Host simulation plugging device

Abstract

The invention relates to the technical field of host plugging, in particular to host simulation plugging equipment which comprises an upper mold frame and a lower mold frame which are rotationally connected, and the upper mold frame is provided with a first plugging assembly; the first inserting assembly comprises a mounting frame and two first inserting modules which are oppositely arranged, the mounting frame comprises a second frame body and two first frame bodies, the second frame body is provided with a first connecting rod and a mounting block, and the first connecting rod is sleeved with a first compression spring. Through the arrangement of the first frame body, the second frame body and the first compression springs, during insertion, the two first insertion modules rotate along with descending of the upper mold frame, and then the first compression springs are pushed to be compressed. And when the plugging is completed, the two plugging modules I are pushed to reset through the compression spring I. Compared with the prior art, by combining the plug-in process of the ram assembly and the descending process of the upper mold frame, the space occupied by the whole plug-in equipment is reduced, the structure of the whole plug-in equipment is more compact and simplified, and space optimization is facilitated.

Description

Technical Field

[0001] This invention relates to the field of host interface technology, and more specifically to a host analog interface device. Background Technology

[0002] The host computer refers to the main body of a computer excluding input / output devices; it is also the control enclosure that houses the motherboard and other major components. A host computer typically includes a CPU (Central Processing Unit), RAM (memory modules), motherboard, SSD (Solid State Drive), optical drive, power supply, chassis, cooling system, and other input / output controllers and interfaces. During the manufacturing process, the host computer's electrical performance is tested using simulated connection equipment and a testing system.

[0003] Existing analog plug-in devices include a rotatably connected upper and lower mold frames. The main unit is placed on the lower mold frame, and the upper mold frame is equipped with plug-in components for plugging into the various parts of the main unit. The plugging of the RAM component is typically cylinder-driven. During simulated plugging, the upper mold frame is first rotated to bring the cylinder closer to the RAM component on the lower mold frame, and then the cylinder drives the plug-in components for plugging. However, the existing technology requires additional space for the cylinder and its associated piping, making the overall plug-in device structurally complex and hindering space optimization. Summary of the Invention

[0004] The technical solution adopted by this invention to solve its technical problem is: to provide a host simulation plug-in device, comprising:

[0005] An upper mold frame and a lower mold frame are rotatably connected. The lower mold frame is used to place the main unit. The upper mold frame is provided with an upper needle plate, and the upper needle plate is provided with a plug-in component.

[0006] The first insertion assembly includes a mounting frame and two insertion modules rotatably connected to the mounting frame. The two insertion modules are arranged opposite to each other. The mounting frame includes a second frame and two first frames. The second frame is connected to the upper pin plate. The two first frames correspond to the two insertion modules respectively. The insertion modules and their corresponding first frames are rotatably connected by torsion springs. The second frame is provided with a connecting rod and a mounting block. A compression spring is sleeved on the connecting rod. The two first frames are slidably disposed on the connecting rod, and the compression spring is located between the mounting block and the first frame. When inserting the RAM assembly, the two insertion modules rotate as the upper frame descends and push the first frame to move. The compression spring is compressed, and the two insertion modules move closer to each other and are inserted into the RAM assembly.

[0007] Furthermore, the first plug-in module includes a rotating frame and a plug-in component connected to each other. The rotating frame and the corresponding first frame are rotatably connected by a torsion spring. Each of the two rotating frames is provided with a limiting frame. The limiting frame is provided with a limiting protrusion. The first plug-in component is provided with a limiting groove corresponding to the limiting protrusion. The limiting protrusion is inserted into the limiting groove.

[0008] Furthermore, a tension spring is provided between the two limiting frames, and the two rotating frames are elastically connected by the tension spring.

[0009] Furthermore, the second frame is provided with a limiting groove two, and the first plug-in passes through the limiting groove two. When the first plug-in rotates, the first plug-in is located in the limiting groove two.

[0010] Furthermore, the upper needle plate is provided with positioning grooves corresponding to the two connectors respectively.

[0011] Furthermore, the RAM assembly includes two RAM components, and the upper pin plate is provided with multiple positioning posts, the positioning posts corresponding to the space between the two RAM components on the motherboard.

