Temperature adjusting device and semiconductor equipment

Abstract

The invention discloses a temperature adjusting device and semiconductor equipment, the temperature adjusting device is applied to the semiconductor equipment, the semiconductor equipment comprises a spraying plate, and the temperature adjusting device comprises a water cooling part which is arranged above the spraying plate and is at least partially in direct contact with the spraying plate, the cooling device is used for directly cooling the spraying plate; and the heat conduction part with the adjustable heat conduction efficiency is arranged above the spraying plate, is positioned between the part, which is not in contact with the spraying plate, of the water cooling part and the spraying plate, and is used for transferring the temperature of the spraying plate to the water cooling part. The water cooling part is arranged to directly cool the spraying plate, meanwhile, the heat conduction part is arranged to transfer heat of the spraying plate to the water cooling part to achieve indirect cooling, and the heat conduction efficiency can be adjusted, so that the heat conduction efficiency of the heat conduction part can be dynamically adjusted according to actual requirements; in this way, accurate control over the temperature of the spraying plate is achieved, and the temperature stability of the spraying plate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a temperature regulating device and a semiconductor equipment. Background Art

[0002] At present, in order to ensure the quality of film formation, semiconductor equipment needs to control the temperature of the shower plate during the process. The shower plate will be affected by the thermal radiation of the heating disk. At the same time, the process gas temperature and the radio frequency field will also cause temperature interference to the shower plate, which will cause the temperature of the shower plate to fluctuate, thereby affecting the process stability. For example, during the process, when the radio frequency is started, the temperature of the shower plate will rise. If the heat dissipation efficiency in the reaction chamber is low, it will cause the temperature of the shower plate to fluctuate greatly. For another example, in some specific processes that require lower temperature conditions for the shower plate, the shower plate temperature cannot be reduced to the target temperature due to the influence of the thermal radiation of the heating disk.

[0003] In this regard, the prior art uses an external fan cooling method to cool the temperature of the shower plate. However, under certain specific process conditions, the cooling effect achieved by this cooling method relying on an external fan is not ideal. Not only that, this method is also easily affected by ambient environmental factors, such as temperature, humidity, etc., which may have a negative impact on the cooling efficiency. Therefore, the use of an external fan cooling method still cannot ensure that the shower plate can maintain stable temperature control under various conditions, thereby affecting the overall performance and reliability of the semiconductor equipment. Summary of the invention

[0004] The embodiments of the present invention provide a temperature regulating device and a semiconductor device, which are intended to achieve precise control of the temperature of a shower plate to improve the stability of the temperature of the shower plate.

[0005] An embodiment of the present invention provides a temperature adjustment device, which is applied to a semiconductor device, wherein the semiconductor device includes a shower plate, and the temperature adjustment device includes:

[0006] A water cooling unit, disposed above the spray plate and at least partially in direct contact with the spray plate, for directly cooling the spray plate;

[0007] The heat conducting part with adjustable heat conducting efficiency is arranged above the spray plate and located between the part of the water cooling part not in contact with the spray plate and the spray plate, and is used for transferring the temperature of the spray plate to the water cooling part.

[0008] Furthermore, a temperature regulating area is provided circumferentially above the spray plate;

[0009] The water cooling part includes a water cooling ring circumferentially arranged in the temperature regulating area;

[0010] The heat conduction part includes a plurality of circumferentially distributed and movable heat conduction blocks, and each of the heat conduction blocks is arranged between a portion of the water cooling part that is not in contact with the spray plate and the spray plate in the temperature adjustment area.

[0011] Furthermore, it also includes:

[0012] The adjusting part is used to adjust the contact area between the water cooling ring and / or the heat conducting block and the spray plate.

[0013] Furthermore, the adjusting portion includes an elastic member clamped between the water cooling ring and the heat conducting block.

[0014] Furthermore, the adjustment part also includes an adjustment screw connected to the water cooling ring and / or the heat conducting block.

[0015] Furthermore, the heat conducting part is detachably mounted above the shower plate to replace a heat conducting part with a different thermal conductivity or a different thickness.

[0016] Furthermore, the heat-conducting material of the heat-conducting part includes any one of graphite and polyetheretherketone.

[0017] Furthermore, the thickness of the heat conducting part is 0.5 mm to 5 mm.

[0018] Furthermore, the water cooling unit also includes a water channel for supplying water, and an outer surface of the water channel is provided with an insulating layer.

