Computer equipment maintenance chip auxiliary dismounting equipment

Abstract

The invention relates to computer equipment maintenance chip auxiliary dismounting equipment, which belongs to the technical field of computer maintenance, and comprises a heat gathering unit, a heating element, an air blowing unit, a dismounting unit, a negative pressure unit and a protection mechanism, the heat gathering unit comprises a heat gathering cover, a mounting plate arranged on the heat gathering cover and a heat gathering cylinder arranged on the mounting plate; the heating element is arranged in the heat gathering cover; the blowing unit is rotationally arranged in the heat gathering cover, and the output end faces the heat gathering cylinder; the dismounting unit is slidably arranged on the mounting plate, and the lower end is located in the heat collection cylinder. The negative pressure unit is slidably arranged in the dismounting unit; the protection mechanism is arranged on the dismounting unit and the negative pressure unit; a switch is arranged on the heat gathering cover and is in control connection with the heating element and the air blowing unit. The soldering tin can be directly adsorbed on a back plate of a chip through the suction cup, soldering tin is melted through heating, the chip is automatically taken down from a main board, and handheld operation can be achieved.

Description

Technical Field

[0001] The invention relates to the technical field of computer maintenance, and in particular to a computer equipment maintenance chip auxiliary disassembly device. Background Art

[0002] There are many electronic components inside the computer, which usually consist of PCB boards, chips, capacitors, etc. When the chip is damaged and needs to be repaired, it is necessary to remove the chip from the surface of the PCB board and replace it with a new PCB board. The chip and PCB board are connected by soldering. When disassembling, it is necessary to heat it first to melt the solder at the connection before the chip can be removed. The general disassembly method is to use a hot air gun to blow air manually, and then use tweezers and other tools to remove the chip after the solder melts.

[0003] Chinese patent publication number CN118976957B is a computer equipment maintenance chip auxiliary disassembly device, which relates to the field of computer maintenance. The computer equipment maintenance chip auxiliary disassembly device includes an outer frame, a gripping device, a transmission device and a power device, and a mounting chassis seat is installed at the bottom of the outer frame. The computer equipment maintenance chip auxiliary disassembly device surrounds the outer side of the chip to be disassembled through a separation belt to prevent the chip in normal use from being damaged by heat, thereby improving the protection effect of the chip, and reducing heat loss, improving the heating efficiency of the solder at the bottom of the chip, thereby improving the chip disassembly efficiency, and the hot air flow heating method also improves the uniformity of heating. The position of the positioning card plate is adjusted according to the size of the chip, and when the positioning card plate moves and expands, it will also drive the separation belt to expand along the outer side of the positioning card plate, so that it can adapt to the clamping and disassembly of chips of different sizes, and improve the scope of application.

[0004] However, the above technical method uses a positioning card plate and other structures to clamp the chip, which requires multiple clamping steps, and after heating is completed, the control arm needs to be manually pushed to move in order to remove the chip, resulting in many steps and low disassembly efficiency. Summary of the invention

[0005] The purpose of the present invention is to address the problems existing in the background technology and to propose a computer equipment repair chip auxiliary disassembly device that can directly adsorb on the back plate of the chip through a suction cup, then melt the solder by heating, and automatically remove the chip from the mainboard, and can be handheld and operated.

[0006] The technical solution of the present invention is: a computer equipment maintenance chip auxiliary disassembly device, comprising: A heat collecting unit comprises a heat collecting cover, a mounting plate arranged on the heat collecting cover, and a heat collecting cylinder arranged on the mounting plate; A heating element is disposed in the heat collecting cover; A blowing unit is rotatably disposed in the heat collecting cover, with an output end facing the heat collecting cylinder; A disassembly unit is slidably disposed on the mounting plate, and a lower end of the disassembly unit is located in the heat collecting cylinder; A negative pressure unit, slidably disposed in the disassembly unit; A protection mechanism is arranged on the disassembly unit and the negative pressure unit.

[0007] Preferably, the heat collecting cover is provided with a plurality of spiral wind grooves and a wind shield plate arranged at the lower part of the heat collecting cover; the spiral wind grooves include an air inlet and an air outlet, the air inlet is located at the upper part of the heat collecting cover, and the air outlet is located at the wind shield plate.

[0008] Preferably, the blowing unit comprises a fan blade assembly rotatably arranged in the heat collecting cover, an air inlet filter plate arranged between the heat collecting cover and the mounting plate, and a driving assembly arranged on the heat collecting cover and having an output end connected to the fan blade assembly.

