Wafer reverse mold mechanism

Abstract

The utility model relates to the field of wafer production, in particular to a wafer reverse mold mechanism, which comprises a wafer assembly feeding station, a reverse mold station, a wafer assembly discharging station and a carrying disc feeding and discharging station, and the wafer assembly feeding station, the carrying disc feeding and discharging station and the wafer assembly discharging station are arranged on the peripheral side of the reverse mold station at intervals. A reverse mold rotating disc and a hot pressing mechanism are arranged on the reverse mold station, a carrying disc is placed on the reverse mold rotating disc, a rotary clamping jaw mechanism is arranged on the wafer assembly feeding station, and the rotary clamping jaw mechanism clamps and rotates a wafer assembly and feeds the wafer assembly to the carrying disc on the reverse mold rotating disc; the hot pressing mechanism is located on a wafer assembly feeding station above the reverse mold rotating disc to conduct automatic feeding on wafers, crystalline grains are transferred to a new film layer from an old film layer through hot pressing on a reverse mold station, and the wafers are turned over. The carrying disc feeding and discharging station carries out discharging on the no-load disc located above, and the wafer assembly discharging station carries out discharging on the wafer assembly.

Description

Technical Field

[0001] The utility model relates to the field of wafer production, in particular to a wafer mold-turning mechanism. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. The processing of wafers mainly includes deoxidation and purification, treatment procedures and needle testing procedures. The basic steps of the processing procedure are to first clean the wafer properly, then oxidize and chemically vapor deposit on its surface, and then repeat the steps of coating, exposure, development, etching, ion implantation, metal sputtering, etc., and finally complete the processing and production of several layers of circuits and components on the wafer.

[0003] During the processing, the wafer needs to be turned over. Please refer to the attached Figure 1 and Figure 7 , at this time, the wafer is bonded to the film layer, and an iron ring is also bonded to the top surface of the film layer. The iron ring surrounds the wafer, and the wafer, iron ring and film layer together form a wafer assembly, and the iron ring and film layer together form a carrier for carrying the wafer. The core particles are covered inside by the new and old films, and the core particles are transferred from the old film to the new film through hot pressing to realize the flipping of the wafer. The empty carrier located below carries the flipped wafer to form a new wafer assembly, and the carrier located above becomes an empty carrier for unloading the carrier and unloading the new wafer assembly. Among them, the application number is CN202022550261.4, and the name is a utility model patent for a wafer flipping device. The wafer in the wafer box is taken out by using the first carrier, and then the wafer is placed on the second carrier. The fixture controller is used to control the fixture to shrink and fix the wafer, and then the rotary electric cylinder drives the second support shaft to rotate 180° to flip the wafer. However, the efficiency of the device in flipping the wafer is low. Utility Model Content

[0004] The utility model aims to provide a wafer inverting mechanism, aiming to improve the problem of low wafer turning efficiency of a conventional wafer turning mechanism.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A wafer inverting mechanism comprises a wafer assembly loading station, an inverting station, a wafer assembly unloading station and a tray loading and unloading station.

[0007] The wafer assembly loading station, the tray loading and unloading station and the wafer assembly unloading station are arranged at intervals on the peripheral side of the mold inversion station.

[0008] The inverted mold station is provided with an inverted mold turntable and a hot pressing mechanism, a carrier plate is placed on the inverted mold turntable, and a rotating clamping mechanism is provided on the wafer assembly loading station, and the rotating clamping mechanism clamps, rotates and loads the wafer assembly to the carrier plate on the inverted mold turntable; the hot pressing mechanism is located above the inverted mold turntable, and the hot pressing mechanism hot presses the wafer assembly on the inverted mold turntable so that the wafer adheres to the carrier plate below;

[0009] The loading and unloading station of the carrier is provided with a loading and unloading clamping claw mechanism, and the loading and unloading clamping claw mechanism unloads the carrier on the inverted mold turntable or loads the carrier onto the inverted mold turntable;

[0010] The wafer assembly unloading station is provided with an unloading clamping mechanism, and the unloading clamping mechanism unloads the wafer assembly on the inverted mold turntable.

[0011] Furthermore, it also includes the material rack, the rotating clamping mechanism and the unloading clamping mechanism correspond to the positions on both sides of the material rack respectively, the material rack carries a material tray, and the wafer assembly is placed in the material tray.

[0012] Furthermore, pushing mechanisms are provided on both sides of the material rack, and the pushing mechanisms drive the material tray to move from one side to the other side.

[0013] Furthermore, visual recognition mechanisms are provided on both sides of the material rack, and the visual recognition mechanisms are respectively located between the rotating clamping mechanism, the unloading clamping mechanism and the material rack.