[0012] Furthermore, the upper mold frame is also provided with a second insertion component and a third insertion component. The second insertion component and the third insertion component are respectively used to insert SSD components and WLAN components. The second insertion component and the third insertion component each include a first mounting block, a second mounting block, and a frame body. The first mounting block is connected to the upper pin plate. The first mounting block is provided with a connecting screw. A compression spring is sleeved on the connecting screw. The connecting screw passes through the second mounting block. The compression spring is located between the first mounting block and the second mounting block. The frame body and the second mounting block are rotatably connected by a torsion spring. The frame body is provided with a second insertion component. When the upper mold frame rotates to engage with the lower mold frame, the second insertion component rotates to engage with the SSD component, and the third insertion component rotates to engage with the WLAN component.

[0013] Furthermore, it also includes a drawer assembly, which is disposed on the lower mold frame. The drawer assembly includes a pusher cylinder and a carrier connected to the output end of the pusher cylinder. The carrier is used to place the main unit, and the pusher cylinder is used to drive the main unit to move.

[0014] Furthermore, it also includes a side insertion assembly, which is disposed on the lower mold frame. The side insertion assembly includes an insertion cylinder and a carrier second connected to the output end of the insertion cylinder. The carrier second is provided with a side insertion module, and the insertion cylinder is used to drive the side insertion module to insert with the motherboard.

[0015] Furthermore, it also includes a heat dissipation assembly, which is disposed on the upper pin plate. The heat dissipation assembly includes a heat sink, heat pipes, and a heat dissipation fin assembly, as well as two opposing cooling fans. The heat sink is in contact with the CPU, the heat pipes pass through the heat dissipation fin assembly, and the heat pipes are connected to the heat sink. The heat dissipation fin assembly is located between the two cooling fans, and both cooling fans are oriented towards the heat dissipation fin assembly. During heat dissipation, heat is sequentially transferred along the heat sink and heat pipes to the heat dissipation fin assembly.

[0016] The beneficial effects of this invention are as follows: Through the arrangement of the first frame, the second frame, and the compression spring, during insertion, the two insertion modules rotate as the upper mold frame descends, thereby compressing the compression spring. Upon completion of insertion, as the upper mold frame rises, moving the two insertion modules away from the RAM assembly, the elastic force generated by the compression spring pushes the two insertion modules back to their original position. This combines the RAM assembly insertion process with the descent of the upper mold frame. Compared to the prior art driven by cylinders and their associated pipelines, this reduces the space occupied by the entire insertion device, making its structure more compact and simplified, and facilitating space optimization. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] In the picture: Figure 1 This invention provides an overall structural diagram of a host simulation plug-in device;

[0019] Figure 2 for Figure 1 A three-dimensional structural diagram of the part shown;

[0020] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0021] Figure 4 for Figure 2 Enlarged view at point B in the middle;

[0022] Figure 5 for Figure 2 The three-dimensional structural diagram of the drawer assembly and side insert assembly is shown;

[0023] Figure 6 for Figure 1 The diagram shows a three-dimensional structural representation of the host computer's analog plug-in device.

[0024] Figure 7 for Figure 6 A three-dimensional structural diagram of the structure shown from another perspective;

[0025] Figure 8 for Figure 6The diagram shows a three-dimensional structure of the heat dissipation component.

[0026] Figure 9 for Figure 6 The three-dimensional structural diagram of the second plug-in component is shown;

[0027] Figure 10 for Figure 9 The side view of the second plug-in component shown is in the unplugged state;

[0028] Figure 11 for Figure 9 The side view of the second plug-in component shown is in the plugged-in state;

[0029] Figure 12 for Figure 6 The three-dimensional structural diagram of the plug-in component one is shown;

[0030] Figure 13 for Figure 6 Top view of plug-in component one shown;

[0031] Figure 14 for Figure 6 An exploded view of the plug-in component one shown;

[0032] Figure 15 for Figure 6 The shown is a cross-sectional view of the plug-in assembly in an exploded state.