[0009] Preferably, the driving assembly includes a driving motor arranged on the heat collecting hood, a driving pulley connected to the output end of the driving motor, a driven pulley rotatably arranged on the outer peripheral side of the heat collecting cylinder and connected to the fan blade assembly, and a driving belt arranged on the driving pulley and the driven pulley.

[0010] Preferably, the fan blade assembly includes a plurality of fan blades obliquely arranged on the driven pulley, and a retaining frame arranged on the upper part of the fan blades.

[0011] Preferably, the disassembly unit includes a straw slidably arranged on the mounting plate, a suction cup arranged at the lower end of the straw and connected to the straw, a second handle arranged on the straw, and an elastic member arranged on the outer peripheral side of the straw and connected to the mounting plate and the second handle at both ends respectively.

[0012] Preferably, the negative pressure unit includes a piston slidably arranged in the straw, a sliding rod arranged on the piston and sliding with the straw, a pressing plate arranged on the upper end of the sliding rod, and two elastic members arranged on the sliding rod and connected to the straw and the pressing plate at both ends respectively.

[0013] Preferably, the protection mechanism includes a protection unit abutting against the suction cup, embedded in the suction tube and threadedly connected, a one-way valve arranged on the piston, and an unlocking unit arranged on the protection unit; a through hole is arranged on the piston, and the one-way valve includes a blocking block 2 embedded in the through hole and having a conical structure, a guide column arranged on the piston and slidably connected to the blocking block 2, and an elastic member 4 whose two ends are respectively connected to the blocking block 2 and the sliding rod.

[0014] Preferably, the protection unit includes a threaded block with a vent hole, which is threadedly connected to the suction tube and abuts against the suction cup, a sealing block 1 that is slidably arranged on the threaded block and can be sealably connected, a connecting plate arranged on the sealing block 1, a sliding column arranged on the connecting plate and slidably arranged on the threaded block, and an elastic member 3 that is arranged on the sliding column and has two ends respectively connected to the lower end of the sliding column and the threaded block; a receiving groove for receiving the sliding column is arranged on the threaded block.

[0015] Preferably, the unlocking unit includes two support seats both arranged on the threaded block, two pry bars respectively rotatably arranged on the two support seats, two connecting rods obtusely arranged on the pry bars, and a rotating rod rotatably connected to the two connecting rods and capable of slidingly abutting against the piston.

[0016] Compared with the prior art, the present invention has the following beneficial technical effects: In the present invention, the heat collecting tube is aimed at the chip to be disassembled and covered on the chip. The suction tube is pressed downward so that the suction tube drives the suction cup to be pressed on the chip, so that the air between the suction cup and the chip is squeezed into the suction tube. The negative pressure unit is pressed downward to discharge the air in the suction tube, and the negative pressure unit is moved upward to generate negative pressure in the suction tube. When there is air between the suction cup and the chip, it will be sucked into the suction tube, thereby ensuring the reliability of the adsorption between the suction cup and the chip and preventing the suction cup from being separated from the chip due to stable rising and vibration.

[0017] The operation of the heating element and the blowing unit is controlled by switches. A thermostat is provided on the heating element to adjust the temperature of the heating element. When the heating element and the blowing unit are turned on, hot air is continuously injected into the heat collecting cylinder, and the airflow is guided by the heat collecting cylinder and enters the heat collecting cylinder in a spiral shape, which can concentrate the heat and quickly heat the chip, melting the solder between the chip and the motherboard.

[0018] When the solder between the mainboard and the chip melts, the elastic part pushes the straw upwards, and the straw drives the suction cup upwards, so that the suction cup drives the chip upwards, separating the chip from the mainboard, thereby allowing the chip to be removed from the mainboard.

[0019] After removing the chip from the motherboard, turn off the switch of the heating element first to stop the heating element from working, while the blowing unit continues to work. At this time, the blowing unit will blow out cool air, so that the gas at the chip can circulate quickly, and the chip can be cooled down quickly, making it easier to take the chip out.

[0020] When the chip needs to be taken out, the negative pressure unit is pressed downward to discharge the air in the straw and make the negative pressure unit contact with the unlocking unit. The unlocking unit releases the sealing of the protection unit so that the air pressure of the straw can be pressed into the space between the suction cup and the chip, thereby removing the chip.