[0019] An embodiment of the present invention further provides a semiconductor device, comprising the temperature adjustment device as described in any one of the above items.

[0020] The embodiment of the present invention provides a temperature regulating device and a semiconductor device, which is applied to a semiconductor device, wherein the semiconductor device includes a shower plate, and the temperature regulating device includes: a water cooling part, which is arranged above the shower plate and at least partially in direct contact with the shower plate, and is used to directly cool the shower plate; a heat conducting part with adjustable heat conduction efficiency, which is arranged above the shower plate and between the part of the water cooling part that is not in contact with the shower plate and the shower plate, and is used to transfer the temperature of the shower plate to the water cooling part. The embodiment of the present invention directly cools the shower plate by arranging the water cooling part, and also arranging the heat conducting part so that the heat of the shower plate can be transferred to the water cooling part to achieve indirect cooling, and because the heat conduction efficiency of the heat conducting part can be adjusted, the heat conduction efficiency of the heat conducting part can be dynamically adjusted according to actual needs, so that the temperature fluctuation caused by the process flow can be avoided, and the temperature of the shower plate can be accurately controlled, thereby improving the stability of the temperature of the shower plate, and ultimately ensuring the overall performance and reliability of the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of the structure of a semiconductor device provided by an embodiment of the present invention;

[0023] Figure 2 for Figure 1 A magnified schematic diagram of part A;

[0024] Figure 3 A schematic diagram of the structure of a temperature adjustment device provided by an embodiment of the present invention;

[0025] Figure 4 An exemplary diagram of a heat conducting part in a temperature regulating device provided by an embodiment of the present invention;

[0026] Figure 5 Another structural schematic diagram of a temperature adjustment device provided by an embodiment of the present invention;

[0027] Figure 6 A schematic diagram of a water path in a temperature regulating device provided by an embodiment of the present invention;

[0028] Figure 7 A schematic cross-sectional view of a water channel in a temperature regulating device provided in an embodiment of the present invention.

[0029] Markings in the figure:

[0030] 1. Spray plate;

[0031] 2. Water cooling unit; 21. Water channel; 211. Insulation cap; 212. Ceramic block;

[0032] 3. Heat transfer part;

[0033] 4. Adjustment part; 41. Elastic member; 42. Adjustment top screw. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0036] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0037] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0038] See below Figure 1 and Figure 2 The embodiment of the present invention provides a temperature regulating device, which is applied to a semiconductor device. The semiconductor device includes a shower plate 1. The temperature regulating device includes:

[0039] The water cooling part 2 is arranged above the spray plate 1 and at least partially in direct contact with the spray plate 1, and is used for directly cooling the spray plate 1;

[0040] The heat conducting part 3 with adjustable heat conducting efficiency is arranged above the spray plate 1 and located between the part of the water cooling part 2 not in contact with the spray plate 1 and the spray plate 1 , and is used to transfer the temperature of the spray plate 1 to the water cooling part 2 .

[0041] In this embodiment, the temperature regulating device includes a water cooling part 2 and a heat conducting part 3, wherein the water cooling part 2 and the heat conducting part 3 are both arranged above the spray plate 1, and a part of the water cooling part 2 is in direct contact with the spray plate 1, so that the spray plate 1 can be directly cooled by the water cooling part 2, and the part of the water cooling part 2 that is not in direct contact with the spray plate 1 will be in contact with one side of the heat conducting part 3, while the other side of the heat conducting part 3 is in direct contact with the spray plate 1, so that the heat conducting part 3 can transfer the heat on the spray plate 1 to the water cooling part 2 to achieve indirect cooling. In addition, the heat conducting efficiency of the heat conducting part 3 described in this embodiment can be adjusted, so different heat conducting efficiencies can be set for the heat conducting part 3 according to actual needs, so that different heat conducting effects can be achieved through the heat conducting part 3, thereby achieving the effect of accurately controlling the temperature of the spray plate 1.

[0042] In this embodiment, a water cooling part 2 is provided to directly cool the shower plate 1, and a heat conducting part 3 is provided to allow the heat of the shower plate 1 to reach the water cooling part 2 to achieve indirect cooling. Since the heat conducting efficiency of the heat conducting part 3 can be adjusted, the heat conducting efficiency of the heat conducting part 3 can be dynamically adjusted according to actual needs, so that the temperature fluctuation caused by the process flow can be avoided, and the temperature of the shower plate 1 can be accurately controlled, thereby improving the stability of the temperature of the shower plate 1 and ultimately ensuring the overall performance and reliability of the semiconductor device. It should also be noted here that the uniform gas structure provided in this embodiment is particularly suitable for semiconductor devices with radio frequency RF devices, such as PECVD (plasma enhanced chemical vapor deposition) equipment, PEALD (plasma enhanced atomic layer deposition) equipment, and the like.

