends to the second soldering pad and is electrically connected to the second soldering pad; preferably, the first substrate includes a flexible substrate; preferably, the circuit board includes a flexible circuit board.

[0011] In an exemplary embodiment of the present application, the antenna device further comprises a semiconductor layer, and the semiconductor layer is formed on a side of the coil facing away from the first substrate; preferably, the semiconductor layer comprises a ferrite material.

[0012] In an exemplary embodiment of the present application, the number of turns of the coil configuration is between 2-5, and an insulating layer is provided between adjacent coils; preferably, the number of the coils is 3; preferably, the insulating layer comprises an organic insulating material.

[0013] In an exemplary embodiment of the present application, the display module includes a high temperature resistant layer, and the high temperature resistant layer is arranged between the antenna device and the non-display surface; preferably, the high temperature resistant layer includes asbestos material; preferably, the thickness of the high temperature resistant layer is between 0.05 and 0.3 mm.

[0014] In an exemplary embodiment of the present application, the display module further includes a silicone layer, which is disposed between the high temperature resistant layer and the non-display surface of the screen body; preferably, the silicone layer is formed on the screen body or the high temperature resistant layer by coating.

[0015] The present application also provides an electronic device, comprising the display module.

[0016] A display module and electronic device of the present application scheme have the following beneficial effects: the coil and the welding side are connected by the first soldering pad, and the first soldering pad is arranged on the side of the antenna device, and the coil and the screen body are fixedly electrically connected on the side by the first soldering pad, which can reduce the space occupied in the thickness direction (i.e., the direction from the display surface to the non-display surface) to reduce the thickness of the display panel. Compared with the prior art, the foam / PET cushioning material used for attachment is also omitted between the screen body and the antenna device. Therefore, the overall thickness of the display module is reduced by combining the above designs, thereby realizing a thin design for the product.

[0017] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0018] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 is a structural schematic diagram of a display module in an embodiment of the present invention;

[0021] Figure 2 is a first structural schematic diagram of a portion of a display module in an embodiment of the present invention;

[0022] Figure 3 yes Figure 2 Schematic cross-sectional view of ;

[0023] Figure 4 yes Figure 3 The enlarged schematic diagram of point A in the middle;

[0024] Figure 5 is a schematic structural diagram of a coil in an embodiment of the present invention;

[0025] Figure 6 is a second structural schematic diagram of a portion of a display module in an embodiment of the present invention;

[0026] Figure 7 yes Figure 6 The enlarged schematic diagram of point B in the middle;

[0027] Figure 8 is a schematic diagram of the structure of a circuit board in an embodiment of the present invention;

[0028] Fig. 9 yes Figure 6 Enlarged schematic diagram of point C in the middle.

[0029] Description of reference numerals:

[0030] 1. Cover plate; 2. Adhesive layer; 3. Polarizer; 10. Screen body; 11. Display surface; 12. Non-display surface; 13. Welding side; 131. Welding area; 14. Second substrate; 15. Light-emitting layer; 20. Antenna device; 21. Coil; 211. First coil; 212. Second coil; 213. Third coil; 22. First solder pad; 221. Solder point; 23. Second solder pad; 24. First substrate; 25. Insulating layer; 30. High temperature resistant layer; 40. Silicone layer; 50. Semiconductor layer; 60. Circuit board; 61. Connecting part; 62. Bending part. DETAILED DESCRIPTION

[0031] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0032] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0033] The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application.

[0034] It should be noted that the "multiple" mentioned in this article refers to two or more. "And / or" describes the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0035] There are many types of display screens, including liquid crystal display (LCD) and organic light-emitting diode (OLED).

[0036] NFC (Near Field Communication) is a short-range wireless communication technology that allows contactless point-to-point data transmission between electronic devices (within ten centimeters). NFC technology is considered to have great application prospects in areas such as mobile phone payments.

[0037] With the development of mobile payment, simply installing NFC antenna can no longer meet the design requirements of product thinning.

[0038] In order to solve the above technical problems, refer to Figures 1 to 4 As shown, the present application provides a display module, including a screen body 10 and an antenna device 20, the screen body 10 has a display surface 11, a non-display surface 12 and a welding side surface 13, the display surface 11 and the non-display surface 12 are arranged back to back, the welding side surface 13 connects the display surface 11 and the non-display surface 12, and the welding side surface 13 is provided with a welding area 131; the antenna device 20 includes a coil 21 and a first soldering pad 22 connected to each other, the coil 21 is arranged on the non-display surface 12, the first soldering pad 22 is located on the side of the antenna device 20, and is fixedly electrically connected to the soldering area 131.

