System, method and device for visual positioning of wafer equipment

Abstract

The invention relates to the technical field of semiconductor manufacturing, and discloses a system, a method and a device for wafer equipment visual localization, in the system for wafer equipment visual localization, a wafer clamping mechanical arm and a waterproof cover with a built-in visual camera are combined together to form a combined mechanical arm, the method comprises the steps that under the condition that the combined mechanical arm is controlled to move to a first set position in a DSP area, first current image information, shot by a vision camera, of a first containing hole in the planet gear is obtained, and under the condition that the combined mechanical arm is controlled to move to a second set position in the DSP area, first current image information of a second containing hole in the planet gear is obtained; acquiring second current image information of a second placement hole in the planet gear shot by the visual camera; and according to the first current image information and the second current image information, position information of each placement hole in the planet wheel is determined, the planet wheel comprises three placement holes, and each placement hole bears one wafer. Therefore, the visual positioning efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a system, method and device for visual positioning of wafer equipment. Background Art

[0002] With the development of science and technology, semiconductor products have received more and more attention, and the degree of automation in semiconductor product manufacturing has also become higher and higher, including: cleaning equipment, double-sided grinding and polishing equipment (Double Side Polishing, DSP), etching equipment, deposition equipment, etc. Semiconductor wafers refer to the substrate silicon wafers used in the manufacture of silicon semiconductor integrated circuits. Because of their round shape, they are called wafers. In semiconductor manufacturing, wafer production is one of the core links, and its quality directly determines the performance and reliability of the final product.

[0003] During the production of wafers, DSP needs to polish the wafers. During the polishing process, the wafer placement holes (Hotels) on the planetary wheel (carrie) need to be positioned. At present, the visual camera needs to be moved between the upper plate and the lower plate, and after taking visual photos, positioning is performed based on the photo information. Generally, there are three hotels on the DSP's carrie. Since the DSP is a vertical lifting structure, the height between the upper plate and the lower plate is very low after opening the cover. The visual camera's field of view cannot cover the three wafer carrying position placement holes Hotel of the carrier. The camera needs to be moved and photographed multiple times to determine the placement point coordinates of the three wafers respectively. In this way, the wafer positioning efficiency is relatively low. In addition, when the DSP opens the cover and takes and places the wafer, there is some grinding liquid on the lower grinding plate, and the upper grinding plate may also drip and splash grinding liquid. The dripping grinding liquid and water mist will affect the visual photography effect, and even the liquid or water mist will pollute the lens, making it impossible to achieve visual positioning. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a system, method and device for visual positioning of wafer equipment. The technical problem to be solved by the present invention is achieved through the following technical solutions: A first aspect of an embodiment of the present invention provides a system for visual positioning of wafer equipment, comprising: a wafer clamping robot arm, a visual camera located in a waterproof cover, and a control device, wherein: The waterproof cover includes a camera cover and a camera lens cover, which are respectively combined with the wafer clamping mechanical arm through a mounting plate to form a combined mechanical arm, and the end face of the camera lens cover is provided with a visual window, which matches the position of the visual camera lens; A visual camera is configured to capture current image information of a wafer processing position in the wafer device through a visual window when the combined robotic arm moves to a set position; The control device is configured to control the combined robotic arm to move and determine the position information of the wafer processing position based on the current image information obtained by the visual camera.

[0005] A second aspect of an embodiment of the present invention provides a method for visual positioning of a wafer device, wherein a wafer clamping mechanical arm and a waterproof cover with a built-in visual camera are combined together to form a combined mechanical arm, and the method comprises: When the combined robotic arm is controlled to move to a first set position in the DSP area, first current image information of a first placement hole on the planetary wheel taken by the visual camera is obtained, and, when the combined robotic arm is controlled to move to a second set position in the DSP area, second current image information of a second placement hole on the planetary wheel taken by the visual camera is obtained; According to the first current image information and the second current image information, the position information of each placement hole on the planetary wheel is determined, wherein the planetary wheel includes three placement holes, and each placement hole carries a wafer.

[0006] A third aspect of an embodiment of the present invention provides a device for visual positioning of wafer equipment, including: the device includes a processor and a memory storing program instructions, characterized in that the processor is configured to execute the above-mentioned method for visual positioning of wafer equipment when executing the program instructions.

