Semiconductor thermoelectric device welding device with temperature and pressure control function

Abstract

The utility model relates to the technical field of semiconductor thermoelectric device welding, and provides a semiconductor thermoelectric device welding device with temperature and pressure control functions, which comprises an upper heating component capable of acting on the upper end of a semiconductor thermoelectric device and a lower heating component capable of being supported at the lower end of the semiconductor thermoelectric device. The upper heating component is connected with a first temperature control component used for adjusting the heating temperature of the upper heating component, and the lower heating component is connected with a second temperature control component used for adjusting the heating temperature of the lower heating component. The upper heating part or / and the lower heating part is connected with a pressure adjusting part used for adjusting the pressure borne by the semiconductor thermoelectric device. On the basis of double-sided synchronous heating temperature control, one-step welding assembly of the flat plate type thermoelectric device is achieved, on the basis of accurate temperature control, through adjustment of the pressure adjusting component, the welding quality of the thermoelectric device can be further improved, and the reliability of the thermoelectric device product is better.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor thermoelectric device welding, and in particular relates to a semiconductor thermoelectric device welding device capable of accurately controlling temperature and pressure. Background Art

[0002] In the current field of semiconductor thermoelectric device welding, the types of welding platforms (welding devices) are divided into fixed welding platforms, mobile welding platforms, adjustable welding platforms, special welding platforms and three-dimensional flexible welding platforms according to the shape of the base material.

[0003] For traditional flat-plate thermoelectric devices, the use of a fixed welding platform for welding and assembly is currently a relatively mature process. The specific welding steps are: first, pressurize and heat the lower substrate filled with thermoelectric particles so that one side of the thermoelectric particles is welded to the lower substrate; then tightly fit the upper substrate to the other side, and pressurize and heat again to complete the assembly. Thermoelectric devices that use a fixed welding platform for two-step welding have a high yield rate and are widely used in industrial assembly lines for thermoelectric refrigeration devices.

[0004] To prevent the thermoelectric particles from shifting during the assembly process, the two-step welding process must wait until the interface between the lower substrate and the thermoelectric particles is cooled down until the solder is completely solidified, which consumes some waiting time. In addition, the current production process does not have strict parameter control for the welding heating and pressurization of the upper and lower substrates and particles of the device. For example, in order to save time and cost, the heating head of the two-step welding often applies constant pressure and fits the upper substrate to achieve welding after preheating. For good quality welding joints, the pressure and temperature often need to be adjusted over time during the entire welding process to improve the wettability of the solder at the interface. Therefore, the two-step welding process used in most of the current thermoelectric device assembly processes is time-consuming, and there are hidden dangers in the overall welding quality of thermoelectric devices, and the product reliability is poor. Utility Model Content

[0005] The purpose of the utility model is to overcome at least one of the deficiencies of the above-mentioned prior art, and to provide a semiconductor thermoelectric device welding device with temperature and pressure control functions, so as to realize one-step welding assembly of flat-plate thermoelectric devices, improve the welding quality of thermoelectric devices, and improve the reliability of thermoelectric device products.

[0006] The technical solution of the utility model is: a semiconductor thermoelectric device welding device with temperature and pressure control functions, comprising an upper heating component that can act on the upper end of the semiconductor thermoelectric device and a lower heating component that can be supported on the lower end of the semiconductor thermoelectric device; the upper heating component is connected to a first temperature control component for adjusting the heating temperature of the upper heating component, and the lower heating component is connected to a second temperature control component for adjusting the heating temperature of the lower heating component;

[0007] The upper heating component and / or the lower heating component are connected to a pressure regulating component for regulating the pressure applied to the semiconductor thermoelectric device.

[0008] Optionally, the lower heating component or the upper heating component is connected to a pressure detection component for detecting the magnitude of the pressure acting on the semiconductor thermoelectric device.

[0009] Optionally, a height-adjustable lifting component is provided below the lower heating component, and the pressure detection component is provided between the lifting component and the lower heating component.

[0010] Optionally, the pressure detection component is connected to a display device for displaying the pressure value.

[0011] Optionally, the pressure regulating component includes a column fixed to a mounting seat, a sliding member slidable along the column, and an adjusting member connected to the sliding member and used to drive the sliding member to slide; the upper heating component is connected to the sliding member.

[0012] Optionally, the adjusting member is a manual operating lever; and a self-locking structure is provided between the adjusting member and the column or the sliding member.

