Heat dissipation device and electronic equipment

Abstract

A heat dissipation device (70) includes a plurality of heat pipes (73) including respective heat receiving portions (73a) located above an integrated circuit (50a) and thermally connected to the integrated circuit (50a), and a heat sink (71) connected to the plurality of heat pipes (73). The plurality of heat-receiving portions (73a) are aligned with each other in the left-right direction and are in contact with the heat-receiving portions (73a) of adjacent heat pipes (73). Each heat receiving portion (73a) has a first width (W1) in the vertical direction and a second width (W2) smaller than the width (W1) in the left-right direction. Therefore, the cooling performance of the integrated circuit can be improved.

Description

Heat dissipation devices and electronic equipment

[0001] This application is a divisional application of the invention patent application filed on March 25, 2021, with application number 202180018943.5 and title "Heat Dissipation Device and Electronic Equipment". Technical Field

[0002] This disclosure relates to techniques for improving the cooling performance of electronic devices. Background Technology

[0003] Electronic devices such as personal computers or game consoles typically include heat sinks and cooling fans as cooling devices for integrated circuits such as CPUs (Central Processing Units) or GPUs (Graphics Processing Units). In PCT patent publication WO2014 / 185311, the cooling fan and heat sink are arranged on the underside of the circuit board. Air supplied by the cooling fan is first supplied to the heat sink and then to a power supply unit located at the rear of the electronic device. After passing through the power supply unit, the air is exhausted to the rear of the electronic device. Recently, with the improvement of integrated circuit performance, the heat generated by integrated circuits has increased, and the size of the heat sink has increased to cope with the increased heat. Heat pipes are commonly used to transfer heat throughout the heat sink. Summary of the Invention

[0004] The heat dissipation device disclosed herein includes: a plurality of heat pipes, each including a heat-receiving portion located relative to the integrated circuit in a first direction and thermally connected to the integrated circuit; and at least one heat sink connected to the plurality of heat pipes. The heat-receiving portions of the plurality of heat pipes are aligned with each other in a second direction orthogonal to the first direction and are in contact with the heat-receiving portions of adjacent heat pipes. Each heat-receiving portion has a first width in the first direction and a second width less than the first width in the second direction. The electronic device disclosed herein includes the heat dissipation device. Using this heat dissipation device and electronic device, the cooling performance of the integrated circuit can be improved. Attached Figure Description

[0005] Figure 1A is a perspective view illustrating an example of an electronic device according to an embodiment of the present disclosure;

[0006] Figure 1B is a perspective view showing the electronic device;

[0007] Figure 1C is a front view showing the electronic device;

[0008] Figure 1D is a plan view showing the electronic device;

[0009] Figure 1E is a right-side view showing the electronic device;

[0010] Figure 1F is a left-side view showing the electronic device;

[0011] Figure 1G is a rear view showing the electronic device;

[0012] Figure 1H is a bottom view showing the electronic device;

[0013] Figure 2A is an exploded perspective view showing the main body of the device included in the electronic device, as well as the upper and lower external panels, in a disassembled state.

[0014] Figure 2B is an exploded perspective view showing the main body of the device included in the electronic device, as well as the upper and lower external panels, in a disassembled state.

[0015] Figure 3 is an exploded perspective view showing the internal components of an electronic device;

[0016] Figure 4 is an exploded perspective view of the housing and front cover included in the main body of the device;

[0017] Figure 5 is a perspective view showing the interior of the upper shell component;

[0018] Figure 6A is a plan view of the main body of the equipment;

[0019] Figure 6B is a plan view showing the positional relationship between the airflow channel and the components formed on the upper side of the circuit board;

[0020] Figure 7A is a sectional view of the main body of the equipment, which is obtained in the cutting plane represented by line VIIa-VIIa in Figure 6B;

[0021] Figure 7B is a sectional view of the main body of the equipment, which is obtained in the cutting plane represented by line VIIb-VIIb in Figure 6B;

[0022] Figure 7C is a sectional view of the main body of the equipment, which is obtained in the cutting plane represented by line VI1c-VI1c in Figure 6B;

[0023] Figure 8A is a bottom view of the main body of the equipment;

[0024] Figure 8B is a bottom view showing the positional relationship between the airflow channel and the components formed on the underside of the circuit board;

[0025] Figure 9 is a sectional view of the main body of the equipment, obtained in the cutting plane represented by line IX-IX in Figure 7A;

[0026] Figure 10A is a plan view of the fan shroud;

[0027] Figure 10B is a cross-sectional view of the fan shroud and cooling fan, which is represented by line Xb-Xb in Figure 10A;

[0028] Figure 11A is a perspective view of the power supply unit;

[0029] Figure 11B is a cross-sectional view of the intake wall and sidewalls;

[0030] Figure 12 is a sectional view of the main body of the device, obtained in the cutting plane represented by line XII-XII in Figure 6B;

[0031] Figure 13A is a plan view of a heat dissipation device disposed on the upper side of the circuit board, which is shown in Figure 3;

[0032] Figure 13B is a bottom view of the heat dissipation device shown in Figure 13A, in which the substrate supporting the fins is omitted;

[0033] Figure 14A is a cross-sectional view of the heat dissipation device and the circuit board, obtained in the cutting plane represented by line XIVa-XIVa in Figure 13A;

[0034] Figure 14B is a cross-sectional view of the heat dissipation device, obtained in the cutting plane represented by line XIVb-XIVb in Figure 13A;

[0035] Figure 14C is a cross-sectional view of the heat dissipation device and the circuit board, obtained in the cutting plane represented by line XIVc-XIVc in Figure 13B.

[0036] Figure 15 is a view showing the lower surface of the circuit board;

[0037] Figure 16A is a cross-sectional view of the circuit board and board shield, represented by line XVIa-XVIa in Figure 15, and shows the side surface of the heat dissipation device.

[0038] Figure 16B is a schematic diagram (plan view) of the heat dissipation device as seen from the circuit board side.

[0039] Figure 17A is a schematic diagram (plan view) of the modified heat dissipation device as seen from the circuit board side.

[0040] Figure 17B is a cross-sectional view obtained in the cutting plane indicated by line XVIIb-XVIIb in Figure 17A;

[0041] Figure 17C is a side view of the modified heat dissipation device;

[0042] Figure 18A is a cross-sectional view obtained in the cutting plane indicated by the line XVIIIa-XVIIIa in Figure 8A;

[0043] Figure 18B is a cross-sectional view obtained in the cutting plane represented by line XVIII b-XVIII in Figure 18A;

[0044] Figure 18C is a cross-sectional view obtained in the cutting plane represented by line XVIIIc-XVIIIc in Figure 18A;

[0045] Figure 19 is a plan view showing the memory housing, in which the plate shielding is depicted;

[0046] Figure 20A is a sectional view of the outer panel and housing, obtained in the cutting plane represented by line XXa-XXa in Figure 1D;

[0047] Figure 20B is a cross-sectional view of the outer panel and housing, obtained in the cutting plane represented by line XXb-XXb in Figure 1D;

[0048] Figure 21A is a cross-sectional view of the external panel and housing of an electronic device excluding the optical disc drive, wherein the cutting plane of the cross-sectional view is the same as the cutting plane represented by line XXa-XXa in Figure 1D.

[0049] Figure 21B is a cross-sectional view of the outer panel and housing shown in Figure 21A, wherein the cutting plane of this cross-sectional view is the same as the cutting plane shown by line XXb-XXb in Figure 1D;

[0050] Figure 21C is a front view of the electronic device shown in Figure 21A;

[0051] Figure 22 is a sectional view of the upper outer panel and the upper shell component, obtained in the cutting plane represented by line XX-XX in Figure 1D;

[0052] Figure 23 is a schematic diagram to help explain the attachment structure of the upper outer panel and the upper shell component;

[0053] Figure 24 is a perspective view that helps explain the modifications to the attachment structure of the upper outer panel and the upper shell component;

[0054] Figure 25 is a cross-sectional view of the electronic device, obtained in the cutting plane represented by the line XXV-XXV in Figure 1C;

[0055] Figure 26A is a plan view showing a modification of the heat dissipation device shown in Figure 13A;

[0056] Figure 26B is a side view of the heat dissipation device shown in Figure 26A, and is a view of the heat dissipation device viewed in the direction indicated by arrow XXVIb in the figure;

[0057] Figure 26C is a plan view of the heat dissipation device shown in Figure 26A, in which the heat sink is omitted;

[0058] Figure 27 is a plan view of the main body of the device including the heat dissipation device shown in Figure 26A;

[0059] Figure 28A is a plan view showing a variation of the heat dissipation device described with reference to Figures 6B and 13A to 14C, illustrating the positional relationship between the heat dissipation device, power supply unit, and cooling fan according to the variation.

[0060] Figure 28B is a perspective view of the heat dissipation device shown in Figure 28A;

[0061] Figure 28C is a cross-sectional view of the heat dissipation device, obtained in a cutting plane along the line XXVIIIc-XXVIIIc shown in Figure 28B. Detailed Implementation

[0062] Embodiments of the present disclosure will now be described with reference to the accompanying drawings. Figures 1A to 1H, etc., illustrate an electronic device 1 as an example of an embodiment. In the following description, X1 and X2 shown in Figures 1A to 1H will be set to the right and left directions, respectively; Y1 and Y2 will be set to the forward and backward directions, respectively; and Z1 and Z2 will be set to the upward and downward directions, respectively. However, these directions are defined to describe the shape, relative positional relationship, movement, etc., of the elements (components, parts, and portions) of the electronic device 1, and do not limit the posture of the electronic device 1 during use. For example, although Figure 1A, etc., shows the electronic device 1 in a horizontally placed posture, the electronic device 1 can be in a vertically placed posture during use. ("Vertical posture" is a posture in which the right or left surface of the electronic device 1 is lowered.)

[0063] Electronic device 1 is, for example, an entertainment device used as a gaming device or audiovisual device. Electronic device 1 outputs to a display device such as a television display data generated by executing a game program, video and audio data obtained via a network, and video and audio data obtained from a recording medium such as an optical disc. This electronic device may, for example, be a personal computer.

[0064] [Standard Configuration]

[0065] As shown in Figure 2A, the electronic device 1 includes a device body 10, an upper external panel 20A covering the upper side of the device body 10, and a lower external panel 20B covering the lower side of the device body 10. As shown in Figure 3, the device body 10 includes a circuit board 50, internal components such as a heat dissipation device 70, and a housing 30 housing the internal components. The housing 30 includes an upper housing member 30A covering the upper side of the circuit board 50 and a lower housing member 30B covering the lower side of the circuit board 50. These housings are joined together vertically. The upper housing member 30A forms the upper surface of the device body 10. The lower housing member 30B forms the lower surface of the device body 10. The upper external panel 20A can be detached from the upper housing member 30A. The lower external panel 20B can be detached from the lower housing member 30B. The external panels 20A and 20B, as well as the housing members 30A and 30B, comprise resins such as acrylonitrile-butadiene-styrene (ABS) resin or polycarbonate.

[0066] As shown in Figure 1A, the device body 10 may have a power button 2a and a CD eject button 2b on its front surface. The device body 10 may also have connectors 3a and 3b on its front surface. In addition, the device body 10 may have connectors 4a to 4e on its rear surface (see Figure 1G).

[0067] As shown in Figure 3, in addition to the circuit board 50 and the power supply unit 60, the main body 10 of the device also includes a cooling fan 5, a heat dissipation device 70, and an optical disc drive 6 as internal components. As described below, the heat dissipation device 70 includes heat sinks 71 and 72 (see Figure 6B) and heat pipes 73A to 73F (see Figure 13B). The upper surface of the circuit board 50 is covered by an upper shield 51, which blocks electromagnetic waves from electronic components mounted on the upper surface. The lower surface of the circuit board 50 is covered by a lower shield 52, which blocks electromagnetic waves from electronic components mounted on the lower surface. Shields 51 and 52 are attached to the upper and lower surfaces of the circuit board 50, respectively. Shields 51 and 52 are metal plates. The material of the metal plates can be, for example, iron, stainless steel, aluminum, etc.

[0068] [Component Layout Overview]

[0069] The power supply unit 60 and the heat sink 70 are disposed, for example, on the upper side of the circuit board 50 (more specifically, on the upper side of the upper shield 51). An integrated circuit 50a (see FIG. 3), serving as a central processing unit (CPU), graphics processing unit (GPU), etc., is mounted on the upper surface of the circuit board 50. The integrated circuit 50a is a heat-generating device and is connected to the heat sink 70. The power supply unit 60 is also a heat-generating device. Airflow generated by the cooling fan 5 is supplied to the heat sink 70 and the power supply unit 60. The layout of internal devices such as the heat sink 70, the power supply unit 60, and the cooling fan 5 is not limited to the example of the electronic device 1.

[0070] An optical disc drive 6 is disposed, for example, on the underside of the circuit board 50 (more specifically, on the underside of the lower shield 52). A heat sink 80 (see FIG. 7A) may be disposed on the underside of the circuit board 50. Electronic components (e.g., power transistors that generate drive power for integrated circuit 50a) are mounted on the lower surface of the circuit board 50. The heat sink 80 may be connected to these electronic components.

[0071] [Cooling Fan]

[0072] As shown in Figure 7A, the cooling fan 5 is configured such that its rotation center line Cf is along the thickness direction of the circuit board 50 (the vertical direction in the electronic device 1). Furthermore, the cooling fan 5 is located on the outer side of the outer edge of the circuit board 50. For example, the cooling fan 5 is located on the right side of the right edge of the circuit board 50. In this description, the vertical direction of the electronic device 1 is along the normal to the circuit board 50. Moreover, the directions mentioned in this specification do not limit the orientation of the electronic device 1 during use. Therefore, when the electronic device 1 is positioned vertically, for example, the rotation center line Cf of the cooling fan 5 is a line along the horizontal direction.

[0073] The cooling fan 5 may have a portion located above the horizontal plane Hp1 including the circuit board 50 and a portion located below the horizontal plane Hp1 including the circuit board 50. More specifically, the plurality of fins 5a rotating about the rotation center line Cf may each have a portion 5b located above the horizontal plane Hp1 and a portion 5c located below the horizontal plane Hp1. This arrangement of the cooling fan 5 can generate an airflow F1 along the upper surface of the circuit board 50 and an airflow F2 along the lower surface of the circuit board 50. Therefore, heat-generating devices arranged or mounted on the upper side of the circuit board 50 and heat-generating devices arranged or mounted on the lower side of the circuit board 50 can be cooled without increasing the number of components.

[0074] As shown in Figure 2A, the upper housing member 30A has an upper inlet 31a located above the cooling fan 5. As shown in Figure 2B, the lower housing member 30B has a lower inlet 31b located below the cooling fan 5. By forming inlets 31a and 31b in the upper and lower surfaces of the housing 30 respectively, air can be effectively drawn into the interior of the housing 30.

[0075] The heat generated by the heating elements arranged on the upper surface of the circuit board 50 can be greater than the heat generated by the heating elements arranged on the lower surface of the circuit board 50. For example, the total heat generated by the integrated circuit 50a and the power supply unit 60 arranged on the upper surface of the circuit board 50 can be greater than the total heat generated by the electronic components 50c (e.g., power transistors and integrated circuits, such as memory) arranged on the lower surface of the circuit board 50. When the heating elements are arranged in this way, the center Ch of the cooling fan 5 in the vertical direction can be located above the horizontal plane Hp1 including the circuit board 50, as shown in FIG7A. This allows a large amount of air to be supplied to the devices that generate a large amount of heat.