[0043] In an actual application scenario, the water cooling in the water cooling part 2 refers to a cooling liquid of a constant temperature, which can ensure that the water cooling part 2 can produce a relatively stable cooling effect on the spray plate 1, and can quickly stabilize the temperature fluctuation caused by factors such as the process. Preferably, the temperature of the cooling liquid in the water cooling part 2 can be determined according to actual needs. For example, when a larger degree of cooling is required, a cooling liquid with a lower temperature can be introduced, and when a smaller degree of cooling is required, a cooling liquid with a normal temperature (the temperature of "normal temperature" is higher than the temperature of "low temperature") can be introduced.

[0044] In another practical application scenario, a critical temperature detection device or other temperature detection device can be provided for the spray plate 1, and the detection device can monitor the temperature of the spray plate 1 in real time and transmit the monitoring data to a pre-set control system. The control system automatically adjusts the working state of the water cooling part 2 and the heat conducting part 3 according to the monitored temperature data to achieve precise control of the temperature of the spray plate 1. In order to further improve the performance of the temperature adjustment device, the temperature detection device can use a high-precision temperature sensor, such as a thermocouple or an infrared sensor, to ensure the accuracy and reliability of the temperature data. At the same time, the control system can adopt PID control algorithms and other methods to achieve rapid response and precise regulation of temperature changes.

[0045] In addition, it should be noted that the temperature regulating device provided in this embodiment is not only applicable to the shower plate 1, but also applicable to other parts of the semiconductor equipment, such as the bottom plate of the reaction chamber, that is, combining the water cooling part 2 and the heat conducting part 3 to adjust the temperature distribution at the bottom of the chamber.

[0046] like Figure 3 As shown, in one embodiment, a temperature regulating area is provided on the upper circumference of the spray plate 1; the temperature regulating area may be the upper peripheral edge area of ​​the spray plate 1, or the peripheral edge area of ​​the spray upper plate of the spray plate 1, or other areas set according to actual needs;

[0047] The water cooling part 2 comprises a water cooling ring circumferentially arranged in the temperature regulating area;

[0048] The heat conducting part 3 includes a plurality of circumferentially distributed and movable heat conducting blocks, and each of the heat conducting blocks is disposed between a portion of the water cooling part 2 that is not in contact with the spray plate 1 and the spray plate 1 in the temperature regulating area.

[0049] In this embodiment, a water-cooling part 2 and a heat-conducting part 3 are arranged in a fixed area above the spray plate 1, so that when the area occupied by the heat-conducting part 3 becomes smaller, the area occupied by the water-cooling part 2 is correspondingly increased, that is, the contact area between the water-cooling ring and the spray plate 1 is increased, which can correspondingly improve the water-cooling cooling effect; conversely, when the area occupied by the heat-conducting part 3 becomes larger, the area occupied by the water-cooling part 2 is correspondingly reduced, that is, the contact area between the water-cooling ring and the spray plate 1 is reduced, which can correspondingly weaken the water-cooling cooling effect.

[0050] Furthermore, the temperature regulating device also includes:

[0051] The adjusting part 4 is used to adjust the contact area between the water cooling ring and / or the heat conducting block and the spray plate 1 .

[0052] That is, the area occupied by the water-cooling ring and / or the heat-conducting block in the temperature adjustment area is adjusted by the adjustment unit 4. For example, the water-cooling ring or the heat-conducting block can be adjusted alone to change the area occupied by the water-cooling ring and the heat-conducting block in the temperature adjustment area; or the water-cooling ring and the heat-conducting block can be adjusted at the same time to change the area occupied by the water-cooling ring and the heat-conducting block in the temperature adjustment area.