[0013] Optionally, the pressure detection component is a cylindrical weighing sensor, and the weighing sensor is centrally arranged on the upper end surface of the lifting plate.

[0014] Optionally, the sliding member is provided with a temperature control adjustment button or a temperature control adjustment knob, and the sliding member is provided with a temperature status indicator light or a temperature status display screen.

[0015] Optionally, the lifting component includes a lifting seat and a lifting plate that can be lifted and lowered relative to the lifting seat, the lifting plate is arranged above the lifting seat, the lifting plate is connected to the lifting seat through a connecting rod mechanism, and the lifting seat or the lifting plate is provided with a fine-tuning mechanism for driving the connecting rod mechanism to lift the lifting plate.

[0016] Optionally, the second temperature control component is connected to an external temperature control system.

[0017] The utility model provides a semiconductor thermoelectric device welding device with temperature and pressure control functions, which realizes the one-step welding assembly of flat-plate thermoelectric devices based on double-sided synchronous heating and temperature control. Moreover, on the basis of precise temperature control, the welding quality of the thermoelectric device can be further improved through the adjustment of the pressure adjustment component, and the reliability of the thermoelectric device product is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a three-dimensional schematic diagram of a semiconductor thermoelectric device welding device with temperature and pressure control functions provided by an embodiment of the utility model. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0021] It should be noted that the terms “setting” and “connection” should be understood in a broad sense. For example, it can be directly setting or connecting, or it can be indirectly setting or connecting through a central component or a central structure.

[0022] In addition, if there are terms such as "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating orientation or positional relationship in the embodiments of the present invention, they are based on the orientation or positional relationship or the conventional placement state or use state shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the structure, feature, device or element referred to must have a specific orientation or positional relationship, nor must it be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0023] The various specific technical features and embodiments described in the specific implementation methods can be combined in any suitable manner unless there is any contradiction. For example, different implementation methods can be formed by combining different specific technical features / embodiments. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features / embodiments in the present utility model will not be described separately.

[0024] like Figure 1As shown, a semiconductor thermoelectric device welding device with temperature and pressure control functions provided by an embodiment of the utility model can be used for welding a thermoelectric device 90. This embodiment takes a flat-plate semiconductor thermoelectric device as an example, including an upper substrate of the thermoelectric device (not marked in the figure) and a lower substrate of the thermoelectric device (not marked in the figure). The above-mentioned welding device includes an upper heating component 10 that can act on the upper end of the semiconductor thermoelectric device 90 (the upper substrate of the thermoelectric device) and a lower heating component 20 that can be supported on the lower end of the semiconductor thermoelectric device 90 (the lower substrate of the thermoelectric device); the upper heating component 10 is connected to a first temperature control component (not shown in the figure) for adjusting the heating temperature of the upper heating component 10, and the lower heating component 20 is connected to a second temperature control component (not shown in the figure) for adjusting the heating temperature of the lower heating component 20. The heating temperatures of the upper heating component 10 and the lower heating component 20 can be directly and accurately controlled. The upper heating component 10 and the lower heating component 20 act on the upper substrate and the lower substrate of the thermoelectric device, so that the upper substrate and the lower substrate of the thermoelectric device are heated and pressed. The heating temperatures of the upper substrate and the lower substrate of the thermoelectric device can be adjusted according to welding needs, thereby realizing double-sided synchronous heating and temperature control of the thermoelectric device 90. The upper heating component 10 and / or the lower heating component 20 are connected to a pressure regulating component 30, and the pressure regulating component 30 is used to adjust the pressure on the semiconductor thermoelectric device 90, that is, the pressure between the upper substrate of the thermoelectric device and the lower substrate of the thermoelectric device can also be accurately adjusted as needed. Based on the double-sided simultaneous heating and temperature control of the thermoelectric device 90, a one-step welding assembly of the flat-plate thermoelectric device 90 is realized; moreover, on the basis of precise temperature control, the welding quality of the thermoelectric device 90 can be further improved through the adjustment of the pressure regulating component 30, and the reliability of the thermoelectric device 90 product is better.

[0025] Specifically, the lower heating component 20 or the upper heating component 10 is connected with a pressure detection component 40 for detecting the pressure acting on the semiconductor thermoelectric device 90. In this embodiment, the pressure detection component 40 is arranged at the bottom of the lower heating component 20, and the structural reliability is good. Of course, the pressure detection component 40 can also be arranged above the upper heating component 10 or other suitable places.