[0076] As shown in Figure 7A, the distance D5 between the upper inlet 31a and the lower inlet 31b corresponds to the width of the cooling fan 5 in the vertical direction. Therefore, air is drawn in from inlets 31a and 31b and flows smoothly in the radial direction of the cooling fan 5. In the example of the electronic device 1, the lower part of the cooling fan 5 (specifically, the substrate 5d, see Figure 3) is attached to the edge of the lower inlet 31b. On the other hand, the upper end of the cooling fan 5 (specifically, the upper end of the rotor 5e) is located at approximately the same height as the edge of the inlet 31a.

[0077] The vertical distance between the upper housing member 30A and the lower housing member 30B at the locations of inlets 31a and 31b, i.e., the distance D5 between inlets 31a and 31b (see Figure 7A), can be smaller than the distance between the upper housing member 30A and the lower housing member 30B at other locations. In the example of electronic device 1, the upper housing member 30A has a recessed plate portion 32a in its upper surface (see Figure 2A). The recessed plate portion 32a is recessed into the circuit board 50 side relative to another portion 32c in the upper surface. (In the description here, the other portion 32c will be referred to as the "main board portion".) The upper inlet 31a is formed in the recessed plate portion 32a. A heat dissipation device 70, a power supply unit 60, etc., are arranged between the main board portion 32c and the circuit board 50.

[0078] Similar to the upper housing member 30A, the lower housing member 30B has a recessed plate portion 32b in its lower surface. As shown in FIG2B, the recessed plate portion 32b is recessed relative to another portion 32d in the lower surface. (In this description, the other portion 32d will be referred to as the "main board portion".) A lower inlet 31b is formed in the recessed plate portion 32b. The fins 81 of the heat dissipation device 80 (see FIGS. 8A and 8B) are arranged between the main board portion 32d and the circuit board 50.

[0079] Then, the distance between the upper and lower recessed plate portions 32a and 32b corresponds to the height of the cooling fan 5. This structure ensures sufficient distance between the upper and lower motherboard portions 32c and 32d, and sufficient space for the heat dissipation devices 70 and 80 arranged between the upper and lower motherboard portions 32c and 32d, while also ensuring that the distance between the inlets 31a and 31b corresponds to the height of the cooling fan 5.

[0080] As shown in Figure 3, the cooling fan 5 includes a rotor 5e with multiple fins 5a and a base plate 5d supporting the rotor 5e. The rotor 5e is rotatable relative to the base plate 5d. As shown in Figure 8B, the base plate 5d may, for example, have an annular peripheral portion 5f, a central portion 5g located inside the peripheral portion 5f, and a bridge 5i connecting the peripheral portion 5f and the central portion 5g to each other. This base plate 5d can be attached to the lower housing member 30B. Specifically, the annular peripheral portion 5f can be attached to the edge of the lower inlet 31b.

[0081] Because the substrate 5d is located below the cooling fan 5, the air resistance at the top of the cooling fan 5 is less than the air resistance at the bottom. As described above, the heat generated by the heating device arranged on the upper surface of the circuit board 50 is greater than the heat generated by the heating device arranged on the lower surface of the circuit board 50. That is, the cooling fan 5 is configured such that the upper part of the cooling fan 5 with low air resistance corresponds to a flow channel in which a device that generates a large amount of heat is arranged.

[0082] The circuit board 50 may have a curved edge 50b (see Figure 15) as the right edge of the circuit board 50. A cooling fan 5 is disposed inside the curved edge 50b. With this arrangement of the circuit board 50 and the cooling fan 5, airflow can be generated on both the upper and lower surfaces of the circuit board 50, while suppressing the increase in size of the electronic device 1.

[0083] [Positioning relationship between cooling fan and heatsink]

[0084] The power supply unit 60 and the heat dissipation device 70 can be arranged side-by-side in the left-right direction. For example, as shown in FIG6B, the first heat sink 71 is located on the right side of the power supply unit 60. The cooling fan 5 can be arranged such that the centerline Cf of the cooling fan 5 is located to the right of the right end of the first heat sink 71. In the example of the electronic device 1, the entire cooling fan 5 is located to the right of the right end of the first heat sink 71. According to this arrangement, even if the front-back dimension of the first heat sink 71 increases, the first heat sink 71 and the cooling fan 5 will not interfere with each other. Therefore, the increase in the front-back dimension of the entire electronic device 1 can be suppressed while ensuring sufficient size of the first heat sink 71 in the front-back direction. In the description here, the front-back direction of the heat sink 71 is the direction in which air passes through the heat sink 71. The left-right direction is the direction orthogonal to the direction in which air passes through the heat sink 71. Furthermore, the directions mentioned in this specification do not limit the orientation of the electronic device 1 during use. Therefore, for example, the power supply unit 60 and the heat dissipation device 70 can be arranged adjacent to each other in the front-back direction, and the cooling fan 5 and the heat sink 71 can also be arranged adjacent to each other in the front-back direction. In this case, the dimensions of the radiator 71 in the left-right direction can be increased.

[0085] As shown in Figure 6B, the cooling fan 5 is located behind the front end 61n of the power supply unit housing 61, which will be described later. Furthermore, the centerline Cf of the cooling fan 5 is located behind the front end of the first heatsink 71.

[0086] As shown in Figure 6B, the second radiator 72 (heat dissipation device) can be located to the right of the first radiator 71. Then, at least a portion of the cooling fan 5 can be located in front of the second radiator 72. With this arrangement of the cooling fan 5 and the second radiator 72, the air flowing backward from the cooling fan 5 can also be used effectively.

[0087] As shown in Figure 6B, the width of the second heat sink 72 in the front-to-back direction can be smaller than the width of the first heat sink 71 in the front-to-back direction. Then, the cooling fan 5 can be positioned in front of the second heat sink 72. With this arrangement of the heat sinks 71 and 72 and the cooling fan 5, the air flowing backward from the cooling fan 5 can be effectively utilized, while suppressing the increase in the front-to-back dimension of the electronic device 1.

[0088] As will be explained in detail later, the heat dissipation device 70 has a plurality of heat pipes 73A to 73F (see Figure 13B). The two heat sinks 71 and 72 are thermally connected to each other via the plurality of heat pipes 73. In addition, the two heat sinks 71 and 72 are fixed to a common substrate 75 (see Figure 13A).

[0089] Incidentally, unlike the example of electronic device 1, the first heat sink 71 and the second heat sink 72 may not be connected to each other via a heat transfer device such as a heat pipe. For example, the second heat sink 72 may be used to cool heat-generating components (e.g., electronic components) that are different from the integrated circuit 50a to which the first heat sink 71 is connected. Additionally, components located to the right of the first heat sink 71 and behind the cooling fan 5 may not be heat sink 72. For example, the heat-generating component to be cooled (e.g., electronic component) may be located behind the cooling fan 5.

[0090] [Airflow channel between the housing and the outer panel]

[0091] The upper surface of the housing 30 is covered by the upper outer panel 20A. A gap Ua (see FIG. 20A) allowing airflow to the upper inlet 31a can be formed between the upper surface of the housing 30 and the upper outer panel 20A. (The gap Ua will be referred to as the upper flow channel below.) As described above, the upper surface of the upper housing member 30A has a recessed plate portion 32a (see FIG. 2A) that is recessed relative to the main plate portion 32c. The recessed plate portion 32a is formed, for example, at the right front portion of the upper housing member 30A, and the upper inlet 31a is formed in the recessed plate portion 32a. For example, the upper flow channel Ua is fixed between the recessed plate portion 32a and the upper outer panel 20A.

[0092] The upper flow channel Ua may, for example, open towards the front and / or right side of the electronic device 1. That is, an inlet may be provided between the front edge of the upper surface of the upper housing member 30A (specifically, the front edge of the recessed plate portion 32a) and the front edge of the upper outer panel 20A, or an inlet may be provided between the right edge of the upper surface of the upper housing member 30A (specifically, the right edge of the recessed plate portion 32a) and the right edge of the upper outer panel 20A. In the example of the electronic device 1, as shown in Figures 1C and 1E, an inlet Ea is provided extending from the upper surface of the upper housing member 30A and the front edge of the upper outer panel 20A to the right edge of the upper outer panel 20A. The inlet Ea may, for example, extend from the center of the front edge of the upper outer panel 20A in a left-right direction to the rear portion of the right edge of the upper outer panel 20A. The upper housing member 30A may have louvers 33A in the inlet Ea.

[0093] The lower surface of the housing 30 is covered by the lower outer panel 20B. The lower surface of the housing 30 and the lower outer panel 20B of the electronic device 1 may have the same structure as the housing 30 and the upper outer panel 20A described above.

[0094] In other words, a gap Ub (see FIG. 20A) allowing airflow to the lower inlet 31b can be formed between the lower surface of the housing 30 and the lower outer panel 20B. (The gap Ub will be referred to as the lower flow channel Ub below.) As described above, the lower surface of the lower housing member 30B has a recessed plate portion 32b (see FIG. 2b) that is recessed relative to the main plate portion 32d. The recessed plate portion 32b is formed, for example, at the right front portion of the lower housing member 30B, and the lower inlet 31b is formed in the recessed plate portion 32b. For example, the lower flow channel Ub is fixed between the recessed plate portion 32b and the lower outer panel 20B.

[0095] The lower flow channel Ub can also be open, for example, toward the front and / or right side of the electronic device 1. That is, the inlet can be located between the front edge of the lower surface of the lower housing member 30B (specifically, the front edge of the recessed plate portion 32b) and the front edge of the lower outer panel 20B, or the inlet can be located between the right edge of the lower surface of the lower housing member 30B (specifically, the right edge of the recessed plate portion 32b) and the right edge of the lower outer panel 20B. In the example of the electronic device 1, as shown in Figures 1C and 1E, an inlet Eb is provided extending from the lower surface of the lower housing member 30B and the front edge of the lower outer panel 20B to the right edge of the lower outer panel 20B. The inlet Eb can, for example, extend from the center of the front edge of the lower outer panel 20B in a left-right direction to the rear portion of the right edge of the lower outer panel 20B. The lower housing member 30B can have a louver 33B in the inlet Eb.

[0096] The portion of the upper surface of the upper housing member 30A, excluding the recessed plate portion 32a, namely the main board portion 32c, is close to the upper outer panel 20A. The main board portion 32c and the upper outer panel 20A may contact each other, or a gap may be formed between the main board portion 32c and the upper outer panel 20A, the gap having a width in the vertical direction smaller than that of the upper flow channel Ua.

[0097] Airflow generated by driving the cooling fan 5 is discharged rearward from the exhaust port M (see Figures 1G and 6A) formed in the rear surface of the housing 30. Louvers 33C and 33D may be formed in the exhaust port M. As shown in Figure 2A, the main board portion 32c may have a portion 32e located behind the recessed plate portion 32a. According to this structure, the main board portion 32c can prevent the air discharged rearward from the exhaust port M from flowing back to the inlet 31a.

[0098] The lower surface of the lower housing member 30B, excluding the recessed plate portion 32b, i.e., the main plate portion 32d, is close to the lower outer panel 20B. The main plate portion 32d and the lower outer panel 20B can contact each other, or a gap can be formed between them, the gap having a width smaller in the vertical direction than the lower flow channel Ub. As shown in Figure 2B, the main plate portion 32d may have a portion 32f located behind the recessed plate portion 32b. With this structure, the main plate portion 32d can prevent air discharged rearward from the exhaust port M from flowing back towards the inlet 31b.

[0099] The outer surface of the electronic device 1 is curved, increasing the vertical width of the electronic device 1 in the front right portion where inlets 31a and 31b are formed. In other words, the outer panels 20A and 20B are curved, increasing the distance between them in the front right portion of the electronic device 1. This external shape of the electronic device 1 facilitates ensuring sufficient vertical width of the aforementioned flow channels Ua and Ub. The curvature of the outer panels 20A and 20B will be explained in detail later.

[0100] Incidentally, the locations of the inlets 31a and 31b formed in the housing 30, and the locations of the inlets Ea and Eb formed between the housing 30 and the outer panels 20A and 20B, are not limited to the example shown in the electronic device 1. For example, inlets 31a and 31b may be formed on the left side portion of the housing 30. Furthermore, inlets 31a and 31b may be formed only on the upper or lower surface of the housing 30. The locations of inlets Ea and Eb can be appropriately varied depending on the locations of inlets 31a and 31b.

[0101] As shown in Figure 6A, the electronic device 1 may have a fan shroud 38A, which is attached to the edge of the inlet 31a and covers the upper side of the cooling fan 5. Similarly, the electronic device 1 may have a fan shroud 38B, which is attached to the edge of the inlet 31b and covers the lower side of the cooling fan 5.

[0102] As shown in Figure 10A, the fan shroud 38A includes multiple rings 38a, a central portion 38b located at the center of the multiple rings 38a, and multiple spokes 38c extending from the outer rings 38a to the central portion 38b. In the example of the electronic device 1, the cooling fan 5 rotates clockwise in the plan view. The spokes 38c are tilted so as to be in the same direction of rotation as the cooling fan 5. Specifically, the spokes 38c are tilted relative to the radial direction so as to advance clockwise toward the center Cf. According to this structure, the spokes 38c can avoid becoming a source of air resistance.

[0103] As shown in Figure 10B, the positions of the multiple rings 38a and the central portion 38b rise towards the center Cf. Furthermore, the spokes 38c extend obliquely to rise towards the center Cf. This increases the area of ​​the opening formed between the rings 38a and the spokes 38c.

[0104] As described above, the spokes 38c extend obliquely, thus rising towards the center Cf. On the other hand, each ring 38a may have a cross-section along a plane perpendicular to the rotation center line Cf of the cooling fan 5 (plane Hp5 in FIG. 10B). This increases the area of ​​the opening formed between the rings 38a and the spokes 38c. An upper outer panel 20A is disposed on the upper side of the fan shroud 38A. As described above, the upper outer panel 20A is curved. The fan shroud 38A may be curved in accordance with the curvature of the upper outer panel 20A.

[0105] The fan shroud 38B covering the lower side of the cooling fan 5 can have the same structure as the upper fan shroud 38A. That is, the fan shroud 38B can be obtained by inverting the upper and lower surfaces of the fan shroud 38A.

[0106] [Power Supply Unit]

[0107] As shown in Figure 7B, the power supply unit 60 includes a power supply circuit 62 and a power supply unit housing 61 that houses the power supply circuit 62. The power supply unit housing 61 has a wall portion 61a located in front of the first heat sink 71. A plurality of air inlets 61b may be formed in the wall portion 61a. (The wall portion 61a will be referred to as the "air inlet wall" below.) As shown in Figure 6B, the heat sinks 71 and 72 have a plurality of fins 71a and 72a arranged side by side in the left-right direction. Therefore, air passes through the heat sinks 71 and 72 in the front-back direction. The air inlet wall 61a is inclined relative to the front-back direction and the left-right direction. The outer surface of the air inlet wall 61a faces the first heat sink 71. Here, "the outer surface of the air inlet wall 61a faces the first heat sink 71" means that a straight line extending from the outer surface and perpendicular to the outer surface intersects the first heat sink 71. A cooling fan 5 is configured to deliver air to the air inlet wall 61a. In the example of the electronic device 1, the cooling fan 5 is separated to the right from the outer surface of the air inlet wall 61a. The airflow from the cooling fan 5 to the intake wall 61a is formed by the flow channel walls 34A and 34B, which will be described later.

[0108] As shown in FIG6B, depending on the shape and arrangement of the power unit housing 61, a portion of the air reaching the intake wall 61a passes through the intake hole 61b and enters the interior of the power unit housing 61. Additionally, another portion of the air reaching the intake wall 61a moves to the first heat sink 71 while being guided by the intake wall 61a. That is, the intake wall 61a ensures that the airflow supplied to the first heat sink 71 is simultaneously cooled by cold air (air not heated by another heat-generating or heat-dissipating device). When the power unit 60 can be cooled by cold air, the gap between the circuit portions 62a and 62b (e.g., transformer and capacitor) included in the power circuit 62 can be reduced, allowing for miniaturization of the power unit 60.