[0007] Beneficial effects of the present invention: The visual camera is located in a waterproof cover, and the waterproof cover is combined with a wafer clamping robot to form a combined robot, which facilitates the position control of the visual camera. In addition, the visual camera is located in the waterproof cover, which can reduce the chance of the lens being contaminated by liquid or water mist, thereby improving the effectiveness and positioning accuracy of the visual positioning of the wafer equipment.

[0008] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0009] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 A schematic diagram of the structure of a combined mechanical arm provided by an embodiment of the present invention; Figure 2A schematic front view of a combined mechanical arm provided by an embodiment of the present invention; Figure 3 A schematic diagram of the structure of a planetary gear in a DSP device provided by an embodiment of the present invention; Figure 4 A geometric diagram corresponding to a planetary gear in a DSP device provided in an embodiment of the present invention; Figure 5 A schematic diagram of a process flow of a method for visual positioning of wafer equipment provided by an embodiment of the present invention; Figure 6-1 , 6-2 A flowchart of a method for visual positioning of a DSP device provided by an embodiment of the present invention; Figure 7 A schematic structural diagram of a visual positioning device for wafer equipment provided in an embodiment of the present invention.

[0011] In the attached drawings: 1. Wafer clamping robot arm; 2. Wafer pressing hand; 3. Wafer pressing detection; 401. Camera cover; 402. Camera lens cover; 403. Window water spray column; 404. Window blow-dry column; 405. Visual window; 406. Camera cable waterproof connector 407. Mounting plate; 408. Positive pressure waterproof start connector; 409. Water injection connector; 410. Dry gas connector. DETAILED DESCRIPTION

[0012] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0013] With the development of science and technology, the degree of automation in the manufacture of semiconductor products is getting higher and higher. During the production process of wafers, many devices used for wafer production, namely wafer equipment, need to be visually positioned. For example, in DSP equipment, it is necessary to use a visual camera to position the wafer placement hole Hotel on the planetary wheel carrie. If the positioning accuracy is low, the wafer will not be able to be placed in the wafer placement hotel of the planetary wheel carrie, or the position is not accurate enough when the wafer is placed. During the polishing process, debris will be generated, causing serious economic losses. In an embodiment of the present invention, the visual camera is located in a waterproof cover, and the waterproof cover is combined with a wafer clamping mechanical arm to form a combined mechanical arm, which is convenient for the position control of the visual camera. In addition, the visual camera is located in the waterproof cover, which can reduce the probability of the lens being contaminated by liquid or water mist, and improve the effectiveness and positioning accuracy of the visual positioning of the wafer equipment. In addition, when visually positioning the DSP equipment, it is only necessary to obtain the image information of the two placement holes on the planetary wheel through the visual camera to obtain the position information of the three placement holes on the planetary wheel, that is, the visual positioning of the wafer processing position is realized, the number of times the visual camera moves to take pictures is reduced, and the efficiency of the visual positioning of the wafer equipment is improved.

[0014] Related technology: wafer processing can be automatically loaded and unloaded by a robotic arm, that is, in the process of wafer production by the wafer equipment, the wafer clamping robotic arm can realize functions such as unloading, clamping, pressing, and pressing detection. In the embodiment of the present invention, the visual camera and the wafer clamping robotic arm can be combined together to form a combined robotic arm. In this way, through the combined robotic arm, the visual camera can be moved in and out of the wafer equipment to take pictures. Not only that, the visual camera can also be placed in a waterproof cover, and the waterproof cover is combined with the wafer clamping robotic arm to form a combined robotic arm, thereby reducing the probability of the lens being contaminated by liquid or water mist, and improving the effectiveness and positioning accuracy of the visual positioning of the wafer equipment.

[0015] Therefore, the system for visual positioning of wafer equipment includes: a wafer clamping mechanical arm, a visual camera located in a waterproof cover, and a control device, wherein the waterproof cover and the wafer clamping mechanical arm are combined to form a combined mechanical arm. The control device is respectively connected to the combined mechanical arm and the visual camera.