[0026] Specifically, the pressure adjustment component 30 includes a column 31 fixed to the mounting seat 50, a sliding member 32 (sliding block) that can slide along the column 31, and an adjustment member 33 connected to the sliding member 32 and used to drive the sliding member 32 to slide. The mounting seat 50 can be a stand or a load-bearing workbench (metal plate) with good stability; the upper heating component 10 is connected to the sliding member 32, and the sliding member 32 can be manually adjusted. When the sliding member 32 slides up and down, it drives the upper heating component 10 to slide up and down synchronously to adjust the distance between the upper heating component 10 and the lower heating component 20, and then the pressure applied to the upper and lower ends of the thermoelectric device 90 can be adjusted. The upper heating component 10 may include an upper heating plate 11, the bottom surface of the upper heating plate 11 is a plane acting on the top of the upper substrate of the thermoelectric device, and an electric heating device is arranged inside or on the top of the upper heating plate 11 so that the temperature of the upper heating plate 11 is heated to a set range. The lower heating component 20 may include a lower heating plate 21, the top surface of which is a plane acting on the bottom of the lower substrate of the thermoelectric device, and an electric heating device is arranged inside or at the bottom of the lower heating plate 21 to heat the temperature of the lower heating plate 21 to a set range.

[0027] In this embodiment, the adjusting member 33 is a manual joystick (anti-slip handle). When the upper and lower ends of the thermoelectric device 90 are clamped between the upper heating component 10 and the lower heating component 20, the manual joystick can be turned to make the sliding member 32 and the upper heating plate 11 slide downward, which can increase the pressure applied between the upper substrate of the thermoelectric device and the lower substrate of the thermoelectric device. The manual joystick can be turned in the opposite direction to make the sliding member 32 and the upper heating plate 11 slide upward, which can reduce the pressure applied between the upper substrate of the thermoelectric device and the lower substrate of the thermoelectric device, and the adjustment is convenient. In specific applications, the sliding of the sliding member 32 can also be controlled by electric control, such as using a linear motor or other driving component that can accurately control the sliding distance, so that the upper heating component 10 can slide up and down accurately, thereby controlling the pressure between the upper substrate of the thermoelectric device and the lower substrate of the thermoelectric device. The driving component can be connected to the control module for automatic and intelligent operation.

[0028] Specifically, a self-locking structure is provided between the adjusting member 33 and the column 31 or the sliding member 32, and the sliding member 32 can only be driven by the adjusting member 33, and the sliding member 32 cannot drive the adjusting member 33. In specific applications, a worm gear structure, a screw structure, etc. can be used to achieve self-locking of the sliding member 32. For example, the slider is connected to a rotatable gear, the main column is provided with a rack structure, and the gear is meshed with the rack structure. The adjusting member 33 (anti-slip handle) is connected to a worm, and the worm is meshed with the gear to form a worm gear structure.

[0029] Specifically, a height-adjustable lifting component 60 is arranged below the lower heating component 20, and the pressure detection component 40 is arranged between the lifting component 60 and the lower heating component 20. The lifting component 60 can adjust the height of the lower heating component 20 so that the welding device can easily adapt to the welding of thermoelectric devices 90 of different height specifications, and has good versatility.

[0030] Specifically, the pressure detection component 40 is connected to a display device 41 (numerical display screen) for displaying the pressure value. The pressure detection component 40 may have a zeroing function, which can accurately reflect the pressure between the upper substrate of the thermoelectric device and the lower substrate of the thermoelectric device in real time, and is conducive to the control of the adjustment member 33 in the welding connection, so that the acting pressure between the upper substrate of the thermoelectric device and the lower substrate of the thermoelectric device is within a set range. In specific applications, in order to achieve automation or intelligence, the pressure detection component 40 can be connected to the control module to facilitate the control of the pressure adjustment component 30 by the control module, so that the acting pressure between the upper substrate of the thermoelectric device and the lower substrate of the thermoelectric device is automatically adjusted to a preset pressure value within a preset time period.

[0031] Specifically, the pressure detection component 40 is a cylindrical weighing sensor, which is centrally arranged on the upper end surface of the lifting plate 62, has good stability and high pressure detection accuracy, and is used for weighing sensor connection.