[0109] The power supply unit housing 61 includes a rear portion 61c located to the left of the first heat sink 71 and a front portion 61d extending forward beyond the front end of the first heat sink 71. In the example of the electronic device 1, the air intake wall 61a is the right side wall of the front portion 61d and extends forward and to the right from the right side wall 61f of the rear portion 61c. On the other hand, the left side wall 61e of the power supply unit housing 61 extends forward from the rear portion 61c to the front portion 61d in a straight line. Therefore, the width of the front portion 61d gradually increases forward in the left-right direction.

[0110] As shown in Figure 11B, the air intake 61b can be formed at an angle relative to the air intake wall 61a. That is, the centerline Ch1 of the air intake 61b can be inclined relative to the air intake wall 61a. For example, the centerline Ch1 of the air intake 61b can be along the left-right direction. This makes it easier for the air exhausted from the cooling fan 5 to pass through the air intake wall 61a. Incidentally, the structure of the air intake 61b is not limited to the example of the electronic device 1. The centerline Ch1 of the air intake 61b can be inclined relative to the left-right and front-back directions in accordance with the airflow direction. For example, the centerline Ch1 can extend forward and to the right from the air intake wall 61a.

[0111] As shown in Figures 11A and 11B, the air inlet 61m can also be formed in the right side wall 61f of the rear portion 61c of the housing. In this case, the direction in which the air inlet 61m penetrates the right side wall 61f, i.e., the direction of the centerline Ch2 of the air inlet 61m, can be the same as the direction of the air inlet 61b in the air inlet wall 61a. This can facilitate the formation of both types of air inlets 61b and 61m.

[0112] As shown in Figure 7B, a portion of the power supply circuit 62 can be disposed in the space within the front portion 61d of the housing and fixed by the inclination of the air intake wall 61a, i.e., a space Sf (see Figure 6B) is formed inside the air intake wall 61a. The circuit portion 62b included in the power supply circuit 62 is accommodated in this space and is located in front of the first heat sink 71. With this layout, the volume of the power supply unit housing 61 can be effectively utilized.

[0113] The circuit portion 62b, arranged in the space formed on the inner side of the air intake wall 61a, can have a smaller size than the other portions 62a. This can facilitate airflow within the power unit housing 61.

[0114] Multiple vents 61g and 61h can be formed in the rear portion 61c of the housing. More specifically, as shown in FIG7C, multiple vents 61g can be formed in the rear wall 61i of the rear portion 61c of the housing, and multiple vents 61h can be formed in the rear portion 61k of the upper wall 61j of the power unit housing 61. In the example of the electronic device 1, the rear portion 61k of the upper wall 61j is recessed relative to the front portion of the upper wall 61j. Due to this recess, the airflow channel Se is fixed between the upper housing member 30A and the rear portion 61k.

[0115] The positions of the vents 61g and 61h are not limited to the example shown in the electronic device 1. For example, the vent 61h formed in the upper wall 61j may not exist. Multiple vents may be formed in the last part of the left side wall 61e.

[0116] [Flow channel wall that defines the airflow channel]

[0117] The heat dissipation device 70 includes a first heat sink 71 and a second heat sink 72 arranged side-by-side in a left-right direction. A cooling fan 5 is located in front of the second heat sink 72. As shown in Figures 4 and 6B, the upper housing member 30A may have a flow channel wall 34A that defines a flow channel for airflow from the cooling fan 5 and directs the airflow to the first heat sink 71. The flow channel wall 34A has a portion that curves along the outer periphery of the cooling fan 5. In the example of the electronic device 1, the entire flow channel wall 34A is curved.

[0118] As shown in Figure 6B, as the distance from the starting point 34A of the flow channel wall 34a increases in the extending direction of the flow channel wall 34A, the distance from the cooling fan 5 to the flow channel wall 34A (the distance in the radial direction of the cooling fan 5) also increases. The flow channel wall 34A extends from the periphery of the cooling fan 5 towards the air intake wall 61a of the power unit housing 61. The air intake wall 61a is located on the extension of the end 34b of the flow channel wall 34A. This flow channel wall 34A allows air from the cooling fan 5 to be smoothly delivered to the air intake wall 61a.

[0119] The intake wall 61a can be curved similarly to the flow channel wall 34A. For example, the flow channel wall 34A is formed along a curve defined by a predetermined function. The intake wall 61a can be arranged along the same curve. For example, the flow channel wall 34A is formed along a spiral curve with the rotation center line Cf of the cooling fan 5 as the origin. In this case, the intake wall 61a can also be curved along the same spiral curve. Therefore, a smooth airflow is formed from the cooling fan 5 to the intake wall 61a and the first radiator 71. Incidentally, the curves on which the curvature of the flow channel wall 34A and the intake wall 61a is based can be, for example, an involute, a logarithmic spiral, a Nelson spiral, etc., rather than a spiral curve.

[0120] The flow channel wall 34A surrounds the periphery of the cooling fan 5 located outside the outer edge of the circuit board 50. The flow channel wall 34A extends downward from the portion forming the upper surface of the device body 10 in the upper housing member 30A (this portion is the recessed plate portion 32a in the example of the electronic device 1). The lower edge of the flow channel wall 34A can reach the lower housing member 30B.

[0121] In the example of electronic device 1, as shown in Figures 4 and 8B, an upwardly projecting flow channel wall 34B is formed on the lower housing member 30B. Similar to flow channel wall 34A, flow channel wall 34B defines a flow channel for the airflow delivered from the cooling fan 5. Flow channel wall 34B has a portion that curves along the periphery of the cooling fan 5. In the example of electronic device 1, similar to flow channel wall 34A, the entire flow channel wall 34B is curved.

[0122] As shown in Figure 7B, the lower edge of the flow channel wall 34A of the upper housing member 30A is connected in the vertical direction to the flow channel wall 34B of the lower housing member 30B. Flow channel walls 34A and 34B are connected to each other to form a wall extending along the periphery of the cooling fan 5. In the example of the electronic device 1, flow channel walls 34A and 34B serve as walls on the front side of the cooling fan 5.

[0123] The structure of the flow channel walls 34A and 34B is not limited to the example of the electronic device 1. For example, only the upper housing member 30A or the lower housing member 30B may have a flow channel wall formed thereon. Then, the flow channel wall formed on one housing member may extend upward or downward until it reaches the other housing member.

[0124] As shown in Figure 4, the electronic device 1 has a front external panel 35 that covers the flow channel walls 34A and 34B, which are part of the external components. The front external panel 35 is located on the front and right sides of the curved flow channel walls 34A and 34B and covers the entire flow channel walls 34A and 34B. Due to the presence of the front external panel 35, the shape of the flow channel walls 34A and 34B can be freely adjusted. A circuit board equipped with switches operated by a power button 2a and a CD eject button 2b can be attached to the front external panel 35, or a circuit board equipped with connectors 3a and 3b can be attached to the front external panel 35.

[0125] [Airflow channel on the underside of the circuit board]

[0126] As described above, the power supply unit 60 and the heat dissipation device 70 are arranged on the upper surface of the circuit board 50, and the power supply unit 60 and the heat dissipation device 70 are side by side with each other in the left-right direction. Air delivered from the cooling fan 5 passes through the heat dissipation device 70 and the power supply unit housing 61. Therefore, airflow is formed throughout the entire space between the circuit board 50 and the upper housing member 30A. On the other hand, a member that reduces the width of the airflow channel between the circuit board 50 and the lower housing member 30B can be provided on the lower side of the circuit board 50. Then, the width of the airflow channel between the lower surface of the circuit board 50 and the lower housing member 30B can be narrower than the width of the airflow channel between the upper surface of the circuit board 50 and the upper housing member 30A. This helps to ensure the velocity of the airflow formed on the lower side of the circuit board 50.

[0127] In the example of electronic device 1, the optical disc drive 6 is disposed on the underside of the circuit board 50. The optical disc drive 6 reduces the width of the airflow channel between the circuit board 50 and the lower housing member 30B.

[0128] As shown in Figure 8B, from the plan view of the electronic device 1, the optical disc drive 6 is separated from the cooling fan 5 to the left. The optical disc drive 6 has a disc drive housing 6a. The spindle motor (not shown), pickup module (not shown), etc., for rotating the optical disc are arranged inside the disc drive housing 6a.

[0129] As shown in Figure 8B, an airflow channel Sb from the cooling fan 5 to the exhaust port M (see Figure 8A) is formed between the cooling fan 5 and the disk drive housing 6a. The disk drive housing 6a confines the airflow channel Sb to the right side region of the circuit board 50. The disk drive housing 6a has a right side wall 6b facing the cooling fan 5, which extends in the front-rear direction at a position separated from the cooling fan 5 to the left. The airflow channel Sb is formed between the right side wall 6b and the cooling fan 5. A plurality of fins 81 included in the heat dissipation device 80 are arranged at the midpoint of the airflow channel Sb.

[0130] The wall defining the airflow channel Sb can be formed on the lower housing member 30B. For example, as shown in Figures 4 and 8B, the lower housing member 30B can have a flow channel wall 34c extending from the periphery of the cooling fan 5 toward the heat dissipation device 80. In the example of the electronic device 1, the flow channel wall 34c extends toward the heat dissipation device 80 from the starting point of the aforementioned flow channel wall 34B, which bends on the periphery of the cooling fan 5.

[0131] Incidentally, electronic device 1 may not have an optical disc drive 6. In this case, the wall can restrict the airflow channel Sb. The wall portion formed on the lower housing member 30B can be used as a member that reduces the width of the airflow channel between the circuit board 50 and the lower housing member 30B compared to the airflow channel between the circuit board 50 and the upper housing member 30A.

[0132] As shown in Figure 4, an opening 30c, corresponding in size and shape to the disk drive housing 6a, is formed in the lower housing member 30B. The lower surface of the disk drive housing 6a can be exposed downwards through the opening 30c. With this structure, the width of the electronic device 1 in the vertical direction is reduced, thus decreasing the thickness of the lower housing member 30B.

[0133] [Dust Collection Room]

[0134] As shown in Figure 6B, the dust collection chamber Ds can be disposed on the flow channel wall 34A. The dust collection chamber Ds captures dust contained in the airflow formed above the circuit board 50 and collects the captured dust. With this structure, the amount of dust entering devices arranged downstream of the dust collection chamber Ds can be reduced, such as the first heat sink 71, the power supply unit 60, etc.

[0135] The dust collection chamber Ds is defined by the dust collection chamber wall 34C (see Figure 5). The dust collection chamber wall 34C is box-shaped with openings in two directions, which will be described later. The dust collection chamber wall 34C is integrally formed, for example, with the upper housing member 30A. This allows the dust collection chamber Ds to be secured without increasing the number of parts. Furthermore, since the upper housing member 30A is the member that covers the entire internal device, the positional freedom of the dust collection chamber Ds can be ensured when the dust collection chamber wall 34C is integrally formed with the upper housing member 30A.

[0136] In the plan view of electronic device 1, the cooling fan 5 rotates clockwise around the rotation center line Cf. In the example of electronic device 1, the flow channel wall 34A extends clockwise from its starting point 34a along the periphery of the cooling fan 5. The entire flow channel wall 34A is curved. The dust collection chamber Ds can be positioned to this curved flow channel wall 34A. More specifically, the dust collection chamber Ds can be located at the end of the flow channel wall 34A. The location of the dust collection chamber Ds is not limited to the example of electronic device 1. The dust collection chamber Ds can be positioned at the midpoint of the flow channel wall 34A.

[0137] Two devices, each a heat-generating or heat-dissipating device, can be positioned downstream of the airflow channel formed by the flow channel wall 34A. A dust collection chamber Ds can be located upstream of both devices. In the example of electronic device 1, the power supply unit 60 and the first heat sink 71 are located downstream of the airflow channel defined by the flow channel wall 34A. The dust collection chamber Ds is located upstream of the power supply unit 60 and the first heat sink 71. In this way, dust can be prevented from being sent to both devices through a single dust collection chamber Ds. In the example of electronic device 1, the dust collection chamber Ds is located between the air inlet wall 61a of the power supply unit housing 61 and the flow channel wall 34A.

[0138] As shown in Figure 12, the dust collection chamber Ds has a first opening A1 that opens along the circuit board 50 toward the airflow passage Sa defined by the flow channel wall 34A and the air inlet wall 61a. Dust contained in the air flowing through the airflow passage Sa is captured into the dust collection chamber Ds through the first opening A1. The dust collection chamber Ds also has a second opening A2 that opens toward the outside of the airflow passage Sa in a direction intersecting with the circuit board 50. According to this structure of the dust collection chamber Ds, dust can be collected in the dust collection chamber Ds, and the collected dust can be discharged through the second opening A2 with relatively simple operation.

[0139] The second opening A2 opens in a direction, for example, orthogonal to the circuit board 50. The second opening A2 opens to the outside of the housing 30, and more specifically, to the upper side of the upper housing member 30A. The upper outer panel 20A covers the second opening A2 and prevents it from being exposed to the outside. A user can expose the second opening A2 by removing the upper outer panel 20A from the upper housing member 30A and extract the dust collected in the dust collection chamber Ds. For example, the dust collected in the dust collection chamber Ds can be sucked in by a vacuum cleaner. Furthermore, because the upper outer panel 20A serves as a member covering the second opening A2, an increase in the number of components can be suppressed.

[0140] The dust collection chamber wall 34C defining the dust collection chamber Ds has a sidewall 34e extending downward from the edge of the second opening A2 (see Figure 12). As shown in Figure 6B, a portion 34f of the sidewall 34e is located between the flow channel wall 34A and the inlet wall 61a, and faces the airflow channel Sa. (The portion 34f will be referred to as the "inner wall" below.) The inner wall 34f may be curved in accordance with the flow channel wall 34A. For example, the inner wall 34f may be formed along a curved function curve (e.g., a spiral curve) defining the flow channel wall 34A. Furthermore, in another example, as shown by the dashed line in Figure 6B, the inner wall 34f may extend into the interior of the curved function curve (e.g., a spiral curve) defining the flow channel wall 34A. This can enlarge the first opening A1 and increase the amount of air entering the dust collection chamber Ds.

[0141] As shown in Figure 12, the dust collection chamber wall 34C may have a bottom 34g located at the lower edge of the side wall 34e. Dust captured in the dust collection chamber Ds is collected on the bottom 34g. The bottom 34g may have a embankment 34h along the edge of the first opening A1. This prevents dust collected on the bottom 34g from returning to the airflow passage Sa. The bottom 34g may be attached to the circuit board 50 via a boss 34h and screws 59.

[0142] Incidentally, when the upper outer panel 20A is attached to the upper housing member 30A, a gap can be formed between the edge of the second opening A2 and the upper outer panel 20A. This facilitates the formation of an airflow that enters the dust collection chamber Ds from the first opening A1 and is discharged from the dust collection chamber Ds to the outside through the second opening A2.

[0143] Incidentally, the structure of the dust collection chamber Ds is not limited to the example of the electronic device 1. For example, instead of using the upper outer panel 20A as a cover to cover the second opening A2, a dedicated cover (cap) can be provided to cover the second opening A2. In another example, the dust collection chamber Ds can be formed in the power unit housing 61 instead of in the upper housing member 30A.