[0039] In this embodiment, the coil 21 and the welding side 13 are connected by the first pad 22, the welding side 13 is arranged on the peripheral side of the screen body 10, and the first pad 22 is arranged on the side of the antenna device 20. The coil 21 and the screen body 10 are fixedly electrically connected on the side by the first pad 22, which can reduce the space occupied in the thickness direction (i.e., the direction from the display surface 11 to the non-display surface 12) to reduce the thickness of the display panel. Compared with the prior art, the foam / PET cushioning material used for attachment is also omitted between the screen body 10 and the antenna device 20. Therefore, the overall thickness of the display module is reduced by combining the above designs, thereby realizing a thin design for the product.

[0040] In some embodiments, reference Figures 2 to 4 As shown, the screen body 10 includes a second substrate 14 and a light-emitting layer 15, and a welding area 131 is located on the side of the second substrate 14. The second substrate 14 includes a driving circuit layer to drive the light-emitting layer 15 to emit light. The light transmittance of the driving circuit layer is poor to form a non-display surface 12, wherein the side opposite to the non-display surface 12 is a display surface 11, and the display surface 11 is used to display images so that it can be received by the user. There are multiple side surfaces around the display surface 11 and the non-display surface, wherein the welding side surface 13 is provided on one side surface. The area size of the welding area 131 is set according to actual needs, and no specific limitation is made here.

[0041] In some embodiments, reference Figures 2 to 4 As shown, at least one side surface of the second substrate 14 is a plane, the welding area 131 is arranged on the side surface of the plane, and the display screen is an organic electroluminescence display screen (Organic Electroluminescence Display, OLED for short).

[0042] In some embodiments, the second substrate 14 may be a low-temperature polysilicon substrate. Using low-temperature polysilicon as a substrate material has many advantages, such as making thin-film circuits thinner and smaller, with lower power consumption, etc.

[0043] In some embodiments, reference Figures 2 to 4 As shown, the welding area 131 and the first pad 22 abut against each other, and a welding spot 221 is provided on the welding area 131 and the first pad 22. The welding area 131 and the first pad 22 are connected through the welding spot 221. Preferably, the welding area 131 and the first pad 22 are fixed by welding. Preferably, the welding area 131 and the first pad 22 are located on the same side of the welding spot 221. The welding spot 221 is provided on the welding area 131 and the first pad 22, and the welding area 131 and the first pad 22 are provided on the same side, so that the screen body 10 and the antenna device 20 can be welded and fixed from the side, that is, the welding spot 221 is provided on the peripheral side of the screen body 10, thereby reducing the space occupied by the welding spot 221 in the thickness direction of the screen body 10, thereby reducing the thickness of the display device. The size of the welding area 131 is not specifically limited here, and is selected according to actual needs.

[0044] In some embodiments, reference Figures 2 to 4 As shown, the screen body 10 generally includes a cover plate 1, and a polarizer 3 (POL for short) and an adhesive layer 2 are provided between the cover plate 1 and the screen body 10. Figure 3 As shown, the polarizer 3 is close to the screen body 10, the adhesive layer 2 is close to the cover plate 1, and the polarizer 3 and the circuit board 60 are in the same layer and are arranged at intervals, so that the emitted light can pass through the polarizer 3 and the cover plate 1 in turn, and the electrical signal transmitted by the circuit board 60 is reduced to prevent negative impact on the polarizer 3.

[0045] In some embodiments, the adhesive layer 2 may include an optically transparent adhesive film (OCA), may be made of an optically transparent adhesive film, etc. However, the adhesive layer 2 is not limited thereto, but may include typical adhesives and adhesives. For example, the adhesive layer 2 may include an optically transparent resin (OCR) or a pressure-sensitive adhesive (PSA) film or may be made of an optically transparent resin or a pressure-sensitive adhesive film.