[0021] The present invention can be conveniently held by a handle. After the heat collecting tube is covered on the chip, the disassembly unit is brought into contact with the chip, and the negative pressure unit is pressed downward. After the air is exhausted, it is only necessary to press a switch to make the heating element and the blowing unit work, so that the soldering between the chip and the mainboard can be quickly melted, and the chip can be automatically removed without manual operation using tweezers. The heat collecting tube can prevent heat loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a schematic diagram of the structure of an embodiment of the present invention; Figure 2 It is a schematic diagram of the structure of the heat collecting cylinder in the embodiment of the present invention; Figure 3 It is a structural explosion diagram of an embodiment of the present invention; Figure 4 It is a schematic diagram of the local structure of an embodiment of the present invention; Figure 5 It is a structural schematic diagram of a disassembly unit in an embodiment of the present invention; Figure 6 It is an exploded view of the local structure of an embodiment of the present invention; Figure 7 for Figure 6 A schematic diagram of the local enlarged structure at point A in the middle; Figure 8 for Figure 6 A schematic diagram of the local enlarged structure at B in the middle; Fig. 9 It is a schematic diagram of the structure of the protection unit in the embodiment of the present invention.

[0024] Reference numerals: 1, heat collecting unit; 101, heat collecting cover; 102, mounting plate; 103, heat collecting cylinder; 104, handle 1; 1031, spiral wind slot; 1032, wind shield; 2, heating element; 3, blowing unit; 301, fan blade assembly; 3011, fan blade; 3012, retaining frame; 302, driving assembly; 3021, driving motor; 3022, driving pulley; 3023, driving belt; 3024, driven pulley disc; 303, air inlet filter plate; 4, disassembly unit; 401, suction cup; 402, suction tube; 403, handle two; 404, elastic part one; 4011, sealing gasket; 5, negative pressure unit; 501, piston; 502, sliding rod; 503, elastic part two; 504, pressing plate; 6, protection unit; 601, threaded block; 602, blocking block one; 603, sliding column; 604, elastic part three; 605, connecting plate; 7, one-way valve; 701, blocking block two; 702, guide column; 703, elastic part four; 8, unlocking unit; 801, pry bar; 802, connecting rod; 803, support seat; 804, rotating rod. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0026] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it an embodiment that is mutually exclusive with other embodiments, either individually or selectively.

[0028] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0029] Embodiment 1 like Figure 1-9 As shown, a computer equipment maintenance chip auxiliary disassembly device proposed by the present invention includes a heat collection unit 1, a heating element 2, a blowing unit 3, a disassembly unit 4, a negative pressure unit 5 and a protection mechanism; The heat collecting unit 1 comprises a heat collecting cover 101, a mounting plate 102 arranged on the heat collecting cover 101, and a heat collecting cylinder 103 arranged on the mounting plate 102; a heating element 2 is arranged in the heat collecting cover 101; a blowing unit 3 is rotatably arranged in the heat collecting cover 101, and an output end faces the heat collecting cylinder 103; a disassembly unit 4 is slidably arranged on the mounting plate 102, and a lower end is located in the heat collecting cylinder 103; a negative pressure unit 5 is slidably arranged in the disassembly unit 4; a protective mechanism is arranged on the disassembly unit 4 and the negative pressure unit 5; a switch is arranged on the heat collecting cover 101, and the switch is respectively controlled and connected with the heating element 2 and the blowing unit 3.

[0030] Among them, the heat collecting cover 101 is provided with a plurality of spiral wind grooves 1031 and a wind shield 1032 arranged at the lower part of the heat collecting cover 101; the spiral wind grooves 1031 include an air inlet and an air outlet, the air inlet is located at the upper part of the heat collecting cover 101, and the air outlet is located at the wind shield 1032; the spiral wind grooves 1031 with a spiral structure can guide the airflow entering the heat collecting tube 103, so that the airflow is spirally gathered toward the middle part of the heat collecting tube 103, and the wind shield 1032 prevents the airflow from being directly discharged from the bottom of the heat collecting tube 103, and after the spiral airflow is gathered into the heat collecting tube 103, the chip in the heat collecting tube 103 can be heated, so that the solder between the chip and the motherboard is melted, so that the heat collecting tube 103 can be removed, and the spiral airflow can better gather heat, so that the heat is concentrated, and the melting speed of the solder is increased.