[0014] Furthermore, a loading and transfer mechanism is also provided on the wafer assembly loading station, and the loading and transfer mechanism includes a loading slide rail, and both ends of the loading slide rail extend to above the rotating clamping mechanism and the inverted mold turntable respectively. A loading suction cup is movably provided on the loading slide rail, and the loading suction cup sucks and loads the wafer assembly on the rotating clamping mechanism.

[0015] Furthermore, the loading and unloading stations of the carrier plate are also provided with a film tearing mechanism and a film sticking mechanism;

[0016] The film tearing mechanism comprises a film tearing slide rail and a film tearing clamp slidably arranged on the film tearing slide rail, wherein the film tearing slide rail extends above the mold turning disk, and the film tearing clamp tears the film from the carrier disc on the mold turning disk;

[0017] The film pasting mechanism is located at one side of the inverted mold turntable, and the loading and unloading clamping claw mechanism unloads the material from the carrier plate to the film pasting mechanism for film pasting.

[0018] Furthermore, a release film loading mechanism is also provided on the loading and unloading station of the carrier, and the release film loading mechanism is located at one side of the film laminating mechanism, and the release film loading mechanism loads the release film onto the carrier.

[0019] Furthermore, the material unloading clamp mechanism includes a material unloading guide rail and a material unloading push cylinder, and the material unloading guide rail extends toward the material rack;

[0020] The driving end of the material unloading push cylinder is connected with a material unloading clamping claw, and the material unloading push cylinder drives the material unloading clamping claw to move along the extension direction of the material unloading guide rail;

[0021] The wafer assembly unloading station is also provided with an unloading transfer mechanism, which includes an unloading slide rail, and both ends of the unloading slide rail extend to the top of the inverted mold turntable and the unloading guide rail respectively. A unloading suction cup is movably provided on the unloading slide rail, and the unloading suction cup sucks and unloads the wafer assembly on the inverted mold turntable.

[0022] Furthermore, a labeling mechanism is fixed below the unloading guide rail, and a driving end of the labeling mechanism moves in a vertical direction.

[0023] Furthermore, the loading and unloading station of the loading and unloading plate is also provided with a loading and unloading plate rotating mechanism, and the loading and unloading plate rotating mechanism is located on one side of the loading and unloading clamping mechanism.

[0024] The tray rotating mechanism includes a tray pushing assembly, a feed guide rail, a tray rotating assembly and a discharge guide rail, wherein the feed guide rail, the tray rotating assembly and the discharge guide rail extend in the same straight line, and the tray pushing assembly pushes the tray in the feed guide rail into the tray rotating assembly for rotation, or pushes the tray in the tray rotating assembly onto the discharge guide rail;

[0025] The carrier plate rotating assembly clamps the carrier plate and rotates it 180°;

[0026] The discharging guide rail is located below the unloading slide rail.

[0027] After adopting the above technical solution, the utility model has the following advantages compared with the background technology:

[0028] In this solution, the wafer assembly loading station, the tray loading and unloading station, and the wafer assembly unloading station are arranged at intervals around the mold-turning station to make full use of the space of the equipment. The wafer assembly loading station automatically loads the wafer, and the grains are transferred from the old film layer to the new film layer through hot pressing at the mold-turning station to complete the wafer flipping; the tray loading and unloading station unloads the empty tray located above, exposing the wafer assembly located below, so that the wafer assembly unloading station can unload the wafer assembly. The wafer loading, flipping and unloading are realized in sequence and automatically, and the wafer mold-turning efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic structural diagram of the wafer assembly, release film and carrier plate stacked in the utility model;

[0030] Figure 2 It is a structural schematic diagram of the wafer inverting mechanism of the utility model;

[0031] Figure 3 It is an enlarged schematic diagram of the structure of part A of the wafer mold-turning mechanism of the utility model;

[0032] Figure 4 It is a schematic diagram of the top view of the structure of the wafer inverting mechanism of the utility model;

[0033] Figure 5 It is a schematic diagram of the side view of the structure of the wafer inverting mechanism of the utility model;

[0034] Figure 6 This is a schematic diagram of the material rack structure of the wafer mold-turning mechanism of the utility model;

[0035] Figure 7 It is an enlarged schematic diagram of the structure of the material rack B part of the wafer mold-turning mechanism of the utility model;

[0036] Figure 8 This is a schematic structural diagram of the material unloading and transfer mechanism of the wafer inverting mechanism of the utility model;

[0037] Fig. 9 It is a schematic structural diagram of the film-tearing mechanism of the wafer inverting mechanism of the utility model;

[0038] Fig.10 It is a schematic structural diagram of the film sticking mechanism and the loading and unloading clamping mechanism of the wafer inverting mechanism of the utility model;

[0039] Fig.11 It is a structural schematic diagram of the labeling mechanism of the wafer inverting mechanism of the utility model;

[0040] Fig.12 It is a schematic diagram of the structure of the visual recognition mechanism of the wafer inverting mechanism of the utility model.