[0046] In some embodiments, reference Figure 3As shown, the display module includes a high temperature resistant layer 30, which is arranged between the antenna device 20 and the non-display surface 12, and can play the role of backlight. The high temperature resistant layer 30 has the advantages of low heat transfer and good heat insulation effect. The high temperature resistant layer 30 is used to isolate the heat transfer between the antenna device 20 and the screen body 10. The screen body 10 generates a large amount of heat when displaying, and the heat is transferred to the antenna device 20, which will reduce the signal transmission efficiency of the antenna device 20. Therefore, the high temperature resistant layer 30 can better isolate the heat transfer between the screen body 10 and the antenna device 20.

[0047] In some embodiments, the high temperature resistant layer 30 includes materials such as asbestos, glass wool, rock wool, etc. Preferably, the high temperature resistant layer 30 is made of asbestos material.

[0048] In some embodiments, the thickness of the high temperature resistant layer 30 is between 0.05 and 0.3 mm; specifically, the thickness of the high temperature resistant layer 30 is 0.1 mm, 0.5 mm, 0.8 mm, 1.2 mm, 1.5 mm, 2.0 mm, 2.5 mm, etc., and one of the thicknesses can be selected as the thickness of the high temperature resistant layer 30 according to actual conditions. Of course, the thickness of the high temperature resistant layer 30 is not limited to this.

[0049] In some embodiments, reference Figure 3 As shown, the display module further includes a silicone layer 40, which is disposed between the high temperature resistant layer 30 and the non-display surface 12 of the screen body 10, and is used to adsorb the antenna device 20 on the screen body 10, and the silicone layer 40 can maintain a long-term adsorption effect under the high temperature of the screen body 10. The silicone layer 40 is formed on the screen body 10 or the high temperature resistant layer 30 by coating.

[0050] In some embodiments, reference Figure 5 As shown, the first pad 22 is connected to the outer ring end of the coil 21, and the antenna device 20 includes a second pad 23, and the second pad 23 is connected to the inner ring end of the coil 21. Compared with setting the first pad 22 and the second pad 23 at the outer ring end or the inner ring end at the same time, setting the first pad 22 and the second pad 23 at the inner ring end and the outer ring end respectively does not require a jumper, thereby reducing the thickness of the coil 21 and also reducing the thickness of the display device.

[0051] In some embodiments, reference Figure 5 As shown, the shape of the first pad 22 can be a polygon, preferably a rectangle (such as Figure 5 The first pad 22 and the outer ring end of the coil 21 may be an integral structure; or the first pad 22 and the outer ring end of the coil 21 may be welded and connected, which is determined according to actual needs.

[0052] In some embodiments, reference Figure 5As shown, the first pad 22 protrudes toward the outer circumference of the coil 21 . The protruding height is not specifically limited here, and it only needs to achieve good electrical connection between the first pad 22 and the welding area 131 .

[0053] In some embodiments, reference Figure 5 As shown, the shape of the second pad 23 can be a polygon, preferably a rectangle (such as Figure 5 The second pad 23 and the inner ring end of the coil 21 may be an integral structure; or the second pad 23 and the inner ring end of the coil 21 may be welded and connected, which is determined according to actual needs.

[0054] In some embodiments, reference Figure 5 As shown, the second pad 23 protrudes toward the inner circumference of the coil 21 , and the protruding height is not specifically limited here, as long as it can enable the first pad 22 to achieve good electrical connection.

[0055] In some embodiments, reference Figure 5 As shown, the coil 21 is arranged in a circle from the inside to the outside, and the first pad 22 protrudes toward the outer peripheral side; the coil 21 is arranged in a circle to form a "vortex" shape, and the shape of each coil 21 is a square, and the first pad 22 is connected to a coil 21 on the outer peripheral side. In other embodiments, the shape of each coil 21 can also be a polygon, a circle or an irregular shape, depending on actual needs.

[0056] In some embodiments, reference Figure 5 As shown, the antenna device 20 may include a plurality of coils 21, and the number of coils 21 is between -; preferably, the number of coils 21 is three. The more coils 21 there are, the stronger the signal receiving and transmitting capabilities of the antenna device 20 are. However, too many coils 21 will occupy a larger area of ​​the non-display surface 12, thereby reducing the space for arranging other components on the non-display surface 12. Therefore, setting the number of coils 21 to three can achieve a balance between the occupied area and signal capability.