[0144] As shown in Figure 27, in addition to the second opening A2 of the dust collection chamber Ds, a third opening A3 can be formed in the upper housing member 30A. In the example shown in Figure 27, the upper housing member 30A covers the heat dissipation device 170 (see Figures 26 and 26C), which will be described later as a modification of the heat dissipation device 70. The fins 171A of the front heat sink 171a are inclined relative to the front-rear and left-right directions. Therefore, a roughly triangular space is created between the fins 171c at the end of the heat sink 171A and the right wall 61f of the power unit housing 61. The third opening A3 is located directly above this space. According to this structure, dust collected in the space between the heat sink 171A and the right wall 61f on the front side of the power unit housing 61 can be extracted through the third opening A3. For example, the dust collected in this space can be sucked in by a vacuum cleaner.

[0145] [Top heat dissipation device]

[0146] As shown in Figure 13B, in addition to heat sinks 71 and 72, the heat dissipation device 70 also has a plurality of heat pipes 73A to 73F. In the example of electronic device 1, the heat dissipation device 70 has six heat pipes 73A to 73F. However, the number of heat pipes can be two or three, or can be more than six. In the following description, when the plurality of heat pipes 73A to 73F are not distinguished from each other, reference numeral 73 is used for the plurality of heat pipes 73A to 73F. Furthermore, as shown in Figure 13A, the heat dissipation device 70 may have a substrate 75. Heat sinks 71 and 72 are fixed to the upper side of the substrate 75. The fins 71a and 72a of heat sinks 71 and 72 are fixed to the substrate 75, for example, by welding.

[0147] As shown in Figure 14A, each heat pipe 73 has a heat-receiving portion 73a thermally connected to an integrated circuit 50a mounted on a circuit board 50. Here, "thermally connected to the heat-receiving portion 73a of the integrated circuit 50a" means that the heat-receiving portion 73a and the integrated circuit 50a are in direct contact with each other or connected to each other via a metal component with high thermal conductivity (e.g., copper or aluminum), such that heat from the integrated circuit 50a is transferred to the heat-receiving portion 73a. In the example of electronic device 1, the heat-receiving portion 73a is the portion located directly above the integrated circuit 50a. The heat dissipation device 70 may have a heat transfer member 74 disposed between the heat pipe 73 and the integrated circuit 50a. The heat-receiving portion 73a may be connected to the integrated circuit 50a via the heat transfer member 74.

[0148] As shown in Figure 14A, multiple heat receiving portions 73a of heat pipes 73 are arranged side-by-side in the left-right direction and can contact the heat receiving portions 73a of adjacent heat pipes 73. The heat receiving portion 73a has a substantially rectangular cross-section and has an upper surface, a lower surface, a left side surface, and a right side surface. The side surfaces of the heat receiving portions 73a contact the side surfaces of adjacent heat receiving portions 73a. Two adjacent heat receiving portions 73a can be in direct contact with each other, or they can be in contact with each other via a layer of thermally conductive grease or the like.

[0149] As shown in Figure 14A, each heat receiving portion 73a has a width W1 in the vertical direction and a width W2 in the horizontal direction. The vertical width W1 is greater than the horizontal width W2. This structure facilitates increasing the number of heat pipes 73. Consequently, it facilitates increasing the size of heat sinks 71 and 72, through which the heat from the integrated circuit 50a is transferred to the heat sinks 71 and 72. In the example of electronic device 1, the horizontal width W2 is less than 3 / 4 of the vertical width W1. The horizontal width W2 can be less than 2 / 3 of the vertical width W1. The horizontal width W2 can be greater than 1 / 2 of the vertical width W1.

[0150] As shown in Figure 14A, the total width Wa (width in the left-right direction) of the heat-receiving portions 73a of the multiple heat pipes 73 can correspond to the left-right width of the integrated circuit 50a. More specifically, the width difference between the total width Wa and the integrated circuit 50a can be less than the thickness of one heat pipe 73 (the width W2 of the heat-receiving portion 73a in the left-right direction). In the example of the electronic device 1, this difference is less than half the thickness of one heat pipe 73. Because the total width Wa thus corresponds to the width of the integrated circuit 50a, all heat pipes 73 can operate effectively.

[0151] As shown in Figure 14A, the heat transfer member 74 has two sides 74b separated from each other in the left-right direction and a groove 74a formed between the two sides 74b. The width of the groove 74a in the left-right direction corresponds to the total width Wa of the heat receiving portions 73a of the plurality of heat pipes 73. The heat receiving portions 73a of all the heat pipes 73 are arranged in the groove 74a. The side surfaces of the heat receiving portions 73a located at the respective right and left ends can contact the inner surface (side 74b) of the groove 74a of the heat transfer member 74. The depth of the groove 74a corresponds to the width W1 of the heat receiving portions 73a in the vertical direction. Therefore, the height of the upper surface of the heat receiving portion 73a and the height of the upper surface of the side 74b are substantially the same. The lower edge of the fins 71a included in the radiator 71 is fixed to the upper surface of the side 74b. The fins 71a are fixed to the upper surface of the side 74b, for example, by welding. According to the side portion 74b, heat can also be transferred to the fins 71a located on the right and left sides of the heat receiving portion 73a.

[0152] The width of the heat pipe 73 in both the vertical and horizontal directions can be varied along its extension direction. The heat pipe 73 may then include a portion whose width in the vertical direction is smaller than its width in the horizontal direction compared to the heat receiving portion 73a. This facilitates the bending of the heat pipe 73 and improves thermal conductivity from the heat pipe 73 to the heat sinks 71 and 72. In the example of electronic device 1, the width of all heat pipes 73 in the vertical direction varies along the extension direction of the heat pipe 73. Unlike the example of electronic device 1, only a portion of the heat pipe 73 may have its width in the vertical direction varied along its extension direction.

[0153] As shown in Figure 13B, each heat pipe 73 has portions 73b and 73c that contact the heat sinks 71 and 72 at locations separated from the heat receiving portion (see Figure 14A) 73a in the extending direction of the heat pipe 73. Hereinafter, the portion 73b contacting the first heat sink 71 will be referred to as the first heat dissipation portion, and the portion 73c contacting the second heat sink 72 will be referred to as the second heat dissipation portion. For example, as shown in Figure 14B, heat pipes 73C and 73D have second heat dissipation portions 73c that extend to the right below the second heat sink 72 and connect to the lower edge of each fin 72a. Heat pipes 73E and 73F have second heat dissipation portions 73c that extend to the right above the second heat sink 72 and connect to the upper edge of each fin 72a. Additionally, as shown in Figure 13B, heat pipes 73A to 73F have first heat dissipation portions 73b that contact the lower edge of the first heat sink 71.

[0154] The width of the second heat dissipation portion 73c in a direction orthogonal to both its extension direction and its vertical direction can be greater than its width in the vertical direction. In the example of electronic device 1, as shown in FIG14B, the second heat dissipation portion 73c has a width W3 in the vertical direction and a width W4 in the front-back direction. The width W4 in the front-back direction is greater than the width W3 in the vertical direction. This allows for efficient heat transfer from the second heat dissipation portion 73c to the second heat sink 72.

[0155] Similarly, the width of the first heat dissipation portion 73b in a direction orthogonal to both its extension direction and vertical direction can be greater than its width in the vertical direction. This can improve the thermal conductivity from the first heat dissipation portion 73b to the first heat sink 71.

[0156] In each heat pipe 73, the width W1 of the heat receiving portion 73a in the vertical direction is greater than the widths of the heat dissipation portions 73b and 73c in the vertical direction (W1 > W3). On the other hand, the widths of the heat dissipation portions 73b and 73c in the directions perpendicular to their extension and vertical directions (e.g., the width W4 of the second heat dissipation portion 73c) are greater than the widths of the heat receiving portion 73a in the directions orthogonal to its extension and vertical directions (i.e., width W2) (W4 > W2). According to this structure, variations in the outer perimeter length of the cross-section of each heat pipe 73 can be avoided.

[0157] Incidentally, heat dissipation portions 73b and 73c may not be arranged on the upper or lower sides of radiators 71 and 72. For example, the second heat dissipation portion 73c may extend in the left-right direction on the front or rear side of the second radiator 72. In this case, the vertical width of the second heat dissipation portion 73c may be greater than its horizontal width. Furthermore, in another example, holes penetrating the respective fins 72a of the second radiator 72 in the left-right direction may be formed in the fins 72a. The second heat dissipation portion 73c may then be inserted into these holes. In this case, the upper and / or lower surfaces of the second heat dissipation portion 73c may contact the edge of the through-hole in the radiator 72. The horizontal width of the second heat dissipation portion 73c may then be greater than its vertical width.

[0158] The radius of curvature of the corner 73d of the heat receiving portion 73a (see FIG. 14A) can be smaller than the radius of curvature of the corners or sides of the heat dissipation portions 73b and 73c (e.g., the side portion 73e shown in FIG. 14B). Therefore, the cross-section of the heat receiving portion 73a is close to rectangular, so that multiple heat pipes 73 can be effectively arranged on the upper side of the integrated circuit 50a.

[0159] As shown in Figure 14C, each heat pipe 73 has an intermediate portion 73h located between the integrated circuit 50a mounted on the circuit board 50 and the first heat sink 71. The intermediate portion 73h is the portion located between the heat receiving portion 73a and the first heat dissipation portion 73b. As shown in the plan view of the heat dissipation device 70, the intermediate portions 73h of the plurality of heat pipes 73 extend in a direction orthogonal to the extension direction of each heat receiving portion 73a (left-right direction in the example of the electronic device 1) (see Figure 13B).

[0160] As shown in Figure 14C, the upper surface 73i of the intermediate portion 73h is connected to the lower edge of the fins 71a of the first heat sink 71. The upper surface 73i is parallel to the lower edge of the circuit board 50 and the fins 71a. On the other hand, the lower surface 73j of the intermediate portion 73h can be tilted, so that the width W7 of the intermediate portion 73h in the vertical direction gradually decreases as the distance from the heat receiving portion 73a increases. This can increase the degree of freedom in the layout of the electronic components 50c below the intermediate portion 73h. Incidentally, the lower surface 73j of the intermediate portion 73h does not have to be tilted. Multiple steps can be formed in the lower surface 73j, so that the width W7 of the intermediate portion 73h in the vertical direction gradually decreases.

[0161] The substrate 75 has a bottom 75c located below the middle portion 73h. Multiple steps can be formed in the bottom 75c to bias the lower surface 73j of the middle portion 73h toward the heat sink 71 side.

[0162] As described above, the second heat dissipation portion 73c of heat pipes 73E and 73F is arranged along the upper side of the second heat sink 72. Therefore, as shown in FIG13A, the two heat pipes 73E and 73F may have a curved portion 73g that bends upward from the lower side of the first heat sink 71 to the upper side of the second heat sink 72.

[0163] As shown in Figure 9, the bent portion 73g has a width W5 in the vertical direction. Additionally, the bent portion 73g has a width W6 in a direction orthogonal to its extension direction and the vertical direction (or the front-back direction in the example shown in Figure 9). The width W6 can then be greater than the width W5 in the vertical direction. Based on this structure of heat pipes 73E and 73F, heat pipes 73E and 73F can easily bend upwards.

[0164] Incidentally, the bending direction of the bent portion 73g is not limited to the vertical direction. For example, if the second heat dissipation portion 73c is located on the front or rear side of the second heat sink 72, the bent portion 73g can be bent to the front or rear side. In this case, the width of the bent portion 73g in the vertical direction can be greater than the width of the bent portion 73g in the front-rear direction.

[0165] Figures 26A to 26C are diagrams showing a variation of the heat dissipation device 170 as the heat dissipation device 70. Figure 27 is a plan view of the main body 10 of the device having the heat dissipation device 170. In Figure 27, the heat dissipation device 170 is covered by the upper housing member 30A.

[0166] In the heat dissipation device 170, the first heat sink 71, as shown in FIG13A, is divided into two heat sinks 171A and 171B (two finned blocks) along the direction of airflow (in the example of electronic device 1, the front-to-back direction), as shown in FIG26A. Heat sinks 171A and 171B are fixed to a common substrate 75. Furthermore, heat sinks 171A and 171B are connected to each other via a common heat pipe 73, which has a heat receiving portion 73a thermally connected to an integrated circuit 50a mounted on a circuit board 50. The front heat sink 171A is located to the left of the centerline Cf of the cooling fan 5, and a line in the left-to-right direction passes through the centerline Cf and the heat sink 171A (see FIG27). A heat transfer member 74 and the heat receiving portion 73a of the heat pipe 73 are fixed to the front heat sink 171A (the front finned block). The front heat sink 171A is connected to the integrated circuit 50a via the heat transfer member 74 and the heat receiving portion 73a. The rear radiator 171B (rear finned block) is located at the rear of the radiator 171A. The heat dissipation portions 73c of the multiple heat pipes 73 are fixed to the rear radiator 171B. The rear second radiator 72 and radiator 171B are arranged side by side with each other in the left-right direction.

[0167] In the following description, the front radiator 171A will be referred to as the first front radiator, the radiator 171B will be referred to as the first rear radiator, and the radiator 72 will be referred to as the second radiator, as shown in the example of Figure 13A.

[0168] As shown in Figure 26A, the front edge of the first rear radiator 171B separates rearward from the rear edge of the first front radiator 171A, and a gap Gn is fixed between the front edge of the first rear radiator 171B and the rear edge of the first front radiator 171A. According to this structure, air that has passed through the rear edge of the first front radiator 171A mixes in the gap Gn (i.e., airflow is disturbed in the gap Gn), and then air enters the first rear radiator 171B. Therefore, the air to be cooled is easily distributed throughout the first rear radiator 171B. As a result, the first rear radiator 171B can be effectively utilized, thereby improving cooling performance.

[0169] As shown in Figure 26A, in the heat dissipation device 170, heat sinks 171A and 171B each have multiple fins 171a and 171b, which are arranged side-by-side in the left-right direction. The fins 171A included in the first front heat sink 171a are inclined relative to both the front-back and left-right directions. A wall 61a (the air intake wall of the power unit housing 61, see Figure 6B) that supplies air to the first front heat sink 171A is formed in front of the first front heat sink 171A. Each fin 171a may be inclined in the same direction as the wall 61a. This allows air to pass smoothly through the heat sink 171A. In the example of the electronic device 1, the wall 61a extends backward and to the left from its front edge. Similar to the wall 61a, each fin 171a extends backward and to the left from its front edge. The fins 171a and the wall 61a may not be parallel to each other.

[0170] On the other hand, each fin 171B of the first rear radiator 171b is arranged in the front-rear direction. Therefore, the fins 171A of the first front radiator 171a are inclined relative to the fins 171B of the first rear radiator 171b.

[0171] The clearance Gn is preferably the size required for air mixing. The clearance Gn can, for example, be greater than 1 / 5 of the width of the first front heatsink 171A in the front-rear direction. The clearance Gn can also be greater than 1 / 4 of the width of the first front heatsink 171A in the front-rear direction.

[0172] In the example shown in Figure 26A, the middle portions 73h of the plurality of heat pipes 73 are exposed in the gap Gn. As shown in Figure 26B, the upper surface of the heat receiving portion 73a of the heat pipe 73 and the upper surface of the heat transfer member 74 are in contact with the lower edge of the fins 171a of the first front radiator. The heat dissipation portions 73c of the plurality of heat pipes 73 are in contact with the lower edge of the fins 171b of the first rear radiator 171B. Therefore, in the examples shown in Figures 26A to 26C, both radiators 171A and 171B are in partial contact with the heat pipes 73, wherein the widths W1 and W3 (Figures 14A and 14B) of the heat pipes 73 in the vertical direction are uniform.

[0173] [Lower side heat dissipation device]

[0174] As shown in Figure 15, the heat dissipation device 80 disposed on the lower surface of the circuit board 50 includes a substrate 82, a plurality of fins 81, and a heat pipe 83. As shown in Figure 16A, the heat pipe 83 is disposed between the lower plate shield 52 and the circuit board 50. An opening 52a is formed in the lower plate shield 52. The fins 81 are disposed inside the opening 52a and exposed to the outside of the lower plate shield 52 (the lower side of the lower plate shield 52 in the example of the electronic device 1). The fins 81 are disposed in the aforementioned airflow channel Sb formed between the circuit board 50 and the lower housing member 30B (see Figure 8B).