[0033] Explanation of reference numerals in the attached figures:

[0034] 100. Main unit simulation plug-in device; 10. Upper mold frame; 11. Handle; 12. Upper needle plate; 121. Positioning groove; 122. Positioning post; 20. Lower mold frame; 21. Through groove; 22. Gas spring; 23. Lower needle plate; 30. Plug-in component one; 311. Second frame; 3111. Connecting rod one; 3112. Mounting block; 3113. Compression spring one; 3114. Limiting groove two; 312. First frame; 321. Rotating frame; 3211. Limiting frame; 3212. Limiting protrusion one; 3214. Tension spring; 322. Plug-in component one; 3221. Limiting groove one; 40. Plug-in component two; 41. First mounting block; 411. Connecting screw; 412. Compression spring two; 42. Second mounting block; 43. Frame one; 431. Plug-in component two; 50. Plug-in component three;

[0035] 60. Drawer assembly; 61. Push cylinder; 62. Carrier frame one; 70. Side insertion assembly; 71. Insertion cylinder; 72. Carrier frame two; 731. Plug; 80. Heat dissipation assembly; 81. Heat sink; 82. Heat pipe; 83. Heat dissipation fin assembly; 84. Cooling fan; 201. Motherboard; 2011. Socket; 202. RAM assembly; 203. SSD component; 204. WLAN component; 205. CPU. Detailed Implementation

[0036] To make the technical problem to be solved, the technical solution, and the beneficial effects of this invention clearer, the invention will now be described in detail with reference to the accompanying drawings. This drawing is a simplified schematic diagram, illustrating only the basic aspects of the invention, and therefore only shows the components relevant to the invention. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0037] Please refer to Figure 1 , Figure 6 and Figure 7 The host of the present invention includes a motherboard 201 and a RAM component 202, an SSD component 203, a WLAN component 204, and a CPU 205 disposed on the motherboard 201. The present invention provides a host simulation plug-in device 100, including an upper mold frame 10 and a lower mold frame 20, which are rotatably connected. The lower mold frame 20 is used to place the host. The upper mold frame 10 is provided with an upper pin plate 12, and the upper pin plate 12 is provided with a plug-in component 30.

[0038] Please refer to Figure 6 and Figure 12 The plug-in assembly 30 includes a mounting frame and two plug-in modules 1 rotatably connected to the mounting frame, with the two plug-in modules 1 arranged opposite to each other. The mounting frame includes a second frame 311 and two first frames 312. The second frame 311 is connected to the upper needle plate 12, and the two first frames 312 correspond to the two plug-in modules 1 respectively. The plug-in modules 1 and their corresponding first frames 312 are rotatably connected by torsion springs. The second frame 311 is provided with a connecting rod 1 3111 and a mounting block 3112. A compression spring 1 3113 is sleeved on the connecting rod 1 3111. The two first frames 312 are slidably arranged on the connecting rod 1 3111, and the compression spring 1 3113 is located between the mounting block 3112 and the first frame 312. As the upper mold frame 10 descends, the two plug-in modules 1 approach each other and are inserted into the ram assembly 202.

[0039] Please refer to Figure 14 and Figure 15 The first plug-in module includes a rotating frame 321 and a plug-in component 322 connected to each other. The rotating frame 321 and the corresponding first frame 312 are rotatably connected by a torsion spring. Each of the two rotating frames 321 is provided with a limiting frame 3211, and the limiting frame 3211 is provided with a limiting protrusion 3212. The plug-in component 322 is provided with a limiting groove 3221 corresponding to the limiting protrusion 3212. The limiting protrusion 3212 is inserted into the limiting groove 3221.

[0040] Specifically, in this embodiment, the cross-section of the first connector 322 is a "丄" shaped structure. The connector includes a vertical part and a horizontal part. The first limiting groove 3221 is arranged at the top of the vertical part of the first connector 322. The front end of the horizontal part of the first connector 322 is inserted into the ram assembly 202.

[0041] With the arrangement of the first compression spring 3113, when the two rotating frames 321 rotate as the upper die holder 10 descends, and then drive the upper halves of the first connectors 322 to move away from each other and the lower halves to move closer to each other, the rotating frames 321 push the two first frames 312 to move away from each other, and the first compression spring 3113 is compressed. As a result, part of the force exerted by the first connector 322 during the insertion into the ram assembly 202 is offset, so that the ram assembly 202 is not easily damaged due to excessive insertion force of the first connector 322 during insertion. At the same time, when the insertion is completed and the upper die holder 10 rises to drive the two rotating frames 321 away from the ram assembly 202, the elastic force generated by the first compression spring 3113 pushes the two rotating frames 321 to reset.

[0042] Both of the two limiting frames 3211 are arranged at one end where the two first frames 312 are close to each other. When the rotating frame 321 rotates to drive the first connector 322 to be inserted into the ram assembly 202, the first connector 322 pushes the two limiting frames 3211 to move away from each other.