[0016] like Figure 1 As shown, the combined robot arm includes: a wafer clamping arm 1, a camera cover 401, a camera lens cover 402, and a mounting plate 407. According to the shape of the visual camera, the waterproof cover for placing the visual camera can be divided into a rectangular camera cover 401 and a cylindrical camera lens cover 402, and the camera cover 401 and the camera lens cover 402 can be respectively combined with the wafer clamping robot arm 1 through the mounting plate 407 to form a combined robot arm, and the end face of the camera lens cover 402 is provided with a visual window 405, which matches the position of the lens of the visual camera, and the visual window 405 can be made of high-definition transparent material, so that the visual camera is configured to capture the current image information of the wafer processing position in the wafer equipment through the visual window 405 when the combined robot arm moves to the set position.

[0017] The control device can control the combined robotic arm and the visual camera respectively, so that when the control device controls the combined robotic arm to move to a set position, it can control the visual camera to take pictures and obtain the current image information taken by the visual camera, and then determine the position information of the wafer processing position based on the current image information obtained by the visual camera.

[0018] For example: when the wafer device is a DSP device, after the DSP device is opened, the control device controls the combined robotic arm to move to the set position, and when the lens position of the visual camera matches the position of a placement hole on the planetary gear, the visual camera can obtain the current image information of the placement hole through the visual window 405, and then send the current image information to the control device, so that the control device can perform image recognition, obtain the placement point coordinate information corresponding to the placement hole, and obtain the position information of the placement hole.

[0019] In the embodiment of the present invention, the control device can be a device, and the programmable logic controller (PLC) is a digital operation electronic system specially designed for application in an industrial environment. It uses a programmable memory to store instructions for performing operations such as logical operations, sequential control, timing, counting and arithmetic operations, and controls various types of mechanical equipment or production processes through digital or analog input and output. Therefore, the control device can be a PLC or other industrial controller, or the control device can be two or more devices, such as a PLC and a microprocessor embedded in a visual camera. Among them, when the control device is a PLC, the PLC can control the movement of the combined mechanical arm, and control the visual camera to shoot, obtain the current image information sent by the visual camera, and perform image recognition to obtain the position information of the corresponding wafer processing position. Alternatively, when the control device includes: a PLC and a microprocessor embedded in a visual camera, the PLC can control the movement of the combined mechanical arm and trigger the microprocessor in the visual camera. The microprocessor can obtain the current image information shot by the visual camera, perform image recognition, obtain the position information of the corresponding wafer processing position and send it to the PLC.

[0020] Because some wafer equipment may have liquid or water mist during the wafer manufacturing process, placing the visual camera in a waterproof cover can reduce the chance of the lens being contaminated by liquid or water mist. Figure 1 , Figure 2 In some embodiments, a positive pressure waterproof start connector 408 is provided on the camera lens cover 402, which is in a normally open state, so that compressed air enters the waterproof cover through the positive pressure waterproof start connector 408, so that the air around the visual camera flows to the outside of the waterproof cover. In this way, during the wafer equipment startup process, the normally open positive pressure waterproof start connector 408 can be connected to an external compressed air pump, so that compressed air enters the waterproof cover through the positive pressure waterproof start connector 408, so that the air in the waterproof cover is in a positive pressure state, and the air around the visual camera flows to the outside of the waterproof cover, so that water mist, water molecules, etc. outside the waterproof cover are difficult to enter the waterproof cover, further reducing the probability of the lens of the visual camera being contaminated by liquid or water mist.

[0021] Since the visual camera captures the image information of the wafer processing position in the wafer device through the visual window 405, the visual window 405 also needs to be kept clean and dry. Therefore, in some embodiments, the visual camera may be used in combination with the visual window 405. Figure 1 and Figure 2 The camera lens cover 402 is provided with a water injection connector 409. When the water injection connector 409 is in an open state, the visual window 405 is flushed with clean water. The camera lens cover 402 is provided with a dry gas connector 410. When the dry gas connector 410 is in an open state, the visual window 405 is purged with dry gas.