[0057] In some embodiments, reference Figure 5 As shown, the coil 21 can be defined as a first coil 211, a second coil 212 and a third coil 213. It can be seen from the figure that the first coil 211 is connected to the third coil 213, and the third coil 213 is connected to the second coil 212, thereby forming a "vortex" shape.

[0058] In some embodiments, reference Figure 5As shown, the first coil 211 is located on the outer circumference, the second coil 212 is located on the inner circumference, the third coil 213 is located between the second coil 212 and the first coil 211, the end of the first coil 211 is connected to the first pad 22, the first pad 22 protrudes to the side of the first coil 211 away from the third coil 213, the end of the second coil 212 is connected to the second pad 23, the second pad 23 protrudes to the side of the second coil 212 away from the third coil 213, and the second pad 23 is spaced from the third coil 213; wherein, the number of coils 21 between the first coil 211 and the second coil 212 can also be configured in multiple. It is possible to make the first pad 22 and the second pad 23 have no electrical contact with the third coil 213, so as to achieve the insulation of the first pad 22, the second pad 23 and the third coil 213. Since the second coil 212 and the third coil 213 are arranged adjacent to each other, and the second pad 23 is made of metal, the second pad 23 needs to be spaced apart from the third coil 213 to achieve insulation between the two, so that the electrical signals between the two do not interfere with each other. In addition, the second pad 23 is protruded to increase the welding area between the second pad 23 and the circuit board 60.

[0059] In some embodiments, reference Figure 5 As shown, an insulating layer 25 is provided between adjacent coils 21 to insulate the first coil 211, the second coil 212 and the third coil 213 from each other. The material of the insulating layer 25 includes organic insulating material, inorganic insulating material, plastic, etc. Preferably, the insulating layer 25 is an organic insulating material.

[0060] In some embodiments, the number of turns of the coil 21 between the first coil 211 and the second coil 212 may be configured to be multiple. The number of turns of the coil 21 configured between the first coil 211 and the second coil 212 is not specifically limited here and is set according to actual needs.

[0061] In some embodiments, reference Figures 6 to 9 As shown, the antenna device 20 includes a first substrate 24, the first substrate 24 is arranged between the coil 21 and the screen body 10, and the coil 21 is arranged on the first substrate 24. The display module includes a circuit board 60, the circuit board 60 is electrically connected to the screen body 10, the circuit board 60 is bent and extended to the side of the antenna device 20 away from the screen body 10, and the circuit board 60 extends to the second pad 23 and is electrically connected to the second pad 23. The first substrate 24 is used to carry the coil 21, which is convenient for preparing the antenna device 20. The circuit board 60 is connected to the screen body 10 on one side and electrically connected to the second pad 23 on the other side, which can transmit the magnetic flux signal of the antenna device 20 to the screen body 10, and the circuit board 60 can also transmit signals between the screen body 10 and the power supply and the processor.

[0062] In some embodiments, reference Figures 6 to 9As shown, the circuit board 60 includes a bent portion 62 and two connecting portions 61, the two connecting portions 61 and the bent portion 62 are an integrated structure, one connecting portion 61 extends into the screen body 10 to connect to the driving circuit of the substrate, the other connecting portion 61 extends on the side of the antenna device 20 away from the screen body 10 and connects to the second pad 23, and the bent portion 62 extends through the screen body 10 and the antenna device 20. Such a design uses the bent portion 62 of the circuit board 60 to reduce the thickness of the display device.

[0063] In some embodiments, the circuit board 60 includes a flexible circuit board, and the first substrate 24 includes a flexible substrate. The flexible circuit board or flexible substrate is a highly reliable and excellently flexible printed circuit board made of polyimide or polyester film as a substrate, and has the characteristics of high wiring density, light weight, thin thickness, and good bendability.

[0064] In some embodiments, reference Figures 6 to 9 As shown, the antenna device 20 further includes a semiconductor layer 50, which is formed on the side of the coil 21 away from the first substrate 24; preferably, the semiconductor layer 50 includes a ferrite material. The ferrite material is a high-temperature sintered iron oxide material that can reduce the absorption of the signal magnetic field by the metal material. At the same time, the ferrite material itself is sintered at a high temperature, and the sensing distance is effectively increased by increasing the magnetic field strength. Other semiconductor materials can also be selected here, according to actual needs.