[0175] The substrate 82 is, for example, a metal plate made of copper, aluminum, stainless steel, etc. The substrate 82 is formed by extruding the metal plate. That is, a portion of the substrate 82 is formed from a single metal plate. Multiple fins 81 are supported by the substrate 82. The fins 81 are, for example, fixed to the lower surface of the substrate 82 by welding.

[0176] As shown in Figure 15, the heat pipe 83 has a heat receiving portion 83n at a location separated from the fins 81. For example, the heat pipe 83 is L-shaped. The heat receiving portion 83n is disposed between the aforementioned optical disc drive 6 and circuit board 50. The fins 81 are arranged in an area that does not overlap with the optical disc drive 6 (in the example of electronic device 1, the area to the right of the optical disc drive 6). During the manufacturing process of the circuit board 50 (the process of mounting electronic components on the circuit board 50), a clamp can press against the surface of the circuit board 50 to suppress warping in the circuit board 50. The heat pipe 83 may have a shape consistent with the area where the clamp is pressed against.

[0177] The heat-receiving portion 83n contacts an electronic component 50c mounted on the lower surface of the circuit board 50. The electronic component 50c is, for example, a power transistor, which receives power from the power supply unit 60 to generate drive power for an integrated circuit 50a (specifically, a CPU) mounted on the upper surface of the circuit board 50. The components and devices cooled by the heat sink 80 are not limited to transistors; the heat sink 80 can be used to cool memory.

[0178] As shown in Figure 16A, the heat pipe 83 has a connecting portion 83a on the opposite side of the heat receiving portion 83n. The connecting portion 83a is located between the fin 81 and the circuit board 50 and extends in the left-right direction. A retaining recess 82f extending in the left-right direction is formed in the lower surface of the substrate 82. The lower surface of the substrate 82 is recessed upward in the retaining recess 82f. A first through hole 82g penetrating the substrate 82 in the left-right direction is formed at the left end of the retaining recess 82f. A second through hole 82h penetrating the substrate 82 in the left-right direction is formed at the right end of the retaining recess 82f. The connecting portion 83a is inserted into the retaining recess 82f from the first through hole 82g on the left side, for example, and is held within the retaining recess 82f. The connecting portion 83a is fixed to the retaining recess 82f, for example, by soldering. Both the retaining recess 82f and the connecting portion 83a are linearly extending portions.

[0179] As shown in Figure 16A, gaps G1 and G2 are generated between the edge of the opening 52a of the lower plate shield 52 and the fin 81. Specifically, gap G1 is generated between the edge (left edge) of the opening 52a and the fin 81 located at the left end, and gap G2 is generated between the edge (right edge) of the opening 52a and the fin 81 located at the right end.

[0180] As shown in Figure 16A, the substrate 82 may have a left portion 82c located to the left of the retaining recess 82f. The left portion 82c may cover the lower surface of the heat pipe 83 (the surface on the side of the plate shield 52) and close the gap G1. This prevents electromagnetic waves from transmitting from the gap G1 to the outside of the lower plate shield 52. The left portion 82c may have a dimension larger than the gap G1 in the front-back direction and close the entire gap G1.

[0181] Similarly, as shown in Figure 16A, the substrate 82 may have a right portion 82d located to the right of the retaining recess 82f. The right portion 82d may cover the lower surface of the heat pipe 83 (the surface on the side of the plate shield 52) and close the gap G2. This prevents electromagnetic waves from transmitting from the gap G2 to the outside of the lower plate shield 52. The right portion 82d may have a dimension larger than the gap G2 in the front-back direction and close the entire gap G2.

[0182] As shown in Figure 16A, the width T1 of the left portion 82c of the board is greater than the distance (gap G1) between the fins 81 located at the left ends of the plurality of fins 81 and the edge (left edge) of the opening 52a of the board shield 52. Therefore, as shown in the plan view of the circuit board 50, the left portion 82c of the board is stacked on the fins 81 located at the left ends, and also on the edge of the opening 52a of the board shield 52. As a result, electromagnetic waves can be effectively prevented from leaking from the gap G1. In the example of the electronic device 1, the plurality of fins 81 are stacked on the left portion 82c of the board.

[0183] As shown in Figure 16A, the width T2 of the right portion 82d of the board is greater than the distance (gap G2) between the rightmost fin 81 and the edge (right edge) of the opening 52a of the board shield 52. Therefore, as shown in the plan view of the circuit board 50, the right portion 82d of the board is stacked on the rightmost fin 81 and also on the edge of the opening 52a of the board shield 52. As a result, electromagnetic waves can be effectively prevented from leaking from the gap G2. In the example of the electronic device 1, the multiple fins 81 are also stacked on the right portion 82d of the board.

[0184] As shown in Figure 16B, the substrate 82 has a front portion 82a and a rear portion 82b, which are located on opposite sides of each other in the front-rear direction, with a retaining recess 82f inserted between them. The front portion 82a, the rear portion 82b, the left portion 82c, and the right portion 82d are connected to each other and surround the retaining recess 82f. The four portions 82a to 82d are located in the same plane along the circuit board 50. The edge of the fin 81 is fixed to the lower surface of the front portion 82a and the lower surface of the rear portion 82b, for example, by soldering. Heat transferred from the heat pipe 83 to the retaining recess 82f is transferred to the fin 81 via the front portion 82a and the rear portion 82b.

[0185] The front portion 82a extends forward from the retaining recess 82f and overlaps the edge of the opening 52a of the plate shield 52. The rear portion 82b extends rearward from the retaining recess 82f and overlaps the edge of the opening 52a of the plate shield 52. Therefore, the substrate 82 can be overlapped over the entire periphery of the edge of the opening 52a of the plate shield 52. This effectively prevents electromagnetic wave leakage.

[0186] Each of portions 82a to 82d may be secured to the edge of the opening 52a of the board shield 52 by means of a fastening device such as screws or rivets. The fastening structure of the substrate 82 and the lower board shield 52 is not limited to the example of the electronic device 1. For example, only the front portion 82a and the rear portion 82b may be provided with fastening devices for securing the substrate 82 to the lower board shield 52.

[0187] As shown in Figure 16B, the width W11 of the first through-hole 82g in the left-right direction can be greater than the width of one fin 81 (width in the left-right direction). Similarly, the width W12 of the second through-hole 82h in the left-right direction can be greater than the width of one fin 81 (width in the left-right direction). The first through-hole 82g is closed by multiple fins 81. The second through-hole 82h is also closed by multiple fins 81. Each fin 81 has a fixed portion 81b at its upper edge that bends to the adjacent fin 81. The fixed portion 81b contacts the adjacent fin 81, and there is no gap between two adjacent fins 81. This also prevents electromagnetic waves from leaking from the area between two adjacent fins 81.

[0188] As shown in Figure 16B, the substrate 82 may have a stop 82k, one end of which faces the heat pipe 83 in the left-right direction (the right end in the example of the electronic device 1). During the manufacturing process of the heat dissipation device 80, when the connecting portion 83a of the heat pipe 83 is inserted into the retaining recess 82f from the left, the stop 82k can reduce the relative positional displacement between the connecting portion 83a and the retaining recess 82f.

[0189] Incidentally, in the example of electronic device 1, the substrate 82 has a left portion 82c and a right portion 82d that are respectively stacked on the edge of the opening 52a of the plate shield 52 to the right and left of the retaining recess 82f. Unlike this example, only the left portion 82c or the right portion 82d can be stacked on the edge of the opening 52a of the plate shield 52.

[0190] Furthermore, in another example, the substrate 82 may not have the retaining recess 82f. In this case, the heat dissipation device 80 may have a back plate that clamps the connection portion 83a of the heat pipe 83 to the substrate 82. Figures 17A to 17C are schematic diagrams illustrating examples of such heat dissipation devices.

[0191] In the examples shown in these figures, the heat dissipation device 180 has a base plate 182 and a back plate 184. As shown in FIG17B, the base plate 182 is disposed between the connection portion 83a of the heat pipe 83 and the fin 81. The upper edge of the fin 81 is fixed to the base plate 182. Unlike the base plate 82 described above, no retaining recess is formed in the base plate 182. The back plate 184 covers the upper surface of the connection portion 83a and is attached to the base plate 182. A retaining recess 184a extending in the left-right direction is formed in the back plate 184. The connection portion 83a of the heat pipe 83 is fitted into this retaining recess. The back plate 184 has a front portion 184b and a rear portion 184c, which are located on opposite sides of each other, with the retaining recess 184a located between them. Portions 184b and 184c are attached to the base plate 182. Incidentally, in the heat dissipation device 180, unlike the heat dissipation device 80, for example, the connection portion 83a of the heat pipe 83 can be curved rather than linear. In this case, the retaining recess 184a can be curved in accordance with the connection portion 83a.

[0192] As shown in Figure 17C, the substrate 182 has a left portion 182c located to the left of the fin 81 and a right portion 182d located to the right of the fin 81. The left portion 182c closes the gap G1. The right portion 182d closes the gap G2. This prevents electromagnetic waves from leaking from gaps G1 and G2.

[0193] As shown in Figure 17C, the left portion 182c of the plate extends to the left beyond the edge (left edge) of the opening 52a of the plate shield 52 and overlaps with the plate shield 52. The right portion 182d of the plate extends to the right beyond the edge (right edge) of the opening 52a of the plate shield 52 and overlaps with the plate shield 52. This can more effectively prevent electromagnetic waves from leaking from gaps G1 and G2.

[0194] As shown in Figure 17B, the substrate 182 has a front portion 182a and a rear portion 182b, which are located on opposite sides in the front-rear direction, with a connecting portion 83a inserted between them. The front portion 182a and the rear portion 182b also extend forward and backward respectively beyond the edge of the opening 52a of the shielding member 52, and overlap with the shielding member 52. Therefore, the substrate 182 can be stacked over the entire periphery of the edge of the opening 52a of the shielding member 52. This effectively prevents electromagnetic wave leakage.

[0195] The backplate 184 may have substantially the same dimensions as the substrate 182 in at least one of the left-right and front-back directions. In the example of the electronic device 1, as shown in FIG17A, the dimension K2 of the backplate 184 in the front-back direction is the same as the dimension of the substrate 182. In addition, the dimension K1 of the backplate 184 in the left-right direction is the same as the dimension of the substrate 182. According to this structure of the backplate 184 and the substrate 182, the heat transferred from the heat pipe 83 to the backplate 184 is easily transferred to the entire substrate 182, and therefore easily transferred to the entire fin 81. Incidentally, the backplate 184 may have substantially the same dimensions as the substrate 182 only in the left-right direction or the front-back direction. Here, the fact that the backplate 184 and the substrate 182 have the same dimensions in the front-back direction means that its frontmost portion can be attached to the plate shield 52 by a common fixing device (screw or rivet), and its rearmost portion can be attached to the plate shield 52 by a common fixing device. For example, a connection hole for inserting the common fixing device is formed in each of the frontmost and rearmost portions of the plates 184 and 182. Similarly, the fact that the backplate 184 and the base plate 182 have the same dimensions in the left-right direction means that their rightmost portion can be attached to the plate shield 52 by a common fixing device, and their leftmost portion can be attached to the plate shield 52 by a common fixing device.

[0196] Furthermore, unlike the substrate 82 described above, this structure does not form holes (the aforementioned through holes 82g and 82h) penetrating the substrate 182. Therefore, electromagnetic wave leakage can be prevented more effectively.

[0197] [Memory housing]

[0198] As shown in Figure 15, a grounding pattern 50f, including a conductor and serving as an electrical ground, is formed on the lower surface of the circuit board 50. In Figure 15, the grounding pattern 50f is shaded. The grounding pattern 50f surrounds the entire periphery of an area B1 on which electronic components 50c and 50e, etc., are mounted (this area will be referred to as the shielding area below). A lower plate shield 52 covers the shielding area B1. The lower plate shield 52 has a grounding contact portion 52b (see Figure 7C), which is fixed to the grounding pattern 50f by a fixing device such as a screw.

[0199] As shown in Figure 15, a semiconductor memory 55 (see Figure 18A) is mounted on a region outside the shielding region B1 on the lower surface of the circuit board 50 via a memory connector 50g from which it can be detached. In the example of the electronic device 1, the semiconductor memory 55 is located to the right of the memory connector 50g. The lower plate shield 52 may have a connector cover 52c (see Figure 18A) covering the memory connector 50g. A memory receiving chamber R1 (see Figure 18A) accommodating the semiconductor memory 55 is defined on the lower side of the circuit board 50.

[0200] As shown in Figure 18C, the lower plate shield 52 has shielding walls 52e and 52f formed along the memory housing R1. This structure reduces the impact of static electricity on the semiconductor memory 55 while suppressing an increase in the number of components. Shielding walls 52e and 52f are walls higher than the semiconductor memory 55 and also have a width corresponding to the length (width in the left-right direction) of the semiconductor memory 55.

[0201] In the example of electronic device 1, the memory housing R1 is defined near the front surface 10a of electronic device 1 (see FIG. 8A). As shown in FIG. 15, the memory housing R1 is located in front of the center of the circuit board 50 in the front-rear direction and is formed, for example, along the front edge 50h of the circuit board 50. A shielding wall 52e is formed on the front side of the memory housing R1. According to this structure, when a user touches the front surface 10a of electronic device 1, the shielding wall 52e can suppress static current to the semiconductor memory 55.

[0202] As shown in Figure 18C, a shielding wall 52f can be formed on the rear side of the memory housing R1. This allows for more effective suppression of the effects of static electricity on the semiconductor memory 55.

[0203] As shown in Figure 15, the grounding pattern 50f may have grounding portions 50i and 50j formed along the memory housing R1. Grounding portions 50i and 50j, for example, have a length corresponding to the length of the memory housing R1 (length in the left-right direction). Grounding portion 50i is formed on the front side of the memory housing R1. Grounding portion 50j is formed on the rear side of the memory housing R1. In the following text, grounding portion 50i will be referred to as the front grounding portion, and grounding portion 50j will be referred to as the rear grounding portion.

[0204] As shown in Figure 18C, the lower plate shield 52 has a contact portion 52g that contacts the front grounding portion 50i and a contact portion 52h that contacts the rear grounding portion 50j. The front shielding wall 52e extends downward from the contact portion 52g. The rear shielding wall 52f extends downward from the contact portion 52h. With this structure, the distance from the shielding walls 52e and 52f to the grounding pattern 50f of the circuit board 50 is reduced. Therefore, the effects of static electricity can be reduced more effectively.

[0205] Incidentally, the structure of the grounding pattern 50f and the structure of the lower plate shield 52 are not limited to the example shown in the electronic device 1. For example, the grounding pattern 50f may have only one of the two grounding portions 50i and 50j (e.g., the front grounding portion 50i). In this case, the lower plate shield 52 may have only one of the two contact portions 52g and 52h (e.g., the contact portion 52g on the front side).

[0206] As shown in Figure 18A, the memory housing R1 can be covered by a memory cover 56. The memory cover 56 comprises, for example, a conductive material (e.g., a metal such as copper, aluminum, or iron). The memory cover 56 is electrically connected to shielding walls 52e and 52f. Accordingly, the effects of static electricity on the semiconductor memory 55 can be more effectively suppressed.

[0207] In the example of electronic device 1, the memory cover 56 is electrically connected to the shielding wall 52e via a conductive pad 56a (FIG. 18C) disposed between the edge of the memory cover 56 and the edge of the shielding wall 52e on the front side. Furthermore, the memory cover 56 is electrically connected to the shielding wall 52f via a conductive pad 56b disposed between the edge of the memory cover 56 and the edge of the shielding wall 52f on the rear side.