[0022] When the cleaning degree of the image information captured by the visual camera is less than the set value, the control device can control the water injection joint 409 to be in an open state. At this time, it can be connected to an external water pump, and the clean water can rinse the visual window 405. After the set flushing time or the set flushing conditions are met, the control device can control the water injection joint 409 to be in a closed state. At this time, the control device can control the dry gas joint 410 to be in an open state. At this time, it is connected to an external dry gas pump, and the dry gas can automatically purge the visual window 405, accelerate the evaporation and flow of the clean water, so that the visual window 405 remains dry and clean. Of course, in some embodiments, the system for visual positioning of wafer equipment may also include a heating device, such as a heating tube, located between the external dry gas pump and the dry gas joint 410, to heat the dry gas, so that the heated gas can further dry the water droplets, water mist, etc. on the visual window 405.

[0023] In some embodiments, the system for visual positioning of wafer equipment may further include: a wiper, which is configured to wipe the visual window 405 when the combined mechanical arm moves to a wiping position that matches the wiper. In this way, after the control device controls the water injection joint 409 to be in a closed state, the combined mechanical arm can be controlled to move to a wiping position that matches the wiper, and the wiper can be controlled to wipe the visual window 405. After the wipe setting time or other set conditions are met, the PLC can control the dry gas joint 410 to be in an open state, so that the dry gas can automatically heat and purge the visual window 405, thereby further improving the drying speed of the visual window 405.

[0024] It can be seen that in the embodiment of the present invention, the visual window 405 can be automatically cleaned and dried by means of clean water flushing, water droplet scraping, dry gas purging, etc., which further improves the accuracy of visual positioning and the intelligence of the system.

[0025] like Figure 3As shown, the planetary wheel of the DSP device includes three placement holes, each placement hole carries a wafer, that is, the placement hole is the wafer processing position in the DSP device. In the embodiment of the present invention, during the visual positioning process of the DSP device, the visual camera only needs to capture the image information of two placement holes to obtain the position information of each placement hole on the planetary wheel. That is, in some embodiments, the control device is configured to obtain the first current image information of the first placement hole on the planetary wheel captured by the visual camera through the visual window 405 when the control combined mechanical arm is moved to the first set position in the DSP area, and to obtain the second current image information of the second placement hole on the planetary wheel captured by the visual camera through the visual window 405 when the control combined mechanical arm is moved to the second set position in the DSP area, and determine the position information of each placement hole on the planetary wheel according to the first current image information and the second current image information, wherein the planetary wheel includes three placement holes, each placement hole carries a wafer.

[0026] Among them, the control device is specifically configured to perform image recognition based on the first current image information and the second current image information to obtain the first current position information of the first placement hole and the second current position information of the second placement hole, and determine the third current position information of the third placement hole based on the positional relationship of the three placement holes on the planetary wheel, the first current position information, and the second current position information.

[0027] like Figure 4 As shown in the figure, the centers A, B, and C of the three placement holes that need to be visually positioned are evenly distributed in a large circle, and the connecting lines form an equilateral triangle with coordinates of A (X1, Y1), B (X2, Y2), and C (X3, Y3). The image information obtained by the visual camera can realize the coordinate positioning of points A and B. The coordinates of point C can be calculated based on the equilateral triangle formed by the centers of the three placement holes on the planetary gear. The specific method is as follows: Since the positions of the three holes on the planetary gear of the DSP device are fixed, vector BA = (X1-X2, Y1-Y2) and vector BC = (X3-X2, Y3-Y2) are known. The angle B is 60°, and vector BC can be regarded as vector BA rotated 60°. According to the vector formula, we can get: X3-X2=(X1-X2)*COSθ-(Y1-Y2)*SINθ Y3-Y2=(X1-X2)*SINθ+(Y1-Y2)*COSθ Where θ = 60°, we can get X3=COSθ(X1-X2)-SINθ(Y1-Y2)+X2 Y3=SINθ(X1-X2)+COSθ(Y1-Y2)+Y2 That is, X3=1 / 2(X1-X2)-√3 / 2(Y1-Y2)+X2=1 / 2(X1+X2)-√3 / 2(Y1-Y2) Y3=√3 / 2(X1-X2)+1 / 2(Y1-Y2)+Y2=1 / 2(Y1+Y2)+√3 / 2(X1-X2).