[0043] Please refer to Figure 14 , a tension spring 3214 is arranged between the two limiting frames 3211, and the two rotating frames 321 are elastically connected by the tension spring 3214. By connecting the two rotating frames 321 with the tension spring 3214, when the upper die holder 10 drives the first connector 322 to approach the ram assembly 202 and insert into the ram assembly 202, the tension spring 3214 is stretched. When the upper die holder 10 rises to drive the two rotating frames 321 away from the ram assembly 202, the tension spring 3214 pulls the two rotating frames 321 and cooperates with the first compression spring 3113 to make the two rotating frames 321 reset.

[0044] At the same time, the tension spring 3214 and the first compression spring 3113 cooperate to further offset part of the force exerted by the first connector 322 during the insertion into the ram assembly 202, so that the ram assembly 202 is not easily damaged due to excessive insertion force of the first connector 322 during insertion, and the stability of the insertion process of the first connector 322 into the ram assembly 202 is improved.

[0045] Please refer to Figure 13As shown in the figure, the X-axis direction and the width direction of the first frame 312 are parallel to each other in the top view, and the Y-axis direction and the length direction of the first frame 312 are parallel to each other in the top view. The second frame 311 is provided with a limiting groove 3114, and the top end of the vertical part of the connector 322 protrudes from the limiting groove 3114. When the connector 322 rotates, it is located within the limiting groove 3114. Specifically, in the top view, the second frame 311 has an overall I-shaped structure, and there are two limiting grooves symmetrically arranged about the central axis of the second frame 311 along the X-direction. The limiting groove 3114 restricts the rotation range of the rotating frame 321, thereby restricting the rotation range of the connector 322, so that in the top view, the connector 322 is less likely to shift relative to the ram assembly 202 in the Y-axis direction.

[0046] Please refer to Figure 6 and Figure 7 Furthermore, the upper needle plate 12 is provided with positioning grooves 121 corresponding to the two plug-in parts respectively. The positioning grooves 121 facilitate the insertion of the upper mold frame 10 into the positioning grooves 121 and into the ram during insertion.

[0047] Specifically, in this embodiment, the RAM assembly 202 includes two RAM components arranged opposite to each other. Two plug-in modules correspond to the two RAM components respectively. To prevent the two RAM components from approaching and squeezing each other during insertion due to excessive force applied by the plug-in module 322, the upper pin plate 12 is provided with multiple positioning posts 122. The positioning posts 122 correspond to the spaces between the two RAM components on the main board 201. When the upper mold frame 10 drives the two plug-in modules 322 to insert into the two RAM components respectively, the positioning posts 122 are inserted into the spaces between the two RAM components to limit their movement, preventing damage caused by excessive force applied by the plug-in module 322.

[0048] Please refer to Figure 13 and Figure 15When inserting the RAM assembly 202, initially, the two insert pieces 322 are tilted. The two insert pieces 322 first move to positions corresponding to the insertion points of the two RAM parts as the upper mold frame 10 descends. As the upper mold frame 10 descends, the two insert pieces 322 rotate counter-clockwise with their corresponding rotating frames 321. The tops of the vertical portions of the two insert pieces 322 move towards the mounting block 3112, compressing the compression spring 3113 and stretching the tension spring 3214. The horizontal portions of the two insert pieces 322 move closer to their corresponding RAM parts, thus inserting the RAM parts. After insertion, the upper mold frame 10 raises the two insert pieces 322, the compression spring 3113 and tension spring 3214 reset, and the two insert pieces 322 rotate clockwise back to their original positions.

[0049] Please refer to Figure 9 , Figure 10 and Figure 11 The upper mold frame 10 is also equipped with a second plug-in component 40 and a third plug-in component 50. The second plug-in component 40 and the third plug-in component 50 are used to plug in the SSD component 203 and the WLAN component 204, respectively. Both the second plug-in component 40 and the third plug-in component 50 include a first mounting block 41, a second mounting block 42 and a frame 43. The first mounting block 41 is connected to the upper pin plate 12. The first mounting block 41 is equipped with a connecting screw 411, and a compression spring is sleeved on the connecting screw 411. Spring 412 and connecting screw 411 are inserted into the second mounting block 42. Compression spring 412 is located between the first mounting block 41 and the second mounting block 42. Frame 43 and the second mounting block 42 are rotatably connected by a torsion spring. Frame 43 is provided with connector 431. When the upper mold frame 10 rotates to engage with the lower mold frame 20, connector 431 rotates to engage with the SSD component 203, and connector assembly 50 rotates to engage with the WLAN component 204. Specifically, connecting screw 411 includes a rod head and a round rod with different diameters. The diameter of the rod head is larger than the diameter of the round rod. Compression spring 412 is sleeved on the round rod. The rod head is located at the end of the round rod that protrudes from the second mounting block 42. The diameter of the round hole in the second mounting block 42 through which the round rod passes is smaller than the diameter of the rod head, thus making it difficult for the second mounting block 42 to detach from the first mounting block 41.