[0041] Description of reference numerals:

[0042] 1. Wafer assembly loading station; 11. Rotating clamp mechanism; 111. Clamp slide rail; 112. Rotating base; 12. Hot press frame; 13. Loading transfer mechanism; 131. Loading slide rail; 132. Loading lifting cylinder; 133. Loading suction cup;

[0043] 2. Inverting mold station; 21. Inverting mold turntable; 22. Hot pressing mechanism; 221. Hot pressing slide rail; 222. Hot pressing lifting cylinder; 223. Pressurizing plate;

[0044] 3. Wafer assembly unloading station; 31. Unloading clamping mechanism; 311. Unloading guide rail; 312. Unloading push cylinder; 313. Unloading clamping jaw; 32. Unloading transfer mechanism; 321. Unloading slide rail; 322. Unloading suction cup; 323. Unloading lifting cylinder; 33. Labeling mechanism; 331. Marking machine; 332. Labeling lifting slide rail; 333. Vacuum suction cup;

[0045] 4. Loading and unloading station of the carrier plate; 41. Loading and unloading clamping claw mechanism; 411. Fixed seat; 412. Lifting seat; 413. Loading and unloading arm; 414. Loading and unloading suction cup; 415. Rotating motor; 42. Film peeling mechanism; 421. Film peeling slide rail; 422. Film peeling slider; 423. Film peeling lifting cylinder; 424. Film peeling clamping claw; 425. Rolling lifting cylinder; 426. Rolling wheel; 427. Film peeling rack; 43. Film pasting mechanism; 431. Film pasting slide rail; 432. Film pasting slider; 433. Film pasting assembly; 4 4. Carrier plate rotating mechanism; 441. Carrier plate pushing assembly; 4411. Pushing slide rail; 4412. Pushing arm; 4413. Pushing claw; 442. Feeding guide rail; 443. Carrier plate rotating assembly; 4431. Rotating vertical plate; 4432. Turning motor; 4433. Rotating seat; 4434. Pressing cylinder; 4435. Connecting plate; 444. Discharging guide rail; 45. Release film feeding mechanism; 451. Film rack; 452. Release film feeding slide rail; 453. Feeding slider; 454. Release film suction cup;

[0046] 5. Material rack; 51. Material tray; 52. Material pushing mechanism; 521. Material pushing slide rail; 522. Material pushing cylinder; 53. Lifting mechanism; 531. Lifting slide rail; 532. Lifting drive motor; 533. Lifting platform;

[0047] 6. Visual recognition mechanism; 61. Visual mounting frame; 62. Recognition camera; 63. Support frame;

[0048] 7. Wafer assembly; 71. Film layer; 72. Iron ring; 73. Crystal grain;

[0049] 8. Release film;

[0050] 9. Load the plate. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0052] In addition, it should be noted that the terms "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element of the present invention must have a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0053] When an element is referred to as being “fixed to” or “disposed on” or “provided on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0054] Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0055] Example

[0056] Please refer to Figure 1-12 As shown, the present embodiment provides a wafer molding mechanism, including a wafer assembly loading station 1, a molding station 2, a wafer assembly unloading station 3 and a tray loading and unloading station 4, the wafer assembly loading station 1, the tray loading and unloading station 4 and the wafer assembly unloading station 3 are arranged at intervals on the circumferential side of the molding station 2, the wafer assembly 7 is located on the wafer assembly loading station 1 for rotation and loading onto the molding station 2; the molding station 2 performs molding on the wafer, and the molding process includes rolling, hot pressing, film tearing and unloading; the tray loading and unloading station 4 located on one side loads and unloads an empty tray 9; the wafer unloading assembly unloads the wafer assembly 7 after the molding is completed.

[0057] The inverted mold station 2 is provided with an inverted mold turntable 21 and a hot pressing mechanism 22, and a carrier plate 9 is placed on the inverted mold turntable 21. The wafer assembly loading station 1 is provided with a rotating clamping mechanism 11, and the rotating clamping mechanism 11 clamps, rotates and loads the wafer assembly 7 to the carrier plate 9 on the inverted mold turntable 21, so that the wafer assembly 7 is inverted on the carrier plate 9; the hot pressing mechanism 22 is located above the inverted mold turntable 21, and the hot pressing mechanism 22 hot presses the wafer assembly 7 on the inverted mold turntable 21, so that the wafer adheres to the carrier plate 9 below. In this embodiment, a release film 8 is placed on the carrier 9 placed on the mold turning disk 21. The release film 8 has an opening in the center, and the position of the opening corresponds to the position of the grain 73 in the wafer assembly 7, ensuring that the grain 73 can be converted between the new film and the old film during the mold turning process. At the same time, the release film 8 isolates the film layer 71 of the wafer assembly 7 and the carrier 9 to prevent the two from sticking together during the mold turning process, which affects the unloading of the carrier 9 and the wafer assembly 7.