[0028] Therefore, in the embodiment of the present invention, the visual camera only needs to capture the image information corresponding to any two placement holes, and the control device can determine the position information of each placement hole on the planetary wheel based on the image information, thereby reducing the frequency of movement of the combined robotic arm and the number of times the visual camera captures, thereby improving the speed and efficiency of visual positioning.

[0029] like Figure 5 As shown, a method for visual positioning of a wafer device provided by an embodiment of the present disclosure is applied to the above-mentioned system for visual positioning of a wafer device, and includes: Step 501: When the combined robotic arm is controlled to move to a first set position in the DSP area, the first current image information of the first placement hole on the planetary wheel taken by the visual camera is obtained, and, when the combined robotic arm is controlled to move to a second set position in the DSP area, the second current image information of the second placement hole on the planetary wheel taken by the visual camera is obtained.

[0030] When visual positioning is required, the DSP opens the cover, and the control device can control the combined mechanical arm to move to the first set position between the plate and the lower plate, so that the lens position of the visual camera matches the position of the first placement hole on the planetary wheel, and then the control device controls the visual camera to capture images and obtain the first current image information of the first placement hole captured by the visual camera. Then, the control device controls the combined mechanical arm to move to the second set position between the plate and the lower plate, so that the lens position of the visual camera matches the position of the second placement hole on the planetary wheel, and then the control device controls the visual camera to capture images and obtain the second current image information of the second placement hole captured by the visual camera.

[0031] Among them, the first set position and the second set position can be the saved coordinate position information of the corresponding combined robotic arm, that is, according to the saved first set coordinate position information of the combined robotic arm, the control device can control the combined robotic arm to move to the first set position in the DSP area. Similarly, according to the saved second set coordinate position information of the combined robotic arm, the control device can control the combined robotic arm to move to the second set position in the DSP area.

[0032] Step 502: Determine the position information of each placement hole on the planetary wheel according to the first current image information and the second current image information, wherein the planetary wheel includes three placement holes, and each placement hole carries a wafer.

[0033] In some embodiments, image recognition is performed based on the first current image information and the second current image information to obtain the first current position information of the first placement hole and the second current position information of the second placement hole; then, the third current position information of the third placement hole can be determined based on the positional relationship between the three placement holes on the planetary wheel, the first current position information, and the second current position information.

[0034] As described above, after the control device identifies the coordinate information A(X1, Y1) of the center A of the first placement hole and the coordinate information B(X2, Y2) of the center B of the second placement hole, the coordinate information C(X3, Y3) of the center C of the third placement hole can be calculated based on the equilateral triangle formed by the centers of the three placement holes on the planetary gear, where X3=1 / 2(X1-X2)-√3 / 2(Y1-Y2)+X2=1 / 2(X1+X2)-√3 / 2(Y1-Y2); Y3=√3 / 2(X1-X2)+1 / 2(Y1-Y2)+Y2=1 / 2(Y1+Y2)+√3 / 2(X1-X2).

[0035] In the embodiment of the present invention, during the processing of the wafer by the DSP device, the wafer rotates and revolves around a center point at the same time, that is, a uniform polishing effect is achieved through planetary motion to avoid uneven surface. Therefore, each time the DSP opens the cover and performs corresponding visual positioning, the large circle corresponding to the planetary wheel will be shifted as a whole, so points A, B, and C will also be displaced respectively. Therefore, after the control device moves the control combination mechanical arm to the first set position in the DSP area for the first time, and moves the control combination mechanical arm to the second set position in the DSP area for the first time, the visual camera can obtain the corresponding first initial image information and the second initial image information, and can determine the initial position information of each placement hole on the star wheel based on the first initial image information and the second initial image information, which are the initial coordinate information of the corresponding center of the circle, which can be A (X1, Y1), B (X2, Y2), C (X3, Y3).

[0036] In this way, after the control device controls the combined robotic arm to move to the first set position in the DSP area to obtain the first current image information, and the control device controls the combined robotic arm to move to the second set position in the DSP area to obtain the second current image information, the control device can obtain the corresponding position offset through image recognition and compare with the first initial image information and the second initial image information obtained by the first shooting, and can calculate the third position offset, that is, in some embodiments, determining the third current position information of the third placement hole includes: obtaining the first position offset between the first current position information and the saved first initial position information, and obtaining the second position offset between the second current position information and the saved second initial position information; according to the positional relationship between the three placement holes on the planetary wheel, and the first position offset and the second position offset, obtain the third position offset corresponding to the third placement hole.