[0053] In a specific embodiment, the adjustment part 4 includes an elastic member 41 clamped between the water cooling ring and the heat conducting block. That is, the distance between the water cooling ring and the heat conducting block is adjusted by the compression and extension of the elastic member 41, so as to achieve the effect of adjusting the contact area between the water cooling ring and the spray plate 1. The design of the elastic member 41 allows the device to be flexibly adjusted under different working conditions to adapt to different temperature control requirements. For example, when rapid cooling is required, the elastic member 41 can be in an extended state, so that the contact area between the water cooling ring and the spray plate 1 is increased, thereby increasing the cooling efficiency; and when cooling needs to be reduced, the elastic member 41 can be in a compressed state to reduce the contact area between the water cooling ring and the spray plate 1, thereby reducing the cooling effect. This design not only improves the accuracy of temperature regulation, but also extends the service life of the device, because the elastic member 41 can absorb part of the stress caused by thermal expansion and contraction, reducing damage to other components. In addition, the use of the elastic member 41 also simplifies the design of the adjustment mechanism, reducing the cost and complexity of maintenance. In this way, the temperature regulating device can work more efficiently and stably, meeting the strict requirements of temperature control in different process flows.

[0054] In addition, the adjustment part 4 also includes an adjustment screw 42 connected to the water cooling ring and / or the heat conducting block. The adjustment screw 42 can be used to drive the water cooling ring and / or the heat conducting block to produce displacement, so that the distance between the water cooling ring and the heat conducting block can be adjusted, thereby achieving the effect of adjusting the contact area between the water cooling ring and the spray plate 1. For example, the adjustment screw 42 is connected to the heat conducting block, so that the heat conducting block can be driven to move by adjusting the screw 42. When the cooling effect needs to be increased, the heat conducting block is driven away from the water cooling ring by adjusting the screw 42, so that the contact area between the water cooling ring and the spray plate 1 is increased; conversely, when the cooling effect needs to be reduced, the heat conducting block is driven close to the water cooling ring by adjusting the screw 42, so that the contact area between the water cooling ring and the spray plate 1 is reduced. This adjustment method not only has a fast response speed, but also can achieve fine-tuning to ensure the accuracy of temperature control. In addition, the structural design of the adjustment screw 42 is simple and easy to operate, which is convenient for users to make quick adjustments according to actual needs. In practical applications, this adjustment mechanism can significantly improve the process adaptability and production efficiency of semiconductor equipment, while reducing the equipment failure rate caused by temperature fluctuations.

[0055] In actual application scenarios, the heat conducting part 3 is divided into a plurality of heat conducting blocks according to actual needs, such as Figure 4 As shown, the heat conducting part 3 is divided into 16 equal areas, and in each equal area, the distance between the heat conducting block and the water cooling ring is controlled by combining the elastic member 41 and the adjusting top screw 42, so that the two are close to or separated, thereby adjusting the heat conduction efficiency in the corresponding equal area, so as to further improve the temperature adjustment effect of the spray plate 1. Of course, the heat conducting block in the corresponding equal area can also be replaced according to actual needs, so as to adjust the heat conduction efficiency of the heat conducting block in the equal area.

[0056] In one embodiment, the heat conducting part 3 is detachably mounted above the shower plate 1 to replace the heat conducting part 3 with a different thermal conductivity or a different thickness.

[0057] Specifically, the heat conducting part 3 may be provided with a plurality of heat conducting parts 3, and the plurality of heat conducting parts 3 are respectively made of a plurality of heat conducting materials with different thermal conductivity coefficients. For example, a uniform heat conducting material such as graphite or peek (polyetheretherketone) may be selected. These materials have excellent thermal conductivity and can effectively transfer heat to each part evenly, thereby improving the overall thermal efficiency. Graphite is a natural mineral material with excellent thermal conductivity, light weight, high temperature resistance and good chemical stability. Peek is a high-performance engineering plastic, which not only has good thermal conductivity, but also has excellent mechanical strength and chemical corrosion resistance, so that it can still maintain stable performance under high temperature and harsh environment. These two materials have been widely used in the industrial and electronic fields, especially in occasions requiring efficient thermal management, such as radiators, heat exchangers and electronic packaging materials.

[0058] In addition, the heat conducting part 3 can also be set according to the thickness, and the specific thickness can be between 0.5 mm and 5 mm. This range is set to ensure the balance between thermal conductivity and structural strength. Of course, according to different application requirements and specific usage scenarios, the thickness of the heat conducting part 3 can also be flexibly adjusted to achieve the best thermal conductivity effect.