[0058] Please refer to Figure 1 As shown, in this embodiment, the wafer assembly 7 includes a film layer 71 and an iron ring 72 and a crystal grain 73 bonded to the film layer 71, and the iron ring 72 encloses the crystal grain 73, and the film layer 71 limits the iron ring 72 and the crystal grain 73 to ensure the stability of the two during movement. The iron ring 72 supports the entirety of the wafer assembly 7 to ensure that the wafer assembly 7 can be better transported, and the inner ring of the iron ring 72 gives way to the crystal grain 73 to ensure that the crystal grain 73 can freely change its position. The carrier 9 includes a film layer 71 and an iron ring 72 bonded to the film layer 71, that is, a wafer assembly 7 without a crystal grain 73. During the mold-turning process, the carrier 9 on the mold-turning turntable 21 places the release film 8 and the wafer assembly loading station 1 is used to position the wafer assembly 7. In this embodiment, in the initial state of the wafer assembly 7, the crystal grain 73 and the iron ring 72 face upward, and the film layer 71 faces downward. The wafer assembly loading station 1 rotates and loads the wafer, and the wafer assembly 7 is inverted on the carrier 9 and the release film 8. The release film 8 isolates the carrier 9 and the film layer 71 of the wafer assembly 7 to prevent the two from sticking together. At this time, the wafer assembly 7 is above the release film 8, and the carrier 9 is below the release film 8. After hot pressing and reverse molding, the crystal grain 73 is transferred from the upper wafer assembly 7 through the release film 8 to the carrier 9 below, so that the carrier 9 below the release film 8 becomes the wafer assembly 7 after the crystal grain 73 is turned over, and the wafer assembly 7 above the release film 8 is converted into an empty carrier 9. The tray loading and unloading station 4 first unloads the empty tray 9 above the release film 8, and loads the tray 9 for the next mold reversal; the wafer assembly unloading station 3 unloads the wafer assembly 7 after the die 73 is turned over.

[0059] The loading and unloading station 4 is provided with a loading and unloading clamp mechanism 41, which unloads the loading tray 9 on the mold turntable 21 or loads the loading tray 9 onto the mold turntable 21, and the loading and unloading clamp 313 clamps and transports the loading tray 9, so as to load and unload the loading tray 9 stably.

[0060] The wafer assembly unloading station 3 is provided with an unloading clamping mechanism 31 , and the unloading clamping mechanism 31 unloads the wafer assembly 7 on the inverted mold turntable 21 .

[0061] Please refer to Figure 6 As shown, specifically, it also includes a material rack 5, on which a material tray 51 is carried, and the wafer assembly 7 is placed in the material tray 51. Pushing mechanisms 52 are provided on both sides of the material rack 5, and the pushing mechanisms 52 drive the material tray 51 to move from one side to the other side, and the push-pull mechanism pushes the material tray 51 or the fully loaded material tray 51. In this embodiment, the number of layers of the material rack 5 is five, and the two ends of the five-layer material rack 5 are mutually conductive, so that the material tray 51 can enter and exit. Lifting mechanisms 53 are provided at both ends of the material rack 5, and the lifting mechanism 53 includes a lifting slide rail 531 and a lifting drive motor 532. A lifting platform 533 is slidably provided on the lifting slide rail 531, and the lifting drive motor 532 drives the lifting platform 533 to move on the lifting slide rail 531. The pushing mechanism 52 is fixed on the lifting platform 533.

[0062] The pushing mechanism 52 includes a pushing rail 521 and a pushing cylinder 522 slidably arranged on the pushing rail 521. The pushing rail 521 extends toward the material rack 5. The driving end of the pushing cylinder 522 faces the material rack 5 and pushes the material tray 51 on the lifting platform 533 to enter the material rack 5. In this embodiment, the two sides of the material rack 5 are the loading side and the unloading side, respectively. A multi-layer material rack 5 is provided. A full and empty material tray 51 or a fully loaded material tray 51 is placed separately on each layer of the material rack 5. During the loading process, the lifting mechanism 53 on the unloading side drives the pushing mechanism 52 to move to one side of the fully loaded material tray 51. The pushing mechanism 52 on the unloading side pushes the fully loaded material tray 51 to move toward the loading side. The fully loaded material tray 51 located at the edge enters the lifting platform 533 on the loading side for loading, thereby realizing the loading and resetting of the empty material tray 51 and the fully loaded material tray 51.

[0063] The rotating clamp mechanism 11 and the unloading clamp mechanism 31 correspond to the positions on both sides of the material rack 5 respectively. The rotating clamp mechanism 11 clamps and unloads the wafer assembly 7 on one side of the material rack 5, and the unloading clamp mechanism 31 unloads the wafer assembly 7 into the material tray 51 on the other side of the material rack 5, that is, the rotating clamp mechanism 11 and the unloading clamp mechanism 31 correspond to the loading side and unloading side positions of the material rack 5 respectively.