[0037] Likewise, Figure 4 As shown, after the control device obtains the first current image information and the second current image information taken by the visual camera, it can obtain the first current position information and the second current position information, and then obtain the first position offset between the first current position information and the saved first initial position information, which are (ΔX1, ΔY1), and obtain the second position offset between the second current position information and the saved second initial position information, which are (ΔX2, ΔY2).

[0038] From the above, we can know that X3+ΔX3=1 / 2(X1+ΔX1+(X2+ΔX2))-√3 / 2(Y1+ΔY1-(Y2+ΔY2)); Y3+ΔY3=√3 / 2(X1+ΔX1+(X2+ΔX2))+1 / 2(Y1+ΔY1+(Y2+ΔY2)).

[0039] Therefore, ΔX3=1 / 2(X1+ΔX1+(X2+ΔX2))-√3 / 2(Y1+ΔY1-(Y2+ΔY2))-X3, that is, ΔX3=1 / 2(ΔX1+ΔX2)-√3 / 2(ΔY1-ΔY2).

[0040] Similarly, ΔY3=√3 / 2(X1+ΔX1+(X2+ΔX2))+1 / 2(Y1+ΔY1+(Y2+ΔY2))-Y3; thus, ΔY3=√3 / 2(X1+ΔX1+(X2+ΔX2 ))+1 / 2(Y1+ΔY1+(Y2+ΔY2))-(1 / 2(Y1+Y2)+√3 / 2(X1-X2)), that is, ΔY3=√3 / 2(ΔX1-ΔX2)+1 / 2(ΔY1+ΔY2) In this way, the third position offset (ΔX3, ΔY3) corresponding to the third placement hole can be obtained. In this way, the position information of each placement hole on the planetary wheel can also be determined through the offset, realizing the visual positioning in the DSP device.

[0041] It can be seen that in the embodiment of the present invention, each time the DSP device is visually positioned, the control device only needs to move the combined robotic arm twice and control the visual camera to take two shots, so as to determine the position information of the three placement holes on the planetary gear of the DSP device, thereby reducing the frequency of movement of the combined robotic arm and the number of shots of the visual camera, thereby improving the speed and efficiency of visual positioning.

[0042] The specific process of wafer equipment visual positioning is described below in conjunction with a specific implementation.

[0043] In this embodiment, the system for visual positioning of DSP equipment can be as described above, where the wafer clamping robot arm and the visual camera located in the waterproof cover are combined together to form a combined robot arm. The control device can be a PLC to control the operation of the combined robot arm, thereby driving the operation of the visual camera.

[0044] like Figure 6-1 , 6-2 As shown in the figure, the process of visual positioning of DSP equipment includes: Step 601: The DSP device starts this operation. When performing the first visual positioning, the PLC controls the combined robotic arm to move to the first set position in the DSP area according to the saved first set position coordinates.

[0045] Step 602: The PLC controls the visual camera to take pictures to obtain the first current image information of the first placement hole on the planetary gear.

[0046] Step 603: Determine whether the clarity of the first current image information is greater than the set clarity. If so, execute step 608; otherwise, execute step 604.

[0047] Step 604: The PLC moves the combined robotic arm outside the DSP area and controls the water injection joint to be in an open state so that clean water can flush the visual window.

[0048] Step 605: When the flushing time reaches the first set time, the PLC closes the water injection joint, moves the combined robotic arm to a wiping position that matches the wiper, and controls the wiper to wipe the visual window.

[0049] Step 606: When the wiping time reaches the second set time, the PLC controls the wiper to stop running and controls the dry gas connector to be in an open state, so that the dry gas is heated to dry the visual window.

[0050] Step 607: When the drying time reaches the third set time, the PLC controls the drying gas connector to be in a closed state, and controls the combined mechanical arm to move to the first set position in the DSP area according to the saved first set position coordinates. Return to step 602.