[0208] As shown in Figure 18C, an opening 30d is formed in the lower housing member 30B to expose the memory housing R1. Supporting walls 37a, 37b, and 37c may be formed on the lower housing member 30B surrounding the memory housing R1. The supporting walls 37a, 37b, and 37c are walls extending from the edge of the opening 30d toward the circuit board 50. The supporting walls 37a, 37b, and 37c can ensure the strength of the lower housing member 30B around the perimeter of the opening 30d.

[0209] As shown in Figure 18C, shielding walls 52e and 52f can be located inside support walls 37a, 37b, and 37c. For example, the front shielding wall 52e is disposed on the inner side of the front support wall 37a and along the support wall 37a. The rear shielding wall 52f, for example, is disposed on the inner side of the rear support wall 37b and along the support wall 37b. In the example of electronic device 1, the board shield 52 does not have a shielding wall located inside the support wall 37c formed on the right side of the memory housing R1. Unlike the example of electronic device 1, the board shield 52 can have a shielding wall located inside the support wall 37c.

[0210] The outer peripheral edge of the memory cover 56 is provided, for example, at the lower edge of the support walls 37a, 37b, and 37c. As shown in FIG18A, a protrusion 56c is formed at the end of the memory cover 56 (the left end in the example shown in the electronic device 1). An opening in which the protrusion 56c is fitted horizontally is formed in the lower housing member 30B. The opposite end of the memory cover 56 (the right end in the example shown in the electronic device 1) is provided on and fixed to the support wall 37c. For example, a hole is formed in the support wall 37c, and the end of the memory cover 56 is fixed to the hole by a fixing device such as a screw 58a.

[0211] The semiconductor memory 55 can be fixed to the circuit board 50 or the upper shield 51 at a location separate from the memory connector 50g. For example, as shown in FIG18A, the right end 55a of the semiconductor memory 55 can be fixed to a threaded hole 51b formed in the upper shield 51 by a screw 58b. In this case, a spacer 57 can be provided between the upper shield 51 and the right end 55a of the semiconductor memory 55. The hole 50k for providing the spacer 57 can be formed at a position corresponding to the threaded hole 51b in the circuit board 50.

[0212] Electronic device 1 allows for the selective use of multiple semiconductor memories with different storage capacities. These semiconductor memories have different lengths in the left-right direction depending on their storage capacity. Therefore, as shown in FIG18A, multiple threaded holes 51b can be formed in the upper shield 51, allowing the multiple semiconductor memories of different lengths to be fixed to the upper shield 51. Additionally, in the circuit board 50, holes for providing spacers 57 can be formed at positions corresponding to the threaded holes 51b.

[0213] With the memory cover 56 closed, vents H1 (see Figures 18A and 18B) that allow air to flow between the inside and outside of the memory housing R1 can be formed in the memory housing R1. This can improve the heat dissipation characteristics of the semiconductor memory 55.

[0214] As described above, the memory housing R1 is disposed near the front surface 10a of the electronic device 1. A vent H1 can be formed in the rear wall portion of the memory housing R1. In the example of the electronic device 1, the vent H1 can be disposed in the rear shielding wall 52f or the rear support wall 37b. Furthermore, the vent H1 can open towards the rear of the electronic device 1. With this structure of the vent H1, the vent H1 is located away from the front surface 10a of the electronic device 1, thus effectively preventing the vent H1 from becoming an electrostatic discharge path.

[0215] In the example of electronic device 1, multiple gaps 52i (see FIG. 19) are formed in the rear shielding wall 52f. As shown in FIG. 18B, the lower edge of the support wall 37b of the lower housing member 30B has a recess 37e at a position corresponding to the gap 52i. A vent H1 opening toward the rear of electronic device 1 is formed between the recess 37e and the edge of the memory cover 56. An attachment hole 52j (see FIG. 18B) for fixing the ground contact portion 52h of the lower plate shield 52 to the circuit board 50 can be formed in the gap 52i.

[0216] The aforementioned lower flow channel Ub (see Figure 20A) is formed between the lower surface of the lower housing member 30B and the lower outer panel 20B. A vent H1 opens within the lower flow channel Ub. Furthermore, the vent H1 opens from the memory housing chamber R1 toward the inlet 31b of the lower housing member 30B (see Figure 8A). Therefore, when the cooling fan 5 is driven, an airflow is formed from the interior of the memory housing chamber R1 through the vent H1 to the inlet 31b.

[0217] In addition to the ventilation hole H1, holes leading to the outside of the memory housing R1 can be formed in the wall portions defining the memory housing R1, such as shielding walls 52e and 52f, support walls 37a, 37b and 37c, circuit board 50, etc. When the cooling fan 5 is driven, air flows into the interior of the memory housing R1 through the holes. The holes leading to the outside of the memory housing R1, i.e., air inlets, are, for example, holes 50k formed in the circuit board 50 to fix the semiconductor memory 55.

[0218] [External Panel]

[0219] As described above, the electronic device 1 has an upper external panel 20A attached to the upper surface of the device body 10 and a lower external panel 20B attached to the lower surface of the device body 10. The device body 10 has an upper housing member 30A and a lower housing member 30B that are joined to each other in the vertical direction. The upper external panel 20A is attached to the upper surface of the upper housing member 30A. The lower external panel 20B is attached to the lower surface of the lower housing member 30B.

[0220] As shown in Figure 1C, the upper outer panel 20A may have a right protrusion 20a on its right side, extending to the right beyond the right side surface 10b of the device body 10 (the right outer surface of the front outer panel 35). Furthermore, the upper outer panel 20A may have a left protrusion 20b on its left side (Figure 1G), which protrudes to the left beyond the left side surface 10c of the device body 10 (the left side surface of the housing 30). As shown in Figure 1B, the protrusions 20a and 20b can extend from the rear edge to the front edge of the upper outer panel 20A.

[0221] The protruding portions 20a and 20b can protect the device body 10. For example, when the electronic device 1 is placed vertically with the right side surface 10b of the electronic device 1 below, the right protruding portion 20a abuts against the floor surface and supports the device body 10, thereby preventing the side surface of the device body 10 from being damaged or soiled.

[0222] Similar to the upper outer panel 20A, as shown in Figure 1C, the lower outer panel 20B may have a right protrusion 20c on its right side, extending to the right beyond the right side surface 10b of the device body 10, and a left protrusion 20d on its left side, extending to the left beyond the left side surface 10c of the device body 10 (see Figure 1G). The protrusions 20c and 20d can extend from the rear edge to the front edge of the lower outer panel 20B. This structure of the outer panels 20A and 20B provides more effective protection for the device body 10.

[0223] As shown in Figure 1E, the upper outer panel 20A may have a forward protrusion 20e on its front side that extends forward beyond the front surface 10a (front surface of the front outer panel 35) of the device body 10. Similarly, the lower outer panel 20B may have a forward protrusion 20f on its front side that extends forward beyond the front surface 10a of the device body 10. This structure of the outer panels 20A and 20B protects the front surface 10a of the device body 10 and components arranged in the front surface 10a (e.g., buttons 2a and 2b, connectors 3a and 3b, etc.). The forward protrusion 20e extends from the right edge to the left edge of the upper outer panel 20A. The forward protrusion 20f extends from the right edge to the left edge of the lower outer panel 20B. Furthermore, the outer panels 20A and 20B may have a rearward protrusion that extends rearward beyond the rear surface (rear surface of the housing 30) of the device body 10.

[0224] Incidentally, the outer panels 20A and 20B may have protrusions only on a portion of their right, left, and front sides. For example, the outer panels 20A and 20B may not have protrusions 20e and 20f on their front sides. Furthermore, only one of the two outer panels 20A and 20B may have a protrusion.

[0225] As shown in Figure 1A, the upper outer panel 20A has a shape obtained by gently bending a plate along its thickness direction, and does not have a wall portion that descends towards the lower outer panel 20B at its outer peripheral edge. That is, the upper outer panel 20A is not box-shaped. Therefore, the upper outer panel 20A has a right end surface 20g (see Figure 1E) facing to the right and having a width T3 (width in the vertical direction) corresponding to the thickness of the upper outer panel 20A. Similarly, the upper outer panel 20A has a left end surface facing to the left and having a width corresponding to the thickness of the upper outer panel 20A, a front end surface facing forward and having a width corresponding to the thickness of the upper outer panel 20A, and a rear end surface facing backward and having a width corresponding to the thickness of the upper outer panel 20A.

[0226] Similar to the upper outer panel 20A, the lower outer panel 20B does not have a wall extending toward the upper outer panel 20A at its outer peripheral edge. Therefore, the lower outer panel 20B has a right end surface 20h (see FIG. 1G) facing to the right and having a width T4 (width in the vertical direction) corresponding to the thickness of the lower outer panel 20B, a left end surface facing to the left and having a width corresponding to the thickness of the lower outer panel 20B, a front end surface facing forward and having a width corresponding to the thickness of the lower outer panel 20B, and a rear end surface facing backward and having a width corresponding to the thickness of the lower outer panel 20B.

[0227] [Bending of the outer panel]

[0228] The upper outer panel 20A may have curved portions in cutting planes that intersect the vertical direction and the horizontal direction. Compared to the case where the upper outer panel 20A is flat, this can increase the strength of the outer component when the electronic device 1 is placed vertically. As shown in Figures 20A and 20B, the upper outer panel 20A may have portions that are curved in different ways in two cutting planes that are vertical and intersect each other. Here, the two cutting planes are, for example, the cutting plane represented by line XXa-XXa and the cutting plane represented by line XXb-XXb shown in Figure 1D. The cutting planes are not limited to the example shown in Figure 1D; for example, they may be planes along the vertical and horizontal directions and the front-back direction. In this case, the strength of the upper outer panel 20A (strength to resist forces acting in the horizontal direction) can also be increased.

[0229] In Figure 1D, the first position P1, the second position P2 and the third position P3 located on the opposite side of the center Pc of the upper outer panel 20A, and the fourth position P4 located on the opposite side of the center Pc of the upper outer panel 20A, are positioned at the four corners of the upper outer panel 20A. In Figure 1D, the first position P1 is located at the front right corner, the second position P2 is located at the rear left corner, the third position P3 is located at the front left corner, and the fourth position P4 is located at the rear right corner.

[0230] When the four positions are defined in the example of electronic device 1, the line L1 connecting the first position P1 and the second position P2 to each other and along the upper surface of the upper outer panel 20A is a downwardly convex curve, as shown in Figure 20A. In other words, when viewed along the cutting plane of the first diagonal of electronic device 1, the upper outer panel 20A curves along an arc around the point where it separates upward from the upper outer panel 20A. Here, the "first diagonal" is the XXa-XXa line shown in Figure 1D.

[0231] On the other hand, line L2, which connects the third position P3 and the fourth position P4 to each other and runs along the upper surface of the upper outer panel 20A, is an upwardly convex curve, as shown in Figure 20B. In other words, when viewed along the cutting plane of the second diagonal of the electronic device 1, the upper outer panel 20A can bend along an arc around the point where it separates downward from the upper outer panel 20A. Here, the "second diagonal" is line XXb-XXb shown in Figure 1D.

[0232] Due to the curvature of the upper outer panel 20A, as shown in Figure 20A, the thickness (width in the vertical direction) of the electronic device 1 at the right front corner (first position P1) and the thickness (width in the vertical direction) of the electronic device 1 at the left rear corner (second position P2) increase. Therefore, when the electronic device 1 is placed vertically, its posture can be stable.

[0233] For example, when electronic device 1 is placed vertically with its right side facing down, the thicker right front corner (first position P1) is on the bottom and supports electronic device 1. Similarly, when electronic device 1 is positioned with its front side facing down, the thicker right front corner (first position P1) is also on the bottom. On the other hand, when electronic device 1 is placed vertically with its left side facing down, the thicker left rear corner (second position P2) is on the bottom and supports electronic device 1. Therefore, based on the aforementioned curvature of the upper outer panel 20A, the posture of electronic device 1 can be stabilized when it is placed vertically.

[0234] Figure 20A shows a first distance D1 at a first position P1 (front right corner) and a second distance D2 at a second position P2 (rear left corner), representing the distance from the horizontal plane Hp1 including the circuit board 50 to the upper surface of the upper outer panel 20A. Furthermore, Figure 20B shows a third distance D3 at a third position P3 (front left corner) and a fourth distance D4 at a fourth position P4 (rear right corner), representing the distance from the horizontal plane Hp1 including the circuit board 50 to the upper surface of the upper outer panel 20A. As described above, the line L1 connecting the first position P1 and the second position P2 (which are defined on a diagonal of the upper outer panel 20A) is a downwardly convex curve, and the line L2 connecting the third position P3 and the fourth position P4 (which are on another diagonal of the upper outer panel 20A) is an upwardly convex curve. Therefore, each of the first distance D1 and the second distance D2 is greater than each of the third distance D3 and the fourth distance D4. Therefore, by arranging the cooling system devices and components near the first position P1 and the second position P2, smooth intake and exhaust can be achieved.

[0235] For example, as shown in FIG1D, from the plan view of the electronic device 1, the line connecting the center Pc of the upper outer panel 20A and the first position P1 (line XXa-XXa represents the cutting plane) passes through the inlet Ea formed between the upper outer panel 20A and the upper housing member 30A (see FIG1C). Furthermore, the line connecting the center Pc of the upper outer panel 20A and the first position P1 passes through the upper flow channel Ua (see FIG20A) formed between the recessed plate portion 32a (see FIG2a) of the upper outer panel 20A and the upper housing member 30A. This helps to ensure sufficient width of the inlet Ea in the vertical direction and sufficient width of the upper flow channel Ua in the vertical direction.

[0236] Furthermore, as seen in the plan view of the electronic device 1, the line connecting the center Pc and the second position P2 of the upper outer panel 20A (line XXa-XXa represents the cutting plane) passes through the airflow channel from the cooling fan 5 to the exhaust port M provided in the rear surface of the electronic device 1. In the example of the electronic device 1, the air flowing from the cooling fan 5 passes through the interior of the power unit housing 61 and is discharged from the exhaust port M. From the plan view of the electronic device 1, the line connecting the center Pc and the second position P2 of the upper outer panel 20A (line XXa-XXa represents the cutting plane) passes through the airflow channel formed in the rear part (rear part 61c) of the power unit housing 61. Therefore, it is easy to ensure that the rear part of the power unit housing 61 has sufficient dimensions in the vertical direction, and exhaust efficiency can be improved.

[0237] Furthermore, as seen in the plan view of the electronic device 1, the line connecting the center Pc and the second position P2 of the upper outer panel 20A to each other passes through the rear wall 61i (see FIG. 7C) of the power unit housing 61 in which the vent 61g is formed, and the rear portion 61k (see FIG. 7C) of the upper wall 61j in which the vent 61h is formed. This helps to ensure sufficient dimensions in the vertical direction of the rear wall 61i of the power unit housing 61, and sufficient width in the vertical direction of the airflow channel Se (see FIG. 7C) formed between the rear portion 61k of the upper wall 61j and the upper housing member 30A.

[0238] The lower outer panel 20B can also be bent as a whole. For example, as shown in FIG20A, the lower outer panel 20B is bent when the cutting plane is viewed along the first diagonal of the electronic device 1 (line XXa-XXa in FIG1D). As shown in FIG20B, the lower outer panel 20B can be bent in a manner different from the cutting plane shown in FIG20A when the cutting plane is viewed along the second diagonal of the electronic device 1 (line XXb-XXb in FIG1D). As described above, the optical disc drive 6 is disposed on the lower side of the circuit board 50. The optical disc drive 6 is located on the left side of the electronic device 1. Therefore, the left side of the lower outer panel 20B protrudes downward to cover the lower side of the optical disc drive 6. The right side Br of the lower outer panel 20B can have a shape symmetrical to the right side of the upper outer panel 20A.