[0064] Please refer to Fig.12As shown, visual recognition mechanisms 6 are provided on both sides of the material rack 5, and the visual recognition mechanisms 6 are respectively located between the rotating clamp mechanism 11, the unloading clamp mechanism 31 and the material rack 5, that is, the two visual recognition mechanisms 6 are respectively arranged between the loading side and the rotating clamp mechanism 11 and between the unloading side and the unloading clamp 313. The visual recognition mechanism 6 takes a picture of the wafer assembly 7 loaded by the rotating clamp mechanism 11, identifies the wafer area, etc. and records it, or takes a picture of the wafer assembly 7 on the unloading clamp mechanism 31, identifies the wafer area, etc. and records it. In this embodiment, the visual recognition mechanism 6 includes a visual mounting frame 61 and a recognition camera 62 fixed on the top of the visual mounting frame 61, and the recognition camera 62 takes a picture downward. A support frame 63 is fixed below the recognition camera 62, and the support frame 63 supports the wafer assembly 7.

[0065] Please refer to Figure 2-4 As shown, in this embodiment, the rotating jaw mechanism 11 includes a jaw slide rail 111 and a jaw slider movably arranged on the jaw slide rail 111, and a rotating base 112 is fixed on the jaw slider. The driving end of the rotating base 112 faces the feeding side of the material rack 5, and a rotating jaw (not shown in the drawings) is fixed. The rotating jaw moves on the jaw slide rail 111 to clamp and feed the wafer assembly 7 on the feeding side. After being photographed and recognized by the visual recognition mechanism 6, the rotating base 112 drives the rotating jaw to rotate 180°.

[0066] Please refer to Figure 8 As shown, the wafer assembly loading station 1 is also provided with a hot press frame 12 and a loading transfer mechanism 13, and the loading transfer mechanism 13 includes a loading slide rail 131, and the two ends of the loading slide rail 131 extend above the rotating jaw mechanism 11 and the mold turntable 21 respectively. In this embodiment, the loading slide rail 131 is fixed on the hot press frame 12. A loading suction cup 133 is movably provided on the loading slide rail 131. In this embodiment, the loading suction cup 133 is fixed on the loading lifting cylinder 132, and the loading suction cup 133 sucks and loads the wafer assembly 7 on the rotating jaw mechanism 11. During the loading process, the loading lifting cylinder 132 drives the loading suction cup 133 downward to absorb the rotated wafer assembly 7 clamped by the rotating clamp. The loading lifting cylinder 132 moves on the loading slide rail 131 until it moves to above the carrier 9 on the inverted mold turntable 21. The loading lifting cylinder 132 drives the loading suction cup 133 downward to place the wafer assembly 7 on the carrier 9, thereby completing the loading of the wafer assembly 7.

[0067] The hot pressing mechanism 22 includes a hot pressing slide 221 and a hot pressing lifting cylinder 222. The hot pressing slide 221 is arranged above the loading slide 131, and the hot pressing lifting cylinder 222 is slidably arranged on the hot pressing slide 221. The hot pressing slide 221 drives the hot pressing lifting cylinder 222 to make way for the loading suction cup 133, ensuring that the loading suction cup 133 can move to the mold turntable 21 and accurately load the wafer assembly 7. The driving end of the hot pressing lifting cylinder 222 faces downward, and a pressure plate 223 is fixed thereto, and the pressure plate 223 is built with a heating plate (not shown in the accompanying drawings). The hot pressing lifting cylinder 222 drives the pressure plate 223 to move above the mold turntable 21 to heat and pressurize the stacked wafer assemblies 7, release films 8 and carriers 9.

[0068] The loading and unloading station 4 is also provided with a film tearing mechanism 42 and a film sticking mechanism 43; Fig. 9 As shown, the film-tearing mechanism 42 includes a film-tearing slide rail 421 and a film-tearing clamp 424 slidably disposed on the film-tearing slide rail 421. The film-tearing slide rail 421 extends to the top of the mold turntable 21, and the film-tearing clamp 424 tears the film from the carrier plate 9 on the mold turntable 21. In this embodiment, a film-tearing lifting cylinder 423 is movably disposed on the film-tearing slide rail 421, the driving end of the film-tearing lifting cylinder 423 faces downward, and the film-tearing clamp 424 is fixed on the film-tearing lifting cylinder 423. The film-tearing lifting cylinder 423 drives the film-tearing clamp 424 downward to clamp the film layer 71 on the empty carrier plate 9 above the release film 8, and drives the film-tearing clamp 424 upward to tear off the film layer 71. In this embodiment, a film-tearing slider 422 is movably disposed on the film-tearing slide rail 421, and the film-tearing lifting cylinder 423 is fixed on the film-tearing slider 422. At the same time, a rolling lifting cylinder 425 is also provided on the film tearing slider 422, and a rolling wheel 426 is provided at the driving end of the rolling lifting cylinder 425. The rolling lifting cylinder 425 drives the rolling wheel 426 downward to roll the stacked wafer assembly 7, the release film 8 and the carrier 9 to ensure that the wafer assembly 7 and the carrier 9 fit more closely, avoid air between the two, and heat and transfer the wafer at the edge. Similarly, the rolling lifting cylinder 425 and the rolling wheel 426 can be set on the hot pressing slide 221. In this embodiment, the film tearing slide 421 is parallel to the hot pressing slide 221 and the loading slide 131, so as to make full use of the space. In this embodiment, the film tearing slide 421 is fixed on the film tearing frame 427.