[0050] Please refer to Figure 2 and Figure 5The host simulation plug-in device 100 also includes a drawer assembly 60, which is mounted on the lower mold frame 20. The drawer assembly 60 includes a pusher cylinder 61 and a carrier frame 62 connected to the output end of the pusher cylinder 61. The carrier frame 62 is used to hold the host, and the pusher cylinder 61 is used to drive the host to move. The lower mold frame 20 is provided with a through slot 21 for the carrier frame 62 to pass through. The carrier frame 62 is provided with a lower needle plate 23, which passes through the carrier frame 62 and contacts the main board 201. Both the upper needle plate 12 and the lower needle plate 23 are electrically connected to the test system, and the upper needle plate 12 and the lower needle plate 23 are used to cooperate with the test system to test the electrical performance of both sides of the main board 201.

[0051] Please refer to Figure 2 , Figure 3 and Figure 5 The host simulation plug-in device 100 also includes a side plug-in component 70, which is disposed on the lower mold frame 20. The side plug-in component 70 includes a plug-in cylinder 71 and a carrier frame 72 connected to the output end of the plug-in cylinder 71. The carrier frame 72 is provided with a side plug-in module. The plug-in cylinder 71 is used to drive the side plug-in module to plug into the motherboard 201.

[0052] Specifically, the side-plug module includes multiple plugs 731 that are electrically connected to the test system, and the main board 201 is provided with sockets 2011 corresponding to the plugs 731.

[0053] Please refer to Figure 8 The host simulation plug-in device 100 also includes a heat dissipation component 80, which is disposed on the upper pin plate 12. The heat dissipation component 80 includes a heat sink 81, a heat pipe 82, and a heat dissipation fin assembly 83, as well as two opposing cooling fans 84. The heat sink 81 is in contact with the CPU 205. The heat pipe 82 passes through the heat dissipation fin assembly 83 and is connected to the heat sink 81. The heat dissipation fin assembly 83 is located between the two cooling fans 84, and both cooling fans 84 are oriented towards the heat dissipation fin assembly 83. During heat dissipation, heat is transferred sequentially along the heat sink 81 and the heat pipe 82 to the heat dissipation fin assembly 83, and then the heat is blown away by the cooling fans 84.

[0054] Specifically, in this embodiment, the heat sink 81, heat pipe 82, and heat dissipation fin assembly 83 are all made of metals with good heat dissipation performance. The heat sink 81 is made of copper, the heat pipe 82 is made of copper pipe, and the heat dissipation fin assembly 83 is made of aluminum fin assembly.

[0055] In existing technologies, heat dissipation for the CPU 205 on the motherboard 201 is typically achieved by having a heatsink fin assembly formed by stacked multiple heatsinks contact the CPU 205. After heat is transferred through the heatsink fins, it is then cooled naturally by the air. However, the heat dissipation component 80 in this application first contacts the CPU 205 via a heatsink block 81. Heat from the CPU 205 is then transferred sequentially along the heatsink block 81 and heat pipes 82 to the heatsink fin assembly 83, and finally cooled by airflow from two opposing cooling fans 84. Compared to the heatsink fin assembly in existing technologies, this method extends the heat dissipation path and, through convection created by the two opposing cooling fans 84, achieves better heat dissipation.

[0056] Please refer to Figure 1 The lower mold frame 20 is equipped with a gas spring 22, and the output end of the gas spring 22 is connected to the upper mold frame 10. When the upper mold frame 10 rotates so that the first plug-in component 30, the second plug-in component 40 and the third plug-in component 50 are away from the main unit, the gas spring 22 supports the upper mold frame 10.