[0059] In this embodiment, the heat conduction efficiency can be adjusted by replacing the heat conduction part 3. For example, the heat conduction part 3 currently having the first thermal conductivity is disassembled and replaced with a heat conduction part having a second thermal conductivity different from the first thermal conductivity, so that the heat conduction efficiency of the heat conduction part 3 can be adjusted. For another example, the heat conduction part 3 currently having the first thickness is replaced with a heat conduction part 3 having a second thickness different from the first thickness, so as to achieve the heat conduction efficiency of the heat conduction part 3. That is, if the heat conduction part 3 of the current thickness is replaced with a thicker heat conduction part 3, the heat conduction efficiency will be relatively lower, and if the heat conduction part 3 of the current thickness is replaced with a thinner heat conduction part 3, the heat conduction efficiency will be relatively higher. In other words, the corresponding heat conduction efficiency adjustment effect can be achieved by disassembling and replacing the heat conduction part 3 with different thermal conductivity coefficients and different thermal conductivity thicknesses.

[0060] In actual application scenarios, in order to meet different process requirements, the three heat conducting parts can be designed as a half-structured annular heat conducting plate. The advantage of this design is that it can provide a quick and convenient disassembly and replacement mechanism. Through this half-structured annular heat conducting plate, users can easily replace components according to specific application conditions to meet different heat conduction requirements.

[0061] like Figure 5 and Figure 6 As shown, in one embodiment, the water cooling unit 2 further includes a water channel 21 for supplying water, and an outer surface of the water channel 21 is provided with an insulating layer.

[0062] Since the present embodiment cools the spray plate 1 by water cooling, a water channel 21 for water supply is naturally provided. In order to avoid the radio frequency leakage caused by the water channel 21, the water channel 21 is designed to be insulated, for example Figure 7 As shown, the RF positive electrode and the water channel 21 can be isolated by means of an insulating cap 211 and a ceramic block 212. The insulating layer design of the water channel 21 can effectively prevent the leakage of RF signals, thereby ensuring the safety and stability of the semiconductor device during operation. In addition, the insulating layer can also prevent the water channel 21 from directly contacting the spray plate 1 or other metal parts, avoiding corrosion problems caused by electrochemical reactions, thereby extending the service life of the device.

[0063] An embodiment of the present invention further provides a semiconductor device, comprising the temperature adjustment device as described in any one of the above items.

[0064] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

[0065] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

Claims

1. A temperature regulating device, applied to a semiconductor device, wherein the semiconductor device comprises a shower plate, characterized in that: The temperature regulating device comprises: A water cooling unit, disposed above the spray plate and at least partially in direct contact with the spray plate, for directly cooling the spray plate; The heat conducting part with adjustable heat conducting efficiency is arranged above the spray plate and located between the part of the water cooling part not in contact with the spray plate and the spray plate, and is used for transferring the temperature of the spray plate to the water cooling part.

2. The temperature adjustment device according to claim 1, characterized in that: A temperature regulating area is provided circumferentially above the spray plate; The water cooling part includes a water cooling ring circumferentially arranged in the temperature regulating area; The heat conduction part includes a plurality of circumferentially distributed and movable heat conduction blocks, and each of the heat conduction blocks is arranged between a portion of the water cooling part that is not in contact with the spray plate and the spray plate in the temperature adjustment area.

3. The temperature adjustment device according to claim 2, characterized in that: Also includes: The adjusting part is used to adjust the contact area between the water cooling ring and / or the heat conducting block and the spray plate.

4. The temperature adjustment device according to claim 3, characterized in that: The adjusting portion includes an elastic member clamped between the water cooling ring and the heat conducting block.

5. The temperature adjustment device according to claim 4, characterized in that: The adjusting part also includes an adjusting top screw connected to the water cooling ring and / or the heat conducting block.

6. The temperature adjustment device according to claim 1, characterized in that: The heat conducting part is detachably mounted above the shower plate to replace a heat conducting part with a different thermal conductivity or a different thickness.

7. The temperature adjustment device according to claim 6, characterized in that: The heat-conducting material of the heat-conducting part includes any one of graphite and polyetheretherketone.

8. The temperature adjustment device according to claim 6, characterized in that: The thickness of the heat conducting part is 0.5 mm to 5 mm.

9. The temperature adjustment device according to claim 1, characterized in that: The water cooling unit further includes a water channel for supplying water, and an outer surface of the water channel is provided with an insulating layer.

10. A semiconductor device, characterized in that: The invention comprises a temperature regulating device as claimed in any one of claims 1 to 9.

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