[0239] Incidentally, the electronic device 1 may not have an optical disc drive 6 on the underside of the circuit board 50. In this case, the entire shape (bend) of the lower outer panel 20B can be symmetrical to the shape (bend) of the upper outer panel 20A. Figures 21A and 21B are cross-sectional views showing the lower outer panel according to this modification. In the example shown in these figures, the lower outer panel 120B and the upper outer panel 20A have shapes symmetrical with respect to the horizontal plane Hp2. Figure 21A shows a cross-section of the outer panels 20A and 120B, obtained in the same cutting plane as the cutting plane shown by lines XXa-XXa in Figure 1D. Figure 21B shows a cross-section of the outer panels 20A and 120B, obtained in the same cutting plane as the cutting plane shown by lines XXb-XXb in Figure 1D. Figure 21C is a front view of the electronic device 101 having the outer panels 20A and 120B shown in Figures 21A and 21B.

[0240] In the examples shown in Figures 21A and 21B, the fifth position P5, the sixth position P6 and the seventh position P7 located on the opposite side of the center Pc of the lower outer panel 120B, and the eighth position P8 located on the opposite side of the center Pc of the lower outer panel 120B, are located at the four corners of the lower outer panel 120B. For example, the fifth position P5 is located at the front right corner of the lower outer panel 120B, the sixth position P6 is located at the rear left corner of the lower outer panel 120B, the seventh position P7 is located at the front left corner of the lower outer panel 120B, and the eighth position P8 is located at the rear right corner of the lower outer panel 120B. Therefore, from the plan view of the electronic device 1, the fifth position P5, the sixth position P6, the seventh position P7, and the eighth position P8 correspond to the first position P1, the second position P2, the third position P3, and the fourth position P4, respectively.

[0241] When the four positions are thus confined within the lower outer panel 120B, the line L3 connecting the fifth position P5 and the sixth position P6 to each other along the lower surface of the lower outer panel 120B can be an upwardly convex curve, as shown in FIG21A. On the other hand, the line L4 connecting the seventh position P7 and the eighth position P8 to each other along the lower surface of the lower outer panel 120B can be a downwardly convex curve, as shown in FIG21B.

[0242] Incidentally, the curvature of the upper outer panel 20A is not limited to the example of the electronic device 1. For example, the four positions P1 to P4 that define the curvature of the upper outer panel 20A may not be the four corners of the upper outer panel 20A. For example, the first position P1 may be defined at the center of the front edge of the upper outer panel 20A, the second position P2 may be defined on the side opposite to the first position P1 of the center Pc of the upper outer panel 20A, the third position P3 may be defined at the center of the right edge of the upper outer panel 20A, and the fourth position P4 may be defined on the side opposite to the third position P3 of the center Pc of the upper outer panel 20A. When the four positions P1 to P4 are defined in this way, the line connecting the first position P1 and the second position P2 to each other and along the upper surface of the upper outer panel 20A may be, for example, a downwardly convex curve. On the other hand, the line connecting the third position P3 and the fourth position P4 to each other and along the upper surface of the upper outer panel 20A may be an upwardly convex curve.

[0243] In this case, the curvature of the lower outer panel 20B can correspond to the curvature of the upper outer panel 20A. For example, the entire shape (curvature) of the lower outer panel 20B can be symmetrical to the shape (curvature) of the upper outer panel 20A. Furthermore, in another example, although only the upper outer panel 20A is curved as described above, the lower outer panel 20B can be flat. In yet another example, a portion of the upper outer panel 20A or a portion of the lower outer panel 20B can include a flat surface.

[0244] [External panel attachment structure]

[0245] As shown in Figures 2A and 22, a plurality of attachment holes 30e and 30f are formed in the upper surface of the device body 10 (the upper surface of the upper housing member 30A). A plurality of attachment target protrusions 21 and 22 (see Figure 2B) are formed on the lower surface of the upper outer panel 20A. The attachment target protrusions 21 and 22 are respectively fitted into the attachment holes 30e and 30f. The attachment holes 30e and 30f are, for example, holes that penetrate the upper housing member 30A.

[0246] In Figure 22, the assembly directions of the attachment target protrusions 21 and 22 into attachment holes 30e and 30f, respectively, are indicated by arrow Da. Assembly direction Da corresponds, for example, to the direction in which the attachment target protrusions 21 and 22 protrude from the lower surface of the upper outer panel 20A. Additionally, assembly direction Da corresponds, for example, to the direction in which attachment holes 30e and 30f penetrate the upper housing member 30A. Each assembly direction Da of the plurality of attachment target protrusions 21 and 22 assembled into attachment holes 30e and 30f is parallel to each other. Assembly direction Da can be inclined relative to a plane perpendicular to the vertical direction (the horizontal plane Hp3 parallel to the circuit board 50 in Figure 22). For example, assembly direction Da can be inclined relative to the horizontal plane Hp3 and along a plane parallel to both the vertical and horizontal directions.

[0247] As described above, the upper outer panel 20A is curved in different ways in two intersecting cutting planes along the vertical direction. Specifically, the upper outer panel 20A is curved to bulge downwards in the cutting plane along the first diagonal (lines XXa-XXa in Figure 1D) and upwards in the cutting plane along the second diagonal (lines XXb-XXb in Figure 1D). As shown in Figure 22, the upper surface of the device body 10 is also curved, consistent with the upper outer panel 20A. When the assembly direction Da is inclined relative to the horizontal plane Hp3, the curved upper outer panel 20A can be attached to the similarly curved upper surface of the device body 10, and the upper outer panel 20A and the upper surface of the device body 10 can be in close contact with each other.

[0248] Figure 23 is a schematic diagram to help explain this. In the example shown in this figure, the horizontal portion 30i and the inclined portion 30j are formed in the upper housing member 30A. The horizontal portion 20i and the inclined portion 20j are also formed in the upper outer panel 20A. The attachment target protrusions 21 and 22 protrude in a direction Da that is inclined relative to the horizontal plane. The attachment holes 30e and 30f penetrate the upper housing member 30A in a direction Da that is inclined relative to the horizontal plane Hp3. The assembly direction Da is more inclined than the inclined portions 30j and 20j. That is, the angle θ1 formed between the horizontal plane Hp3 and the assembly direction Da is greater than the angle θ2 formed between the horizontal plane Hp3 and the inclined portions 20j and 30j. Therefore, the attachment target protrusions 21 and 20 can be inserted into the attachment holes 30e and 30f without interference between the inclined portions 20j and 30j or between the horizontal portions 20i and 30i. Furthermore, after the insertion of the attachment target protrusions 21 and 20, the inclined portions 20j and 30j can be in close contact with each other, and the horizontal portions 20i and 30i can be in close contact with each other.

[0249] To reduce the vertical dimensions of the electronic device 1, one effective method involves attaching the upper outer panel 20A and the upper housing member 30A to each other, for example, by sliding the upper outer panel 20A relative to the upper housing member 30A in a rightward or leftward direction. However, this method results in a gap between the inclined portions 20j and 30j, and interference between another inclined portion of the upper outer panel 20A and the upper housing member 30A. On the other hand, in the example of the electronic device 1, the assembly direction Da is more inclined than the inclined portions 20j and 30j, thus the upper outer panel 20A can be attached to the upper housing member 30A without causing such gaps or interference. Therefore, it is desirable that the assembly direction Da of the attachment target protrusions 21 and 22 and the attachment holes 30e and 30f is more inclined relative to the horizontal plane Hp3 than the portion of the upper outer panel 20A with the largest inclination.

[0250] Incidentally, the plurality of attachment holes 30e and 30f are preferably distributed over the entire upper surface of the upper housing member 30A. This allows the entire upper outer panel 20A to be in close contact with the upper surface of the upper housing member 30A. In the example of the electronic device 1, a recessed plate portion 32a is formed in the upper surface of the upper housing member 30A. The attachment holes 30e and 30f are preferably distributed in areas other than the recessed plate portion 32a.

[0251] As shown in Figure 22, the attachment target protrusion 21 has an engaging protrusion 21a at its base. A recess 30h is formed in the bottom surface of the attachment hole 30e. The engaging protrusion 21a is fitted into the recess 30h and restricts the sliding of the attachment target protrusion 21 from the attachment hole 30e. On the other hand, the attachment target protrusion 22 has no protrusion at its base. The engaging protrusion 21a has a surface 21b facing the direction in which the attachment target protrusion 21 is pulled out from the attachment hole 30e. At the surface 21b, the engaging protrusion 21a engages with the recess 30h. (Surface 21b will be referred to as the locking surface below.) The upper outer panel 20A uses the locking surface 21b of the attachment target protrusions 22 and 211 to hold the upper surface of the upper housing member 30A. A plurality of attachment target protrusions 22 are arranged along the left edge of the upper outer panel 20A. Unlike the protruding portion 21 of the attached target, no protrusion may be formed at the base of the protruding portion 22 of the attached target.

[0252] The structure for attaching the lower outer panel 20B to the lower housing member 30B can be the same as the structure for attaching the upper outer panel 20A to the upper housing member 30A. That is, as shown in FIG2A, the lower outer panel 20B can have attachment target protrusions 25 and 24, whereby the attachment target protrusion 25 has a protrusion formed at its base, and the attachment target protrusion 24 does not have such a protrusion formed thereon. Attachment holes into which the attachment target protrusions 24 and 25 will be fitted can be formed in the lower surface of the lower housing member 30B.

[0253] Incidentally, the structure for fixing the upper outer panel 20A to the upper housing member 30A is not limited to the example of the electronic device 1. For example, as shown in FIG24, a joining protrusion 26 can be formed in the lower surface of the upper outer panel 20A, instead of a joining protrusion 21a formed on the base of the attachment target protrusion 21. The joining protrusion 26 can be formed, for example, such that its centerline is along the vertical direction. On the other hand, the hole or recess into which the joining protrusion 26 will be fitted can be formed in the upper housing member 30A. According to this structure, the size of the protrusion can be easily increased compared to the joining protrusion 21a of the attachment target protrusion 21. As a result, the strength of the joining protrusion can be increased.

[0254] [Disc Insertion Slot]

[0255] As shown in Figures 1B and 25, a disc insertion slot 23a can be formed in the lower outer panel 20B, into which the optical disc is inserted toward the optical disc drive 6. The lower outer panel 20B has a front bevel 23 on its front side. The front bevel 23 is a surface that extends downward and backward from the front edge 20k of the lower outer panel 20B. The disc insertion slot 23a is formed in the front bevel 23. This prevents the disc insertion slot 23a from being conspicuous.

[0256] As shown in Figure 25, a guide bending surface 23c connected to the edge of the disc insertion slot 23a is formed on the upper part of the disc insertion slot 23a. The guide bending surface 23c can be used as a guide for the optical disc D. For example, when the optical disc D is inserted, if the front edge of the optical disc collides with the front edge 20k of the lower outer panel 20B, the guide bending surface 23c guides the optical disc D into the interior of the disc insertion slot 23a.

[0257] In the example of electronic device 1, the disc insertion slot 23a is located on the left side of electronic device 1. The front slope 23 forming the disc insertion slot 23a is formed at an angle, such that the right side of the front slope 23 (the part near the center in the left-right direction of electronic device 1) is located in front of the left side of the front slope 23. Therefore, as shown in FIG1H, in the bottom view of electronic device 1, the front edge 23e of the disc insertion slot 23a slopes forward from the left end of the front edge 23e to the center (center in the left-right direction) of electronic device 1. Therefore, when the optical disc D is inserted, the guidance of the optical disc D begins earlier near the center of electronic device 1.

[0258] As shown in Figure 25, a bevel 23d is formed at the lower edge of the disc insertion slot 23a. The bevel 23d extends backward and upward from its leading edge. When the leading edge of the optical disc collides with the bevel 23d, the bevel 23d guides the optical disc D to the insertion opening 6c formed in the front surface of the disc drive housing 6a.

[0259] The insertion opening 6c formed in the front surface of the disk drive housing 6a is located above the lower part of the inclined surface 23d. Therefore, the distance from the insertion opening 6c to the disk insertion slot 23a formed in the lower housing member 30B is reduced. As a result, it is convenient to insert the optical disc D.

[0260] As described above, in the electronic device 1, the housing 30 includes an upper housing member 30A covering the upper surface of the circuit board 50 and a lower housing member 30B covering the lower surface of the circuit board 50. A cooling fan 5 is disposed outside the outer edge of the circuit board 50. The cooling fan 5 has a rotation center line Cf along the vertical direction as the thickness direction of the circuit board 50. The cooling fan 5 forms an airflow between the upper surface of the circuit board 50 and the upper housing member 30A, and between the lower surface of the circuit board 50 and the lower housing member 30B. The upper housing member 30A has an upper inlet 31a defined above the cooling fan 5. The lower housing member 30B has a lower inlet 31b defined below the cooling fan 5. According to the electronic device 1, one cooling fan 5 can deliver air to both surfaces of the circuit board 50. Therefore, components disposed on both surfaces of the circuit board 50 can be cooled without increasing the number of components. Furthermore, since the upper inlet 31a and the lower inlet 31b are formed in the housing 30, air can be effectively drawn in, thereby improving cooling performance.

[0261] Furthermore, the electronic device 1 includes: a first heat sink 71 that allows air to pass through in the front-rear direction; a power supply unit 60 including a power supply circuit 62 and a power supply unit housing 61 housing the power supply circuit 62 and having an air intake wall 61a, with a plurality of air intake holes 61b formed in the air intake wall 61a; and a cooling fan 5. The air intake wall 61a is located in front of the first heat sink 71. Furthermore, the air intake wall 61a has an outer surface that is inclined relative to the front-rear and left-right directions and faces the first heat sink 71. The cooling fan 5 is configured to deliver air to the air intake wall. This air intake wall 61a ensures that airflow is supplied to the first heat sink 71 and simultaneously cools the power supply unit 60 with cold air (air not heated by another heat-generating or heat-dissipating device). When the power supply unit 60 can be cooled by cold air, the gap between the circuit components 62a and 62b (e.g., transformers and capacitors) included in the power supply circuit 62 can be reduced, allowing the power supply unit 60 to be miniaturized.

[0262] Furthermore, the electronic device 1 includes: a circuit board 50; a cooling fan 5 that forms an airflow for cooling components mounted on the circuit board 50; a flow channel wall 34A that defines a flow channel for the airflow delivered from the cooling fan 5; and a dust collection chamber Ds that captures dust in the airflow and collects the captured dust, the dust collection chamber Ds being disposed on the flow channel wall 34A. According to this structure, the amount of dust entering devices arranged downstream of the dust collection chamber Ds, such as the first heat sink 71, the power supply unit 60, etc., can be reduced. Additionally, the dust collection chamber Ds has a first opening A1 that opens towards the airflow channel Sa in the direction along the circuit board 50, and a second opening A2 that opens towards the outside of the dust collection chamber Ds in a direction intersecting with the circuit board 50. In the example of the electronic device 1, the direction in which the second opening A2 opens is orthogonal to the direction of the circuit board 50. According to this structure of the dust collection chamber Ds, dust can be collected in the dust collection chamber Ds, and the collected dust can be discharged through the second opening A2 with relatively simple operation.