[0069] Please refer to Fig.10 As shown, in this embodiment, the wafer assembly loading station 1, the mold pouring station 2, the wafer assembly unloading station 3 and the carrier loading and unloading station 4 are covered in an outer cover (not shown in the drawings), and the loading and unloading clamping claw mechanism 41 is suspended and fixed inside the outer cover, and the loading and unloading clamping claw mechanism 41 is located at one end of the film tearing slide rail 421, that is, as shown in the attached Figure 4The middle reference number 41 is the position of the loading and unloading clamp mechanism 41. The loading and unloading clamp mechanism 41 includes a fixed seat 411 and a lifting seat 412 fixed below the fixed seat 411. The driving end of the lifting seat 412 faces downward and is fixed with a loading and unloading arm 413. The opposite end of the loading and unloading arm 413 is fixedly connected to the driving end of the lifting seat 412. The other end of the loading and unloading arm 413 is fixed with a loading and unloading suction cup 414. The loading and unloading suction cup 414 loads and unloads the iron ring 72. A rotating motor 415 is fixed on the lifting seat 412. The driving end of the rotating motor 415 is drivingly connected to one end of the loading and unloading arm 413. The rotating motor 415 drives the loading and unloading arm 413 to rotate, thereby realizing the position conversion between the inverted mold turntable 21 and the film sticking assembly 433 and other mechanisms.

[0070] The film pasting mechanism 43 is located on one side of the inverted mold turntable 21, and the loading and unloading clamping claw mechanism 41 unloads the carrier plate 9 onto the film pasting mechanism 43 for film pasting. In this embodiment, the film pasting mechanism 43 includes a film pasting slide rail 431 and a film pasting assembly 433 located at one end of the film pasting slide rail 431. A film pasting slider 432 is provided on the film pasting slide rail 431, and the film pasting slider 432 carries the iron ring 72. The film pasting slide rail 431 transports the iron ring 72 into the film pasting assembly 433 to re-film the iron ring 72. The loading and unloading suction cup 414 loads the iron ring 72 on the film pasting slider 432 or unloads the iron ring 72 onto the film pasting slider 432.

[0071] Please refer to Figure 3As shown, a tray rotating mechanism 44 is also provided on the tray loading and unloading station 4. The tray rotating mechanism 44 is located on one side of the loading and unloading clamping mechanism 41, so that the loading and unloading clamping mechanism 41 can transport the iron ring 72 that has been re-laminated to the tray rotating mechanism 44 for rotation. The tray rotating mechanism 44 includes a tray pushing assembly 441, a feeding guide rail 442, a tray rotating assembly 443 and a discharging guide rail 444. The feeding guide rail 442, the tray rotating assembly 443 and the discharging guide rail 444 extend in the same straight line. The loading and unloading suction cup 414 sucks the iron ring 72 that has been re-laminated onto the feeding guide rail 442. In this embodiment, the feeding guide rail 442 and the discharging guide rail 444 are both relatively arranged "L"-shaped rails, which are convenient for placing or sucking the iron ring 72. The tray pushing assembly 441 pushes the tray 9 in the feed guide rail 442 into the tray rotating assembly 443 for rotation, or pushes the tray 9 in the tray rotating assembly 443 onto the discharge guide rail 444. The tray pushing assembly 441 includes a pushing slide rail 4411 and a pushing arm 4412 slidably disposed on the pushing slide rail 4411, the pushing arm 4412 extends upward, and a pushing clamp 4413 is fixed to the free end of the pushing arm 4412. In this embodiment, the pushing slide rail 4411 is located at the feed guide rail 442, the tray rotating assembly 443 and the discharge guide rail 444, and the extension direction of the pushing slide rail 4411 is the same as the arrangement direction of the feed guide rail 442, the tray rotating assembly 443 and the discharge guide rail 444. The tray rotating assembly 443 clamps the tray 9 and rotates 180°. In this embodiment, the carrier rotating assembly 443 includes two rotating vertical plates 4431 arranged opposite to each other, a flipping motor 4432 is fixed on the outer side of the rotating vertical plates 4431, and a rotating seat 4433 is arranged on the side opposite to the top of the rotating vertical plates 4431, and the rotating seat 4433 is rotatably connected to the rotating vertical plates 4431 through a rotating shaft. A downward pressure cylinder 4434 is arranged on the rotating seat 4433, and the downward pressure cylinder 4434 presses and limits the iron ring 72. The driving end of the flipping motor 4432 passes through the rotating vertical plates 4431 and is driven and connected to a rotating seat 4433, and a connecting plate 4435 is fixed between the two rotating seats 4433. The rotating motor 415 drives the rotating seat 4433 to rotate synchronously to realize the flipping of the iron ring 72. After the iron ring 72 is re-filmed, the iron ring 72 is at the bottom and the film layer 71 is at the top. The carrier rotating assembly 443 rotates the iron ring 72 180°, so that the film layer 71 is at the bottom and the iron ring 72 is at the top, meeting the subsequent requirements for loading the carrier 9 and facilitating mold pouring.