[0065] The present application also provides an electronic device, including the above-mentioned display module, wherein the coil 21 of the display module is arranged in a circle from the inside to the outside, and the antenna device 20 is electrically connected to the screen body 10 by welding the first solder pad 22 connected to the outer end of the coil 21 to the soldering area 131 of the soldering side 13, and by welding the second solder pad 23 connected to the inner end of the coil 21 to the circuit board 60. The high temperature resistant layer 30 is arranged between the antenna device 20 and the non-display surface 12, and the high temperature resistant layer 30 is used to isolate the heat transfer between the antenna device 20 and the screen body 10. Compared with the prior art, since the foam / PET buffer material used for attachment is omitted between the display screen and the antenna device 20, and the soldering area 131 is arranged on the side, the soldering fixation does not increase the overall thickness. Therefore, the overall thickness of the display module is reduced by combining the above designs, thereby realizing a thin design for the product and achieving a good heat insulation effect.

[0066] In this application, unless otherwise clearly specified and limited, the terms "disposed (provided with)", "connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0067] In the description of this specification, the description of reference terms such as "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0068] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent of this application.

Claims

1. A display module, characterized in that: include: A screen body, wherein the screen body has a display surface, a non-display surface and a welding side surface, the display surface and the non-display surface are arranged opposite to each other, the welding side surface connects the display surface and the non-display surface, and the welding side surface is provided with a welding area; The antenna device comprises a coil and a first pad connected to each other, wherein the coil is arranged on the non-display surface, and the first pad is located on the side of the antenna device and is fixedly electrically connected to the welding area.

2. The display module according to claim 1, characterized in that: The welding area and the first pad are in contact with each other, welding points are arranged on the welding area and the first pad, and the welding area and the first pad are connected via the welding points; Preferably, the welding area and the first welding pad are fixed by welding; Preferably, the welding area and the first welding pad are located on the same side of the welding point.

3. The display module according to claim 1, characterized in that: The first pad is connected to the outer end of the coil, and the antenna device includes a second pad, and the second pad is connected to the inner end of the coil; Preferably, the first pad and the second pad are rectangular in shape; Preferably, the first pad and the second pad are square in shape.

4. The display module according to claim 3, characterized in that: The coil is arranged to surround from the inside to the outside, and the coil includes a first coil, a second coil and a third coil, the first coil is located on the outer peripheral side, the second coil is located on the inner peripheral side, and the third coil is located between the second coil and the first coil, an end of the first coil is connected to the first pad, and the first pad protrudes toward a side of the first coil away from the third coil, an end of the second coil is connected to the second pad, and the second pad protrudes toward a side of the second coil away from the third coil, and the second pad is spaced apart from the third coil; Preferably, the number of coils between the first coil and the second coil can be configured in multiples.

5. The display module according to claim 3, characterized in that: The antenna device comprises a first substrate, the first substrate is arranged between the coil and the screen, and the coil is arranged on the first substrate; The display module includes a circuit board, the circuit board is electrically connected to the screen body, the circuit board is bent and extended toward a side of the antenna device away from the screen body, the circuit board extends to the second pad, and is electrically connected to the second pad; Preferably, the first substrate comprises a flexible substrate; Preferably, the circuit board comprises a flexible circuit board.

6. The display module according to claim 5, characterized in that: The antenna device further comprises a semiconductor layer, wherein the semiconductor layer is formed on a side of the coil facing away from the first substrate; Preferably, the semiconductor layer comprises a ferrite material.

7. The display module according to any one of claims 1 to 5, characterized in that: The number of turns of the coil configuration is between 2 and 5, and an insulating layer is provided between adjacent coils; Preferably, the number of the coils is 3; Preferably, the insulating layer comprises an organic insulating material.

8. The display module according to any one of claims 1 to 5, characterized in that: The display module comprises a high temperature resistant layer, and the high temperature resistant layer is arranged between the antenna device and the non-display surface; Preferably, the high temperature resistant layer comprises asbestos material; Preferably, the thickness of the high temperature resistant layer is between 0.05 and 0.3 mm.

9. The display module according to any one of claim 8, characterized in that: The display module further includes a silicone layer, which is arranged between the high temperature resistant layer and the non-display surface of the screen body; Preferably, the silica gel layer is formed on the screen body or the high temperature resistant layer by coating.

10. An electronic device, characterized in that: A display module comprising any one of claims 1 to 9.

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