[0031] In this embodiment, the heat collecting tube 103 is aimed at the chip to be disassembled and covered on the chip. By pressing the suction tube 402 downward, the suction tube 402 drives the suction cup 401 to press on the chip, so that the air between the suction cup 401 and the chip is squeezed into the suction tube 402, and the negative pressure unit 5 is pressed downward to discharge the air in the suction tube 402, and the negative pressure unit 5 is moved upward to generate negative pressure in the suction tube 402. When there is air between the suction cup 401 and the chip, it will be sucked into the suction tube 402, thereby ensuring the reliability of the adsorption between the suction cup 401 and the chip and preventing the suction cup 401 from separating from the chip due to stable rising and vibration.

[0032] The operation of the heating element 2 and the blowing unit 3 is controlled by a switch. A temperature control switch is provided on the heating element 2 to adjust the temperature of the heating element 2. When the heating element 2 and the blowing unit 3 are turned on, hot air is continuously injected into the heat collecting tube 103, and the airflow is guided by the heat collecting tube 103 and enters the heat collecting tube 103 in a spiral shape, which can concentrate the heat and quickly heat the chip, so that the solder between the chip and the motherboard melts.

[0033] When the soldering between the mainboard and the chip melts, the elastic member 404 pushes the suction tube 402 to move upward, and the suction tube 402 drives the suction cup 401 to move upward, so that the suction cup 401 drives the chip to move upward, so that the chip is separated from the mainboard, and the chip can be removed from the mainboard.

[0034] After removing the chip from the mainboard, turn off the switch of the heating element 2 first to stop the heating element 2 from working, while the blowing unit 3 continues to work. At this time, the blowing unit 3 will blow out cool air, so that the gas at the chip can circulate quickly, and the chip can be cooled down quickly, making it convenient to start taking the chip.

[0035] When the chip needs to be taken out, the negative pressure unit 5 is pressed downward to discharge the air in the suction tube 402 and make the negative pressure unit 5 contact with the unlocking unit 8. The unlocking unit 8 releases the sealing of the protection unit 6, so that the air pressure of the suction tube 402 can be pressed into between the suction cup 401 and the chip, so that the chip can be removed.

[0036] The present invention can be conveniently held by the handle 104. After the heat collecting tube 103 is covered on the chip, the disassembly unit 4 is brought into contact with the chip, and the negative pressure unit 5 is pressed downward. After the air is exhausted, it is only necessary to press the switch to make the heating element 2 and the blowing unit 3 work, so that the solder between the chip and the mainboard can be quickly melted, and the chip can be automatically removed without manual operation using tweezers; the heat collecting tube 103 can prevent heat loss.

[0037] Embodiment 2 like Figure 1-9 As shown, a computer equipment maintenance chip auxiliary disassembly device proposed in the present invention, compared with the first embodiment, the blowing unit 3 in this embodiment includes a fan blade assembly 301 rotatably arranged in the heat collecting cover 101, an air inlet filter plate 303 arranged between the heat collecting cover 101 and the mounting plate 102, and a driving assembly 302 arranged on the heat collecting cover 101 and the output end of which is connected to the fan blade assembly 301.

[0038] The driving assembly 302 includes a driving motor 3021 disposed on the heat collecting cover 101, a driving pulley 3022 connected to the output end of the driving motor 3021, a driven pulley disc 3024 rotatably disposed on the outer peripheral side of the heat collecting cylinder 103 and connected to the fan assembly 301, and a driving belt 3023 disposed on the driving pulley 3022 and the driven pulley disc 3024. The fan assembly 301 includes a plurality of fan blades 3011 disposed obliquely on the driven pulley disc 3024, and a retaining frame 3012 disposed on the upper part of the fan blades 3011; the obliquely disposed fan blades 3011 can better inject wind into the spiral wind groove 1031, and inject wind into the interior of the spiral wind groove 1031 from the air inlet of the spiral wind groove 1031, and the rotation direction is the oblique direction of the spiral wind groove 1031, that is, the acute angle direction, and the fan blades 3011 are supported by the retaining frame 3012 to ensure the stability of the fan blades 3011.