[0263] Additionally, the heat dissipation device 70 includes: a plurality of heat pipes 73A to 73F located above the integrated circuit 50a, each heat pipe having a heat receiving portion 73a thermally connected to the integrated circuit 50a; and heat sinks 71 and 72 connected to the plurality of heat pipes 73A to 73F. The heat receiving portions 73a of the heat pipes 73A to 73F are arranged side by side in the left-right direction and are in contact with the heat receiving portions 73a of adjacent heat pipes 73. The heat receiving portions 73a have a first width W1 in the vertical direction and a second width W2 in the left-right direction that is smaller than the first width W1. With this structure, it becomes easy to increase the number of heat pipes 73. As a result, it becomes easy to increase the size of the heat sinks 71 and 72 to which the heat from the integrated circuit 50a is transferred through the heat pipes 73. Therefore, the cooling performance of the integrated circuit 50a can be improved.

[0264] Furthermore, the electronic device 1 includes: a circuit board 50; a plate shield 52 covering the circuit board 50 and having an opening 52a formed therein; and a heat dissipation device 80. The heat dissipation device 80 includes: a plurality of fins 81 disposed inside the opening 52a; a heat pipe 83 having a connecting portion 83a located between the plurality of fins 81 and the circuit board 50 and extending along the circuit board 50 in a left-right direction; and a substrate 82 or 182 supporting the plurality of fins 81. The substrate 82 or 182 has a left portion 82c or 182c. The left portion 82c or 182c covers the lower surface of the heat pipe 83, i.e., the lower surface facing the plate shield 52, and closes the gap G1 between the left ends of the plurality of fins 81 and the left edge of the opening 52a of the plate shield 52. According to this structure, electromagnetic wave leakage from the gap G1 between the left ends of the plurality of fins 81 and the left edge of the opening 52a of the plate shield 52 can be effectively suppressed.

[0265] As described above, in the electronic device 1, the lower surface of the circuit board 50 has a shielding region B1, electronic components 50c and 50e are arranged on the shielding region B1, and a board shield 52 covers the shielding region. A memory housing chamber R1 capable of accommodating a semiconductor memory 55 is defined outside the shielding region. The board shield 52 has shielding walls 52e and 52f along the memory housing chamber R1. Because the shielding walls 52e and 52f are formed on the board shield 52 in the electronic device 1, the semiconductor memory 55 can be protected from static electricity while suppressing an increase in the number of components.

[0266] As described above, the electronic device 1 includes an upper outer panel 20A having an upper surface. The upper surface of the upper outer panel 20A has a first position P1, a second position P2 defined on the side opposite to the first position P1 at the center Pc of the upper surface, a third position P3, and a fourth position P4 defined on the side opposite to the third position P3 at the center Pc, on its peripheral portion. The line L1 connecting the first position P1 and the second position P2 to each other and forming along the upper surface is a downwardly convex curve. The line L2 connecting the third position P3 and the fourth position P4 to each other and forming along the upper surface is an upwardly convex curve. According to the electronic device 1, the appearance is improved, and the strength of the outer panel 20A is easily ensured. Incidentally, this can be applied to electronic devices without an outer panel 20A. In this case, the upper surface of the housing accommodating internal devices such as a circuit board 50 can be bent as described above.

[0267] Furthermore, the electronic device 1 includes a device body 10 having an upper surface and a right side surface 10b, and a curved upper outer panel 20A. The upper outer panel 20A covers and is attached to the upper surface of the device body 10. The upper outer panel 20A has a right protrusion 20A at its end that extends beyond the right side surface 10b. According to the electronic device 1, when the electronic device 1 is placed vertically such that the right side surface 10b is below, the device body 10 can be protected by the upper outer panel 20A. Furthermore, because the upper outer panel 20A is curved, its strength can be ensured compared to, for example, a flat upper outer panel 20A. Moreover, the upper outer panel 20A has a curved portion in a cutting plane (specifically, the cutting plane indicated by line XXa-XXa in FIG. 1D) that intersects the vertical direction and the horizontal direction. This ensures sufficient strength for the outer panel 20A. The cutting plane that intersects the vertical direction and the horizontal direction can, for example, be a plane that intersects the vertical and horizontal directions and the front-back direction. In the same case, it can be ensured that the outer panel 20A has sufficient strength to resist external forces acting in the left and right directions.

[0268] Furthermore, the upper outer panel 20A is a panel attached to the housing 30, which has an upper surface and a right side surface 10b, and is positioned above the housing 30. The upper outer panel 20 is curved and has a plurality of attachment target protrusions 21 and 22 for attachment to a plurality of attachment holes 30e and 30f formed in the upper surface of the housing 30, respectively, and has a right protrusion 20a at its end extending beyond the right side surface 10b. According to the upper outer panel 20A, when the electronic device 1 is positioned such that the right side surface 10b is below, the device body 10 can be protected by the upper outer panel 20A.

[0269] Figures 28A to 28C are diagrams illustrating variations of the heat dissipation devices 70 and 170 described with reference to Figures 6B, 13A to 14C, and 26A to 26C. Figure 28A is a plan view showing the positional relationship between the heat dissipation device 270, the power supply unit 60, and the cooling fan 50 according to the variation. Figure 28B is a perspective view of the heat dissipation device 270. Figure 28C is a cross-sectional view of the heat dissipation device 270, obtained in a cutting plane along the line XXVIIIc-XXVIIIc shown in Figure 28B. Hereinafter, the focus will be on describing the differences between the heat dissipation devices 70 and 170 described herein and the heat dissipation device 270. Items not described with respect to the heat dissipation device 270 may be the same as those in the heat dissipation device 70 (or 170).

[0270] As shown in Figure 28A, the heat dissipation device 270 includes a first radiator (finned block) 271A, a second radiator (finned block) 271B, and a third radiator (finned block) 271C. The first radiator 271A, the second radiator 271B, and the third radiator 271C are arranged in this order from the front side of the device body 10. Heat pipes 73A-73F are arranged along the lower side of the first radiator 271A and the second radiator 271B. Heat pipes 73C and 73D are arranged along the lower side of the third radiator 271C. Heat pipes 73E and 73F have a curved portion 73g that bends upward at the midpoint of heat pipes 73E and 73F. Heat pipes 73E and 73F extend along the upper side of the third radiator 271C.

[0271] The region E1, where the curved portion 73g is located, is situated behind the second radiator 271B and to the left of the third radiator 271C. Region E1 is located on the side of the second radiator 271B opposite to the side where the first radiator 271A is located. Therefore, the radiator positioned behind the first radiator 271A is only the second radiator 271B, and the third radiator 271C does not have a portion located behind the rear surface (air exhaust surface) 271a of the first radiator 271A. Based on this arrangement of radiators 271A-271C, the radiators 271A-271C of the heat dissipation device 270 can be used effectively.

[0272] In a structure where three heatsinks are arranged in a front-to-back direction, the air heated by the foremost heatsink (the one connected to the CPU) is further heated in the second heatsink. Then, the air heated by the second heatsink enters the third heatsink. Therefore, in some cases, it may be difficult to fully utilize the cooling performance of the third heatsink. In the structure of Figure 28A, the third heatsink 271C does not have a portion located behind the rear surface (air exhaust surface) 271a of the first heatsink 271A, thus allowing for effective utilization of the cooling performance of the third heatsink 271C.

[0273] As shown in Figure 28A, the second radiator 271B and the third radiator 271C are arranged in the region to the right of the rear surface 271a of the first radiator 271A. Also in this region, only two radiators (the second radiator 271B and the third radiator 271C) are arranged in the front-back direction. Therefore, each radiator 271A-271C can be used effectively.

[0274] A gap G3 is maintained between the first radiator 271A and the second radiator 271B. Air F3 (unheated air) that has not passed through radiators 271A-271C flows into the gap G3 from the right side (the cooling fan 50 side). Air F3 mixes with the air that has already passed through the first radiator 271A, lowering the air temperature. The cooled air then flows into the second radiator 271B. This structure ensures the cooling performance of the heat sink 270 while reducing the size of the radiators 271A-271C.

[0275] The width of gap G3 in the front-to-back direction (airflow direction) is greater than 5% of the length of gap G3 in the left-to-right direction. More preferably, the width of gap G3 in the front-to-back direction can be greater than 10% of the length of gap G3 in the left-to-right direction. In addition, the width of gap G3 in the front-to-back direction can be less than 30% of the length of gap G3 in the left-to-right direction.

[0276] As shown in Figure 28A, a gap G4 is maintained between the second heat sink 271B and the third heat sink 271C. Air F4 (unheated air) that has not yet passed through heat sinks 271A-271C flows into the gap G4 from the right side (the cooling fan 50 side). Air F4 mixes with the air that has already passed through the second heat sink 271B, lowering its temperature. The cooled air then flows into the third heat sink 271C. This structure ensures the cooling performance of the heat sink 270 while reducing the size of the heat sinks 271A-271C.

[0277] The width of gap G4 in the front-to-back direction (airflow direction) is greater than 5% of the length of gap G4 in the left-to-right direction. The width of gap G4 in the front-to-back direction can be greater than 10% of the length of gap G4 in the left-to-right direction. In addition, the width of gap G4 in the front-to-back direction can be less than 30% of the length of gap G4 in the left-to-right direction.

[0278] As shown in Figure 28B, the heat dissipation device 270 has a base plate 75. Heat sinks 271A, 271B, and 271C are fixed to the upper side of the base plate 75. The base plate 75 is disposed on the upper side of the upper plate shield 51. The base plate 75 can be a metal plate, or it can be composed of multiple metal plates of different materials. Materials used for the base plate 75 include copper, iron, aluminum, etc.

[0279] As shown in Figures 28B and 28C, the substrate 75 has a lower portion 75c on the side of the cooling fan 5. The lower portion 75c is below the portion where the heat sinks 271A to 271C are arranged. In the illustrated example, the lower portion 75c is formed on the front side of the third heat sink 271C and the right side of the second heat sink 271B. That is, the lower portion 75c is formed in the region where the air flowing from the cooling fan 5 is divided into air that passes through the third heat sink 271C and air that passes through the gap G4 F4.

[0280] As shown in Figure 28C, the lower portion 75c is lower than the rear portion 75a of the plate that fixes the third heat sink 271C. The base plate 75 has a guide slope 75b between the bottom portion 75c and the rear portion 75a. The guide slope 75b guides air from the cooling fan 5 to the third heat sink 271C.

[0281] As shown in Figure 28C, the guide slope 75b is located below the foremost portion of the lower edge 271e of the plurality of first fins 271d constituting the third heat sink 271C. According to this structure, air F5 (see Figure 28C) flows along the lower portion 75c of the substrate 75, then flows obliquely upward along the guide slope 75b, passes through the lower edge 271e of the first fins 271d, and flows into the third heat sink 271C. Therefore, the utilization efficiency of the third heat sink 271C can be improved.

[0282] As shown in Figure 28B, in addition to the first fin 271d described above, the third heat sink 271C also has a second fin 271f. The second fin 271f has an attachment portion 271g at its lower edge, which is bent and welded to the substrate 75 in the direction along the substrate 75. On the other hand, the first fin 271d, which has a lower edge 271e located above the guide slope 75b, does not have an attachment portion 271g at its foremost portion. Therefore, air F5 (see Figure 28C) flows obliquely upward along the guide slope 75b, passes through the lower edge 271e of the first fin 271d, and flows into the third heat sink 271C.

[0283] The electronic devices proposed in this disclosure are not limited to the examples described with reference to Figures 1 to 28C, and can be modified in various ways as required by design and other factors.

Claims

1. A heat dissipation device, disposed within a housing, comprising: Multiple heat pipes, including various heat receiving portions of the integrated circuit located in a first direction relative to the integrated circuit and thermally connected to the integrated circuit; The device includes at least one heat sink connected to the plurality of heat pipes, a heat transfer member having a first portion disposed between the heat receiving portions of the plurality of heat pipes and the integrated circuit, and a second portion disposed between the at least one heat sink and the integrated circuit, wherein the heat receiving portions of the plurality of heat pipes are aligned with each other in a second direction orthogonal to the first direction and in contact with the heat receiving portions of adjacent heat pipes, each heat receiving portion having a first width in the first direction and a second width less than the first width in the second direction, a groove formed in the heat transfer member and located in the first direction of the integrated circuit, the heat receiving portions of the plurality of heat pipes being arranged in the groove, and the width of the groove in the second direction corresponding to the width of the entire heat receiving portion of the plurality of heat pipes in the second direction, the housing including a first inlet and a second inlet, the first inlet defining a first airflow channel along a first surface of a circuit board adjacent to the heat receiving portions of the plurality of heat pipes, and the second inlet defining a second airflow channel along a second surface of the circuit board opposite to the first surface.

2. The heat dissipation device according to claim 1, wherein the second width is less than 3 / 4 of the first width.

3. The heat dissipation device according to claim 1, wherein the width of the entire heat receiving portion of the plurality of heat pipes in the second direction corresponds to the width of the integrated circuit in the second direction.

4. The heat dissipation device according to claim 1, wherein, The width of the groove in the second direction corresponds to the width of the integrated circuit in the second direction.

5. The heat dissipation device according to claim 1, wherein, The depth of the groove in the first direction corresponds to the width of the heat receiving portion in the first direction.

6. The heat dissipation device according to claim 1, wherein: The ratio between the widths of at least one of the plurality of heat pipes in the first direction and the second direction varies in the extension direction of the at least one heat pipe.

7. The heat dissipation device according to claim 1, wherein at least one of the plurality of heat pipes includes a heat dissipation portion at a position separated from the heat receiving portion in the extension direction of the at least one heat pipe, the heat dissipation portion being located in a third direction relative to the at least one radiator and connected to the at least one radiator, and the heat dissipation portion having a third width in the third direction and a fourth width greater than the third width in a fourth direction orthogonal to the third direction.

8. The heat dissipation device according to claim 7, wherein the first direction and the third direction are the same direction.

9. The heat dissipation device according to claim 7, wherein the first width is greater than the third width.

10. The heat dissipation device according to claim 7, wherein the fourth width is greater than the second width.

11. The heat dissipation device according to claim 1, wherein at least one of the plurality of heat pipes includes a curved portion that bends along a fifth direction, and the curved portion has a fifth width in the fifth direction and a sixth width that is larger than the fifth width in a sixth direction orthogonal to the fifth direction.

12. The heat dissipation device according to claim 11, wherein the first direction and the fifth direction are the same direction.

13. The heat dissipation device according to claim 1, wherein at least one of the plurality of heat pipes includes a heat dissipation portion at a position separated from the heat receiving portion in the extending direction of the at least one heat pipe, and the at least one heat sink includes a first fin block and a second fin block, the first fin block being connected to the heat receiving portion and the second fin block being connected to the heat dissipation portion.

14. An electronic device, comprising: case; Circuit boards, integrated circuits, and components are mounted on circuit boards; A heat dissipation device includes: a plurality of heat pipes, each including a heat-receiving portion located in a first direction relative to an integrated circuit and thermally connected to the integrated circuit; and at least one heat sink connected to the plurality of heat pipes, wherein the heat-receiving portions of the plurality of heat pipes are aligned with each other in a second direction orthogonal to the first direction and in contact with the heat-receiving portions of adjacent heat pipes, each heat-receiving portion having a first width in the first direction and a second width less than the first width in the second direction, the ratio between the widths of at least one of the plurality of heat pipes in the first and second directions varying in the extension direction of the at least one heat pipe, the at least one of the plurality of heat pipes including an intermediate portion located between the at least one heat sink and a component on a circuit board, the intermediate portion having a first surface facing the heat sink and a second surface facing the circuit board, and a ramp or step formed in the second surface such that the width of the intermediate portion gradually decreases in the first direction, the housing including a first inlet and a second inlet, the first inlet defining a first airflow channel along a first surface of the circuit board adjacent to the heat-receiving portions of the plurality of heat pipes, and the second inlet defining a second airflow channel along a second surface of the circuit board opposite to the first surface.

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