[0051] Step 608: The PLC determines the first current image information as the first initial image information, and controls the combined robotic arm to move to the second set position in the DSP area according to the saved second set position coordinates.

[0052] Step 609: The PLC controls the visual camera to take pictures, obtain the second current image information of the second placement hole on the planetary wheel, and determine it as the second initial image information.

[0053] Step 610: The PLC determines the first initial position information A (X1, Y1) of the center position of the first placement hole and the second initial position information B (X2, Y2) of the center position of the second placement hole according to the first initial image information and the second initial image information.

[0054] Step 611: PLC obtains the third initial position information C (X3, Y3) based on the first initial position information A (X1, Y1) and the second initial position information B (X2, Y2) through the equilateral triangle formed by the centers of the three placement holes on the planetary wheel.

[0055] Among them, X3=1 / 2(X1+X2)-√3 / 2(Y1-Y2); Y3= =1 / 2(Y1+Y2)+√3 / 2(X1-X2).

[0056] Step 612: When it is determined that this is not the first time that visual positioning is performed, the PLC controls the combined robotic arm to move to the first set position in the DSP area according to the saved first set position coordinates, and controls the visual camera to take pictures to obtain the first current image information of the first placement hole on the planetary gear.

[0057] Of course, during each visual positioning, an image clarity check may also be performed. The specific process is as described in steps 603-607 and will not be described in detail again.

[0058] Step 613: The PLC controls the combined robotic arm to move to the second set position in the DSP area according to the saved second set position coordinates, and controls the visual camera to take pictures to obtain the second current image information of the second placement hole on the planetary gear.

[0059] Step 614: The PLC performs image recognition based on the first current image information and the second current image information to obtain the first current position information of the first placement hole and the second current position information of the second placement hole.

[0060] Step 615: The PLC obtains a first position offset (ΔX1, ΔY1) between the first current position information and the stored first initial position information, and obtains a second position offset (ΔX2, ΔY2) between the second current position information and the stored second initial position information.

[0061] Step 616: The PLC obtains a third position offset (ΔX3, ΔY3) corresponding to the third placement hole according to the first position offset and the second position offset through an equilateral triangle formed by the centers of the three placement holes on the planetary wheel.

[0062] Among them, ΔX3=1 / 2(ΔX1+ΔX2)-√3 / 2(ΔY1-ΔY2); ΔY3=√3 / 2(ΔX1-ΔX2)+1 / 2(ΔY1+ΔY2).

[0063] Of course, when visual positioning is still required during the operation of the DSP device, the process can return to step 612 to continue to obtain the position offset each time and continue to perform corresponding positioning.

[0064] It can be seen that in the embodiment of the present invention, the PLC only needs to move the combined mechanical arm twice and control the visual camera to take two shots to determine the position information of the three placement holes on the planetary gear of the DSP device, which reduces the frequency of the combined mechanical arm movement and the number of visual camera shots, thereby improving the speed and efficiency of visual positioning. In addition, the PLC can also rinse and dry the visual window, further improving the accuracy of visual positioning and the intelligence of the system.

[0065] Combination Figure 7 , an embodiment of the present invention provides a device 700 for visual positioning of wafer equipment, comprising: The processor 1000 and the memory 1001 may also include a communication interface 1002 and a bus 1003. The processor 1000, the communication interface 1002, and the memory 1001 may communicate with each other through the bus 1003. The communication interface 1002 may be used for information transmission. The processor 1000 may call the logic instructions in the memory 1001 to execute the method for controlling semiconductor manufacturing equipment of the above embodiment.

[0066] In addition, the logic instructions in the above-mentioned memory 1001 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0067] The memory 1001 is a computer-readable storage medium that can be used to store software programs and computer executable programs, such as program instructions / modules corresponding to the method in the embodiment of the present invention. The processor 1000 executes functional applications and data processing by running the program instructions / modules stored in the memory 1001, that is, the method for visual positioning of wafer equipment in the above method embodiment is implemented.

[0068] The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function; the data storage area may store data created according to the use of the terminal device, etc. In addition, the memory 1001 may include a high-speed random access memory and may also include a non-volatile memory.

[0069] An embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, comprising: a processor and a memory storing program instructions, wherein the processor is configured to execute a method for visual positioning of a wafer device when executing the program instructions.