[0039] In this embodiment, the driving motor 3021 drives the active pulley 3022 to rotate, the active pulley 3022 drives the driving belt 3023 to move, the driving belt 3023 drives the driven pulley disc 3024 to rotate, and the driven pulley disc 3024 drives the fan blade 3011 to move, so that air can circulate when the fan blade 3011 moves, and the outside air is absorbed from the air inlet filter plate 303. The outside air is heated by the heating element 2 and flows into the heat collection cover 101, and then is injected into the heat collection cylinder 103 through the spiral wind groove 1031, so as to heat the chip, melt the solder, and enable the chip to be removed.

[0040] When the chip is removed, the heating element 2 can be controlled to shut down, so that cool air can be blown into the heat collecting tube 103, thereby cooling the chip and dissipating the heat, so that the chip can be quickly taken out without burning the hands.

[0041] Embodiment 3 like Figure 1-9 As shown, a computer equipment repair chip auxiliary disassembly device proposed by the present invention, compared with embodiment one or embodiment two, the disassembly unit 4 in this embodiment includes a straw 402 slidably set on the mounting plate 102, a suction cup 401 set at the lower end of the straw 402 and connected to the straw 402, a handle 403 set on the straw 402, and an elastic member 404 set on the outer peripheral side of the straw 402 and connected to the mounting plate 102 and the handle 403 at both ends.

[0042] Furthermore, the negative pressure unit 5 includes a piston 501 slidably disposed in the straw 402, a sliding rod 502 disposed on the piston 501 and sliding with the straw 402, a pressing plate 504 disposed on the upper end of the sliding rod 502, and an elastic member 503 disposed on the sliding rod 502 and having two ends respectively connected to the straw 402 and the pressing plate 504; negative pressure is generated in the straw 402 by the negative pressure unit 5, so that the suction cup 401 can adsorb the chip.

[0043] When the present embodiment is in use, the suction cup 401 is brought into contact with the chip, and the suction tube 402 is pressed, so that the suction cup 401 fits the chip, and the air between the suction cup 401 and the chip enters the suction tube 402, and then the pressing plate 504 is pressed downward, and the pressing plate 504 pushes the sliding rod 502 to move downward, and the sliding rod 502 drives the piston 501 to move downward, and the air in the suction tube 402 is discharged through the one-way valve 7, so that the suction cup 401 fits the chip firmly.

[0044] The pressing plate 504 is pushed upward by the elastic member 503, and the pressing plate 504 drives the sliding rod 502 upward, and the sliding rod 502 drives the piston 501 upward, so that the air in the suction tube 402 can be continuously extracted, thereby reducing the air pressure in the suction tube 402, so that when there is air between the suction cup 401 and the chip due to temperature rise or vibration, the air can be sucked into the suction tube 402 in time, thereby ensuring the reliability of the adsorption of the suction cup 401 and the chip and preventing the suction cup 401 from separating from the chip.

[0045] When the chip is heated and removed, the elastic member 404 pushes the handle 403 to move upward, the handle 403 drives the straw 402 to move upward, and the straw 402 drives the suction cup 401 to move upward, so that the suction cup 401 provides an upward force, so that after the solder between the chip and the motherboard melts, the chip can be directly removed without manually using a suction cup or tweezers to clamp the chip, thereby realizing quick removal of the chip and no need to check the melting status. When the separation point is reached, the elastic member 404 automatically pushes the handle 403 to move upward, so that the suction cup 401 drives the chip to separate from the motherboard.

[0046] When the chip is separated from the mainboard, if it is necessary to remove the chip from the suction cup 401, the negative pressure unit 5 is pressed downward to move the piston 501 downward, and the one-way valve 7 discharges the air in the suction tube 402. When the piston 501 contacts the unlocking unit 8, the unlocking unit 8 pushes the blocking block 602 to move upward, so that the gas in the suction tube 402 can be pressed into the position between the suction cup 401 and the chip, so that the suction cup 401 is separated from the chip, thereby facilitating the removal of the chip.

[0047] Embodiment 4 like Figure 1-9As shown, a computer equipment repair chip auxiliary disassembly device proposed by the present invention, compared with embodiment one or embodiment two or embodiment three, the protection mechanism in this embodiment includes a protection unit 6 that abuts against the suction cup 401 and is embedded in the suction tube 402 and threadedly connected, a one-way valve 7 arranged on the piston 501, and an unlocking unit 8 arranged on the protection unit 6; a through hole is arranged on the piston 501, and the one-way valve 7 includes a blocking block 701 embedded in the through hole and having a conical structure, a guide column 702 arranged on the piston 501 and slidably connected to the blocking block 701, and an elastic member 703 with two ends respectively connected to the blocking block 701 and the sliding rod 502, and the air pressure in the suction tube 402 can be discharged through the one-way valve 7.