[0032] Specifically, the lifting component 60 includes a lifting seat 61 and a lifting plate 62 that can be lifted and lowered relative to the lifting seat 61. The lifting plate 62 is arranged above the lifting seat 61, and the lifting seat 61 can be fixed to the mounting seat 50. The lifting plate 62 is connected to the lifting seat 61 through a connecting rod mechanism 63. The lifting seat 61 or the lifting plate 62 is provided with a fine adjustment mechanism for driving the connecting rod mechanism 63 to lift the lifting plate 62. The fine adjustment mechanism can adopt a screw transmission mechanism, etc., which has high adjustment accuracy. Of course, hydraulic devices, linear motors, etc. can also be used to adjust the lifting and lowering of the lifting plate 62. In this embodiment, the connecting rod mechanism 63 can be an X-shaped connecting rod, one side of which is rotatably connected to the lifting seat 61 and the lifting plate 62, and the other side is slidably rotatably connected to the lifting seat 61 and the lifting plate 62 and connected to the screw transmission mechanism. The front of the lifting plate 62 can be provided with an adjustment knob 64, which is connected to the screw. By rotating the adjustment knob 64, the lifting plate 62 can be lifted and lowered.

[0033] Specifically, the sliding member 32 is provided with a temperature control adjustment button or a temperature control adjustment knob 35, and the sliding member 32 is provided with a temperature status indicator light or a temperature status display screen, so as to accurately determine whether the temperature reaches the set range. In this embodiment, the temperature control adjustment knob 35 is a mechanical temperature adjustment knob, and a scale indicator line is arranged around it.

[0034] Specifically, the second temperature control component can be connected to an external temperature control system 70, which has high reliability. The external temperature control system 70 can be provided with a display screen, a temperature control knob or a button, etc.

[0035] In specific applications, the anti-slip handle controls the descending height of the upper heating plate 11 through the pressure adjustment component 30, which can preliminarily adjust the space required for welding; the mechanical temperature adjustment knob 35 can accurately control the temperature of the upper heating plate 11; the upper heating plate 11 is used to fit tightly against the upper substrate of the flat-plate thermoelectric device to achieve the pressurized heating function. The lower heating component 20 is a split high-precision constant temperature heating table, including a lower heating plate 21 (heating table) and an external temperature control system temperature 70. The heating table can fit the lower substrate of the flat-plate thermoelectric device, and the welding temperature can be accurately controlled by an external control system.

[0036] The weighing sensor and the special digital display instrument constitute a high-precision pressure weighing sensor system, wherein the model of the weighing sensor can also be replaced according to the pressure required for welding. It is assembled between the lower heating component 20 (split high-precision constant temperature heating table) and the lifting plate 62 of the lifting component 60 (precision fine-tuning displacement table). The small volume design of the weighing sensor enables it to have a smaller eccentricity error. The weighing sensor has a millivolt signal output interface, which can perform high dynamic response to the load, and has a good application effect.

[0037] The precision fine-tuning displacement stage is a Z-axis (height direction) travel lifting stage, the lower plane is placed on the load-bearing workbench, and the upper plane carries a high-precision weighing sensor, a split high-precision constant temperature heating stage and a thermoelectric device 90. Rotating the side adjustment knob 64 can drive the screw drive to move the lifting plate 62 to adjust the table height, so as to control the pressure on the upper and lower end surfaces of the welding workpiece.

[0038] In this embodiment, the anti-slip handle of the pressure adjustment component 30 has a self-locking function to ensure that the heating plate descends and remains at a suitable working height; the mechanical version temperature control temperature can be adjusted between 0-350°C, and the temperature is controlled by a knob (set the knob to the specified temperature, and when the temperature is reached, the temperature indicator red light will jump to green); the upper heating component 10 and / or the lower heating component 20 can be equipped with a balance adjustment screw to ensure that the heating plane and the upper and lower planes of the welding workpiece are fully fitted.

[0039] Furthermore, the temperature of the split high-precision constant temperature heating platform (the lower heating plate 21 of the lower heating component 20) can be adjusted between 0-350°C. The external temperature control system temperature 70 can be equipped with a built-in cooling fan to ensure a good heat dissipation environment during the operation of the equipment, and can be configured with a PID control system for precise automatic temperature control; the upper heating plate 11 and the lower heating plate 21 can be made of aluminum plates with good thermal conductivity.