[0072] Please refer to Figure 5As shown, the material unloading jaw mechanism 31 includes a material unloading guide rail 311 and a material unloading push cylinder 312, and the material unloading guide rail 311 extends toward the material rack 5. The driving end of the material unloading push cylinder 312 is connected to a material unloading jaw 313, and the material unloading push cylinder 312 drives the material unloading jaw 313 to move along the extension direction of the material unloading guide rail 311, and pushes the wafer assembly 7 that has been completed by the reverse molding into the material rack 5. A material unloading transfer mechanism 32 is also provided on the wafer assembly unloading station 3, and the material unloading transfer mechanism 32 includes a material unloading slide rail 321, and the two ends of the material unloading slide rail 321 extend to the top of the reverse molding turntable 21 and the material unloading guide rail 311, respectively, and a material unloading suction cup 322 is movably provided on the material unloading slide rail 321, and the material unloading suction cup 322 sucks and unloads the wafer assembly 7 on the reverse molding turntable 21. In this embodiment, a material unloading lifting cylinder 323 is movably provided on the unloading slide rail 321, and the driving end of the material unloading lifting cylinder 323 faces downward and is fixedly connected to the material unloading suction cup 322. The material unloading slide rail 321 drives the material unloading suction cup 322 to move above the inverted mold turntable 21, and the material unloading lifting cylinder 323 drives the material unloading suction cup 322 downward to absorb the wafer assembly 7 that has completed the unloading of the iron ring 72 on the inverted mold turntable 21. And the material unloading slide rail 321 moves to the top of the unloading guide rail 311, and the unloading suction cup 322 places the wafer assembly 7 in the unloading guide rail 311. In this embodiment, the unloading guide rail 311 is an "L"-shaped guide rail, which plays a good guiding role and is convenient for the placement of the wafer assembly 7.

[0073] In this embodiment, the discharge guide rail 444 is located below the discharge slide rail 321, and the discharge suction cup 322 simultaneously absorbs and loads the turned-over carrier 9, making full use of each component.

[0074] Please refer to Fig.11 As shown, a labeling mechanism 33 is fixed below the unloading guide rail 311, and the driving end of the labeling mechanism 33 moves in the vertical direction. The labeling mechanism 33 includes a labeling machine 331 and a labeling lifting rail 332, and a vacuum suction cup 333 is movably arranged on the labeling lifting rail 332. The labeling machine 331 prints the label content on the label paper, and the user can provide the label content through the client MES. The hollow suction cup absorbs the label, and the labeling lifting rail 332 drives the vacuum suction cup 333 upward to label the wafer assembly 7.

[0075] Please refer to Figure 2-4As shown, a release film loading mechanism 45 is also provided on the loading and unloading station 4 of the carrier plate, and the release film loading mechanism 45 is located on one side of the film pasting mechanism 43, and the release film loading mechanism 45 loads the release film 8 onto the carrier plate 9. The release film loading mechanism 45 includes a film frame 451 and a release film loading slide rail 452, and a loading slider 453 is movably provided on the release film loading slide rail 452, and a release film 8 lifting cylinder is fixed on the loading slider 453, and the driving end of the release film 8 lifting cylinder extends upward, and is driven and connected to a release film suction cup 454, and the release film suction cup 454 sucks and loads the release film 8 on the film frame 451. In this embodiment, the release film loading slide rail 452 is located on one side of the film pasting slide rail 431, and the release film loading slide rail 452 and the film pasting slide rail 431 have a certain overlap in travel. The film sticking slide rail 431 drives the film sticking slider 432 to move to one end side of the release film feeding slide rail 452, and the release film 8 feeding suction cup 133 moves to the top of the film sticking slider 432 through the release film 8 feeding suction cup 133, and transports the release film 8 to the film sticking slider 432. The film sticking slider 432 carries the release film 8 and transports the release film 8 to the carrier plate 9 on the inverting turntable 21 through the loading and unloading clamping claw mechanism 41.