[0048] Among them, the protection unit 6 includes a threaded block 601 with a vent hole and threadedly connected to the suction tube 402 and abutting against the suction cup 401, a blocking block 602 slidably set on the threaded block 601 and sealably connected, a connecting plate 605 set on the blocking block 602, a sliding column 603 set on the connecting plate 605 and slidably set on the threaded block 601, and an elastic member 604 set on the sliding column 603 and with both ends respectively connected to the lower end of the sliding column 603 and the threaded block 601; a storage groove for accommodating the sliding column 603 is set on the threaded block 601. A sealing gasket 4011 is provided on the suction cup 401, and the lower end of the threaded block 601 passes through the suction cup 401 and is threadedly connected to the straw 402, so that the straw 402 is pressed on the sealing gasket 4011, and the suction cup 401 is against the inside of the suction cup 401, thereby completing the assembly between the suction cup 401 and the straw 402, and ensuring its airtightness by squeezing to prevent air leakage; after removing the threaded block 601, the suction cup 401 can be replaced, which is convenient for use.

[0049] Among them, the unlocking unit 8 includes two support seats 803 both set on the threaded block 601, two pry bars 801 respectively rotatably set on the two support seats 803, the pry bars 801 are slidably connected to the connecting plate 605, two connecting rods 802 are obtusely set on the pry bars 801, and a rotating rod 804 is rotatably connected to the two connecting rods 802 and can be slidably abutted with the piston 501. When the piston 501 moves downward, the protective unit 6 can be lifted up by the unlocking unit 8, so that the protective unit 6 can be unlocked, so that the gas can be squeezed into the suction cup 401, so that the suction cup 401 is separated from the chip.

[0050] In this embodiment, when the piston 501 is moved upward, the one-way valve 7 is pressed on the piston 501 and is in a sealed state, thereby ensuring the sealing of the piston 501. When the piston 501 extracts the air in the suction tube 402, the blocking block 602 will move upward, and the suction cup 401 can be connected with the suction tube 402, so that the air in the suction cup 401 can be extracted, so that the suction cup 401 can be adsorbed on the chip.

[0051] After the gas is evacuated, the sliding column 603 is pushed downward by the elastic member 3 604, and the sliding column 603 drives the connecting plate 605 to move downward, and the connecting plate 605 drives the blocking block 1 602 to move downward, so that the blocking block 1 602 is pressed on the threaded block 601 to seal the threaded block 601, which can prevent the problem of air pressure backflow caused by the downward movement of the negative pressure unit 5, thereby ensuring good air tightness between the suction cup 401 and the chip and preventing the suction cup 401 from separating from the chip.

[0052] When the negative pressure unit 5 moves downward, the blocking block 1 602 presses on the threaded block 601, so that the gas cannot be discharged from the threaded block 601, thereby pushing the blocking block 2 701 to move upward, so that there is a gap between the blocking block 2 701 and the piston 501, so that the air can be discharged from the piston 501, so that the piston 501 can move downward, and when the piston 501 contacts the rotating rod 804, it will push the rotating rod 804 to move, and the rotating rod 804 will drive the connecting rod 802 to rotate, and the connecting rod 802 will drive the pry bar 801 to rotate, so that the pry bar 801 will lift the connecting plate 605, and the connecting plate 605 will drive the blocking block 1 602 to move, so that there is a gap between the threaded block 601 and the blocking block 1 602. At this time, continuing to move the piston 501 downward can press the remaining gas in the suction tube 402 between the suction cup 401 and the chip, so that the suction cup 401 can be separated from the chip, and the chip can be easily removed.

[0053] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A computer equipment maintenance chip auxiliary disassembly device, characterized in that: include, A heat collection unit (1) comprises a heat collection cover (101), a mounting plate (102) arranged on the heat collection cover (101), and a heat collection cylinder (103) arranged on the mounting plate (102); A heating element (2) is arranged in the heat collecting cover (101); A blowing unit (3) is rotatably disposed in the heat collecting cover (101), with its output end facing the heat collecting cylinder (103); A disassembly unit (4) is slidably disposed on the mounting plate (102), and the lower end of the disassembly unit is located in the heat collecting cylinder (103); A negative pressure unit (5) slidably disposed in the disassembly unit (4); A protection mechanism is arranged on the disassembly unit (4) and the negative pressure unit (5).