[0040] Furthermore, the cylindrical weighing sensor can bear a pressure between 0-200N and an accuracy of 0.1N; the surface can be made of stainless steel to ensure the corrosion resistance and high temperature resistance of the sensor; the small size of the sensor ensures that the measurement has a small eccentricity error, and its dedicated digital display instrument (display device 41) has high-precision anti-shake function, and can be zeroed in real time during the test. The sensor is placed at the center of the upper and lower contact surfaces when in use. The precision fine-tuning displacement stage (lifting component 60) can be driven by a finely ground screw, with a load range of 0-300N. It uses hard aluminum material and a finely processed screw to ensure that the working distance will not rebound within the load range, indirectly ensuring the stability of the welding pressure.

[0041] Furthermore, the upper heating component 10 (manual hot press), (lower heating component 20) split high-precision constant temperature heating table and pressure detection component 40 (high-precision pressure weighing sensor system) all use independent power supplies and can be operated separately. The semiconductor thermoelectric device welding device with temperature and pressure control functions provided by the embodiment of the utility model realizes the one-step welding assembly of the flat-plate thermoelectric device based on double-sided synchronous heating and temperature control. On the basis of precise temperature control capability, by monitoring the pressure and adjusting it in real time, the welding quality of the thermoelectric device can be further improved, and the reliability of the thermoelectric device product is better.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent substitution or improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor thermoelectric device welding device with temperature and pressure control functions, characterized in that: The invention comprises an upper heating component which can act on the upper end of the semiconductor thermoelectric device and a lower heating component which can be supported on the lower end of the semiconductor thermoelectric device; the upper heating component is connected to a first temperature control component for adjusting the heating temperature of the upper heating component, and the lower heating component is connected to a second temperature control component for adjusting the heating temperature of the lower heating component; The upper heating component and / or the lower heating component are connected to a pressure regulating component for regulating the pressure applied to the semiconductor thermoelectric device.

2. A semiconductor thermoelectric device welding device with temperature and pressure control functions as claimed in claim 1, characterized in that: The lower heating component or the upper heating component is connected to a pressure detection component for detecting the magnitude of the pressure acting on the semiconductor thermoelectric device.

3. A semiconductor thermoelectric device welding device with temperature and pressure control functions as claimed in claim 2, characterized in that: A height-adjustable lifting component is arranged below the lower heating component, and the pressure detection component is arranged between the lifting component and the lower heating component.

4. A semiconductor thermoelectric device welding device with temperature and pressure control functions as claimed in claim 2, characterized in that: The pressure detection component is connected to a display device for displaying the pressure value.

5. A semiconductor thermoelectric device welding device with temperature and pressure control functions as claimed in any one of claims 2 to 4, characterized in that: The pressure regulating component comprises a column fixed to a mounting seat, a sliding member which can slide along the column, and an adjusting member which is connected to the sliding member and is used to drive the sliding member to slide; the upper heating component is connected to the sliding member.

6. A semiconductor thermoelectric device welding device with temperature and pressure control functions as claimed in claim 5, characterized in that: The adjusting member is a manual operating lever; a self-locking structure is arranged between the adjusting member and the column or the sliding member.

7. A semiconductor thermoelectric device welding device with temperature and pressure control functions as claimed in claim 5, characterized in that: The sliding part is provided with a temperature control adjustment button or a temperature control adjustment knob, and the sliding part is provided with a temperature status indicator light or a temperature status display screen.

8. A semiconductor thermoelectric device welding device with temperature and pressure control functions as claimed in claim 3, characterized in that: The lifting component includes a lifting seat and a lifting plate that can be lifted and lowered relative to the lifting seat. The lifting plate is arranged above the lifting seat. The lifting plate is connected to the lifting seat through a connecting rod mechanism. The lifting seat or the lifting plate is provided with a fine-tuning mechanism for driving the connecting rod mechanism to lift the lifting plate.

9. A semiconductor thermoelectric device welding device with temperature and pressure control functions as claimed in claim 8, characterized in that: The pressure detection component is a cylindrical weighing sensor, and the weighing sensor is centrally arranged on the upper end surface of the lifting plate.

10. A semiconductor thermoelectric device welding device with temperature and pressure control functions as claimed in claim 1, characterized in that: The second temperature control component is connected to an external temperature control system.

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