[0057] Please refer to Figure 1 To facilitate the rotation of the upper mold frame 10, a handle 11 is provided on the upper mold frame 10.

Claims

1. A host simulation plug-in device, characterized in that, include: An upper mold frame and a lower mold frame are rotatably connected. The lower mold frame is used to place the main unit. The upper mold frame is provided with an upper needle plate, and the upper needle plate is provided with a plug-in component. The first insertion assembly includes a mounting frame and two insertion modules rotatably connected to the mounting frame. The two insertion modules are arranged opposite to each other. The mounting frame includes a second frame and two first frames. The second frame is connected to the upper pin plate. The two first frames correspond to the two insertion modules respectively. The insertion modules and their corresponding first frames are rotatably connected by torsion springs. The second frame is provided with a connecting rod and a mounting block. A compression spring is sleeved on the connecting rod. The two first frames are slidably disposed on the connecting rod, and the compression spring is located between the mounting block and the first frame. When inserting the RAM assembly, the two insertion modules rotate as the upper frame descends and push the first frame to move. The compression spring is compressed, and the two insertion modules move closer to each other and are inserted into the RAM assembly.

2. The host simulation plug-in device according to claim 1, characterized in that: The first plug-in module includes a rotating frame and a plug-in component connected to each other. The rotating frame and the corresponding first frame are rotatably connected by a torsion spring. Each of the two rotating frames is provided with a limiting frame. The limiting frame is provided with a limiting protrusion. The first plug-in component is provided with a limiting groove corresponding to the limiting protrusion. The limiting protrusion is inserted into the limiting groove.

3. The host simulation plug-in device according to claim 2, characterized in that: A tension spring is provided between the two limiting frames, and the two rotating frames are elastically connected by the tension spring.

4. The host simulation plug-in device according to claim 3, characterized in that: The second frame is provided with a limiting groove 2. The first plug-in passes through the limiting groove 2. When the first plug-in rotates, the first plug-in is located in the limiting groove 2.

5. The host simulation plug-in device according to claim 1, characterized in that: The upper needle plate is provided with positioning grooves that correspond to the two connectors.

6. The host simulation plug-in device according to claim 5, characterized in that: The RAM assembly includes two RAM components, and the upper pin plate is provided with multiple positioning posts, the positioning posts and the space between the two RAM components on the motherboard correspond to each other.

7. The host simulation plug-in device according to claim 1, characterized in that: The upper mold frame is also provided with a second plug-in component and a third plug-in component. The second plug-in component and the third plug-in component are respectively used to plug in SSD components and WLAN components. The second plug-in component and the third plug-in component each include a first mounting block, a second mounting block, and a frame body. The first mounting block is connected to the upper pin plate. The first mounting block is provided with a connecting screw. The connecting screw is fitted with a compression spring. The connecting screw passes through the second mounting block. The compression spring is located between the first mounting block and the second mounting block. The frame body and the second mounting block are rotatably connected by a torsion spring. The frame body is provided with a second plug-in component. When the upper mold frame rotates to engage with the lower mold frame, the second plug-in component rotates to engage with the SSD component, and the third plug-in component rotates to engage with the WLAN component.

8. The host simulation plug-in device according to claim 1, characterized in that: It also includes a drawer assembly, which is disposed on the lower mold frame. The drawer assembly includes a pusher cylinder and a carrier connected to the output end of the pusher cylinder. The carrier is used to place the main unit, and the pusher cylinder is used to drive the main unit to move.

9. The host simulation plug-in device according to claim 1, characterized in that: It also includes a side insertion assembly, which is disposed on the lower mold frame. The side insertion assembly includes an insertion cylinder and a carrier second connected to the output end of the insertion cylinder. The carrier second is provided with a side insertion module. The insertion cylinder is used to drive the side insertion module to insert into the motherboard.

10. The host simulation plug-in device according to claim 1, characterized in that: It also includes a heat dissipation assembly, which is disposed on the upper pin plate. The heat dissipation assembly includes a heat sink, heat pipes, and a heat dissipation fin assembly, as well as two opposing cooling fans. The heat sink is in contact with the CPU. The heat pipes pass through the heat dissipation fin assembly and are connected to the heat sink. The heat dissipation fin assembly is located between the two cooling fans, and both cooling fans are oriented towards the heat dissipation fin assembly. During heat dissipation, heat is sequentially transferred along the heat sink and heat pipes to the heat dissipation fin assembly.

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