2. A computer equipment repair chip auxiliary disassembly device according to claim 1, characterized in that: The heat collecting cover (101) is provided with a plurality of spiral wind grooves (1031) and a wind shield (1032) arranged at the lower part of the heat collecting cover (101); the spiral wind grooves (1031) comprise an air inlet and an air outlet, the air inlet is located at the upper part of the heat collecting cover (101), and the air outlet is located at the wind shield (1032).

3. A computer equipment repair chip auxiliary disassembly device according to claim 2, characterized in that: The blowing unit (3) comprises a fan blade assembly (301) rotatably arranged in the heat collecting cover (101), an air inlet filter plate (303) arranged between the heat collecting cover (101) and the mounting plate (102), and a driving assembly (302) arranged on the heat collecting cover (101) and having an output end connected to the fan blade assembly (301).

4. A computer equipment repair chip auxiliary disassembly device according to claim 3, characterized in that: The driving assembly (302) comprises a driving motor (3021) arranged on the heat collecting cover (101), a driving pulley (3022) connected to the output end of the driving motor (3021), a driven pulley disc (3024) rotatably arranged on the outer peripheral side of the heat collecting cylinder (103) and connected to the fan blade assembly (301), and a driving belt (3023) arranged on the driving pulley (3022) and the driven pulley disc (3024).

5. A computer equipment repair chip auxiliary disassembly device according to claim 4, characterized in that: The fan blade assembly (301) comprises a plurality of fan blades (3011) which are arranged obliquely on the driven pulley disc (3024), and a retaining frame (3012) arranged on the upper part of the fan blades (3011).

6. A computer equipment repair chip auxiliary disassembly device according to claim 5, characterized in that: The disassembly unit (4) comprises a straw (402) slidably arranged on the mounting plate (102), a suction cup (401) arranged at the lower end of the straw (402) and connected to the straw (402), a second handle (403) arranged on the straw (402), and an elastic member (404) arranged on the outer peripheral side of the straw (402) and having two ends respectively connected to the mounting plate (102) and the second handle (403).

7. A computer equipment repair chip auxiliary disassembly device according to claim 6, characterized in that: The negative pressure unit (5) comprises a piston (501) slidably arranged in the suction tube (402), a sliding rod (502) arranged on the piston (501) and sliding with the suction tube (402), a pressing plate (504) arranged on the upper end of the sliding rod (502), and a second elastic member (503) arranged on the sliding rod (502) and having two ends respectively connected to the suction tube (402) and the pressing plate (504).

8. The computer equipment maintenance chip auxiliary disassembly device according to claim 7, characterized in that: The protection mechanism comprises a protection unit (6) abutting against the suction cup (401) and embedded in the suction tube (402) and threadedly connected, a one-way valve (7) arranged on the piston (501), and an unlocking unit (8) arranged on the protection unit (6); the piston (501) is provided with a through hole, and the one-way valve (7) comprises a blocking block 2 (701) embedded in the through hole and having a conical structure, a guide column (702) arranged on the piston (501) and slidably connected to the blocking block 2 (701), and an elastic member 4 (703) having two ends respectively connected to the blocking block 2 (701) and the sliding rod (502).

9. The computer equipment repair chip auxiliary disassembly device according to claim 8, characterized in that: The protection unit (6) comprises a threaded block (601) having a vent hole and being threadedly connected to the suction tube (402) and abutting against the suction cup (401), a sealing block (602) slidably arranged on the threaded block (601) and sealably connected, a connecting plate (605) arranged on the sealing block (602), a sliding column (603) arranged on the connecting plate (605) and slidably arranged on the threaded block (601), and an elastic member (604) arranged on the sliding column (603) and having two ends respectively connected to the lower end of the sliding column (603) and the threaded block (601); a receiving groove for receiving the sliding column (603) is arranged on the threaded block (601).

10. The computer equipment repair chip auxiliary disassembly device according to claim 9, characterized in that: The unlocking unit (8) comprises two support seats (803) both arranged on the threaded block (601), two pry bars (801) rotatably arranged on the two support seats (803), two connecting rods (802) obliquely arranged on the pry bars (801) with an obtuse angle, and a rotating rod (804) rotatably connected to the two connecting rods (802) and capable of slidably abutting against the piston (501).

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