[0070] An embodiment of the present invention provides a storage medium storing program instructions, which, when run, execute the above-mentioned method for visual positioning of wafer equipment.

[0071] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0072] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0073] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0074] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A system for visual positioning of wafer equipment, characterized in that: include: Wafer gripping robot, visual camera in waterproof cover, control device, among which, The waterproof cover comprises a camera cover (401) and a camera lens cover (402), which are respectively combined with a wafer clamping mechanical arm (1) via a mounting plate (407) to form a combined mechanical arm, and the end surface of the camera lens cover (402) is provided with a visual window (405) that matches the position of the visual camera lens; A visual camera is configured to capture current image information of a wafer processing position in the wafer device through a visual window (405) when the combined robotic arm moves to a set position; The control device is configured to control the combined robotic arm to move and determine the position information of the wafer processing position based on the current image information obtained by the visual camera.

2. The system according to claim 1, characterized in that The camera lens cover (402) is provided with a positive pressure waterproof start connector (408) which is in a normally open state, so that compressed air enters the waterproof cover through the positive pressure waterproof start connector (408), and the air around the visual camera flows to the outside of the waterproof cover.

3. The system according to claim 1, characterized in that A water injection joint (409) is arranged on the camera lens cover (402); when the water injection joint (409) is in an open state, clean water is used to flush the visual window (405); A dry gas connector (410) is disposed on the camera lens cover (402). When the dry gas connector (410) is in an open state, the dry gas purges the visual window (405).

4. The system according to claim 3, characterized in that Also includes: The wiper is configured to wipe the visual window (405) when the combined mechanical arm moves to a wiping position matching the wiper.

5. The system according to any one of claims 1 to 4, characterized in that: The control device is configured to obtain first current image information of a first placement hole on the planetary wheel taken by a visual camera through a visual window (405) when the combined robotic arm is controlled to move to a first set position in the DSP area, and obtain second current image information of a second placement hole on the planetary wheel taken by the visual camera through a visual window (405) when the combined robotic arm is controlled to move to a second set position in the DSP area, and determine the position information of each placement hole on the planetary wheel based on the first current image information and the second current image information, wherein the planetary wheel includes three placement holes, and each placement hole carries a wafer.

6. The system according to claim 5, characterized in that The control device is specifically configured to perform image recognition based on the first current image information and the second current image information to obtain the first current position information of the first placement hole and the second current position information of the second placement hole, and determine the third current position information of the third placement hole based on the positional relationship of the three placement holes on the planetary wheel, the first current position information, and the second current position information.

7. A method for visual positioning of wafer equipment, characterized in that: The wafer holding robot arm and the waterproof cover with a built-in visual camera are combined together to form a combined robot arm. The method includes: When the combined robotic arm is controlled to move to a first set position in the DSP area, first current image information of a first placement hole on the planetary wheel taken by the visual camera is obtained, and, when the combined robotic arm is controlled to move to a second set position in the DSP area, second current image information of a second placement hole on the planetary wheel taken by the visual camera is obtained; According to the first current image information and the second current image information, the position information of each placement hole on the planetary wheel is determined, wherein the planetary wheel includes three placement holes, and each placement hole carries a wafer.

8. The method according to claim 7, characterized in that Determining the position information of each placement hole on the planetary wheel includes: Perform image recognition according to the first current image information and the second current image information to obtain first current position information of the first placement hole and second current position information of the second placement hole; The third current position information of the third placement hole is determined based on the positional relationship among the three placement holes on the planetary wheel, the first current position information, and the second current position information.

9. The method according to claim 7, characterized in that The determining of the third current position information of the third placement hole comprises: Obtaining a first position offset between the first current position information and the stored first initial position information, and obtaining a second position offset between the second current position information and the stored second initial position information; According to the positional relationship among the three placement holes on the planetary wheel, and the first position offset and the second position offset, a third position offset corresponding to the third placement hole is obtained.

10. A device for visual positioning of wafer equipment, comprising: The device includes a processor and a memory storing program instructions, wherein the processor is configured to execute the method for visual positioning of wafer equipment as described in claims 7-9 when executing the program instructions.

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