[0076] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A wafer mold reversing mechanism, characterized in that: It includes wafer component loading station, mold pouring station, wafer component unloading station and tray loading and unloading station. The wafer assembly loading station, the tray loading and unloading station and the wafer assembly unloading station are arranged at intervals on the peripheral side of the mold inversion station. The inverted mold station is provided with an inverted mold turntable and a hot pressing mechanism, a carrier plate is placed on the inverted mold turntable, and a rotating clamping mechanism is provided on the wafer assembly loading station, and the rotating clamping mechanism clamps, rotates and loads the wafer assembly to the carrier plate on the inverted mold turntable; the hot pressing mechanism is located above the inverted mold turntable, and the hot pressing mechanism hot presses the wafer assembly on the inverted mold turntable so that the wafer adheres to the carrier plate below; The loading and unloading station of the carrier is provided with a loading and unloading clamping claw mechanism, and the loading and unloading clamping claw mechanism unloads the carrier on the inverted mold turntable or loads the carrier onto the inverted mold turntable; The wafer assembly unloading station is provided with an unloading clamping mechanism, and the unloading clamping mechanism unloads the wafer assembly on the inverted mold turntable.

2. The wafer mold-turning mechanism according to claim 1, characterized in that: It also includes the material rack, the rotating clamping mechanism and the unloading clamping mechanism correspond to the positions on both sides of the material rack respectively, the material rack carries a material tray, and the wafer assembly is placed in the material tray.

3. The wafer mold-turning mechanism according to claim 2, characterized in that: Pushing mechanisms are arranged on both sides of the material rack, and the pushing mechanisms drive the material tray to move from one side to the other side.

4. The wafer mold-turning mechanism according to claim 2, characterized in that: Visual recognition mechanisms are arranged on both sides of the material rack, and the visual recognition mechanisms are respectively located between the rotating clamping mechanism, the unloading clamping mechanism and the material rack.

5. The wafer mold-turning mechanism according to claim 1, characterized in that: The wafer assembly loading station is also provided with a loading and transporting mechanism, which includes a loading slide rail, and both ends of the loading slide rail extend to the top of the rotating clamping mechanism and the inverted mold turntable respectively. A loading suction cup is movably provided on the loading slide rail, and the loading suction cup absorbs and loads the wafer assembly on the rotating clamping mechanism.

6. The wafer mold-turning mechanism according to claim 2, characterized in that: The loading and unloading stations of the carrier plate are also provided with a film tearing mechanism and a film sticking mechanism; The film tearing mechanism comprises a film tearing slide rail and a film tearing clamp slidably arranged on the film tearing slide rail, wherein the film tearing slide rail extends above the mold turning disk, and the film tearing clamp tears the film from the carrier disc on the mold turning disk; The film pasting mechanism is located at one side of the inverted mold turntable, and the loading and unloading clamping claw mechanism unloads the material from the carrier plate to the film pasting mechanism for film pasting.

7. The wafer mold-turning mechanism according to claim 6, characterized in that: A release film loading mechanism is also provided on the loading and unloading station of the carrier, and the release film loading mechanism is located on one side of the film pasting mechanism, and the release film loading mechanism loads the release film onto the carrier.

8. The wafer mold-turning mechanism according to claim 6, characterized in that: The material unloading clamp mechanism comprises a material unloading guide rail and a material unloading push cylinder, and the material unloading guide rail extends toward the material rack; The driving end of the material unloading push cylinder is connected with a material unloading clamping claw, and the material unloading push cylinder drives the material unloading clamping claw to move along the extension direction of the material unloading guide rail; The wafer assembly unloading station is also provided with an unloading transfer mechanism, which includes an unloading slide rail, and both ends of the unloading slide rail extend to the top of the inverted mold turntable and the unloading guide rail respectively. A unloading suction cup is movably provided on the unloading slide rail, and the unloading suction cup sucks and unloads the wafer assembly on the inverted mold turntable.

9. The wafer mold-turning mechanism according to claim 8, characterized in that: A labeling mechanism is fixed below the unloading guide rail, and a driving end of the labeling mechanism moves in a vertical direction.

10. The wafer mold-turning mechanism according to claim 8, characterized in that: The loading and unloading station is also provided with a loading and unloading plate rotating mechanism, and the loading and unloading plate rotating mechanism is located on one side of the loading and unloading jaw mechanism. The tray rotating mechanism includes a tray pushing assembly, a feed guide rail, a tray rotating assembly and a discharge guide rail, wherein the feed guide rail, the tray rotating assembly and the discharge guide rail extend in the same straight line, and the tray pushing assembly pushes the tray in the feed guide rail into the tray rotating assembly for rotation, or pushes the tray in the tray rotating assembly onto the discharge guide rail; The carrier plate rotating assembly clamps the carrier plate and rotates it 180°; The discharging guide rail is located below the unloading slide rail.

Images